JP2003332321A5 - - Google Patents
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- JP2003332321A5 JP2003332321A5 JP2003056181A JP2003056181A JP2003332321A5 JP 2003332321 A5 JP2003332321 A5 JP 2003332321A5 JP 2003056181 A JP2003056181 A JP 2003056181A JP 2003056181 A JP2003056181 A JP 2003056181A JP 2003332321 A5 JP2003332321 A5 JP 2003332321A5
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Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003056181A JP4238050B2 (en) | 2001-09-20 | 2003-03-03 | Plasma processing apparatus and processing method |
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2001286054 | 2001-09-20 | ||
JP2001-286054 | 2001-09-20 | ||
JP2002037580 | 2002-02-15 | ||
JP2002-37580 | 2002-02-15 | ||
JP2003056181A JP4238050B2 (en) | 2001-09-20 | 2003-03-03 | Plasma processing apparatus and processing method |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002275738A Division JP3898612B2 (en) | 2001-09-20 | 2002-09-20 | Plasma processing apparatus and processing method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2003332321A JP2003332321A (en) | 2003-11-21 |
JP2003332321A5 true JP2003332321A5 (en) | 2005-10-27 |
JP4238050B2 JP4238050B2 (en) | 2009-03-11 |
Family
ID=29715866
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003056181A Expired - Fee Related JP4238050B2 (en) | 2001-09-20 | 2003-03-03 | Plasma processing apparatus and processing method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4238050B2 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4778715B2 (en) * | 2005-02-24 | 2011-09-21 | 株式会社日立ハイテクノロジーズ | Semiconductor manufacturing method |
JP6045646B2 (en) * | 2010-08-23 | 2016-12-14 | 東京エレクトロン株式会社 | Plasma etching method |
JP2012138581A (en) * | 2012-01-10 | 2012-07-19 | Hitachi High-Technologies Corp | Plasma processing apparatus and plasma processing method |
JP5894445B2 (en) * | 2012-01-23 | 2016-03-30 | 東京エレクトロン株式会社 | Etching method and etching apparatus |
KR102201886B1 (en) * | 2013-06-11 | 2021-01-12 | 세메스 주식회사 | Apparatus for treating substrate and method for generating plasma |
WO2020100357A1 (en) * | 2019-08-05 | 2020-05-22 | 株式会社日立ハイテク | Plasma processing device |
CN113936985A (en) * | 2020-07-14 | 2022-01-14 | 东京毅力科创株式会社 | Plasma processing apparatus and plasma processing method |
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2003
- 2003-03-03 JP JP2003056181A patent/JP4238050B2/en not_active Expired - Fee Related