JP2003332710A - Circuit board with embedded electric conductor - Google Patents

Circuit board with embedded electric conductor

Info

Publication number
JP2003332710A
JP2003332710A JP2002121525A JP2002121525A JP2003332710A JP 2003332710 A JP2003332710 A JP 2003332710A JP 2002121525 A JP2002121525 A JP 2002121525A JP 2002121525 A JP2002121525 A JP 2002121525A JP 2003332710 A JP2003332710 A JP 2003332710A
Authority
JP
Japan
Prior art keywords
conductor
groove
concave groove
substrate
concave
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002121525A
Other languages
Japanese (ja)
Inventor
Akira Uehara
旻 上原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
YAMANASHI FUSO KK
Original Assignee
YAMANASHI FUSO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by YAMANASHI FUSO KK filed Critical YAMANASHI FUSO KK
Priority to JP2002121525A priority Critical patent/JP2003332710A/en
Publication of JP2003332710A publication Critical patent/JP2003332710A/en
Pending legal-status Critical Current

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  • Manufacturing Of Printed Wiring (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board with an embedded electric conductor as a circuit member for reducing size and weight of electronic equipment and for saving power, which facilitates manufacture, is appropriate for mass production and reduces manufacturing cost by forming a recessed groove in a substrate along a designed circuit pattern with embedded electric conductor. <P>SOLUTION: The recessed groove (2) is formed by means of a molding machine or a press machine or other means having a metallic mold of a circuit pattern designed in one surface or both surfaces, or one surface or both surfaces and a solid surface of an electric insulation substrate (1). The electric conductor (3) is inserted into the recessed groove (2) so as not to stick out therefrom, while allowing an end (3<SB>1</SB>) of the electric conductor (3) to protrude from an end (1<SB>1</SB>) of the substrate (1). <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明が属する技術分野】本発明は、電子機器の小型軽
量化を図る回路部材として導電埋め込み回路基板に関す
るもので設計した配線回路パターンに沿って基体に凹溝
を成形し、且つ導電体を圧入し、又は緩く嵌め込んで装
入することによって、製造が簡単で量産に適し、製作コ
ストの低減を図ることを目的とする。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive embedded circuit board as a circuit member for reducing the size and weight of an electronic device, in which a groove is formed in a base along a wiring circuit pattern designed and a conductor is press-fitted. The present invention aims to reduce the manufacturing cost by facilitating the simple manufacturing, suitable for mass production, and by loosely fitting and inserting.

【0002】[0002]

【従来の技術】従来この種の電気回路は、プリント配線
基板によることが行われる。そのプリント配線基板は例
えば、絶縁材料から成る基板の表面に銅メッキないし銅
箔を張り付けるなどして形成した金属層を蝕刻すること
によって電気回路を形成している。
2. Description of the Related Art Conventionally, an electric circuit of this type is based on a printed wiring board. In the printed wiring board, an electric circuit is formed by etching a metal layer formed by, for example, applying copper plating or copper foil to the surface of a substrate made of an insulating material.

【0003】[0003]

【発明が解決しようとする課題】ところが、前記のプリ
ント配線基板は、専ら平面状回路や平面状配線だけであ
る。そして、基板の平面に銅メッキや銅箔を張り付けた
り、金属層を蝕刻したりする作業を必要とし、設備に費
用が掛かっているためコストが高く、且つ生産性が悪か
った。
However, the above-mentioned printed wiring board is exclusively a plane circuit or plane wiring. Further, it is necessary to attach copper plating or copper foil to the flat surface of the substrate or to etch the metal layer, and the equipment is expensive, so the cost is high and the productivity is poor.

【0004】そこで、従来においても、プリント配線基
板のような平面状回路や平面状配線だけではなく、立体
回路や立体配線ができるように射出成形機による回路基
板を製造することは知られている。(例えば、(1)特開
昭63−50482号公報、(2)特開平1−20798
9号公報、(3)特開2001−77512公報)。
Therefore, conventionally, it is known to manufacture a circuit board by an injection molding machine so that a three-dimensional circuit or three-dimensional wiring can be formed in addition to a two-dimensional circuit or two-dimensional wiring like a printed wiring board. . (For example, (1) Japanese Patent Laid-Open No. 63-50482, (2) Japanese Patent Laid-Open No. 1-20798.
No. 9, gazette (3) JP 2001-77512 A).

【0005】しかしながら、前記の公開公報(2)・(3)の
射出成形機による回路基板を製造に関する発明は、易め
っき性プラスチック材料の凸部の表面及び穴の内周面を
従来の化学粗化を行っても易めっき性プラスチック材料
と金属めっき層との密着性を顕著に改善することができ
なかった。また、易めっき性プラスチック材料と金属層
との密着性は、ベースのめっき性プラスチック材料自身
の機械的強度特性が弱い場合にも低下する難点があっ
た。
However, the inventions relating to the production of the circuit board by the injection molding machine of the above-mentioned publications (2) and (3), the surface of the convex portion of the easily-platable plastic material and the inner peripheral surface of the hole are formed by conventional chemical roughening. However, the adhesion between the easily-platable plastic material and the metal plating layer could not be significantly improved. Further, the adhesion between the easily-platable plastic material and the metal layer has a drawback that it is deteriorated even when the mechanical strength characteristic of the base plastic material itself is weak.

【0006】また、前記公開公報(1)・(2)の発明にあっ
ては、プラスチックス基板の平面に成形機の金型によっ
て凹溝を成形し、その凹溝に配線を装入し、且つ抜け出
さないように加工するような構造にはなっていない。
Further, in the inventions of the above-mentioned publications (1) and (2), a concave groove is formed on a flat surface of a plastic substrate by a mold of a molding machine, and wiring is inserted into the concave groove. Moreover, it is not structured to be processed so as not to come out.

【0007】次に、前記公開公報(3)の射出成形機によ
るプラスチック成形品の製造に係る回路基板にあって
は、「回路部品の骨格部材である、一次成形体と、この
一次成形体のめっき不要部分の外表面上に無電解めっき
が困難な難めっき性プラスチック材料用いて成形した二
次成形体と、この二次成形体の無電解めっきを行う易め
っき性プラスチックス材料の露出部分を化学薬品により
粗化処理した後、粗化処理面上に無電解めっきを行うプ
ラスチックス成形品の製造方法において、前記二次成形
体の無電解めっきを行う易めっき性プラスチックス材料
の露出部分の粗化処理により得られた粗化凹溝の下端が
二次成形体の成形外周線より0.2〜0.8mm下側に
位置するように粗化処理したもの」である。
[0007] Next, in the circuit board relating to the production of a plastic molded product by the injection molding machine of the above-mentioned publication (3), "a primary molded body which is a skeleton member of a circuit component and a primary molded body On the outer surface of the plating-free part, a secondary molded body molded using a difficult-to-plate plastic material that is difficult to electroless plate, and an exposed part of the easily-platable plastics material for electroless plating of this secondary molded body After the roughening treatment with a chemical agent, in the method for producing a plastics molded article for performing electroless plating on the roughened surface, in the exposed portion of the easily plateable plastics material for performing electroless plating of the secondary molded body. The roughening treatment is performed so that the lower end of the roughening groove obtained by the roughening treatment is positioned 0.2 to 0.8 mm below the outer peripheral line of the secondary molded body. "

【0008】ところが前記公開公報(3)の発明にあって
も、プラスチックス基板の平面に成形機の金型によって
凹溝を成形し、その凹溝に配線を圧入して抜け出さない
ように加工するようにはなっていなかった。
However, even in the invention of the above-mentioned publication (3), a concave groove is formed on the flat surface of the plastic substrate by a mold of a molding machine, and the wiring is press-fitted into the concave groove so as not to come out. It wasn't like that.

【0009】[0009]

【課題を解決しようとする手段】そこで、本発明は従来
の課題を解決し、且つ発明の目的を達成するために提供
するものである。
Therefore, the present invention is provided to solve the conventional problems and achieve the objects of the invention.

【0010】本発明の第1は、配線埋め込み回路基板に
おいて、電気絶縁基体の片面又は両面に設計された回路
パターンに沿って凹溝を成形した後、回路配線を当該凹
溝に抜け出さないように装入したものである。
A first aspect of the present invention is, in a wiring-embedded circuit board, after forming a groove along a circuit pattern designed on one side or both sides of an electrically insulating substrate, prevent the circuit wiring from coming out of the groove. It was charged.

【0011】本発明の第2は、配線埋め込み回路基板に
おいて、電気絶縁基体の片面又は両面、若しくは片面な
いし両面と立体面に設計された回路パターンの金型を備
えた成形機又はプレス機械等の適宜手段によって凹溝を
成形した後、導電体を当該凹溝に抜け出さないように装
入し、電気絶縁基体の端面から導電体端部を突出させた
ものである。
A second aspect of the present invention is a wiring-embedded circuit board, such as a molding machine or a press machine provided with a die for a circuit pattern designed on one side or both sides of the electrically insulating substrate, or one side or both sides and a three-dimensional surface. After the concave groove is formed by an appropriate means, the conductor is inserted into the concave groove so as not to slip out, and the conductor end is projected from the end face of the electrically insulating substrate.

【0012】本発明の第3は、配線埋め込み回路基板に
おいて、電気絶縁基体の平面と底面に設計された回路パ
ターンの金型を備えた成形機又はプレス機械等の適宜手
段によって当該基体の平面から側端面を通って底面に連
続して凹溝を成形した後、導電体を当該凹溝から抜け出
さないように装入したものである。
In a third aspect of the present invention, in a wiring-embedded circuit board, the electrically insulating base is cut from the plane of the base by an appropriate means such as a molding machine or a press machine equipped with a die for a circuit pattern designed on the bottom and the bottom. A concave groove is continuously formed on the bottom surface through the side end surface, and then the conductor is inserted so as not to come out of the concave groove.

【0013】本発明の第4は、配線埋め込み回路基板に
おいて、複数の電気絶縁基体を所定の間隔をあけて配置
し、各電気絶縁基体の片面に設計された回路パターンの
金型を備えた成形機又はプレス機械等の適宜手段によっ
て凹溝を成形した後、導電体を当該凹溝から抜け出さな
いように装入し、且つ設定した基板の一端から折り曲げ
たものである。
According to a fourth aspect of the present invention, in a wiring-embedded circuit board, a plurality of electrically insulating substrates are arranged at a predetermined interval, and a molding having a designed circuit pattern die is provided on one surface of each electrically insulating substrate. After forming the concave groove by an appropriate means such as a machine or a press machine, the conductor is inserted so as not to come out from the concave groove, and is bent from one end of the set substrate.

【0014】[0014]

【実施例】次に本発明の実施例を図面に即して説明す
る。1は基板(図1・図2、図42〜図44)又はプラ
グ・ソケット(図30)若しくは立体凸型1′(図3
6)・立体凹型1″(図37)等から成る電気絶縁基体
であり、プラスチック材料を主とするが、ベークライ
ト、セラミック等の材料を用いることも可能である。図
1〜図21において、2は電気絶縁基体1の片面(平面
又は底面)に成形した横断面四角の凹溝であり、直線状
に成形したものを示すが、曲線若しくは多角形の線状に
する場合もある。3は基体1の凹溝2内に圧入し、又は
緩く装入して小突起若しくは突条によって抜け出さない
ようにし、又はフィルムないしテープで抜け出さないよ
うに封入した細い銅線、金線、銀等から成る導電体を示
し、単一線のほか、複数の極細線体を撚り線にしたもの
を用いる。
Embodiments of the present invention will now be described with reference to the drawings. 1 is a substrate (FIGS. 1 and 2, FIGS. 42 to 44), a plug socket (FIG. 30), or a three-dimensional convex mold 1 ′ (FIG. 3)
6) An electrically insulating substrate composed of a solid concave type 1 ″ (FIG. 37) and the like, which is mainly made of a plastic material, but it is also possible to use a material such as bakelite or ceramic. In FIGS. 1 to 21, 2 Is a concave groove having a square cross section formed on one surface (flat surface or bottom surface) of the electrically insulating substrate 1, and shows a linear groove, but it may be a curved line or a polygonal line. Conductivity made of thin copper wire, gold wire, silver, etc., which is press-fitted or loosely inserted into the groove 2 of 1 to prevent it from coming off by a small projection or a ridge, or sealed by a film or tape so as not to come out. A body is used, and in addition to a single wire, a plurality of ultrafine wire bodies that are stranded wires are used.

【0015】図3・4において、4は凹溝2の内壁面に
成形した掛止用突起である。図5・図6において、5は
基体1の平面における凹溝の縁辺に近接位置にプレス機
械のポンチ形の陥没成形用雄型6で押圧することによっ
て、凹溝2内の導電体3を抜け出ないように支持する陥
没部である。この場合、基体1がプラスチックの場合
は、雄型6に高周波熱その他の熱を伝導しておき、当該
雄型6の押圧力と高周波熱で凹溝縁辺の一部又は全体を
変形させることによって、凹溝2内の導電体3の逸脱防
止をより確実に行うこともある。
3 and 4, reference numeral 4 denotes a hooking protrusion formed on the inner wall surface of the concave groove 2. In FIGS. 5 and 6, 5 is pressed out by a punch-shaped depression forming male die 6 of a press machine to a position close to the edge of the concave groove in the plane of the base body 1, and the conductor 3 in the concave groove 2 is pulled out. It is a depression that supports not to. In this case, when the substrate 1 is plastic, high-frequency heat or other heat is conducted to the male die 6, and the pressing force of the male die 6 and the high-frequency heat deform a part or the whole of the edge of the groove. In some cases, the conductor 3 in the groove 2 may be more reliably prevented from departing.

【0016】図7・図8において、7は基体1の平面に
おける凹溝2の縁辺の近接位置をプレス機械のリブ成形
用雄型8で押圧することによって、凹溝2内の導電体3
を抜け出ないように支持するリブである。前記の陥没部
5及びリブ7はプレス機械の雄型6・8で成形するほ
か、予め成形型で成形しておき、導電体3を凹溝2にそ
の端面から装入することも可能である。この場合におい
ても、基体1がプラスチックの場合は、雄型6に高周波
熱又はその他の熱を伝導しておき、当該雄型6の押圧力
と高周波熱等の加熱で凹溝縁辺の一部又は全体を変形さ
せることによって、凹溝2内の導電体3の逸脱防止をよ
り確実に行うこともある。
In FIGS. 7 and 8, a conductor 7 in the concave groove 2 is pressed by pressing a rib molding male die 8 of a press machine at a position close to the edge of the concave groove 2 on the plane of the substrate 1.
It is a rib that supports it so that it does not come out. The recessed portion 5 and the rib 7 may be molded by the male molds 6 and 8 of the press machine, or may be molded by a molding mold in advance and the conductor 3 may be inserted into the groove 2 from its end surface. . Also in this case, when the substrate 1 is plastic, high-frequency heat or other heat is conducted to the male die 6, and a part of the edge of the groove is pressed by pressing force of the male die 6 and heating by high-frequency heat. By deforming the entire structure, the deviation of the conductor 3 in the concave groove 2 may be prevented more reliably.

【0017】図9・図10において、9は凹溝2内に導
電体3を装入した基体1の平面に貼着した電気絶縁のフ
ィルム又はテープであるが、当該部分に電気絶縁性の樹
脂で2段成形するなど電気絶縁性のある材質に置き換え
ることは任意に行える。図11・図12において、10
は導電体3の外径面に成形した小突起であり、この小突
起によって導電体の3の外径より少し幅広の凹溝2内に
装入した導電体3を当該凹溝に掛止するようにしてあ
る。
In FIGS. 9 and 10, reference numeral 9 denotes an electrically insulating film or tape adhered to the flat surface of the base body 1 in which the conductor 3 is inserted in the concave groove 2. It is possible to arbitrarily replace the material with an electrically insulating material such as molding in two steps. 11 and 12, 10
Is a small protrusion formed on the outer diameter surface of the conductor 3, and the small protrusion locks the conductor 3 inserted in the groove 2 slightly wider than the outer diameter of the conductor 3 in the groove. Is done.

【0018】図13において、111は基体1の一面に
設けたガイドピンであり、凹溝2に導電体3を装入し、
且つこれに別の基体1を重ね合わせたときの位置合わせ
となる。112は基体の他面に設けたガイドピン挿入用
の凹部である。図14及び図15において、12は基体
の凹溝2に装入した導電体3に交差して接触させた他の
導電体若しくは銅箔、金箔等の導電性回路である。図1
6及び図17において、13は凹溝2内の導電体3に直
角の鉤形に曲折して接触させた導電体であり、この場
合、導電体の接触する鉤形先端部位13′の凹溝部位は
その分だけ幅広になっている。
In FIG. 13, reference numeral 11 1 is a guide pin provided on one surface of the base 1, and the conductor 3 is inserted into the groove 2.
In addition, the positioning is performed when another substrate 1 is superposed on this. Reference numeral 11 2 is a concave portion provided on the other surface of the base body for inserting a guide pin. In FIG. 14 and FIG. 15, reference numeral 12 is another conductor or a conductive circuit such as a copper foil or a gold foil which is brought into contact with the conductor 3 inserted in the concave groove 2 of the substrate so as to intersect with the conductor 3. Figure 1
6 and 17, reference numeral 13 denotes a conductor which is bent in a hook shape at right angles to contact with the conductor 3 in the groove 2, and in this case, the groove of the hook-shaped tip portion 13 'where the conductor contacts The part is widened accordingly.

【0019】図18と図19において、基体1に設けた
凹溝2′は断面が鳩尾形を成している。これは予め成形
型で成形しておくものである。この場合、導電体3は鳩
尾形凹溝2′の基体端部から装入するようになってい
る。図20と図21において、14は凹溝2の左右縁辺
を上方に向けて成形したリブであり、これをプレス機械
のリブ成形用雄型8で押下して対向内向きに圧潰したも
のを示すが、雄型8に高周波熱又はその他の熱を伝導し
ておき、当該雄型8の押圧力と高周波熱等でリブ14を
変形させて凹溝2内の導電体3の逸脱を防止をより確実
に行うこともできる。
18 and 19, the groove 2'provided in the base 1 has a dovetail-shaped cross section. This is formed in advance with a molding die. In this case, the conductor 3 is inserted from the base end of the dovetail-shaped groove 2 '. 20 and 21, reference numeral 14 denotes a rib formed by shaping the left and right edges of the concave groove 2 upward, and pressing the rib with the rib forming male die 8 of the press machine to crush it toward the inside. However, the high frequency heat or other heat is conducted to the male die 8, and the rib 14 is deformed by the pressing force of the male die 8 and the high frequency heat to prevent the conductor 3 from deviating in the groove 2. It can also be done reliably.

【0020】図22と図23においては、導電体3とこ
れに交差する別の導電体15を孔16に挿通して3次元
に立体積層して回路を形成してある。図24と図25に
あっては、同じく導電体3とこれに交差する導電体17
を孔16に挿通して3次元に立体積層して回路を形成し
た他の例を示している。
22 and 23, the conductor 3 and another conductor 15 intersecting with the conductor 3 are inserted into the holes 16 and three-dimensionally stacked to form a circuit. 24 and 25, the conductor 3 and the conductor 17 that intersects with the conductor 3 are the same.
Another example is shown in which a circuit is formed by inserting three-dimensionally three-dimensionally into the holes 16 to form a circuit.

【0021】図26は基体1の平面に導電体3を装入し
た複数の凹溝2の列を一端から他端に至る間に広幅(又
は細幅)から細幅(又は広幅)に変えてある。図27に
あっては、基体1の平面に複数の凹溝2の列を一端から
他端に至る間を直線で通すほか、一端から他端に至る途
中で角度を変えて横向き方向の端部に至るように成形し
てある。図28にあっては、平面に複数の凹溝2の列を
一端から他端に至るまで直線で通すほか、一端から他端
に至る途中で下方に孔16をあけ、これに凹溝2に装入
してある導電体3の端部位を折り曲げて通す形状になっ
ている。
In FIG. 26, the row of a plurality of concave grooves 2 in which the conductor 3 is inserted in the plane of the base 1 is changed from wide width (or narrow width) to narrow width (or wide width) from one end to the other end. is there. In FIG. 27, a row of a plurality of concave grooves 2 is made to pass straight through the plane of the base body 1 from one end to the other end, and the angle in the lateral direction is changed by changing the angle from one end to the other end. It is molded to reach. In FIG. 28, in addition to passing a row of a plurality of concave grooves 2 on a plane in a straight line from one end to the other end, a hole 16 is opened downward on the way from one end to the other end, The shape is such that the end portion of the inserted conductor 3 is bent and passed.

【0022】図29〜図33は基体1の平面と底面とそ
の間の側端面に凹溝2を連続して成形し、これに導電体
3を圧入してある。また、図33において、18は複数
本又は単数本の導電体181を装着したソケット部であ
り、これに対し凹溝2に導電体3を装入した基体1のプ
ラグ部を嵌合する構成になっている。図34は基体1の
平面に成形した凹溝2の一端に孔16をあけ、これに導
電体3の端部31を挿通したものを示す。また図35は
図34の基体1の底面に補助基板1を重ね、導電体3
の端部31を半田付けしてある。
29 to 33, the concave groove 2 is continuously formed on the plane and bottom surface of the base body 1 and the side end surface between them, and the conductor 3 is press-fitted therein. Further, in FIG. 33, reference numeral 18 denotes a socket portion in which a plurality of or singular conductors 18 1 are mounted, and the plug portion of the base body 1 in which the conductor 3 is inserted in the groove 2 is fitted into the socket portion. It has become. In FIG. 34, a hole 16 is formed in one end of a concave groove 2 formed in the plane of the base 1, and the end portion 3 1 of the conductor 3 is inserted into the hole 16. The Figure 35 is superposed an auxiliary substrate 1 1 to the bottom surface of the base body 1 in FIG. 34, the conductor 3
The end 3 1 of the is soldered.

【0023】図36においては、立体凸型基体1′に凹
溝2を縦面・平面・縦面・平面・縦面の順に連続して成
形してある。図37にあっては、立体凹型基体1″に凹
溝2を縦面・平面の順に連続して成形し、これに導電体
3を装入してある。
In FIG. 36, the concave groove 2 is continuously formed in the three-dimensional convex base 1'in the order of vertical surface / plane / vertical surface / plane / vertical surface. In FIG. 37, the concave groove 2 is continuously formed in the order of the vertical surface and the flat surface in the three-dimensional concave substrate 1 ″, and the conductor 3 is inserted therein.

【0024】図38〜図40にあっては、導電体3を立
体的に折り曲げたものを示す。すなわち、当該導電体凹
溝2に装入した複数の基体1を所定の間隔Gをあけて配
置してある。そして、立体的に折り曲げた導電体3に装
入した基体1の平面に樹脂プレート9′及び9″が張り
付けられている。
38 to 40, the conductor 3 is three-dimensionally bent. That is, the plurality of base bodies 1 loaded in the conductor groove 2 are arranged with a predetermined gap G therebetween. The resin plates 9'and 9 "are attached to the flat surface of the base body 1 inserted in the three-dimensionally bent conductor 3.

【0025】図41にあっては、方形の基体1の中央部
位に窓穴19をあけ、凹溝2に装入して基体平面にフィ
ルム又はプレート9を貼着して導電体3が逸脱しないよ
うにし、且つ導電体3を前記窓穴の内壁に沿わせながら
下向きに折り曲げてある。
In FIG. 41, a window hole 19 is opened in the central portion of the rectangular base 1 and is inserted into the groove 2 and the film or plate 9 is attached to the flat surface of the base to prevent the conductor 3 from deviating. In addition, the conductor 3 is bent downward along the inner wall of the window hole.

【0026】図42〜図46は方形の基体1の平面及び
底面において、外周縁辺に凹溝2を成形し、且つ外周縁
辺内の所定個所には2個一対の突起20・20を多数成
形し、その突起間が凹溝の役割を成している。また、単
一又は複数の窓穴19をあけ、その窓穴の位置におい
て、導電体同士を溶接、半田付け等によって結線したも
のを示す。なお、窓穴19の周囲には外周縁辺と同じ高
さの隆起部を成形し、これに凹溝3を成形してある。
42 to 46, in the plane and bottom surface of the rectangular base 1, the concave groove 2 is formed in the outer peripheral edge, and a large number of two pairs of projections 20, 20 are formed in predetermined places in the outer peripheral edge. The space between the protrusions serves as a groove. In addition, a single or a plurality of window holes 19 are formed, and conductors are connected by welding, soldering, or the like at the positions of the window holes. In addition, around the window hole 19, a raised portion having the same height as the outer peripheral edge side is formed, and the concave groove 3 is formed therein.

【0027】[0027]

【加工例】次に本発明の加工例を説明する。 「基板と凹溝の成形」 射出成形機の射出成形によっ
て、目的の基板又はプラグ・ソケット若しくは立体凸型
・立体凹型の基体1を成形すると共に、設定の回路パタ
ーンを備えた金型によって導電体3を埋め込むための凹
溝2を成形する。
[Processing Example] Next, a processing example of the present invention will be described. [Molding of Substrate and Recessed Groove] By injection molding of an injection molding machine, a target substrate or a plug / socket or a three-dimensional convex / three-dimensional concave substrate 1 is molded, and a conductor is provided by a mold having a set circuit pattern. The concave groove 2 for embedding 3 is formed.

【0028】「加工例1」 基体1の片面に成形した直
線の凹溝2に導電体3を装入する。(図1、図2) 「加工例2」 凹溝2の内面の適宜個所に掛止用突起4
を設け、導電体3の直径より幅広の凹溝2に緩く嵌め込
んだとき、この突起4で抜け出ないように支持する。
(図3、図4) 「加工例3」 凹溝2の両縁辺の近接位置に陥没部5を
成形し、この部位をプレス機械の陥没成形用雄型6で押
圧し、或いは当該雄型6と高周波熱又はその他の熱との
組み合わせで押圧と加熱とによって、凹溝2内に装入し
た導電体3を陥没部5で抜け出ないように支持する。
(図5、図6)
"Processing Example 1" A conductor 3 is inserted into a linear concave groove 2 formed on one surface of a substrate 1. (FIGS. 1 and 2) “Processing example 2” The hooking projections 4 are provided at appropriate places on the inner surface of the groove 2.
Is provided, and when it is loosely fitted into the concave groove 2 wider than the diameter of the conductor 3, it is supported by the protrusion 4 so as not to come out.
(FIGS. 3 and 4) “Processing Example 3” A depressed portion 5 is formed at a position close to both edges of the recessed groove 2, and this portion is pressed by a depressed molding male die 6 of the press machine, or the male die 6 is pressed. The conductor 3 loaded in the concave groove 2 is supported by the depression 5 by pressing and heating with a combination of the high frequency heat and other heat so as not to come out.
(Figs. 5 and 6)

【0029】「加工例4」 凹溝2の両縁辺の近接位置
に凹条溝7を成形し、この部位をプレス機械のリブ成形
用雄型8で押圧することによって、凹溝2内に収容した
導電体3を抜け出ないように支持する。(図7、図8) この場合においても、リブ成形用雄型8による押圧加工
と当該雄型に導電した高周波熱又はその他の熱とを組み
合わせ、押圧と加熱とによって凹溝2内の導電体3の埋
め込みをより確実に行うことも可能である。 「加工例5」 図1の凹溝2に導電体3を圧入し若しく
は緩く嵌め込んだ基体1の平面に電気絶縁フィルム又は
テープ9を貼着する。(図9、図10) 「加工例6」 導電体3の外径に成形した小突起10に
よって、凹溝2に装入したときに抜け出ないように凹溝
2の内壁に掛止する。(図11、図12)
[Processing Example 4] A groove groove 7 is formed at a position close to both edges of the groove 2, and this portion is pressed by a rib forming male die 8 of a press machine to be accommodated in the groove 2. The conductor 3 is supported so as not to come out. (FIGS. 7 and 8) Also in this case, the pressing in the rib forming male die 8 is combined with the high frequency heat or other heat conducted to the male die, and the conductor in the concave groove 2 is formed by pressing and heating. It is also possible to embed 3 more reliably. "Processing Example 5" An electric insulating film or tape 9 is attached to the flat surface of the base body 1 in which the conductor 3 is press-fitted or loosely fitted into the groove 2 of FIG. (FIGS. 9 and 10) “Processing Example 6” The small protrusions 10 formed on the outer diameter of the electric conductor 3 are hooked on the inner wall of the concave groove 2 so as not to come out when the electric conductor 3 is inserted. (Figure 11, Figure 12)

【0030】「加工例7」 凹溝2に導電体3を装入し
た基体1を所定の枚数を重ね合わせ、その各基体に設け
たガイドピン111とピン挿入凹部112によって位置決
めをしている。(図13) 「加工例8」 凹溝2に圧入した導電体3と直交して別
の導電体又は銅箔、金箔等の電気回路12を接触固定す
る。(図14、図15) 「加工例9」 凹溝2に装入した導電体3に沿って直角
の鉤形に屈曲した端部13′を接触した導電体13を固
定する。(図16、図17)
"Processing Example 7" A predetermined number of bases 1 each having a conductor 3 inserted in a groove 2 are stacked and positioned by guide pins 11 1 and pin insertion recesses 11 2 provided on each base. There is. (FIG. 13) “Processing example 8” Another electric conductor or an electric circuit 12 such as a copper foil or a gold foil is contacted and fixed orthogonally to the electric conductor 3 press-fitted into the groove 2. (FIGS. 14 and 15) “Processing Example 9” The conductor 13 is fixed along the conductor 3 inserted in the groove 2 with its end 13 ′ bent in a hook shape at right angles being in contact. (Figs. 16 and 17)

【0031】「加工例10」 凹溝を鳩尾形状2′に成
形し、これに導電体3を鳩尾形凹溝2′の端部から挿入
する。(図18、図19) 「加工例11」 導電体3を埋め込んだ凹溝2の両側縁
辺に成形した上向きリブ14又は上向き突片をプレス機
械のリブ形又はポンチ形を成す押圧面が平坦の雄型8′
で圧潰して導電体3が当該凹溝から抜け出ない支持固定
する。(図20、図21) この場合においても、リブ形又はポンチ形の成形用雄型
8による押圧加工と当該雄型に導電した高周波熱又はそ
の他の熱とを組み合わせ、押圧と加熱とによって凹溝2
内の導電体3の埋め込みをより確実に行うことも可能で
ある。 「加工例12」 基体1に成形した2列の凹溝2・2に
圧入した2本の導電体3・3の間に他の導電体15を接
触するように直交させて基体1の孔16に挿通する。
(図22、図23)
"Processing Example 10" A concave groove is formed into a dovetail shape 2 ', and a conductor 3 is inserted into the dovetail groove 2'from its end. (FIGS. 18 and 19) “Processing Example 11” The upward ribs 14 or upward projections formed on both side edges of the recessed groove 2 in which the conductor 3 is embedded are formed into a rib shape or a punch shape of a press machine. Male type 8 '
The conductor 3 is crushed and fixed so that the conductor 3 does not come out of the groove. (FIGS. 20 and 21) Even in this case, the pressing process by the rib-shaped or punch-shaped male mold 8 is combined with the high-frequency heat or other heat conducted to the male mold, and the concave groove is formed by pressing and heating. Two
It is also possible to more reliably embed the conductor 3 inside. "Processing Example 12" The holes 16 of the base 1 are made orthogonal to each other so that the other conductor 15 is in contact between the two conductors 3 and 3 press-fitted into the two rows of concave grooves 2.2 formed in the base 1. To insert.
(Figure 22, Figure 23)

【0032】「加工例13」 平面に成形した凹溝2に
導電体3を圧入した2枚の基体1を2段に重ねると共
に、凹溝内の導電体同士を直交位置に配置し、その直交
する導電体3・3に接触するように導電体17を基体1
にあけた孔16に挿通する。(図24、図25) 「加工例14」 基体1の一端から他端に向けて凹溝2
の列を狭い幅から広い幅に変更して成形し、各凹溝に導
電体3を圧入する。(図26) 「加工例15」 基体1の一端から他端に向けて凹溝2
の列を直線的に成形するほか、一端から他端に至る途中
で直角に外向きに曲折して端部に至るように成形し、こ
れに導電体3を抜け出ないように各凹溝に装入する。
(図27)
"Processing Example 13" Two substrates 1 having conductors 3 press-fitted into a flat groove 2 are stacked in two stages, and the conductors in the grooves are arranged at orthogonal positions, and the orthogonal The conductor 17 so as to come into contact with the conductor 3
It is inserted into the hole 16 formed in the. (FIGS. 24 and 25) “Processing Example 14” The groove 2 is formed from one end of the base 1 toward the other end.
The column is changed from a narrow width to a wide width and is molded, and the conductor 3 is press-fitted into each groove. (FIG. 26) “Processing example 15” The groove 2 is formed from one end of the base 1 toward the other end.
In addition to linearly molding the row of, the wire is bent outward at a right angle from one end to the other end and shaped so as to reach the end, and the conductor 3 is attached to each groove so as not to come out. To enter.
(Figure 27)

【0033】「加工例16」 基体1の一端から他端に
向けて凹溝2の列を直線的に成形するほか、一端から他
端に至る途中で下向きに孔16をあけ、凹溝2に装入し
た導電体3を当該孔に挿通する。(図28) 「加工例17」 基体1の両面(平面と底面)に凹溝2
を成形すると共に、両面の凹溝を連続して繋ぐ凹溝を基
体1の側端面に成形し、これに導電体3を抜け出ないよ
うに装入する。(図29〜図32) そして、前記の基体1をプラグとし、当該プラグの導電
体に3に接する導電体181を有するソケット部18か
ら成り、これらを相互に嵌合するようになっている。
(図33)
"Processing Example 16" In addition to linearly forming a row of the recessed grooves 2 from one end of the base 1 to the other end, a hole 16 is formed in the recessed groove 2 downwardly on the way from one end to the other end. The inserted conductor 3 is inserted into the hole. (FIG. 28) “Processing Example 17” The groove 2 is formed on both sides (plane and bottom) of the base 1.
In addition to molding, a concave groove that continuously connects concave grooves on both sides is molded on the side end surface of the base body 1, and the conductor 3 is inserted therein so as not to come out. (FIGS. 29 to 32) and the substrate 1 of the a plug made of a socket portion 18 having a conductor 18 1 in contact with the 3 to the conductor of the plug, so as to fit them to each other .
(Figure 33)

【0034】「加工例18」 基体1の平面に凹溝2を
成形し、当該凹溝の端部に孔16をあけ、凹溝に導電体
3を圧入すると共に導電体の端部を孔16に挿通する。
(図34) 「加工例19」 前記「加工例18」の基体1の底面に
回路補助基板11を重ね合わせて貼着し、孔16を挿通
した導電体3の端部3を当該回路基体に半田付けす
る。(図35)
"Processing Example 18" The concave groove 2 is formed on the flat surface of the base body 1, a hole 16 is opened at the end of the concave groove, the conductor 3 is press-fitted into the concave groove, and the end of the conductor is formed at the hole 16. To insert.
(Figure 34) "processing Example 19" the "working example 18" on the bottom surface of the base body 1 by superposing circuit auxiliary board 1 1 stuck in the end portion 3 1 the circuit conductor 3 inserted through the hole 16 Solder to the base. (Fig. 35)

【0035】「加工例20」 立体凸型基体1′に縦方
向と横方向の凹溝2を連続させて成形し、これに導電体
3を抜け出ないように装入する。(図36) 「加工例21」 立体凹型基体1″の内面に縦方向と横
方向の凹溝2を連続させて成形し、且つ底面及び側面に
孔16をあけ、この凹溝に導電体3を抜け出ないように
装入し、且つ各孔16に挿通する。(図37)
[Processing Example 20] The three-dimensional convex base 1'is formed by continuously forming the concave grooves 2 in the vertical direction and the horizontal direction, and the electric conductor 3 is inserted thereinto so as not to come out. (FIG. 36) “Processing Example 21” Vertical and horizontal concave grooves 2 are continuously formed on the inner surface of a three-dimensional concave substrate 1 ″, and holes 16 are formed in the bottom and side surfaces, and the conductor 3 is formed in the concave grooves. Insert it so that it will not come out, and insert it into each hole 16 (FIG. 37).

【0036】「加工例22」 複数の絶縁基体1を所定
の間隔Gをあけて配置し、各絶縁基体の平面に設けた凹
溝2に導電体3を当該凹溝から抜け出ないように装入
し、且つ各基体の一端から折り曲げて設け、各基体の平
面と導電体3の折り曲げ箇所に薄い樹脂プレート9′及
び樹脂部材9″を貼着し又は樹脂で成形する。(図38
〜図40)
[Processing Example 22] A plurality of insulating bases 1 are arranged with a predetermined gap G, and the conductor 3 is inserted into the recessed groove 2 provided on the plane of each insulating base so as not to come out of the recessed groove. In addition, the thin resin plate 9'and the resin member 9 "are attached to the flat surface of each base and the bent portion of the conductor 3 or molded with resin (FIG. 38).
(Fig. 40)

【0037】「加工例22」 方形の基体1の平面に設
けた凹溝2に装着した導電体3を基体中央の穴19から
下に向けて折り曲げ、その基体平面に電気絶縁フィルム
又はテープ9を貼着し又は樹脂で成形する。(図41)
"Processing Example 22" The conductor 3 mounted in the concave groove 2 provided on the flat surface of the rectangular base 1 is bent downward from the hole 19 at the center of the base, and the electric insulating film or tape 9 is placed on the flat surface of the base. Stick or mold with resin. (Fig. 41)

【0038】「加工例23」 方形の基体1の平面及び
底面に導電体3を嵌入又は挟持若しくは圧入等によって
受け入れる左右一対の突起20・20と、その外縁辺に
隆起外縁辺に凹溝2を成形し、これに導電体3を装入し
たものを示す。そのうち、窓穴19の部位にあっては、
平面と底面の両面に設けた凹溝2に装入した導電体3を
接触させ、その接触部位を溶着、溶接等によって結線さ
せてある。また導電体3を突起20・20間及び凹溝2
に装入した後、基体の平面と底面にフィルム又は樹脂シ
ート若しくはプレート状の電気絶縁体を被せてある。
(図42〜図46)
[Processing Example 23] A pair of left and right protrusions 20 and 20 for receiving the conductor 3 by fitting, sandwiching, press-fitting or the like on the flat and bottom surfaces of the rectangular base body 1 and the raised groove on the outer peripheral edge of the protrusion 20. What is molded and then charged with the conductor 3 is shown. Among them, in the part of the window hole 19,
The conductors 3 charged in the concave grooves 2 provided on both the flat surface and the bottom surface are brought into contact with each other, and the contact portions are connected by welding, welding or the like. Further, the conductor 3 is provided between the projections 20 and 20 and the concave groove 2.
Then, the base and the bottom of the base are covered with a film, a resin sheet, or a plate-shaped electric insulator.
(Figs. 42-46)

【0039】[0039]

【発明の効果】本発明は上記の構成であるから、次のよ
うな効果がある。すなわち、各種電子機器の小型軽量化
又は省略化を図る回路部材として導電体の埋め込み回路
基板において、設計した回路パターンに沿って基板に凹
溝を成形し、これに導電体を埋め込むことによって、製
造が簡単で量産に適し、製作コストの低減を図ることが
できる。
Since the present invention is constructed as described above, it has the following effects. That is, in a circuit board in which a conductor is embedded as a circuit member aiming at downsizing, weight saving, or omission of various electronic devices, a groove is formed in the board along a designed circuit pattern, and the conductor is embedded in the groove to manufacture the circuit board. It is simple and suitable for mass production, and the production cost can be reduced.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明に係る導電体埋め込み回路基板の平面
図である。
FIG. 1 is a plan view of a conductor-embedded circuit board according to the present invention.

【図2】 図1の2−2線に沿う断面図である。FIG. 2 is a sectional view taken along line 2-2 of FIG.

【図3】 図1の変形例を示す平面図である。FIG. 3 is a plan view showing a modified example of FIG.

【図4】 図3の4−4線に沿う断面図である。FIG. 4 is a sectional view taken along line 4-4 of FIG.

【図5】 図1のまた別の変形例を示す平面図である。5 is a plan view showing another modification of FIG. 1. FIG.

【図6】 図5の6−6線に沿う断面図である。6 is a sectional view taken along line 6-6 of FIG.

【図7】 図1のさらに別の変形例を示す平面図であ
る。
FIG. 7 is a plan view showing still another modified example of FIG.

【図8】 図7の8−8線に沿う断面図である。8 is a sectional view taken along line 8-8 of FIG.

【図9】 図1の凹溝の平面に電気絶縁フィルム又はテ
ープを貼着した平面図である。
FIG. 9 is a plan view in which an electric insulating film or tape is attached to the flat surface of the groove of FIG.

【図10】 図9の10−10線に沿う断面図である。10 is a sectional view taken along the line 10-10 of FIG.

【図11】 凹溝に導電体の外径面に突起を設けて圧入
した平面図である。
FIG. 11 is a plan view in which a protrusion is provided on an outer diameter surface of a conductor in a concave groove and press-fitted therein.

【図12】 図11の12−12線に沿う断面図であ
る。
12 is a cross-sectional view taken along line 12-12 of FIG.

【図13】 凹溝に導電体を装入した基体を重ねた状態
の縦断面図である。
FIG. 13 is a vertical cross-sectional view showing a state in which a base body in which a conductor is inserted is stacked in a groove.

【図14】 基体の凹溝に装入した導電体に他の導電体
を交差接触した状態の平面図である。
FIG. 14 is a plan view showing a state where another conductor is cross-contacted with the conductor inserted in the groove of the base body.

【図15】 図14の15−15線に沿う断面図であ
る。
15 is a sectional view taken along line 15-15 of FIG.

【図16】 基体の凹溝に装入した導電体に沿って直角
形鉤状導電体の先端を沿わせて接触させた平面図であ
る。
FIG. 16 is a plan view in which the tip of a right-angled hook-shaped conductor is placed along the conductor inserted in the concave groove of the base body and brought into contact therewith.

【図17】 図16の17−17線に沿う断面図であ
る。
17 is a sectional view taken along line 17-17 of FIG.

【図18】 断面を鳩尾形に成形した凹溝に導電体を埋
め込んだ基板の平面図である。
FIG. 18 is a plan view of a substrate in which a conductor is embedded in a groove having a dovetail-shaped cross section.

【図19】 図18の19−19線に沿う断面図であ
る。
19 is a cross-sectional view taken along the line 19-19 of FIG.

【図20】 基板の凹溝の縁辺に上向きリブを成形した
縦断面図である。
FIG. 20 is a vertical cross-sectional view in which an upward rib is formed on the edge of the concave groove of the substrate.

【図21】 図20の凹溝縁辺のリブを圧潰した状態の
縦断面である。
FIG. 21 is a vertical cross-sectional view showing a state where the ribs at the edges of the concave groove in FIG. 20 are crushed.

【図22】 基体の凹溝内の導電体に他の導電体を直交
して接触させた平面図である。
FIG. 22 is a plan view in which another conductor is orthogonally contacted with the conductor in the concave groove of the base body.

【図23】 図22の23−23線に沿う断面図であ
る。
23 is a cross-sectional view taken along line 23-23 of FIG.

【図24】 図22の他の変形例を示す平面図である。FIG. 24 is a plan view showing another modified example of FIG. 22.

【図25】 図24の25−25線に沿う断面図であ
る。
25 is a cross-sectional view taken along the line 25-25 of FIG.

【図26】 複数の凹溝列を一端から他端に狭幅から広
幅に変更した状態の平面図である。
FIG. 26 is a plan view showing a state in which a plurality of grooves is changed from one end to the other end from a narrow width to a wide width.

【図27】 複数の凹溝列を一端から他端に直線的に通
すもののほか、途中で直角に曲がって側端面に通す状態
の平面図である。
FIG. 27 is a plan view showing a state in which a plurality of concave groove rows are linearly passed from one end to the other end, and a plurality of concave groove rows are bent at a right angle in the middle and passed through a side end surface.

【図28】 複数の凹溝列を一端から他端に直線的に通
すもののほか、途中で下方(又は上方)に通す状態の平
面図である。
FIG. 28 is a plan view showing a state in which a plurality of concave groove rows are linearly passed from one end to the other end, and also a state where they are passed downward (or upward) on the way.

【図29】 基体の凹溝を平面から底面に連続して成形
した平面図である。
FIG. 29 is a plan view in which the concave groove of the base body is continuously formed from the flat surface to the bottom surface.

【図30】 図29の30−30線に沿う断面図であ
る。
30 is a sectional view taken along the line 30-30 of FIG.

【図31】 基体の凹溝を平面から底面に連続して成形
し、この凹溝に導電体を平面から底面に連続して巻き付
けた平面図である。
FIG. 31 is a plan view in which the concave groove of the base body is continuously formed from the flat surface to the bottom surface, and the conductor is continuously wound around the concave groove from the flat surface to the bottom surface.

【図32】 図31の32−32線に沿う断面図であ
る。
32 is a sectional view taken along the line 32-32 of FIG.

【図33】 図32の基体側をプラグとし、これと嵌合
するソケット部の斜視図である。
FIG. 33 is a perspective view of a socket portion that fits with the base body side of FIG. 32 as a plug.

【図34】 基体の平面に成形した凹溝の途中に孔をあ
けて導電体の端部を其の孔に挿通した状態の縦断面図で
ある。
FIG. 34 is a vertical cross-sectional view showing a state in which a hole is opened in the middle of a concave groove formed on the flat surface of a base body and an end portion of a conductor is inserted into the hole.

【図35】 図34の基体の底面に回路補助基板を重ね
た縦断面図である。
35 is a vertical cross-sectional view in which a circuit auxiliary board is overlaid on the bottom surface of the base body of FIG. 34.

【図36】 立体凸型の基体表面に複数の凹溝列を縦方
向と横方向に連続して成形した斜視図である。
FIG. 36 is a perspective view in which a plurality of concave groove rows are continuously formed in a vertical direction and a horizontal direction on the surface of a three-dimensional convex base.

【図37】 立体凹型の基体内表面に複数の凹溝列を縦
方向と横方向に連続して成形した斜視図である。
FIG. 37 is a perspective view in which a plurality of concave groove rows are continuously formed in the vertical direction and the horizontal direction on the inner surface of a three-dimensional concave base.

【図38】 所定の間隔をあけて配置した複数の電気絶
縁基体に導電体を装着した平面図である。
FIG. 38 is a plan view in which a conductor is attached to a plurality of electrically insulating bases arranged at a predetermined interval.

【図39】 図38の39−39線に沿う断面図であ
る。
39 is a sectional view taken along the line 39-39 of FIG.

【図40】 図38の導電体を複数の基体同士の間から
折り曲げた正面図である。
FIG. 40 is a front view of the conductor of FIG. 38 bent from between a plurality of bases.

【図41】 方形の基体装着した導電体を中央の穴から
下に向けて折り曲げた平面図である。
FIG. 41 is a plan view in which a conductor mounted on a rectangular base is bent downward from a central hole.

【図42】 窓穴を有する回路基板に導電体を受け入れ
る左右一対の突起及び凹溝付き外縁辺を成形し、これに
導電体をセットした平面図である。
FIG. 42 is a plan view in which a pair of left and right protrusions for receiving a conductor and outer edges with concave grooves are formed on a circuit board having window holes, and the conductor is set on the outer periphery.

【図43】 図42の正面図である。43 is a front view of FIG. 42. FIG.

【図44】 図42の側面図である。FIG. 44 is a side view of FIG. 42.

【図45】 図42の窓穴部位における導電体接合部の
拡大平面図である。
FIG. 45 is an enlarged plan view of a conductor joint portion in the window hole portion of FIG. 42.

【図46】 図42の46−46線に沿う断面図であ
る。
FIG. 46 is a cross-sectional view taken along the line 46-46 of FIG. 42.

【図47】 図46の斜視図である。47 is a perspective view of FIG. 46. FIG.

【符号の説明】[Explanation of symbols]

1 基板又はプラグ・ソケット若しくは立体凸型・立体
凹型等から成る電気絶縁基体 2 基体の平面に成形した凹溝 3 細い銅線、金線、銀線等から成る導電体 4 凹溝の内壁面に成形した導電体の掛止用突起 5 導電体固定用の陥没部 6 プレス機械の陥没成形用雄型 7 凹溝内の導電体を固定するリブ 8 プレス機のリブ成形用雄型 9 電気絶縁のフィルム又はテープ若しくはプレート 10 導電体の外径面に成形した小突起 11 基体を重ね合わせたときの位置合わせ用のガイド
ピン 12 銅箔、金箔等の導電性回路又は導電体 13 鉤形に屈曲して接触させた導電体 14 凹溝の左右縁辺を上方に向けて成形したリブ 15 導電体 16 基体及び回路基板にあけた孔 17 導電体 18 プレス機械の平坦雄型 19 基体の中央にあけた穴
1 Electrically insulating substrate consisting of substrate or plug / socket or three-dimensional convex / three concave type 2 Grooves formed on the plane of the substrate 3 Conductor 4 consisting of thin copper wire, gold wire, silver wire, etc. on the inner wall surface of the groove Recessed protrusion 5 of molded conductor 5 Recessed portion for fixing conductor 6 Recessed male mold for press machine 7 Rib for fixing conductor in concave groove 8 Male rib mold for press machine 9 Electrical insulation Film or tape or plate 10 Small protrusions 11 formed on the outer diameter surface of a conductor 11 Guide pins 12 for positioning when bases are stacked Conductive circuit or conductor 13 such as copper foil or gold foil Bending into a hook shape Conductor 14 brought into contact with the ribs 15 Ribs formed with the right and left edges of the groove facing upwards 15 Conductor 16 Holes formed in the base and circuit board 17 Conductor 18 Flat male die 19 of press machine Hole formed in the center of the base

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成14年4月24日(2002.4.2
4)
[Submission date] April 24, 2002 (2002.4.2)
4)

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正対象項目名】図18[Name of item to be corrected] Fig. 18

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図18】 ─────────────────────────────────────────────────────
FIG. 18 ─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成14年4月24日(2002.4.2
4)
[Submission date] April 24, 2002 (2002.4.2)
4)

【手続補正1】[Procedure Amendment 1]

【補正対象書類名】図面[Document name to be corrected] Drawing

【補正対象項目名】図42[Correction target item name] Fig. 42

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【図42】 FIG. 42

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 電気絶縁基体(1)の片面又は両面、若し
くは片面ないし両面と立体面に設計された回路パターン
に沿って凹溝(2)を成形した後、導電体(3)を当該凹溝に
装入したことを特徴とする導電体の埋め込み回路基板。
1. A concave groove (2) is formed along a circuit pattern designed on one surface or both surfaces of an electrically insulating substrate (1), or one surface or both surfaces and a three-dimensional surface, and then a conductor (3) is formed on the concave surface. A conductor-embedded circuit board characterized by being inserted into a groove.
【請求項2】 電気絶縁基体(1)の片面又は両面、若し
くは片面ないしは両面と立体面に設計された回路パター
ンの金型を備えた成形機又はプレス機械その他の手段に
よって凹溝(2)を成形した後、導電体(3)を当該凹溝に抜
け出さないように装入し、電気絶縁基体の端面(11)から
導電体端部(31)を突出させたことを特徴とする導電体
の埋め込み回路基板。
2. The concave groove (2) is formed by a molding machine, a press machine or other means equipped with a die of a circuit pattern designed on one side or both sides of the electrically insulating substrate (1), or one side or both sides and a three-dimensional surface. After molding, the conductor (3) is inserted into the groove so as not to come out, and the conductor end (3 1 ) is projected from the end face (1 1 ) of the electrically insulating substrate. Body embedded circuit board.
【請求項3】 電気絶縁基体(1)の両面に設計された回
路パターンの金型を備えた成形機又はプレス機械等の手
段によって当該基体の平面から側端面を通って底面に連
続して凹溝(2)を成形し、且つ導電体(3)を当該凹溝から
抜け出さないように装入したことを特徴とする導電体の
埋め込み回路基板。
3. The electrically insulating substrate (1) is continuously recessed from the plane of the substrate through the side end faces to the bottom by means such as a molding machine or a press machine equipped with molds for circuit patterns designed on both sides. A conductor-embedded circuit board, characterized in that the groove (2) is formed and the conductor (3) is inserted so as not to come out of the concave groove.
【請求項4】 複数の電気絶縁基体(1)を所定の間隔(G)
をあけて配置し、各基体(1)の片面に設計された回路パ
ターンの金型を備えた成形機又はプレス機械等の手段に
よって凹溝(2)を成形した後、導電体(3)を当該凹溝に装
入し、且つ設定した基体の一端から折り曲げたことを特
徴とする導電体の埋め込み回路基板。
4. A plurality of electrically insulating substrates (1) are arranged at predetermined intervals (G).
After forming the concave groove (2) by means such as a molding machine or a press machine equipped with a die for a circuit pattern designed on one side of each base (1), the conductor (3) is formed. A conductor-embedded circuit board, which is inserted into the groove and bent from one end of a set base.
JP2002121525A 2002-03-05 2002-04-23 Circuit board with embedded electric conductor Pending JP2003332710A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002121525A JP2003332710A (en) 2002-03-05 2002-04-23 Circuit board with embedded electric conductor

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002-59395 2002-03-05
JP2002059395 2002-03-05
JP2002121525A JP2003332710A (en) 2002-03-05 2002-04-23 Circuit board with embedded electric conductor

Publications (1)

Publication Number Publication Date
JP2003332710A true JP2003332710A (en) 2003-11-21

Family

ID=29713764

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002121525A Pending JP2003332710A (en) 2002-03-05 2002-04-23 Circuit board with embedded electric conductor

Country Status (1)

Country Link
JP (1) JP2003332710A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135172A (en) * 2016-01-25 2017-08-03 京セラ株式会社 Thick copper circuit board and manufacturing method of the same
JP2020120053A (en) * 2019-01-25 2020-08-06 トヨタ自動車株式会社 Substrate with built-in stranded wire

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2017135172A (en) * 2016-01-25 2017-08-03 京セラ株式会社 Thick copper circuit board and manufacturing method of the same
JP2020120053A (en) * 2019-01-25 2020-08-06 トヨタ自動車株式会社 Substrate with built-in stranded wire
JP7196636B2 (en) 2019-01-25 2022-12-27 株式会社デンソー Substrate with built-in stranded wires

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