JP2003332359A - Method for manufacturing semiconductor device and semiconductor manufacturing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To rapidly change setting of waiting positions of an upper claw and a lower claw corresponding to the thickness of a work, in a grip mechanism used for conveying a work. <P>SOLUTION: Waiting position contacts P1, P2 for a pair of upper claw and lower claw to be opened or closed by a cam mechanism are set on a large diameter vertex and on the small diameter vertex of a cam 21a for the upper claw. When the work is thick, the upper claw is made to wait at the waiting position contact for the upper claw set to the large diameter vertex; while when the work is thin, the waiting position contact P2 for the upper claw set to the small diameter vertex is waited so that the upper claw can be opened or closed at the gripping time of the shortest upper claw stroke, in response to the thickness of the work. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device manufacturing technique, and more particularly to a technique effective when applied to a grip mechanism used for carrying a work in a semiconductor device manufacturing process.

[0002]

2. Description of the Related Art The techniques described below are for studying the present invention,
The present invention was studied by the present inventors upon completion, and its outline is as follows.

In the manufacturing process of a semiconductor device, various processes are continuously provided, and between adjacent processes, a work in which a work completed in the immediately preceding process is transferred to an adjacent next process is performed. As the conveying means, there is a means for pushing the work on the conveying rail from the back, or for propelling the work by sandwiching it between rotating rollers, or for sandwiching the upper and lower surfaces of the work between upper and lower claws that move up and down. Various means are appropriately adopted.

For example, in a semiconductor device package assembly process, a lead frame is carried by a grip carrying mechanism using upper and lower claws in a die bonder used for the same. In this step, individual semiconductor chips (also referred to as dies) that have been separated by dicing the wafer are transferred and bonded onto the die pad of the lead frame that is transferred to a predetermined position by the grip transfer mechanism. afterwards,
Bonding between the pads on the semiconductor chip and the inner leads of the lead frame is performed.

In the die bonding process, the lead frame housed in the frame rack is pulled out onto the transport rail via the frame loader, and the lead frame pulled out is the upper claw of the grip mechanism and the lower claw of the grip mechanism. It is sandwiched between the rail and the rail while being slightly floated from the rail. Both the upper claw and the lower claw are lowered or raised from the preset standby position, that is, the position of the fully opened claw height.

The lead frame is sandwiched by a plurality of upper and lower claws of a plurality of the grip mechanism portions at a plurality of side edge portions facing each other along the longitudinal direction, and in that state, the lead frame is conveyed to a predetermined stage for die bonding. It The lead frame conveyed to a predetermined position is placed on the rail by opening the upper and lower claws of the grip mechanism unit and separating the lead frame. After that, the upper claw and the lower claw are opened to the original standby position to prepare for the next lead frame conveyance.

In the grip transfer mechanism having such a structure, the standby positions of the upper and lower claws for holding the lead frame are as follows.
Is set in one of two ways. That is, the claw opening height corresponding to the standby position is uniformly set in advance to a height obtained by adding clearance to the thickness of the lead frame having the maximum thickness expected to be used in the die bonder, and the thickness. There is a method of changing the setting each time to a height obtained by adding clearance to the thickness of each different lead frame.

[0008]

However, the present inventor has found that the technique adopted in the above grip method has the following problems.

That is, a method in which the open heights of the upper and lower claws, which are the standby positions of both the claws, are uniformly set in advance, for example, in accordance with the maximum thickness work such as a lead frame that can be used in the die bonder. Then, the thinner the work, the longer the stroke of the upper claw and the lower claw until the work is clamped or conveyed and then returned to the original standby position.

That is, it takes time to grip the work. At the same time, after moving the work, when moving to the next operation, both pawls (maximum frame thickness + clearance)
It takes time to return to the standby position corresponding to, and the transition time to the next process becomes long.

On the other hand, in the method of adjusting the claw opening height, which is the standby position of the upper claw and the lower claw of the transport unit, according to (target frame thickness + clearance), the claw opening height is changed every time the work thickness changes. It is necessary to change the setting of, and it takes a lot of trouble each time.

In particular, in a structure such as a lead frame in which a plurality of frames are provided in series as a work, it is necessary to grip a plurality of points along the longitudinal direction so that distortion of the lead frame does not occur during transportation. However, it is a troublesome and time-consuming work to uniformly and accurately adjust the claw opening heights of the upper and lower claws of the grip mechanism section at the plurality of places.

If such adjustment cannot be performed with high accuracy,
At the time of gripping, the grip level is different for each grip portion, which causes unnecessary bending of the lead frame. At present, the thickness of the lead frame is as small as several millimeters to several μm at maximum, so that the adjustment range of the claw opening height is also fine, and skilled adjustment techniques are required to change the settings.

On the other hand, as a method of avoiding such fine adjustment, a method of preparing upper and lower claws corresponding to a plurality of claw opening heights in advance and replacing the necessary claws as necessary is also considered. To be However, even with such an exchange method, a considerable amount of time is required such as removing the fixing screws of the claws at a plurality of places, replacing the claws with the prepared predetermined configuration, and fixing the replaced claws so that they will not come loose again. .

That is, at present, whichever configuration is adopted, it takes time to change the setting of the claw opening height corresponding to the change of the work thickness. Therefore, the present inventor thought that a technique capable of promptly responding to such a change in the work thickness was necessary.

An object of the present invention is a grip mechanism used for transporting a work in the manufacture of a semiconductor device, which can quickly change the setting of the standby positions of the upper claw and the lower claw according to the thickness of the work. To provide the technology.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0018]

Among the inventions disclosed in the present application, a brief description will be given to the outline of typical ones.
It is as follows.

That is, according to the present invention, in the method of manufacturing a semiconductor device, the grip mechanism for sandwiching and transporting the work between the plurality of claws opened and closed by the cam mechanism is used. The standby position contacts for multiple claws, which are set to have different claw strokes,
Since it is set on the cam surface of the claw cam, it is possible to select a standby position that shortens the stroke from the plurality of standby positions to the target work when the thickness of the work is changed.

Since the standby position setting can be changed by selecting the pawl standby position contact provided on the cam surface of the pawl cam, the setting can be easily and quickly changed.

[0021]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below with reference to the drawings. In all the drawings for explaining the embodiments, members having the same function are designated by the same reference numeral, and repeated description thereof will be omitted.

FIG. 1 (a) is a plan view of a main part schematically showing an example of a semiconductor manufacturing apparatus used in the method of manufacturing a semiconductor device of the present invention, and FIG. 1 (b) is a side view of the main part.

In the case shown in FIG. 1, the semiconductor manufacturing apparatus 10
Is configured in a die bonder 10a having a function of bonding a semiconductor chip. The die bonder 10a has
A work supply unit 11 is provided, and a work transfer rail 12 is provided on the front surface of the work supply unit 11.

A work grip mechanism section 13 is provided along the work transfer rail 12. In the work grip mechanism section 13 provided on the side of the work transfer rail 12a,
A plurality of grip portions 13a, 13b, 13c, 13d, 13e for sandwiching the work W are provided between the vertically moving claws. On the other hand, the work grip mechanism section 13 on the side of the work transport rail 12b has grip sections 13f and 13f, respectively.
g is provided.

The work grip mechanism section 13 having such a configuration
Is connected to the work grip mechanism drive unit 14 and can be moved left and right along the work transfer rail 12 as the work grip mechanism drive unit 14 moves left and right. On the side of the work transfer rail 12, a wafer take-out section 17 is provided from the wafer cassette 15 to the wafer holder 16 to take out the wafer F by moving it along the guide 17a.

Further, between the wafer holder 16 and the work transfer rail 12b, die protrusions for individually pushing up the semiconductor chips individually diced by dicing the wafer F attached to the wafer tape from the back surface side of the wafer tape. An upper part 18 is provided. At the same time, as shown in FIG. 1B, the semiconductor chips that have been separated into individual pieces are adsorbed to
A bonding head 1 for die-bonding to a conveyed work W at a die bonding point P shown in (a).
9 is provided.

As shown by the double-headed arrow in FIG. 1B, the bonding head 19 is provided with a suction portion 19a which is vertically movable so that the semiconductor chip can be suctioned and released, and the suction portion 19a is bonded. According to the head 19
It is configured to be able to reciprocate between the die protrusion 18 and the die bonding point P. Note that FIG. 1 (a)
The bonding head 19 is not shown to show the work grip mechanism section 13.

FIG. 2A shows a plan view of the main part of the grip portion 13g of the work grip mechanism portion 13 provided on the work transfer rail 12a. As shown in FIG.
As shown in (c) to (c), an upper claw cam 21a and a lower claw cam 22a, which are eccentric cams, are provided so that one motor 23 can rotate by a common cam shaft 24.

The upper claw cam 21a and the lower claw cam 22
As shown in FIGS. 2B and 2C, corresponding to a, an upper claw cam follower 21b and a lower claw cam follower 22b that follow each cam are provided. The upper claw cam follower 21b and the lower claw cam follower 22b are fixed to the same base 31 so as to be vertically movable.

As shown in FIG. 2B, one end of the cam follower for upper claw 21b is formed on the upper claw 25 so that the tip 25a of the claw faces vertically downward. A cam roller 26 is provided on the other end side of the upper nail cam follower 21b,
The cam roller 26 is in contact with the cam surface of the upper claw cam 21a.

The cam roller 26 is a cam follower 2 for the upper claw.
By connecting 1b and the base 31 with a pulling spring 32, a biasing force is applied so that the cam surface of the upper claw cam 21a can be contacted. A sliding member 27 is provided on the cam follower for upper claw 21b in the vertical direction so that the sliding member 27 can slide in the vertical direction along a guide 33 provided in the vertical direction with respect to the base 31. .

Incidentally, the cam roller 26 is the cam 21a for the upper claw.
When it is located at the lowermost point, the spring pressure of the spring 32 is set so that there is a gap between the cam roller 26 and the upper claw cam 21a, and the gap serves as a grip allowance when the upper claw is lowered.

With this configuration, the rotation of the upper claw cam 21a is controlled by the cam roller 26 via the cam roller 26.
The upper claw 25 can be moved up and down by being converted into a vertical movement of b.

Similarly, the lower pawl cam follower 22b is also formed on the lower pawl 28 such that one end of the cam follower 22b is directed vertically upward. Cam follower 22b for lower claw
A cam roller 26 provided on the other end side of the base connects the base 31 and the cam follower 22b for the lower claw with a spring 32 to urge the cam roller 26 to contact the cam surface of the cam 22a for the lower claw. Has been.

Further, the lower follower cam follower 22b is provided with a sliding member 27 in the vertical direction so that it can slide in the vertical direction along a guide 33 provided in the base 31 in the vertical direction. There is.

With this configuration, the rotation of the lower pawl cam 22a is controlled by the cam roller 26 through the lower pawl cam follower 22.
This is converted into a vertical movement of b, and the lower claw 28 moves up and down.

On the other hand, the upper claw 25 and the lower claw 28 are constructed such that their claw tips 25a and 28a face each other, and both claw tips of the descending upper claw 25 and the ascending lower claw 28 are provided. The work can be held between the parts 25a and 28a.

In the work grip mechanism section 13 thus constructed, the cam shaft 24 is rotated by the single motor 23 so that the upper claw 25 and the lower claw 28 cooperate to clamp the work, or The work can be separated. That is, when the work is clamped, the upper claw 25 is lowered from the standby position to the work clamping position, and at the same time, the lower claw 28 is also raised from the standby position to the work clamping position so that the work is clamped between the two claws. Will be pinched.

When the work is released, the upper claw 25
Is raised from the work clamping position to the original standby position, and at the same time, the lower claw 28 is lowered from the work clamping position to the original standby position. By thus opening the upper claw 25 and the lower claw 28, the clamping of the work is released, and the released work is placed on the work transport rail 12 at a predetermined position.

The timing at which the upper claw 25 and the lower claw 28 arrive at the work clamping position is set so that the lower claw 28 reaches the clamping position before the upper claw 25 or at the same time. This setting is performed because when the upper claw 25 first reaches the work holding position, the work may be deformed by pressing the work toward the rail with the claw tip 25a.

3 (a) and 3 (b), the cam 21 for the upper claw is shown.
a, the configuration of the lower claw cam 22a is illustrated. As shown in FIG. 3A, the upper claw cam 21a configured as an eccentric cam
Is 0 ° to 90 °, 270 ° to 360 ° on the cam surface.
The cam displacement and the allocation angle are set so that the upper claw stroke of the upper claw 25 is 4 mm. That is, 0 °
Corresponds to the upper claw standby position contact point P1 set so that the stroke up to the clamping position of the work becomes the longest.

Since the upper claw cam 21a and the lower claw cam 22a shown in FIG. 3 are slightly deformed for easy understanding, the agreement with the cam diagram shown in FIG. 4 is ensured. Not not. It is merely a diagram for explanation.

The upper claw cam 21a is 90 ° to 27 °.
The cam displacement and the allocation angle are set so that the upper claw stroke is 2 mm in the range of 0 °. That is, 18
0 ° corresponds to the upper claw standby position contact P2 set so that the upper claw stroke to the work clamping position is the shortest.

On the other hand, as shown in FIG. 3B, the lower pawl cam 22a formed as an eccentric cam has a lower pawl stroke of 0.1 mm on its cam surface at 0 ° to 360 °. The cam displacement and allocation angle are set so that
That is, the lower claw standby position contacts P3 and P4 set to 0 ° and 180 ° have the same lower claw stroke to the work clamping position.

FIG. 4A shows a cam diagram showing the displacement of the upper claw 25, and FIG. 4B shows a cam diagram showing the displacement of the lower claw 28. For the work thickness of 3 to 1 mm, the standby position of the upper claw 25 may be selected from the upper claw standby position contact P1 at 0 ° of the upper claw cam 21a. Standby position contact P3 for lower claw
Also selects the 0 ° position of the lower claw cam 22a. Note that FIG. 4A shows a case where the grip allowance is 0.3 mm.

On the other hand, for a work thickness of 1 to 0.1 mm, the standby position of the upper claw 25 is 180 degrees of the upper claw cam 21a.
It suffices to select the upper claw standby position contact P2 at °.
The lower claw standby position contact P4 is also 180 ° of the lower claw cam 22a.
Select the position of.

As described above, the standby positions of the upper claw 25 and the lower claw 28 are set at two positions respectively on the upper claw cam 21a and the lower claw cam 22a, respectively, to correspond to the respective work thicknesses. The standby position can be obtained, and compared with the case where only one standby position is set regardless of the work thickness, the time until the work is gripped, the work is released and the work is waited for the next sandwiching. It is possible to shorten the time until.

That is, in the above configuration, the standby position of the upper claw 25 is set on the cam surface of the upper claw cam 21a to the clamping position. From the contact points P1 and P2, the standby position contact point P1 or P2 for the upper claw having the shortest stroke can be selected according to the thickness of the workpiece to be clamped. Therefore, the opening / closing operation of the upper claw 25 in the grip operation can be shortened.

In order to make the upper claw 25 stand by at the upper claw standby position contact P1 having the largest upper claw stroke, the motor 23
The upper claw cam 21a may be rotated with to stop the apex on the large diameter side of the upper claw cam 21a at the vertically upper position as shown in FIG. 3 (a). Whether or not the apex on the large diameter side is stopped at the vertically upper position can be confirmed by the standby position detection sensor 41 shown in FIG. 2 (a).

The standby position detecting sensor 41 is used for the upper claw cam 2
A light-shielding plate that rotates corresponding to 1a is configured as an optical chopper system that detects whether or not the sensor beam is blocked.

That is, as shown in FIGS. 2A and 5A, in the standby position detection sensor 41, the light shielding plate 42 is provided on the rotation shaft of the motor 23 that rotates the cam shaft 24. The light shielding plate 42 has a beam through hole 4 for passing the sensor beam on two concentric circles set with respect to the rotation center.
3, 44 are formed.

The beam through hole 43 is provided on the outer circumference 43a, and the beam through hole 44 is provided on the inner circumference 44a.
They are provided with a phase difference of 90 ° at the central angle. The beam through hole 43 is used for detecting the position of the upper claw standby position contact P1, and the beam through hole 44 is used for detecting the position of the upper claw standby position contact P2.

At the same time, a first sensor 45 and a second sensor 46 are provided corresponding to the beam passage holes 43 and 44 having a phase difference of 90 °, and the detection portions of the respective sensors pass through both beams. The phase difference is set to 90 ° in accordance with the holes 43 and 44.

That is, in a state in which the upper claw 25 is on standby at the upper claw standby position contact P1 on the apex on the large diameter side of the upper claw cam 21a, as shown in FIG. The through hole 43 is aligned with the first sensor 45,
The sensor beam emitted from the back of the light shielding plate 42 toward the light receiving portion of the first sensor 45 is received by the light receiving portion of the first sensor 45 through the beam through hole 43.

On the other hand, when the upper claw 25 is descending to clamp the work W, that is, the rotation of the motor 23 causes the cam shaft 24 to rotate and the upper claw cam 21a to rotate, so that the upper claw 25 moves upward. When it is out of the claw standby position contact P1, the light shielding plate 42 also rotates in accordance with the rotation of the motor 23,
The beam passage hole 43 is removed from the passage position of the sensor beam, and the first sensor 45 is in a state where the sensor beam is not received. This state is shown in FIG.

Note that, in the case shown in FIG. 5B, the rotation position of the light shielding plate 42 in the state where the work W is gripped is shown. If the case shown in FIG. 5A is associated with 0 ° of the upper claw cam, the work W is gripped by the upper claw 25 and the lower claw 28 in a state of being rotated by 135 °. This situation is
Although shown corresponding to the cam diagram of FIG. 4 (a) described above, the rotation angle of how much to rotate at the time of grip depends on the design of the cam displacement and needs to be limited to this description. Needless to say

On the other hand, in the state where the upper claw 25 stands by at the upper claw standby position contact P2 on the small diameter side vertex of the upper claw cam 21a, as shown in FIG. The through hole 44 is aligned with the second sensor 46, and the sensor beam emitted from the back of the light shielding plate 42 toward the light receiving portion of the second sensor 46 passes through the beam through hole 44 and the light receiving portion of the second sensor 46. Is received by.

Therefore, when the upper claw 25 is lowered to hold the work W, the light shielding plate 42 also rotates in accordance with the rotation of the motor 23, as shown in FIG. The beam through hole 44 is disengaged from the passing position, and the second
The sensor 46 is not receiving the sensor beam.

In the case shown in FIG. 6 (b), the rotation position of the light shielding plate 42 in the state where the work W is gripped is shown, and it is 275 ° rotation with reference to 0 ° of the upper claw cam 21a. In this state, the work W is gripped by the upper claw 25 and the lower claw 28.

In this way, the upper claw standby position contact P
In order to confirm which contact point 1 or P2 the upper claw 25 is on standby, the shading plate 42 is made to correspond to the contact points at a plurality of standby positions.
It can be determined by the presence / absence of light reception by the first sensor 45 or the second sensor 46 of the sensor beam from the beam through holes 43, 44 provided in the.

Therefore, for example, when changing a product from a thin work to a thick work, the standby position detection sensor 4
In the state where the sensor beam can be received by the first sensor 45 constituting the first sensor 45, that is, when the upper nail 25 is on standby, the first sensor 45
The setting may be changed so that is ON and the second sensor 46 is OFF.

On the contrary, in the case of supporting a thin work,
The setting for standby is that the first sensor is OFF and the second sensor 46
The motor 23 may be rotated to change the setting of the cam position so that the ON position is set to ON.

The structure of the standby position detection sensor 41 is as follows.
It is not necessary to limit to the optical sensor of the optical chopper method, and any sensor mechanism that can effectively detect the standby position can be used.

In the above description, the work grip mechanism section 13
The grip portion 13g has been described as an example, but the grip portions 13a, 13b, 13c, 13d, 13e, 13f are also configured in the same manner. However, the grip portions 13a, 13
b, 13c, 13d, and 13e may be rotated by the same motor by the same cam shaft. In such a case, the grip portions 13a to 13e, 13f, 13g
Although a total of three motors will be provided corresponding to the above, it is sufficient to start and stop the driving of these three motors in a synchronized manner.

Further, in the above description, the cam is divided into two and the cam stroke is allocated at 180 °.
By increasing the number of divisions, such as dividing the allocation angle of 120 ° into three, or dividing the allocation angle of 90 ° into four, the standby position of the claw may be selected more finely. It is possible to finely select the standby position that shortens the claw stroke according to various work thicknesses.

Further, in the above description, the cam structure in which the cam follower is made to follow the cam surface of the flat cam via the cam roller is exemplified, but a cam mechanism using a plate cam may be adopted. In the case of a flat cam, the standby position can be easily set by rotating the cam, but in the case of a plate cam, reciprocating motion of the plate cam is required. Is preferred.

In the above structure, the lower claw standby position contacts P3 and P4 set on the lower claw cam 22a have the same stroke, but similar to the setting of the upper claw standby position contact, a plurality of lower claw strokes having different claw strokes are set. The claw standby position contact may be set on the lower claw cam 22a.

Further, in the above structure, the upper claw cam 21
By using the cam shaft 24 of the cam 22a for the lower claw and a, the opening and closing operations of the upper claw 25 and the lower claw 28 are performed by one motor 23. The cam 22a and the cam 22a may be independently rotated by different motors.

In such a configuration, since the upper claw standby position contact and the lower claw standby position contact can be selected independently, the work thickness can be reduced by combining the upper and lower claw standby position contacts. It is possible to perform grip opening / closing operations for the upper and lower claws corresponding to. Therefore, as a whole, the time required to open and close the grip can be further shortened as compared with the case where the cams for the upper claw and the cams for the lower claw are previously made to correspond one-to-one and the cam shaft is shared.

In such a construction, the time required for opening and closing when actually gripping a work having a different thickness is shown in FIGS. 7 (a) to 7 (c).

FIG. 7A shows a case where a work W1 having a thickness of 3 mm is sandwiched. In such a case,
As shown in (a), when the cam displacement allocation angle of the upper pawl cam 21a is 0 ° to 180 °, the upper pawl stroke is 4 mm.
As described above, the upper claw 25 is made to stand by at the upper claw standby position contact P1. In addition, the stroke of the lowest descent is 3 mm and the rotation of the cam is stopped. Lower jaw stroke is 1mm
Set to.

When the work is gripped by the upper claw 25 and the lower claw 28 according to the above setting, the moving speed of the upper claw becomes 1
If it is mm / 10 msec, the time required for gripping the work is 10 msec.

In FIG. 7A, the left side shows the standby state of the upper and lower claws, and the right side shows the gripped state. Hereinafter, similar illustrations are made in FIGS. 7B and 7C.

On the other hand, when the thickness of the work W2 is 0.1 mm, as shown in FIG. 7 (b), the upper claw cam 21a is formed.
Allocation angle of cam displacement (see Fig. 3 (a)) 180 °
At ~ 360 °, the upper claw 25 is made to stand by at the upper claw standby position contact P2 so that the upper claw stroke becomes 2 mm. That is, the small diameter apex of the upper claw cam 21a is set to the upper claw standby position contact P2. In such a case, the upper nail 25
If the moving speed of is set as above, 20ms
It becomes ec.

Further, when the thickness of the work W3 is 1 mm, as shown in FIG. 7C, the cam displacement allocation angle of the upper pawl cam 21a is 180 ° to 360 °, and the upper pawl stroke is 2 mm. Thus, the upper claw 25 is made to stand by at the upper claw standby position contact P2. That is, it suffices to set the standby position contact P2 for the upper claw on the small diameter apex of the cam 21a for the upper claw, and in this case as well, the time required to grip the work is 20.
It becomes msec.

Therefore, in the configuration described above, when the work thickness is 3 to 1 mm, the setting of FIG. 7A is set, and when the work thickness is 1 to 0.1 mm, the setting of FIG. 7B is set. You can see that

On the other hand, when the two standby position contacts corresponding to the work thickness are not provided, that is, when the upper jaw stroke is uniformly set to 4 mm according to the maximum work thickness, the work is fixed. 1mm even if the thickness is 3mm
In the case of, the time is 40 msec, and it is clear that the configuration described above according to the embodiment of the present invention can shorten the grip time.

Next, a method for manufacturing a semiconductor device using the die bonder having the grip transfer mechanism described above will be described.

First, from the wafer cassette 15 of the semiconductor manufacturing apparatus 10 constituted in the die bonder 10a shown in FIG.
The wafer F that has already been diced is placed on the wafer holder 16
Pull out to. The semiconductor chips 50 that have been separated into individual pieces by the wafer extractor 17 that moves along the guide 17a are taken out from the wafer F that has been pulled out to the wafer holder 16.
As shown in FIG. 8, the semiconductor chip 50 has an electrode pad 51 provided on the main surface thereof, and the electrode pad 51 is electrically connected to an element portion formed on a silicon substrate. .

On the other hand, from the work supply unit 11, the work 5
2, for example, the lead frame 52 having the configuration shown in FIG.
a is supplied onto the work transfer rail 12. Towards the lead frame 52a, the work transfer rail 12a,
The work grip mechanism unit 13 provided on 12b is moved to the left side in the drawing by the work grip mechanism drive unit 14.

When the grip portions 13a to 13g reach the predetermined position of the side edge portion 53 of the lead frame 52a, the gripping portions 13a to 13g are moved upward from the upper claw standby position contact P1 corresponding to the thickness of the lead frame 52a. The claw 25 descends, the lower claw 28 rises from the lower claw standby position contact P3, and grips the lead frame 52a.

When gripping, the lower claw 2
8 rises to the grip position first, and the lead frame 5
The timing is set so that 2a is slightly lifted from the work transfer rail 12 and the lowering of the upper claw 25 is waited for.

The grip parts 13a to 13g holding the lead frame 52a in this way are moved to the right side in the drawing by the work grip mechanism drive part 14 and are stopped when the die pad 54 of the lead frame 52a reaches the bonding stage position. .

In this state, the adhesive is dripped onto the die pad 54 from the dispenser. At the same time, the bonding head transfers the semiconductor chip 50 taken out by the wafer take-out unit 17 onto the die pad 54 by collet suction or the like, and is die-bonded to the lead frame 52a as shown in FIG.

After die bonding, the semiconductor chip 50
Electrode pad 51 and the inner lead 55 of the lead frame 52a are bonded by a bonding wire 56 such as an Au wire.
Is used for wire bonding, and then resin-sealed to manufacture a semiconductor device.

Although the invention made by the present inventor has been specifically described based on the embodiments, the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, in the above description, the die bonder was described as an example of the semiconductor manufacturing apparatus using the grip mechanism according to the present invention. However, a mounter such as a CSP mounter or a lead-on-chip mounter, a pellet bonder,
It may be configured as a semiconductor manufacturing apparatus having a function of transferring semiconductor chips or transferring and bonding the semiconductor chips, such as a wire bonder.

[0088]

The effects obtained by the typical ones of the inventions disclosed in this application will be briefly described as follows.
It is as follows.

That is, according to the present invention, in the grip conveying mechanism for sandwiching the work between the pawls opened and closed by the cam mechanism, a plurality of standby positions having different opening and closing strokes of the pawls are set on the cam surface. Accordingly, it is possible to set a standby position where the claw stroke is short, and the grip time based on the opening and closing of the claw can be shortened.

Since the grip time can be shortened, it is possible to increase the number of workpieces transported per unit time in the manufacturing of the semiconductor device, and it is possible to shorten the manufacturing time of the semiconductor device and the manufacturing cost as a whole.

[Brief description of drawings]

FIG. 1A is a plan view of relevant parts showing an example in which a semiconductor manufacturing apparatus used in a method for manufacturing a semiconductor device of the present invention is configured as a die bonder, and FIG. 1B is a side view of the essential parts.

2A is a plan view of a main part of a work grip mechanism portion, FIG. 2B is a side view of a main part showing a cam mechanism of an upper pawl, and FIG. 2C is a main view showing a cam mechanism of a lower pawl. FIG.

FIG. 3A is an explanatory diagram showing an example of an upper claw cam, and FIG. 3B is an explanatory diagram showing an example of a lower claw cam.

FIG. 4A is a cam diagram of a cam for an upper claw, and FIG.
[Fig. 3] is a cam diagram of a lower claw cam.

FIG. 5A is an explanatory diagram showing an example of a position confirmation situation of the upper claw standby position contact P1 by a standby position detection sensor, and FIG. 5B is an explanatory diagram showing an example of a work grip situation.

FIG. 6A is an explanatory diagram showing an example of a position confirmation state of the upper claw standby position contact P2 by a standby position detection sensor, and FIG. 6B is an explanatory diagram showing an example of a work grip state.

FIG. 7A is an explanatory diagram showing an example of a grip situation when the standby position of the upper claw is set corresponding to a work having a thickness of 3 mm, and FIG. 7B is a work having a thickness of 0.1 mm. It is explanatory drawing which shows an example of the grip situation in the case of correspondence,
(C) is an explanatory view showing an example of a grip situation corresponding to a work having a thickness of 1 mm.

FIG. 8 is an explanatory diagram showing an example of an assembly structure of a semiconductor device.

FIG. 9 is a plan view showing an example of a lead frame.

[Explanation of symbols]

10 Semiconductor manufacturing equipment 10a die bonder 11 Work supply department 12 Work transfer rail 12a Work transfer rail 12b Work transfer rail 13 Work grip mechanism 13a grip part 13b grip part 13c grip part 13d grip part 13e Grip part 13f grip part 13g grip part 14 Work grip mechanism drive 15 wafer cassette 16 Wafer holder 17 Wafer take-out section 17a guide 18 Die top 19 Bonding head 19a Adsorption part 21a Cam for upper claw 21b Cam follower for upper claw 22a Cam for lower claw 22b Cam follower for lower claw 23 motor 24 cam shaft 25 Upper nail 25a Claw tip 26 Cam roller 27 Sliding member 28 Lower nail 28a Claw tip 31 base 32 springs 33 Guide 41 Standby position detection sensor 42 Light shield 43 beam holes 43a circumference 44 beam through hole 44a circumference 45 First sensor 46 Second sensor 50 semiconductor chips 51 electrode pad 52 work 52a lead frame 53 Side edge 54 die pad 55 Inner lead 56 bonding wire P die bonding point P1 standby position contact for upper claw P2 standby position contact for upper claw P3 Standby position contact for lower claw P4 Standby position contact for lower claw F wafer W work W1 work W2 work W3 work

Continued front page    (72) Inventor Miaki Makita             3-3 Fujibashi, Ome City, Tokyo 2 Hitachi Higashi             Inside Kyo Electronics Co., Ltd. (72) Inventor Masayuki Mochizuki             3-3 Fujibashi, Ome City, Tokyo 2 Hitachi Higashi             Inside Kyo Electronics Co., Ltd.

Claims (5)

[Claims] 1. A method of manufacturing a semiconductor device, comprising a step of nipping and conveying a work between a plurality of claws opened and closed by a cam mechanism, wherein the cam mechanism nips the work from a standby position when nipping the work. A method for manufacturing a semiconductor device, wherein a plurality of claw standby position contacts, which have different claw strokes to different positions, are set on the cam surface of the claw cam. 2. A method of manufacturing a semiconductor device, comprising a step of nipping and transporting a work between an upper claw and a lower claw that are moved up and down by a cam mechanism, wherein the cam mechanism waits when nipping the work. A method of manufacturing a semiconductor device, wherein a plurality of upper claw standby position contacts, which are set to have different upper claw strokes from a position to a nipping position, are set on a cam surface of the upper claw cam. 3. A method of manufacturing a semiconductor device, comprising a step of sandwiching and transporting a work between an upper claw and a lower claw that are moved up and down by a cam mechanism, wherein the cam mechanism waits when sandwiching the work. A plurality of upper claw standby position contacts that are set to have different upper claw strokes from the position to the clamping position, and have an upper claw set on the cam surface of the upper claw cam. A method for manufacturing a semiconductor device is characterized in that a cam shaft is shared with a claw cam. 4. A semiconductor device manufacturing method using a semiconductor manufacturing apparatus having a function of sandwiching and transporting a work between an upper claw and a lower claw that are moved up and down by a cam mechanism, wherein the cam mechanism uses the work. A plurality of upper claw standby position contacts, which are set to have different upper claw strokes from the standby position to the clamping position when the upper claw is clamped, have an upper claw set on the cam surface of the upper claw cam, A method of manufacturing a semiconductor device, wherein the manufacturing device has a function of transferring a semiconductor chip onto the work. 5. A semiconductor manufacturing apparatus having a function of nipping and conveying a work between an upper claw and a lower claw which are moved up and down by a cam mechanism, wherein the cam mechanism moves from a standby position when nipping the work. A semiconductor manufacturing apparatus, wherein a plurality of upper-claw standby position contacts, which are set to have different upper-claw strokes up to the holding position, have upper claws set on the cam surface of the upper-claw cam.