JP2004006815A5 - - Google Patents
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- Publication number
- JP2004006815A5 JP2004006815A5 JP2003111311A JP2003111311A JP2004006815A5 JP 2004006815 A5 JP2004006815 A5 JP 2004006815A5 JP 2003111311 A JP2003111311 A JP 2003111311A JP 2003111311 A JP2003111311 A JP 2003111311A JP 2004006815 A5 JP2004006815 A5 JP 2004006815A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/133,724 US6762113B2 (en) | 2002-04-26 | 2002-04-26 | Method for coating a semiconductor substrate with a mixture containing an adhesion promoter |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004006815A JP2004006815A (ja) | 2004-01-08 |
| JP2004006815A5 true JP2004006815A5 (ja) | 2006-04-20 |
Family
ID=28791024
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003111311A Withdrawn JP2004006815A (ja) | 2002-04-26 | 2003-04-16 | 半導体基板材料をコーティングする方法 |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6762113B2 (ja) |
| EP (1) | EP1357585A3 (ja) |
| JP (1) | JP2004006815A (ja) |
| KR (1) | KR20030084743A (ja) |
| CN (1) | CN1453822A (ja) |
| TW (1) | TW200305621A (ja) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6762113B2 (en) * | 2002-04-26 | 2004-07-13 | Hewlett-Packard Development Company, L.P. | Method for coating a semiconductor substrate with a mixture containing an adhesion promoter |
| KR20060115323A (ko) * | 2003-10-14 | 2006-11-08 | 마쯔시다덴기산교 가부시키가이샤 | 트랜지스터 집적 회로 장치 및 그 제조 방법 |
| US7635919B1 (en) | 2005-05-26 | 2009-12-22 | Rockwell Collins, Inc. | Low modulus stress buffer coating in microelectronic devices |
| US20070298268A1 (en) * | 2006-06-27 | 2007-12-27 | Gelcore Llc | Encapsulated optoelectronic device |
| JP4297943B2 (ja) * | 2007-01-26 | 2009-07-15 | 中外炉工業株式会社 | 板状材の塗工方法 |
| US8981311B2 (en) | 2010-05-24 | 2015-03-17 | Koninklijke Philips N.V. | CT detector including multi-layer fluorescent tape scintillator with switchable spectral sensitivity |
| US8753460B2 (en) | 2011-01-28 | 2014-06-17 | International Business Machines Corporation | Reduction of edge chipping during wafer handling |
| DE102011114865B4 (de) | 2011-07-29 | 2023-03-02 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements |
| EP2836800B1 (en) * | 2012-04-11 | 2020-06-24 | University Of Virginia Patent Foundation | Gaseous flow sensor and related method thereof |
| DE102016113162A1 (de) * | 2015-07-28 | 2017-02-02 | Schott Ag | Bedienblende für ein Haushaltsgerät mit zumindest einer Benutzerschnittstelle, Haushaltsgerät und Verfahren zur Herstellung der Bedienblende mit Benutzerschnittstelle |
| CN108649192B (zh) * | 2018-04-08 | 2019-08-16 | 河南大学 | 一种基于接触角测试制备电极材料表面均匀修饰层的方法 |
| EP4350759A1 (en) | 2022-10-06 | 2024-04-10 | Nexperia B.V. | A semiconductor device |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4183839A (en) | 1976-04-08 | 1980-01-15 | John V. Long | Polyimide resin-forming composition |
| DE3107633A1 (de) | 1981-02-27 | 1982-09-16 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung duenner polyimidschichten" |
| US4604644A (en) * | 1985-01-28 | 1986-08-05 | International Business Machines Corporation | Solder interconnection structure for joining semiconductor devices to substrates that have improved fatigue life, and process for making |
| DE3606266A1 (de) * | 1986-02-27 | 1987-09-03 | Basf Ag | Lichtempfindliches aufzeichnungselement |
| US5024922A (en) * | 1988-11-07 | 1991-06-18 | Moss Mary G | Positive working polyamic acid/imide and diazoquinone photoresist with high temperature pre-bake |
| US5133840A (en) | 1990-05-15 | 1992-07-28 | International Business Machines Corporation | Surface midification of a polyimide |
| DE4119444A1 (de) * | 1991-06-13 | 1992-12-17 | Wolff Walsrode Ag | Beschichtungssystem fuer wasserquellbare materialien |
| US5742075A (en) * | 1994-10-07 | 1998-04-21 | Iowa State University Research Foundation, Inc. | Amorphous silicon on insulator VLSI circuit structures |
| US5635240A (en) * | 1995-06-19 | 1997-06-03 | Dow Corning Corporation | Electronic coating materials using mixed polymers |
| US5965679A (en) | 1996-09-10 | 1999-10-12 | The Dow Chemical Company | Polyphenylene oligomers and polymers |
| US6300162B1 (en) | 2000-05-08 | 2001-10-09 | Rockwell Collins | Method of applying a protective layer to a microelectronic component |
| US6762113B2 (en) * | 2002-04-26 | 2004-07-13 | Hewlett-Packard Development Company, L.P. | Method for coating a semiconductor substrate with a mixture containing an adhesion promoter |
-
2002
- 2002-04-26 US US10/133,724 patent/US6762113B2/en not_active Expired - Fee Related
- 2002-12-19 TW TW091136727A patent/TW200305621A/zh unknown
-
2003
- 2003-03-10 CN CN03120153A patent/CN1453822A/zh active Pending
- 2003-04-16 JP JP2003111311A patent/JP2004006815A/ja not_active Withdrawn
- 2003-04-25 EP EP03252638A patent/EP1357585A3/en not_active Withdrawn
- 2003-04-25 KR KR10-2003-0026221A patent/KR20030084743A/ko not_active Application Discontinuation
- 2003-10-30 US US10/696,825 patent/US7071548B2/en not_active Expired - Lifetime