JP2004014902A5 - - Google Patents

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Publication number
JP2004014902A5
JP2004014902A5 JP2002168192A JP2002168192A JP2004014902A5 JP 2004014902 A5 JP2004014902 A5 JP 2004014902A5 JP 2002168192 A JP2002168192 A JP 2002168192A JP 2002168192 A JP2002168192 A JP 2002168192A JP 2004014902 A5 JP2004014902 A5 JP 2004014902A5
Authority
JP
Japan
Prior art keywords
temperature
thermocouple
manufacturing apparatus
heating furnace
semiconductor manufacturing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002168192A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004014902A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2002168192A priority Critical patent/JP2004014902A/ja
Priority claimed from JP2002168192A external-priority patent/JP2004014902A/ja
Publication of JP2004014902A publication Critical patent/JP2004014902A/ja
Publication of JP2004014902A5 publication Critical patent/JP2004014902A5/ja
Pending legal-status Critical Current

Links

JP2002168192A 2002-06-10 2002-06-10 半導体製造装置 Pending JP2004014902A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002168192A JP2004014902A (ja) 2002-06-10 2002-06-10 半導体製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002168192A JP2004014902A (ja) 2002-06-10 2002-06-10 半導体製造装置

Publications (2)

Publication Number Publication Date
JP2004014902A JP2004014902A (ja) 2004-01-15
JP2004014902A5 true JP2004014902A5 (https=) 2005-10-13

Family

ID=30435168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002168192A Pending JP2004014902A (ja) 2002-06-10 2002-06-10 半導体製造装置

Country Status (1)

Country Link
JP (1) JP2004014902A (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8026113B2 (en) 2006-03-24 2011-09-27 Tokyo Electron Limited Method of monitoring a semiconductor processing system using a wireless sensor network
CN100456187C (zh) * 2006-08-03 2009-01-28 上海交通大学 热处理无线虚拟仪表集中控制系统
CN119876565B (zh) * 2025-03-21 2026-01-16 浙江亨达光学有限公司 一种热处理炉、温控方法及其存储介质

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0931656A (ja) * 1995-07-24 1997-02-04 Ebara Corp 薄膜気相成長装置
JP2001126997A (ja) * 1999-10-29 2001-05-11 Hitachi Kokusai Electric Inc 縦型半導体製造装置

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