JP2003523070A - Method and apparatus for manufacturing thin-layer structure - Google Patents
Method and apparatus for manufacturing thin-layer structureInfo
- Publication number
- JP2003523070A JP2003523070A JP2000544168A JP2000544168A JP2003523070A JP 2003523070 A JP2003523070 A JP 2003523070A JP 2000544168 A JP2000544168 A JP 2000544168A JP 2000544168 A JP2000544168 A JP 2000544168A JP 2003523070 A JP2003523070 A JP 2003523070A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- layer
- thin layer
- manufacturing
- layer structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 238000007641 inkjet printing Methods 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 238000003860 storage Methods 0.000 claims description 6
- 239000007858 starting material Substances 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims 1
- 239000002585 base Substances 0.000 claims 1
- 239000003779 heat-resistant material Substances 0.000 claims 1
- 239000011261 inert gas Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 230000009969 flowable effect Effects 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 23
- 239000004020 conductor Substances 0.000 description 12
- 238000000576 coating method Methods 0.000 description 9
- 239000011248 coating agent Substances 0.000 description 8
- 239000010408 film Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000002344 surface layer Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000000018 DNA microarray Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010884 ion-beam technique Methods 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
- H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
- B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
- Physical Vapour Deposition (AREA)
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
Abstract
(57)【要約】 薄層構造物の製造方法及び製造装置多層薄層構造物を製造するとき、インクジェットプリント原理に基づくプログラムに制御されたプロセスにより、各層は、その目的が要求する幾何的形状で、画素毎に基板に塗布される。各々の薄層の材料は、溶剤を加えることにより又は加熱によって流動可能な状態となっている。個々の単数又は多数の層は、微細な小滴又は流動性の噴流の形状で、随意的に一つの同じ層において異なる厚さで、コンピューターに記憶されたプログラムに制御されるとおりに、材料供給の横の動きに対して垂直に移動できる基板に塗布される。 (57) [Summary] Manufacturing method and manufacturing apparatus of thin layer structure When manufacturing a multilayer thin layer structure, each layer is formed into a substrate for each pixel in a geometric shape required for the purpose by a process controlled by a program based on an ink jet printing principle. Applied to The material of each thin layer is made flowable by adding a solvent or by heating. The individual layer or layers may be in the form of fine droplets or fluid jets, optionally at different thicknesses in one and the same layer, as controlled by a computer stored program. Is applied to a substrate that can move vertically with respect to the lateral movement of.
Description
【０００１】 薄層構造物の製造方法及び製造装置[0001] Method and apparatus for manufacturing thin layer structure
【０００２】
本発明は、部分的に厚さの異なることのある薄い幾何的に構成された単数又は
多数の層を製造する、薄層構造物の製造方法、及びこのプロセスを実施するため
の装置に関する。The invention relates to a method for the production of thin-layer structures, and an apparatus for carrying out this process, for producing thin geometrically constructed single or multiple layers which may have different thicknesses. Regarding
【０００３】
様々な材料の薄層構造物は、最も変化に富んだ用途、例えば、電子回路、コー
ティングした眼鏡や窓ガラス、ＤＮＡチップ、ドライケミストリーに使用される
試験用の細長い片、マイクロメカニックスの薄層構造物、その他多くの用途に使
用される。Laminated structures of various materials are used in the most varied applications such as electronic circuits, coated eyeglasses and glazings, DNA chips, test strips used in dry chemistry, micromechanics. It is used for thin-layer structures and many other applications.
【０００４】
多層薄層構造物、例えば、電子部品や一体となった回路の公知の製造方法にお
いて、銅、銀等の導電性の材料の広面積で薄いフィルムは、コーティングプラン
トにおいて基板に塗布される。コーティングのプロセスは、典型的に、蒸着若し
くはスパッタリングを使用する方法、エピタキシャル成長、又は、レーザー除去
方法若しくは電気化学プロセスの方法によって実施される。この細長い片の導電
体又は素子の層は、種々のリソグラフィック法を使用することにより構成される
。この目的の為、先ず最初に、製造される構造物のマスクが製造され、これは、
ＵＶ、Ｘ−線、電子又はイオンビームを使用することにより、基板の導電層に塗
布される放射線感受性のコーティングフィルムを曝す為に使用される。次に、曝
された又は曝されていないコーティングフィルムは溶解され、露出した表面層が
エッチングによって取り除かれる。最後に、残ったコーティングフィルムがはぎ
取られ、これによって残った表面層は、例えば、細長い片の導電体を形成するこ
とができる。In a known method for manufacturing multilayer thin layer structures, such as electronic components and integrated circuits, large area, thin films of conductive materials such as copper, silver, etc. are applied to substrates in coating plants. It The coating process is typically carried out by methods using vapor deposition or sputtering, epitaxial growth, or laser ablation or electrochemical process methods. The layers of conductors or elements of this strip are constructed by using various lithographic methods. For this purpose, first of all, a mask of the structure to be manufactured is manufactured, which is
It is used to expose a radiation-sensitive coating film applied to the conductive layer of a substrate by using UV, X-rays, electron or ion beams. The exposed or unexposed coating film is then dissolved and the exposed surface layer is etched away. Finally, the remaining coating film is stripped off, whereby the remaining surface layer can form, for example, strip conductors.
【０００５】
特に、複雑な回路、例えば、多数の交差点と、電気的に絶縁された細長い片の
導電体で１つの細長い片の導電体の間でさえ厚さが変化しそして随意的に混合材
料からなる導電体とを備えたもの、を製造する為には、公知のリソグラフィック
な方法によれば、多数の異なるプロセス段階を必要とし更に必要な設備も極めて
高価であるため、非常に時間を消費すると共にコストがかかることとなる。In particular, in complex circuits, for example, with multiple crossings and electrically isolated strip conductors with varying thickness even between one strip conductors and optionally mixed materials. In order to produce a material with a conductor consisting of, according to known lithographic methods, many different process steps are required and the equipment required is also very expensive, which is very time consuming. It consumes and costs.
【０００６】
そこで、以上の如きタイプの様々な多層薄層構造物の製造方法で、公知のリソ
グラフィック法よりも必要とする労資と時間が少なく、これによって材料と設備
を節約することができる製造方法を提供することを本発明の課題とする。Therefore, in the manufacturing method of various multilayer thin layer structures of the above type, the labor and time required are less than those in the known lithographic method, which can save the material and the equipment. It is an object of the present invention to provide a method.
【０００７】
この課題はクレーム１の特有の部分に従った薄層構造物の製造方法における発
明によって解決され、クレーム１においては、インクジエットプリントの原理に
基づくプログラムに制御されたプロセスを使用することにより、その各目的に適
した幾何的形状で、各層が画素毎に基板に直接塗布され、そして、このインクジ
エットプリントの原理においては、熱に又は溶剤によって液化され且つノズルヘ
ッドに連結された貯蔵タンクに貯蔵された出発材料が、単数の又は重ね合わされ
た層を形成すべく、基板表面に供給され、前記プロセスが、物質の適量と、ノズ
ルヘッドの前後の動き及び垂直の対応する基板の動きによる位置決めとを決定す
る特定のプログラムによって制御されている。This problem is solved by the invention in a method for manufacturing a thin-layer structure according to the particular part of claim 1, in which the use of a program-controlled process based on the principle of inkjet printing is used. Each layer is applied pixel-by-pixel directly to the substrate in a geometry suitable for its respective purpose, and in the principle of this ink jet printing, it is liquefied by heat or solvent and connected to the nozzle head. The starting material stored in the tank is fed to the substrate surface to form a single or superposed layer, said process comprising the appropriate amount of material and the back and forth movement of the nozzle head and the corresponding vertical movement of the substrate. It is controlled by a specific program that determines the positioning by.
【０００８】
換言すれば、この発明のコンセプトは、単数の及び／又は重ね合わされた層と
して様々な薄層構造物の各々の幾何的形状を形成又は応用するためインクジェッ
トプリンターに基づくプロセスの利用である。構成要素は、実質的に、液状の薄
層材料の微細な噴流又は微細な小滴によってプリントされる。しかし、従来のイ
ンクジェットプリントと異なり、このプロセスによれば、厚さの異なる又は一つ
の層の間で厚さの異なる様々な層に関しても、薄層構造物に適した液化された出
発材料を基板に塗布することが許容される。In other words, the concept of the present invention is the use of an inkjet printer-based process to form or apply the geometry of each of the various lamina structures as single and / or superposed layers. . The components are printed substantially by fine jets or droplets of liquid lamina material. However, unlike conventional ink jet printing, this process allows liquefied starting materials suitable for thin layer structures to be applied to substrates even for various layers of different thickness or different thicknesses within one layer. It is acceptable to apply
【０００９】
ここに提案された発明に従ったプロセスは、公知のリソグラフィックな薄層の
技術よりも極めて有効であり、このことは、最も複雑な薄層構造物をより短時間
により少ない労資で、更により少ない材料と設備をもって製造できることを意味
する。The process according to the invention proposed here is significantly more effective than the known lithographic thin layer techniques, which means that the most complex thin layer structures can be produced in less time and in less labor. , Meaning that it can be manufactured with even less material and equipment.
【００１０】 本発明における他の特有の特徴と有利な改善は、サブクレームから生じる。[0010] Other particular features and advantageous refinements of the invention result from the subclaims.
【００１１】
交差領域において電気的に絶縁された二つの交差する細長い片の導電体からな
る電気薄層回路を製造する実施例を参照しつつ、本発明に付いて、これからより
詳細に説明する。The present invention will now be described in more detail with reference to an example of manufacturing an electrical laminar circuit consisting of two intersecting strips of electrical conductors electrically insulated in the intersecting region.
【００１２】
回路を製造する為に使用される装置は、コンピューターに接続される一般的に
知られているインクジェットプリンターに類似しており、これは図示されていな
い。従来のインクジェットプリンターとの違いは、ノズルヘッドに連結された貯
蔵タンクが導電性の銀又は絶縁材料として機能するコーティングフィルムで満た
されている点である。両材料は、溶剤と混合されて、流動可能状態となっている
。導電性の銀溶液と液状のコーティングフィルムとに接触することとなる装置の
部分は、耐溶剤性の材料からなる（与えられるべき材料が加熱されて可溶性の状
態で塗布される場合には、耐熱性の材料）。
貯蔵タンクに接続され且つ各材料に応じた大きさに作られたノズルヘッド（プ
リンターヘッド）における材料供給ノズルの開閉装置は、装置のノズルヘッドの
線の動き及びこれに垂直な基板の動きと同様に、前記コンピューターに記憶され
たプログラムにより制御されている。The equipment used to manufacture the circuit is similar to commonly known inkjet printers connected to a computer, which is not shown. The difference from the conventional inkjet printer is that the storage tank connected to the nozzle head is filled with conductive silver or a coating film that functions as an insulating material. Both materials are mixed with a solvent so that they can flow. The parts of the device that come into contact with the conductive silver solution and the liquid coating film consist of solvent resistant materials (heat resistant if the material to be applied is heated and applied in a soluble state). Material). The opening / closing device of the material supply nozzle in the nozzle head (printer head) connected to the storage tank and sized according to each material is similar to the movement of the line of the nozzle head of the device and the movement of the substrate perpendicular thereto. And is controlled by a program stored in the computer.
【００１３】
使用される基板は、導電性の銀と絶縁層とが前記交差点において塗布されるシ
リコンウエハとすることができる。
先ず最初に、シリコンウエハがプリンターヘッドに対応してＹ−方向に移動す
る間に、導電性の銀溶液のための物資供給ノズルを開いた状態で、記憶された細
長い片の導電体のパターンに対応してプログラムがプリンターヘッドをＸ−方向
の前後に移動させ、最初の細長い片の導電体がシリコンウエハ上に製造される。The substrate used can be a silicon wafer on which conductive silver and an insulating layer are applied at the intersections. First of all, while the silicon wafer moves in the Y-direction corresponding to the printer head, a memorized strip conductor pattern is formed with the material supply nozzle for the conductive silver solution opened. Correspondingly, the program moves the printer head back and forth in the X-direction, producing the first strip of conductors on the silicon wafer.
【００１４】
このプロセスにおいて、導電性の銀溶液は、インクジェットのプリントプロセ
スに対応して、微細な小滴となって（画素毎に）シリコンウエハ上に吹き付けら
れ、そして、それは溶液が蒸発するにつれて乾燥し、固体即ち電気的に導電性で
且つ細長い片の形状の薄層として基板上に残存する。次いで、プリセットされた
交差する位置にプログラムがプリンターヘッドを導き、そして、液状のコーティ
ングフィルムのための材料供給ノズルがプリセットされた領域で開口する。In this process, the conductive silver solution is sprayed (pixel by pixel) onto a silicon wafer in fine droplets, which corresponds to the inkjet printing process, and as the solution evaporates. It dries and remains on the substrate as a thin layer in the form of a solid or electrically conductive and strip. Then, the program guides the printer head to the preset intersecting position, and the material supply nozzle for the liquid coating film opens at the preset area.
【００１５】
吹き付けられた液状のコーティングフィルムもまた乾燥し、強固に付着した絶
縁層を最初の細長い片の導電体上に形成する。それから、第２の細長い片の導電
体が、記憶されたパターンに従って製造される。このように、最初の細長い片の
導電体が絶縁層によって電気的に絶縁された状態で、三つの重ね合わされた層が
交差点において形成される。The sprayed liquid coating film is also dried, forming a firmly attached insulating layer on the conductor of the first strip. Then, a second strip of electrical conductor is manufactured according to the stored pattern. Thus, three superposed layers are formed at the intersections, with the conductors of the first strip electrically insulated by the insulating layers.
【００１６】
当然ながら、本発明は、上記単純な実施例に限定されるものではない。それど
ころか、インクジェットプリントの原理を作動させることに基づいたこのプロセ
スを使用することによって、厚みの異なる多数の重ね合わされた層を備え、より
高い温度で流動できる多様な材料又は様々な物質の混合物からなる最も複雑な薄
層構造物を基板に塗布することもできる。Naturally, the invention is not limited to the simple embodiments described above. On the contrary, by using this process, which is based on operating the principle of inkjet printing, it is possible to have a large number of superposed layers of different thickness, consisting of various materials or mixtures of various substances that can flow at higher temperatures. The most complex thin layer structures can also be applied to the substrate.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 ゼムラー ヴォルハルト ドイツ連邦共和国 13467 ベルリン ヤ ーンストラーセ 17 Ｆターム(参考） 5E343 AA02 AA11 AA22 BB25 BB72 DD15 DD18 FF05 GG06 GG08 GG11 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Zemler Volhard Federal Republic of Germany 13467 Berlinya Strasse 17 F-term (reference) 5E343 AA02 AA11 AA22 BB25 BB72 DD15 DD18 FF05 GG06 GG08 GG11
Claims (6)
厚さで、基板上に製造する薄層構造物の製造方法であって、熱又は溶剤によって
液化され且つノズルヘッドに連結された貯蔵タンクに貯蔵された出発材料が、単
数又は重ね合わされた層を形成すべく基板表面に供給されるというインクジェッ
トプリントに基づくプロセスであり且つプログラムに制御されたプロセスを使用
することにより、各層をその各目的に適応した幾何的形状で、画素毎に基板に直
接塗布し、物質の適量と、ノズルヘッドの前後の動き及び垂直の対応する基板の
動きによる位置決めとを決定する特定のプログラムによって前記プロセスを制御
することを特徴とする薄層構造物の製造方法。1. A method of manufacturing a thin layer structure, comprising thinly geometrically structured layer (s), optionally with different thicknesses, on a substrate, which is liquefied by heat or solvent and A process based on inkjet printing, in which a starting material stored in a storage tank connected to a nozzle head is supplied to a substrate surface to form a single or superposed layer and using a program controlled process This allows each layer to be applied, pixel-by-pixel, directly to the substrate in a geometric shape adapted to its purpose, to determine the proper amount of material and its positioning by the back and forth movement of the nozzle head and the corresponding movement of the vertical substrate. A method for manufacturing a thin layer structure, comprising controlling the process according to a specific program.
支配下で、薄層の材料を基板に塗布することを特徴とする請求項１による方法。2. Method according to claim 1, characterized in that a thin layer of material is applied to the substrate under an inert gas atmosphere or under the control of a vacuum and / or a characteristic temperature pattern.
それによって、混合材料からなる層を製造することを特徴とする請求項１又は２
による方法。3. Spraying two or more substances simultaneously from different storage tanks,
Thereby, a layer of mixed material is produced.
By the method.
給ヘッドとの移動速度に関連して制御し、そして、このようにして、異なる層の
間で又は一つの同じ層の間で、厚さの変動を発生させることを特徴とする請求項
１乃至３の何れかによる方法。4. A suitable amount of material is controlled in relation to the speed of movement of the substrate and the feed head according to a preset program, and in this way between different layers or of one and the same layer. A method according to any of claims 1 to 3, characterized in that a thickness variation is generated between them.
使用することにより、異なる構造を基板に同時に塗布し又は重ね合わすことを特
徴とする請求項１乃至４の何れかによる方法。5. Method according to claim 1, characterized in that different structures are simultaneously applied or superposed on the substrate by using multiple nozzle heads and connected storage tanks at different positions. .
接触する部品、特に貯蔵タンクとノズルヘッドとが酸、塩基、溶剤又は熱に耐え
る材料からなるインクジエットプリンターによって特徴付けられている装置。6. An apparatus for carrying out the method according to claim 1, wherein the components in contact with the thin layer of material, in particular the storage tank and the nozzle head, are made of acid, base, solvent or heat resistant materials. A device characterized by a jet printer.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19817530.2 | 1998-04-09 | ||
| DE19817530A DE19817530C2 (en) | 1998-04-09 | 1998-04-09 | Process for the production of thin-film structures |
| PCT/DE1999/000958 WO1999053738A1 (en) | 1998-04-09 | 1999-03-25 | Method and device for producing thin-layer structures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003523070A true JP2003523070A (en) | 2003-07-29 |
Family
ID=7865161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000544168A Pending JP2003523070A (en) | 1998-04-09 | 1999-03-25 | Method and apparatus for manufacturing thin-layer structure |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP2003523070A (en) |
| AT (1) | ATE216554T1 (en) |
| DE (2) | DE19817530C2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286881A (en) * | 2005-03-31 | 2006-10-19 | Fujitsu Component Ltd | Wire forming method for panel type input unit |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITUD20010220A1 (en) | 2001-12-27 | 2003-06-27 | New System Srl | SYSTEM FOR THE REALIZATION OF A LAYERING OF ELECTRONICALLY INTERACTIVE MATERIAL |
| DE102016202551A1 (en) * | 2016-02-18 | 2017-09-07 | Krones Ag | Method, printhead and machine for printing on a container |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3047884A1 (en) * | 1980-12-18 | 1982-07-15 | Siemens AG, 1000 Berlin und 8000 München | Printed circuit mfg. process - using ink jet printer for applying metal coating, lacquer or etching fluid to allow high prodn. rate |
| DE3805841A1 (en) * | 1988-02-22 | 1989-08-31 | Siemens Ag | METHOD FOR EQUIPPING COMPONENT CARRIERS WITH COMPONENTS IN SURFACE MOUNTING TECHNOLOGY |
-
1998
- 1998-04-09 DE DE19817530A patent/DE19817530C2/en not_active Expired - Fee Related
-
1999
- 1999-03-25 JP JP2000544168A patent/JP2003523070A/en active Pending
- 1999-03-25 AT AT99924725T patent/ATE216554T1/en not_active IP Right Cessation
- 1999-03-25 DE DE59901261T patent/DE59901261D1/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006286881A (en) * | 2005-03-31 | 2006-10-19 | Fujitsu Component Ltd | Wire forming method for panel type input unit |
| JP4663373B2 (en) * | 2005-03-31 | 2011-04-06 | 富士通コンポーネント株式会社 | Method for forming conductive wire of panel type input device |
Also Published As
| Publication number | Publication date |
|---|---|
| DE59901261D1 (en) | 2002-05-23 |
| DE19817530C2 (en) | 2002-10-24 |
| ATE216554T1 (en) | 2002-05-15 |
| DE19817530A1 (en) | 1999-10-14 |
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