JP2003342712A - Parts for film deposition apparatus and vacuum film deposition apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide parts for a film deposition apparatus for suppressing separation of a deposited film as much as possible during the film deposition on substrates in a vacuum chamber, and a vacuum film deposition apparatus having the parts. <P>SOLUTION: A Ti thermal-sprayed film S of the thickness of 200 μm, Vickers hardness (Hv) of ≤200 and the surface roughness (Ra) of ≥10 μm is formed over an entire surface by performing the arc thermal spraying of Ti under a vacuum (for example, degree of vacuum of 10<SP>-3</SP>to 10<SP>-1</SP>Pa) on a SUS shutter sheet 7 with the surface roughness (Ra) of 4 μm through glass bead blasting. The thickness to start separation of the deposited film of the shutter A with the Ti thermal-sprayed film S is 1.5 to 2 times that of shutters B, C and D with a Ti thermal-sprayed film without the above hardness and surface roughness. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film-forming apparatus component and a vacuum film-forming apparatus. More specifically, the adhered film that is simultaneously formed and adhered during film formation on substrates is peeled or dropped. The present invention relates to a film forming apparatus component having a metal sprayed film formed on the surface thereof, and a vacuum film forming apparatus including such a film forming apparatus component.

[0002]

2. Description of the Related Art LSIs (Large Scale Integrated Circuits), solar cells,
As is well known, semiconductor products such as LCD (liquid crystal display) and plasma display are formed on a variety of substrates by a method such as sputtering, CVD, vapor deposition in a vacuum film forming apparatus, SiO ₂ , Si ₃ N ₄ , Al, W, It is manufactured by forming various other thin films. At this time, in addition to the target substrates, the film is also formed on the film forming device parts in the vacuum film forming device and becomes an adhered film. However, as the substrate is replaced and the film forming operation is repeated, the film forming device parts are The adhered film of No. 2 grows thick, and if it is simply calculated, the peeling stress doubles if the film thickness is doubled. Therefore, the grown adhered film eventually peels and falls off, and the resulting fine particles, dust, etc. What is called a particle contaminates the inside of the vacuum film forming apparatus, resulting in a large decrease in the yield of semiconductor products.

On the other hand, various thermal spray coatings have been used on the surface of film forming apparatus parts. That is, the sprayed coating can be expected to have the following effects. 1) Since the surface of the sprayed film is generally rough, the adhesion film is likely to obtain an anchor (anchor) effect, and the contact area between the sprayed film and the adhesion film is large, so that it is difficult to peel it off. 2) The sprayed film has a certain porosity depending on its forming method, and is slightly deformable due to the existence of the pores,
Depending on the degree, the peeling stress of the attached film is relaxed. 3) Peeling stress occurs due to the temperature difference from the solidification temperature at which the adhesive film solidifies, but by using a thermal spray film having a thermal expansion coefficient close to that of the adhesive film, the peeling stress of the adhesive film can be reduced and used. The stress change due to the temperature change of the process is also small.

Conventionally, for the above-mentioned spray coating, for example, S
The surface of a US (stainless steel) film-forming apparatus component is sprayed with, for example, Al ₂ O ₃ (alumina) powder, Al
A film in which a sprayed film of (aluminum) is formed and then its surface is anodized to be converted into Al ₂ O ₃ has been proposed and implemented. Parts with irregularities on the surface or those with a Ti (titanium) sprayed film that has a similar coefficient of thermal expansion to the adhesion film with a small coefficient of thermal expansion and that has excellent corrosion resistance are used. .

According to the thermal spraying method, the Ti sprayed film described above is formed to have both high hardness and surface roughness, or low hardness and surface roughness. That is, plasma spraying method, arc spraying method, flame (flame)
There are thermal spraying methods, and any one of them is used. The thermal spraying of Ti by the plasma spraying method is usually performed under reduced pressure, and as a result, the oxidation of Ti is suppressed, so that a soft thermal sprayed film of Ti originally having a Vickers hardness (Hv) of 200 or less is formed, and Has a center line average roughness (Ra) of 10 μm or less on the surface of a Ti sprayed film formed from a melt having a low viscosity by being melted at a high plasma temperature. On the other hand, the Ti sprayed film produced by the arc spraying method or flame spraying method under atmospheric pressure has a high Hv of 200 or more due to a slight oxidation of Ti and melts at the arc temperature or flame temperature. T from melted
The surface roughness (Ra) of the i sprayed film is 10 μm or more.

[0006]

If the hardness of the sprayed film is small, the sprayed film is deformed by the peeling stress (for example, the peeling stress of the adhered film caused by the difference in thermal expansion coefficient between the adhered film and the sprayed film), and the deformation is caused. Since the peeling stress is relieved, the attached film becomes difficult to peel off. On the other hand, when the surface roughness of the sprayed film is small, it is difficult for the attached film to obtain the anchor effect, and therefore the peeling is likely to occur. That is, the hardness of the Ti sprayed film is small,
It is preferable that the surface roughness is large, but such a Ti sprayed film has not been obtained.

The present invention has been made in view of the above problems, and prevents the adhered films that are simultaneously formed and adhered to the parts for the film forming apparatus during the film forming on the substrates in the vacuum film forming apparatus from peeling or dropping. A film-forming apparatus component having a sprayed film formed on its surface, and a film-forming apparatus component having a sprayed film capable of remarkably suppressing peeling and dropping of an adhered film, and a part for such a film-forming apparatus. An object of the present invention is to provide a vacuum film forming apparatus provided with parts.

[0008]

The above-mentioned problems can be solved by the constitutions of claims 1 and 7, and the solution means will be described as follows.

The film forming apparatus component according to claim 1 is a film forming apparatus component having a metal sprayed film formed on the surface thereof so that the adhered film that is simultaneously formed and adhered during film formation on substrates is not separated. In the above, the sprayed film is formed by an arc spraying method or a flame spraying method in a non-oxidizing atmosphere. In such a film-forming apparatus component, since metal oxidation is suppressed by thermal spraying in a non-oxidizing atmosphere, a soft metal sprayed film having a small hardness, that is, a soft metal sprayed film is formed. As a result, a metal sprayed film with a large surface roughness is formed, so it is difficult to peel off the adhered film that is formed and adheres to the parts for the film formation device during film formation on substrates in the vacuum film formation device. By increasing the time until the inside of the vacuum chamber is contaminated by particles generated by peeling and dropping of the adhered film, the operation rate of the vacuum film forming apparatus is increased.

The film forming apparatus component according to claim 2 subordinate to claim 1 is one in which the metal sprayed film is formed under a reduced pressure lower than atmospheric pressure in a non-oxidizing atmosphere. In such a film-forming apparatus component, a non-oxidizing atmosphere can be obtained relatively easily, so that a metal sprayed film effective for suppressing the peeling and dropping of the adhered film is formed at a relatively low cost. .

According to the film forming apparatus component of claim 3 which depends on claim 1, the metal sprayed film has a Vickers hardness (Hv) of 20.
Such a film-forming apparatus component having a surface roughness of the metal sprayed film of 0 or less and a center line average roughness (Ra) of 10 μm or more deforms due to the softness of the metal sprayed film and peels off the deposited film. Since the stress is relieved and the surface roughness is large, the adhesion film easily obtains an anchor effect, and peeling is suppressed even if the adhesion film becomes thick.

According to a fourth aspect of the present invention, which is a film forming apparatus component, the surface of the film forming apparatus component is roughened in advance. The rough surface of the parts for spraying and the rough surface of the sprayed film itself prevent the attached film and the sprayed film from being integrally separated from the parts for the film forming apparatus.

According to a fifth aspect of the present invention, which is dependent on the first aspect, the metal spray coating is a Ti spray coating. Such a film-forming apparatus component is easily deformed due to the softness of the Ti sprayed film, so that the peeling stress of the adhered film can be eased, and when the material of the film-forming apparatus component is SUS (stainless steel), thermal expansion occurs. Since the coefficients are close to each other, the Ti sprayed film is difficult to be peeled off from the film forming apparatus component.

According to a sixth aspect of the present invention, there is provided at least one of a shower plate, a shutter, a deposition plate, a chimney, a mask, a cover ring, a ground shield, and a substrate holder. Or more than one. Since all of the parts for such a film forming apparatus are arranged in the vacuum film forming apparatus at a place where the adhered film is easily formed, by suppressing the peeling of the adhered film, the cleaning interval is lengthened. .

A vacuum film forming apparatus according to a seventh aspect of the present invention comprises a film forming apparatus component having a metal sprayed film formed on a surface thereof so that an adhered film which is simultaneously formed and adhered during film formation on a substrate is not separated. In the vacuum film forming apparatus described above, the metal sprayed film is formed by an arc spraying method or a flame spraying method in a non-oxidizing atmosphere. Such a vacuum film forming apparatus has a low hardness because the metal sprayed film of the parts for the film forming apparatus is formed by suppressing the oxidation, and also has a surface roughness due to the arc spraying method or the flame spraying method. Since it is large, it is difficult to peel off the adhered film that is formed and adhered to the parts for the film forming device during film formation on the substrate in the vacuum film forming device, and the particles generated by peeling or falling off of the adhered film cause the inside of the vacuum chamber. It takes a long time to get polluted, which increases the operation rate of the vacuum film forming apparatus.

A vacuum film forming apparatus according to claim 8 that depends on claim 7 is one in which the metal sprayed film is formed under a reduced pressure lower than atmospheric pressure in a non-oxidizing atmosphere. In such a vacuum film forming apparatus, since the metal sprayed film of the film forming apparatus part suppresses the oxidation of metal and the metal sprayed film becomes soft, the peeling stress of the adhered film formed on the surface is relaxed. Prevents peeling.

In a vacuum film forming apparatus according to claim 9 which depends on claim 7, the Vickers hardness (Hv) of the metal sprayed film of the film forming apparatus component is 200 or less, and the center line of the surface of the metal sprayed film. The average roughness (Ra) is 10 μm or more. In such a vacuum film forming apparatus, since the metal sprayed film of the film forming apparatus component is soft and easily deformed, the peeling stress of the adhered film is relaxed, the surface roughness is large, and the anchor effect is given to the adhered film. The film is hard to be peeled off, and even if the attached film is thick, it is prevented from peeling off.

A vacuum film forming apparatus according to a tenth aspect, which depends on the seventh aspect, is an apparatus in which the surface of the film forming apparatus component is roughened in advance. In such a vacuum film forming apparatus, the rough surface of the film forming apparatus component and the rough surface of the sprayed film itself prevent the adhered film and the sprayed film from being integrally separated from the film forming apparatus component.

A vacuum film forming apparatus according to claim 11 subordinate to claim 7 is an apparatus in which the metal sprayed film of the film forming apparatus component is a Ti sprayed film. In such a vacuum film forming apparatus, since the Ti sprayed film of the film forming apparatus component is soft and easily deformed, the peeling stress of the adhered film is relaxed, and the material of the film forming apparatus component is SUS.
In this case, the coefficient of thermal expansion is close, and the Ti deposited film is difficult to peel off from the film forming apparatus component.

According to a twelfth aspect of the vacuum film forming apparatus, which is dependent on the seventh aspect, the parts for the film forming apparatus are a shower plate, a shutter, a deposition preventive plate, a chimney, a mask, a cover ring, an earth shield, and a substrate holder. It is an apparatus including at least one of them. In such a vacuum film forming apparatus, any of the above film forming apparatus parts is arranged in a place where the adhered film is easily formed thickly. Therefore, by suppressing the peeling of the adhered film, the cleaning interval is increased. Lengthen the period.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION As described above, the film-forming apparatus component of the present invention has a metal sprayed film formed on the surface thereof so as to prevent the adhered film that is simultaneously formed and adhered during film formation on substrates from being separated. In the formed film forming apparatus component, the metal sprayed film is formed by an arc spraying method or a flame spraying method in a non-oxidizing atmosphere, and the vacuum film forming apparatus of the present invention is the above film forming apparatus. It is an apparatus equipped with parts for use.

Thermal spraying by an arc spraying method or a flame spraying method for forming a metal sprayed film on the parts for a film forming apparatus of the present invention is performed in a non-oxidizing atmosphere.
The non-oxidizing atmosphere mentioned here means an atmosphere in which the metal is not oxidized when the metal sprayed film is formed. That is, metal spraying is performed under reduced pressure with a small absolute amount of oxygen, for example, a vacuum degree of 10 ⁻³ to 1
The object can be achieved by performing arc spraying or flame spraying in an atmosphere of about 0 ⁻¹ Pa. In addition, the thermal spraying may be performed in an atmosphere of a gas, such as argon (Ar) gas, which has no reactivity with the metal in a molten state at a high temperature during thermal spraying.

The metal sprayed film sprayed in a non-oxidizing atmosphere as described above exhibits the original hardness of the metal because the metal is not oxidized. For example, Ti, which is soft depending on the type of metal and is deformed by stress. It becomes an easy metal sprayed film. In the present invention, the easiness of deformation that the metal sprayed film should have, that is, the softness is the Vickers hardness (H
It is required to be 200 or less as shown in v). Of course, the easiness of deformation of the thermal spray coating can also be indicated by the elastic modulus of the metallic spray coating.

Further, the metal sprayed film is formed on the metal sprayed film so as to give an anchor effect to the adhered film and to increase the contact area between the metal sprayed film and the adhered film. Must have a rough surface, but the surface roughness is required to be 10 μm or more in terms of center line average roughness (Ra). Furthermore, in order to prevent the metal sprayed film from peeling off from the film-forming apparatus component, it is desired that the surface of the film-forming apparatus component be previously subjected to a blast treatment such as glass bead blasting or shot blasting.

As the metal used for the metal spray coating, Ti is used because of its softness and corrosion resistance, and molybdenum (Mo) and tantalum (Ta) can be used equally. In addition, examples of film forming device components that are used in a vacuum film forming device and in which an adhered film is easily formed include shower plates, shutters, deposition plates, chimneys, masks, coverings, earth shields, substrate holders, and the like.

[0026]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the components for a film forming apparatus and the vacuum film forming apparatus of the present invention will be concretely described with reference to the drawings.

(Embodiment 1) FIG. 1 is a vertical sectional view schematically showing a vacuum chamber 1 in a vacuum film forming apparatus 10 by a sputtering method. The vacuum chamber 1 as a whole is SUS
Process gas (eg Ar)
Introducing pipe 8 and a vacuum exhaust pipe 9 are provided at a position opposite to the introducing pipe 8 and are evacuated by a vacuum pump (not shown) connected to vacuum exhaust pipe 9. In the vacuum chamber 1, TiN as a cathode connected to the high frequency power source 2
A target T made of (titanium nitride) and a substrate holder 4 as an anode are provided so as to face each other in parallel. A substrate W is set in the substrate holder 4 and a bias power supply (not shown) is connected. . Board holder 4
A heater 5 for heating the substrate W to a predetermined temperature is arranged behind the substrate as shown in a simplified manner. On the other hand, behind the target T, a cylindrical magnet 6 is attached to the center and an annular magnet 6'is attached to the outer periphery so that the polarities are reversed so that part of the lines of magnetic force are parallel to the surface of the target T. Has been done. A shutter plate 7 made of SUS340 for turning on / off the film formation on the substrate W is attached to the substrate W side depending on the rotation angle position in the horizontal plane.

The inside of the vacuum chamber 1 has a vacuum degree of 10 ^-3.
By maintaining an Ar (argon) atmosphere of about 10 ^-1 Pa and applying high-frequency power between the electrodes by the high-frequency power source 2, effective glow discharge in a portion where the electric field and the magnetic field above the target T are orthogonal to each other. Occurs and plasma is generated in an annular shape. Ar ⁺ ions in this plasma are accelerated in the vicinity of the target T of the cathode and collide with the surface of the target T to sputter target atoms, so that the sputtered particles are the substrate W of the substrate holder 4 which is the anode.
A thin film of TiN is formed by depositing on top.

The shutter plate 7 is closed at the start of sputtering, and a TiN film is deposited on and adheres to the shutter plate 7. When the sputtering reaches a steady state, the position of the shutter plate 7 is rotated and opened to start the film formation of TiN on the surface of the substrate W. Then, TiN is similarly deposited and adhered to the shutter plate 7 near the substrate W. When the TiN film is formed on the substrate W to a predetermined thickness, the substrate W is replaced with the next substrate W and the sputtering is continued. However, since the shutter plate 7 is continuously used as it is, the attached film grows. It becomes a thick film, and finally peels off and falls off to generate particles and contaminate the inside of the vacuum chamber 1. Therefore, as described above, the Ti sprayed film is formed on the entire surface of the shutter plate 7 so that the thickened adhered film does not peel off or fall off until the next maintenance time.

With respect to the above Ti sprayed film, the spraying conditions were adjusted to prepare sprayed films having different softness and surface roughness, and the resistance to peeling of the deposited film was examined. That is, after subjecting the entire surface of the shutter plate 7 to glass bead blasting to make the center line average roughness (Ra) of the surface 4 μm rough, as shown in the cross-sectional view of FIG. Adjusted and arc-sprayed with Ti, thickness 200 μm
Then, a Ti sprayed film S having a surface roughness (Ra) of 22.7 μm and a Vickers hardness (Hv) of 164 was formed to be “shutter A”. FIG. 3 is an enlarged cross-sectional view of a portion surrounded by a circle in FIG. Note that, in FIG. 3, the adhesion film Q attached on the Ti sprayed film S is shown by a one-dot chain line.

Then, this "shutter A" was incorporated into the vacuum film forming apparatus 10 described above, and the substrate W was formed under the film forming conditions of a vacuum degree of 4 × 10 ^-1 Pa and a sputter output of 600 V / 12 A (7.2 kW). A TiN film was formed. At this time, TiN is also deposited on the shutter plate 7 to form an adhesion film.
By visually observing the growth of the adhered film, the film thickness is about 5
The presence or absence of peeling was checked every time the thickness increased by 0 μm, and peeling occurred when the deposited film thickness became approximately 1.5 mm.

For comparison, the same shutter plate 7 was similarly treated with glass beads and blasted to form a rough surface having a center line average roughness (Ra) of 4 μm, and the same film thickness of 200 μm. However, “Shutter B”, “Shutter C”, and “Shutter D” having Ti sprayed films with different surface roughness (Ra) and Vickers hardness (Hv) are formed, and vacuum film formation is performed in the same manner. It was incorporated in the apparatus 10 and the film thickness of the adhesive film when the adhesive film formed on the surface thereof was peeled off was recorded. The results are shown in Table 1.

[0033]

[Table 1]

As is clear from Table 1, in the shutter plate A of Example 1, the Ti sprayed film had a Vickers hardness (Hv) of 200 or less and a surface center line average roughness (Ra) of 10 μm or more (specifically, 27.2μ, which is more than 7.2μm
By setting m), the adhesion film thickness causing peeling was 1.5 to 2 times as compared with Comparative Examples 1 to 3. This means that the interval for cleaning the inside of the vacuum chamber 1 can be increased by 1.5 to 2 times, which increases the operating rate of the vacuum film forming apparatus 10 and significantly reduces the cost of the sputtered film.

(Embodiment 2) FIG. 4 is a vertical sectional view schematically showing a vacuum chamber 21 of a vacuum film forming apparatus 20 by a thermal CVD method. The vacuum chamber 21 is made of SUS, and the exhaust port 29 is connected to a vacuum exhaust system (not shown). In the vacuum chamber 21, the substrate W is attached to the substrate holder 31 fixed to a jig (not shown). In addition, the substrate W is provided behind the substrate holder 31.
A heater 32 for heating the above is disposed, and an introducing pipe 33 including a cable connected to a power source (not shown) is introduced from above the vacuum chamber 21. Further, a raw material gas introduction pipe 34 is introduced from below the vacuum chamber 21, and a shower plate 36 for rectifying the gas and evenly flowing the gas to the substrate W is attached to the gas disperser 35 subsequent thereto.

A cylindrical chimney 37 is provided so as to surround the gas introduction pipe 34 and the gas disperser 35 so that a film is not formed on the inner wall surface of the vacuum chamber 21 other than the substrate W. An RF power source 38 for plasma discharge is connected to the gas introduction pipe 34,
The shower plate 36 acts as a cathode. Further, an earth shield 39 is provided so as to surround the gas disperser 35, and although not shown, the substrate holder 31 serving as an anode is provided.
Is grounded together with the vacuum chamber 21.

Film formation on the substrate W by the vacuum film forming apparatus 20 is performed as follows. The vacuum chamber 21 is evacuated to maintain a predetermined vacuum degree, and the heater 32 holds the substrate W at a predetermined temperature. Then, SiH ₄ (monosilane) and NH ₃ which are source gases are added to the gas introduction pipe 34.
After the pressure in the vacuum chamber 21 is stabilized, high-frequency power is applied by the RF power source 38 to generate plasma discharge between the shower plate 36 as the cathode and the substrate holder 31 as the anode. Then, the source gas is decomposed and reacted by this plasma discharge, and an insulating film of Si ₃ N ₄ (silicon nitride) is formed on the surface of the substrate W.

At this time, the Si ₃ N ₄ film is also formed on the surfaces of the substrate holder 31, the shower plate 36, and the deposition-inhibiting plate 37 other than the substrate W for the film-forming apparatus components and becomes an adhesion film. Then, the substrate W on which the Si ₃ N ₄ film is formed with a predetermined thickness is exchanged with a new substrate W and thermal CVD is repeated, but since the components for the film forming apparatus are not exchanged, the attached film grows and becomes thicker. ,
Finally, it peels off and falls off, and the inside of the vacuum chamber 21 is contaminated with particles. Therefore, after subjecting the surfaces of the film-forming apparatus components to glass beads blasting to roughen the surfaces under exactly the same conditions as in Example 1, T
An i sprayed film was formed. As a result, the peeling and dropping of the adhered film was suppressed, the cleaning interval in the vacuum chamber 21 was extended, and the running cost of the vacuum film forming apparatus 20 was significantly reduced.

(Embodiment 3) FIG. 5 is a vertical sectional view schematically showing a vacuum chamber 41 of a vacuum film forming apparatus 40 by a thermal CVD method. A substrate W is placed on a hot plate 42 fixed to the bottom surface of the vacuum chamber 41, and an elevating pin 47 for the substrate W is provided with a saucer 47d penetrating the center of the hot plate 42. Also hot plate 42
An annular water-cooling block 43 is provided in the vicinity of the outer circumference of, and a cover ring 44 is placed on the water-cooling block 43 and the outer circumference of the hot plate 42. On the lower surface of the cover ring 44, a groove 44a having a U-shaped cross section is formed concentrically with the cover ring 44. And
Three lifting pins 48 are provided at positions where the water cooling block 43 is divided into three at equal angles, and the cover ring 44 is moved up and down. In addition, a shower plate 46 for introducing the raw material gas and evenly flowing it toward the substrate W is provided on the ceiling surface of the vacuum chamber 41, and a vacuum exhaust pipe 49 is attached to the bottom surface of the vacuum chamber 41.

In the vacuum film forming apparatus 40 having such a structure, when forming a film on the substrate W, the most attached film is formed on the cover ring 44 except the substrate W. Then, the substrate W having a predetermined film thickness is lifted up by the raising and lowering pins 48 to raise the cover ring 44, and then raised and lowered by the raising and lowering pins 47, and taken out by a hand of a robot (not shown). Then, a new substrate W to be replaced is set in the reverse procedure, the cover ring 44 is lowered, and thermal CVD is repeated. As a result, the film adhered to the cover ring 44 grows and becomes thicker, and finally peels off and falls off to contaminate the inside of the vacuum chamber 41 with particles. Therefore, the thickness immediately before the film peels off. Then, when the substrate W is replaced, the cover ring 44 is also replaced at the same time. Even in this case, the frequency of replacement of the cover ring 44 can be reduced by blasting the entire surface of the cover ring 44 and forming a Ti sprayed film on the entire surface, just as in the case of the first embodiment. The number of spare cover rings 44 can be reduced.

Although the parts for the film forming apparatus and the vacuum film forming apparatus of the present invention have been described above with reference to the embodiments, the present invention is not limited to these, and various modifications can be made based on the technical idea of the present invention. Is possible.

For example, FIG. 6 is a schematic vertical cross-sectional view of a vacuum chamber 51 of the sputtering method in which the substrate W is arranged above. The substrate W, the target T, the earth shield 53, and the vacuum chamber 51 in the vacuum chamber 51 are shown in FIG. The positional relationship of the deposition preventive plate 54 for preventing film formation on the wall surface is shown. In this case, particles sputtered from the target T below are likely to adhere to the earth shield 53 and the adhesion-preventing plate 54. Effectively suppress peeling. FIG. 7 is a schematic vertical sectional view of a vacuum chamber 61 of the sputter method in which the substrate W is arranged below.
The arrangement of the target T, the substrate W, the mask 63 for partially forming a film on the substrate W, and the cover ring 64 are shown. In this case, the sputtered particles from the target T above tend to adhere to the mask 63 and the cover ring 64, but those in which the sprayed film of the present invention is formed on these film forming apparatus parts are also effective in removing the adhered film. To suppress.

In the first embodiment, the arc spraying method is used for forming the Ti sprayed film, but it goes without saying that the same effect can be obtained by using the flame spraying method.
In the first embodiment, the substrate W is formed by the sputtering method.
Although TiN has been illustrated as the thin film to be formed on the substrate, that is, the adhesion film that adheres to the shutter plate 7 and becomes thicker, other than this, TiW (titanium tungsten), TaN (thallium nitride), W (tungsten), etc. In addition to metal film, A
Even when an inorganic oxide film such as l ₂ O ₃ or ITO (indium tin oxide) adheres to form a thick film, the film-forming apparatus component on which the metal sprayed film of the present invention is formed does not peel off the adhered film. Similarly suppress. Further, in this embodiment, the vacuum film forming apparatus by the sputtering method and the CVD method has been described, but the present invention is similarly applied to the vacuum film forming apparatus by the vapor deposition method.

[0044]

The parts for a film forming apparatus and the vacuum film forming apparatus of the present invention are carried out in the form as described above, and have the following effects.

According to the film-forming apparatus component of claim 1, since the metal sprayed film on the surface is formed by the arc spraying method or the flame spraying method in a non-oxidizing atmosphere, the metal sprayed film is soft. And the surface roughness is large.
Therefore, the peeling stress of the adhered film on the metal sprayed film is relaxed by deformation of the metal sprayed film, and the rough surface gives an anchor effect to the adhered film, resulting in peeling even if the adhered film grows thick,
It suppresses the falling off, prolongs the cleaning interval of the vacuum chamber, and improves the operation rate of the vacuum film forming apparatus.

According to the film-forming apparatus component of the second aspect, since the pressure-reduced space obtained relatively easily is metal-sprayed in a non-oxidizing atmosphere, it is effective in suppressing the peeling and dropping of the adhered film. The metal sprayed film is formed at low cost. According to the film-forming apparatus component of claim 3, since the metal sprayed film has a soft Vickers hardness (Hv) of 200 or less and a centerline average roughness (Ra) of the surface of 10 μm or more. , The peeling stress of the adhesion film is deformed and relaxed, and the anchoring effect is given to the adhesion film, so that even if the adhesion film becomes thicker, it is prevented from being peeled off from the film forming apparatus component. According to the film-forming apparatus component of claim 4, since the surface of the film-forming apparatus component is roughened in advance, the adhesion film and the sprayed film are prevented from being separated from the film-forming apparatus component as a unit.

According to the film forming apparatus component of claim 5, since the metal sprayed film is a Ti sprayed film, the sprayed film which is corrosion resistant and is formed in a non-oxidizing atmosphere is soft, and the deposited film Easy to relieve peeling stress. According to the film-forming apparatus component of claim 6, the component is at least one of a shower plate, a shutter, a deposition-inhibitory plate, a chimney, a mask, a cover ring, an earth shield, and a substrate holder, Since each of them is arranged at a place where the adhered film is easily formed, the effect of suppressing the peeling of the adhered film is most effectively exhibited.

According to the vacuum film-forming apparatus of claim 7, the metal-sprayed film of the parts for the film-forming apparatus provided is formed by arc spraying or flame spraying in a non-oxidizing atmosphere. The film is soft and has a large surface roughness. Therefore, the peeling stress of the adhered film on the metal sprayed film is relaxed by the deformation of the metal sprayed film, the rough surface gives an anchor effect to the adhered film, and even if the adhered film grows thick, it peels off and falls off. Since the suppression is performed, the cleaning interval of the vacuum chamber is prolonged and the operation rate of the vacuum film forming apparatus is increased.

According to the vacuum film forming apparatus of the eighth aspect, since the metal sprayed film of the film forming apparatus component is sprayed in a non-oxidizing atmosphere under a reduced pressure which is relatively easy to obtain, the deposition film is The metal sprayed film effective for suppressing peeling and dropping is formed at low cost. According to the vacuum film-forming apparatus of claim 9, the metal sprayed film of the film-forming apparatus component has a Vickers hardness (Hv) of 200 or less and a center line average roughness (R) of the surface.
Since a) is set to 10 μm or more, the metal sprayed film is softly deformed to relieve the peeling stress of the adhered film and the surface roughness gives an anchor effect to the adhered film. Suppress doing. According to the vacuum film forming apparatus of the tenth aspect, since the surface of the film forming apparatus component is roughened in advance, it is possible to prevent the adhesion film and the sprayed film from being integrally separated from the film forming apparatus component.

According to the vacuum film forming apparatus of the eleventh aspect, since the metal sprayed film of the film forming apparatus component is a Ti sprayed film, the sprayed film that is corrosion resistant and is formed in a non-oxidizing atmosphere is soft. It is easy to relieve the peeling stress of the attached film. Claim 12
According to the vacuum film forming apparatus, the film forming apparatus component includes at least one of a shower plate, a shutter, a deposition preventive plate, a chimney, a mask, a cover ring, and a substrate holder. Since the adhesive film is easily formed, the effect of suppressing peeling of the adhesive film is most effectively exhibited.

[Brief description of drawings]

FIG. 1 is a vertical sectional view of a vacuum chamber according to a first embodiment.

FIG. 2 is a sectional view of a shutter in the vacuum chamber of the first embodiment.

FIG. 3 is an enlarged cross-sectional view of a part circled in FIG.

FIG. 4 is a vertical sectional view of a vacuum chamber according to a second embodiment.

FIG. 5 is a vertical sectional view of a vacuum chamber according to a third embodiment.

FIG. 6 is a vertical cross-sectional view of another vacuum chamber.

FIG. 7 is a vertical cross-sectional view of still another vacuum chamber.

[Explanation of symbols]

1, 21, 41, 51, 61 Vacuum chamber 4 board holder 7 shutter 31 board holder 36 shower plate 39 Earth Shield 44 cover ring 54 Anti-corrosion plate 63 mask S Ti sprayed film T target W board

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4K029 DA01 DA10 DA12 DC20                 4K030 EA04 GA02 KA09 KA12 KA47                 5F045 AA03 AA08 AB33 AC01 AC12                       BB08 BB15 DP03 DP05 EC05                       EF05 EH05

Claims (12)

[Claims] 1. A component for a film forming apparatus having a metal sprayed film formed on a surface thereof so that an adhered film which is simultaneously formed and adhered during film formation on substrates is not separated, and the metal sprayed film is non-oxidized. A film forming apparatus component, which is formed by an arc spraying method or a flame spraying method in a strong atmosphere. 2. The film forming apparatus component according to claim 1, wherein the metal sprayed film is formed under reduced pressure lower than atmospheric pressure in the non-oxidizing atmosphere. 3. The Vickers hardness (H
v) is 200 or less, and the center line average roughness (Ra) of the surface of the metal sprayed film is 10 μm or more, and the film forming apparatus component according to claim 1. 4. The film-forming apparatus part according to claim 1, wherein the surface of the film-forming apparatus part is roughened in advance. 5. The film-forming apparatus component according to claim 1, wherein the metal sprayed film is a Ti sprayed film. 6. The film forming apparatus component is at least any one of a shower plate, a shutter, a deposition preventive plate, a chimney, a mask, a cover ring, an earth shield, and a substrate holder. Claim 1
The film forming apparatus component as described in. 7. A vacuum film forming apparatus comprising a film forming apparatus component having a metal sprayed film formed on a surface thereof so that an adhered film which is simultaneously formed and adhered during film formation on a substrate is not peeled off. A vacuum film forming apparatus, wherein the sprayed film of the film device component is formed by an arc spraying method or a flame spraying method in a non-oxidizing atmosphere. 8. The vacuum film forming apparatus according to claim 7, wherein the metal sprayed film is formed under reduced pressure lower than atmospheric pressure in the non-oxidizing atmosphere. 9. The Vickers hardness (H
The vacuum film forming apparatus according to claim 7, wherein v) is 200 or less, and the center line average roughness (Ra) of the surface of the metal sprayed film is 10 μm or more. 10. The vacuum film forming apparatus according to claim 7, wherein the surface of the film forming apparatus component is roughened in advance. 11. The vacuum film forming apparatus according to claim 7, wherein the metal sprayed film is a Ti sprayed film. 12. The film forming apparatus component is at least one of a shower plate, a shutter, a deposition preventive plate, a chimney, a mask, a cover ring, a ground shield, and a substrate holder. Item 7. The vacuum film forming apparatus according to Item 7.