JP2003505880A - Substrate and workpiece support for receiving substrate - Google Patents

Abstract

SUMMARY OF THE INVENTION The present invention is a workpiece support for receiving a substrate during processing of a substrate, particularly a thin film substrate, wherein the workpiece support includes a receiving portion for positioning and receiving the substrate. About things. According to the invention, the workpiece support has a base element (28) for receiving the substrate (12), which base element (28) is arranged on the operating element (30). The base element (28) can be assigned a process-related cover element (50) on the side opposite the operating element (30). Also, the substrate (12) and the workpiece support each have at least one complementary positioning element (29, 31), which determines the relative spatial position of the substrate (12). Used for fixing (positioning unit).

Description

Detailed Description of the Invention

The invention relates to a workpiece support for receiving a substrate, in particular a thin film substrate, having the features described in the preamble of claim 1, and a substrate having the features described in the preamble of claim 20. Regarding

Prior Art In order to manufacture sensor elements, in particular high-pressure sensor elements, high-grade steel with a shaped diaphragm is generally used. Different functional layers are applied to this diaphragm by thin-wrapping technology. Such functional layers have, for example, insulated layers, sensitive resistive layers, conductive layers from which the conductor tracks or contacts can be structured or passivated. Can be provided.

In order to mass-produce the sensor elements provided as individual substrates, it is advantageous in terms of cost to process them in groups. For this reason, ideas already exist to meet the different requirements of the particular individual processes in thin film manufacturing. In this case, the substrate is generally arranged in a receptacle on a workpiece support, which workpiece support is used in particular for positioning the substrate during each process step.

On the one hand, it is known to bring the substrate into a solid and very sturdy work support at the beginning of the thin film production and to remain in this solid work support during the whole thin film production. The disadvantage here is that the workpiece support has a heavy weight and a large structural height, which makes the individual process steps difficult. Moreover, such a structure requires troublesome screw tightening work. Moreover, mass production is difficult because the medium stagnates particularly when treated with a liquid medium.

On the other hand, it is known to use for each process stage of thin-film production a cultivated crop support tailored to each individual treatment type. Then, between each process step, the respective substrate is received in the workpiece support and can be taken out again after the end of the process step. This has the disadvantages that the assembly and operation costs are high, and that substrate positioning errors occur due to the number of possible process steps, and thus the amount of waste is large, so that mass production is not possible.

Advantages of the invention The invention has been solved by a substrate and a workpiece support for receiving a substrate, in particular a thin film substrate, having the features of claims 1 and 10. A workpiece support has a base element for receiving a substrate, which base element is arranged on an operating element, the cover being associated with the base element on the side opposite the operating element. By being able to assign the elements, cost-effective mass production of the sensor elements is possible. The substrate has at least one complementary positioning element for the substrate and the workpiece support, which positioning element is used to fix the relative spatial position of the substrate (positioning unit). Is characterized by. The positioning unit prevents the substrate from rotating radially or sliding axially during thin film production in the base element, thereby reducing the number of waste products based on production, especially in the automation of thin film production. Decrease. Furthermore, the substrate has, for example, a groove or notch arranged in the side wall of the substrate, the base element having a complementary projection, which projection is provided when the substrate is inserted into the base element. Engage with this groove.

According to an advantageous embodiment of the invention, the base element has a separate support element, to which the substrate is supported at the abutment surface. For example, this abutment surface is formed by the lower edge of the collar surrounding the substrate. In this case, the support element projects into the receiving opening of the base element. This positions the substrate such that at least one opening extends between the edge of the receiving opening of the base element and the lateral wall of the substrate. In this way, sufficient permeability is obtained for the liquid medium used in a given process step and stagnation of the medium is effectively avoided.

Furthermore, it is advantageous if the operating element and the cover element are assigned means for positioning them relative to one another. For example, the means may include guide pins, rotary fasteners, expansion pins or mechanical stops. In this way, a very precise positioning of the cover element on the operating element is ensured.

Furthermore, means for coding the operating element and / or the cover element can be assigned, for example by providing notches, bar codes or holes on the surface of the operating element. This overall makes it possible to automate the process very reliably in thin film production, which makes it suitable for mass production.

In a preferred embodiment of the invention, the cover element is such that the individual mounting elements abut the mounting surface of the substrate, for example the upper edge of the collar surrounding the substrate. In this case, the cover element has a process area, which makes it possible to selectively treat the surface of the substrate (mask; Mask). For this purpose, especially when treating with a liquid medium, the cover element is such that the process area is located above the opening between the base element and the substrate, so that a high permeability for the liquid medium is obtained. Is positioned.

By means of deposition, plasma etching, photolithography or similar means
It is advantageous if the cover element abuts the peripheral edge of the substrate surface during the treatment of the substrate surface. This allows more precise positioning on the one hand and media stagnant on the other hand.

[0012]   Drawing   The present invention will be specifically described below with reference to the embodiments shown in the drawings.

FIG. 1 is a cross-sectional view of a sensor element having different functional layers on a substrate, FIG. 2 is a view of a substrate for manufacturing a thin film in different directions, and FIG. 3 receives the substrate. 4 is a plan view of a base element for the purpose of carrying out, FIG. 4 is a plan view of a manipulating element with a number of base elements, FIG. FIG. 6 shows a cross-section and a plan view of the body, FIG. 6 shows a cross-section and a plan view of the substrate and the workpiece support in the region of the base element during the treatment of the substrate surface by deposition, plasma etching or similar treatment 7 is a sectional view of the workpiece and the substrate during deposition of the contact portion and immobilization of the substrate surface by the shadow mask technique, and FIG. 8 is a workbench for receiving the workpiece support. It is a perspective view.

FIG. 9 is a perspective view of a workbench for receiving a workpiece support during automated thin film manufacturing.

DESCRIPTION OF THE EMBODIMENTS In FIG. 1, a cross-sectional view of a sensor element 10 is shown, on which different functional layers are deposited on a substrate 12 according to known thin-film technology. To be done. A functional layer of this type has a sensitive layer 14, a contact 16, a passivation layer 18 and an insulating layer 20. This insulating layer 20 is arranged on the substrate surface 22. In this case, without limiting the functionality of the sensor element 10,
Additional shape features can be provided in the substrate 12. Thus, for example, a flange 24 surrounding the substrate 12 can be provided. This flange 24 aids thin film technology.

FIG. 2 shows views of the substrate 12 viewed from different directions. The radial structure of the substrate 12 is interrupted in the region of the grooves 26 milled in the side wall 27. The groove 27 is used as a positioning element 29 in a manner which will be described in more detail.

Each substrate 12 is located in a respective base element 28 during the entire manufacturing process of the sensor element 10, which base element 28 is also a component of the operating element 30. A plan view of such an operating element 30 is shown in FIG. 4, and a plan view of each base element 38 of the operating element 30 is shown in FIG.

According to FIG. 3, the abutment surface 32 of the substrate 12 is positioned on each support element 34 of the base element 28. In this case, the base element 28 has a receiving opening 36.
The support element 34 projects into the receiving opening 36. The abutment surface 32 is formed by the lower edge 38 of the collar 24, according to this embodiment. As shown in the plan view of FIG. 3, a number of openings 40 extend between the edge 42 of the base element 28 and the substrate 12. Through these openings 40,
In some cases, the liquid medium used during thin film fabrication for treating or cleaning the sensor surface 22 is drained.

Furthermore, the base element 28 has a rectangular projection 44 as a complementary positioning element 31, which projection 44 likewise projects into the receiving opening 36. The substrate 12 has a form such that the protrusions 44 engage in the grooves 26 during thin film fabrication.
It is placed in the receiving opening 36 of the base element 28. Substrate 1 in this form
The relative position of the two is fixed so that the two positioning elements 29, 3
1 is used as a positioning unit. Of course, the positioning unit can optionally meet the geometrical requirements for the substrate 12 in various ways.

The operating element 30 may be provided with a number of base elements 28 arranged in accordance with a predetermined size. In this case, the base elements 28, which have a hexagonal basic structure according to an embodiment of the invention, have a particularly close arrangement. Furthermore, the operating element 30 has openings 46, 48 which position the operating element 30 and the cover element 50 (described in more detail below) during the individual process steps. And / or enables positioning of the workpiece support (operating element 30 and cover element 50) on the workbench 80 in the manner described in more detail below. Thus, the aperture 46 can receive, for example, a rotary fastener, while the aperture 48 is used to receive a guide pin, a divergence pin, or the like.

Furthermore, the operating element 30 and / or the cover element 50 can be assigned means for coding for automating the thin film production. Thus, for example, the holes 52 on the surface 54 of the operating element 30 provide a description of a process step or the like. A suitable sensor detects the relative position of the operating element 30 via the cutout 56.

During the entire thin film manufacturing stage, the substrate 12 is fixed to the base element 28 as described above. Then, at each process stage, a process-based cover element 50
Are installed on the substrate 12. For this purpose, the base plate 12 has a mounting surface 58 at the upper edge 60 of the collar 24, so that the cover element 50 is fitted with a corresponding mounting element 62 (
2 and 5).

A cover element 50 is shown in FIG. 5 and is used in a conventional manner when treating the substrate surface 22 with a liquid medium. The operation of wetting the substrate 12 with the liquid medium is performed in the process area 64. This process area 64 is formed by a cutout in the area of the cover element 50.
In this way, the substrate surface 2 is provided with a suitable shape of the process area 64, for example by covering a partial area of the substrate surface 22 with the cover element 50.
Two selective treatments are possible. According to the illustrated embodiment, the process area 64 is
It is also chosen to extend through the opening 40 between the base element 28 and the substrate 12. Thus, the liquid medium is drained or washed through the openings 40 during or after the process stage, and the medium stagnation (Mediumver) is reached.
schlepung) is significantly reduced.

If the process step involves treating the substrate surface 22 by deposition, plasma etching, photolithography or similar operations, the cover element 50 is matched accordingly (FIG. 6). To this end, the cover element 50 has the sealing edge 68 located flush with the peripheral edge 66 of the substrate 12 so that only the substrate surface 22 is processed during processing steps. To be done. A very precise positioning of the substrate 12 is carried out by means of the introduction bevels 69 and the cover element 50
The substrate 12 slides along the introduction slope during the mounting work.

In the side view shown in FIG. 7, the arrangement of the individual components of the workpiece support is illustrated during the work of depositing the conductor tracks or during the work of immobilizing the substrate surface 22. In this case, the cover element 50 includes the positioning metal thin plate 70, the pressing metal thin plate 72, and these two.
It comprises a shadow mask 74 arranged between two metal sheets 70 and 72. The substrate 12 is loaded under the base element 28 with a predetermined force via another pressing metal leaf 76 and a metal leaf spring 78, so that the substrate surface 22 hits the shadow mask 74 flat during the process stage. Contact.

As shown by way of example in FIGS. 5 to 7, during thin film production of the sensor element 10, the substrate 12 is always located in the base element 28 and only the cover element 50 is replaced. In some cases (FIG. 7), the base element 28 may additionally be provided with components for assisting the process steps, such as pressing metal leafs 76 and leaf springs 78.

During the entire manufacturing process, the workpiece support can be fixed in its position. As mentioned above, means such as guide pins, rotary fasteners, expansion pins or mechanical stoppers are suitable for this. To this end, the workpiece support is fixed on a workbench 80, as shown in a side perspective view in FIG. To this end, the workbench 80 also has guide pins 82 for positioning elements, receiving openings,
The surface 88 has a spacer holder 86. Furthermore, it is advantageous if the outflow opening 90 for the flowing medium is integrated in the workbench 80.

FIG. 9 schematically illustrates how this type of thin film production is performed by a robot 92.
Is illustrated as being automated by. The robot arm 94 removes the cover element 50 from one of the magazines 96 and positions it on the operating element 30 arranged on the workbench 30, depending on the process step being performed. Via suitable sensors, for example holes 52 and operating elements 30.
Notches 56 can be used to define the relative position and process steps being performed. After the end of the process step, the cover element 50 is again placed in the magazine 96 and the next process step is carried out subsequently.

[Brief description of drawings]

[Figure 1]   FIG. 4 is a cross-sectional view of a sensor element provided with various functional layers on a substrate.

[Fig. 2]   It is the figure which looked at the board | substrate for manufacturing a thin film in a different direction.

[Figure 3]   FIG. 7 is a plan view of a base element for receiving a substrate.

[Figure 4]   It is a plan view of an operating element with a number of base elements.

FIG. 5 is a cross-sectional view and a plan view of the substrate and workpiece support in the region of the base element during the treatment of the substrate surface with the liquid medium.

FIG. 6 is a cross-sectional view and a plan view of the substrate and workpiece support in the region of the base element during treating the substrate surface by deposition, plasma etching or similar treatment.

FIG. 7 is a cross-sectional view of the workpiece and substrate during deposition of contacts and immobilization of the substrate surface by shadow mask technology.

[Figure 8]   FIG. 7 is a perspective view of a workbench for receiving a work piece support.

FIG. 9 is a schematic view of a workbench for receiving a workpiece support during automated thin film manufacturing.

[Procedure for Amendment] Submission for translation of Article 34 Amendment of Patent Cooperation Treaty

[Submission date] September 7, 2001 (2001.9.7)

[Procedure Amendment 1]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 1

[Correction method] Change

[Contents of correction]

[Procedure Amendment 2]

[Document name to be amended] Statement

[Name of item to be corrected] Claim 20

[Correction method] Change

[Contents of correction]

─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Harald Vanka             Germany, Reutlingenbull             Knucker Strasse 17/3 (72) Inventor Andre Kletschmann             Germany, Reutlingen-Gru             Obachstrasse 60 (72) Inventor Ralf Heng             Federal Republic of Germany             Janeicherstraße 23 (72) Inventor Volker Wingsch             Germany, Reutlingen Mol             Tokestrasse 53 (72) Inventor Joachim Grueck             Federal Republic of Germany Renningen             Bühlstraße 53 (72) Inventor Armin Sharping             Germany Metzingen Hin             Denburg Strasse 8 F term (reference) 5F031 CA20 DA20 FA05 FA07 FA11                       GA43 GA47 HA80 KA20 MA26                       MA27 MA32

Claims (21)

[Claims] 1. A workpiece support for receiving a substrate during processing of a substrate, particularly a thin film substrate, of the type having a receptacle for positioning and receiving the substrate. The support has a base element (28) for receiving the substrate (12), which base element (28) is arranged on the operating element (30), the base element (28) comprising: Workpiece support for receiving a substrate, characterized in that a cover element (50) associated with the process can be assigned on the side opposite to the operating element (30). 2. The base element (28) is a separate support element (34).
And the substrate (12) has an abutting surface (32), and the corresponding abutting surface (32)
3. Workpiece support according to claim 2, in which the support element (34) abuts. 3. A collar (24), the abutment surface (32) of which surrounds the substrate (12).
A workpiece support according to claim 3, wherein the workpiece support is formed by the lower edge (38). 4. Workpiece support according to claim 2, wherein the support element (34) projects into the receiving opening (36) of the base element (28). 5. The substrate (12) has a receiving opening (3) for the base element (28).
Support element () of the base element (28) such that at least one opening (40) extends between the edge (42) of 6) and the side wall (27) of the substrate (12).
34) The work piece support according to claim 4, which is positioned on. 6. Workpiece support according to claim 5, wherein the receiving opening (36) of the base element (28) has a hexagonal structure. 7. The base element (28) and the substrate (12) each have at least one complementary positioning element (29, 31), which positioning element (29, 31) comprises a substrate (12). Workpiece carrier according to any one of claims 1 to 6, which is used for fixing the relative spatial position of () (positioning unit). 8. The substrate (12) has a groove (26), said groove (26) being arranged in a side wall (27) of the substrate (12), the base element (28) being A workpiece support according to claim 7, having complementary projections (44). 9. A collar (24) in which the groove (66) surrounds the substrate (12).
Abutment against the lower edge (38) of the base element (28) with complementary protrusions (44)
9. The workpiece support according to claim 8, which projects into the receiving opening (36) of the workpiece. 10. The operating element (30) and the cover element (50) are provided with means for positioning them relative to one another.
The work support according to any one of items 1 to 7. 11. The positioning means includes guide pins, rotary fasteners,
11. The workpiece support of claim 10, which has a spreading pin or a mechanical stop. 12. Operating element (30) and / or cover element (5).
Workpiece support according to any one of claims 1 to 11, wherein means (0) are arranged for coding. 13. The operating means (30) comprises means for encoding.
13. A workpiece support according to claim 12, having a notch, a bar code (56) or a hole (52) in the surface (54) of the. 14. Covering element (50) is a separate mounting element (62).
), The substrate (12) has a mounting surface (58), and the mounting surface (58)
Workpiece carrier according to any one of claims 1 to 13, wherein the mounting element (68) is in contact with the). 15. The mounting surface (58) comprises a collar () surrounding the substrate (12).
15. Workpiece support according to claim 14, formed by the upper edge (60) of the 24). 16. The cover element (50) according to claim 1, wherein the cover element (50) has a process area (64) allowing selective treatment of the substrate surface (22) (mask). The work support according to item. 17. The process area (64) of the cover element (50) is located above the opening (40) between the base element (28) and the substrate (12) when treated with a liquid medium. 17. The workpiece support of claim 16, wherein the workpiece support is positioned as follows. 18. The workpiece support according to claim 17, wherein the process area (64) of the cover element (50) has a hexagonal structure. 19. The process area (64) of the cover element (50) deposits, plasma etches, photolithographically, immobilizes or the like in processing the substrate surface (22) of the substrate (12). 17. The workpiece support according to claim 16, wherein the treatment is positioned on the substrate (12) such that the cover element (50) abuts the peripheral edge (66) of the substrate surface (54). . 20. In a substrate which is arranged in a receptacle of a workpiece support during processing of a substrate, in particular a thin film substrate, the substrate (12) and the workpiece support each have at least one complementary positioning element (29, 31) and the positioning element comprises a substrate (12)
A) (positioning unit) for fixing the relative spatial position of the substrate. 21. The substrate (12) has grooves (26) or notches,
The substrate according to claim 20.