JP2003340602A - Cutting tool with circuit and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting tool with circuit including an insulating layer which surely can insulate a conductive base material and a conductive film despite of its thinner thickness, and to provide its manufacturing method. <P>SOLUTION: The cutting tool with circuit is provided with the insulating layer 2 on the surface of the conductive base material 3 and a sensor circuit 13 comprising the conductive film formed on the insulating layer 2. This insulating layer 2 has an amorphous phase. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting tool with a circuit having a conductive circuit on its surface and a method for manufacturing the cutting tool.

[0002]

2. Description of the Related Art Conventionally, a method of automatically determining the tool life by detecting the wear amount of a cutting edge portion of a cutting tool, that is, self-diagnosis of the tool life by detecting the wear amount of the cutting tool How to do is being studied. For example, in JP-A-62-88552, an insulating layer is provided on the surface of a conductive base material, and a conductor path is embedded in the insulating layer.
A method is described in which a signal when the conductor path breaks during the cutting process is used as a trigger to detect the limit wear and the breakage.

Further, in Japanese Patent Laid-Open No. 59-81043, a tool in which a surface of a conductive base material is coated with an insulating aluminum oxide film is used, and a voltage is applied between the work material and the tool. There is also proposed a method of detecting the tool life by utilizing the fact that an electric current flows when the aluminum oxide film is worn, that is, at the end of its life.

[0004]

However, the insulating layer such as the aluminum oxide film described in the above publication is C.
Although produced by the VD method or the PVD method at a high temperature, when an aluminum oxide film is formed on a base material having a low coefficient of thermal expansion such as cemented carbide or cermet by the above method, the difference in the coefficient of thermal expansion results. As a result, tensile residual stress is generated in the aluminum oxide film during the cooling process after film formation, and as a result, cracks that lead to the base material in the aluminum oxide film.
May occur, and there is a risk of short-circuiting between the conductive base material and the conductive sensor film through the crack. Therefore, according to Japanese Patent Laid-Open No. 59-81043, it is described that an aluminum oxide film of at least 10 μm to 100 μm is necessary in order to ensure the insulating property of the insulating layer. There is a problem that if the thickness is increased, the cutting performance is deteriorated and the fracture resistance is deteriorated.

An object of the present invention is to solve such a problem, and an object thereof is to provide a cutting tool with a circuit provided with an insulating layer capable of reliably insulating between a conductive base material and a conductive film even if it is thin, and a cutting tool therefor. It is to provide a manufacturing method.

[0006]

In order to solve the above-mentioned problems, the present inventor has studied the structure of an insulating layer which enables reliable insulation, and as a result, the insulating layer is formed at a low temperature so that the insulating layer does not crystallize. By doing so, it is possible to reliably insulate between the conductive base material and the conductive film without causing a crack and to have excellent adhesiveness between the conductive base material and the conductive film. It was found that it would become an insulating layer.

That is, the cutting tool with a circuit of the present invention is
A cutting tool with a circuit, wherein an insulating layer is provided on the surface of a conductive base material, and a conductive circuit made of a conductive film is formed on the surface of the insulating layer, wherein the insulating layer comprises an amorphous phase. It is a cutting tool with a circuit.

Further, another cutting tool with a circuit of the present invention is
In a cutting tool with a circuit in which an insulating layer is provided on the surface of a conductive base material and a conductive circuit made of a conductive film is formed on the surface of the insulating layer, the half-value width w of the X-ray diffraction peak of the insulating layer is It is characterized in that it is 2 ° or more in terms of 2θ.

Further, it is desirable that the insulating layer contains Al and / or Si.

In the method for manufacturing a cutting tool with a circuit of the present invention, a conductive circuit is formed by forming an insulating layer on the surface of a conductive base material at a temperature of 600 ° C. or lower, and then forming a conductive film on the surface of the insulating layer. Is formed.

Further, it is desirable that the insulating layer is formed by a plasma CVD method.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION A cutting tool with a circuit according to the present invention will now be described with reference to FIG. b) A perspective view seen from diagonally below).

According to FIG. 1, the throw-away tip 1 is shown.
Has a rake surface 5 on one main surface, a seating surface 6 on the other main surface, and a flank surface 7 on the side surface, each of which has a substantially flat plate shape (a substantially rectangular parallelepiped shape in FIG. 1). Crossing ridge part of
In particular, when the main surface as shown in FIG.
Is composed of a plurality of flat surfaces, and a cutting edge 9 is formed at a corner portion where the rake surface 5 and two adjacent flanks 7 intersect.

According to the present invention, as shown in FIG. 2, which is an enlarged cross-sectional view of the main part of the throw-away tip 1 of FIG. 1, the throw-away tip 1 has an insulating layer 2 on the surface of a conductive base material 3. Then, the wear sensor circuit 13 made of the conductive film 12 for detecting the wear state of the throw-away chip 1 is deposited and formed, and the insulating layer 2 is formed as an amorphous phase.

This has the effect of suppressing the occurrence of cracks in the insulating layer 2 and making it less likely that a short circuit will occur between the conductive base material 3 and the conductive film 12.

Further, according to another throw-away tip with a circuit of the present invention, from the diffraction chart (2θ = 20 to 80 °) of the surface of the throw-away tip 1 as shown in FIG. 3 by the X-ray diffraction analysis method. Of the peaks of the insulating layer 2, the half-value width w of the peak showing the maximum intensity (the peak width at the intensity h ′ of 1/2 of the peak intensity h) is 2θ and 2 °.
Or more, preferably 8 ° or more at 2θ, further 10 at 2θ
The above effect can be provided even if it is at least °.

In addition, the total thickness of the insulating layer 2 is 0.1 to 2 from the viewpoint that the insulating property can be surely maintained, the adhesive force of the insulating layer 2 can endure cutting, and the chipping resistance during cutting is enhanced.
0 μm, particularly 0.1 to 10 μm, further 0.1 to 2 μm
Is desirable.

The material of the insulating layer 2 has a volume resistivity of 1 × 10.
AlN, Al ₂ O ₃ , and Si ₃ have sufficient insulation and cutting performance for forming the sensor circuit 13 because of the fact that they have a resistance of ⁸ Ω · m or more and have excellent resistance to oxidation at high temperatures. N ₄ , S
At least one insulating hard substance selected from the group consisting of iO ₂ , SiON, ZrO ₂ and TiO ₂ can be used. The insulating layer 2 preferably contains aluminum and / or silicon from the viewpoint of high temperature strength, wear resistance, oxidation resistance, and heat resistance.

The insulation and the high electric resistance as used herein mean that the measured value of the tester shown in FIG. 4 is 1000 kΩ or more. The measured value of the tester shown in FIG.
This is because if it is Ω or more, it can effectively function as a cutting tool with a circuit.

On the other hand, the conductive film 1 forming the sensor circuit 13
No. 2 has a strong bonding force to the insulating layer 2 formed on the conductive base material 3 of the throw-away tip 1, does not easily react with the work material, and the electric resistance value of the sensor circuit 13 always shows a stable value. It is easy to accurately detect the degree of wear of the away tip 1, the presence or absence of a defect, the reaction product is unlikely to be generated on the machined surface of the work material, the oxidation resistance is excellent, and the sensor circuit 13 by the oxide generation is formed. Ti, Zr, V, Nb, Ta, Cr, Mo, W, etc. can be accurately detected because there is no change in the electric resistance value and the degree of wear of the throw-away tip 1 and the presence or absence of defects can be accurately detected. 4a, 5a, 6a group metal, iron group metal such as Co, Ni, Fe, or metal material such as Al, TiC, VC, N
bC, TaC, Cr ₃ C ₂ , Mo ₂ C, WC, W ₂ C, Ti
N, VN, NbN, TaN, CrN, TiCN, VC
N, NbCN, TaCN, CrCN, etc. 4a, 5a, 6
Carbide, nitride, carbonitride of group a metal (Ti, Al)
At least one selected from the group N, especially TiN, (T
At least one selected from the group consisting of i, Al) N and (Ti, Al) CN, and further, TiN exhibiting a gold color are preferable.

The conductive film 12 has a thickness of 0.05.
If the thickness is less than μm, the bonding to the surface of the base material 3 becomes weak and the electric resistance value of the sensor becomes high, which may make it difficult to accurately detect the degree of wear or breakage of the throw-away tip 1. There is. Further, if the conductive film 12 having a thickness of more than 20 μm is to be formed, the conductive film 1 is formed at the time of formation.
There is a risk that a large stress is generated and remains inside 2 and the residual stress weakens the bonding of the conductive film 12 to the surface of the base material 3. Therefore, the film thickness of the conductive film 12 is preferably set to 0.05 to 20 μm.

On the other hand, as the conductive base material 3 of the throw-away tip 1, a conductive material having a resistance value of 10 Ω or less, an oxide containing a conductive auxiliary agent such as Ti carbide, nitride or carbonitride. Ceramics such as aluminum sintered bodies and silicon nitride sintered bodies, cermets, cemented carbides, cubic boron nitride sintered bodies (CBN / Cubic BoronNi)
tride), diamond sintered body (PCD / Poly)
Crystalline Diamond) is preferably used. Specific materials of the conductive base material 3 are shown below.

As the aluminum oxide sintered body, Ti is used.
2 to 40% by weight of C, 0.01 to 5.0% by weight of at least one of Fe, Ni and Co oxides, and the balance of Al
_It is possible to use an aluminum oxide-based sintered body containing ₂ O ₃ and inevitable impurities.

As the silicon nitride sintered body, Al is Al ₂
1.5 to 10 mol% in terms of O ₃ , 30 to 80 mol% of Ti carbides, nitrides and carbonitrides, the balance of 10 wt% or less of silicon nitride and rare earth oxides with respect to silicon nitride, and impurity oxygen. It is possible to use a silicon nitride-based sintered body having a ratio of 10 mol% or less in terms of SiO ₂ .

The cermet contains Ti in an amount of 50 to 80% by weight in terms of carbide, nitride or carbonitride and 10 to 40% by weight of an element of Group 6a in the periodic table in terms of carbide (nitrogen / Hard phase component 70 having an atomic ratio represented by (carbon + nitrogen) within the range of 0.4 to 0.6
˜90% by weight and a binder phase component 10 to 3 composed of an iron group metal
There is a TiCN-based cermet composed of 0% by weight.

Cemented carbides include those composed of a hard phase and a binder phase. The hard phase is tungsten carbide,
Alternatively, 5 to 15 wt% of tungsten carbide is replaced with carbides, nitrides, and carbonitrides of metals of Groups 4a, 5a, and 6a of the periodic table, and the binder phase is mainly an iron group metal such as Co. It is a component and is contained, for example, in a proportion of 5 to 15% by weight in the total amount.

Among the above materials, cermet,
A cemented carbide, a diamond sintered body having an iron group metal as a binder, and the like can be preferably used.

On the other hand, as the pattern of the sensor circuit 13, for example, as shown in FIG. 1, the sensor line 1 formed of a conductive band in the vicinity of the cutting edge 9 of the flank 7 and parallel to the cutting edge 9 is parallel.
5 is preferable, and the allowable wear width of the tool life (wear amount) can be defined by the formation position and width of the sensor line 15.

Then, for example, the width of the sensor line 15 is made to coincide with a life reference amount of the cutting edge 9 (a wear limit width of the cutting edge 9), for example, 0.05 to 0.7 mm, and the cutting edge 9 is used. By cutting, at least a part of the sensor line 15 is broken due to damage such as abrasion, the sensor circuits 13 are broken, that is, the sensor circuits 13 are broken, and a pair of sensor circuits formed at both ends of the sensor circuits 13 are cut. Connection terminal 2
The life of the cutting edge 9 can be detected by measuring the change in the resistance value between 0 and 20 (20 ′, 20 ′).

On the other hand, according to FIG. 1, a pair of connection terminals 2
Nos. 0 and 20 are formed on the seating surface 6, so that the sensor circuit 13 contacts the seating surface 6 and the chip holder 3 to be described later.
It is possible to easily connect to the pair of external terminals 36, 36 formed in 0.

Further, according to FIG. 1, a pair of connection terminals 2
0 and 20 are formed adjacent to each other, which facilitates the positioning of the external terminals 36 and 36 connected to the pair of connection regions.

Further, according to FIG. 1, the one end 27a of the sensor line 15 is connected to one of the connection terminals 2 through the first side surface line 24 formed on the side surface (flank surface 7) of the conductive base material 3.
0, the other end 27b of the sensor line 15 is connected to a turn-back line 26 formed on the rake face 5, and the turn-back line 26 and the other connecting terminal 20 are formed on the flank 7 (side face). The two side lines 28 are connected to each other. That is, according to FIG. 1, the sensor circuit 13 includes the first connection terminal 20-the first side surface line 2
4-Sensor line 15-Folding line 26-Second side face line 28-Second connection terminal 20.

Further, according to FIG. 1, particularly in a cutting tool in which a throw-away tip or the like can be attached and detached, a cutting edge 9 is formed in each corner portion 8 of both main surfaces, and a sensor line 15 (15 ') is formed. One is provided near each cutting edge 9. That is, as shown in FIG. 1, the main surface of the conductive base material 3 has a polygonal shape (quadrangle in FIG. 1), a plurality of flanks 7 (four in FIG. 1) are formed, and the main surface 2 is adjacent to the main surface 2. When there is a corner portion 8 that intersects with two flanks 7, the sensor lines 15 (15 ′) are desirably formed in each corner portion 8 (eight in FIG. 1). Depending on the mounting method, the eight corner portions 8 can be sequentially used for cutting.

According to FIG. 1, the first side surface line 24 and the second side surface line 28 formed on the flank surface 7 are formed.
Is mainly the arrangement position of the connection terminals 20 and 20 of the sensor circuit 13 and the arrangement position of the connection terminals 20 ′ and 20 ′ of the other sensor circuit 13 ′ on the surface opposite to the connection terminals 20 and 20 of the sensor circuit 13. With respect to the sensor line 15 (in other words, with respect to the cutting edge 9) so that they can be connected to the same external terminal 36 of the chip holder 30 of FIG. It is arranged so as to have a predetermined inclination angle instead of the orthogonal direction.

According to the present invention, the shape of the throw-away tip 1 is not limited to a square main surface (the rake surface 5 and the seating surface 6) as shown in FIG. Shapes, other regular polygons such as regular triangles, parallelograms, diamonds, etc. are applicable, and the cross-sectional shape of the throw-away tip 1 is not limited to a rectangle, and may be a trapezoidal shape. . In addition to the shapes described above,
The present invention can also be applied to grooving chips and the like.

Further, according to FIG. 1, a clamp hole 29 penetrating the conductive base material 3 is formed at the center of the conductive base material 3, and the throw-away tip 1 of FIG. As shown in the attached example of FIG. 5, the throw-away tip 1 has the clamp screw 3 in the clamp hole 29.
4 is screwed or is pressed from the rake face 5 side by a metal fitting (not shown), so that the chip holder 3
It is attached to 0 etc.

Further, according to FIG. 5, a chip mounting pocket 31 is formed at the tip of the chip holder 30. The bottom surface of the pocket 31 is a chip seat 32.
The side surface of the pocket 31 is in contact with the side surface of the chip 1 and serves as a restraining surface 33 for restraining the chip 1. The throw-away tip 1 is housed in the pocket 31, the seating surface 6 is in contact with the tip seat 32, and the side surface of the tip 1 is in contact with the restraining surface 33. Then, the clamp screw 34 is inserted into the clamp hole 29 of the throw-away tip 1 from above, and the tip of the clamp screw 34 is screwed into the screw hole 35 formed in the center of the tip seat 32. Be attached to.

Further, on the tip seat 32, for example, at a position facing one of the connection terminals 20, 20 connected to the sensor line 15 provided in the corner portion used for cutting the attached throw-away tip 1, for example, A pair of external terminals 36, 36, which are elastically urged upward and protrude from the tip seat 32 by a few mm, are provided so as to be electrically insulated from the tip holder 30. When the throw-away tip 1 is mounted in the pocket 31, the seating surface 6 of the throw-away tip 1 pushes down the external terminals 36, 36, and the upper ends of the external terminals 36, 36 are flush with the tip seat 32.
At this time, the upper ends of the external terminals 36, 36 have a pair of connection terminals 20, 2, provided on the seating surface 6 of the throw-away tip 1.
0 is in electrical contact with each.

Further, according to FIG. 5, the external terminals 36, 36
Is connected to a lead wire 38 arranged in the chip holder 30, and the lead wire 38 is connected to a detection circuit 39 equipped with an ohmmeter or the like. The resistance value of the sensor line 15 provided on the cutting edge 9 (corner portion 8 used for cutting) of the chip 1 can be measured.

In the mounted state of FIG. 5, for example, the cutting edge 9 of one corner portion 8 of the throw-away tip 1 is used for cutting. Then, when the cutting edge 9 of one corner portion 8 is worn, the clamp screw 34 and the pressing metal fitting are loosened, and the throw-away tip 1 is rotated by 90 ° around the center of the rake face 5 to be adjacent to each other. Another corner part 8
Can be used for cutting as the cutting edge 9. In this manner, the throw-away tip 1 can be rotated by 90 °, and the four corner portions on the one main surface side of the tip 1 can be sequentially used for cutting. Furthermore, if the throw-away tip 1 is turned upside down and mounted on a holder or the like, the four corners on the other main surface can be used for cutting in sequence,
A total of eight corners 8 can be used. When the corner portion 8 of the other main surface is used, the rake surface 5 and the seating surface 6 are reversed and function.

In addition to the throw-away tip,
It can also be applied to drills and the like.

Next, a method of manufacturing a cutting tool with a wear sensor circuit according to the present invention will be described.

The raw material powders of the respective materials forming the above-mentioned conductive base material are mixed and pulverized in the above-mentioned content ratio, and are molded by a predetermined method such as a press molding method to prepare a fired conductive base material 3. . The surface of the conductive base material 3 may be ground, if desired.
It is desirable to adjust the surface roughness (Rmax) to 0.1 to 10 μm by performing polishing.

If desired, on the surface of the conductive base material 3 produced as described above, 0.1 to 10 μm of Ti carbide, nitride and carbonitride and 0.1 to 10 μm of Al oxide are used. 1
0 to 10 μm of Ti and Al composite nitride
It is also possible to coat the conductive base material 3 with at least one hard film selected from the group m.

Next, the conductive base material 3 (or hard film)
The insulating layer 2 is formed on the surface of the film by the following film forming method.
According to the present invention, it is important for the film forming method of the insulating layer 2 that the film forming temperature is 600 ° C. or less, so that there are few cracks that cause a short circuit reaching the conductive base material. The insulating layer 2 having low crystallinity can be formed. That is, when the film formation temperature of the insulating layer 2 exceeds 600 ° C., cracks are likely to occur in the insulating layer 2 due to the difference in thermal expansion due to crystallization of the insulating layer 2 and cooling after the film formation, and the insulating property of the insulating layer 2 is increased. Is damaged.

The pressure in the furnace during film formation is preferably 10 to 1000 Pa in order to reduce impurities in the film.

As a film forming method, a PVD method such as ion plating, sputtering, vapor deposition, or a plating method can be applied. Particularly, the film can be formed at a low temperature and has good throwing power, and defects such as pinholes. It is hard to occur,
It is desirable to use the plasma CVD method.

For example, when forming an Al ₂ O ₃ film by the plasma CVD method, a mixed gas of AlCl ₃ , O ₂ , H ₂ and Ar, or a gas such as CO ₂ or N ₂ O is used instead of O _2. You may form a film. The conditions for forming a film by the plasma CVD method are, for example, using pulsed DC plasma as a plasma source, or high frequency or microwave, and a plasma density of 8 to 22 kW / m ² , a frequency of 16.6 kHz, and 33 kHz.
It is desirable to form a film as z. Further, in order to generate a higher density plasma, it is possible to use a plasma generation source such as ECR plasma, inductively coupled plasma, or helicon wave plasma. Regarding the film forming temperature, 60
When the film is formed at a temperature higher than 0 ° C., the crystal of the insulating layer 2 does not become amorphous and cracks are generated in the insulating layer during the cooling process. Therefore, the film forming temperature is preferably 600 ° C. or lower. . The pressure in the furnace is set to 10 to 1000 Pa.

Further, for example, SiON is formed by a plasma CVD method.
When forming a film, a mixed gas of SiH ₄ , N ₂ O and N ₂ is used. High frequency plasma or microwave plasma is used as the plasma source. Plasma density is 1.0 to 1.3k
W / m ² and frequency 13.56 MHz are used. Further, in order to generate a higher density plasma, it is possible to use a plasma generation source such as ECR plasma, inductively coupled plasma, or helicon wave plasma. Deposition temperature is 600 ° C
Below, 350 ° C. or higher is particularly preferable. The reason is that if the temperature is lower than 350 ° C., the amount of hydrogen in the film increases, so that gas is generated when the operating temperature rises, which is not preferable. The pressure in the furnace is between 120 and 130 Pa.

Then, by adopting the CVD method, the PVD method such as ion plating, sputtering and vapor deposition, the plating method and the like, the conductive film 12 is formed to a predetermined thickness on almost the entire surface of the base material of the throw-away chip. Then, the conductive film 12 is processed into a predetermined pattern by laser processing, whereby the sensor circuit 13 can be obtained.

[0051]

[Examples] -Examples 1-Volume specific resistance value of the conductive base material is 1.0 × 10 ⁻⁶ Ω.
TiCN-based cermet and Al ₂ shown in Table 1 below
O ₃ -TiC based a ceramic, is the main surface as shown in FIG. 1 was prepared as the rectangular shape of approximately square. The surface roughness (Ry) of this conductive base material was processed to 8 μm or less.

The insulating layers shown in Table 2 were prepared for the above conductive base materials under the conditions shown in Table 2. afterwards,
On the surface of the insulating film, under a nitrogen atmosphere of 4.0 Pa, 500
A conductive film made of TiN was formed by a PVD method at ℃, and processed into a circuit pattern shown in FIG. 1 by a laser to manufacture a sensor circuit.

Regarding the obtained chips, all samples had good electrical continuity in the sensor circuit, and there was no part where the base material and the sensor circuit were in contact with each other due to peeling of the insulating layer or the like. It was confirmed.

With respect to the obtained chip, the insulation state between the conductive base material 3 and the sensor circuit 12 through the insulating layer 2 was confirmed with the tester 37 by the method shown in FIG. In order to confirm the insulation state, a chip having an electric resistance value of 1000 kΩ or more was regarded as a good product, and the electric resistance value of each of 10 samples prepared by the same method was measured. The non-defective rate was calculated by the formula of (n / 10) × 100 (%). The results are shown in Table 1.

[0055]

[Table 1]

[0056]

[Table 2]

As is clear from the results of Tables 1 and 2, the non-defective products of the present invention 1, 2 and 3 had a yield of 70% or more, and were electrically insulated between the conductive base material and the conductive film.

[0058]

As described above, in the cutting tool with a circuit according to the first aspect, by using the insulating layer made of an amorphous phase as the insulating layer forming the conductive circuit, the cutting tool is thin and has no cracks or pins. Since an insulating layer having no holes can be formed, an insulating layer that does not short-circuit between the conductive base material and the conductive circuit can be formed without adversely affecting cutting performance, and thus can function normally as a sensor circuit. .

Further, in the cutting tool with a circuit according to claim 2, the insulating layer forming the conductive circuit is made thin by using an insulating layer having a half value width w of the X-ray diffraction peak of 2θ of 2 ° or more. In addition, since an insulating layer without cracks and pinholes can be produced, an insulating layer that does not short-circuit between the conductive base material and the conductive circuit without adversely affecting cutting performance can be produced, and thus can be normally used as a sensor circuit. Can function.

In the cutting tool with a circuit according to the third aspect, since the insulating layer contains Al and / or Si, a cutting tool with a circuit excellent in high temperature strength, wear resistance, oxidation resistance and heat resistance is produced. can do.

Further, in the method for manufacturing a cutting tool with a circuit according to the fourth aspect of the present invention, the amorphous insulating layer is manufactured at a temperature of 600 ° C. or lower to suppress the generation of cracks in the insulating layer and to prevent the conductive matrix. A short circuit does not occur between the material and the conductive circuit, and the sensor circuit can function normally.

In the method for manufacturing a cutting tool with a circuit according to the fifth aspect, by using the plasma CVD method as the method for manufacturing the insulating layer, it is possible to easily manufacture the insulating layer without cracks at a low temperature. A short circuit between the conductive base material and the conductive sensor circuit can be prevented, and the sensor circuit can function normally.

[Brief description of drawings]

FIG. 1 is a schematic perspective view ((a) viewed from above, (b) viewed from below) showing an embodiment of a cutting tool with a circuit according to the present invention.

FIG. 2 is an enlarged cross-sectional view of essential parts of the cutting tool with circuit of the present invention.

FIG. 3 is an X-ray diffraction analysis chart of a throw-away tip surface showing an embodiment of a cutting tool with a circuit according to the present invention.

FIG. 4 is a diagram for explaining a method for measuring an electric resistance value between a sensor circuit (conductive film) via an insulating layer and a conductive base material.

FIG. 5 is an exploded perspective view for explaining an example of mounting the cutting tool of FIG. 1 on a tip holder.

FIG. 6 is an enlarged sectional view of an essential part showing a conventional cutting tool with a circuit.

[Explanation of symbols]

1 Throw-away tip 2 insulating layers 3 Conductive base material 5 rake face 6 Seating surface 7 flank 8 corners 9 cutting edges 12 Conductive film 13, 13 'sensor circuit 15,15 'sensor line 17 reading line 20, 20 'connection terminal 24 First side line 26 Folding line 27 (27a, 27b) connection part 28 Second side line 29 Clamp hole 30 chip holder 31 pockets 32 chip seat 33 Restraint surface 34 Clamp screw 35 screw holes 36 external terminals 37 Tester resistance measuring instrument 38 Lead wire 39 Detection circuit 41 crack

Claims (5)

[Claims] 1. A cutting tool with a circuit, comprising: an insulating layer provided on the surface of a conductive base material; and a sensor circuit made of a conductive film formed on the surface of the insulating layer. A cutting tool with a circuit that is characterized by 2. A cutting tool with a circuit, comprising an insulating layer provided on the surface of a conductive base material and a conductive circuit formed of a conductive film on the surface of the insulating layer, for X-ray diffraction measurement of the insulating layer. And a half-value width w of the peak showing the maximum peak strength is 2 ° or more in terms of 2θ, and a cutting tool with a circuit. 3. The cutting tool with a circuit according to claim 1, wherein the insulating layer contains Al and / or Si. 4. A cutting tool with a circuit, comprising: forming an insulating layer on a surface of a conductive base material at a temperature of 600 ° C. or lower, and then forming a sensor circuit made of a conductive film on the surface of the insulating layer. Manufacturing method. 5. The method of forming the insulating layer is plasma CVD
5. The method for manufacturing a cutting tool with a circuit according to claim 4, wherein the method is a method.