JP2004009280A - Method and device for polishing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem wherein large load is applied for a shape measurement of a working surface of a workpiece and preparation of working data and waviness components left on the working surface can not be efficiently removed. <P>SOLUTION: This device is provided with a pressure shoe 13 having a pressing surface 12 corresponding to a part of the working surface 11 of the workpiece 10, a polishing belt 18 disposed along the pressing surface 12 of the pressure shoe 13 and having a polishing layer joined to the surface of a base material and forming flexibility in slidable contact with the pressing surface 12, a polishing belt moving means 19 to move the polishing belt 18 along the pressing surface 12 of the pressing shoe 13, a pressing means provided on the pressing shoe 13 to press the polishing belt 18 in a direction vertical to the working surface 11 of the workpiece 10, and a relative moving means 14 to relatively move a work table mounted with the workpiece 10 and the pressing shoe 13 to relatively move the working surface 11 of the workpiece 10 and the pressing surface 12 of the pressing shoe 13 in a direction crossing the moving direction of the polishing belt 18. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a polishing method and a polishing apparatus capable of efficiently removing a waviness component remaining on a work surface of a work.
[0002]
[Prior art]
The optical surfaces of optical elements such as lenses and mirrors, or the molding surfaces of molds are polished with extremely high shape accuracy.However, by removing the waviness component remaining on the processed surface of such a work, it is possible to design more It is possible to obtain a highly accurate polished surface close to the shape. In particular, in the case of ultra-precision polishing such as the optical surface of an optical element or the molding surface of a mold that requires extremely high shape accuracy with a machined surface having an axisymmetric aspheric surface or free-form surface, the shape accuracy of the machined surface is maintained. However, it is necessary to remove the undulation component remaining on the processing surface.
[0003]
Conventionally, when polishing the optical surface of optical elements such as lenses and mirrors and the molding surface of molds that require a high degree of shape accuracy, use a polishing tool smaller than the processing surface of these workpieces, and measure the shape of the processing surface For example, Japanese Patent Application Laid-Open No. 2000-84817 proposes a method of repeatedly performing the above-described correction polishing process and performing the shape correction while polishing. According to the method disclosed in Japanese Patent Application Laid-Open No. 2000-84817, the diameter of a rotary polishing tool is changed in accordance with the spatial frequency component of an error shape remaining on a processed surface of a workpiece, and the shape accuracy of the processed surface is changed through a plurality of polishing steps. Is to improve. Specifically, the height and pitch of the undulation component remaining on the work surface of the work are measured, and the peaks of the undulation component are selectively polished to form a secondary undulation component with a shorter wavelength on the work surface of the work. Then, the secondary undulation component is also removed by using a rotary polishing tool having a diameter of at least twice the wavelength of the secondary undulation component.
[0004]
On the other hand, Japanese Patent Application Laid-Open No. H11-42546 discloses a method for polishing a workpiece having a processed surface having an axisymmetric aspheric surface using an endless belt-shaped polishing cloth. In this method, a pressing shoe having a pressing surface having a shape obtained by inverting the processing surface of the work is arranged so that the pressing surface faces the processing surface of the work, and the processing surface of the work and the pressing surface of the pressing shoe are formed. An endless polishing belt is interposed between them, and the pressing shoe is urged toward the work side, and the polishing belt is pressed against the work surface of the work while the polishing belt is pressed against the work surface of the work. The workpiece is moved in the radial direction along the axis to efficiently polish the work surface of the workpiece.
[0005]
[Problems to be solved by the invention]
In the polishing method disclosed in Japanese Patent Application Laid-Open No. 2000-84817, it takes an enormous amount of time to accurately measure the height and pitch of the undulation component remaining on the processed surface of the work, and the measured undulation component data The processing data for selectively polishing only the peaks of the undulation component by the CNC apparatus based on the CNC control also becomes enormous, so that the undulation component remaining on the processed surface cannot be efficiently removed. Further, depending on the size of a tool for removing a secondary undulation component, it may be difficult to perform a polishing process to a peripheral portion of a work surface of a work according to a design shape due to tool interference.
[0006]
On the other hand, in the polishing method disclosed in Japanese Patent Application Laid-Open No. 11-42546, the direction of the processing pressure applied to the polishing belt by the pressing shoe is generally the same as the rotation axis of the work, regardless of the inclined state of the work surface of the work. Since they are set in parallel directions, there is a drawback that the working pressure acting in the normal direction of the work surface of the work varies depending on the inclination angle. For this reason, the entire processing surface of the work cannot be uniformly polished, and the polishing amount in a portion where the processing surface is not perpendicular to the pressing direction by the pressing shoe tends to be insufficient. If the swell component is to be completely removed, there is a problem that the polishing amount of the other portion becomes excessive and the accuracy of the shape of the processed surface of the work is deteriorated.
[0007]
[Object of the invention]
An object of the present invention is to uniformly grind the entire processing surface without applying a large load to the shape measurement and processing data creation, regardless of the shape of the processing surface of the work, and to remove the waviness component remaining on the processing surface. An object of the present invention is to provide a polishing method and an apparatus therefor which can be efficiently removed.
[0008]
[Means for Solving the Problems]
According to a first aspect of the present invention, there is provided a step of holding a pressing surface of a pressing shoe close to a processing surface of a work, and forming a polishing band for polishing the processing surface of the work with the processing surface of the work and the pressing shoe. Pressing the polishing band in a direction perpendicular to the processing surface of the work, and interposing between the processing surface of the work and the pressing surface of the pressing shoe. Moving the polishing band along the pressing surface of the pressing shoe; and relatively moving the processing surface of the work and the pressing surface of the pressing shoe in a direction intersecting the moving direction of the polishing band. The polishing method is characterized in that:
[0009]
According to a second aspect of the present invention, there is provided a pressing shoe having a pressing surface corresponding to a part of a processing surface of a workpiece, and a pressing shoe arranged along the pressing surface of the pressing shoe and capable of sliding on the pressing surface. A polishing band having a polishing layer joined to the surface of a flexible base material, a polishing band moving means for moving the polishing band along the pressing surface of the pressing shoe, and provided on the pressing shoe; Pressing means for pressing the polishing band in a direction perpendicular to the processing surface of the work, such that the processing surface of the work and the pressing surface of the pressing shoe relatively move in a direction intersecting the moving direction of the polishing band. And a relative moving means for relatively moving a work table on which a work is mounted and the pressing shoe.
[0010]
According to the present invention, in a portion where the polishing band is pressed against the processing surface of the work by the pressing means, with the progress of the polishing, the shape of the pressing surface of the pressing shoe is transferred to the processing surface of the work, and the pressing surface of the pressing shoe is pressed. The undulation component remaining on the work surface of the work over the range is removed.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
In the polishing method according to the first aspect of the present invention, the processing surface of the work has an axially symmetric shape, and the step of moving the polishing band includes moving the polishing band in the radial direction of the work, and pressing the processing surface of the work against the pressing surface. The step of moving the shoe relative to the pressing surface may include driving rotation about the axis of the work.
[0012]
The polishing apparatus according to the second aspect of the present invention may include a plurality of sets of a pressing shoe, a polishing band, a polishing band moving unit, and a pressing unit.
[0013]
It is possible to further include shoe holding means for holding the pressing shoe such that the pressing surface of the pressing shoe faces the processing surface of the workpiece at a predetermined interval.
[0014]
The pressing means utilizes a fluid pressure, and may have a pressure adjusting means capable of adjusting the fluid pressure.
[0015]
The pressing shoe may have relief portions at both ends of the pressing surface of the pressing shoe along the moving direction of the polishing band to avoid interference with the work surface of the work. In this case, the polishing band moving means may have guide means for guiding the polishing band along the relief portion of the pressing shoe.
[0016]
【Example】
Embodiments of the polishing apparatus according to the present invention capable of carrying out the polishing method according to the present invention will be described in detail with reference to FIGS. 1 to 7. However, the present invention is not limited to these embodiments, and further combines these. In addition, all changes and modifications included in the concept of the present invention described in the claims of the present specification are possible, and therefore, can naturally be applied to other technologies belonging to the spirit of the present invention. .
[0017]
FIG. 1 shows a processing state of a workpiece according to the first embodiment of the present invention. The workpiece 10 in this embodiment has a polished surface formed as a cylindrical concave surface 11 having a predetermined radius of curvature, and is fixed on a work table (not shown).
[0018]
The pressing shoe 13 whose pressing surface is a cylindrical convex surface 12 having a predetermined radius of curvature that is the inverse of the cylindrical concave surface 11 of the workpiece 10 has a semicircular plate shape, and the upper end thereof is opposed to the slider guide block 15 of the slider driving means 14. The work 10 is supported by a bracket 17 projecting from a slider 16 mounted reciprocally in a direction parallel to the axis of the cylindrical concave surface 11 of the work 10. The slider 16 as a shoe holding means of the present invention supporting the pressing shoe 13 via the bracket 17 is provided with a slider guide block in a direction parallel to the axis of the cylindrical concave surface 11 of the work 10 by a driving mechanism (not shown) of the slider driving means 14. 15 is reciprocated. In the present embodiment, the slider driving means 14 having the slider 16 and the slider guide block 15 constitutes the relative moving means in the present invention, but a work table (not shown) to which the work 10 is fixed is fixed together with the work 10 to its cylindrical concave surface. It may be made to reciprocate in a direction parallel to the 11 axis.
[0019]
The axis of the cylindrical convex surface 12 of the pressing shoe 13 is supported by the bracket 17 so as to be coaxial with the axis of the cylindrical concave surface 11 of the work 10, and at this time, the axis of the cylindrical concave surface 11 of the work 10 and the cylindrical convex surface 12 of the pressing shoe 13 are adjusted. The radius of curvature of the cylindrical convex surface 12 is appropriately set so that a gap at a constant interval is formed between them.
[0020]
A polishing band 18 for polishing the cylindrical concave surface 11 of the work 10 is interposed between the cylindrical concave surface 11 of the work 10 and the cylindrical convex surface 12 of the pressing shoe 13. The polishing band 18 has flexibility, and its base end side is connected to a polishing band driving device 19 attached to the upper end of the pressing shoe 13. FIG. 2 shows a cross-sectional structure of the polishing band 18 in this embodiment. That is, the polishing band 18 in the present embodiment is composed of a base material 20 that can slide on the cylindrical convex surface 12 of the pressing shoe 13, and an elastic material layer 22 that is bonded to the surface of the base material 20 via the adhesive 21. A polishing layer 24 joined to the surface of the elastic material layer 22 via an adhesive 23 and abutting against the cylindrical concave surface 11 of the work 10, and the cylindrical concave surface 11 of the work 10 is A concave portion 25 for preventing clogging of the polishing layer 24 is formed in a predetermined pattern on the surface side of the polishing layer 24 to which the processing liquid is supplied.
[0021]
The above-described base material 20 can be made of an extremely thin steel tape or the like in addition to a resin wrapping tape having a relatively strong stiffness, and a material having high flexibility is used as the base material 20. Thereby, the followability of the pressing shoe 13 to the cylindrical convex surface 12 can be further improved, and polishing with higher precision can be performed. The elastic material layer 22 can be made of felt, foamed resin, nylon, or the like, but can be made of another material. The polishing layer 24 can be made of a material for polisher typified by asphalt pitch, urethane, or the like, but is not limited to this.
[0022]
In this embodiment, the concave portions 25 having a predetermined pattern are formed on the surface of the polishing layer 24. However, in some cases, the concave portions 25 may not be formed. Further, the elastic material layer 22 may be omitted depending on the material of the work 10, the curvature of the polishing surface, the material of the base material 20 or the polishing layer 24 of the polishing band 18, and the like. FIG. 3 schematically shows the structure together with the internal structure of the pressing shoe 13. That is, the polishing layer 24 for removing the undulation of the cylindrical concave surface 11 of the workpiece 10 is bonded to the base material 20 via the adhesive 21 and is more directly than the previous embodiment in which the elastic material layer 22 is interposed. The cylindrical concave surface 11 of the work 10 is polished according to the shape of the cylindrical convex surface 12 of the pressing shoe 13.
[0023]
A plurality of injection ports 26 for blowing out compressed air are respectively opened perpendicularly to the cylindrical convex surface 12 on the cylindrical convex surface 12 which is the pressing surface of the pressing shoe 13, that is, the axis of the cylindrical convex surface 12 of the pressing shoe 13. The individual injection ports 26 are radially formed around the center. These injection ports 26 communicate with a common chamber 27 formed in the pressing shoe 13, and an air pipe 28 communicating with the common chamber 27 passes through a well-known pressure adjusting device 29 which is a pressure adjusting means of the present invention. The compressed air supplied from the compressor 30 is regulated to a predetermined pressure by a pressure regulating device 29 and guided to a common chamber 27 via an air pipe 28. Then, the abrasive band 18 is injected perpendicularly to the cylindrical convex surface 12 from each of the injection ports 26, and the abrasive band 18 is pressed almost perpendicularly to the cylindrical concave surface 11 of the work 10 by the injection pressure of the compressed air, thereby generating a processing pressure on the work 10. I do.
[0024]
As described above, in the present embodiment, the above-described injection port 26, the air pipe 28, the pressure adjusting device 29, the compressor 30, and the like constitute the pressing means of the present invention, and pressurized air is perpendicular to the cylindrical convex surface 12 of the pressing shoe 13. In this manner, a processing pressure for pressing the polishing band 18 against the work 10 is generated. However, a liquid such as a processing liquid is injected from the injection port 26 or a plunger is applied to each of the injection ports 26. May be slidably fitted to each other, and the tip of these plungers may be pressed against the polishing band 18 to generate a processing pressure of the polishing band 18 on the work 10. In any case, it is necessary to consider that a uniform processing pressure is generated from the individual injection ports 26 perpendicularly to the cylindrical convex surface 12 of the pressing shoe 13.
[0025]
The polishing band driving device 19 to which the base end of the long polishing band 18 in the longitudinal direction is connected functions as the polishing band moving means of the present invention, and the polishing band 18 is moved in and out along the longitudinal direction to polish. The band 18 is reciprocated in the circumferential direction of the cylindrical concave surface 11 of the work 10 along the cylindrical convex surface 12 of the pressing shoe 13, thereby causing relative movement between the polishing band 18 and the cylindrical concave surface 11 of the work 10. However, the polishing band 18 may be formed in an endless belt shape, mounted on the pressing shoe 13, and continuously swiveled in the same direction.
[0026]
Therefore, the polishing band 18 is a state in which the reciprocating motion of the polishing band 18 itself by the polishing band driving device 19 and the reciprocating motion of the pressing shoe 13 along the axis of the cylindrical concave surface 11 of the work 10 by the slider driving means 14 are combined. Due to the above-mentioned processing pressure, the cylindrical concave surface 11 of the work 10 is uniformly pressed, and the inverted shape corresponding to the cylindrical convex surface 12 of the pressing shoe 13 is accurately transferred to the cylindrical concave surface 11 of the work 10 and remains on the cylindrical concave surface 11 of the work 10. The undulations are efficiently removed. In particular, when the cylindrical concave surface 11, which is the polished surface of the work 10, has a gradual error shape of a wavelength component longer than the undulation component accompanying the pre-processing, the shape is simultaneously corrected in accordance with the cylindrical convex surface 12 of the pressing shoe 13. The Rukoto. For this reason, it is not necessary to remove the waviness component remaining on the polished surface of the work 10 in a plurality of steps as in the related art, and it is not necessary to perform a measurement for removing the waviness component. The undulation component can be efficiently removed without basically destroying the shape.
[0027]
In the above-described embodiment, the work 10 in which the polished surface is the cylindrical concave surface 11 has been described. However, the present invention can also polish a higher-order curved surface of second order or higher, such as polishing a Schmidt lens or the like. You can do it too.
[0028]
FIG. 4 schematically shows a polishing operation state according to another embodiment of the polishing apparatus according to the present invention. Elements having the same functions as those of the previous embodiment are denoted by the same reference numerals, and are not described again. Shall be omitted. That is, the Schmitt lens 31, which is a work, is fixed to a rotating table 33 rotatable at a predetermined speed by a table driving device 32 so that its optical axis is the same as the rotating axis of the rotating table 33. In this case, the table driving device 32 and the rotary table 33 function as relative moving means of the present invention. The polishing surface 34 of the Schmitt lens 31 and the pressing shoe 13 extending in the radial direction of the polishing surface 34 are held at predetermined intervals with respect to the polishing surface 34 of the Schmitt lens 31 by shoe holding means (not shown). A polishing band 18 is interposed between the pressing surface 35 of the pressing shoe 13 and the polishing surface 34 of the Schmitt lens 31, and a working liquid is supplied between the polishing band 18 and the polishing surface 34 of the Schmitt lens 31. The base end of the polishing band 18 extending in the radial direction of the Schmidt lens 31 is connected to a polishing band driving device 19 attached to the pressing shoe 13, and the polishing band 18 is operated by the operation of the polishing band driving device 19. The Schmitt lens 31 is driven to reciprocate in the radial direction along the pressing surface 35 of the thirteenth embodiment.
[0029]
The polishing band 18 is pressed almost perpendicularly to the polishing surface 34 of the Schmitt lens 31 by compressed air injected from a plurality of injection ports 26 which are respectively opened perpendicularly to the pressing surface 35 of the pressing shoe 13 to reduce the processing pressure. The generated polished surface 34 of the Schmitt lens 31 is uniformly polished along with the driving rotation of the turntable 33, and the waviness component remaining on the polished surface 34 is efficiently removed. As described above, when the polishing surface 34 of the workpiece has a rotationally symmetric shape, the polishing can be efficiently performed even if the polishing surface 34 is a curved surface of a higher order.
[0030]
In the two embodiments described above, the longitudinal base end of the polishing band 18 is connected to the polishing band driving device 19, and is reciprocally driven in a cantilever state. It is also possible to drive the polishing band 18 back and forth with.
[0031]
FIG. 5 schematically shows a polishing operation state according to another embodiment of the polishing apparatus according to the present invention. Elements having the same functions as those in the previous embodiment are denoted by the same reference numerals, and are not described again. Shall be omitted. That is, the workpiece 10 having the polishing surface 34 having a rotationally symmetrical shape is fixed on a rotary table (not shown) that can be driven and rotated, and its axis is coaxial with the axis of the rotary table so as to rotate integrally. ing. A pair of gap sensors 36 for detecting the distance between the polishing surface 34 of the work 10 and the pair of gap sensors 36 are provided at both ends in the longitudinal direction of the pressing shoe 13 having an elongated pressing surface 35 extending in the radial direction of the work 10. And a pair of polishing band driving devices 19 to which both end portions of the polishing band 18 extending along the pressing surface 35 are connected. The polishing band 18 is reciprocated in the radial direction of the polishing surface 34 of the work 10 along the pressing surface 35 of the pressing shoe 13 by a pair of polishing band driving devices 19.
[0032]
The pressing shoe 13 is held by a shoe holding device 37 to which a detection signal from the gap sensor 36 is transmitted, and the shoe holding device 37 optimally controls the attitude of the pressing shoe 13 with respect to the workpiece 10 based on information from the gap sensor 36. I can do it. In this embodiment, the gap between the polishing surface 34 of the work 10 and the pressing surface 35 of the pressing shoe 13 is always kept constant by using the pair of gap sensors 36. The gap between the polishing surface 34 of the work 10 and the pressing surface 35 of the pressing shoe 13 may be optimally controlled using a pressure detection sensor or the like that detects the pressing force of the polishing band 18 pressed against the polishing surface 34 of FIG. .
[0033]
Also in this embodiment, as in the previous embodiment, the rotational movement of the work 10, the reciprocating movement of the polishing band 18, and the pressing force of the polishing band 18 acting on the polishing surface 34 of the work 10 by pressing means (not shown). Thereby, the undulation component, particularly an annular shape, remaining on the polishing surface 34 of the work 10 is efficiently removed.
[0034]
When there is a possibility that the pressing shoe 13 may interfere with the polishing surface 34 of the work 10 due to the relative movement between the work 10 and the pressing shoe 13, relief portions are provided at both longitudinal ends of the pressing surface 35 of the pressing shoe 13. To avoid interference between the work 10 and the pressing shoe 13. FIG. 6 schematically shows a polishing state in another embodiment of such a polishing apparatus according to the present invention. Elements having the same functions as those in the previous embodiment are denoted by the same reference numerals, and are not described again. Shall be omitted. That is, in the present embodiment, the work 10 whose polishing surface is the paraboloid of revolution 38 is targeted, and therefore, the pressing surface 35 of the pressing shoe 13 cannot be elongated to about the radius of the work 10. . Further, when the pressing shoe 13 moves to the outer peripheral edge of the work 10, the pressing surface 35 is retracted to the side so that the outer peripheral end does not interfere with the outer peripheral edge of the work 10. A portion 39 is formed. The polishing band 18 in this embodiment has an endless belt shape and is wound around a plurality of (four in the illustrated example) pulleys 40 so as to surround the pressing shoe 13. A drive motor 41 is connected to one of the pulleys 40 to drive the polishing band 18 to rotate. Each of the pulleys 40 is disposed sufficiently behind the pressing surface 35 of the pressing shoe 13 so as not to interfere with the paraboloid of revolution 38 of the work 10, and is in a state close to the side wall portion of the pressing shoe 13.
[0035]
In this manner, the longitudinal ends of the pressing surface 35 of the pressing shoe 13 are suddenly retracted rearward to form the escape portions 39, and the front and left side edges of the pressing shoe 13 and the polishing band 18 separated from the pressing surface 35. Since the portion does not interfere with the paraboloid of revolution 38 of the work 10, the polishing process is performed without any problem even at a place where the radius of curvature of the polishing surface 34 of the work 10 is sharply changed. be able to. Further, by forming the polishing band 18 into an endless belt shape as in this embodiment, the polishing area of the polishing band 18 can be increased, so that the life of the polishing band 18 can be extended and the polishing band 18 can be reciprocated. Polishing can be performed more efficiently than moving.
[0036]
In the above-described embodiment, the case where the polished surface of the work is cylindrical or the case where the polished surface of the work has a complicated three-dimensional shape is described. However, when the polished surface of the work has a complicated three-dimensional shape, as shown in FIG. Using a plurality of pressing shoes 13 respectively corresponding to the polishing surfaces 34 of the ten, the polishing band 18 is moved for each pressing shoe 13 while the workpiece 10 and each pressing shoe 13 are relatively moved, and further, individual pressing (not shown) is performed. By means, the polishing strip 18 can be pressed against the polishing surface 34 of the work 10 perpendicularly to the pressing surface 35 of the pressing shoe 13 with a uniform pressure to remove the waviness component remaining on the polishing surface 34. In this case, it is needless to say that the relative movement amount between the work 10 and the individual pressing shoes 13 needs to be regulated according to the radius of curvature of the polishing surface 34.
[0037]
【The invention's effect】
According to the polishing method of the present invention, the pressing surface of the pressing shoe is held close to the processing surface of the work, and a polishing band for polishing the processing surface of the work is formed between the processing surface of the work and the pressing surface of the pressing shoe. The polishing band is moved along the pressing surface of the pressing shoe while pressing the polishing band in a direction perpendicular to the processing surface of the work, and the working surface of the work and the pressing surface of the pressing shoe are moved in the direction of movement of the polishing band. Is relatively moved in the direction that intersects with the workpiece. Therefore, even if the shape of the processed surface of the work is not only flat, but also spherical or aspherical, it places a large load on measuring the shape of the processed surface and creating processing data. Without removing all the undulation components remaining on the processed surface of the work, this can be efficiently removed while maintaining the surface shape accuracy of the processed surface, and the entire processed surface can be uniformly polished. In addition, since the pressing surface of the pressing shoe has an inverted shape corresponding to the processing surface of the work, the shape error of the processing surface having a longer wavelength than the undulation component is corrected, and the peripheral portion of the processing surface of the work is corrected. Polishing can be performed with high precision according to the design shape without rising or sagging.
[0038]
The processing surface of the work has a rotationally symmetric shape, and the step of moving the polishing band includes moving the polishing band in the radial direction of the work, and the step of relatively moving the processing surface of the work and the pressing surface of the pressing shoe is performed. In this case, the polishing can be performed extremely efficiently.
[0039]
According to the polishing apparatus of the present invention, a pressing shoe having a pressing surface corresponding to a part of a processing surface of a work, and a flexibility that is disposed along the pressing surface of the pressing shoe and can slide on the pressing surface. A polishing band having a polishing layer bonded to a surface of a base material to be formed; a polishing band moving means for moving the polishing band along a pressing surface of a pressing shoe; Pressing means for pressing in a direction perpendicular to the work table, and a work table and a pressing shoe on which the work is mounted such that the processing surface of the work and the pressing surface of the pressing shoe relatively move in a direction intersecting with the moving direction of the polishing band. And a relative moving means for relatively moving the workpiece, so that even if the shape of the work surface of the work is not only flat, but also spherical or aspheric, a great load is required for measuring the shape of the work surface and creating the processing data. Don't put on , Can be uniformly polished so efficiently removed by processing surface throughout while maintaining the surface shape precision of the processed surface of all the undulation component remaining on the processed surface of the workpiece. In addition, since the pressing surface of the pressing shoe has an inverted shape corresponding to the processing surface of the work, the shape error of the processing surface having a longer wavelength than the undulation component is corrected, and the peripheral portion of the processing surface of the work is corrected. Polishing can be performed with high precision according to the design shape without rising or sagging.
[0040]
When a plurality of sets of the pressing shoe, the polishing band, the polishing band moving means, and the pressing means are provided, it is possible to polish efficiently even if the work surface of the work is an aspherical surface having no axis of symmetry.
[0041]
When the pressing shoe further includes shoe holding means for holding the pressing shoe such that the pressing surface of the pressing shoe faces the processing surface of the workpiece at a predetermined interval, the pressing force of the polishing band by the pressing means is reduced by the pressing shoe. It can be made more uniform over the entire pressing surface.
[0042]
When the pressing means uses a fluid pressure and has a pressure adjusting means capable of adjusting the fluid pressure, the work surface of the work is polished even if the work surface of the work has complicated irregularities. The band can be pressed easily and reliably with a uniform pressure. In addition, fluid pressure can be interposed between the pressing surface of the pressing shoe and the base material of the polishing band, thereby reducing the friction caused by the movement of the polishing band with respect to the pressing surface of the pressing shoe, and further improving the polishing band. It can be moved smoothly.
[0043]
If the pressing shoe has relief portions at both ends of the pressing surface of the pressing shoe along the moving direction of the polishing band to avoid interference with the processing surface of the work, the polishing surface may On the other hand, it is possible to prevent a problem in which the pressing surface of the pressing shoe interferes and damages the shape of the work surface of the work. In particular, when the polishing band moving means has a guide means for guiding the polishing band along the relief portion of the pressing shoe, the polishing band does not abut on the work surface of the work at a portion other than the pressing surface of the pressing shoe, and the reliability is improved. High polishing processing can be performed.
[Brief description of the drawings]
FIG. 1 is a conceptual processing diagram schematically illustrating the appearance of a first embodiment of a polishing apparatus according to the present invention.
FIG. 2 is an enlarged sectional view of a portion of a polishing band in the embodiment shown in FIG.
FIG. 3 is a conceptual diagram of a mechanism showing a schematic structure of a portion of a pressing means in the embodiment shown in FIG. 1;
FIG. 4 is a processing conceptual diagram of a second embodiment of the polishing apparatus according to the present invention.
FIG. 5 is a conceptual diagram of processing of a third embodiment of the polishing apparatus according to the present invention.
FIG. 6 is a conceptual processing diagram showing a schematic structure of a part of a polishing apparatus according to the present invention which can avoid interference of a pressing shoe with a work.
FIG. 7 is a perspective view showing an external appearance of a main part of a polishing apparatus according to the present invention for polishing a work to be subjected to the present invention and a surface thereof.
[Explanation of symbols]
10 Work
11 cylindrical concave surface
12 cylindrical convex surface
13 Press shoe
14 Slider driving means
15 Slider guide block
16 Slider
17 Bracket
18 Polished belt
19 Polishing belt drive
20 Substrate
21 Adhesive
22 Elastic material layer
23 Adhesive
24 polishing layer
25 recess
26 Injection port
27 Common Chamber
28 Air piping
29 Pressure regulator
30 Compressor
31 Schmidt lens
32 table drive
33 Rotary table
34 Polished surface
35 pressing surface
36 Gap sensor
37 Shoe holding device
38 paraboloid of revolution
39 Escape
40 pulley
41 Drive motor

Claims (8)

Holding the pressing surface of the pressing shoe close to the processing surface of the work;
Interposing a polishing band for polishing the work surface of the work between the work surface of the work and the pressing surface of the pressing shoe,
Pressing the polishing band in a direction perpendicular to the processing surface of the work,
Moving the polishing band interposed between the processing surface of the work and the pressing surface of the pressing shoe along the pressing surface of the pressing shoe;
A step of relatively moving the work surface of the work and the pressing surface of the pressing shoe in a direction intersecting with the moving direction of the polishing band. The work surface of the work has a rotationally symmetric shape, and the step of moving the polishing band includes moving the work band in the radial direction of the work, and relatively moving the work surface of the work and the pressing surface of the pressing shoe. The polishing method according to claim 1, wherein the step includes driving rotation about an axis of the workpiece. A pressing shoe having a pressing surface corresponding to a part of the processing surface of the work,
A polishing band having a polishing layer that is arranged along the pressing surface of the pressing shoe and is bonded to a surface of a flexible base material that can slide on the pressing surface,
A polishing band moving means for moving the polishing band along the pressing surface of the pressing shoe,
Pressing means provided on the pressing shoe, pressing the polishing band in a direction perpendicular to the processing surface of the work,
Relative movement means for relatively moving a work table on which a work is mounted and the pressing shoe, so that the processing surface of the work and the pressing surface of the pressing shoe relatively move in a direction intersecting the moving direction of the polishing band. A polishing apparatus characterized by comprising: The polishing apparatus according to claim 3, comprising a plurality of sets of the pressing shoe, the polishing band, the polishing band moving unit, and the pressing unit. 5. The apparatus according to claim 3, further comprising a shoe holding unit configured to hold the pressing shoe such that the pressing surface of the pressing shoe faces the processing surface of the workpiece at a predetermined interval. 6. The polishing apparatus according to the above. The polishing apparatus according to any one of claims 3 to 5, wherein the pressing means uses a fluid pressure, and has a pressure adjusting means capable of adjusting the fluid pressure. 4. The pressing shoe according to claim 3, wherein the pressing shoe has relief portions at both ends of the pressing surface of the pressing shoe along the moving direction of the polishing band to avoid interference with a work surface of the workpiece. The polishing apparatus according to any one of claims 1 to 6. The polishing apparatus according to claim 7, wherein the polishing band moving unit includes a guide unit that guides the polishing band along the relief portion of the pressing shoe.

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