JP2003347333A - Semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent faulty short circuit between bumps formed on a semiconductor chip. <P>SOLUTION: Shapes of the bumps formed on the semiconductor chip are formed so as to comprise line segments except vertical or parallel line segments with respect to segments constituting the profile of the semiconductor chip whereby a space between projected electrodes is increased. For example, the shapes of the bumps 5 formed on the semiconductor chip 4 are formed specified into triangles and the bumps 5 are arranged so that the vertexes of triangles are inverted alternately between adjacent bumps 5. Accordingly to this method, the adjacent bumps 5 are arranged in one row while converting the shapes of the bumps so that a triangle, an inverted triangle, a triangle and so on are arrayed in one row. <P>COPYRIGHT: (C)2004,JPO

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a technology effective when applied to a semiconductor device having densely arranged protruding electrodes.

[0002]

2. Description of the Related Art In semiconductor chip mounting technology, bumps, which are protruding electrodes, have been actively used.

[0003] As a mounting technique using a bump, a flip chip bonding technique in which a bump provided on a semiconductor chip and an electrode of a substrate are directly opposed to each other and aligned and adhered to each other, and heat and pressure are applied for bonding, TAB (Tape Automated Bonding) for mounting semiconductor chips with bumps face down on flexible film substrates
And TCP (Tape Carrier Package) technology are known.

[0004]

In the above-mentioned technique, in order to increase the wiring density of the substrate, the size of the bumps provided on the semiconductor chip is reduced and the bumps are densely arranged. .

[0005] However, when the bumps are densely arranged, there is a problem that a short-circuit failure easily occurs between adjacent bumps due to the deformation of the bumps generated when the semiconductor chip is mounted on the substrate.

Another problem is that conductive foreign matter adheres to the bumps provided on the semiconductor chip, and short-circuiting occurs between adjacent bumps via the foreign matter.

In particular, the number of input / output terminals of a liquid crystal driver is extremely large, and accordingly, the distance between bumps is extremely reduced. For this reason, there is a problem in that short-circuit defects are likely to occur due to deformation of bumps and adhesion of conductive foreign matter generated when the semiconductor chip is mounted on the substrate.

An object of the present invention is to provide a technique in which short-circuit failure is unlikely to occur between adjacent bumps even if the bumps are densely arranged.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0010]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

The present invention includes a semiconductor chip provided with a protruding electrode, and the outer shape of the protruding electrode includes a line segment other than a line segment perpendicular or parallel to a line segment constituting the outer shape of the semiconductor chip. Is what it is.

[0012]

Embodiments of the present invention will be described below in detail with reference to the drawings. In all the drawings for describing the embodiments, components having the same function are denoted by the same reference numerals, and repeated description thereof will be omitted.

(Embodiment 1) The semiconductor device of Embodiment 1 is a chip-on-film (Chip On Film) comprising a film substrate serving as a relay substrate (interposer) and a semiconductor chip mounted on the film substrate. ; C
This is a liquid crystal driver having an OF) structure, for example, mounted on a liquid crystal substrate of a personal computer or a mobile communication terminal and used.

FIG. 1 is a perspective view showing a film substrate 1 on which a semiconductor chip is mounted.

A film substrate 1 has a lead 3 made of copper (Cu) on one surface of an insulating film 2 made of a polyimide resin.
Is formed, and has a semiconductor chip mounting area A in which a semiconductor chip is mounted substantially in the center.

FIG. 2 is a plan view showing the semiconductor chip 4 mounted on the film substrate 1. FIG. 3 is an enlarged view in which the periphery of one long side of the semiconductor chip 4 is enlarged.

The semiconductor chip 4 is formed of a single crystal silicon substrate, and a liquid crystal driving circuit (not shown) is formed on a main surface thereof. As shown in FIG. 2, bumps 5 (protruding electrodes), which are protruding electrodes, are provided on the periphery of the main surface of the semiconductor chip 4. Direction).

FIG. 4 is a perspective view showing a state where the semiconductor chip 4 is mounted on the film substrate 1 on which the leads 3 are formed.

The semiconductor chip 4 is mounted on the semiconductor chip mounting area A of the film substrate 1, and the individual bumps 5 formed on the semiconductor chip 4 are connected to the corresponding leads 3 on the film substrate 1. It is connected.

In the semiconductor chip 4, a liquid crystal drive circuit and input / output terminals are formed in a chip region partitioned on a semiconductor wafer by using a well-known semiconductor manufacturing technique, and the bumps are formed on the formed input / output terminals. After the formation, the semiconductor wafer is diced to singulate the chip region to produce a chip.

Bump 5 formed on semiconductor chip 4
Has a triangular shape as shown in FIGS. 2 and 3,
The triangles are arranged such that the vertices of the triangle are upside down between the adjacent bumps 5. That is, the adjacent bumps 5 are arranged in a line while alternately inverting the shape, such as a triangle, an inverted triangle, and a triangle.

The bumps 5 are formed on input / output terminals (bonding pads) of the semiconductor chip 4 by a method such as electrolytic plating, electroless plating, evaporation or sputtering.

The following is a comparison between the space between the triangular bumps 5 and the space between the rectangular bumps.

FIG. 14 is a diagram studied by the present inventor and shows the semiconductor chip 101 mounted on the liquid crystal driver. FIG. 15 is an enlarged view in which the periphery of one long side of the semiconductor chip 101 is enlarged.

Bump 1 formed on semiconductor chip 101
02 has a rectangular shape and is formed in a line along the x-axis direction and the y-axis direction.

Assuming that the pitch between the rectangular bumps 102 in the x-axis direction is P and the length of the bumps 102 in the x-axis direction is a, the space between the adjacent bumps 102 is P-a
It becomes.

On the other hand, the pitch in the x-axis direction between the triangular bumps 5 shown in FIG. 3 is set to P, which is the same as the pitch between the above-mentioned rectangular bumps 102, and the length of the base of the triangular bump is a. Then, the space between adjacent bumps 5 is Pa / 2.

Accordingly, it can be seen that the space between the triangular bumps 5 shown in FIG. 3 is larger by a / 2 than the space between the rectangular bumps 102 shown in FIG.

As described above, by forming the shape of the bumps 5 so as to include triangles, that is, lines other than lines perpendicular or parallel to the lines constituting the outer shape of the semiconductor chip 4, the bumps 5 between the adjacent bumps 5 can be formed. Space can be increased. For this reason, short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of the bump 5 when the semiconductor chip 4 is mounted on the film substrate 1 can be prevented. Therefore, the yield of the liquid crystal driver can be improved, and the reliability can be improved.

The area of the triangular bump 5 itself shown in FIG. 3 is a × b / 2, where a is the base length (x-axis direction) and b is the height (y-axis direction). The area of the rectangular bump 102 shown in FIG. 15 is a × b, where a is the length in the x-axis direction and b is the length in the y-axis direction.

Therefore, the area of the triangular bump 5 itself shown in FIG. 3 is smaller than that of the rectangular bump 1 shown in FIG.
02 is smaller by a × b / 2 than the area of No. 02. For this reason, the concave portion generated in the bump 5 is also reduced. Therefore,
Poor contact can be reduced when a needle-shaped probe is pressed against the bump 5 to test the electrical characteristics.

Next, a process of manufacturing a liquid crystal driver which is a semiconductor device according to the first embodiment will be described.

First, a semiconductor wafer having a liquid crystal drive circuit and input / output terminals (bonding pads) formed in individual chip regions is prepared.

Then, after forming a barrier metal film on the semiconductor wafer, a resist film is applied. Then exposure,
By performing development, patterning for bump formation is performed. The patterning is performed so that a triangular region from which the resist film has been removed is formed above the input / output terminals.

Next, a bump made of gold (Au) is formed in a triangular area formed on the input / output terminal by using a plating method. Thus, a triangular-shaped bump can be formed on the semiconductor chip.

Then, the unnecessary resist film is removed, and a new resist film is applied on the semiconductor wafer, and is exposed and developed to form a pattern for etching the barrier metal film. Then, after the barrier metal film exposed on the wafer is removed using the formed resist pattern as a mask, the resist film is removed. After that, heat treatment is performed.

Next, by dicing the semiconductor wafer, the chip area is singulated to form a semiconductor chip on which a liquid crystal drive circuit and triangular bumps are formed.

Thereafter, the bumps formed on the semiconductor chip and the leads formed on the film substrate are simultaneously connected together, thereby mounting the semiconductor chip on the film substrate to form a liquid crystal driver.

(Embodiment 2) FIG. 5 shows Embodiment 2 of the present invention.
FIG. 4 is an enlarged view of the vicinity of one long side of the semiconductor chip 6 mounted on the liquid crystal driver in FIG.

A bump 7 which is a protruding electrode is formed on the periphery of the long side of the semiconductor chip 6. This bump 7
Has a trapezoidal shape, and is arranged such that the trapezoidal shape is inverted between adjacent bumps 7. That is, the adjacent bumps 7 are arranged in a line while alternately inverting the shape.

When the pitch in the x-axis direction between the arranged bumps 7 in the x-axis direction is P, the length of the lower base (long side) of the trapezoid is a, and the length of the upper base (short side) is c, the adjacent bumps The space between 7 is (P- (a + c) / 2). Therefore,
It can be seen that the space between the trapezoidal bumps 7 is larger by (ac) / 2 than the space between the rectangular bumps 102 shown in FIG.

By forming the shape of the bumps 7 so as to include trapezoids, that is, lines other than lines perpendicular or parallel to the lines forming the outer shape of the semiconductor chip 6, the bumps 7 between the adjacent bumps 7 are formed. Space can be increased.
Therefore, it is possible to prevent short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of the bump 7 when the semiconductor chip 6 is mounted on the film substrate.

The area of the bump 7 itself is (a + c), where a is the length of the lower base (long side), c is the length of the upper base (short side), and b is the length in the y-axis direction. × b / 2. Therefore, the size is reduced by (ac) × b / 2 as compared with the rectangular bump 102 shown in FIG. For this reason, the concave portion generated in the bump 7 is also reduced. Therefore, it is possible to reduce poor contact when a needle-shaped probe is pressed against the bump 7 to test the electrical characteristics.

(Embodiment 3) FIG. 6 shows Embodiment 3 of the present invention.
FIG. 4 is an enlarged view of the vicinity of one long side of the semiconductor chip 8 mounted on the liquid crystal driver in FIG.

A bump 9 as a protruding electrode is formed in a peripheral portion of a long side of the semiconductor chip 8. This bump 9
Has a pentagonal shape, and is arranged such that the shape between adjacent bumps 9 is upside down. That is,
The adjacent bumps 9 are arranged in a line while alternately inverting the shape.

Assuming that the pitch in the x-axis direction between the arranged bumps 9 is P and the length of the base parallel to the x-axis is a, the space between the adjacent bumps 9 differs depending on the size in the y-axis direction. . When the position of the base of the pentagon is the origin of the y-axis,
The space between the adjacent bumps 9 becomes minimum at y = b / 2 and becomes Pa. Further, the space between the adjacent bumps 9 becomes maximum when y = 0 and b, and becomes Pa−2. Accordingly, it can be understood that a large space can be obtained as compared with the rectangular bump 102 having a space value of Pa regardless of the size in the y-axis direction.

As described above, by forming the shape of the bump 9 so as to include a pentagon, that is, a line segment other than a line segment perpendicular or parallel to the line segment forming the outer shape of the semiconductor chip 8, the bump 9 between adjacent bumps 9 is formed. Space can be increased. For this reason, short-circuit failure due to adhesion of conductive foreign matter and bumps 9 when the semiconductor chip 8 is mounted on the film substrate.
Can be prevented from being short-circuited due to deformation of.

The area of the bump 9 itself is 3 ×, where a is the length of the base (x-axis direction) and b is the length of the y-axis direction.
a × b / 4. That is, it is smaller by a × b / 4 than the rectangular bump 102 shown in FIG. For this reason, the concave portion generated in the bump 9 is also reduced. Therefore,
Poor contact can be reduced when a needle-shaped probe is pressed against the bump 9 to test the electrical characteristics.

(Embodiment 4) FIG. 7 shows Embodiment 4 of the present invention.
FIG. 2 is an enlarged view of the vicinity of one long side of the semiconductor chip 10 mounted on the liquid crystal driver in FIG.

A bump 11 which is a protruding electrode is formed on the periphery of the long side of the semiconductor chip 10. The bumps 11 have a right-angled triangular shape, and are arranged so that the shapes between adjacent bumps 11 are upside down.
That is, the adjacent bumps 11 are arranged in a line while alternately inverting the shape.

Assuming that the pitch in the x-axis direction between the arranged bumps 11 is P and the length of the side in the x-axis direction is a, the space between the adjacent bumps 11 depends on the size in the y-axis direction. Are different. When the position of the base of the triangle is set as the origin of the y-axis, the space between the bumps 11 becomes minimum when y = b and becomes Pa. The space between the bumps 11 is y
= 0 and becomes the maximum, and becomes P. Accordingly, it can be understood that a large space can be obtained as compared with the rectangular bump 102 having a space value of Pa regardless of the size in the y-axis direction.

As described above, by forming the shape of the bump 11 so as to include a line other than a line perpendicular or parallel to the line constituting the outer shape of the semiconductor chip 10, the space between the adjacent bumps 11 is increased. Can be taken. Therefore, it is possible to prevent short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of the bump 11 when the semiconductor chip 10 is mounted on the film substrate.

The area of the triangular bump 11 itself is a × b / 2, where a is the base length (x-axis direction) and b is the height (y-axis direction), as shown in FIG. It becomes smaller by a × b / 2 than the area of the rectangular bump 102. For this reason, the concave portion generated in the bump 11 is also reduced.
Therefore, it is possible to reduce poor contact when a needle-shaped probe is pressed against the bump 11 to test the electrical characteristics.

(Embodiment 5) FIG. 8 shows Embodiment 5 of the present invention.
FIG. 4 is an enlarged view of the vicinity of one long side of the semiconductor chip 12 mounted on the liquid crystal driver in FIG.

A bump 13 which is a protruding electrode is formed on the periphery of the long side of the semiconductor chip 12. The bump 13 has a tree-like shape, and the adjacent bump 1
They are arranged so that the shape between the three is upside down. That is, the adjacent bumps 13 are arranged in a line while alternately inverting the shape.

If the pitch in the x-axis direction between the arranged bumps 13 is P and the length of the base is a, the space between the adjacent bumps 13 differs depending on the size in the y-axis direction. -A / 2 apart. Therefore,
The value of the space between adjacent bumps 13 is P
Compared to the rectangular shaped bump 102 which is −a,
It turns out that it becomes large.

By configuring the shape of the bump 13 so as to include the curved line, the space between the adjacent bumps 13 can be increased. Therefore, it is possible to prevent short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of the bump 13 when the semiconductor chip 12 is mounted on the film substrate.

The area of the bump 13 itself is smaller than that of the rectangular bump 102 shown in FIG. For this reason, the concave portion generated in the bump 13 is also reduced. Therefore, it is possible to reduce poor contact when a needle-shaped probe is pressed against the bump 13 to test the electrical characteristics.

(Embodiment 6) FIG. 9 shows Embodiment 6 of the present invention.
FIG. 4 is an enlarged view of the vicinity of one long side of the semiconductor chip 14 mounted on the liquid crystal driver in FIG.

In the peripheral portion of the long side of the semiconductor chip 14, bumps 15a and 15b as protruding electrodes are alternately arranged. The bumps 15a and 15b have different shapes. That is, the bump 15a has a bell-like shape, while the bump 15b has a tree-inverted shape. The bumps 15a and 15b are adjacent to each other, and the curve forming the bell and the curve forming the inverted tree shape are arranged in parallel.

The bumps 15a and the bumps 1 alternately arranged
Assuming that the pitch between the bumps 5b and P is P and the lengths of the sides of the bumps 15a and 15b parallel to the x-axis are both a, the adjacent bump 1
The space between 5a and 15b is Pa-2. Therefore, it can be seen that the space between the adjacent bumps 15a and 15b is larger by a / 2 than the space Pa between the rectangular bumps 102 shown in FIG.

By configuring the shapes of the bumps 15a and 15b so as to include curves that are parallel to each other,
The space between the adjacent bumps 15a and 15b can be increased. For this reason, it is possible to prevent short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of the bumps 15a and 15b when the semiconductor chip 14 is mounted on the film substrate.

The area of the bumps 15a and 15b themselves is smaller than that of the rectangular bump 102 shown in FIG. For this reason, the concave portions generated in the bumps 15a and 15b are also reduced. Therefore, it is possible to reduce poor contact when a needle-shaped probe is pressed against the bumps 15a and 15b to test the electrical characteristics.

(Embodiment 7) FIG. 10 shows a semiconductor chip 16 mounted on a liquid crystal driver according to Embodiment 7 of the present invention.
It is the enlarged view which expanded the periphery of one long side.

In the periphery of the long side of the semiconductor chip 16, bumps 17a and 17b, which are projecting electrodes, are alternately arranged. The bumps 17a and 17b have different shapes. That is, the bump 17a is shaped like an inverted bowl on one side of a rectangle.
b has the shape of Mt. Fuji upside down on one side of the rectangle. The bumps 17a and 17b are adjacent to each other, and the curve configuring the adjacent bump 17a and the curve configuring the bump 17b are arranged so as to be parallel.

The bumps 17a and the bumps 1 which are alternately arranged
P is the pitch between the bumps 7b and 7b, the length of the bottom of the bump 17a (the long side of the sides parallel to the x-axis) is a, and the length of the bottom of the bump 17b (the short side of the sides parallel to the x-axis). Is d, the space between adjacent bumps 17a and 17b is P
− (A + d) / 2. Accordingly, it can be seen that the space between the adjacent bumps 17a and 17b is larger by (ad) / 2 than the space Pa between the rectangular bumps 102 shown in FIG.

By configuring the shapes of the bumps 17a and 17b so as to include curves that are parallel to each other,
The space between the adjacent bumps 17a and 17b can be increased. For this reason, it is possible to prevent short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of the bumps 17a and 17b when the semiconductor chip 16 is mounted on the film substrate.

The area of the bumps 17a and 17b themselves is smaller than that of the rectangular bump 102 shown in FIG. For this reason, the concave portions generated in the bumps 17a and 17b are also reduced. Therefore, it is possible to reduce poor contact when a needle-shaped probe is pressed against the bumps 17a and 17b to test the electrical characteristics.

(Eighth Embodiment) FIG. 11 shows a semiconductor chip 18 mounted on a liquid crystal driver according to an eighth embodiment.
It is the enlarged view which expanded the periphery of one long side.

In the periphery of the long side of the semiconductor chip 18, bumps 19a and 19b, which are projecting electrodes, are alternately arranged. The bumps 19a and 19b have different shapes. That is, the bump 19a has a bell shape on one side of the rectangle, and the bump 19b has a shape like Mt. Fuji inverted on one side of the rectangle.

The bumps 19a and bumps 1 alternately arranged
Assuming that the pitch between the bumps 9b and 9b is P, the length of the bottom of the bump 19a is a, and the length of the bottom of the bump 19b (the shorter side parallel to the x-axis) is d, Although the space between the adjacent bumps 19a and 19b is different, at least the adjacent bumps 19a and 1
9b is P- (a + d) / 2.
Therefore, it can be seen that the space between the adjacent bumps 19a and 19b is larger than that of the rectangular bump 102 having a space value of Pa.

As described above, by forming the shapes of the bumps 19a and 19b so as to include the curved lines, it is possible to increase the space between the adjacent bumps 19a and 19b. For this reason, it is possible to prevent short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of the bumps 19a and 19b when the semiconductor chip 18 is mounted on the film substrate.

The area of the bumps 19a and 19b themselves is smaller than that of the rectangular bump 102 shown in FIG. For this reason, the concave portions generated in the bumps 19a and 19b are also reduced. Therefore, it is possible to reduce poor contact when a needle-shaped probe is pressed against the bumps 19a and 19b to test the electrical characteristics.

(Embodiment 9) FIG. 12 is an enlarged view of the vicinity of one long side of a semiconductor chip 20 mounted on a semiconductor device according to Embodiment 9 of the present invention. FIG. 16 is a diagram studied by the present inventors, and is an enlarged view in which the periphery of one long side of the semiconductor chip 103 is enlarged.

In the periphery of the long side of the semiconductor chip 20, bumps 21 as projecting electrodes are arranged in a staggered manner. The staggered bumps 21 have a pentagonal shape. By making the shape of the bump 21 pentagonal in this way, the bump 21 in the first row and the bump 2 in the second row can be compared with the case where the shape of the bump shown in FIG.
1 and a large space can be taken. Therefore, it is possible to prevent short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of the bump 21 when the semiconductor chip 20 is mounted on the film substrate.

The area of the pentagonal bump 21 is:
The area is smaller than that of the rectangular bump 104 shown in FIG. For this reason, the concave portion generated in the bump 21 is also reduced. Therefore, it is possible to reduce a contact failure when a needle-shaped probe is pressed against the bump 21 to test the electrical characteristics.

Although the invention made by the inventor has been specifically described based on the above embodiment, the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. It goes without saying that it is possible.

In the embodiment, an example in which the bumps are arranged along the sides constituting the outer shape of the semiconductor chip has been described. For example, as shown in FIG. Is also good. Thus, the semiconductor chip 22
By forming the bumps 23 at the corners of the bumps, the bumps can be densely arranged.

The shape of the bump is not limited to the shape described in the embodiment, but may be, for example, a V-shape.

In the embodiment, the liquid crystal driver has been described. However, the present invention is not limited to the liquid crystal driver, and can be generally applied to a semiconductor device on which a semiconductor chip provided with protruding electrodes is mounted.

[0081]

Advantageous effects obtained by typical ones of the inventions disclosed by the present application will be briefly described as follows.
It is as follows.

The space between the projecting electrodes can be increased by configuring the shape of the projecting electrodes formed on the semiconductor chip to include lines other than lines perpendicular or parallel to the lines constituting the outer shape of the semiconductor chip. Can be taken. Therefore, it is possible to prevent short-circuit failure due to adhesion of conductive foreign matter and short-circuit failure due to deformation of bumps when mounting a semiconductor chip on a film substrate.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a film substrate of a liquid crystal driver according to an embodiment of the present invention.

FIG. 2 is a plan view of a semiconductor chip mounted on a liquid crystal driver according to an embodiment of the present invention.

FIG. 3 is an enlarged view showing a part of a semiconductor chip mounted on a liquid crystal driver according to an embodiment of the present invention;

FIG. 4 is a perspective view showing a state where a semiconductor chip is mounted on a film substrate.

FIG. 5 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 6 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 7 is an enlarged view showing a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 8 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 9 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 10 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 11 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 12 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 13 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver according to another embodiment of the present invention.

FIG. 14 is a plan view of a semiconductor chip mounted on a liquid crystal driver studied by the present inventors.

FIG. 15 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver studied by the present inventors.

FIG. 16 is an enlarged view of a part of a semiconductor chip mounted on a liquid crystal driver studied by the present inventors.

[Explanation of symbols]

1 Film substrate 2 Insulating film 3 Lead 4 Semiconductor chip 5 Bump 6 Semiconductor chip 7 Bump 8 Semiconductor chip 9 Bump 10 Semiconductor chip 11 Bump 12 Semiconductor chip 13 Bump 14 Semiconductor chip 15a bump 15b bump 16 Semiconductor chip 17a bump 17b bump 18 Semiconductor chip 19a bump 19b bump 20 Semiconductor chip 21 Bump 22 Semiconductor chip 23 Bump

Claims (4)

[Claims] 1. A semiconductor chip provided with a protruding electrode, wherein the outer shape of the protruding electrode includes a line segment other than a line segment perpendicular or parallel to a line segment constituting the outer shape of the semiconductor chip. A semiconductor device characterized by the above-mentioned. 2. A semiconductor chip provided with a plurality of projecting electrodes, wherein an outer shape of the projecting electrode includes a line segment other than a line segment perpendicular or parallel to a line segment constituting the outer shape of the semiconductor chip. A line segment constituting the outer shape of the bump electrode, and a line segment other than a line segment perpendicular or parallel to the line segment constituting the outer shape of the semiconductor chip is parallel to the bump electrodes adjacent to each other. Characteristic semiconductor device. 3. A semiconductor chip provided with a plurality of protruding electrodes, wherein an outer shape of the protruding electrode is configured to include a curve, and a curve forming an outer shape of the protruding electrode is parallel to the adjacent protruding electrodes. A semiconductor device, comprising: 4. A semiconductor device comprising a semiconductor chip provided with a protruding electrode, wherein the outer shape of the protruding electrode is formed in a triangular shape.