JP2003332635A - Thermoelectric conversion element module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To reduce the manufacturing cost of a thermoelectric conversion element module by simplifying an incorporating step or joining step at the time of incorporating the body of the module into an enclosure and reducing the number of steps. <P>SOLUTION: A lead member 20 joined to the body 10 of the thermoelectric conversion element module 100 has a function of positioning the module 100 to a prescribed position in the package of an optical communication module based on a positioning hole 23 at the time of incorporating the module 100 into the package, a function of positioning ends (junction terminals 211a and 211b) of terminal leads 21a and 21b to their joining positions to a prescribed wiring pattern of a package-side substrate after the module 10 is positioned, and a function of setting a power suppliable state by separating the terminal leads 21a and 21b from each other in independent states by cutting off a connecting section 22. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermoelectric conversion element module incorporated in the housing of various equipment such as an optical communication module to control the temperature of an object such as a semiconductor laser chip. The present invention relates to an improvement in the structure of a lead member for simplifying the assembling work inside and reducing the manufacturing cost.

[0002]

2. Description of the Related Art In recent years, WDM that multiplexes and uses light having each wavelength in accordance with the rapid spread of the Internet and the like
(Wavelength multiplexing) or D with higher density of wavelengths to be multiplexed
Development of WDM (Dense Wavelength Division Multiplexing) type optical communication system is in progress.

An optical communication module used for this kind of optical communication is constructed by incorporating various parts such as a semiconductor laser chip, a photodiode, a thermistor, and a micro optical system in a housing (package). In order to stabilize the output wavelength of the semiconductor laser chip, precise temperature control of the semiconductor laser chip is essential.

As a temperature control means used for such an application, for example, a thermoelectric conversion element module for performing heat exchange utilizing the Peltier effect is known.

As a conventional thermoelectric conversion module of this type, for example, as shown in FIG. 7 (side view), the lead wires 60 (6) are provided on the lower substrate 12 of the module main body 10A.
0a, 60b) were soldered.

The module body 10A having the above structure is
FIG. 8 shows a top view when the optical communication module is incorporated into the package 50 for the purpose described above.

In FIG. 8, the module body 10A
Is assembled so that the lower substrate 12 is brought into contact with the bottom surface of the package 50 (which functions as a heat dissipation plate), and the lead wires 60a and 60b are connected to the package-side substrates 51a and 51.
Predetermined wiring patterns 510a and 510 formed on b
connected to b.

The wiring pattern 510 (510)
a, 510b) is a plurality of lead wires 5 led out to the outside.
2 is a conductor pattern for supplying power to the module main body 10 through a pair of lead wires (52a, 52b) of the two.

This lead wire type module body 1
0A (see FIG. 7) is an optical communication module package 50.
Before incorporating into the inside of the
It is necessary to apply a soldering iron to the slight gap of and to solder the lead wire 60 on the specified pattern with an appropriate amount of solder.
Since the appearance may be poor depending on the solder protrusion and shape,
It was a task that required a high degree of skill.

Next, in order to incorporate the module main body 10A into the package 50, after soldering the lower substrate 12 to the bottom surface of the package, the lead wire 60 is manually soldered to the wiring pattern 510 of the package substrate 51. Need to attach.

Also in this case, of course, it is necessary to perform soldering while adjusting the lead wire 60 so that the lead wire 60 does not come into contact with other components, and to cut the excess length, which is a very troublesome work.

Since these processes are difficult to mechanize and mainly involve manual work, they are a bottleneck in mass production.
The cost was also high.

As another example of this type of conventional thermoelectric conversion module, as shown in FIG. 9 (side view), the lead wire 60 is used in the lower substrate 12 of the module body 10B. Lead post 62 (62a, 62b)
There was one that was joined.

The module body 10 having such a structure
FIG. 10 shows a top view when B is incorporated in the package 50 of the optical communication module.

In FIG. 10, the module main body portion 10B
Is incorporated so that the lower substrate 12 is brought into contact with the bottom surface of the package 50, and the lead posts 62a and 62b of the module body 10B and the package-side substrates 51a and 51b.
Lead wires 61a and 61b are joined to the wiring patterns 510a and 510b formed above, respectively.

When this lead post type module main body portion 10B (see FIG. 9) is incorporated into the package 50 of the optical communication module, the lower substrate 12 is soldered to the bottom surface of the package 50 and then the lead post 62 is formed. Is electrically connected to the package-side substrate 51 by wire bonding the lead wire 61 (61a, 61b) between the upper surface of the substrate and the wiring pattern 510 (510a, 510b) of the package-side substrate 51 (51a, 51b). .

However, this type requires a separate device for wire bonding, resulting in an increase in manufacturing cost.

Further, in this type, the position of the lead post 62 is often changed for each customer due to the restriction of the device and the arrangement of parts. For example, from the one shown in FIG. 9 to the one shown in FIG.
When there is a request to change to the one having the lead posts 63a and 63b shown in No. 1, it is necessary to change the board pattern of the module main body portion 10B each time, which also contributes to the cost increase.

[0019]

As described above, some conventional thermoelectric conversion element modules have lead wires or lead posts attached to the module body.
When incorporating these module bodies into the housing of various devices such as optical communication modules, positioning of the module body and bonding of the lower substrate to the housing bottom surface in a narrow space inside the housing. Since it is necessary to perform work such as attaching a lead wire to a predetermined wiring pattern on the package side substrate, the assembling process and the lead wire joining process become very complicated.

Further, when the specifications of the lead wire and the lead post are changed at the request of the customer, the board pattern must be changed, and the above-mentioned assembling process and lead wire joining process are complicated, and the manufacturing cost is increased. There was a problem that

The present invention solves the above problems, simplifies the assembling process and the joining process when the module main body is incorporated into the housing, and reduces the number of processes to reduce the manufacturing cost. The purpose is to provide a module.

[0022]

In order to achieve the above object, the invention according to claim 1 is built into a housing together with an object to be temperature-controlled, and is supplied with power via a predetermined wiring pattern of a board on the housing side. In a thermoelectric conversion element module that is driven to control the temperature of an object to be temperature controlled, N-type and P-type thermoelectric conversion elements are alternately connected by upper and lower metal electrodes, and upper and lower metal electrodes are connected. When the module main body is assembled into the housing, the module main body is formed by disposing a heat exchange substrate on each of the two, and a pair of metal electrodes also serving as positive and negative power supply terminals of the module main body. A lead portion in which the module main body portion is positioned at a predetermined position inside the housing, and at the same time, a lead end portion is aligned with a joint position with a predetermined wiring pattern of the housing-side substrate. Characterized by including and.

According to a second aspect of the present invention, in the lead member according to the first aspect, the metal piece has a shape in which the positive electrode terminal lead portion and the negative electrode terminal lead portion are connected via a connecting portion. One end of the positive electrode terminal lead portion and the negative electrode terminal lead portion are joined to the positive electrode power feeding terminal and the negative electrode power feeding terminal, respectively, and the other end is the lead end portion of the housing side substrate. Along the cut portion formed in the plate thickness direction between the positive electrode terminal lead portion and the negative electrode terminal lead portion and the connecting portion while being extended so as to be in contact with a predetermined wiring pattern. It is characterized in that the positive electrode lead and the negative electrode lead are separated and independent by separating the connecting portion.

According to a third aspect of the present invention, in the first aspect of the present invention, the lead member is bridged between the positive electrode power supply terminal and the negative electrode power supply terminal and a predetermined wiring pattern of the housing side substrate. It is characterized in that a wiring pattern is formed on the non-conductive member so as to allow conduction between each of the power supply terminals and a predetermined wiring pattern of the casing-side substrate.

[0025]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

FIG. 1 is a top view of a thermoelectric conversion element module 100 according to the present invention. Further, FIG. 2 shows A of FIG.
It is a side view of the thermoelectric conversion element module 100 seen from the direction, and FIG. 3 is a front view of the thermoelectric conversion element module 100 seen from the B direction of FIG.

As shown in FIGS. 1 to 3, the thermoelectric conversion element module 100 according to the present invention comprises a module body 1
0 and a metallic lead member 20 bonded to the lower substrate 11 of the module body 10.

In the module body 10, a plurality of N-type and P-type thermoelectric conversion elements 13a and 13b are alternately arranged in the vertical and horizontal directions, and adjacent thermoelectric conversion elements 13a and 13b are arranged on the upper side and the lower side. The metal electrodes (not shown) are bonded to each other so as to be electrically connected in series, and the upper and lower metal electrodes 11 and 1 for heat exchange, respectively.
It has a structure in which 2 are arranged.

N-type thermoelectric power is applied to the module main body 10 through a positive electrode terminal and a negative electrode terminal (not shown: for example, a pair of metal electrodes formed on the lower substrate 12 is applied thereto). When a direct current is passed from the conversion element 13a to the P-type thermoelectric conversion element 13b, the upper metal electrode is cooled and the upper substrate (hereinafter referred to as the heat absorption side substrate) 11
The metal electrode on the lower side generates heat via the substrate and heat is radiated to the surroundings via the lower substrate (also referred to as a heat radiation side substrate) 12.

Since the thermoelectric conversion element module 100 has the above-mentioned heat exchange function, for example, a semiconductor laser chip which is a light source or another optical element in the housing (hereinafter referred to as a package) of the optical communication module or It is used together with various electronic circuit components and is used for precise temperature control of semiconductor laser chips.

In this case, the thermoelectric conversion element module 100
As will be described later in detail, the heat dissipation side substrate 12 is in contact with the bottom surface (functioning as a heat dissipation plate) of the package of the optical communication module, and the semiconductor laser chip which is the cooling target is mounted on the heat absorption side substrate 11. Of the laser module installed in the package so that the laser module is brought into contact with the laser module and brought into contact with the substrate 11 via the heat absorption side substrate 11 by energization from the positive electrode terminal and the negative electrode terminal (power supply terminal) described above. It functions to cool an object (semiconductor laser chip) and control it to a constant temperature.

The conventional thermoelectric conversion element module of this type has a structure in which lead wires and lead posts are joined to the power supply terminals (see FIGS. 7 and 9), but the thermoelectric conversion element module 100 according to the present invention is Lead member 20 for the power supply terminal
It has a structure in which

As a concrete structure of the thermoelectric conversion element module 100, the lead member 2 of the module 100 is used.
0 is the module body 10 as shown in FIGS.
1. A pair of terminal lead portions 21a and 21b respectively joined to the positive electrode terminal (denoted by reference numeral 15a in FIG. 1) and the negative electrode terminal (the same reference numeral 15b) formed on the heat dissipation side substrate 12, and these terminal lead portions 21a. , 22b connecting part 22
And a positioning hole 23 formed in the connecting portion 22.

In this lead member 20, a connecting portion 22
The positioning hole 23 formed at the time of mounting the module 100 inside the package of the optical communication module, for example, engages with a positioning pin arranged on the package side to keep the module 100 inside the package. Performs the function of accurately positioning at the proper position.

Terminal lead portions 2 connected to both sides of the connecting portion 22
Each of 1a and 21b includes a portion (base portion) formed of the same plane as the connecting portion 22 and a portion (bent portion) bent in a direction (height direction) perpendicular to the plane.

The tip ends of the bent portions of the terminal lead portions 21a and 21b are bent outward, for example, when viewed from the connecting portion 22 to form the joining terminal portions 211a and 211b.

The terminal lead portions 21a and 21b are positioned in the package of the optical communication module with the module 100 accurately positioned by the above-mentioned positioning hole 23.
Each of the joining terminal portions 211a and 211b has a structure in which the joining terminal portions 211a and 211b are aligned at positions where they can be joined to a predetermined wiring pattern on the package side substrate.

The lead member 20 joined to the module body 10 is formed by integrally molding one metal piece so as to have the portions corresponding to the above-mentioned terminal lead portions 21a and 21b and the connecting portion 22. However, at the partition position between the terminal lead portions 21a and 21b and the connecting portion 22,
Cut in the thickness direction using a technique such as half press 24
(Indicated by the dotted line in FIG. 1) is formed. Further, the connecting portion 22
A grip portion 221 is formed at the end of the.

With this structure, the connecting portion 22 of the lead member 20 can be separated from the terminal lead portions 21a and 21b along the notches 24 by pinching the gripping portion 221 with a tool or the like.

The terminal lead portions 21a and 21b become separated and independent only after the connecting portion 22 is separated by the above-mentioned method, and the power can be supplied as the original two lead wires.

When the connecting portion 22 is disconnected, the positioning hole 23 also disappears and the above-described positioning cannot be performed. Therefore, the procedure for assembling the present module 100 into the package of the optical communication module is as follows: The positioning of the module 100 in the package, the bonding of the heat radiation side substrate 12 of the module 100 to the package bottom surface, and the bonding terminal portions 211a and 211b of the lead member 20 to the package side substrate (predetermined wiring pattern). It is desirable that the joining is completed.

Next, a procedure for incorporating the thermoelectric conversion element module 100 according to the present invention into the package of the optical communication module will be described.

FIG. 4 is a top view of the package in which the thermoelectric conversion element module 100 according to the present invention is incorporated in the package 50 of the optical communication module.

The optical communication module package 50 is realized by a metal case having a low coefficient of thermal expansion. The bottom plate of the package 50 is formed of, for example, a copper-tungsten (Cu-W) alloy, and is suitable for heat diffusion and heat dissipation. Further, the side walls other than the bottom plate, or the lid plate described later, respectively, are formed of, for example, Kovar alloy,
It can serve as a shield function.

As shown in FIG. 4, package side substrates 51a and 51b are buried in both side walls of the package 50 via an insulating member (not shown) made of, for example, ceramics. A plurality of lead wires 52 are led out from the package 51b toward the outside of the package 50.

These lead wires 52 are joined to corresponding wiring patterns formed on the package side substrates 51a and 51b, and supply a control signal or power from an externally provided control unit or power supply unit. It is used for.

Of the lead wires 52, the lead wires 52a and 52b at the ends are used especially for supplying power to the thermoelectric conversion element module 100 incorporated in the package 50.

These lead wires 52a and 52b are the wiring patterns 5 formed on the package side substrates 51a and 51b.
10a and 510b, respectively.

In addition, as a structure on the package 50 side, a positioning pin 55 is provided upright on the bottom surface of the package.

In FIG. 4, the thermoelectric conversion element module 1
00 is a positioning hole 23 of the connecting portion 22 of the lead member 20.
Is mounted on the bottom surface of the package while being fitted to the positioning pin 55.

In this state, the thermoelectric conversion element module 10
0 is accurately positioned at an appropriate position (position shown in the drawing) inside the package 50 by fitting the positioning hole 23 and the positioning pin 55.

Further, in this positioned state, the lead member 20 of the thermoelectric conversion element module 100 has the end portion (joint terminal portion 21) of the terminal lead portion 21a connected to the positive electrode terminal.
1a) and an end portion (joint terminal portion 211b) of the terminal lead portion 21b connected to the negative electrode terminal are formed on the package side substrates 51a and 51b, respectively.
It is aligned so as to come into contact with the joining position with a and 510b.

FIG. 5 shows a conceptual side sectional view of the package taken along the line CC of FIG.

In FIG. 5, the thermoelectric conversion element module 1
00, the lower substrate (heat dissipation side substrate) 12 is the package 50
Is placed so as to come into contact with the bottom surface of the terminal, is positioned by the positioning hole 23 fitted into the positioning pin 55, and the bent portion of the terminal lead portion 21b extends in the height direction and hits the end portion thereof. 221b is the package-side substrate 5
It is kept in contact with the wiring pattern 510b of 1b.

At this time, although not shown in FIG. 5, the bent portion of the terminal lead portion 21a extends in the height direction and hits the end portion of the joint terminal portion 221a, which contacts the wiring pattern 510a of the package side substrate 51a. It is kept in contact.

Therefore, in this state (the state in which the thermoelectric conversion element module 100 is incorporated in the package 50 in the form shown in FIG. 5), for example, a method of putting the entire package 50 in a heating furnace and heating it, etc. Thus, the lower substrate (heat dissipation side substrate) 12 of the thermoelectric conversion element module 100
And the bottom surface of the package 50, between the terminal lead portion 21a side end portion (joint terminal portion 211a) of the lead member 20 and the wiring pattern 510a of the package side substrate 51a, and the terminal lead portion 21b side end portion (joint). Terminal part 211b)
And the wiring pattern 510b of the package side substrate 51b can be soldered at the same time.

When the above-mentioned respective parts are soldered in one step in the heating furnace, the thermoelectric conversion element module 100 is assembled in the package 50 in the state shown in FIGS. 4 and 5. For example, it is necessary to apply solder in advance on the bottom surface of the package 50 and the wiring patterns 510a and 510b of the package-side substrates 51a and 51b.

After the soldering process is completed, the connecting portion 22 is obtained by pulling up the grip portion 221 of the lead member 20 joined to the thermoelectric conversion element module 100 with a tool or the like.
The work of cutting off is performed with the notch 24 as a boundary.

FIG. 6 shows the lead member 2 from the state shown in FIG.
The package top view in the state which disconnected the connection part 22 of 0 is shown.

As shown in FIG. 6, when the connecting portion 22 of the lead member 20 is separated, the terminal lead portions 21a, 2
1b is independently separated into one.

As a result, the thermoelectric conversion element module 10
0 and the wiring pattern 510 of the package side substrate 51a and the positive electrode terminal (indicated by reference numeral 15a) formed on the lower substrate 12
a is electrically connected by a terminal lead portion 21a, and the negative terminal (indicated by reference numeral 15b) of the lower substrate 12 and the wiring pattern 510b of the package-side substrate 51b.
Is electrically connected by the terminal lead portion 21b,
Power can be supplied to the module main body 10 through the terminal lead portions 21a and 21b.

That is, in the state shown in FIG.
When power is supplied from an external power source (not shown) through 2a and 52b, the lead wire 52a and the wiring pattern 510 are formed.
a, terminal lead portion 21a, module body portion 10, terminal lead portion 21b, wiring pattern 510b, lead wire 52
An electric current flows through a path b, the upper heat absorption side substrate 11 of the module body 10 is cooled, and the lower heat radiation side substrate 12
Heats up.

Therefore, in this case, by placing the object to be cooled on the upper substrate (heat absorption side substrate) 11 of the module main body 100 incorporated in the package 50,
By the above-described energization control, the object to be cooled can be cooled and maintained at a constant temperature.

In consideration of such use, the connecting portion 2 is used as described above.
After separating 2 to separate the terminal lead portions 21a and 21b from each other, the laser module (semiconductor laser chip, photodiode, optical fiber, etc.) to be cooled is mounted on the upper substrate (heat absorption side substrate) 11 of the module body 10. Consisting of)) and join.

Here, for convenience, the arrangement mode of the laser module 30 is shown with reference to FIG.

Thereafter, the input / output terminals of the laser module 30 and the corresponding wiring patterns of the package side substrates 51a and 51b are connected by wire bonding using a lead wire, and the opening of the package 50 is covered. The optical communication module is completed by closing the plate and hermetically sealing it.

In the optical communication module as a finished product, power and drive signals are supplied to the laser module 30 from the external power supply section (for laser module) and the control section through the corresponding lead wires 52, and laser light is emitted. Let The laser light at this time contains a light component (transmission information) modulated by the drive signal.

On the other hand, in this completed optical communication module, when power is supplied from the external power source (for the thermoelectric conversion element module) through the lead wires 52a and 52b,
Inside the optical communication module, the wiring pattern 510a connected to the lead wire 52a, the terminal lead portion 21a,
An electric current flows through the route of the wiring pattern 510b connected to the module main body 10, the terminal lead portion 21b, and the lead wire 52b, the heat absorption side substrate 11 of the module main body 10 is cooled, and the heat radiation side substrate 12 generates heat.

As a result, the object (laser module 30) in contact with the heat absorption side substrate 11 can be efficiently distributed while radiating the heat generated in the heat radiation side substrate 12 to the surroundings via the bottom surface (heat radiation plate) of the package 50. By cooling and maintaining the semiconductor laser chip at a predetermined temperature, the output wavelength of the semiconductor laser chip is kept constant, and stable optical communication can be performed.

As described above, in the thermoelectric conversion element module 100 according to the present invention, the metal is formed by connecting the positive electrode terminal lead portion 21a and the negative electrode terminal lead portion 21b through the connecting portion 22 having the positioning hole 23. Lead member 2
0 is bonded to the module body 10, and the lead member 20 holds the module 100 at a predetermined position inside the package by the positioning hole 23 when the module 100 is installed inside the package 50 of the optical communication module. The function of positioning, the terminal side of each terminal lead portion 21a, 21b (joint terminal portion 211a, 211b) in the state of the above positioning, the package side substrate 51a,
51b has a function of aligning with a predetermined wiring pattern 510a, 510b and a joining position, and a function of separating the connecting portion 22 so that each of the terminal lead portions 21a, 21b can be separated and independently supplied with power. is there.

According to the thermoelectric conversion element module 100 having such a functional structure, when the module 100 is incorporated into the package 50 of the optical communication module, the module 1 is formed by using the positioning hole 23 of the lead member 20.
00 can be accurately positioned at an appropriate position inside the package, and positioning work becomes easy.

Further, in the positioned state, the end portions (joint terminal portions 211a and 211b) of the lead member 20 have predetermined wiring patterns 51 on the package side substrates 51a and 51b.
Since it is aligned with the joint position with 0a and 510b,
Ends of lead member 20 and wiring patterns 510a, 510
Positioning for soldering and joining with b is unnecessary.

Further, if this positioning function is used,
At the same time as soldering the heat radiation side substrate 12 of the thermoelectric conversion element module 100 to the bottom surface (heat radiation plate) of the package 50,
The end portions of the lead member 20 are connected to the package side substrates 51a, 51
It is possible to solder to the predetermined wiring patterns 510a and 510b of b, and the number of soldering steps can be reduced.

Further, since the lead wire or the lead post which has been changed according to the specifications requested by the customer is abolished,
The board pattern of the thermoelectric conversion element module 100 can be unified.

Further, since the lead wires or the lead posts are eliminated, as a matter of course, the step of soldering the lead wires or the lead posts used for energization at the time of assembling into the package 50 can be eliminated, and that amount can be eliminated. The number of processes can be reduced.

As described above, a significant reduction in manufacturing cost can be expected due to synergistic effects such as a reduction in the number of steps of assembling into the package 50, elimination of the lead wire attaching step of the thermoelectric conversion element module 100, and unification of the substrate pattern of the thermoelectric conversion module 100.

Although the lead member 20 integrally formed with the metal piece (conductive member) is used in the above embodiment, a lead member made of a non-conductive member may be used as another embodiment.

As an example, the terminal lead portions 21a, 21 of the metallic lead member 20 according to the above embodiment are provided.
b, a portion (base portion) corresponding to the connecting portion 22 (having the positioning hole 23) is made of a resin member, and is joined to the positive and negative power supply terminals of the module body 10 on the base portion. From the location described above, when it is incorporated into the package 50 thereafter, the package side substrates 51a, 51
A lead member having a structure in which a metal film (wiring pattern) is patterned up to the position corresponding to the connection position with the predetermined wiring patterns 510a and 510b of b can be considered.

In addition, a lead member in which the base portion is replaced with a flexible substrate and a metal film similar to the above is patterned on the flexible substrate is also conceivable.

As described above, the above-mentioned power supply terminals and the predetermined wiring pattern of the package side substrate are provided on the non-conductive member that is bridged between the positive electrode power supply terminal and the negative electrode power supply terminal and the predetermined wiring pattern of the package side substrate. In the case of a thermoelectric conversion element module equipped with a lead member of a type in which a wiring pattern that allows electrical continuity between the modules is attached, it is not necessary to cut the connecting part when incorporating the module into the package of the optical communication module, and thus a further process Reduction is possible.

Besides, the present invention is not limited to the embodiments described above and shown in the drawings, but can be modified and implemented as appropriate without departing from the scope of the invention.

For example, the connecting portion 22 of the lead member 20.
As a positioning method using the positioning hole 23 formed in the above, a positioning pin 55 is provided on the bottom surface of the package 50, and the positioning pin 23 is fitted into the positioning hole 23 to perform positioning. A method of recognition is also possible.

Specifically, the positioning hole 23 is read by a reading device, and the position of the positioning hole 23 read at this time is set to a preset normal position (module main body 1
0 is displayed on the screen together with the position of the positioning hole 23 when it is positioned at the correct position, and the module body 10 is moved and positioned so that the position of the currently read positioning hole 23 matches the regular position. You can also do it.

In the above embodiment, the thermoelectric conversion element module which is incorporated in the package of the optical communication module to control the temperature of the semiconductor laser chip has been described. A thermoelectric conversion element module that is incorporated in a housing together with a temperature control target such as for cooling electronic components mounted on the housing and is driven by power supply through a predetermined wiring pattern of the chassis side substrate to control the temperature of the target. It is generally applicable.

[0085]

As described above, according to the present invention,
A lead member is joined to the module main body, and when the module main body is incorporated into the housing, the lead member positions the module main body at a predetermined position inside the housing, and at the same time, the lead end is on the housing side. Since the structure is aligned at the joint position with the predetermined wiring pattern on the board, positioning becomes easier when the module main body is installed inside the housing, and moreover, the lead ends are located at the predetermined position on the housing-side board during the positioning. By using the structure that aligns with the bonding position of the wiring pattern, it is possible to perform bonding between the lead end and the wiring pattern and between the heat dissipation side substrate of the module body and the bottom surface of the chassis at the same time. The complicated process of soldering the lead wire or the lead post used for soldering is unnecessary, the number of assembling processes inside the housing, the lead end and the housing side substrate It is possible to reduce the number of bonding steps and a predetermined wiring pattern. In addition, by eliminating lead wires and lead posts, it is no longer necessary to change the specifications of lead wires or lead posts at the request of the customer, which makes it possible to unify the board patterns and reduce the number of assembling steps and joining steps described above. Combined with this, the manufacturing cost can be significantly reduced.

[Brief description of drawings]

FIG. 1 is a top view of a thermoelectric conversion element module according to the present invention.

FIG. 2 is a side view of the thermoelectric conversion element module according to the present invention.

FIG. 3 is a front view of a thermoelectric conversion element module according to the present invention.

FIG. 4 is a top view of a package incorporating the thermoelectric conversion element module according to the present invention.

5 is a conceptual cross-sectional view of the package side surface taken along the line CC of FIG.

FIG. 6 is a top view of the package when the connecting portion of the lead member is separated from the state of FIG.

FIG. 7 is a side view showing a configuration of a conventional thermoelectric conversion module.

8 is a top view of a package incorporating the thermoelectric conversion module in FIG.

FIG. 9 is a side view showing the configuration of another conventional type of thermoelectric conversion module.

FIG. 10 is a top view of a package incorporating the thermoelectric conversion module in FIG.

FIG. 11 is a side view showing the configuration of still another type of conventional thermoelectric conversion module.

[Explanation of symbols]

100 thermoelectric conversion element module 10 Module body 11 Heat absorption side substrate 12 Heat dissipation side substrate 13a N-type thermoelectric conversion element 13b P-type thermoelectric conversion element 15a positive electrode terminal 15b Negative electrode terminal 20 Lead member 21a, 21b Terminal lead part 211a, 211b Joint terminal part 22 Connection 221 grip 23 Positioning hole 24 notches 30 laser module 50 packages 51a, 51b Package side substrate 510a, 510b wiring pattern 52, 52a, 52b Lead wire 55 Positioning pin

Claims (3)

[Claims] 1. A thermoelectric conversion element module, which is incorporated in a housing together with a temperature control object and is driven by power supply through a predetermined wiring pattern of a board on the housing side to control the temperature of the temperature control object. Type and P type thermoelectric conversion elements are alternately connected by upper and lower metal electrodes, and heat exchange substrates are respectively arranged on the upper and lower metal electrodes, and a module body of the module body. It is joined between a pair of metal electrodes that also serve as a positive electrode and a negative electrode power supply terminal, and when the module main body is incorporated into the housing, the module main body is positioned at a predetermined position inside the housing, and at the same time, the lead end. A thermoelectric conversion element module, wherein a part is provided with a lead member which is aligned with a joining position with a predetermined wiring pattern on the casing-side substrate. 2. The lead member is formed by integrally molding a metal piece into a shape in which the positive electrode terminal lead portion and the negative electrode terminal lead portion are connected via a connecting portion. One end of the terminal lead portion is joined to the positive electrode power feeding terminal and the negative electrode power feeding terminal, respectively, and the other end is extended as the lead end portion so as to come into contact with a predetermined wiring pattern of the casing-side substrate. The positive electrode lead and the negative electrode lead by connecting the positive electrode terminal lead portion and the negative electrode terminal lead portion to the connecting portion along a notch formed in the plate thickness direction between the connecting portions. The thermoelectric conversion element module according to claim 1, wherein the leads have a structure in which they are separated and independent. 3. The lead member is provided on the non-conductive member that is bridged between the positive electrode power supply terminal and the negative electrode power supply terminal and a predetermined wiring pattern of the housing side substrate, and the power supply terminals and the housing side. The thermoelectric conversion element module according to claim 1, wherein a wiring pattern is formed to allow conduction between predetermined wiring patterns on the substrate.