JP2003338703A - Manufacturing method for non-reciprocal circuit element, and communications device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a non-reciprocal circuit and a communications device which is easy to attach capacitors for matching, and has high reliability. <P>SOLUTION: After coating solder paste on capacitor coupling parts 42a-42c of a grounding board 42, the capacitors for matching C1-C3 are mounted on the coupling parts 42a-42c with cold-side capacitor electrodes 2 underneath. After coating the solder paste on hot side capacitor electrodes 1 of the capacitors C1-C3, a ferrite 20 provided with central electrodes 21-23 is mounted from above. Port parts P1-P3 make surface-contact via the solder paste, with the capacitor electrodes 1 of the capacitors C1-C3, respectively. In this state, the solder paste is heated and the capacitors C1-C3 are soldered. Next, the coupling parts 42a-42c and port parts P1-P3 are bent, and the capacitors C1-C3 are mounted longitudinally. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a non-reciprocal circuit device, and more particularly to a method for manufacturing a non-reciprocal circuit device such as an isolator and a circulator used in microwave band communication equipment and a communication device.

[0002]

2. Description of the Related Art In general, a lumped-constant isolator used in mobile communication equipment such as a mobile phone has a function of passing a signal only in the transmission direction and blocking transmission in the opposite direction. Further, in recent mobile communication devices, there is a strong demand for cost reduction as well as size reduction and weight reduction due to its application, and accordingly, isolator size reduction, weight reduction and cost reduction are also required. There is.

As such a lumped constant isolator, one shown in FIG. 10 has been proposed. The lumped-constant type isolator 11 includes left and right side walls 12a and a bottom wall 1.
On the lower yoke 12 made of magnetic metal having 2b,
The resin terminal case 13 is arranged, the center electrode assembly 14 is housed in the terminal case 13, and the upper yoke 15 made of magnetic metal is mounted. A permanent magnet 16 is attached to the inner surface of the upper yoke 15, and a DC magnetic field is applied to the center electrode assembly 14 by the permanent magnet 16.

In the center electrode assembly 14, three center electrodes 21 to 23 are arranged on the upper surface of the microwave ferrite 20 so as to intersect each other every 120 degrees in an electrically insulated state.
These center electrodes 21 to 23 bend the port portions P1 to P3 on one end side at right angles, and shield the shield portion 26 common to the center electrodes 21 to 23 on the other end side to the ferrite 20.
Is abutted on the lower surface of. The common shield portion 26 substantially covers the lower surface of the ferrite 20 and is connected to the bottom wall 12b of the lower yoke 12 through the window 13a of the terminal case 13.

The terminal case 13 includes input / output terminals 31, 3
2 and the ground terminals 33 and 34 are insert-molded. One end of each of the input / output terminals 31, 32 is exposed on the outer side wall of the case 13, and the other end is exposed on the inner side wall of the case 13 to form input / output connection electrode portions 18a, 18b. Similarly, one end of each of the ground terminals 33 and 34 is exposed on the outer side wall of the case 13, and the remaining two other ends are exposed on the inner side wall of the case 13 so that the ground connection electrode portions 17a, 17 are connected.
b and 17c and 17d are formed.

Port portions P1 to P3 of the center electrodes 21 to 23
Are connected to the hot-side capacitor electrodes 1 of the matching capacitors C1 to C3. Matching capacitors C1 to C
Each cold side capacitor electrode 2 of 3 is connected to the ground connection electrode portions 17a, 17c, 17d. One end of the terminating resistor R is connected to the hot-side capacitor electrode 1 of the matching capacitor C3, and the other end is connected to the ground connection electrode portion 17b. That is, the matching capacitor C3 and the terminating resistor R
And are electrically connected in parallel between the port P3 of the center electrode 23 and the ground. Further, the center electrodes 21, 22
Each of the port portions P1 and P2 of is connected to the input / output connection electrode portions 18a and 18b.

[0007]

In the conventional isolator 11, the matching capacitors C1 to C3 are placed vertically and the ports P1 to P3 and the ground connection electrode 17 are provided.
It had to be inserted between a, 17c and 17d. Moreover, it is necessary to solder the capacitor electrodes 1 and 2 of the matching capacitors C1 to C3 to the port portions P1 to P3 and the ground connection electrode portions 17a, 17c, 17d.

However, the matching capacitors C1 to C3, which are small in size and complicated to handle, are replaced by the ports P1 to P3.
There is a problem in that the work of inserting between No. 3 and the ground connection electrode parts 17a, 17c, 17d is time-consuming. Further, since the center electrodes 21 to 23 must be bent at right angles to the port portions P1 to P3 in advance, if there is variation in the bending angle of the port portions P1 to P3, the port portion P1.
There was a concern that the soldering of 1 to P3 and the matching capacitors C1 to C3 would become unstable. Further, the matching capacitors C1 to C are formed by the solder dripping during the soldering at this time.
There is also a problem that the hot side capacitor electrode 1 and the cold side capacitor electrode 2 of 3 are short-circuited and the manufacturing yield is low.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a nonreciprocal circuit device and a communication device in which a matching capacitor can be easily assembled and which has high reliability.

[0010]

In order to achieve the above object, a method for manufacturing a nonreciprocal circuit device according to the present invention comprises:
A permanent magnet, a ferrite to which a direct current magnetic field is applied by the permanent magnet, a plurality of center electrodes extending from the first main surface of the ferrite to the second main surface through the side surface, and the second main surface of the ferrite A metal ground plate that is electrically connected to a plurality of center electrodes, and a plurality of matching capacitors that have hot-side capacitor electrodes and cold-side capacitor electrodes provided on both main surfaces. A method for manufacturing a reversible circuit element, comprising: (a) sandwiching each matching capacitor between each port of a plurality of center electrodes assembled to a ferrite and a capacitor connecting part extending from an end of a ground plate. After that, the hot-side capacitor electrode is electrically connected to the center electrode port, and the cold-side capacitor electrode is electrically connected to the ground plate capacitor connection part. And (b) the capacitor connection part and the port part where the capacitor electrodes are electrically connected are bent, and at least one of the matching capacitors is provided with a capacitor electrode surface of 60 degrees or more and 120 degrees or less with respect to the ferrite. And a step of arranging so as to form an angle.

According to the above method, the matching capacitor is sandwiched between the substantially flat ground plate and the center electrode, and in this state, the ground plate, the center electrode and the matching capacitor are electrically connected, and then the port portion is connected. Bend the capacitor connection and place the matching capacitor vertically. Therefore, the matching capacitor can be integrally handled as a unit together with the center electrode, the ground plate and the ferrite. Therefore, the matching capacitor can be easily mounted. “Electrically connected” means, for example, soldering or adhesion with a conductive adhesive.

Further, an insulator for preventing solder outflow is provided in the vicinity of the capacitor connecting portion of the ground plate and in the vicinity of the port portion of the center electrode. This insulator regulates the dripping of the solder when soldering the matching capacitor.
A short circuit between the hot-side capacitor electrode and the cold-side capacitor electrode of the matching capacitor is prevented.

By providing a bent portion in advance on the base of the capacitor connecting portion of the ground plate, the capacitor connecting portion can be bent with a dimensional margin.

Further, since the communication device according to the present invention includes the nonreciprocal circuit device obtained by the manufacturing method having the above-mentioned characteristics, the manufacturing cost is low and the reliability is high.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of a method for manufacturing a nonreciprocal circuit device and a communication device according to the present invention will be described below with reference to the accompanying drawings.

[First Embodiment, FIGS. 1 to 6] FIG. 1 is for explaining one embodiment of a method for manufacturing a non-reciprocal circuit device according to the present invention. It is a figure. The nonreciprocal circuit element 41 is obtained by applying the present invention to the lumped constant isolator 11 described with reference to FIG. As shown in FIG. 1, a lumped constant isolator 41 is provided.
Includes a lower yoke 12, a resin terminal case 53, a center electrode assembly 54, a permanent magnet 16, and an upper yoke 15.

The lower yoke 12 is made of magnetic metal and has left and right side walls 12a and a bottom wall 12b. The terminal case 53 is arranged on the lower yoke 12, the center electrode assembly 54 is housed in the terminal case 53, and the upper yoke 15 made of magnetic metal is mounted. A permanent magnet 16 is attached to the lower surface of the upper yoke 15, and a DC magnetic field is applied to the center electrode assembly 54 by the permanent magnet 16. The lower yoke 12, the center electrode assembly 54, and the upper yoke 15 form a magnetic path.

As shown in FIGS. 2 and 3, the center electrode assembly 54 has three center electrodes 21 to 23 on the upper surface (first main surface) of the microwave ferrite 20 in an electrically insulated state of 120 degrees. They are arranged to intersect each other. These center electrodes 21 to 23 have port portions P1 to P on one end side, respectively.
3 is bent at a right angle, and each center electrode 21 on the other end side is bent.
The common shield part 26 of 23 to 23 is brought into contact with the lower surface (second main surface) of the ferrite 20. Common shield 26
Substantially covers the lower surface of the ferrite 20.

The ground plate 42 is arranged on the lower surface side of the ferrite 20, and is provided with the common shield portion 26 of the center electrodes 21 to 23.
Are surface-contacted (using solder or a conductive adhesive or the like, if necessary) to be electrically connected. Capacitor connecting portions 42a, 42b, 42c extend from the end portion of the ground plate 42 and rise so as to be parallel to the port portions P1 to P3 of the center electrodes 21 to 23. The ground plate 42 is connected to the bottom wall 12b of the lower yoke 12 through the window 53a of the terminal case 53 and is grounded.

In the matching capacitors C1 to C3, the hot side capacitor electrodes 1 are soldered to the port portions P1 to P3, respectively, and the cold side capacitor electrodes 2 are connected to the ground plate 42.
Are soldered to the capacitor connecting portions 42a, 42b, 42c. At this time, the matching capacitors C1 to C3
Are arranged such that the surfaces of the capacitor electrodes 1 and 2 form an angle of 60 degrees or more and 120 degrees or less with respect to the upper surface of the ferrite 20. In the case of the first embodiment, the angle is set to 9
It was set to 0 degrees. Each of the matching capacitors C1 to C3 is a single plate type capacitor in which capacitor electrodes 1 and 2 are formed on both surfaces of a dielectric substrate 3.

The matching capacitors C1 to C3 can be mounted, for example, as shown in FIG. That is, the ground plate 42 includes the capacitor connecting portions 42a to 42a.
Assuming that c is raised, the bent portion 43 is previously formed on the base portion.
Is provided to allow a dimensional margin. This ground plate 4
After the solder paste is applied to the second capacitor connection portions 42a to 42c, the matching capacitors C1 to C3 are placed thereon with the cold side capacitor electrode 2 facing downward.

Further, after solder paste is applied on the hot side capacitor electrodes 1 of the matching capacitors C1 to C3, the ferrite 20 having the center electrodes 21 to 23 mounted thereon is placed from above. Common shield part 2 of center electrodes 21-23
6 is in surface contact with the upper surface of the ground plate 42, and the port portions P1 to P
3 is in surface contact with each of the hot-side capacitor electrodes 1 of the matching capacitors C1 to C3 via a solder paste.
In this state, the solder paste is heated and the matching capacitor C
Solder 1 to C3. Next, the capacitor connecting portion 42
a to 42c and the ports P1 to P3 are bent so that the matching capacitors C1 to C3 have the surfaces of the capacitor electrodes 1 and 2 at an angle of 60 degrees or more and 120 degrees or less with respect to the upper surface of the ferrite 20. Deploy. Thus, the center electrode assembly 54 is obtained.

The terminal case 53 has input / output terminals 31, 3
2 and the ground terminal 33 are insert-molded. Each of the input / output terminals 31 and 32 has a case 5 at one end.
3 is exposed on the outer side wall and the other end is exposed on the inner side wall of the case 53 to form the input / output connection electrode portions 18a, 18b.
Similarly, the ground terminal 33 has one end exposed on the outer wall of the case 53 and the other end exposed on the inner wall of the case 53 to form the ground connection electrode portion 17b.

As shown in FIG. 5, the center electrode assembly 54 and the terminating resistor R are housed in the terminal case 53 having the above structure. Port portions P1 and P of the center electrodes 21 and 22
Each of the two is connected to the input / output connection electrode parts 18a and 18b by a method such as soldering. One end of the terminating resistor R is connected to the ground connection electrode portion 17b, and the other end is connected to the hot side capacitor electrode 1 of the matching capacitor C3.
FIG. 6 shows an electrical equivalent circuit of the isolator 41.

In the method of manufacturing the isolator 41 having the above-described method, matching capacitors C1 to C3 are respectively provided between the port portions P1 to P3 of the center electrodes 21 to 23 and the capacitor connecting portions 42a to 42c of the ground plate 42. Since it is mounted, matching capacitors C1 to C3 and center electrodes 21 to 2
3, the ground plate 42 and the ferrite 20 can be handled as one unit. As a result, the work of assembling the matching capacitors C1 to C3, which are small in size and are complicated to handle, is eliminated, and the isolator 41 is easily manufactured.

In the first embodiment, after the matching capacitors C1 to C3 are connected to the port portions P1 to P3 and the capacitor connecting portions 42a to 42c, the port portions P1 to P3 and the capacitor connecting portions 42a to 42c are connected. It is bent to vertically raise the matching capacitors C1 to C3. Therefore, compared with the conventional method of manufacturing the isolator 11 (see FIG. 10) in which the port portion must be bent before connecting the matching capacitor, the port portions P1 to P3 and the matching capacitor C1 to The soldering with C3 becomes reliable, and the connection reliability is improved.

Further, since the cold side capacitor electrode 2 of each of the matching capacitors C1 to C3 is grounded through the ground plate 42, the ground connection electrode portion 17a formed in the conventional terminal case 13 (see FIG. 10). , 17c,
17d can be omitted, the structure of the terminal case 53 can be simplified, and the cost can be reduced.

[Second Embodiment, FIGS. 7 and 8] FIGS. 7 and 8 show a center electrode assembly 64 of another embodiment of the method for manufacturing a nonreciprocal circuit device according to the present invention. The center electrode assembly 64 is the center electrode assembly 54 of the isolator 41 of the first embodiment provided with insulators 65 and 66 (indicated by diagonal lines in FIGS. 7 and 8) for preventing solder outflow. Is.

The insulator 65 is provided in the vicinity of the portion of the capacitor connecting portions 42a to 42c of the ground plate 42 to which the matching capacitors C1 to C3 are connected. The insulator 66 is
The center electrodes 21 to 23 are provided near the ports P1 to P3. The flow of solder is restricted by the insulators 65 and 66, and the hot-side capacitor electrode 1 of the matching capacitors C1 to C3 and the ground plate 42 are short-circuited, or
It is possible to prevent short circuit between the hot side capacitor electrode 1 and the cold side capacitor electrode 2. Further, since the outflow of solder is restricted by the insulators 65 and 66, the positional accuracy of the matching capacitors C1 to C3 is also improved.

Further, in the second embodiment, the center electrodes 21, 22 are hot in order to prevent short circuit between the hot side capacitor electrode 1 and the center electrodes 21, 22 of the matching capacitors C1, C2 in the vertical installation state. An insulator 67 is provided in a portion facing the side capacitor electrode 1. This allows
A more reliable isolator can be obtained.

[Third Embodiment, FIG. 9] In the third embodiment,
A mobile phone will be described as an example of the communication device according to the present invention.

FIG. 9 is an electric circuit block diagram of the RF portion of the mobile phone 120. In FIG. 9, 122 is an antenna element, 123 is a duplexer, 131 is a transmission side isolator, 132 is a transmission side amplifier, 133 is a transmission side interstage bandpass filter, 134 is a transmission side mixer, 135 is a reception side amplifier, 136 is A receiving side interstage bandpass filter, 137 is a receiving side mixer, 138 is a voltage controlled oscillator (VCO), and 139 is a local bandpass filter.

Here, as the transmission side isolator 131, the lumped constant type isolator obtained by the manufacturing method of the first or second embodiment can be used. By mounting these isolators, an inexpensive and highly reliable mobile phone can be realized.

[Other Embodiments] The present invention is not limited to the above-mentioned embodiments, but various configurations can be made within the scope of the gist of the present invention. For example, in the first and second embodiments, the matching capacitors C1 to C3 are all placed vertically (the capacitor electrode surface is placed perpendicular to the horizontal plane), but all the matching capacitors C1 to C3 are not necessarily required. Does not need to be placed vertically, but the two matching capacitors C1 and C2 may be placed vertically and the remaining one matching capacitor C3 may be placed horizontally (the capacitor electrode surface is placed parallel to the horizontal plane). . That is, at least one of the matching capacitors may be arranged so that the capacitor electrode surface forms an angle of 60 degrees or more and 120 degrees or less with respect to the ferrite.

Further, the matching capacitors C1 to C3 can be mounted by using a conductive adhesive instead of soldering. The matching capacitors C1 to C3 may be multilayer capacitors. In addition to the isolator, the present invention can be applied to non-reciprocal circuit devices used in other high-frequency components such as circulators.

[0036]

As is apparent from the above description, according to the present invention, the matching capacitor is sandwiched between the ground plate and the center electrode, and the ground plate, the center electrode and the matching capacitor are electrically connected in this state. After connecting, the port and the capacitor connection are bent and the matching capacitor is placed vertically. Therefore, the matching capacitor can be handled as one unit together with the center electrode, the ground plate and the ferrite. Therefore, it is easy to mount a matching capacitor having a small size, which is complicated to handle, the matching efficiency of the nonreciprocal circuit device is significantly improved, and the cost thereof can be significantly reduced. As a result, the cost of the communication device can be reduced.

Further, by providing an insulator for preventing solder outflow in the vicinity of the capacitor connection portion of the ground plate and in the vicinity of the port portion of the center electrode, unnecessary short circuit is eliminated, and the reliability is higher. A reversible circuit element and a communication device can be obtained.

[Brief description of drawings]

FIG. 1 is a first method of manufacturing a non-reciprocal circuit device according to the present invention.
FIG. 3 is an exploded perspective view of the non-reciprocal circuit device for explaining the embodiment.

FIG. 2 is a front view of a center electrode assembly of the nonreciprocal circuit device of FIG.

3 is a plan view of the center electrode assembly of FIG.

FIG. 4 is an explanatory view of assembling a matching capacitor into the center electrode assembly of FIG.

5 is a plan view showing the internal structure of the non-reciprocal circuit device of FIG. 1. FIG.

6 is an electrical equivalent circuit diagram of the nonreciprocal circuit device of FIG.

FIG. 7 is a second method of manufacturing a nonreciprocal circuit device according to the present invention.
The front view of the center electrode assembly of embodiment.

8 is a plan view of the center electrode assembly shown in FIG.

FIG. 9 is a block diagram showing an embodiment of a communication device according to the present invention.

FIG. 10 is an exploded perspective view of a conventional non-reciprocal circuit device.

[Explanation of symbols]

1 ... Hot side capacitor electrode 2 ... Cold side capacitor electrode 12 ... Lower yoke 53 ... Resin terminal case 54, 64 ... Center electrode assembly 15 ... Upper yoke 16 ... Permanent magnet 20 ... Ferrite 21-23 ... Center electrode 26 ... Common shield part 31, 32 ... Input / output terminals 33 ... Ground terminal 41 ... Isolator 42 ... Ground plate 42a, 42b, 42c ... Capacitor connection part 65, 66 ... Insulator P1 to P3 ... Port section C1 to C3 ... Matching capacitors 120 ... mobile phone 131 ... Transmitter side isolator

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takashi Hasegawa             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. (72) Inventor Seikatsu Mori             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. (72) Inventor Ritsuhiro Tsunemon             2-10-10 Tenjin, Nagaokakyo, Kyoto Stock             Murata Manufacturing Co., Ltd. F-term (reference) 5J013 FA07

Claims (4)

[Claims] 1. A permanent magnet, a ferrite to which a DC magnetic field is applied by the permanent magnet, a plurality of center electrodes extending from a first main surface of the ferrite to a second main surface through side surfaces, and A plurality of metal ground plates arranged on the second main surface side of the ferrite and electrically connected to the plurality of center electrodes, and a plurality of hot-side capacitor electrodes and cold-side capacitor electrodes are provided on both main surfaces. A method for manufacturing a non-reciprocal circuit device including a matching capacitor, comprising a port portion of each of the plurality of center electrodes assembled to the ferrite and a capacitor connection portion extending from an end portion of the ground plate. After sandwiching each of the matching capacitors, the hot side capacitor electrode is electrically connected to the port portion of the center electrode, and the cold side capacitor electrode is connected. Electrically connecting to the capacitor connection portion of the ground plate, and bending the capacitor connection portion and the port portion electrically connected to the capacitor electrode, at least one of the matching capacitor, And a step of arranging the capacitor electrode surface so as to form an angle of 60 degrees or more and 120 degrees or less with respect to the ferrite. 2. An insulator for preventing solder outflow is provided in the vicinity of the capacitor connecting portion of the ground plate and in the vicinity of the port portion of the center electrode. Reversible circuit element manufacturing method. 3. The method for manufacturing a nonreciprocal circuit device according to claim 1, wherein a bent portion is provided in advance on a base portion of the capacitor connecting portion of the ground plate. 4. A communication device, comprising at least one of the nonreciprocal circuit elements obtained by the manufacturing method according to claim 1. Description: