JP2003348402A - Camera and imaging element unit used for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a camera using an imaging element unit provided with an exciting member with a simple configuration capable of obtaining a stronger exciting force. <P>SOLUTION: The imaging element unit includes: an imaging element 27 for obtaining an image signal; an imaging lens 12a for making an object image incident on a photoelectric conversion face of the imaging element; a dust-proof member 21 having a transparent part capable of transmitting a valid luminous flux made incident on the imaging element from the imaging lens, the transparent part being opposed to the front side of the imaging element at a prescribed interval; an exciting member 22 placed at a circumferential edge of the dust-proof member and providing vibration to the dust-proof member; a sealing structure part configured to seal a space part by the circumferential edge of the imaging element and the dust-proof member to configure the space nearly enclosed at a part formed by making both the imaging element and the dust-proof member oppose to each other; and an image signal processing circuit 16a for converting an image signal obtained from the imaging element into a signal of a form appropriate to recording in order to correspond to the image formed on the photoelectric conversion face of the imaging element, and the exciting member is configured with a multi-layer structure. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a camera provided with an image sensor unit having an image sensor for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface, and more particularly, to a dustproof device for the image sensor. The present invention relates to a camera having a structure and an image sensor unit used for the camera.

[0002]

2. Description of the Related Art In recent years, a solid-state image sensor or the like in which a subject image formed on the basis of a light beam (hereinafter referred to as a subject light beam) from a subject transmitted through a photographing optical system (a photographing lens) is disposed at a predetermined position. Coupling device (CCD; Charge C
oupled Device. An image is formed on a photoelectric conversion surface such as an image sensor, and an electrical image signal or the like representing a desired subject image is generated using the photoelectric conversion action of the image sensor or the like. Is output to a predetermined display device such as a liquid crystal display (LCD) to display an image or the like, or an image signal or the like generated by an image sensor or the like is converted into a predetermined image. The data is recorded in a predetermined recording area of a predetermined recording medium as data, and the image data recorded on the recording medium is read out. The image data becomes an optimal image signal to be displayed on a display device. After the conversion process,
A digital camera such as a so-called digital still camera or digital video camera (hereinafter referred to as a digital camera or simply a camera) configured to display an image corresponding to the processed image signal based on the processed image signal is generally used. It has been put to practical use and is widely used.

Further, a general digital camera is provided with an optical finder device for the purpose of observing a desired subject to be photographed prior to a photographing operation and setting a photographing range including the subject. Generally.

In this optical viewfinder device, a traveling direction of a subject light beam transmitted through a photographing optical system is bent by using a reflecting member or the like disposed on an optical axis of the photographing optical system so that a subject image for observation is positioned at a predetermined position. On the other hand, during the photographing operation, the reflecting member is retracted from the optical axis of the photographing optical system, thereby guiding the subject light beam to the light receiving surface of the image sensor, that is, the photoelectric conversion surface, and photographing on the photoelectric conversion surface. In general, a so-called single-lens reflex type finder device configured to form a subject image for use is generally used.

In recent years, a finder device of a single-lens reflex type is provided, and a photographing optical system is configured to be detachable from a camera body.
A so-called lens-replaceable lens, which is configured so that a plurality of types of photographing optical systems can be selectively used in a single camera body by arbitrarily attaching and detaching and replacing a desired photographing optical system when a user desires. Digital cameras of the form are generally being put to practical use.

In such a lens-replaceable digital camera, when the photographic optical system is detached from the camera body, dust or the like floating in the air may enter the inside of the camera body. Also, since various mechanisms that operate mechanically, such as a shutter and an aperture mechanism, are provided inside the camera body, when various kinds of mechanisms generate dust or the like during the operation, There is also.

On the other hand, when the photographing optical system is detached from the camera body, the light receiving surface (also referred to as a photoelectric conversion surface) of the imaging device disposed behind the photographing optical system is exposed to the outside air inside the camera. Therefore, dust and the like may adhere to the photoelectric conversion surface of the image sensor due to factors such as charging.

Therefore, in a conventional single-lens reflex digital camera or the like, a technique for suppressing dust or the like from adhering to a light receiving surface of an image sensor due to a charging action or the like is disclosed in, for example, Japanese Patent Laid-Open No. 2000-2000. -29132 and the like.

Means disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2000-29132 is a method for a single-lens reflex digital camera in which a lens is exchangeable, the surface of a cover member for covering a light receiving surface of an image sensor provided inside the camera. Is provided with a transparent electrode, and a DC voltage or an AC voltage having a frequency of about several kHz to 20 kHz is applied to the electrode so that dust or the like is prevented from adhering to the light receiving surface of the imaging device due to a charging action. It was made.

According to the means disclosed in the publication,
By neutralizing the charge generated in the image sensor, it is possible to suppress the attachment of dust and the like to the light receiving surface of the image sensor due to static electricity and the like.

On the other hand, as an image sensor in a conventional digital camera, an image sensor of a so-called package type (for example, a package CCD) is widely used. In recent years, it has been proposed to supply bare CCD chips called so-called bare chip CCDs to the market.

In such a bare chip CCD,
Since there is a high possibility that dust and the like adhere to the photoelectric conversion surface, a piezoelectric element is provided between the bare chip CCD and the substrate on which the CCD is mounted, and a predetermined voltage is applied to the piezoelectric element. For example, Japanese Unexamined Patent Publication No. Hei 9-130654 discloses a means for causing the bare chip CCD itself to vibrate, thereby shaking off dust and the like adhering to the photoelectric conversion surface.

[0013]

However, in the means disclosed in Japanese Patent Application Laid-Open No. 2000-29132, the charge of the charged imaging element is neutralized to suppress the attachment of dust and the like. Therefore, it is considered that a means for simply removing dust or the like that has simply adhered or accumulated on the photoelectric conversion surface of the image sensor without being affected by static electricity is not optimal.

The means disclosed in the above-mentioned Japanese Patent Application Laid-Open No. Hei 9-130654 is designed with the bare chip CCD in mind, and is generally used in conventional digital cameras. It cannot be said that this is an optimal means to apply to an image pickup device having a form such as a packaged CCD.

That is, a packaged CCD of a general form
In the case where the means disclosed in Japanese Patent Application Laid-Open No. Hei 9-130654 is applied to, for example, vibration is applied to the image pickup device itself or its package, the image pickup is performed by this vibrating action. For example, there is a possibility that adverse effects such as mechanical deterioration and deviation may be exerted on the element and various mechanisms disposed in the vicinity thereof.

On the other hand, the present applicant has previously filed Japanese Patent Application No. 2000-4.
In No. 01291, by providing a dust-proof member for sealing or protecting the side of the photoelectric conversion surface of the imaging device, dust and the like are prevented from adhering to the photoelectric conversion surface of the imaging device,
With respect to dust and the like adhering to the outer surface side of the dustproof member, a means for removing the dust by applying a vibration of a predetermined amplitude to the dustproof member by a predetermined vibration member has been proposed.

According to this means, it is possible to prevent dust and the like from adhering to the photoelectric conversion surface of the image pickup device by a small and simple mechanism, and to easily and reliably remove dust and the like adhering to the outer surface side of the dustproof member. This makes it possible to form a digital camera having a removable lens interchangeable form.

The present invention has been made in view of the above points, and has as its object to provide a dustproof member for sealing and protecting the photoelectric conversion surface side of an image pickup device,
A camera using an image sensor unit provided with a vibrating member that applies vibration of a predetermined amplitude to the dustproof member, and proposes a configuration of a vibrating member capable of obtaining a stronger vibrating force with a simple configuration. It is another object of the present invention to provide a camera capable of easily and reliably removing dust and the like adhering to the surface of a dustproof member and an image sensor unit used for the camera.

[0019]

In order to achieve the above object, a camera according to a first aspect of the present invention includes an image sensor for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface, and an image sensor for the image sensor. A photographic lens that allows a subject image to be incident on the photoelectric conversion surface, and a transparent portion that can transmit an effective light beam incident on the image sensor from the photographic lens, and the transparent portion is a predetermined portion on the front side of the image sensor. A dust-proof member that is disposed to be opposed at an interval; a vibration-providing member that is disposed at a peripheral portion of the dust-proof member to apply vibration to the dust-proof member; and the imaging element and the dust-proof member that face each other A sealing structure configured to seal the space at a peripheral side of the image sensor and the dustproof member so as to form a substantially sealed space in a portion formed by forming the image sensor; Corresponding to the image formed on the photoelectric conversion surface And an image signal processing circuit for converting an image signal obtained from the image sensor into a signal in a form suitable for recording, wherein the vibration member is configured by a multilayer structure. I do.

According to a second aspect of the present invention, in the camera according to the first aspect, a conductive plate is provided between layers of the vibrating member.

According to a third invention, in the camera according to the first invention or the second invention, the vibrating member alternately includes a piezoelectric element and an electrode for applying a voltage to the piezoelectric element. It is characterized by being laminated.

According to a fourth aspect, in the camera according to the third aspect, the piezoelectric element is a piezoelectric ceramic.

According to a fifth aspect of the present invention, in the camera according to the first aspect, the camera further comprises a photographic lens mounting portion for mounting the photographic lens, and the photographic lens is detachable from the photographic lens mounting portion. There is a feature.

According to a sixth aspect of the present invention, in the camera according to the first aspect, the vibrating member is annularly arranged on a peripheral portion of the dustproof member.

An image sensor unit according to a seventh aspect of the present invention is arranged so that an image sensor for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface is opposed to the front surface of the image sensor at a predetermined interval. An optical member to be provided, a vibrating member disposed on a peripheral portion of the optical member for applying vibration to the optical member, and a portion where both the image pickup element and the optical member are formed to face each other A sealing structure configured to substantially seal the space at a peripheral side of the image sensor and the optical member so as to form a space, and the vibration member has a multilayer structure. It is characterized by comprising.

According to an eighth invention, in the imaging device unit according to the seventh invention, a conductive plate is provided between layers of the vibrating member.

According to a ninth aspect, in the imaging device unit according to the seventh or eighth aspect, the vibrating member alternately includes a piezoelectric element and an electrode for applying a voltage to the piezoelectric element. It is characterized by being laminated.

According to a tenth aspect, in the imaging device unit according to the ninth aspect, the piezoelectric element is a piezoelectric ceramic.

According to an eleventh aspect of the present invention, in the imaging device unit according to the seventh aspect, the vibrating member is annularly arranged on a periphery of the optical member.

[0030]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. First, a schematic configuration of a camera according to an embodiment of the present invention will be described below.

FIG. 1 and FIG. 2 are diagrams showing a schematic configuration of a camera according to an embodiment of the present invention. FIG. FIG. 2 is a block diagram schematically showing a main electric configuration of the camera.

The camera 1 of the present embodiment comprises a camera body 11 and a lens barrel 12 which are separately provided, and both (11 and 12) are configured to be detachable from each other. is there.

The lens barrel 12 includes a photographing optical system (photographing lens) 12a including a plurality of photographing lenses and a driving mechanism thereof.
Is held inside. This photographing optical system 12
For example, a plurality of optical lenses are used to transmit a light beam from a subject so that an image of the subject formed by the subject light beam is formed at a predetermined position (on a photoelectric conversion surface of an image sensor 27 described later). Etc. The lens barrel 12 is connected to the camera body 11
It is arranged so as to protrude toward the front surface.

The same lens barrel 12 as that generally used in conventional cameras and the like is applied to the lens barrel 12. Therefore, description of the detailed configuration is omitted.

The camera body 11 is provided with various constituent members and the like, and has a photographing optical system (photographing lens).
A so-called single-lens reflex having a photographing optical system mounting portion (photographing lens mounting portion) 11a as a connecting member for detachably mounting the lens barrel 12 holding the lens barrel 12a. Camera.

That is, an exposure opening having a predetermined diameter capable of guiding a subject light beam into the camera main body 11 is formed at a substantially central portion on the front side of the camera main body 11. A photographing optical system mounting portion 11 is provided on the periphery of the opening.
a is formed.

On the outer surface side of the camera body 11, the above-mentioned photographing optical system mounting portion 11a is provided on the front surface thereof, and the camera body 11 is provided at a predetermined position such as an upper surface portion or a rear portion.
Are provided, for example, a release button 17 for generating an instruction signal or the like for starting a photographing operation. Since these operating members are not directly related to the present invention, the release button 17 is used to avoid complication of the drawing.
Illustration and description of other operation members are omitted.

As shown in FIG. 1, a desired subject image formed by various constituent members, for example, the photographing optical system 12a is provided inside the camera body 11 as shown in FIG.
Finder device 13 which is provided so as to be formed at a predetermined position different from the position on the photoelectric conversion surface, and which constitutes a so-called observation optical system, and controls the irradiation time of the subject light beam to the photoelectric conversion surface of the image sensor 27 and the like. A shutter unit 14 having a shutter mechanism and the like; an image sensor 27 that includes the shutter unit 14 and obtains an image signal corresponding to a subject image formed based on a subject light beam transmitted through the photographing optical system 12a; An imaging device unit which is an assembly including a dustproof filter 21 (details of which will be described later), which is a dustproof member disposed at a predetermined position on the front side of the photoelectric conversion surface and which prevents dust and the like from adhering to the photoelectric conversion surface. (Hereinafter abbreviated as imaging unit) 15 and imaging element 2
7, a main circuit board 16 on which various electric members constituting an electric circuit such as an image signal processing circuit 16a (see FIG. 2) for performing various kinds of signal processing on the image signal are mounted. Circuit boards (only the main circuit board 16 is shown in FIG. 1) and the like are provided at predetermined positions.

The finder device 13 includes the photographing optical system 12
a reflecting mirror 13b configured to bend the optical axis of the subject light beam that has passed through a and guide it toward the observation optical system, and a pentaprism that receives the light beam emitted from the reflecting mirror 13b and forms an erect erect image 13a and the pentaprism 1
An eyepiece 13c for forming an image in an optimal form for magnifying and observing the image formed by 3a is formed.

The reflecting mirror 13b is configured to be movable between a position retracted from the optical axis of the photographing optical system 12a and a predetermined position on the optical axis.
On the optical axis 2a, it is arranged at a predetermined angle with respect to the optical axis, for example, at an angle of 45 degrees. This allows
When the camera 1 is in the normal state, the optical axis of the subject light beam transmitted through the imaging optical system 12a is bent by the reflecting mirror 13b to the pentaprism 13a disposed above the reflecting mirror 13b. It is designed to be reflected.

On the other hand, while the camera 1 is performing the photographing operation, and during the actual exposure operation, the reflecting mirror 13b
Moves to a predetermined position retracted from the optical axis of the photographing optical system 12a. As a result, the subject light beam is guided toward the image sensor 27 and irradiates the photoelectric conversion surface.

As the shutter section 14, for example, a shutter mechanism of a focal plane system, a drive circuit for controlling the operation of the shutter mechanism, and the like similar to those generally used in a conventional camera or the like are applied. .
Therefore, description of the detailed configuration is omitted.

As described above, a plurality of circuit boards are arranged inside the camera 1 to constitute various electric circuits. As shown in FIG. 2, the electrical configuration of the camera 1 is suitable for recording based on, for example, a CPU 41 which is a control circuit for totally controlling the camera 1 and an image signal acquired by the image sensor 27. Image signal processing circuit 16a for performing various signal processing such as signal processing for converting into a signal of a form to be processed, and temporarily storing image signals and image data processed by the image signal processing circuit 16a and various information associated therewith. Memory 16b for temporarily recording, a recording medium 43 for recording image data for recording in a predetermined form generated by the image signal processing circuit 16a in a predetermined area, and an electrical connection between the recording medium 43 and the camera 1. A recording medium interface 42 configured to electrically connect a circuit, and a liquid crystal display (LC) for displaying an image.
D) and the like, and the display unit 46 and the camera 1 are electrically connected to each other, and the image signal processing circuit 16a
A display circuit 47 that receives the processed image signal and generates an optimal display image signal to be displayed on the display unit 46; a battery 45 including a secondary battery such as a dry battery;
Upon receiving power from an external power supply (AC) supplied by the battery 45 or a predetermined connection cable or the like (not shown),
A power supply circuit 44 that controls the camera 1 so as to be suitable for operation and distributes power to each electric circuit;
Circuit for driving the dustproof filter 21 included in the dustproof filter drive unit 4 including an oscillator and the like.
8 mag.

Next, details of the imaging unit 15 in the camera 1 of the present embodiment will be described below. Fig. 3.
4 and 5 are views showing a part of the image pickup unit in the camera 1 of the present embodiment, and FIG. 3 is an exploded perspective view of a main part showing the image pickup unit in an exploded manner. FIG. 4 is a perspective view showing a part of the imaging unit in an assembled state, which is cut away. FIG. 5 is a cross-sectional view along the cut surface of FIG.

The imaging unit 15 of the camera 1 according to the present embodiment is a unit constituted by a plurality of members including the shutter section 14 as described above. The illustration of the shutter unit 14 is omitted in the figure. In addition, in order to show the positional relationship between the components, in FIGS. 3 to 5, provided near the imaging unit 15, the imaging element 27 is mounted, and the image signal processing circuit 16 a and the work memory 16 b are provided. FIG. 2 also shows a main circuit board 16 on which an electric circuit of an imaging system composed of an image pickup system is mounted. Note that the details of the main circuit board 16 itself are applied to those generally used in conventional cameras and the like, and description thereof is omitted.

The image pickup unit 15 is composed of a CCD or the like, and transmits an image pickup optical system 12a, and obtains an image signal corresponding to light irradiated on its own photoelectric conversion surface. The image pickup unit 15 fixedly supports the image pickup element 27. An image pickup element fixing plate 28 made of a thin plate-like member, and an optical element arranged on the side of the photoelectric conversion surface of the image pickup element 27 and formed to remove a high-frequency component from a subject light beam transmitted through the imaging optical system 12a and irradiated. An optical low-pass filter (hereinafter, referred to as an optical LPF) 25 which is an element, and a low-pass filter which is disposed at a peripheral portion between the optical LPF 25 and the image sensor 27 and is formed by a substantially frame-shaped elastic member or the like. A filter receiving member 26 and an image pickup device 27 are housed and fixedly held, and the optical LPF 25 is supported in close contact with a peripheral portion thereof or a portion in the vicinity thereof. And an imaging element housing case member 24 (a second member described below; hereinafter, referred to as a CCD case 24) disposed so as to come into close contact with a dust-proof filter receiving member 23 described later, and a front side of the CCD case 24. A dust-proof filter receiving member 23 that is arranged and supports the dust-proof filter 21 (dust-proof member) in close contact with a peripheral portion thereof or a portion in the vicinity thereof; In addition, a dust filter 21 which is a dust-proof member disposed opposite to a predetermined position having a predetermined gap between the optical LPF 25 and the front side of the optical LPF 25, and is disposed annularly around the periphery of the dust filter 21. The dust filter 2
Exciting member 22 for giving predetermined vibration to 1
And the dustproof filter 21 is attached to the dustproof filter receiving member 23.
And a pressing member 20 made of an elastic body which is air-tightly joined to and fixedly held.

The image pickup device 27 receives the subject light beam transmitted through the photographing optical system 12a on its own photoelectric conversion surface and performs a photoelectric conversion process, thereby generating an image signal corresponding to the subject image formed on the photoelectric conversion surface. To get,
For example, a charge coupled device (CCD; Charge Coupled Device)
ce) etc. are applied.

The image pickup device 27 includes an image pickup device fixing plate 28
And is mounted at a predetermined position on the main circuit board 16 via the. As described above, the image signal processing circuit 16a and the work memory 16b are mounted on the main circuit board 16, and the output signal from the image sensor 27, that is, the image signal obtained by the photoelectric conversion Processing circuit 16a
And so on.

The signal processing performed by the image signal processing circuit 16a includes, for example, the photographing optical system mounting section 11a.
The image signal obtained from the image sensor 27 is recorded as corresponding to the image formed on the photoelectric conversion surface of the image sensor 27 by the photographing optical system 12a held inside the lens barrel 12 attached to the lens barrel 12. And various kinds of signal processing, such as processing for converting into a signal of a form conforming to. Such signal processing is the same as the processing normally performed in a general digital camera or the like configured to handle electronic image signals. Therefore, a detailed description of various signal processes performed in the camera 1 will be omitted.

On the front side of the image sensor 27, an optical LPF 25 is disposed with a low-pass filter receiving member 26 interposed therebetween. Then, a CCD case 24 is provided so as to cover this.

That is, the CCD case 24 is provided with a rectangular opening 24c at a substantially central portion, and the optical LPF 25 and the image pickup device 27 are disposed in the opening 24c from the rear side. Has become. This opening 2
As shown in FIGS. 4 and 5, a step portion 24a having a substantially L-shaped cross section is formed on the inner peripheral edge portion on the rear side of 4c.

As described above, the low-pass filter receiving member 26 made of an elastic member or the like is provided between the optical LPF 25 and the image sensor 27. The low-pass filter receiving member 26 is disposed at a position on the front edge of the imaging device 27 that avoids the effective range of the photoelectric conversion surface, and is in contact with the vicinity of the rear edge of the optical LPF 25. I have. The airtightness between the optical LPF 25 and the imaging device 27 is maintained. As a result, the optical LPF 25 receives an elastic force in the optical axis direction by the low-pass filter receiving member 26.

Therefore, the peripheral edge of the front side of the optical LPF 25 is disposed so as to be substantially airtightly contacted with the step portion 24a of the CCD case 24, so that the optical LPF 25 is disposed.
Of the optical LPF 2 against the elastic force of the low-pass filter receiving member 26 for displacing the optical LPF 2 in the optical axis direction.
5 is restricted in the optical axis direction.

In other words, the opening 24 of the CCD case 24
The position of the optical LPF 25 inserted from the back side into the inside of c is regulated in the optical axis direction by the step portion 24a. Thus, the optical LPF 25 is prevented from falling out from the inside of the CCD case 24 toward the front side.

After the optical LPF 25 is inserted into the opening 24c of the CCD case 24 from the rear side as described above, the image sensor 27 is disposed on the rear side of the optical LPF 25. In this case, the optical LP
A low-pass filter receiving member 26 is sandwiched between the F25 and the imaging element 27 at the peripheral edge.

The image sensor 27 is mounted on the main circuit board 16 with the image sensor fixing plate 28 interposed therebetween as described above. The image sensor fixing plate 28 is connected to the CCD case 2.
4 is fixed to the screw hole 24e from the back side by a screw 28b via a spacer 28a. The main circuit board 16 is provided on the image sensor fixing plate 28 with a spacer 16c.
And is fixed by a screw 16d.

On the front side of the CCD case 24, a dust-proof filter receiving member 23 is provided with a screw hole 24b of the CCD case 24.
Are fixed by screws 23b. In this case, a peripheral groove 24d is formed in a substantially annular shape at a predetermined position on the peripheral side and the front side of the CCD case 24, as shown in detail in FIGS. On the other hand, an annular convex portion 23d (not shown in FIG. 3) corresponding to the peripheral groove 24d of the CCD case 24 is entirely provided at a predetermined position on the peripheral side and the rear side of the dust-proof filter receiving member 23. It is formed in a substantially annular shape over the circumference. Therefore, by fitting the annular convex portion 23d and the circumferential groove 24d, CC
The D case 24 and the dust-proof filter receiving member 23 are substantially airtightly fitted to each other in an annular region, that is, in a region where the circumferential groove 24d and the annular convex portion 23d are formed.

The dustproof filter 21 is formed of a circular or polygonal plate-like optical member as a whole, and can transmit an effective light beam which enters the image pickup device 27 from the photographing optical system 12a and contributes to forming an image. The transparent portion is disposed facing the front surface of the optical LPF 25 at a predetermined interval.

Further, a vibrating member 22 for applying vibration to the dustproof filter 21 is integrated with a peripheral edge of one surface (the back side in this embodiment) of the dustproof filter 21. For example, it is provided by means such as sticking with an adhesive.

The vibrating member 22 is configured to generate a predetermined vibration in the dustproof filter 21 by applying a predetermined driving voltage from the outside. Details of the member 22 will be described later (see FIGS. 12 and 13).

The dustproof filter 21 is fixed and held by a pressing member 20 made of an elastic body such as a leaf spring so as to be airtightly joined to the dustproof filter receiving member 23.

An opening 23f having a circular or polygonal shape is provided near the substantially central portion of the dust filter receiving member 23. The opening 23f is set to have a size large enough to allow the light beam of the subject transmitted through the photographing optical system 12a to pass therethrough and irradiate the photoelectric conversion surface of the image sensor 27 disposed behind. .

A wall 23e (see FIGS. 4 and 5) protruding toward the front side is formed in a substantially annular shape at the peripheral edge of the opening 23f. The receiving portion 23c is formed so as to protrude toward.

On the other hand, a plurality of (three in this embodiment) projecting portions 23a are formed at predetermined positions near the outer peripheral edge of the dust-proof filter receiving member 23 on the front side so as to project toward the front side. Have been. The protruding portion 23a is a portion formed for fixing the pressing member 20 for fixing and holding the dustproof filter 21, and the pressing member 20 is provided with a screw 20a or the like with respect to the tip of the protruding portion 23a. Are fixed by the fastening means.

As described above, the pressing member 20 is a member formed of an elastic body such as a leaf spring, and has a base end fixed to the protruding portion 23 a and a free end fixed to the outer peripheral edge of the dustproof filter 21. By contacting the portion, the dust filter 21 is pressed toward the dust filter receiving member 23, that is, in the optical axis direction.

In this case, a predetermined portion of the vibration member 22 disposed on the outer peripheral edge on the rear side of the dustproof filter 21 abuts on the receiving portion 23c, so that the dustproof filter 21 and the vibration member 22 are prevented. Is regulated in the optical axis direction. Accordingly, the dustproof filter 21 is thereby fixed and held so as to be airtightly joined to the dustproof filter receiving member 23 via the vibration member 22.

In other words, the dust filter receiving member 23
Is configured to be airtightly joined to the dustproof filter 21 and the vibrating member 22 by the urging force of the pressing member 20.

By the way, as described above, the dust-proof filter receiving member 23 and the CCD case 24 are so arranged that the circumferential groove 24d and the annular convex portion 23d (see FIGS. 4 and 5) are substantially airtightly fitted to each other. At the same time, the dust-proof filter receiving member 23 and the dust-proof filter 21
Are hermetically joined via the vibrating member 22 by the urging force. The optical LPF 25 provided in the CCD case 24 is provided so as to be substantially airtight between the peripheral portion on the front side of the optical LPF 25 and the step portion 24 a of the CCD case 24. Further, on the rear side of the optical LPF 25, an image sensor 27 is disposed via a low-pass filter receiving member 26, so that substantially airtightness is maintained even between the optical LPF 25 and the image sensor 27. ing.

Accordingly, a predetermined gap 51a is formed in the space between the optical LPF 25 and the dustproof filter 21 facing each other. Also, the optical LPF 25
, The CCD case 24, the dust-proof filter receiving member 23 and the dust-proof filter 21
b is formed. This space 51b is provided with an optical LPF.
This is a sealed space formed so as to protrude outside the outside 25 (see FIGS. 4 and 5). The space 51b is set to be a space larger than the space 51a. The space formed by the gap 51a and the space 51b is formed by the CCD case 24, the dust-proof filter receiving member 23, the dust-proof filter 21, and the optical
A sealing space 51 that is substantially airtightly sealed by the PF 25
It has become.

As described above, in the image pickup unit 15 in the camera of the present embodiment, the portion (the gap 51) where both the image pickup device 27 and the dustproof filter 21 are formed to face each other.
a) and a space 51 b substantially enclosed in the periphery of the optical LPF 25 and the dustproof filter 21.
A sealing structure formed so as to seal the (space) is configured. And this sealing structure part is an optical LPF
It is provided at a position outside from the periphery of 25 or its vicinity.

That is, in the present embodiment, the dustproof filter 21 and the vibrating member 22 and the dustproof filter that supports the dustproof filter 21 (and the vibrating member 22) in close contact with the peripheral portion or the vicinity thereof. Receiving member 23
And a CCD disposed so as to closely support the optical LPF 25 at a peripheral portion thereof or a portion in the vicinity thereof and to be in close contact with the dust-proof filter receiving member 23 at a predetermined portion thereof.
The case 24 and the dustproof filter 21 (and the vibration member 2)
A sealing structure is constituted by a pressing member 20 for pressing 2) against the dust-proof filter receiving member 23 and the like.

In the camera of the present embodiment configured as described above, the dust-proof filter 21 is disposed at a predetermined position on the front side of the image sensor 27 so as to oppose the photoelectric conversion surface of the image sensor 27 and the dust-proof filter 21. The sealing space 51 formed on the periphery of the image sensor 27 is sealed, thereby preventing dust and the like from adhering to the photoelectric conversion surface of the image sensor 27.

In this case, dust and the like adhering to the exposed surface on the front side of the dustproof filter 21 are applied to the vibration member 22 which is disposed integrally with the periphery of the dustproof filter 21. By applying a predetermined voltage to the dustproof filter 21 by applying a periodic voltage, the dustproof filter 21 can be removed.

FIG. 6 is a front view showing only the dustproof filter 21 and the vibrating member 22 provided integrally with the dustproof filter 21 of the image pickup unit 15 of the camera 1. 7 and 8 show the state change of the dustproof filter 21 and the vibration member 22 when a driving voltage is applied to the vibration member 22 of FIG. 6, and FIG. FIG. 8 is a cross-sectional view taken along line A-B of FIG. 6.

Here, for example, when a negative (minus;-) voltage is applied to the vibrating member 22,
7 is deformed as shown by a solid line in FIGS. 7 and 8, while a positive (+; +) voltage is applied to the vibrating member 22, the dustproof filter 21 is deformed as shown by a dotted line in FIG. Will be transformed into

In this case, reference numeral 21 in FIGS.
Since the amplitude is substantially zero at the position of the node of the vibration as indicated by a, the receiving portion 23c of the dust-proof filter receiving member 23 is set to abut on a portion corresponding to the node 21a. Thereby, the dustproof filter 21 can be efficiently supported without hindering the vibration.

In this state, the dust-proof filter driving section 48 is controlled at a predetermined time to
By applying a periodic voltage to the dust filter 21, the dust filter 21 vibrates, and dust and the like attached to the surface of the dust filter 21 are removed.

The resonance frequency at this time is determined by the shape, plate thickness, material and the like of the dustproof filter 21. In the examples shown in FIGS. 6 to 8 described above, the case where the primary vibration is generated is shown. However, the present invention is not limited to this, and higher-order vibration may be generated.

In another example shown in FIGS. 9 to 11, FIGS.
FIG. 10 shows a case where secondary vibration is generated in a dust filter having exactly the same configuration as the example shown in FIG. 8.

In this case, FIG. 9 is a front view showing only the dustproof filter 21 and the vibrating member 22 provided integrally with the dustproof filter 21 in the image pickup unit 15 of the camera 1 as in FIG. 10 and 1
1 shows a state change of the dustproof filter 21 and the vibration member 22 when the voltage is applied to the vibration member 22 of FIG.
FIG. 10 is a sectional view taken along the line AA in FIG. 9, and FIG. 11 is a sectional view taken along the line BB in FIG.

Here, for example, when a negative (minus;-) voltage is applied to the vibrating member 22, the dustproof filter 2
1 is deformed as shown by a solid line in FIGS. 10 and 11, while when a positive (plus; +) voltage is applied to the vibrating member 22, the dustproof filter 21 is deformed as shown by a dotted line in FIG. Will be transformed into

In this case, there are two pairs of nodes in this vibration as indicated by reference numerals 21a and 21b shown in FIGS. 9 to 11. However, the dust filter receiving member 23 is provided at a portion corresponding to the node 21a. By setting the receiving portion 23c to abut, the dustproof filter 21 can be efficiently supported without obstructing the vibration, as in the examples shown in FIGS. 6 to 8 described above.

Then, in this state, the dust-proof filter driving section 48 is controlled at a predetermined time to
By applying a periodic voltage to the dust filter 21, the dust filter 21 vibrates, and dust and the like attached to the surface of the dust filter 21 are removed.

When the primary vibration is generated as shown in FIGS. 6 to 8, the volume of the sealed space 51 is changed by the amplitude C due to the amplitude of the dust filter 21. Become. On the other hand, when the secondary vibration is generated as shown in FIGS. 9 to 11, the volume change of the sealed space 51 caused by the amplitude of the dust filter 21 is changed from the area indicated by the reference sign D1 to the area indicated by the reference sign D2. X2 minus (D1- (D2x2)).

The smaller the change in the volume of the sealed space 51, the smaller the change in the internal pressure inside the sealed space 51. Therefore, the smaller the change in the volume of the sealed space 51, the more efficient vibration can be obtained. . Therefore, in terms of the efficiency of the electromechanical conversion, it is considered that it is desirable to set the generated vibration to a higher order.

It is desirable that the receiving portion 23c of the dust-proof filter receiving member 23 is set so as to abut on a portion of the dust-proof filter 21 that serves as a node of vibration. The position of the node of the vibration of the dustproof filter 21 differs depending on the size (thickness, diameter, etc.) of the dustproof filter 21 or the size of the vibration member 22 for vibrating the filter. Therefore, the setting as shown in the present embodiment, that is, the setting is not necessarily such that the receiving portion 23c of the dustproof filter receiving member 23 comes into contact with the vibrating member 22, for example, a predetermined shape on the surface of the dustproof filter 21. It may be a position.

In the image pickup unit 15 of the camera 1 according to the present embodiment, as described above, a vibrating member, which is a vibrating member for applying vibration to the dustproof filter 21, is provided on the peripheral edge of the dustproof filter 21. 22 is provided by means such as sticking with an adhesive.

The details of the dustproof filter 21 (dustproof member) and the vibration member 22 in the image pickup unit 15 will be described below.

FIGS. 12 and 13 are views showing a part of components constituting the image pickup unit of the camera according to the present embodiment. FIG. 12 shows a dustproof member (optical member; dustproof filter 21). FIG. 5 is a perspective view of a vibration member (such as a piezoelectric element) and a conductive plate taken out and viewed from the back side (the image pickup element side). FIG. 13 is a sectional view taken along line RR in FIG.

Vibration member 2 in main imaging unit 15
Reference numeral 2 denotes a piezoelectric element 22n formed of, for example, a piezoelectric ceramic or the like, which is a thin plate-shaped electromechanical transducer, in a substantially annular shape, and a voltage applied to the piezoelectric element 22n formed on both surfaces of the piezoelectric element 22n. 22m electrode for applying
(See FIG. 13) are alternately stacked. This is because, if the vibration member 22 has a multilayer structure, the vibration force can be increased without changing the applied voltage.

In FIG. 12, only the electrode 22m on the surface portion shown by oblique lines is shown, and the electrode (22m) to be provided at each portion between the layers is not shown. The electrodes 22m provided at each part between the layers are illustrated in FIG.

Since the vibrating member 22 has a multilayer structure as described above, the vibrating member 22 according to the present embodiment includes a plurality of piezoelectric elements 22 constituting the vibrating member 22.
A conductive plate 66 made of a similar annular thin plate member is provided between each of the n layers. Thereby, the conductive plate 66
Are arranged in contact with the respective electrodes 22m of the vibration member 22.

Further, on the outer peripheral edge portion of the conductive plate 66, a piece 66a part of which protrudes outward is formed integrally with each other. Therefore, if a connecting member such as the lead wire 63 is connected to the section 66a, the piezoelectric element 22n
It is configured such that conduction to each electrode 22m provided between the layers is enabled.

The vibrating member 22 in the present embodiment is an example constituted by two layers of piezoelectric elements 22n as shown in FIG.
1 is annularly disposed on the surface of the outer peripheral edge. And
Two conductive plates 66 are provided between the respective layers.

In this case, one of the two conductive plates 66 is connected to the dustproof filter 21 and one of the piezoelectric elements 22.
n, and the other conductive plate 66 is provided so as to be sandwiched between the layers of the two-layer piezoelectric element 22n. Then, the section 6 of one conductive plate 66
The main body ground (GN) is connected to the electrode 22m on the outer surface side of the piezoelectric element 22n on the outer side (imaging element side) via a lead wire 63.
D), and a section 66a of the other conductive plate 66 is formed.
Are connected to a dust filter driving unit 48.

By applying a predetermined periodic voltage from the dust-proof filter driving section 48 to the vibrating member 22 thus configured at a predetermined time, vibration can be given to the dust-proof filter 21. I have.

As described above, according to the one embodiment, the optical LPF 25 and the dustproof filter 21 (dustproof member).
A sealing structure in which the space 51b is sealed on the peripheral side of the optical LPF 25 and the dustproof filter 21 so as to form a substantially sealed space 51 including a gap 51a formed by opposing each other. Since the portion is provided outside from the periphery of the optical LPF 25 or the vicinity thereof, the distance between the optical LPF 25 and the dustproof filter 21 (dustproof member) may be set short in order to secure a constant volume of the space. it can.

In general, if the distance between the optical LPF 25 and the dustproof filter 21 (dustproof member) is set short, the gap 5
When the dust-proof filter 21 is vibrated by the vibrating member 22, the sealing space 51a is reduced.
It is well known that the internal pressure of the air becomes high. But,
When the internal pressure of the sealing space 51 is high, the vibration of the dust-proof filter 21 by the vibration member 22 tends to be hindered.

On the other hand, if the distance between the optical LPF 25 and the dustproof filter 21 (dustproof member) is set to be long in order to secure the volume of the sealing space 51, the dimension of the image pickup unit 15 in the optical axis direction also increases. As a result, the size of the camera 1 is hindered from being reduced in the optical axis direction.

Thus, in the present embodiment, the optical LP
By providing the space portion 51b outside from the periphery of the F25 or the vicinity thereof, a sufficient volume of the sealing space 51 is secured, and the vibration of the dustproof filter 21 by the vibration member 22 is not hindered. Can be suppressed from becoming large in the optical axis direction. Therefore, camera 1
Can easily be reduced in the optical axis direction.

In the present embodiment, since the vibration member 22 has a multilayer structure, the applied voltage is not changed.
A stronger excitation force can be obtained. In order to solve the problem caused by the vibration member 22 having a multilayer structure, that is, the problem that it is difficult to obtain conduction to the electrode 22m located between the layers, the conductive plate 66 having a section 66a between the layers is used.
Is provided so that electrical continuity can be easily obtained with the electrode 22m between the layers. Therefore, a multilayer structure of the vibration member 22 can be easily realized with a simple configuration.

The means for ensuring conduction to the electrodes 22m provided between the layers of the vibrating member 22 is not limited to the means according to the above-described embodiment, but may be any other means. Hereinafter, each modified example of another means for securing conduction to each electrode 22m between layers will be described.

FIGS. 14, 15, and 16 are views showing a first modification of the above-described embodiment. FIG. 14 is a view showing a part of components constituting the image pickup unit (dust / dust filter 21). FIG. 4 is a perspective view of a state in which a vibration member (a piezoelectric element or the like) and a conductive plate are taken out and viewed from the back side (the imaging element side). FIG. 15 is a cross-sectional view taken along line SS of FIG. 14, and FIG. 16 is a cross-sectional view taken along line TT of FIG.

Exciting member 22 in the first modified example
Has a multilayer structure similarly, but is configured by omitting the conductive plate 66 in the above-described embodiment.

The vibrating member 22 includes a piezoelectric element 22n
And an electrode 22m for applying a voltage to the piezoelectric element 22n are alternately laminated, and have a two-layer structure in this example. In order to make the electrode 22m formed on the outer surface side of the outermost (image sensor side) piezoelectric element 22n among the plurality of electrodes 22m and the electrode 22m on the side in contact with the dustproof filter 21 into a conductive state, Exciting member 22
Is provided with a first conductive member 64a made of, for example, a silver paste or a conductive adhesive. The first conductive member 64a has a lead wire 6
3 is connected, and the main body is grounded through this (GND)
Is made.

Note that the first conductive member 64a is turned off in FIG. 1 so that only the electrode 22m between the layers provided at a position sandwiched between the two piezoelectric elements 22n becomes non-conductive.
4. As shown in FIG. 15, an insulating member 67 such as an epoxy resin is formed at a portion in contact with the interlayer electrode 22m.

On the other hand, at the inner peripheral edge of the vibration member 22, as shown in FIG. 16, a second material made of the same material as the first conductive member 64 a is provided at a position in contact with the above-mentioned interlayer electrode 22 m. A conductive member 64b is provided. The lead wire 63 is connected to the second conductive member 64b, and is electrically connected to the dust filter driving unit 48 via the lead wire 63. Other configurations are the same as those of the above-described embodiment.

In this modified example having such a configuration, it is possible to obtain exactly the same effects as those of the above-described embodiment.

FIG. 17 shows a second modification of the above-described embodiment, and is a cross-sectional view corresponding to a portion taken along line SS of FIG.

The second modification has substantially the same configuration as the first modification, but the following points are different in the vibration member 22 of this modification.

That is, in the vibrating member 22, the electrode 22m disposed so as to be sandwiched between the two piezoelectric elements 22n has a predetermined non-exposed area 67a so as not to be exposed to the outer peripheral edge. It is formed to have.

That is, in the above-described embodiment and the first modification thereof, each electrode 22m is connected to the piezoelectric element 2m.
2n are formed on the entire surface of both surfaces, but in this modification, only the interlayer electrode 22m is formed except for a predetermined range (a portion indicated by reference numeral 67a) on the outermost peripheral edge side. I have to.

Accordingly, in this modification, a first conductive member 64a in place of the first conductive member 64a in the first modification is used.
The conductive member 64c is applied. This first conductive member 64
c is the insulating member 67 in the first conductive member 64a described above.
By eliminating, it is formed in a simpler form.

In other words, in this modification, since the interlayer electrode 22m is not exposed to the outer edge as described above, the first conductive member 64c in which the insulating member 67 is omitted is applied. Also, the first conductive member 64c
Can make the other two electrodes 22m conductive while keeping only the interlayer electrode 22m nonconductive.

A lead wire 63 is connected to the first conductive member 64a, through which the main body ground (GN) is connected.
D) is performed. On the other hand, the second conductive member (64b) is connected to a lead wire (63), not shown, but electrically connected to the dustproof filter driving unit 48 via the lead wire (63), similarly to the first modification. ing. Other configurations are the same as those of the above-described embodiment.

In this modified example having such a configuration, the same effect as that of the above-described embodiment and the first modified example can be obtained, and in this modified example, the insulating member 67 is provided.
Since it is not necessary to form the semiconductor device, the manufacturing cost can be reduced.

FIGS. 18, 19, and 20 are views showing a third modification of the above-described embodiment. FIG. 18 shows a part of components constituting the image pickup unit (dustproof / dustproof filter 21). FIG. 4 is a perspective view of a state in which a vibration member (a piezoelectric element or the like) and a conductive plate are taken out and viewed from the back side (the imaging element side). FIG. 19 is a sectional view taken along the line UU in FIG. 18, and FIG. 20 is a sectional view taken along the line VV in FIG.

The third modified example has substantially the same configuration as the first modified example described above, but differs in the following points in this modified example.

That is, in this modification, a first conductive member 64d having a different shape is applied instead of the first conductive member 64a in the above-described first modification. Although the first conductive member 64a of the above-described first modified example is disposed only on the outer peripheral side edge of the vibrating member 22, in the present modified example, the first conductive member 64d is further positioned outside (imaging). Element side) Piezoelectric element 22
n is formed to extend to the outer surface side.

That is, the first conductive member 64d is formed as shown in FIG.
As shown in FIG. 9, the section is formed in a substantially L-shape, and the inner wall surface of the short bowl portion comes into contact with the electrode 22m on the outer surface side of the piezoelectric element 22n. The continuity can be obtained.
A lead wire 63 is connected to the outer surface side electrode 22m, and the main body is grounded (GND) via this.

In this modification, a second conductive member 64e having a different shape is applied instead of the second conductive member 64b in the above-described first modification. The second conductive member 64b of the above-described first modified example is disposed only on the inner peripheral side edge of the vibrating member 22, but in the present modified example, the second conductive member 64e is further disposed outside ( Piezoelectric element 22 on the imaging element side)
n is formed to extend to the outer surface side. That is,
The second conductive member 64e has a substantially L-shaped cross section as shown in FIG.

Accordingly, in this modification, the insulating portion 65 is provided on a part of the electrode 22m formed on the outer surface side of the outermost (image sensor side) piezoelectric element 22n. Further, an electrode 22ma is further formed within the range of the insulating portion 65. That is, this electrode 22
An insulating portion 65 is provided between ma and the electrode 22m formed on the same surface, and the insulating portion 65 isolates the two from each other to be in a non-conductive state.

The inner wall surface of the short bowl of the second conductive member 64e is formed so as to contact the electrode 22ma. As a result, more reliable conduction can be obtained. The dust filter driving unit 48 is electrically connected to the electrode 22ma via a lead wire 63. Other configurations are the same as those of the above-described embodiment.

In this modified example having such a configuration, it is possible to obtain exactly the same effects as those of the above-described embodiment and each modified example. In this third modification, each electrode 2
Piezoelectric element 22 on the outermost side (imaging element side)
Since n is drawn to the outer surface side, it can contribute to simplification of wiring, and can contribute to simplification of a manufacturing process and reduction of manufacturing cost.

FIG. 21 shows a fourth modification of the above-described embodiment, and is a cross-sectional view corresponding to a portion along line UU in FIG.

The fourth modification has substantially the same configuration as the third modification, and is obtained by applying the same application as the second modification to the third modification. It is.

That is, the vibrating member 22 in this modification is
Are the two piezoelectric elements 22n, as in the above-described second modification.
The electrode 22m provided so as to be sandwiched between the layers is formed to have a predetermined non-exposed region 67a so as not to be exposed to the outer peripheral edge.

Accordingly, in this modification, the first conductive member 64d in the third modification is replaced with the first conductive member 64d.
The conductive member 64f is applied. This first conductive member 64
f is the insulating member 67 in the first conductive member 64d described above.
By eliminating, it is formed in a simpler form.

Thus, the first conductive member 64f can make the other two electrodes 22m conductive while keeping only the interlayer electrode 22m non-conductive. Other configurations are completely the same as those of the third modification.

In this modified example having such a configuration, substantially the same effects as those of the above-described embodiment and each modified example can be obtained, and the shape of the first conductive member 64f can be simplified. This can contribute to a reduction in manufacturing cost.

In the above-described embodiment,
As an example of the multilayer structure of the vibration member 22, for example, a two-layer structure (one embodiment and first to fourth modified examples thereof;
Although FIGS. 12 to 21 have been described as an example, the present invention is not limited to this, and it is easy to form a multilayer structure using more piezoelectric elements.

For example, FIGS. 22 and 23 show an example in which the vibration member has a three-layer structure, and shows a fifth modification of the above-described embodiment. Among them, FIG. 22 is a cross-sectional view corresponding to a portion along the line SS in FIG. FIG. 23 is a cross-sectional view corresponding to a portion along the line TT in FIG.

The basic structure of this modification is substantially the same as that of the above-described first modification, except that the vibrating member 22 has a three-layer structure, and accordingly, the first conductive member 64g and the first conductive member 64g have the same structure. The difference is that the two conductive members 64h are formed in an appropriate shape.

In this case, the first conductive member 64g
Is an electrode 22m provided on the contact surface with the dustproof filter 21 as shown in FIG.
Are in a conductive state. The first conductive member 64
An insulating member 67 is formed on g, so as to be in a non-conductive state with an unnecessary electrode. The first conductive member 64 g is grounded (GND) via the lead wire 63.

On the other hand, as shown in FIG. 23, the second conductive member 64h brings a plurality of electrodes 22m other than the electrodes made conductive by the first conductive member 64g into a conductive state. An insulating member 67 is also formed on the second conductive member 64h so as to be in a non-conductive state with unnecessary electrodes. Then, the second conductive member 64h
Is electrically connected to the dust filter driving unit 48 via a lead wire 63. Other configurations are the same as those of the above-described first modification.

With such a configuration, the vibration member 22 having a further multilayer structure can be easily formed.

In each of the modifications of the above-described embodiment, the case where the first conductive member is provided mainly at the outer peripheral portion and the second conductive member is provided mainly at the inner peripheral portion is exemplified. However, since there is no restriction on the arrangement position, it goes without saying that the configuration can be freely combined as appropriate.

In the above-described embodiment and its modifications, the dustproof filter 21 is formed by a substantially circular plate-shaped optical member. However, the present invention is not limited to this. For example, reference numerals in FIGS. It may be constituted by a polygonal plate-shaped optical member as shown in 21A.

Here, FIG. 24 shows a dustproof member (dustproof dustproof filter 21A) which is a part of the components of the image pickup unit.
FIG. 3 is a perspective view illustrating a schematic configuration when a vibration member (a piezoelectric element or the like) is taken out and viewed from the back side (the imaging element side). FIG. 25 is a front view when viewed from the arrow V2 direction in FIG.

As described above, in this example, since the dustproof filter 21A is formed by a polygonal plate-shaped optical member, the shape of the vibrating member 22 is also formed in accordance with this, and It is the same that it is stuck on one surface near the periphery.

The shape of the vibrating member 22 is not limited to an annular shape as shown in the above-described embodiment and each of its modifications. For example, a plurality of rectangular The small piece of the shape is
May be arranged so as to surround the transparent part.

[0142]

As described above, according to the present invention, there is provided a dustproof member for sealing and protecting the photoelectric conversion surface side of the image pickup device, and a vibrator for applying vibration of a predetermined amplitude to the dustproof member. A camera using an image sensor unit having a member, which proposes a configuration of a vibration member capable of obtaining a stronger vibration force with a simple configuration, thereby removing dust and the like adhering to the surface of the dustproof member. It is possible to provide a camera that can be easily and reliably removed and an image sensor unit used for the camera.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an internal configuration of a camera according to an embodiment of the present invention by cutting a part of the camera.

FIG. 2 is a block diagram schematically showing a main electric configuration of the camera shown in FIG. 1;

3 is an exploded perspective view of an essential part of the camera of FIG. 1, showing a part of the imaging unit in an exploded state.

FIG. 4 is a perspective view of the camera of FIG. 1 with a part cut away in an assembled state of an imaging unit.

FIG. 5 is a cross-sectional view taken along the section plane of FIG. 4;

FIG. 6 is a front view showing only a dustproof filter and a piezoelectric element provided integrally with the dustproof filter out of the imaging unit in the camera of FIG. 1;

FIG. 7 is a cross-sectional view taken along the line AA of FIG. 6, showing a state change of the dust-proof filter and the piezoelectric element when voltage is applied to the piezoelectric element of FIG. 6;

FIG. 8 is a cross-sectional view taken along the line BB of FIG. 6, showing a state change of the dust-proof filter and the piezoelectric element when voltage is applied to the piezoelectric element of FIG. 6;

9 is a front view showing only a dustproof filter and a piezoelectric element provided integrally with the dustproof filter out of the image pickup unit in the camera of FIG. 1;

FIG. 10 shows another example of a state change of the dustproof filter and the piezoelectric element when applied to the piezoelectric element of FIG.
Sectional drawing which follows the AA line of FIG.

FIG. 11 shows another example of a state change of the dust filter and the piezoelectric element when applied to the piezoelectric element of FIG.
Sectional drawing which follows the BB line of FIG.

12 is a perspective view of a part (a dustproof member, a vibrating member, a conductive plate, and the like) of components constituting the imaging unit of the camera of FIG. 1 taken out and viewed from the back side (imaging element side). FIG.

FIG. 13 is a sectional view taken along the line RR in FIG. 12;

FIG. 14 shows a first modified example of the embodiment of the present invention, in which a part (a dustproof / dustproof filter, a vibrating member, a conductive plate, and the like) of an imaging unit is taken out, and a back side thereof ( FIG. 3 is a perspective view when viewed from an imaging element side).

FIG. 15 is a sectional view taken along the line SS in FIG. 14;

FIG. 16 is a sectional view taken along the line TT in FIG. 14;

FIG. 17 is a cross-sectional view illustrating a second modification of the embodiment of the present invention and corresponding to a portion along the line SS in FIG. 14;

FIG. 18 shows a third modified example of the embodiment of the present invention, in which a part (a dustproof / dustproof filter, a vibrating member, a conductive plate, and the like) of the constituent members constituting the imaging unit are taken out, and the back side thereof ( FIG. 3 is a perspective view when viewed from an imaging element side).

FIG. 19 is a sectional view taken along the line UU in FIG. 18;

FIG. 20 is a sectional view taken along the line VV in FIG. 18;

FIG. 21 is a sectional view showing a fourth modification of the embodiment of the present invention and corresponding to a portion along the line UU in FIG. 18;

FIG. 22 is a sectional view showing a fifth modification of the embodiment of the present invention and corresponding to a portion taken along line SS of FIG. 14;

FIG. 23 is a sectional view showing a fifth modification of the embodiment of the present invention and corresponding to a portion taken along line TT of FIG. 14;

FIG. 24 shows a sixth modification of the embodiment of the present invention, in which a part (a dustproof member and a vibrating member) of an imaging unit is taken out and viewed from the back side (the imaging element side). FIG. 2 is a perspective view showing a schematic configuration at the time.

FIG. 25 is a front view when viewed from the direction of arrow V2 in FIG. 24;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Camera 11 ... Camera main body 11a ... Photographing optical system mounting part (photographing lens mounting part) 12 ... Lens barrel 12a ... Photographing optical system (photographing lens) 13 ... Viewfinder device 13a ... Penta prism 13b Reflector 13c Eyepiece 14 Shutter 15 Image pickup unit (image pickup element unit) 16 Main circuit board 16a Image signal processing circuit 16b Work memory 17 Release button 20 ... Pressing members 21 and 21A... Dustproof filter (dustproof member; optical member) 22... Vibration member 22n... Piezoelectric element 22m... Case (imaging element storage case member) 23d: annular convex portion 24d: peripheral groove 25: optical LPF (optical low-pass filter) 26: roper Filter receiving member 27 Image pickup device (CCD) 28 Image pickup device fixing plate 48 Dust-proof filter drive unit 51 Sealed space 51a Void 51b Space 63 63 Lead wire 64a 64c, 64d, 64f, 64g first conductive member 64b, 64e, 64h second conductive member 65 insulating part 66 conductive plate 66a section (conductive plate) 67 insulating member 67a Unexposed area

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI Theme coat ゛ (Reference) H01L 41/09 H01L 41/08 U F term (Reference) 2H044 AD03 2H083 AA10 AA26 AA32 2H100 CC07 EE06 4M118 AB01 HA02 HA20 HA23 HA25 HA35 5C022 AA00 AC42 AC66 AC69 AC74 AC78 CA00

Claims (11)

[Claims] An imaging device that obtains an image signal corresponding to light irradiated on its own photoelectric conversion surface, a photographic lens that causes a subject image to be incident on a photoelectric conversion surface of the imaging device; A dust-proof member having a transparent portion capable of transmitting an effective light beam incident on the image-capturing element, and the transparent portion facing the front side of the image-capturing element at a predetermined interval; and a peripheral portion of the dust-proof member. A vibrating member disposed to apply vibration to the dustproof member; and the image sensor to form a substantially sealed space in a portion where both the image sensor and the dustproof member are formed facing each other. And a sealing structure configured to seal the space at the peripheral side of the dustproof member, and a sealing structure obtained from the image sensor as corresponding to an image formed on a photoelectric conversion surface of the image sensor. Form suitable for recording the recorded image signal It comprises an image signal processing circuit for converting a signal, a, the pressing mutabilis member, a camera, characterized by being configured by a multilayer structure. 2. The camera according to claim 1, wherein a conductive plate is provided between layers of the vibration member. 3. The camera according to claim 1, wherein the vibration member is formed by alternately stacking piezoelectric elements and electrodes for applying a voltage to the piezoelectric elements. 4. The camera according to claim 3, wherein the piezoelectric element is a piezoelectric ceramic. 5. The camera according to claim 1, further comprising a photographic lens mounting portion for mounting the photographic lens, wherein the photographic lens is detachable at the photographic lens mounting portion. . 6. The camera according to claim 1, wherein the vibrating member is disposed annularly around a periphery of the dustproof member. 7. An image pickup element for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface, an optical member disposed opposite to the front side of the image pickup element at a predetermined interval, and A vibrating member disposed on a peripheral portion of the optical member for applying vibration to the optical member, and a space portion formed at a portion where both the image pickup element and the optical member are formed facing each other. A sealing structure configured to substantially seal the space on the peripheral side of the imaging element and the optical member, wherein the vibration member has a multilayer structure. Image sensor unit. 8. The imaging device unit according to claim 7, wherein a conductive plate is provided between layers of the vibration member. 9. The imaging device according to claim 7, wherein the vibration member is formed by alternately stacking a piezoelectric element and an electrode for applying a voltage to the piezoelectric element. unit. 10. The imaging device unit according to claim 9, wherein the piezoelectric element is a piezoelectric ceramic. 11. The imaging element unit according to claim 7, wherein the vibration member is disposed in a ring shape around a periphery of the optical member.