JP2003332687A5 - - Google Patents

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Publication number
JP2003332687A5
JP2003332687A5 JP2003127648A JP2003127648A JP2003332687A5 JP 2003332687 A5 JP2003332687 A5 JP 2003332687A5 JP 2003127648 A JP2003127648 A JP 2003127648A JP 2003127648 A JP2003127648 A JP 2003127648A JP 2003332687 A5 JP2003332687 A5 JP 2003332687A5
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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JP2003127648A
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JP4624651B2 (ja
JP2003332687A (ja
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Priority claimed from US10/151,631 external-priority patent/US6953702B2/en
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Publication of JP2003332687A publication Critical patent/JP2003332687A/ja
Publication of JP2003332687A5 publication Critical patent/JP2003332687A5/ja
Application granted granted Critical
Publication of JP4624651B2 publication Critical patent/JP4624651B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2003127648A 2002-05-16 2003-05-06 垂直空洞光デバイスの製造方法 Expired - Fee Related JP4624651B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/151,631 2002-05-16
US10/151,631 US6953702B2 (en) 2002-05-16 2002-05-16 Fixed wavelength vertical cavity optical devices and method of manufacture therefor

Publications (3)

Publication Number Publication Date
JP2003332687A JP2003332687A (ja) 2003-11-21
JP2003332687A5 true JP2003332687A5 (ja) 2006-06-15
JP4624651B2 JP4624651B2 (ja) 2011-02-02

Family

ID=29269813

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003127648A Expired - Fee Related JP4624651B2 (ja) 2002-05-16 2003-05-06 垂直空洞光デバイスの製造方法

Country Status (4)

Country Link
US (1) US6953702B2 (ja)
EP (1) EP1363370B1 (ja)
JP (1) JP4624651B2 (ja)
DE (1) DE60328557D1 (ja)

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TW570896B (en) 2003-05-26 2004-01-11 Prime View Int Co Ltd A method for fabricating an interference display cell
JP2005259885A (ja) * 2004-03-10 2005-09-22 Seiko Epson Corp 光素子ウェハおよびその製造方法、光素子ウェハのバーンイン装置、ならびに光素子ウェハのバーンイン方法
EP2246726B1 (en) 2004-07-29 2013-04-03 QUALCOMM MEMS Technologies, Inc. System and method for micro-electromechanical operating of an interferometric modulator
TW200628877A (en) * 2005-02-04 2006-08-16 Prime View Int Co Ltd Method of manufacturing optical interference type color display
EP2495212A3 (en) 2005-07-22 2012-10-31 QUALCOMM MEMS Technologies, Inc. Mems devices having support structures and methods of fabricating the same
JP2009503565A (ja) 2005-07-22 2009-01-29 クアルコム,インコーポレイテッド Memsデバイスのための支持構造、およびその方法
US7795061B2 (en) 2005-12-29 2010-09-14 Qualcomm Mems Technologies, Inc. Method of creating MEMS device cavities by a non-etching process
US7382515B2 (en) 2006-01-18 2008-06-03 Qualcomm Mems Technologies, Inc. Silicon-rich silicon nitrides as etch stops in MEMS manufacture
US7450295B2 (en) 2006-03-02 2008-11-11 Qualcomm Mems Technologies, Inc. Methods for producing MEMS with protective coatings using multi-component sacrificial layers
US7321457B2 (en) 2006-06-01 2008-01-22 Qualcomm Incorporated Process and structure for fabrication of MEMS device having isolated edge posts
US7763546B2 (en) 2006-08-02 2010-07-27 Qualcomm Mems Technologies, Inc. Methods for reducing surface charges during the manufacture of microelectromechanical systems devices
US7733552B2 (en) 2007-03-21 2010-06-08 Qualcomm Mems Technologies, Inc MEMS cavity-coating layers and methods
US7719752B2 (en) 2007-05-11 2010-05-18 Qualcomm Mems Technologies, Inc. MEMS structures, methods of fabricating MEMS components on separate substrates and assembly of same
US7569488B2 (en) 2007-06-22 2009-08-04 Qualcomm Mems Technologies, Inc. Methods of making a MEMS device by monitoring a process parameter
US7851239B2 (en) 2008-06-05 2010-12-14 Qualcomm Mems Technologies, Inc. Low temperature amorphous silicon sacrificial layer for controlled adhesion in MEMS devices
US7864403B2 (en) 2009-03-27 2011-01-04 Qualcomm Mems Technologies, Inc. Post-release adjustment of interferometric modulator reflectivity
US8659816B2 (en) 2011-04-25 2014-02-25 Qualcomm Mems Technologies, Inc. Mechanical layer and methods of making the same
CN109906518B (zh) * 2016-12-05 2022-07-01 歌尔股份有限公司 微激光二极管转移方法和微激光二极管显示装置制造方法
US20200006924A1 (en) * 2016-12-05 2020-01-02 Goertek, Inc. Micro Laser Diode Display Device and Electronics Apparatus
US10305254B2 (en) * 2017-09-18 2019-05-28 Finisar Corporation VCSEL with elliptical aperture having reduced rin
US11264527B2 (en) 2018-10-01 2022-03-01 Medtronic, Inc. Integrated circuit package and system using same
US10950511B2 (en) 2018-10-30 2021-03-16 Medtronic, Inc. Die carrier package and method of forming same

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US5771253A (en) * 1995-10-13 1998-06-23 The Board Of Trustees Of The Leland Stanford Junior University High performance micromechanical tunable verticle cavity surface emitting laser
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