JP2004008830A - Plasma cleaning apparatus - Google Patents

Plasma cleaning apparatus Download PDF

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Publication number
JP2004008830A
JP2004008830A JP2002161444A JP2002161444A JP2004008830A JP 2004008830 A JP2004008830 A JP 2004008830A JP 2002161444 A JP2002161444 A JP 2002161444A JP 2002161444 A JP2002161444 A JP 2002161444A JP 2004008830 A JP2004008830 A JP 2004008830A
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JP
Japan
Prior art keywords
magazine
plasma
chamber
active electrode
process gas
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JP2002161444A
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Japanese (ja)
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JP4090792B2 (en
Inventor
Eiji Komine
小峰 栄治
Masaki Sekizaki
関崎 雅樹
Yoshito Ushida
牛田 義人
Takeshi Imai
今井 武志
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Yamato Scientific Co Ltd
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Yamato Scientific Co Ltd
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Priority to JP2002161444A priority Critical patent/JP4090792B2/en
Publication of JP2004008830A publication Critical patent/JP2004008830A/en
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Abstract

<P>PROBLEM TO BE SOLVED: To prevent a burning phenomenon such as the burning or the like of an article to be treated even if a magazine is used without knowing that a part of a surface is peeled to expose the magazine and that insulating irregularity is yielded. <P>SOLUTION: A pair of counter electrodes comprising an active electrode 9 and an earth electrode 11 are provided in a chamber 3 into which a process gas is introduced, and the magazine 7 having the article 5 to be treated housed and set therein through a support member made of an insulating material is supported above the active electrode 9 to certainly ensure an insulating state between the active electrode 9 and the magazine 7. <P>COPYRIGHT: (C)2004,JPO

Description

【0001】
【発明の属する技術分野】
この発明は、マガジン内に収納セットされた被処理物をプラズマによって洗浄するプラズマ洗浄装置に関する。
【0002】
【従来の技術】
プラズマ洗浄装置は、大気圧より減圧されたチャンバ内にプロセスガスを導入し、対向し合う一対の活性電極とアース電極との間でプラズマを発生させ、そのプラズマによって被処理物の洗浄を行なうようになっている。
【0003】
プラズマ中にはイオン、ラジカル等が存在し、これらが被処理物の洗浄に寄与するもので、現在、環境汚染等を招く洗浄液を使用する洗浄に替わる手段として期待されている。
【0004】
【発明が解決しようとする課題】
プラズマ洗浄は、環境汚染に対して悪影響を与えることがないところから、その洗浄対象が例えば、電子部品、工業部品まで広がりつつある。
【0005】
具体的には、例えば、チップ実装用のリードフレームをマガジン内に所定の間隔で挿入セットし、そのマガジンを対向し合う活性電極とアース電極との間で、かつ、活性電極の上面に配置セットすることでプラズマによる洗浄が行なわれようになっている。
【0006】
被処理物を一度に多数プラズマ洗浄処理できるマガジンは、加工性、耐久性、コストの面から金属板によって加工され、表面はアルマイト等の絶縁材料によって表面処理されている。
【0007】
しかしながら、使用中に例えば、マガジン同志、あるいは他の所にぶつけた場合に、その衝撃によって表面が剥がれて金属が露出し、絶縁ムラが発生するようになる。
【0008】
マガジンに絶縁ムラがあるのを知らずに使用すると、その領域にプラズマが集中し易く強く作用する結果、リードフレームに焼け等のバーニングが起きる不具合があった。
【0009】
そこで、この発明は、絶縁ムラが起きたのを知らずにマガジンを使用してもバーニング等を起こすことなく安定した均一な洗浄が得られるプラズマ洗浄装置を提供することを目的としている。
【0010】
【課題を解決するための手段】
前記目的を達成するために、この発明の請求項1にあっては、プラズマ発生用電源に接続された活性電極と接地されたアース電極とから成る一対の対向電極を備えたチャンバ内に、吹出口からプロセスガスを導入する一方、前記チャンバ内を大気圧より減圧してプラズマを発生させ、そのプラズマによって表面が絶縁状態に処理されたマガジン内の被処理物を洗浄するプラズマ洗浄装置において、
前記マガジンは、前記活性電極の上方に絶縁材料で作られた支持部材を介して支持されることを特徴とする。
【0011】
これにより、マガジンに絶縁ムラが発生しても、絶縁材料で作られた支持部材によって活性電極に対して確実な絶縁状態で支持されるため、プラズマがマガジンの露出部分となる一部分に集中する、という現象が回避される結果、焼け等のバーニング現象は起こらず、安定したプラズマ洗浄が行なえるようになる。
【0012】
また、この発明の請求項2にあっては、プロセスガスを吹出す吹出口は、チャンバの内壁面に所定広さの領域にわたって配置されると共にその全領域面からマガジンへ向けてシャワー状に吹出すことを特徴とする。
【0013】
これにより、プロセスガスは、チャンバ内のマガジンに向かってほぼ水平に均一に吹出されるため、マガジン領域においてムラなくイオン化、ラジカル化された雰囲気が得られる。
【0014】
【発明の実施の形態】
以下、図1の図面を参照しながらこの発明の実施の形態について具体的に説明する。
【0015】
図1はプラズマ洗浄装置1全体の概要説明図を示している。
【0016】
プラズマ洗浄装置1のチャンバ3は、全面が開閉扉(図示していない)となっていて、開閉扉を開とすることで、被処理物5が収納セットされたマガジン7の出し入れが可能となる。一方、閉とすることで密閉状態が作られるようになっている。チャンバ3内には、プレート状の活性電極9とアース電極11が上下に対向して配置された一対の対向電極となっている。下位側の活性電極9は絶縁材料となるセラミックで作られた支脚部13によって、上位側のアース電極11はセラミックで作られた支柱15によってそれぞれ四点支持されている。
【0017】
活性電極9は、プラズマ発生用電源17によって高周波が印加されるようになっている。
【0018】
高周波としては、13.56MzのRF周波数(ラジオ波)が好ましいが、2.45GHzなどのマイクロ波又は10kHz未満の低周波を用いてもよい。
【0019】
活性電極9の上方には、前記したマガジン7が配置セッとされ、そのマガジン7はセラミック等の絶縁材料で作られた支持部材19によって支持されている。
【0020】
マガジン7は、金属板によって一方が開放されたボックス状に形成され、表面はアルマイト等によって絶縁状態に処理された形状となっている。内部には、被処理物5となる、例えば、チップ実装用のリードフレーム等が所定の間隔を有して収納セットされるようになっている。
【0021】
活性電極9と対向し合うアース電極11は、接地電位となるようチャンバ3の内壁面と接続している。
【0022】
一方、チャンバ3の一方の内周壁面にはプロセスガスを吹出す吹出口21が、その吹出口21と対向し合う他方の内周壁面には排気口23がそれぞれ設けられている。
【0023】
吹出口21は、所定広さの領域にわたって口径の小さい孔が多数配置され、図外のプロセス供給部から供給管25を介してプロセスガスが送り込まれるようになっている。これにより、プロセスガスは前記マガジン7へ向かって全領域からほぼ水平方向にシャワー状に吹出すことが可能となる。
【0024】
供給管25は、プロセスガス用のバルブ27を有し、プロセスガス用のバルブ27の開又は閉によってプロセスガスの供給、遮断制御が可能となっている。
【0025】
なお、プロセスガスとしては、酸素、アルゴン、窒素、水素等を用いてよく、あるいは、それらを組合せた混合ガスとして使用することも可能である。
【0026】
排気口23は排気管29を介して図外の真空ポンプと接続連通し、排気管29に設けられた真空ポンプ用のバルブ31を開とすることで、チャンバ3内は大気圧より減圧された所定の真空状態が作られるようになっている。
【0027】
このように構成されたプラズマ洗浄装置1の作用について説明する。まず、真空ポンプ用のバルブ31を開として図外の真空ポンプを作動し、チャンバ3内を大気圧より減圧した真空状態を作る。真空度が設定値に到達した時点で吹出口21からプロセスガスを吹出す。
【0028】
続いて、活性電極9に例えば13.56MHzの高周波を印加することで、活性電極9とマイナス電極11との間で放電が起こりプラズマが発生する。
【0029】
この時、吹出口21から吹き出されたプラズマ中のプロセスガスは、ほぼ水平にマガジン7へ向かってシャワー状に吹出されるため、濃・淡を起こすことなくムラのないほぼ均一にイオン化、ラジカル化された雰囲気が得られると共に、それらがマガジン7内に収納セットされたリードフレーム等の被処理物5の表面に作用することで汚れを落とす。
【0030】
このプラズマによる洗浄工程時に、表面の絶縁材料が剥がれて金属の一部が露出し絶縁ムラがあることを知らずにマガジン7を使用した場合でも、支持部材19によって活性電極9から確実に絶縁された支持状態が確保されているため、プラズマがその露出部分に集中する不具合がなくなり、被処理物5の焼け等のバーニング現象を未然に防げるようになる。
【0031】
【発明の効果】
以上、説明したように、この発明の請求項1によれば、金属の一部分が露出した絶縁ムラのあるマガジンを知らずに使用したとしても、そのマガジンを活性電極の上方に確実な絶縁状態で支持したため、露出部分にプラズマが集中するのを確実に回避できる。この結果、被処理物の焼け等のバーニング現象を未然に防ぐことができると共に安定したプラズマ洗浄が行なえる。
【0032】
また、この発明の請求項2によれば、プロセスガスを広い領域にわたってほぼ均一に吹き出すことができるため、プラズマ中のプロセスガスはマガジン領域においてムラのないイオン化、ラジカル化が図れる。
【図面の簡単な説明】
【図1】この発明にかかるプラズマ洗浄装置全体の概要説明図。
【符号の説明】
3 チャンバ
5 被処理物
7 マガジン
9 活性電極
11 アース電極
17 プラズマ発生用電源
19 支持部材
21 吹出口
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a plasma cleaning apparatus for cleaning an object stored and set in a magazine with plasma.
[0002]
[Prior art]
A plasma cleaning apparatus introduces a process gas into a chamber reduced in pressure from the atmospheric pressure, generates plasma between a pair of opposing active electrodes and a ground electrode, and cleans an object to be processed by the plasma. It has become.
[0003]
The plasma contains ions, radicals, and the like, which contribute to the cleaning of the object to be processed, and is currently expected as a means for replacing cleaning using a cleaning liquid that causes environmental pollution and the like.
[0004]
[Problems to be solved by the invention]
Since plasma cleaning has no adverse effect on environmental pollution, its cleaning targets are expanding to, for example, electronic components and industrial components.
[0005]
More specifically, for example, a lead frame for chip mounting is inserted and set at a predetermined interval in a magazine, and the magazine is set between an opposing active electrode and a ground electrode and on the upper surface of the active electrode. As a result, cleaning by plasma is performed.
[0006]
A magazine capable of plasma-cleaning a large number of workpieces at a time is processed by a metal plate in terms of workability, durability and cost, and the surface is surface-treated with an insulating material such as alumite.
[0007]
However, for example, when the magazines are hit against each other or another place during use, the impact peels off the surface, exposing the metal, and causing uneven insulation.
[0008]
If the magazine is used without knowing that there is uneven insulation, the plasma tends to concentrate in that region and acts strongly, resulting in a problem that burning such as burning occurs in the lead frame.
[0009]
SUMMARY OF THE INVENTION It is an object of the present invention to provide a plasma cleaning apparatus capable of obtaining stable and uniform cleaning without causing burning or the like even when a magazine is used without knowing that insulation unevenness has occurred.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, according to the first aspect of the present invention, a gas is blown into a chamber provided with a pair of counter electrodes each including an active electrode connected to a power supply for plasma generation and a ground electrode grounded. In a plasma cleaning apparatus for introducing a process gas from an outlet while generating plasma by depressurizing the inside of the chamber from the atmospheric pressure, and cleaning an object to be processed in a magazine whose surface is processed into an insulating state by the plasma,
The magazine is supported via a support member made of an insulating material above the active electrode.
[0011]
Thereby, even if the magazine has uneven insulation, the support member made of an insulating material supports the active electrode in a reliable insulating state, so that the plasma concentrates on a part of the magazine that becomes an exposed portion. As a result, the burning phenomenon such as burning does not occur, and stable plasma cleaning can be performed.
[0012]
According to a second aspect of the present invention, the blow-out port for blowing the process gas is disposed over an area of a predetermined size on the inner wall surface of the chamber, and blows in a shower shape from the entire area surface to the magazine. It is characterized by putting out.
[0013]
As a result, the process gas is blown substantially horizontally and uniformly toward the magazine in the chamber, so that an ionized and radicalized atmosphere can be obtained in the magazine region without unevenness.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, an embodiment of the present invention will be specifically described with reference to the drawing of FIG.
[0015]
FIG. 1 is a schematic explanatory diagram of the entire plasma cleaning apparatus 1.
[0016]
The entire surface of the chamber 3 of the plasma cleaning apparatus 1 is an opening / closing door (not shown). By opening the opening / closing door, the magazine 7 in which the workpiece 5 is stored and set can be taken in and out. . On the other hand, a closed state is created by closing. In the chamber 3, a plate-shaped active electrode 9 and a ground electrode 11 are formed as a pair of opposing electrodes arranged so as to face up and down. The lower active electrode 9 is supported at four points by a support leg 13 made of ceramic as an insulating material, and the upper ground electrode 11 is supported at four points by a support 15 made of ceramic.
[0017]
A high frequency is applied to the active electrode 9 by a power supply 17 for plasma generation.
[0018]
As the high frequency, an RF frequency (radio wave) of 13.56 Mz is preferable, but a microwave such as 2.45 GHz or a low frequency of less than 10 kHz may be used.
[0019]
Above the active electrode 9, the above-mentioned magazine 7 is arranged and set, and the magazine 7 is supported by a support member 19 made of an insulating material such as ceramic.
[0020]
The magazine 7 is formed in a box shape with one side opened by a metal plate, and has a surface treated to be insulated with alumite or the like. Inside, for example, a lead frame for chip mounting or the like, which is to be processed 5, is stored and set at a predetermined interval.
[0021]
The ground electrode 11 facing the active electrode 9 is connected to the inner wall surface of the chamber 3 so as to be at the ground potential.
[0022]
On the other hand, an outlet 21 for blowing out the process gas is provided on one inner peripheral wall of the chamber 3, and an exhaust port 23 is provided on the other inner peripheral wall facing the outlet 21.
[0023]
The outlet 21 is provided with a large number of small-diameter holes over a region of a predetermined size, and a process gas is fed from a process supply unit (not shown) via a supply pipe 25. As a result, the process gas can be blown out from the entire region toward the magazine 7 in a substantially horizontal direction in a shower shape.
[0024]
The supply pipe 25 has a valve 27 for the process gas, and the supply or cutoff of the process gas can be controlled by opening or closing the valve 27 for the process gas.
[0025]
As the process gas, oxygen, argon, nitrogen, hydrogen, or the like may be used, or a mixed gas obtained by combining them may be used.
[0026]
The exhaust port 23 is connected to and connected to a vacuum pump (not shown) through an exhaust pipe 29, and the pressure in the chamber 3 is reduced from the atmospheric pressure by opening a vacuum pump valve 31 provided in the exhaust pipe 29. A predetermined vacuum state is created.
[0027]
The operation of the plasma cleaning apparatus 1 configured as described above will be described. First, the vacuum pump valve 31 is opened, and a vacuum pump (not shown) is operated to create a vacuum state in which the pressure in the chamber 3 is reduced from the atmospheric pressure. When the degree of vacuum reaches the set value, the process gas is blown from the outlet 21.
[0028]
Subsequently, by applying a high frequency of 13.56 MHz to the active electrode 9, a discharge occurs between the active electrode 9 and the negative electrode 11 to generate plasma.
[0029]
At this time, the process gas in the plasma blown out from the blow-out port 21 is blown out almost horizontally to the magazine 7 in a shower shape, so that it is almost uniformly ionized and radicalized without unevenness without causing dark and light. The resulting atmosphere is obtained, and at the same time, they act on the surface of the workpiece 5 such as a lead frame housed and set in the magazine 7 to remove dirt.
[0030]
At the time of this plasma cleaning step, even when the magazine 7 was used without knowing that the insulating material on the surface was peeled off and a part of the metal was exposed and there was insulation unevenness, the support member 19 reliably insulated the active electrode 9 from the active electrode 9. Since the supporting state is ensured, the problem that the plasma concentrates on the exposed portion is eliminated, and the burning phenomenon such as burning of the workpiece 5 can be prevented.
[0031]
【The invention's effect】
As described above, according to the first aspect of the present invention, even when a magazine having a part of metal exposed and having uneven insulation is used without knowing it, the magazine is supported above the active electrode in a reliable insulating state. Therefore, concentration of plasma on the exposed portion can be reliably avoided. As a result, a burning phenomenon such as burning of the object can be prevented beforehand, and stable plasma cleaning can be performed.
[0032]
According to the second aspect of the present invention, since the process gas can be blown out almost uniformly over a wide area, the process gas in the plasma can be uniformly ionized and radicalized in the magazine area.
[Brief description of the drawings]
FIG. 1 is a schematic explanatory view of an entire plasma cleaning apparatus according to the present invention.
[Explanation of symbols]
3 Chamber 5 Workpiece 7 Magazine 9 Active electrode 11 Earth electrode 17 Plasma generation power supply 19 Support member 21 Blow-out port

Claims (2)

プラズマ発生用電源に接続された活性電極と接地されたアース電極とから成る一対の対向電極を備えたチャンバ内に、吹出口からプロセスガスを導入する一方、前記チャンバ内を大気圧より減圧してプラズマを発生させ、そのプラズマによって表面が絶縁状態に処理されたマガジン内の被処理物を洗浄するプラズマ洗浄装置において、
前記マガジンは、前記活性電極の上方に絶縁材料で作られた支持部材を介して支持されることを特徴とするプラズマ洗浄装置。
A process gas is introduced from a blow-out port into a chamber provided with a pair of counter electrodes each including an active electrode connected to a power supply for plasma generation and a grounded earth electrode, and the inside of the chamber is depressurized from atmospheric pressure. In a plasma cleaning apparatus that generates plasma and cleans an object to be processed in a magazine whose surface is processed into an insulating state by the plasma,
The apparatus according to claim 1, wherein the magazine is supported above the active electrode via a supporting member made of an insulating material.
プロセスガスを吹出す吹出口は、チャンバの内壁面に所定広さの領域にわたって配置されると共にその全領域面からマガジンへ向けてシャワー状に吹出すことを特徴とする請求項1記載のプラズマ洗浄装置。2. The plasma cleaning apparatus according to claim 1, wherein the outlet for blowing out the process gas is disposed over a region of a predetermined size on the inner wall surface of the chamber, and blows out the entire surface of the chamber in a shower shape toward the magazine. apparatus.
JP2002161444A 2002-06-03 2002-06-03 Plasma cleaning device Expired - Fee Related JP4090792B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008186994A (en) * 2007-01-30 2008-08-14 Hitachi High-Tech Instruments Co Ltd Plasma cleaning device
WO2013011761A1 (en) * 2011-07-15 2013-01-24 パナソニック株式会社 Cleaning apparatus
CN103639155A (en) * 2013-12-11 2014-03-19 中国电子科技集团公司第二研究所 Lead frame online plasma surface processing device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008186994A (en) * 2007-01-30 2008-08-14 Hitachi High-Tech Instruments Co Ltd Plasma cleaning device
WO2013011761A1 (en) * 2011-07-15 2013-01-24 パナソニック株式会社 Cleaning apparatus
CN103639155A (en) * 2013-12-11 2014-03-19 中国电子科技集团公司第二研究所 Lead frame online plasma surface processing device

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