JP2003506873A5 - - Google Patents
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- Publication number
- JP2003506873A5 JP2003506873A5 JP2001514483A JP2001514483A JP2003506873A5 JP 2003506873 A5 JP2003506873 A5 JP 2003506873A5 JP 2001514483 A JP2001514483 A JP 2001514483A JP 2001514483 A JP2001514483 A JP 2001514483A JP 2003506873 A5 JP2003506873 A5 JP 2003506873A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US36485599A | 1999-07-30 | 1999-07-30 | |
| US09/364,788 US7435108B1 (en) | 1999-07-30 | 1999-07-30 | Variable width resilient conductive contact structures |
| US09/364,855 | 1999-07-30 | ||
| US09/364,788 | 1999-07-30 | ||
| PCT/US2000/020530 WO2001009952A2 (fr) | 1999-07-30 | 2000-07-28 | Ensembles d'interconnexion et procedes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003506873A JP2003506873A (ja) | 2003-02-18 |
| JP2003506873A5 true JP2003506873A5 (fr) | 2007-09-13 |
Family
ID=27002648
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001514483A Pending JP2003506873A (ja) | 1999-07-30 | 2000-07-28 | 相互接続アセンブリ及び方法 |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP1208595A2 (fr) |
| JP (1) | JP2003506873A (fr) |
| KR (2) | KR100733525B1 (fr) |
| AU (1) | AU6385600A (fr) |
| TW (1) | TW518916B (fr) |
| WO (1) | WO2001009952A2 (fr) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7126220B2 (en) | 2002-03-18 | 2006-10-24 | Nanonexus, Inc. | Miniaturized contact spring |
| US6780001B2 (en) * | 1999-07-30 | 2004-08-24 | Formfactor, Inc. | Forming tool for forming a contoured microelectronic spring mold |
| US7189077B1 (en) | 1999-07-30 | 2007-03-13 | Formfactor, Inc. | Lithographic type microelectronic spring structures with improved contours |
| US6888362B2 (en) | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
| US6939474B2 (en) * | 1999-07-30 | 2005-09-06 | Formfactor, Inc. | Method for forming microelectronic spring structures on a substrate |
| US6627980B2 (en) | 2001-04-12 | 2003-09-30 | Formfactor, Inc. | Stacked semiconductor device assembly with microelectronic spring contacts |
| DE10143790B4 (de) * | 2001-09-06 | 2007-08-02 | Infineon Technologies Ag | Elektronisches Bauteil mit wenigstens einem Halbleiterchip |
| US7010854B2 (en) | 2002-04-10 | 2006-03-14 | Formfactor, Inc. | Re-assembly process for MEMS structures |
| DE102008001038B4 (de) * | 2008-04-08 | 2016-08-11 | Robert Bosch Gmbh | Mikromechanisches Bauelement mit Schrägstruktur und entsprechendes Herstellungsverfahren |
| US10281648B2 (en) * | 2013-07-30 | 2019-05-07 | President And Fellows Of Harvard College | Device support structures from bulk substrates |
| KR102655504B1 (ko) | 2022-06-10 | 2024-04-11 | 영진전자산업 주식회사 | 스핀들 미세조정장치를 구비한 pcb 챔퍼링 장치 |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4423401A (en) * | 1982-07-21 | 1983-12-27 | Tektronix, Inc. | Thin-film electrothermal device |
| US5152695A (en) | 1991-10-10 | 1992-10-06 | Amp Incorporated | Surface mount electrical connector |
| JPH05259584A (ja) * | 1992-01-14 | 1993-10-08 | Internatl Business Mach Corp <Ibm> | 集積光デフレクタおよびその製造方法 |
| JPH06213929A (ja) * | 1993-01-19 | 1994-08-05 | Sharp Corp | 検査装置のプローブヘッドの製造方法および検査装置のプローブヘッド |
| JPH06260383A (ja) * | 1993-03-03 | 1994-09-16 | Nikon Corp | 露光方法 |
| US5915170A (en) * | 1994-09-20 | 1999-06-22 | Tessera, Inc. | Multiple part compliant interface for packaging of a semiconductor chip and method therefor |
| JPH08306708A (ja) * | 1995-05-09 | 1996-11-22 | Sanyo Electric Co Ltd | 半導体装置およびその製造方法 |
| CN1151009C (zh) * | 1995-05-26 | 2004-05-26 | 福姆法克特公司 | 利用牺牲基片制作互连件和接点 |
| US5613861A (en) * | 1995-06-07 | 1997-03-25 | Xerox Corporation | Photolithographically patterned spring contact |
| JP3611637B2 (ja) * | 1995-07-07 | 2005-01-19 | ヒューレット・パッカード・カンパニー | 回路部材の電気接続構造 |
| JP3294084B2 (ja) * | 1995-10-31 | 2002-06-17 | 沖電気工業株式会社 | 素子の実装構造及びその実装方法 |
| JP3022312B2 (ja) | 1996-04-15 | 2000-03-21 | 日本電気株式会社 | プローブカードの製造方法 |
| JP3759622B2 (ja) * | 1996-05-17 | 2006-03-29 | フォームファクター，インコーポレイテッド | 超小型電子接触構造及びその製造方法 |
| JPH10303345A (ja) * | 1997-04-28 | 1998-11-13 | Shinko Electric Ind Co Ltd | 半導体チップの基板への実装構造 |
| JP3378259B2 (ja) * | 1997-05-15 | 2003-02-17 | フォームファクター，インコーポレイテッド | 接触構造体の作成方法 |
| US5944537A (en) * | 1997-12-15 | 1999-08-31 | Xerox Corporation | Photolithographically patterned spring contact and apparatus and methods for electrically contacting devices |
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2000
- 2000-07-28 JP JP2001514483A patent/JP2003506873A/ja active Pending
- 2000-07-28 EP EP00950811A patent/EP1208595A2/fr not_active Withdrawn
- 2000-07-28 WO PCT/US2000/020530 patent/WO2001009952A2/fr active Application Filing
- 2000-07-28 KR KR1020027001207A patent/KR100733525B1/ko not_active IP Right Cessation
- 2000-07-28 AU AU63856/00A patent/AU6385600A/en not_active Abandoned
- 2000-07-28 KR KR1020077003992A patent/KR100807426B1/ko not_active IP Right Cessation
- 2000-08-18 TW TW089115236A patent/TW518916B/zh not_active IP Right Cessation