JP2003348401A - Camera and imaging element unit used for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent dust from being deposited on a photoelectric conversion surface of an imaging element and to remove dust deposited on an outer surface of a dust-proof member sealing or protecting the imaging element. <P>SOLUTION: An imaging element unit includes: the imaging element 27; a dust-proof filter 21 formed to be a disk or a polygonal plate as a whole, a region having a prescribed spread from the center of which in a radial direction forms a transparent part, the transparent part being placed opposite to a front side of the imaging element 27 at a prescribed interval, and at least a face of which opposed to the imaging element 27 is subjected to surface treatment by an antistatic agent; a piezoelectric element 22 placed at a circumferential edge of the dust-proof filter 21 to provide vibration to the dust-proof filter 21; and a sealing structure section configured to seal a nearly enclosed space by the circumferential edge of the imaging element 27 and the dust-proof filter 21, the space being configured at a place formed by both the imaging element 27 and the dust-proof filter 21 opposed to each other. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a camera provided with an image sensor unit having an image sensor for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface, and more particularly, to a dustproof device for the image sensor. The present invention relates to a camera having a structure and an imaging unit used for the camera.

[0002]

2. Description of the Related Art In recent years, a solid-state image pickup device or the like in which a subject image formed based on a light beam from a subject transmitted through a photographing optical system (hereinafter referred to as a subject light beam) is arranged at a predetermined position, such as a charge-coupled device (CCD) ; Charge Coupled Devic
e. An image is formed on a photoelectric conversion surface such as an image sensor, and an electrical image signal or the like representing a desired subject image is generated using the photoelectric conversion action of the image sensor or the like. For example, a liquid crystal display (LC)
D; Liquid Crystal Display) or the like, to output an image or the like by displaying it on a predetermined display device or the like, or to record an image signal or the like generated by an image sensor or the like as image data in a predetermined form on a predetermined recording medium. Area, and further read out the image data recorded on the recording medium, convert the image data into an optimal image signal to be displayed on a display device, and then process the processed image data. A digital camera such as a so-called digital still camera or digital video camera (hereinafter referred to as a digital camera or simply a camera) configured to display an image corresponding thereto based on an image signal is generally put into practical use. Is widely spread.

Further, a general digital camera is provided with an optical finder device for the purpose of observing a desired subject to be photographed prior to a photographing operation and setting a photographing range including the subject. Generally.

In this optical viewfinder device, a traveling direction of a subject light beam transmitted through a photographing optical system is bent by using a reflecting member or the like disposed on an optical axis of the photographing optical system so that a subject image for observation is positioned at a predetermined position. On the other hand, during the photographing operation, the reflecting member is retracted from the optical axis of the photographing optical system, thereby guiding the subject light beam to the light receiving surface of the image sensor, that is, the photoelectric conversion surface, and photographing on the photoelectric conversion surface. In general, a so-called single-lens reflex type finder device configured to form a subject image for use is generally used.

In recent years, a finder device of a single-lens reflex type is provided, and a photographing optical system is configured to be detachable from a camera body.
A so-called lens-replaceable lens, which is configured so that a plurality of types of photographing optical systems can be selectively used in a single camera body by arbitrarily attaching and detaching and replacing a desired photographing optical system when a user desires. Digital cameras of the form are generally being put to practical use.

In such a lens-replaceable digital camera, when the photographic optical system is detached from the camera body, dust or the like floating in the air may enter the inside of the camera body. Also, since various mechanically operated mechanisms such as a shutter and an aperture mechanism are provided inside the camera body, dust may be generated from these various mechanisms during the operation. There is also.

On the other hand, when the photographing optical system is detached from the camera body, the light receiving surface (also referred to as a photoelectric conversion surface) of the imaging device disposed behind the photographing optical system is exposed to the outside air inside the camera. Therefore, dust and the like may adhere to the photoelectric conversion surface of the image sensor due to factors such as charging.

Therefore, in a conventional single-lens reflex digital camera or the like, a technique for suppressing dust or the like from adhering to a light receiving surface of an image sensor due to a charging action or the like is disclosed in, for example, Japanese Patent Laid-Open No. 2000-2000. -29132 and the like.

Means disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 2000-29132 is a method for a single-lens reflex digital camera in which a lens is exchangeable, the surface of a cover member for covering a light receiving surface of an image sensor provided inside the camera. Is provided with a transparent electrode, and a DC voltage or an AC voltage having a frequency of about several kHz to 20 kHz is applied to the electrode so that dust or the like is prevented from adhering to the light receiving surface of the imaging device due to a charging action. It was made.

According to the means disclosed in the publication,
By neutralizing the charge generated in the image sensor, it is possible to suppress the attachment of dust and the like to the light receiving surface of the image sensor due to static electricity and the like.

[0011]

However, in the means disclosed in Japanese Patent Application Laid-Open No. 2000-29132, the charge of the charged imaging element is neutralized to suppress the attachment of dust and the like. Therefore, it is considered that a means for simply removing dust or the like that has simply adhered or accumulated on the photoelectric conversion surface of the image sensor without being affected by static electricity is not optimal.

On the other hand, the present applicant has previously filed Japanese Patent Application No. 2000-4.
In No. 01291, by providing a dust-proof member for sealing or protecting the side of the photoelectric conversion surface of the imaging device, dust and the like are prevented from adhering to the photoelectric conversion surface of the imaging device,
With respect to dust and the like adhering to the outer surface of the dustproof member, a means for removing the dust by applying a vibration of a predetermined amplitude to the dustproof member by a predetermined vibration means has been proposed.

According to this means, it is possible to prevent dust and the like from adhering to the photoelectric conversion surface of the image pickup device by a small and simple mechanism, and to easily remove dust and the like adhering to the outer surface side of the dustproof member. It is possible to configure a digital camera having a lens interchangeable form.

By the way, there are various kinds of adhesion factors, such as those adhering due to static electricity and those adhering not due to static electricity, and the size of the adhering dust varies in size.

The present invention has been made in view of the above points, and has as its object to provide a vibrating device for removing dust or the like adhering to the surface of a dustproof member provided inside a camera. Camera with means for preventing dust and the like from adhering to dust-proof members and the like, regardless of the factors and size of the dust, etc. An object of the present invention is to provide a camera and an image sensor unit used for the camera.

[0016]

In order to achieve the above object, a camera according to a first aspect of the present invention comprises an image pickup device for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface, and a disk as a whole. A transparent part is formed at least in a region radially extending from its own center in the shape of a polygonal or polygonal plate, and this transparent part is disposed facing the front surface of the image sensor at a predetermined interval. Dustproof member, and a vibration member arranged on the periphery of the dustproof member to apply vibration to the dustproof member, and a portion where both the image sensor and the dustproof member are formed to face each other, A sealing structure configured to seal the space at a peripheral side of the image sensor and the dustproof member so as to form a substantially sealed space; and forming an image on a photoelectric conversion surface of the image sensor. Obtained from the image sensor as corresponding to the It comprises an image signal processing circuit for converting the image signal to a signal form compatible to the recording, and
At least the surface of the dustproof member opposite to the image sensor is surface-treated with an antistatic agent.

According to a second aspect of the present invention, in the camera of the first aspect, the antistatic agent is a transparent conductive film. According to a third invention, in the camera according to the second invention, the transparent conductive film is one of a metal transparent conductive film and an oxide semiconductor transparent conductive film.

According to a fourth aspect, in the camera according to the second aspect, the transparent conductive film is a film containing any one of tin oxide, indium oxide, cadmium tin oxide, Au, and Ag as a main component. It is characterized by the following.

According to a fifth aspect of the present invention, in the camera according to the first aspect, the vibrating member is an electromechanical transducer. According to a sixth aspect of the present invention, in the camera of the first aspect, a photographic lens mounting portion for mounting a photographic lens is provided.

According to a seventh aspect of the present invention, there is provided an image pickup device unit which opposes an image pickup device for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface at a predetermined interval on the front side of the image pickup device. An optical member provided, a vibrating member disposed on a peripheral portion of the optical member for applying vibration to the optical member, and a portion where both the imaging element and the optical member are formed to face each other. A sealing structure configured to seal the space at a peripheral side of the imaging element and the optical member to form a substantially sealed space, at least one of the optical members The opposite surface of the image sensor is surface-treated with an antistatic agent.

According to an eighth aspect, in the imaging device unit according to the seventh aspect, the antistatic agent is a transparent conductive film. According to a ninth aspect, in the imaging device unit according to the eighth aspect, the transparent conductive film is one of a metal transparent conductive film and an oxide semiconductor transparent conductive film.

According to a tenth aspect, in the imaging device unit according to the eighth aspect, the transparent conductive film is a film containing tin oxide, indium oxide, cadmium tin oxide, Au, or Ag as a main component. It is characterized by being.

According to an eleventh aspect, in the imaging element unit according to the seventh aspect, the vibration member is an electromechanical transducer.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the illustrated embodiments. First, a schematic configuration of the camera according to the first embodiment of the present invention will be described below.

FIG. 1 and FIG. 2 are diagrams showing a schematic configuration of a camera according to a first embodiment of the present invention. FIG. FIG. 2 is a schematic perspective view, and FIG. 2 is a block diagram schematically showing a main electric configuration of the camera.

The camera 1 of this embodiment comprises a camera body 11 and a lens barrel 12 which are separately provided, and both (11 and 12) are configured to be detachable from each other. is there.

The lens barrel 12 has a photographing optical system 12a comprising a plurality of lenses and a driving mechanism for the lenses, and is held therein. The photographing optical system 12a transmits, for example, a light beam from the subject so that an image of the subject formed by the subject light beam is formed at a predetermined position (on a photoelectric conversion surface of an image sensor 27 described later). It is constituted by a plurality of optical lenses and the like. The lens barrel 12 is disposed so as to protrude toward the front of the camera body 11.

As the lens barrel 12, the same lens barrel as that generally used in a conventional camera or the like is applied. Therefore, description of the detailed configuration is omitted.

The camera body 11 is provided with various components therein and is a connecting member for detachably mounting the lens barrel 12 holding the photographing optical system 12a. This is a so-called single-lens reflex camera having a photographing optical system mounting portion 11a provided on the front surface thereof.

That is, an exposure opening having a predetermined aperture capable of guiding a subject light beam to the inside of the camera main body 11 is formed at a substantially central portion on the front side of the camera main body 11. The photographing optical system mounting portion 11
a is formed.

On the outer surface side of the camera main body 11, the above-mentioned photographing optical system mounting portion 11a is disposed on the front surface thereof, and the camera main body 11 is provided at a predetermined position such as an upper surface portion or a rear surface portion.
There are provided various operation members for operating the camera, for example, a release button 17 for generating an instruction signal for starting a photographing operation and the like. Since these operating members are not directly related to the present invention, the release button 17 is used to avoid complication of the drawing.
Illustration and description of other operation members are omitted.

As shown in FIG. 1, various constituent members, for example, a desired subject image formed by the photographing optical system 12a are captured inside the camera body 11 by the image pickup device 27 (FIG. 2).
Finder device 13 which is provided so as to be formed at a predetermined position different from the position on the photoelectric conversion surface, and which constitutes a so-called observation optical system, and controls the irradiation time of the subject light beam to the photoelectric conversion surface of the image sensor 27 and the like. A shutter unit 14 having a shutter mechanism and the like; an image sensor 27 that includes the shutter unit 14 and obtains an image signal corresponding to a subject image formed based on a subject light beam transmitted through the photographing optical system 12a; An assembly including a dustproof filter 21 (which will be described later in detail) which is a dustproof member or an optical member disposed at a predetermined position on the front side of the photoelectric conversion surface to prevent dust and the like from adhering to the photoelectric conversion surface. An imaging unit 15 and an image signal processing circuit 16 for performing various signal processing on the image signal acquired by the imaging device 27
a (see FIG. 2), a plurality of circuit boards including a main circuit board 16 on which various electric members constituting an electric circuit are mounted (only the main circuit board 16 is shown in FIG. 1);
And the like are arranged at predetermined positions.

The finder device 13 includes the photographing optical system 12
a reflecting mirror 13b configured to bend the optical axis of the subject light beam that has passed through a and guide it toward the observation optical system, and a pentaprism that receives the light beam emitted from the reflecting mirror 13b and forms an erect erect image 13a and the pentaprism 1
An eyepiece 13c for forming an image in an optimal form for magnifying and observing the image formed by 3a is formed.

The reflecting mirror 13b is configured to be movable between a position retracted from the optical axis of the photographing optical system 12a and a predetermined position on the optical axis.
On the optical axis 2a, it is arranged at a predetermined angle with respect to the optical axis, for example, at an angle of 45 degrees. This allows
When the camera 1 is in the normal state, the optical axis of the subject light beam transmitted through the imaging optical system 12a is bent by the reflecting mirror 13b to the pentaprism 13a disposed above the reflecting mirror 13b. It is designed to be reflected.

On the other hand, while the camera 1 is performing the photographing operation, and during the actual exposure operation, the reflecting mirror 13b
Moves to a predetermined position retracted from the optical axis of the photographing optical system 12a. As a result, the subject light beam is guided toward the image sensor 27 and irradiates the photoelectric conversion surface.

As the shutter unit 14, for example, a shutter mechanism of a focal plane system, a drive circuit for controlling the operation of the shutter mechanism, and the like similar to those generally used in conventional cameras and the like are applied. .
Therefore, description of the detailed configuration is omitted.

As described above, a plurality of circuit boards are provided inside the camera 1 to constitute various electric circuits. As shown in FIG. 2, the electrical configuration of the camera 1 is suitable for recording based on, for example, a CPU 41 which is a control circuit for totally controlling the camera 1 and an image signal acquired by the image sensor 27. Image signal processing circuit 16a for performing various signal processing such as signal processing for converting into a signal of a form to be processed, and temporarily storing image signals and image data processed by the image signal processing circuit 16a and various information associated therewith. Memory 16b for temporarily recording, a recording medium 43 for recording image data for recording in a predetermined form generated by the image signal processing circuit 16a in a predetermined area, and an electrical connection between the recording medium 43 and the camera 1. A recording medium interface 42 configured to electrically connect a circuit, and a liquid crystal display (LC) for displaying an image.
D) and the like, and the display unit 46 and the camera 1 are electrically connected to each other, and the image signal processing circuit 16a
A display circuit 47 that receives the processed image signal and generates an optimal display image signal to be displayed on the display unit 46; a battery 45 including a secondary battery such as a dry battery;
Upon receiving power from an external power supply (AC) supplied by the battery 45 or a predetermined connection cable or the like (not shown),
A power supply circuit 44 that controls the camera 1 so as to be suitable for operation and distributes power to each electric circuit;
Circuit for driving the dustproof filter 21 included in the dustproof filter drive unit 4 including an oscillator and the like.
8 mag.

Next, details of the image pickup unit 15 in the camera 1 of the present embodiment will be described below. Fig. 3.
4 and 5 are views showing a part of the image pickup unit in the camera 1 of the present embodiment, and FIG. 3 is an exploded perspective view of a main part showing the image pickup unit in an exploded manner. FIG. 4 is a perspective view showing a part of the imaging unit in an assembled state, which is cut away. FIG. 5 is a cross-sectional view along the cut surface of FIG.

The image pickup unit 15 of the camera 1 according to the present embodiment is a unit constituted by a plurality of members including the shutter section 14 as described above. The illustration of the shutter unit 14 is omitted in the figure. In addition, in order to show the positional relationship between the components, in FIGS. 3 to 5, provided near the imaging unit 15, the imaging element 27 is mounted, and the image signal processing circuit 16 a and the work memory 16 b are provided. FIG. 2 also shows a main circuit board 16 on which an electric circuit of an imaging system composed of an image pickup system is mounted. Note that the details of the main circuit board 16 itself are applied to those generally used in conventional cameras and the like, and description thereof is omitted.

The image pickup unit 15 is composed of a CCD or the like, transmits an image through the photographing optical system 12a, and obtains an image signal corresponding to light irradiated on its own photoelectric conversion surface, and fixedly supports the image pickup element 27. An image pickup element fixing plate 28 made of a thin plate-like member, and an optical element arranged on the side of the photoelectric conversion surface of the image pickup element 27 and formed to remove a high-frequency component from a subject light beam transmitted through the imaging optical system 12a and irradiated. An optical low-pass filter (hereinafter, referred to as an optical LPF) 25 which is an element, and a low-pass filter which is disposed at a peripheral portion between the optical LPF 25 and the image sensor 27 and is formed by a substantially frame-shaped elastic member or the like. The filter receiving member 26 and the image pickup device 27 are housed and fixedly held, and the optical LPF 25 (optical device) is closely adhered to the peripheral portion or the vicinity thereof to be supported. One predetermined dustproof filter described later part of receiving member 23 (described later first member) tightly imaging device is arranged to be in contact storage case member 24
(A second member to be described later; hereinafter, referred to as a CCD case 24), and a dust-proof filter disposed on the front side of the CCD case 24 and supporting the dust-proof filter 21 (dust-proof member) in close contact with a peripheral portion or a portion in the vicinity thereof. Receiving member 23
(First member), and the optical LPF 25 supported by the dust-proof filter receiving member 23 on the side of the photoelectric conversion surface of the image sensor 27 and on the front side of the optical LPF 25.
A dust-proof filter 21 which is a dust-proof member disposed opposite to a predetermined position having a predetermined distance between the dust-proof filter 21 and a peripheral portion of the dust-proof filter 21 to apply a predetermined vibration to the dust-proof filter 21. A piezoelectric element 22 composed of, for example, an electromechanical transducer, and a pressing member 2 composed of an elastic body that hermetically joins and holds the dustproof filter 21 to a dustproof filter receiving member 23.
0 or the like.

The image sensor 27 receives the subject light beam transmitted through the photographing optical system 12a on its own photoelectric conversion surface and performs a photoelectric conversion process, thereby generating an image signal corresponding to the subject image formed on the photoelectric conversion surface. To get,
For example, a charge coupled device (CCD; Charge Coupled Device)
ce) has been applied.

The image pickup device 27 includes an image pickup device fixing plate 28
And is mounted at a predetermined position on the main circuit board 16 via the. As described above, the image signal processing circuit 16a and the work memory 16b are mounted on the main circuit board 16, and the output signal from the image sensor 27, that is, the image signal obtained by the photoelectric conversion Processing circuit 16a
And so on.

The signal processing performed by the image signal processing circuit 16a includes, for example, the photographing optical system mounting section 11a
The image signal obtained from the image sensor 27 is recorded as corresponding to the image formed on the photoelectric conversion surface of the image sensor 27 by the photographing optical system 12a held inside the lens barrel 12 attached to the lens barrel 12. And various kinds of signal processing, such as processing for converting into a signal of a form conforming to. Such signal processing is the same as the processing normally performed in a general digital camera or the like configured to handle electronic image signals. Therefore, a detailed description of various signal processes performed in the camera 1 will be omitted.

On the front side of the image sensor 27, an optical LPF 25 is disposed with a low-pass filter receiving member 26 interposed therebetween. Then, a CCD case 24 is provided so as to cover this.

That is, the CCD case 24 is provided with a rectangular opening 24c substantially at the center thereof, and the optical LPF 25 and the image pickup device 27 are arranged in the opening 24c from the rear side. Has become. This opening 2
As shown in FIGS. 4 and 5, a step portion 24a having a substantially L-shaped cross section is formed on the inner peripheral edge portion on the rear side of 4c.

As described above, the low-pass filter receiving member 26 made of an elastic member or the like is provided between the optical LPF 25 and the image pickup device 27. The low-pass filter receiving member 26 is disposed at a position on the front edge of the imaging device 27 that avoids the effective range of the photoelectric conversion surface, and is in contact with the vicinity of the rear edge of the optical LPF 25. I have. The airtightness between the optical LPF 25 and the imaging device 27 is maintained. As a result, the optical LPF 25 receives an elastic force in the optical axis direction by the low-pass filter receiving member 26.

Therefore, the peripheral edge of the front side of the optical LPF 25 is disposed so as to be substantially airtightly contacted with the step portion 24a of the CCD case 24, so that the optical LPF 25 is provided.
Of the optical LPF 2 against the elastic force of the low-pass filter receiving member 26 for displacing the optical LPF 2 in the optical axis direction.
5 is restricted in the optical axis direction.

In other words, the opening 24 of the CCD case 24
The position of the optical LPF 25 inserted from the back side into the inside of c is regulated in the optical axis direction by the step portion 24a. Thus, the optical LPF 25 is prevented from falling out from the inside of the CCD case 24 toward the front side.

After the optical LPF 25 is inserted into the opening 24c of the CCD case 24 from the rear side as described above, the image sensor 27 is disposed on the rear side of the optical LPF 25. In this case, the optical LP
A low-pass filter receiving member 26 is sandwiched between the F25 and the imaging element 27 at the peripheral edge.

The image sensor 27 is mounted on the main circuit board 16 with the image sensor fixing plate 28 interposed therebetween as described above. The image sensor fixing plate 28 is connected to the CCD case 2.
4 is fixed to the screw hole 24e from the back side by a screw 28b via a spacer 28a. The main circuit board 16 is provided on the image sensor fixing plate 28 with a spacer 16c.
And is fixed by a screw 16d.

On the front side of the CCD case 24, a dust-proof filter receiving member 23 is provided with a screw hole 24b of the CCD case 24.
Are fixed by screws 23b. In this case, a peripheral groove 24d is formed in a substantially annular shape at a predetermined position on the peripheral side and the front side of the CCD case 24, as shown in detail in FIGS. On the other hand, an annular convex portion 23d (not shown in FIG. 3) corresponding to the peripheral groove 24d of the CCD case 24 is entirely provided at a predetermined position on the peripheral side and the rear side of the dust-proof filter receiving member 23. It is formed in a substantially annular shape over the circumference. Therefore, by fitting the annular convex portion 23d and the circumferential groove 24d, CC
The D case 24 and the dust-proof filter receiving member 23 are substantially airtightly fitted to each other in an annular region, that is, in a region where the circumferential groove 24d and the annular convex portion 23d are formed.

The dustproof filter 21 has a circular or polygonal plate shape as a whole, and at least a region having a predetermined spread in a radial direction from its own center forms a transparent portion.
The transparent portion is disposed facing the front surface of the optical LPF 25 with a predetermined interval.

Further, on a peripheral portion of one surface (the back side in this embodiment) of the dustproof filter 21, a predetermined vibration member for applying vibration to the dustproof filter 21 is provided. Piezoelectric element 2 formed by
2 are arranged by, for example, means such as sticking with an adhesive so as to be integrated. The piezoelectric element 22 is configured to generate a predetermined vibration in the dust-proof filter 21 by applying a predetermined driving voltage from the outside.

The dustproof filter 21 is fixed and held by a pressing member 20 made of an elastic body such as a leaf spring so as to be airtightly joined to the dustproof filter receiving member 23.

In the vicinity of substantially the center of the dust filter receiving member 23, a circular or polygonal opening 23f is provided. The opening 23f is set to have a size large enough to allow the light beam of the subject transmitted through the photographing optical system 12a to pass therethrough and irradiate the photoelectric conversion surface of the image sensor 27 disposed behind. .

A wall 23e (see FIGS. 4 and 5) protruding toward the front side is formed in a substantially annular shape at the periphery of the opening 23f. The receiving portion 23c is formed so as to protrude toward.

On the other hand, a plurality (three in this embodiment) of projecting portions 23a are formed at predetermined positions near the outer peripheral edge of the front side of the dust-proof filter receiving member 23 so as to protrude toward the front side. Have been. The protruding portion 23a is a portion formed for fixing the pressing member 20 for fixing and holding the dustproof filter 21, and the pressing member 20 is provided with a screw 20a or the like with respect to the tip of the protruding portion 23a. Are fixed by the fastening means.

The pressing member 20 is a member formed of an elastic body such as a leaf spring as described above, and has a base end fixed to the protruding portion 23 a and a free end formed on the outer peripheral edge of the dustproof filter 21. By contacting the portion, the dust filter 21 is pressed toward the dust filter receiving member 23, that is, in the optical axis direction.

In this case, a predetermined portion of the piezoelectric element 22 disposed on the outer peripheral edge on the back side of the dustproof filter 21 abuts on the receiving portion 23c, so that the optical axis of the dustproof filter 21 and the piezoelectric element 22 is reduced. The position in the direction is regulated. Accordingly, the dustproof filter 21 is thereby fixed and held so as to be airtightly joined to the dustproof filter receiving member 23 via the piezoelectric element 22.

In other words, the dust filter receiving member 23
Is configured to be airtightly joined to the dustproof filter 21 and the piezoelectric element 22 by the urging force of the pressing member 20.

By the way, as described above, the dust-proof filter receiving member 23 and the CCD case 24 are so arranged that the circumferential groove 24d and the annular convex portion 23d (see FIGS. 4 and 5) are substantially airtightly fitted to each other. At the same time, the dust-proof filter receiving member 23 and the dust-proof filter 21
Are hermetically joined via the piezoelectric element 22 by the biasing force of The optical LPF 25 provided in the CCD case 24 is provided so as to be substantially airtight between the peripheral portion on the front side of the optical LPF 25 and the step portion 24 a of the CCD case 24. Further, on the rear side of the optical LPF 25, an image sensor 27 is disposed via a low-pass filter receiving member 26, so that substantially airtightness is maintained even between the optical LPF 25 and the image sensor 27. ing.

Accordingly, a predetermined gap 51a is formed in the space between the optical LPF 25 and the dustproof filter 21. Also, the optical LPF 25
, The CCD case 24, the dust-proof filter receiving member 23 and the dust-proof filter 21
b is formed. This space 51b is provided with an optical LPF.
This is a sealed space formed so as to protrude outside the outside 25 (see FIGS. 4 and 5). The space 51b is set to be a space larger than the space 51a. The space formed by the gap 51a and the space 51b is formed by the CCD case 24, the dust-proof filter receiving member 23, the dust-proof filter 21, and the optical
A sealing space 51 that is substantially airtightly sealed by the PF 25
It has become.

As described above, in the imaging unit 15 of the camera according to the present embodiment, the sealing structure portion which forms the substantially sealed space 51 including the gap 51a formed on the periphery of the optical LPF 25 and the dustproof filter 21 is formed. It is configured. The sealing structure is provided at a position outside the periphery of the optical LPF 25 or its vicinity.

Further, in the present embodiment, the dust-proof filter receiving member 23, which is the first member, which supports the dust-proof filter 21 in close contact with the peripheral portion or the vicinity thereof.
And a second portion disposed so as to closely contact the optical LPF 25 with its peripheral portion or a portion in the vicinity thereof, and to closely contact the dustproof filter receiving member 23 (first member) at its own predetermined portion. A sealing structure is constituted by the CCD case 24 and the like as members.

In the camera of the present embodiment configured as described above, the dust filter 21 is disposed at a predetermined position on the front side of the image sensor 27 so as to oppose the photoelectric conversion surface of the image sensor 27 and the dust filter 21. The configuration in which the sealing space 51 formed on the peripheral edge is sealed prevents dust and the like from adhering to the photoelectric conversion surface of the imaging element 27.

In this case, with respect to dust and the like adhering to the exposed surface on the front side of the dustproof filter 21, the periodic voltage is applied to the piezoelectric element 22 which is disposed integrally with the periphery of the dustproof filter 21. Is applied to apply a predetermined vibration to the dustproof filter 21 to remove it.

FIG. 6 is a front view showing only the dustproof filter 21 and the piezoelectric element 22 provided integrally with the dustproof filter 21 of the image pickup unit 15 of the camera 1.
7 and 8 show the dust filter 21 and the piezoelectric element 2 when a driving voltage is applied to the piezoelectric element 22 of FIG.
FIG. 7 is a sectional view taken along line AA of FIG. 6, and FIG. 8 is a sectional view taken along line BB of FIG.

Here, for example, when a negative (minus;-) voltage is applied to the piezoelectric element 22, the dustproof filter 21
Is deformed as shown by the solid line in FIGS. 7 and 8, while when a positive (plus; +) voltage is applied to the piezoelectric element 22, the dustproof filter 21 is deformed as shown by the dotted line in FIG. Will be.

In this case, reference numeral 21 in FIGS.
Since the amplitude is substantially zero at the position of the node of the vibration as indicated by a, the receiving portion 23c of the dust-proof filter receiving member 23 is set to abut on a portion corresponding to the node 21a. Thereby, the dustproof filter 21 can be efficiently supported without hindering the vibration.

In this state, the dust-proof filter drive section 48 is controlled at a predetermined time, and a periodic voltage is applied to the piezoelectric element 22 to thereby control the dust-proof filter 2.
1 vibrates, and dust and the like attached to the surface of the dustproof filter 21 are removed.

The resonance frequency at this time is determined by the shape, plate thickness, material and the like of the dustproof filter 21. In the examples shown in FIGS. 6 to 8 described above, the case where the primary vibration is generated is shown. However, the present invention is not limited to this, and higher-order vibration may be generated.

In another example shown in FIGS. 9 to 11, FIGS.
FIG. 10 shows a case where secondary vibration is generated in a dust filter having exactly the same configuration as the example shown in FIG. 8. In this case, FIG. 9 is a front view showing only the dustproof filter 21 and the piezoelectric element 22 provided integrally with the dustproof filter 21 in the imaging unit 15 of the camera 1 as in FIG. 10 and 11 show the state change of the dustproof filter 21 and the piezoelectric element 22 when applied to the piezoelectric element 22 of FIG. 9, and FIG. 10 is a cross-sectional view taken along the line AA of FIG. FIG. 11 is a sectional view taken along the line BB of FIG.

Here, for example, when a negative (minus;-) voltage is applied to the piezoelectric element 22, the dustproof filter 21
Is deformed as shown by a solid line in FIGS. 10 and 11, while when a positive (plus; +) voltage is applied to the piezoelectric element 22, the dustproof filter 21 is deformed as shown by a dotted line in FIG. Will be.

In this case, as shown by reference numerals 21a and 21b in FIGS. 9 to 11, there are two pairs of nodes in this vibration, but the dust-proof filter receiving member 23 has a pair of nodes corresponding to the nodes 21a. By setting the portion 23c to abut, as in the example shown in FIGS. 6 to 8 described above,
The dust filter 21 can be efficiently supported without hindering vibration.

In this state, the dust-proof filter drive section 48 is controlled at a predetermined time, and a periodic voltage is applied to the piezoelectric element 22 to thereby control the dust-proof filter 2.
1 vibrates, and dust and the like attached to the surface of the dustproof filter 21 are removed.

When the primary vibration is generated as shown in FIGS. 6 to 8, the sealed space 51 changes in volume due to the amplitude of the dust filter 21 due to the amplitude indicated by the symbol C. Become. On the other hand, when the secondary vibration is generated as shown in FIGS. 9 to 11, the volume change of the sealed space 51 caused by the amplitude of the dust filter 21 is changed from the area indicated by the reference sign D1 to the area indicated by the reference sign D2. X2 minus (D1- (D2x2)).

The smaller the change in volume with respect to the sealed space 51, the smaller the change in internal pressure inside the sealed space 51. Therefore, it can be seen that the smaller the change in volume of the sealed space 51, the more efficient vibration can be obtained. . Therefore, in terms of the efficiency of the electromechanical conversion, it is considered that it is desirable to set the generated vibration to a higher order.

The surface of the dustproof filter 21 of the camera according to the present embodiment is surface-treated with an antistatic agent. As the antistatic agent, a transparent conductive film used for an optical system is applied. As this transparent conductive film, gold (Au)
A metal transparent conductive film made of a metal thin film such as silver (Ag) and platinum (Pt) and an oxide semiconductor transparent conductive film such as tin oxide, indium oxide, indium tin oxide, zinc oxide and cadmium tin oxide are included. is there. The former has difficulty in transparency and film strength. Therefore, in the optical field, the latter oxide semiconductor transparent conductive film is mainly used.

As a method for forming the above-mentioned metal transparent conductive film, there are a sputtering method and a vacuum evaporation method. Examples of the method for forming a tin oxide film include a spray method, a vapor phase reaction method (CVD), a vacuum evaporation method, and a sputtering method. Examples of a film forming method of indium oxide or indium tin oxide include a spray method, a vapor phase reaction method (CVD), a coating method such as a dipping method, a spinner method, and a spraying method, a vacuum evaporation method, and a sputtering method. Furthermore, as a method of forming cadmium tin oxide, there are a spray method, a sputtering method, and the like.

Such a surface treatment may be performed on at least the surface of the dustproof filter 21 opposite to the image pickup device 27 (the surface on the side of the photographing optical system 12a), or may be performed on both surfaces. By performing the surface treatment on both surfaces, it is not necessary to consider the directionality of the dust-proof filter 21, so that troublesome work at the time of assembling and manufacturing becomes unnecessary. When a thin film is formed by a dipping method, it is inevitably formed on both sides.

As described above, according to the first embodiment, the piezoelectric element 22 (vibration member) disposed on the peripheral portion of the dust filter 21 (dust member or optical member).
Thus, in addition to removing dust and the like attached to the dustproof filter 21 by applying vibration to the dustproof filter 21, at least the opposite surface of the dustproof filter 21 opposite to the image sensor is subjected to a surface treatment with an antistatic agent. Therefore, regardless of the factor or size of the adhesion of the dust and the like, the adhesion of the dust and the like is reduced, and the dust and the like can be removed by the slight vibration of the piezoelectric element 22 when the dust and the like adhere.

In each of the embodiments described above, the case of a camera of a type in which the image pickup optical system is detachable is described in detail, but the idea of the present invention is that this type is essential. is not.

[0083]

As described above, according to the present invention, in a camera, especially a digital camera, it is possible to completely prevent dust and the like from adhering to the photoelectric conversion surface of the image pickup device and to seal the image pickup device. Further, it is possible to provide a camera configured to reliably remove dust and the like attached to the outer surface of the dustproof member to be protected.

[Brief description of the drawings]

FIG. 1 is a perspective view schematically showing an internal configuration of a camera according to a first embodiment of the present invention by cutting a part of the camera.

FIG. 2 is a block diagram schematically showing a main electric configuration of the camera shown in FIG. 1;

3 is an exploded perspective view of a main part of the camera shown in FIG. 1, in which a part of an image pickup unit is taken out and shown.

FIG. 4 is a perspective view showing a part of the camera shown in FIG. 1 in an assembled state of an imaging unit.

FIG. 5 is a cross-sectional view along a cut surface of FIG. 4;

6 is a front view showing only a dustproof filter and a piezoelectric element provided integrally with the dustproof filter out of the image pickup unit in the camera of FIG. 1;

7 shows a state change of the dustproof filter and the piezoelectric element when applied to the piezoelectric element of FIG. 6;
Sectional view along the line.

8 shows a state change of the dustproof filter and the piezoelectric element when applied to the piezoelectric element of FIG. 6, and FIG.
Sectional view along the line.

9 is a front view showing only a dustproof filter and a piezoelectric element provided integrally with the dustproof filter out of the image pickup unit in the camera of FIG. 1;

FIG. 10 is a cross-sectional view taken along line AA of FIG. 9, showing another example of a state change of the dust-proof filter and the piezoelectric element when applied to the piezoelectric element of FIG. 9;

11 is a cross-sectional view taken along the line BB of FIG. 9 showing another example of a state change of the dustproof filter and the piezoelectric element when the state is applied to the piezoelectric element of FIG. 9;

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Camera 11 ... Camera body part 11a ... Shooting optical system mounting part 12 ... Lens barrel 12a ... Shooting optical system (shooting lens) 13 ... Finder device 13a ... Pentagon prism 13b ... Reflection mirror 13c ... Eyepiece lens 14 Shutter section 15, 15A, 15B Image pickup unit 16 Main circuit board 17 Release button 20 Pressing member 21 Dustproof filter (dustproof member) 22 Piezoelectric element Vibration member) 23 Dustproof filter receiving member 24 CCD case (Imaging element storage case member) 25 Optical low-pass filter (Optical LPF; Optical element) 26 Low-pass filter receiving member 27 Image sensor ( CCD) 28 ... Imaging element fixing plate 48 ... Dustproof filter drive unit

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) H01L 41/09 H01L 27/14 D // H04N 101: 00 41/08 U F term (reference) 2H083 AA01 AA19 AA26 AA32 2H100 CC07 EE06 4M118 AA08 AA10 AB01 BA10 GC20 HA20 HA24 5C022 AA13 AB39 AC42 AC44 AC54 AC66 AC74 AC77 AC78

Claims (11)

[Claims] 1. An image pickup device for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface, and a disc-shaped or polygonal plate as a whole having a predetermined spread in a radial direction from at least its own center A region having a transparent portion, the transparent portion is disposed on the front side of the image sensor at a predetermined interval facing a dust-proof member, and disposed on a peripheral portion of the dust-proof member. A vibrating member for applying vibration, and a peripheral side of the image sensor and the dustproof member to form a substantially closed space at a portion where both the image sensor and the dustproof member are formed to face each other. A sealing structure configured to seal the space portion, and recording an image signal obtained from the image sensor as corresponding to an image formed on the photoelectric conversion surface of the image sensor. Image signal processing circuit for converting to a signal of suitable form It includes a, the opposite surface of at least the image pickup device of the dust-screening member, a camera, characterized in that it is surface treated with an antistatic agent. 2. The camera according to claim 1, wherein the antistatic agent is a transparent conductive film. 3. The camera according to claim 2, wherein the transparent conductive film is one of a metal transparent conductive film and an oxide semiconductor transparent conductive film. 4. The camera according to claim 2, wherein the transparent conductive film is a film mainly containing any of tin oxide, indium oxide, cadmium tin oxide, Au, and Ag. 5. The camera according to claim 1, wherein the vibration member is an electromechanical conversion element. 6. The camera according to claim 1, further comprising a photographic lens mounting portion for mounting a photographic lens. 7. An image sensor for obtaining an image signal corresponding to light irradiated on its own photoelectric conversion surface, an optical member disposed opposite to the front surface of the image sensor at a predetermined interval, and A vibrating member disposed on a peripheral portion of the optical member for applying vibration to the optical member, and a substantially sealed space in a portion where both the image pickup element and the optical member are formed to face each other And a sealing structure configured to seal the space at the peripheral side of the imaging element and the optical member, so that at least the opposite surface of the optical member opposite to the imaging element, An imaging device unit, which is surface-treated with an antistatic agent. 8. The imaging device unit according to claim 7, wherein the antistatic agent is a transparent conductive film. 9. The imaging device unit according to claim 8, wherein the transparent conductive film is one of a metal transparent conductive film and an oxide semiconductor transparent conductive film. 10. The transparent conductive film is a film containing any one of tin oxide, indium oxide, cadmium tin oxide, Au, and Ag as a main component.
2. The image sensor unit according to item 1. 11. The imaging device unit according to claim 7, wherein the vibration member is an electromechanical conversion device.