JP2003330002A - Electrooptical device housed in packaging case, and projection type display - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently suppress temperature elevation in an electrooptical device housed in a packaging case such as a liquid crystal panel or the like for a projection type liquid crystal device on which the high-intensity projection light is made incident. <P>SOLUTION: The projection type display is provided with the electrooptical device comprising a picture display region on which the projection light from a light source is made incident, the packaging case holding at least a part of a peripheral region positioned on the periphery of the picture display region in the electrooptical device and an interposed layer interposed in a gap between at least a part of the peripheral region and the packaging case and further containing a far infrared ray radiating body material. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mounting case for mounting an electro-optical device such as a liquid crystal panel used as a light valve in a projection type display device such as a liquid crystal projector. The present invention belongs to the technical field of a mounting case-encased electro-optical device and a projection-type display device including such a case-encased electro-optical device.

[0002]

BACKGROUND ART In general, when a liquid crystal panel is used as a light valve in a liquid crystal projector, a powerful light source light from a light source such as a metal halide lamp is condensed on the liquid crystal panel in order to perform enlarged projection on a screen. It is incident in the state. When such strong light source light is incident, the temperature of the liquid crystal panel rises, and the temperature of the liquid crystal sandwiched between the pair of transparent substrates in the liquid crystal panel also rises, leading to deterioration of the characteristics of the liquid crystal. Further, in particular, when the light from the light source has unevenness, the liquid crystal panel is partially heated to generate a so-called hot spot, which causes unevenness in the transmittance of the liquid crystal and deteriorates the image quality of the projected image. Such a temperature rise is
A heat ray cut filter is placed between the light source and the liquid crystal panel to reduce the incidence of unnecessary infrared rays, or the liquid crystal panel is air-cooled or liquid-cooled, but this is somewhat mitigated. Therefore, more efficient temperature rise prevention measures are needed.

Therefore, conventionally, for example, Japanese Patent Laid-Open No. 9-113 is used.
As disclosed in Japanese Patent Publication No. 906, by disposing a transparent glass plate having a heat dissipation function on the outer surface of one or both of the transparent substrates of the liquid crystal panel, the deterioration of the image quality due to scratches and dust can be prevented and at the same time the liquid crystal panel of the liquid crystal panel can be prevented. We are trying to prevent temperature rise. Further, attempts have been made to improve the heat dissipation by using sapphire as the material of such dustproof glass.

Further, by forming a light-shielding film called a black matrix or a black mask on a counter substrate which constitutes a liquid crystal panel and is arranged on the incident side of the projected light, the projected light incident on the liquid crystal panel is made. A technique is also common in which the liquid crystal panel is partially shielded to prevent a temperature rise in the liquid crystal panel.

On the other hand, the projection light is also incident on the mounting case in which the electro-optical device such as a liquid crystal panel is mounted or accommodated, which promotes the temperature rise of the mounting case itself. For this reason,
For example, the mounting case is made of a light-reflective material such as aluminum, or the surface of the mounting case is coated with white paint to reflect the projection light that has entered the mounting case and suppress the temperature rise. Technology is also being considered.

[0006]

However, according to the technique disclosed in the above-mentioned Japanese Laid-Open Patent Publication No. 9-113906, a transparent glass plate having a heat radiation function is separately prepared, and the transparent liquid crystal panel is transparent. Since it is necessary to adhere to both or one of the outer surfaces of the substrate or to bond the substrates with a predetermined gap therebetween, the device configuration of the entire liquid crystal panel including the transparent glass plate becomes complicated and the manufacturing cost increases. There is.

Further, according to the technique of forming the light shielding film on the counter substrate described above, as the area for forming the light shielding film is increased, the projected light is shielded to darken the image. For this reason, it cannot be a drastic measure when using a strong light source light for displaying a bright image.

On the other hand, according to the technique for suppressing the temperature rise in the mounting case, the heat generated in the electro-optical device is transmitted to the mounting case. Therefore, it is technically very difficult to sufficiently prevent the temperature rise in the mounting case and the electro-optical device housed in the mounting case only by reflecting the projection light incident on the surface of the mounting case.

The present invention has been made in view of the above problems, and it is possible to efficiently suppress a temperature rise in an electro-optical device to which relatively strong projection light is incident, and an electro-optical device in a mounting case. It is another object of the present invention to provide a projection type display device including such an electro-optical device encased in a mounting case.

[0010]

In order to solve the above-mentioned problems, an electro-optical device including an electro-optical device encased in a first mounting case according to the present invention is an electro-optical device in which projection light is incident on a light source in an image display area. A far-infrared radiator interposed in a gap between the mounting case and at least a part of the peripheral area, which holds at least a part of the peripheral area around the image display area in the electro-optical device. An intervening layer comprising a material.

According to the first electro-optical device encased in the mounting case of the present invention, the electro-optical device in which the projection light from the light source enters the image display region is housed or mounted in the mounting case. Examples of such an electro-optical device include a liquid crystal device or a liquid crystal panel mounted as a light valve in a projection display device. The mounting case holds at least a part of the peripheral area of the electro-optical device. The "mounting case" according to the present invention means a case-shaped member that at least partially houses the electro-optical device or at least partially holds the electro-optical device, and is generally a "mounting case" or simply "case". Alternatively, it is a broad concept including members called "mounting frame" or simply "frame", and metal hooks for fixing the electro-optical device to such a case-shaped member. In such a mounting case, by covering at least a part of the peripheral area of the electro-optical device, it is possible to prevent light leakage in the peripheral area or prevent stray light from entering the image display area from the peripheral area. You may have a light-shielding function to prevent.

During operation of the electro-optical device, when the image display area is irradiated with the projection light from the light source, the temperature of the electro-optical device rises due to the incidence of the projection light. As a result, if no measures are taken, the temperature of the electro-optical device rises, which causes various harmful effects similar to those of the conventional technique. However, according to the present invention, the intervening layer interposed in the gap between the mounting case and the peripheral region of the electro-optical device includes a far infrared radiator material. Therefore, the heat generated in the electro-optical device due to the incidence of the projected light is conducted to the intervening layer, then converted into far infrared rays in the intervening layer, and is radiated as energy of far infrared rays from the intervening layer to the mounting case side. . Then, the mounting case is cooled by the heat radiation effect from the mounting case to the outside (for example, the internal space of the projection display device in which the electro-optical device is incorporated). As a result, the electro-optical device is also efficiently cooled via the intervening layer.

The "far-infrared radiator material" used in the present invention is generally used in far-infrared ray generators for generating far-infrared rays for heating, heating, drying and medical purposes, and for example, coils and resistors. Examples thereof include zirconia (ZrO ₂ ), alumina (Al ₂ O ₃ ), and the like, which generate far infrared rays with a temperature rise caused by energization of the body. In addition, "far infrared" means
Generally, it means an electromagnetic wave having a wavelength of about 3.0 to 1,000 μm. According to the research conducted by the inventor of the present application, it has been found that the temperature of the far-infrared radiation material that has been conventionally used for emitting far-infrared radiation decreases with the radiation of far-infrared radiation. It is considered that the phenomenon of such a temperature decrease is due to the high conversion efficiency of heat to far infrared in the far infrared radiator material. That is, the present invention has been made paying attention to the fact that heat is taken away from the part made of the far-infrared radiator material and the member connected to it or directly or indirectly in contact with the far-infrared radiation. It is a thing.

As described above, according to the first mounting case-encased electro-optical device of the present invention, for example, the temperature rise in the electro-optical device used as the light valve of the projection type display device, which is irradiated with strong projection light, can be efficiently performed. Can be suppressed.

In one aspect of the electro-optical device encased in the first mounting case of the present invention, the intervening layer is applied to the surface of at least a part of the peripheral region.

According to this aspect, by applying the coating material to the surface of the electro-optical device in the peripheral region, the effects peculiar to the present invention as described above can be obtained relatively easily. In particular, regarding the mounting case, it is sufficient to put the electro-optical device in the conventional manner using the conventional one, which is advantageous in practice.

In another aspect of the electro-optical device encased in the first mounting case of the present invention, the intervening layer is applied to a surface of the mounting case in a region facing at least a part of the peripheral region.

According to this aspect, the coating material is applied to the surface of the mounting case (that is, the inner surface facing the electro-optical device) in the area facing the peripheral area, which is peculiar to the present invention as described above. The effect is relatively easy to obtain. In this case, in particular, even if the far-infrared radiator material has a high coefficient of thermal expansion, it is possible to suppress the coefficient of thermal expansion in a mounting case made of a material different from the material. Therefore, it is possible to reduce thermal expansion or thermal deformation in the mounting case while realizing high heat dissipation, which is very advantageous in practical use. By the way, depending on the material of the existing mounting case, for example, expansion / deviation in units of several microns is confirmed.

However, the thermal expansion or thermal deformation may be absorbed at the portion of the mounting case that comes into contact with the electro-optical device via the intervening layer. For example, the contacting portion may be made of a highly elastic spring or the like, or may be made of a gel material, a molding material or the like so as to buffer and retain the stress. As a result, the material of the mounting case body is arbitrary with respect to the coefficient of thermal expansion, and the intervening layer may be formed from a far infrared radiator material having an arbitrary coefficient of thermal expansion. That is, it is possible to suppress the temperature rise while reducing the adverse effects caused by thermal expansion and thermal deformation in the mounting case.

In addition, according to this aspect of the coating material, it is possible to form the mounting case portion, which is the base of the coating material, from an inexpensive material such as glass, metal, resin, etc. It is also very advantageous in increasing the freedom of choice.

In another aspect of the electro-optical device encased in the first mounting case of the present invention, the intervening layer also serves as an adhesive for fixing the electro-optical device to the mounting case.

According to this aspect, the effect peculiar to the present invention as described above can be relatively easily obtained by mixing the far-infrared radiator material with the adhesive for fixing the electro-optical device in the mounting case. In this case, since the electro-optical device can be fixed to the mounting case with an adhesive, it is not necessary to use a fixing mechanism such as a metal hook.

In another aspect of the first electro-optical device encased in a mounting case of the present invention, the intervening layer also serves as a molding material for filling a gap between the electro-optical device and the mounting case.

According to this aspect, the effect peculiar to the present invention as described above can be relatively easily obtained by mixing the far-infrared radiator material with the molding material that fills the gap between the electro-optical device and the mounting case.

In another aspect of the electro-optical device encased in the first mounting case of the present invention, the mounting case is formed of a material having a higher thermal conductivity than that of the intervening layer.

According to this aspect, the heat generated by the electro-optical device is converted into far infrared energy by the intervening layer, is absorbed by the mounting case, and is further efficiently transmitted inside the mounting case. Then, the mounting case is cooled by heat radiation from the mounting case to the outside. As a result, the temperature rise in the electro-optical device can be suppressed more efficiently.

For the purpose of enhancing heat conduction between the electro-optical device and the mounting case, a molding material having a high heat conductivity may be inserted between the electro-optical device and the mounting case in addition to the intervening layer. Alternatively, such a molding material may be inserted between the intervening layer and the electro-optical device, or such a molding material may be inserted between the intervening layer and the mounting case.

In another aspect of the first mounting case-encased electro-optical device of the present invention, the surface of the mounting case on the side of the light source is made of a material having a light reflectance higher than that of the intervening layer.

According to this aspect, the surface of the mounting case on the light source side can reflect the projection light by a material having a high light reflectance such as aluminum. Thereby, heat generation in the mounting case due to irradiation of the projection light can be suppressed. That is, the temperature rise in the mounting case can be suppressed, and further the temperature rise in the electro-optical device connected to the mounting case via the intervening layer can be suppressed. For example, the surface of the mounting case on the light source side may be made of a metal material having a high light reflectance, such as aluminum, titanium, or nickel.

In another aspect of the first mounting case-encased electro-optical device of the present invention, the surface of the intervening layer is provided with irregularities.

According to this aspect, the surface of the intervening layer containing the far-infrared radiation material is provided with irregularities.
Therefore, the surface area that radiates far infrared rays is substantially increased. As a result, in the intervening layer, the efficiency in converting heat into far infrared rays is further increased, and the temperature rise in the electro-optical device can be suppressed more efficiently.

In order to solve the above-mentioned problems, a second mounting case-encased electro-optical device of the present invention is an electro-optical device in which projection light is incident on an image display region, and the image display region in the electro-optical device. And a mounting case for holding at least a part of a peripheral region located on the periphery of the peripheral region, and at least a part of the peripheral region is formed of a far infrared radiator material.

According to the second electro-optical device encased in the mounting case of the present invention, the electro-optical device in which the projection light from the light source enters the image display region is housed or mounted in the mounting case. The mounting case holds at least a part of the peripheral area of the electro-optical device.

When the image display area is irradiated with projection light from the light source during operation of the electro-optical device, the temperature of the electro-optical device rises due to incidence of the projection light. However, at least a part of the peripheral region of the electro-optical device is formed of the far infrared radiator material. For this reason, the heat generated in the electro-optical device due to the incidence of the projection light is conducted to the peripheral region thereof, and then converted into far infrared rays, and emitted as far infrared energy from the peripheral region to the mounting case side.
Then, the mounting case is cooled by heat radiation from the mounting case to the outside. As a result, the electro-optical device is also efficiently cooled via the peripheral area.

As described above, according to the second mounting case-encased electro-optical device of the present invention, for example, the temperature rise in the electro-optical device used as a light valve of a projection type display device irradiated with strong projection light can be efficiently performed. Can be suppressed.

In an aspect of the second mounting case-encased electro-optical device of the present invention, at least a part of the surface of the peripheral region is provided with irregularities.

According to this aspect, the surface of the peripheral region containing the far-infrared radiation material is provided with irregularities. Therefore, the surface area that radiates far infrared rays is substantially increased. As a result, in the peripheral area, the efficiency in converting heat into far infrared rays is further increased, and the temperature rise in the electro-optical device can be suppressed more efficiently.

In order to solve the above problems, a third mounting case-encased electro-optical device of the present invention is an electro-optical device in which projection light is incident on an image display region, and the image display region of the electro-optical device. And a mounting case for holding at least a part of a peripheral region located in the periphery of the above, and the mounting case in a region facing at least a part of the peripheral region is formed of a far infrared radiator material.

According to the third mounting case-encased electro-optical device of the present invention, the electro-optical device in which the projection light is incident on the image display region is housed or mounted in the mounting case. The mounting case holds at least a part of the peripheral area of the electro-optical device.

During operation of the electro-optical device, when the image display area is irradiated with the projection light from the light source, the temperature of the electro-optical device rises due to the incidence of the projection light. However, the mounting case in the region facing at least a part of the peripheral region of the electro-optical device is formed of the far infrared radiator material. Therefore, the heat generated by the electro-optical device due to the incidence of the projected light is conducted to the peripheral region thereof and then converted into far infrared rays. Then, the mounting case is cooled by heat radiation from the mounting case to the outside. As a result, the electro-optical device is also efficiently cooled via the peripheral area.

As described above, according to the third packaging case-encased electro-optical device of the present invention, for example, the temperature rise in the electro-optical device used as a light valve of a projection type display device which is irradiated with strong projection light is efficiently performed. Can be suppressed.

In the third aspect of the electro-optical device encased in the mounting case of the present invention, unevenness is provided on the surface of the mounting case in a region facing at least a part of the peripheral region.

According to this aspect, the surface of the mounting case containing the far-infrared radiator material is provided with irregularities. Therefore, the surface area that radiates far infrared rays is substantially increased. As a result, in the peripheral area, the efficiency in converting heat into far infrared rays is further increased, and the temperature rise in the electro-optical device can be suppressed more efficiently.

In order to solve the above-mentioned problems, a fourth mounting case-encased electro-optical device of the present invention is an electro-optical device in which projection light is incident on an image display region, and the image display region of the electro-optical device. And a mounting case that holds at least a part of a peripheral region located in the periphery of, and the surface of the mounting case on the light source side includes a far-infrared radiator material.

According to the fourth mounting case-encased electro-optical device of the present invention, the electro-optical device in which the projection light from the light source is incident on the image display region is housed or mounted in the mounting case. The mounting case holds at least a part of the peripheral area of the electro-optical device.

During operation of the electro-optical device, when the image display area is irradiated with projection light from the light source, the temperature of the electro-optical device rises due to incidence of the projection light. However, the surface of the mounting case on the light source side includes a far infrared radiator material. Therefore, the heat generated in the electro-optical device due to the incidence of the projected light is transferred to the mounting case, and then converted into far infrared rays on the surface of the mounting case on the light source side, and the outside world (for example, the electro-optical device is incorporated). It is discharged to the internal space of the projection display device). In addition, the heat generated in the mounting case itself by the projection light applied to the mounting case is also converted into far infrared rays on the light source side surface of the mounting case and is emitted to the outside world. As a result, the electro-optical device is also efficiently cooled via the peripheral area.

As described above, according to the fourth mounting case-encased electro-optical device of the present invention, it is possible to efficiently increase the temperature in the electro-optical device used as a light valve of a projection type display device which is irradiated with strong projection light. Can be suppressed.

In a fourth aspect of the electro-optical device encased in the mounting case of the present invention, a coating containing the far-infrared radiator material is applied to the surface of the light source side, and the mounting case is It is made of a material having a higher thermal conductivity than the paint.

According to this aspect, the effect peculiar to the present invention as described above can be relatively easily obtained by applying the paint to the surface of the mounting case on the light source side. Further, since the mounting case is made of a material having a higher thermal conductivity than that of the paint, it is possible to enhance the heat conduction from the electro-optical device to the surface of the mounting case on the light source side, so that the electro-optical device can be efficiently used. Can be cooled.

In another aspect of the first to fourth mounting cases of the present invention, the far infrared radiator material is zirconia (Z
rO ₂ ), alumina (Al ₂ O ₃ ), titania (TiO 2
₂ ), zircon (ZrO ₂ · SiO ₂ ) and silica (Si
O ₂ ) At least one of the sintered bodies is included.

According to this aspect, the far infrared radiator material such as zirconia can convert heat into far infrared with high efficiency, and the temperature rise in the electro-optical device can be efficiently suppressed. Note that these materials are excellent as materials that radiate far infrared rays with high efficiency, but even if they are other than these, if far infrared radiator materials such as various ceramic materials are used, the heat thereof will be far infrared rays. The effect of suppressing the above-mentioned temperature rise in the present invention can be obtained correspondingly depending on the magnitude of the efficiency of conversion into.

In another aspect of the first to fourth mounting cases of the present invention, a high efficiency infrared radiator material is used instead of or in addition to the far infrared radiator material.

According to this aspect, a high-efficiency infrared radiator material is used instead of or in addition to the far infrared radiator material. It is highly efficiently converted into infrared light in each part including the high-efficiency infrared radiator material, and is emitted from each part as infrared energy. As a result, the temperature of the electro-optical device housed or mounted in the mounting case is lowered.

The "high-efficiency infrared radiator material" used in the present invention is generally used in far-infrared ray generators for generating far-infrared rays for heating, heating, drying, and medical purposes, for example, coils and Examples thereof include manganese dioxide (MnO ₂ ), chromium oxide (Cr ₂ O ₃ ), and the like, which generate infrared rays as the temperature rises due to energization of the resistor. According to the research conducted by the inventor of the present application, it has been found that the temperature of the high-efficiency infrared radiator material that has been conventionally exclusively used for emitting infrared rays decreases with infrared radiation. It is considered that the phenomenon of such a temperature decrease is due to the high conversion efficiency of heat to infrared rays in the high-efficiency infrared radiator material. That is, the present invention was made by paying attention to the fact that heat is taken away from a part made of a high-efficiency infrared radiator material and a member connected to it or directly or indirectly contacting it with the emission of infrared rays. It is a thing.

In this embodiment, the high-efficiency infrared radiator material is manganese dioxide (MnO ₂ ), chromium oxide (Cr
₂ O ₃ ), iron oxide (Fe ₂ O ₃ ), cobalt oxide (Co
O), copper oxide (CuO), or other transition element oxide.

According to this structure, the temperature increase in the mounting case and the electro-optical device can be efficiently suppressed by the highly efficient infrared radiator material such as manganese dioxide. still,
These materials are excellent as materials that radiate infrared rays with high efficiency, but other than these, if a high-efficiency infrared radiator material made of, for example, various ceramic materials is used, its heat is converted into infrared rays. Depending on the size of efficiency,
The effect of suppressing the above-mentioned temperature rise in the present invention can be obtained accordingly.

In another aspect of the first to fourth mounting cases of the present invention, instead of or in addition to the far-infrared radiator material, a material that emits near-infrared rays having a wavelength of about 0.83 to 3.0 μm is used. Used.

According to this aspect, it is possible to convert heat into near infrared rays with high efficiency by the material that generates near infrared rays, and it is possible to efficiently suppress the temperature rise in the electro-optical device.

In order to solve the above-mentioned problems, a fifth mounting case-encased electro-optical device according to the present invention is an electro-optical device in which projection light is incident on an image display region and the image display region in the electro-optical device. And a mounting case for holding at least a part of a peripheral region located around the periphery of the mounting case, and a surface of the mounting case opposite to the light source and a surface facing the peripheral region are at least partially made of a black material. Comprises.

According to the fifth mounting case-encased electro-optical device of the present invention, the electro-optical device in which the projection light is incident on the image display region is housed or mounted in the mounting case. The mounting case holds at least a part of the peripheral area of the electro-optical device.

During operation of the electro-optical device, when the image display area is irradiated with projection light from the light source, the temperature of the electro-optical device rises due to incidence of the projection light. However, the surface of the mounting case opposite to the light source and the surface facing the peripheral region at least partially include the black material. Therefore, the heat generated in the electro-optical device due to the incidence of the projected light is conducted to the peripheral region thereof, and then, on the surface of the mounting case facing the peripheral region, far infrared rays, infrared rays,
Converted to near infrared rays. Then, the mounting case is cooled by heat radiation from the mounting case to the outside. Or, on the surface opposite to the light source in the mounting case,
The heat transmitted from the electro-optical device to the mounting case or the heat generated in the mounting case itself is converted into far infrared rays, infrared rays, near infrared rays, etc., and then radiated from the mounting case to the outside world.

The "black material" used in the present invention means a material that exhibits a black color visually regardless of the type of metal, alloy, organic substance, inorganic substance, etc. In particular, the degree of blackness thereof is white. Defined in contrast to white in the material. That is, even if some white or chromatic color is mixed in black, as long as it has a sufficient blackness to exert the effect of emitting far-infrared rays, near-infrared rays, infrared rays, etc. which bring about the above-mentioned temperature decrease. There is no substitute for the black material referred to in the present invention. According to the research conducted by the inventor of the present application, a white surface has an effect of suppressing a temperature rise by reflecting light, while a far-infrared ray, a near-infrared ray, and an infrared ray emitting ability are black. It has been found to be significantly inferior to the surface. It is considered that the phenomenon in which the temperature is lowered is due to the high conversion efficiency from heat to far infrared rays, near infrared rays, infrared rays, and the like in the black material. That is, the present invention pays attention to the fact that heat is taken away from a part made of a black material and a member connected to it or directly or indirectly in contact with radiation such as far infrared rays, near infrared rays, and infrared rays. It was done.

As described above, according to the fifth mounting case of the present invention, the temperature rise of the electro-optical device can be efficiently suppressed.

In one aspect of the fifth mounting case of the present invention,
A coating material containing the black material is applied to a surface of the mounting case opposite to the light source and a surface facing the peripheral region.

According to this aspect, the effect peculiar to the present invention as described above can be relatively easily obtained by applying the coating material to the mounting case. In this case, in particular, even if the black material has a high coefficient of thermal expansion, it is possible to suppress the coefficient of thermal expansion in a mounting case made of a different material to a low value. Therefore, it is possible to reduce thermal expansion or thermal deformation in the mounting case while realizing high heat dissipation, which is very advantageous in practical use.

In another aspect of the fifth mounting case of the present invention, the mounting case is made of a material having a higher thermal conductivity than the paint.

According to this aspect, after the heat generated in the electro-optical device is transferred to the mounting case, the heat is efficiently transferred inside the mounting case made of a material having a high thermal conductivity such as metal. Then, the mounting case is cooled by heat radiation from the mounting case to the outside. As a result, the temperature rise in the electro-optical device can be suppressed more efficiently.

In another aspect of the fifth mounting case of the present invention, the surface of the mounting case on the light source side is made of a material having a higher light reflectance than the black material.

According to this aspect, on the side where the projected light is irradiated, the projected light can be reflected by the material forming the surface of the mounting case, such as aluminum, which has a high light reflectance, or the white material. Thereby, heat generation in the mounting case itself due to irradiation of the projection light can be suppressed. That is, the temperature rise in the mounting case can be suppressed, and further the temperature rise in the electro-optical device held by the mounting case can be suppressed. On the other hand, the surface of the mounting case that is not irradiated with the projected light is made of a black material, and far infrared rays, infrared rays, near infrared rays, and the like can suppress the temperature rise in the mounting case. Further, it is possible to suppress the temperature rise in the electro-optical device held by this. For example, the mounting case is made of a metal material having high light reflectance such as aluminum, titanium, and nickel, and a coating containing a black material is applied to the surface opposite to the light source or the surface facing the peripheral area of the electro-optical device. If applied, a structure like this embodiment can be obtained relatively easily. Alternatively, the mounting case may be made of a black material, and a material having a high light reflectance may be applied only to the surface on the light source side.

In order to solve the above-mentioned problems, the projection type display device of the present invention is any one of the electro-optical devices including the above-mentioned first to fifth mounting cases (however, including various aspects thereof) of the present invention. And a light source, an optical system that guides the projection light to the electro-optical device, and a projection optical system that projects the projection light emitted from the electro-optical device.

According to the projection type display device of the present invention, since it is provided with any one of the above-mentioned electro-optical devices encased in the first to fifth mounting cases of the present invention, far infrared rays, infrared rays,
Radiation of near-infrared rays can efficiently dissipate heat from the electro-optical device to the mounting case and from the mounting case to the outside world (for example, the internal space of the projection display device), and is used as a light valve. The temperature rise in the electro-optical device can be efficiently suppressed. Therefore, the deterioration of the electro-optical material such as liquid crystal due to heat can be reduced, and the deterioration of the display image due to the temperature increase in the electro-optical material can be effectively prevented. The image can be displayed.

In one aspect of the projection type display device of the present invention, there is further provided a cooling means for flowing a fluid into the peripheral space of the electro-optical device.

According to this aspect, for example, the internal space of the projection type display device is provided with the cooling means including the blower fan for flowing the air and the circulating device for flowing the cooling medium, so that the heat dissipation from the mounting case is efficiently performed. be able to. Therefore, the temperature rise of the mounting case and the electro-optical device housed or mounted in the mounting case can be efficiently prevented.

The operation and other advantages of the present invention will be apparent from the embodiments described below.

[0075]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

(Embodiment of Projection Type Liquid Crystal Device) First, with reference to FIG. 1, an embodiment of a projection type liquid crystal device according to the present invention will be described focusing on an optical system incorporated in an optical unit thereof. The projection type display device of this embodiment is constructed as a multi-plate color projector using three liquid crystal light valves, which is an example of an electro-optical device in a mounting case.

In FIG. 1, a liquid crystal projector 11 as an example of a multi-plate type color projector in this embodiment.
00 has three liquid crystal light valves including an electro-optical device in which a driving circuit is mounted on a TFT array substrate, and RGB light valves 100R, 100G, and 100, respectively.
It is configured as a projector used as B. In the liquid crystal projector 1100, when the projection light is emitted from the lamp unit 1102 of the white light source such as a metal halide lamp, the three mirrors 1106 and the two dichroic mirrors 1108 cause the light components R, G corresponding to the three primary colors of RGB, It is divided into B and is led to the light valves 100R, 100G and 100B corresponding to the respective colors. At this time, in particular, the B light is guided through a relay lens system 1121 including an entrance lens 1122, a relay lens 1123, and an exit lens 1124 in order to prevent light loss due to a long optical path. And the light valves 100R, 10
The light components corresponding to the three primary colors modulated by 0G and 100B are combined again by the dichroic prism 1112, and then projected as a color image on the screen 1120 via the projection lens 1114.

The light valves 100R, 10 of this embodiment.
As 0G and 100B, for example, an active matrix drive type liquid crystal device using a TFT as a switching element as described later is used.

In the structure described above, the temperature of each of the light valves 100R, 100G and 100B rises due to the projection light from the lamp unit 1102 which is a strong light source. At this time, if the temperature rises excessively, the liquid crystal forming each of the light valves 100R, 100G, and 100B is deteriorated, and the hot spots due to the partial heating of the liquid crystal panel due to the unevenness of the light source cause the transmittance to increase. It causes unevenness. Therefore, particularly in the present embodiment, each of the light valves 100R, 100G, and 100B is mounted in a mounting case of the present invention as described below, and the projection type liquid crystal device 110 is mounted.
It is mounted in a zero housing. Therefore, as described later, each light valve 100R, 100G, 100B
The temperature rise of is effectively suppressed.

In this embodiment, preferably, each light valve 1 is provided in the housing of the projection type liquid crystal device 1100.
In the peripheral space of 00R, 100G, 100B, a cooling unit including a blower fan for flowing air, a circulation device for flowing a cooling medium, and the like is provided. As a result, it is possible to more efficiently dissipate heat from the electro-optical device contained in the mounting case having a heat dissipating effect as described later.

(Embodiment of Electro-Optical Device) Next, FIG. 2 shows the overall configuration of the embodiment of the electro-optical device of the present invention.
And FIG. 3 will be described. Here, a TFT active matrix drive type liquid crystal device with a built-in drive circuit, which is an example of an electro-optical device, is taken as an example. The electro-optical device according to this embodiment is the liquid crystal light valves 100R, 100G, and 100B in the liquid crystal projector 1100 described above.
Is used as. Here, FIG. 2 shows a TFT
FIG. 3 is a plan view of the electro-optical device seen from the side of the counter substrate, together with the components formed on the array substrate.
FIG. 2 is a sectional view taken along line HH ′ of FIG. 1.

2 and 3, in the electro-optical device according to this embodiment, the TFT array substrate 10 and the counter substrate 2 are used.
0 and 0 are arranged to face each other. A liquid crystal layer 50 is enclosed between the TFT array substrate 10 and the counter substrate 20,
The T array substrate 10 and the counter substrate 20 are arranged in the image display area 1
They are adhered to each other by a seal material 52 provided in a seal area located around 0a.

The sealing material 52 is made of, for example, an ultraviolet curable resin, a thermosetting resin or the like for bonding the two substrates together,
It is applied on the TFT array substrate 10 in the manufacturing process and then cured by irradiation with ultraviolet rays, heating, or the like. Further, in the sealing material 52, a gap material such as glass fiber or glass beads for dispersing the gap (inter-substrate gap) between the TFT array substrate 10 and the counter substrate 20 to a predetermined value is scattered. That is, the electro-optical device according to the present embodiment is small for a light valve of a projector and is suitable for performing enlarged display.

A light-shielding frame light-shielding film 53 that defines a frame region of the image display region 10a is provided on the counter substrate 20 side in parallel with the inside of the seal region in which the seal material 52 is arranged. However, part or all of such a frame light-shielding film may be provided as a built-in light-shielding film on the TFT array substrate 10 side.

Of the areas spread around the image display area,
A data line driving circuit 101 and an external circuit connecting terminal 102 are provided along one side of the TFT array substrate 10 in a peripheral region located outside the sealing region where the sealing material 52 is arranged, and a scanning line driving circuit 104. Are provided along two sides adjacent to this one side. Further, on the remaining one side of the TFT array substrate 10, a plurality of wirings 105 for connecting the scanning line driving circuits 104 provided on both sides of the image display area 10a are provided. Further, as shown in FIG. 2, vertical conducting members 106 functioning as vertical conducting terminals between the two substrates are arranged at four corners of the counter substrate 20. On the other hand, the TFT array substrate 10 is provided with vertical conduction terminals in the regions facing these corners. As a result, electrical continuity can be established between the TFT array substrate 10 and the counter substrate 20.

In FIG. 3, on the TFT array substrate 10, an alignment film is formed on the pixel electrodes 9a after the TFTs for pixel switching and wirings such as scanning lines and data lines are formed. On the other hand, on the counter substrate 20, the counter electrode 2
1, an alignment film is formed on the uppermost layer. Also,
The liquid crystal layer 50 is made of, for example, a liquid crystal in which one kind or several kinds of nematic liquid crystals are mixed, and between the pair of alignment films,
It takes a predetermined alignment state.

On the TFT array substrate 10 shown in FIGS. 2 and 3, in addition to the data line driving circuit 101, the scanning line driving circuit 104, etc., an image signal on an image signal line is sampled to obtain data. Line, sampling circuit, precharge circuit that supplies a precharge signal of a predetermined voltage level to multiple data lines prior to the image signal, and inspects the quality and defects of the electro-optical device during manufacturing or shipping An inspection circuit or the like may be formed for this purpose.

In the case of the electro-optical device having such a configuration, strong projection light is emitted from the upper side of FIG. 3 during its operation. Then, the counter substrate 20, the liquid crystal layer 50, the TFT
Due to heat generated by light absorption in the array substrate 10 and the like,
The temperature of the electro-optical device rises. Such a temperature rise accelerates the deterioration of the liquid crystal layer 50 and the like, and deteriorates the quality of the displayed image.

Therefore, particularly in the present embodiment, by mounting the electro-optical device in the mounting case described below,
Such a temperature rise is effectively suppressed.

(First Embodiment of Mounting Case-Encased Electro-Optical Device) Next, with reference to FIGS. 4 to 9, a first embodiment of the mounting-case-included electro-optical device according to the present invention will be described.

First, referring to FIGS. 4 to 8,
The basic configuration of the mounting case according to this embodiment will be described. Here, FIG. 4 is a front view of the mounting case, and FIG.
6 is a side view thereof, FIG. 6 is a rear view thereof, FIG. 7 is a top view thereof, and FIG. 8 is a sectional view taken along line DD ′ of FIG. 4 to 8 each show a mounting case in which the electro-optical panel is housed inside.

As shown in FIGS. 4 to 8, the mounting case 6
01 comprises a frame portion 610 and a hook portion 620. Electro-optical panel 5 housed in mounting case 601
Reference numeral 00 denotes the electro-optical device shown in FIGS. 2 and 3, and other optical elements such as an antireflection plate, a dustproof glass, and a defocus glass, which are stacked on the surface of the electrooptical device. The flexible connector 501 is connected to the. The polarizing plate and the retardation plate may be provided in the optical system of the projection type display device, or the electro-optical panel 50.
It may be superimposed on the surface of 0.

The frame portion 610 is preferably made of a light-shielding resin, metal or the like so as to prevent light leakage in the peripheral area of the electro-optical panel and prevent stray light from entering the image display area from the peripheral area. Become. The frame portion 610 has a main body that defines an internal space that houses the electro-optical panel 500, and a window portion 71 that is opened in the main body so as to expose an image display area of the electro-optical panel 500.
Have eight. The frame portion 610 has mounting holes 719 at its four corners so that the mounting case-encased electro-optical device can be mounted in the projection type display device as shown in FIG.

The hook portion 620 corresponds to the frame portion 610.
In order to fix the peripheral area of the electro-optical panel 500 placed in the internal space of the back side from the back side, a plate-shaped main body having a planar shape facing the peripheral area is provided. Hook part 62
0 has a window portion 728 so as to expose the image display area of the electro-optical panel 500, and further has engagement portions 725 having small windows for fixing the main body of the hook portion 620 to the mounting case 610 on both front sides. Have.

The mounting case 610 has projecting portions 715 that engage with the small windows of the engaging portion 725 on both front sides. The hook portion 620 is preferably made of highly elastic metal, resin, or the like so that the protrusion 715 and the engaging portion 725 can be engaged with each other.

As described above, the electro-optical panel 500 is
The engaging portion 71 is housed in the internal space of the frame portion 610.
The hook portion 620 is fixed to the frame portion 610 by the engagement between the mounting case 6 and the protrusion portion 725.
It is implemented in 01.

In the case of the mounting case-encased electro-optical device shown in FIGS. 4 to 8, the side on which the projection light is incident may be the “front side” shown in FIG. 4, that is, the frame portion 610 side. Alternatively, it may be the “back side” shown in FIG. 6, that is, the hook portion 620 side.

Next, the structure relating to the heat dissipation effect in the first embodiment of the electro-optical device encased in the mounting case configured as described above will be described with reference to FIG. here,
FIG. 9 is a schematic cross-sectional view showing a layer including a far-infrared radiator material by a thick line so that it can be visually observed in a cross section taken along line EE ′ of FIG. 4.

As shown in FIG. 9, in the first embodiment, far infrared radiation paint 701 is applied to the surface of at least the area in contact with the mounting case 601 in the peripheral area of the electro-optical panel 500. Examples of such far-infrared radiator materials include zirconia, alumina, titania, zircon and silica sinter, or various ceramic materials.

Therefore, according to the present embodiment, during operation of the electro-optical device, heat or the like generated in the electro-optical panel 500 due to the incidence of the projection light L1 is transmitted to the surface through the TFT array substrate, the counter substrate, or the like. After being transmitted to the applied far-infrared radiation paint 701, it is converted into far-infrared rays in the far-infrared radiation paint 701 and is emitted from the far-infrared radiation paint 701 to the mounting case 601 side as far-infrared energy. Then, the mounting case 601 is cooled by the heat radiation effect from the mounting case 601 to the outside (for example, the internal space of the projection display device). As a result, the electro-optical panel 500 is also cooled efficiently.

Especially in the first embodiment, since the far-infrared radiator material is used as the paint, the material of the frame portion 610 or the hook portion 620 may be an inexpensive material such as glass, iron plate, stainless steel or the like. In particular, if a material that does not easily undergo thermal expansion or thermal deformation is selected, even if the far infrared radiator material has a high thermal expansion coefficient, the mounting case 601 as a whole does not undergo thermal expansion or thermal deformation.

In addition, if the frame portion 610 or the hook portion 620 is formed of a material having a higher thermal conductivity than the far infrared radiator material, the heat generated in the electro-optical device can be generated by the frame portion 610 or the hook portion 620. Can be efficiently transmitted to the surface of the, and the heat radiation from the surface can be performed more efficiently.

For the purpose of preventing a temperature rise, the far infrared radiator material is preferably a material having a high efficiency of converting heat into far infrared rays, but in reality, the manufacturing cost, thermal expansion or deformation, mechanical strength, An appropriate material may be selected according to the actual specifications of the electro-optical device in consideration of chemical strength, weight, easiness of processing, and the like.

As a modification of the first embodiment, the far-infrared radiation paint 701 may be applied to the inner surface of the mounting case 601 side instead of being applied to the surface of the electro-optical panel 500. Alternatively, the far-infrared radiation paint 701 may be formed as a separate intervening layer in the gap between the electro-optical panel 500 and the mounting case 601 instead of as a paint. Further, the electro-optical panel 500 and the mounting case 60
The vicinity of the surface of at least one of the two may be formed of a far infrared radiator material. In addition, for the mounting case 601, the entire frame portion 610 or the entire hook portion 620 may be formed of a far infrared radiator material. Alternatively, far infrared radiation paint may be applied to the entire surface of the frame portion 610 or the hook portion 620. In any of the modifications, a heat dissipation effect similar to that in the case of the first embodiment described above can be obtained.

Second Embodiment of Mounting-case-encased Electro-Optical Device Next, a second embodiment of the mounting-case-included electro-optical device will be described with reference to FIG. Here, FIG.
FIG. 8 is a schematic cross-sectional view of a second embodiment in which a layer including a far-infrared radiator material is shown in bold at the same place as the EE ′ cross-section of FIG. 4.

In the second embodiment, the electro-optical panel 500 has no dust-proof glass, and the hook portion 6 provided on the emitting side.
22 is a type that directly contacts the electro-optical panel 500 from the lower side in FIG. In the second embodiment, the far-infrared radiation paint 702 is applied to the inner surface on the mounting case 602 side, and in particular, not only the surface that the electro-optical panel 500 directly contacts, but also the frame portion 612 and the hook portion 62.
It is also applied to the surface that contacts with 2. At this time, the coating on the surface where the frame portion 612 and the hook portion 622 contact each other may be applied to the frame portion 612, the hook portion 622, or both. Other configurations are similar to those in the first embodiment.

Therefore, according to the present embodiment, during operation of the electro-optical device, heat or the like generated in the electro-optical panel 500 due to incidence of the projection light L1 is conducted to the far-infrared radiation coating material 702 and then converted into far-infrared radiation. It is converted and emitted as far infrared energy. As a result, the electro-optical panel 50
0 will also be cooled efficiently.

As a modification of the second embodiment, the far infrared radiation paint 702 may be partially applied to the surface of the electro-optical panel 500. Or far-infrared radiation paint 7
02 may be formed as an independent intervening layer instead of as a paint. Further, the vicinity of the surface of at least one of the electro-optical panel 500 and the mounting case 602 may be formed of a far infrared radiator material. in addition,
For the mounting case 602, the entire frame portion 612 or the entire hook portion 622 may be formed of a far infrared radiator material. Alternatively, far infrared radiation paint may be applied to the entire surface of the frame portion 613 or the hook portion 623. In any of the modifications, a heat dissipation effect similar to that in the case of the second embodiment described above can be obtained.

(Third Embodiment of Electro-Optical Device with Mounting Case) Next, a third embodiment of the electro-optical device with a mounting case will be described with reference to FIG. Here, FIG.
FIG. 8 is a schematic cross-sectional view of a third embodiment in which a layer including a far-infrared radiator material is shown in bold at the same position as the EE ′ cross-section of FIG. 4.

In the third embodiment, the electro-optical panel 500 has no dust-proof glass, and the hook portions 623 provided on the emitting side and the incident side are in direct contact with the electro-optical panel 500 from both upper and lower sides in FIG. Is. In the third embodiment, the far-infrared radiation paint 703 is applied to the mounting case 603.
Is applied to the inner surface of the side, especially the electro-optical panel 5
Not only the surface with which 00 directly contacts but also the frame portion 61
3 is also applied to the surface where the hook portion 623 contacts. At this time, the frame portion 613 and the hook portion 623
The coating on the surface in contact with the frame portion 613
May be applied to the hook portion 623, the hook portion 623, or both. Other configurations are similar to those in the first embodiment.

Therefore, according to the present embodiment, during operation of the electro-optical device, heat or the like generated in the electro-optical panel 500 due to the incidence of the projection light L1 is conducted to the far-infrared radiation coating material 703 and then converted into far-infrared radiation. It is converted and emitted as far infrared energy. As a result, the electro-optical panel 50
0 will also be cooled efficiently.

As a modification of the third embodiment, the far infrared radiation paint 703 may be partially applied to the surface of the electro-optical panel 500. Or far-infrared radiation paint 7
03 may be formed as an independent intervening layer instead of as a paint. Further, the vicinity of the surface of at least one of the electro-optical panel 500 and the mounting case 603 may be made of a far infrared radiator material. in addition,
For the mounting case 603, the entire frame portion 613 or the entire hook portion 623 may be formed of a far infrared radiator material. Alternatively, far infrared radiation paint may be applied to the entire surface of the frame portion 613 or the hook portion 623. In any of the modifications, a heat dissipation effect similar to that in the case of the third embodiment described above can be obtained.

(Fourth Embodiment of Electro-Optical Device with Mounting Case) Next, a fourth embodiment of the electro-optical device with a mounting case will be described with reference to FIG. Here, FIG.
FIG. 8 is a schematic cross-sectional view of a fourth embodiment in which a layer including a far-infrared radiator material is shown in bold at the same place as the EE ′ cross-section of FIG. 4.

In the fourth embodiment, the electro-optical panel 500 has no dustproof glass, and the hook portion 6 provided on the incident side.
24 is a type that presses the electro-optical panel 500 from the upper side in FIG. 12 in a non-contact manner. In the fourth embodiment, the far-infrared radiation paint 704 is applied to the inner surface on the mounting case 604 side, and in particular, not only the surface that the electro-optical panel 500 directly contacts, but also the hooks that face each other with a minute gap therebetween. Surface 624a of portion 624 and frame portion 614
Is also applied to the surface where the hook portion 624 and the hook portion 624 contact. At this time, the coating on the surface where the frame portion 614 and the hook portion 624 contact each other may be applied to the frame portion 614, the hook portion 624, or both. For other configurations,
This is similar to the case of the first embodiment.

Therefore, according to the present embodiment, during operation of the electro-optical device, heat or the like generated in the electro-optical panel 500 due to incidence of the projection light L1 is conducted to the far-infrared radiation coating material 704 and then converted into far-infrared radiation. It is converted and emitted as far infrared energy. As a result, the electro-optical panel 50
0 will also be cooled efficiently.

As a modification of the fourth embodiment, the far infrared radiation paint 704 may be partially applied to the surface of the electro-optical panel 500. Or far-infrared radiation paint 7
04 may be formed as a separate intervening layer instead of as a paint. Furthermore, the vicinity of the surface of at least one of the electro-optical panel 500 and the mounting case 604 may be formed of a far infrared radiator material. in addition,
For the mounting case 604, the entire frame portion 614 or the entire hook portion 624 may be formed of a far infrared radiator material. Alternatively, far-infrared radiation paint may be applied to the entire surface of the frame portion 614 or the hook portion 624. In any of the modifications, a heat dissipation effect similar to that in the case of the fourth embodiment described above can be obtained.

(Fifth Embodiment of Electro-Optical Device with Mounting Case) Next, a fifth embodiment of the electro-optical device with a mounting case will be described with reference to FIG. Here, FIG.
FIG. 8 is a schematic cross-sectional view of a fifth embodiment in which a layer including a far-infrared radiator material is shown in bold at the same position as the EE ′ cross-section of FIG. 4.

The fifth embodiment is the electro-optical panel 500 '.
A dustproof glass 502a is provided on the upper side and a dustproof glass 502b is provided on the lower side. Then, the hook portion 625 provided on the emitting side is of a type that directly contacts the dustproof glass 502b from the lower side in FIG. In the fifth embodiment, the far-infrared radiation paint 705 is applied to the mounting case 605.
Is applied to the inner surface of the side, especially the electro-optical panel 5
Not only the surface with which 00 'directly contacts, but also the frame part 6
It is also applied to the surface where 15 and the hook portion 625 contact. For other configurations, the second configuration shown in FIG.
This is similar to the case of the embodiment. Therefore, a heat radiation effect similar to that of the second embodiment can be obtained. Further, the same modification as the second embodiment is possible.

(Sixth Embodiment of Electro-Optical Device with Mounting Case) Next, a sixth embodiment of the electro-optical device with a mounting case will be described with reference to FIG. Here, FIG.
FIG. 8 is a schematic cross-sectional view of a sixth embodiment in which a layer including a far-infrared radiator material is shown in bold at the same place as the EE ′ cross-section of FIG. 4.

The sixth embodiment is an electro-optical panel 500 '.
A dustproof glass 502a is provided on the upper side and a dustproof glass 502b is provided on the lower side. The hook portions 626 provided on the upper and lower sides directly contact the dustproof glasses 502a and 502b. In the sixth embodiment, the far-infrared radiation paint 706 is applied to the inner surface of the mounting case 605 side, and in particular, the electro-optical panel 50.
Not only the surface which 0'contacts directly but also the frame portion 61
6 is also applied to the surface where hook portion 626 contacts. Other configurations are similar to those of the third embodiment shown in FIG. 11. Therefore, almost the same heat radiation effect as in the third embodiment can be obtained. Further, the same modification as the third embodiment is possible.

(Seventh Embodiment of Electro-Optical Device with Mounting Case) Next, a seventh embodiment of the electro-optical device with a mounting case will be described with reference to FIG. Here, FIG.
FIG. 9 is a schematic cross-sectional view of a seventh embodiment in which a layer including a far-infrared radiator material is shown in bold at the same position as the EE ′ cross-section of FIG. 4.

The seventh embodiment is an electro-optical panel 500 ″.
A dustproof glass 502a is provided on the upper side and a dustproof glass 502b is provided on the lower side. These glass plates are slightly smaller than the TFT array substrate and the counter substrate which form the electro-optical device included in the electro-optical panel 500 ″. Therefore, a slight gap is provided around these glass plates. The hook portion 627 provided on the upper side is a type that holds the electro-optical panel 500 ″ in a non-contact manner. In the seventh embodiment, the far infrared radiation paint 7
07 is applied to the inner surface on the mounting case 607 side, and in particular, it is applied not only to the surface that the electro-optical panel 500 ″ directly contacts but also to the surface that the frame portion 617 and the hook portion 627 contact. The other structure is the same as that of the fourth embodiment shown in Fig. 12. Therefore, a heat radiation effect similar to that of the fourth embodiment can be obtained. It is possible.

(Eighth Embodiment of Electro-Optical Device with Mounting Case) Next, an eighth embodiment of the electro-optical device with a mounting case will be described with reference to FIG. Here, FIG.
FIG. 9 is a schematic cross-sectional view of an eighth embodiment in which a layer including a far-infrared radiator material is shown in bold at the same position as the EE ′ cross-section of FIG. 4.

In the eighth embodiment, the hook portion 628 provided on the emitting side is the electro-optical panel 50 from the lower side in FIG.
It is a type that directly contacts 0. In the eighth embodiment, the far-infrared radiation paint 708 is applied to the surface of the frame portion 618 of the mounting case 608 and the side on which the projection light L3 is incident. And, preferably, the frame portion 6
18 is formed of a material having a higher thermal conductivity than the far infrared radiation paint 708. For other configurations,
This is similar to the case of the second embodiment shown in FIG.

Therefore, particularly in the eighth embodiment, the projection light L
1. The mounting case 60 caused by the electro-optical panel 500
The heat that is conducted to 8 and the heat generated in the mounting case 608 itself can be released to the outside (that is, the inside of the projection display device) as far infrared rays L3 and the like by the far infrared radiation paint 708 applied to the surface of the frame portion 618. .

Such heat radiation by far infrared radiation is based on a principle different from the conventional heat radiation using air as a transmission medium, that is, so-called "air cooling". Therefore, a large practical advantage can be obtained such that the capacity of the air fan or the like is low and the air fan or the like is unnecessary. As a result, noise and power consumption during operation can be reduced. However, it goes without saying that other heat radiating means such as an air fan may be used together for radiating heat to the electro-optical device.

It is also possible to combine the structure of the eighth embodiment with the structure of the second or fifth embodiment.

In addition, in the eighth embodiment, the far-infrared radiation paint 708 may be applied to the emission side of the projection light L1 instead of or in addition to the incidence side of the projection light L1. Also by this, the heat radiation effect by the radiation of far infrared rays from the far infrared radiation paint can be expected. For example, for the incident side,
A light reflection film is formed on the surface of the mounting case to reduce heat generated in the mounting case by the projection light L1 radiated to the mounting case, and far-infrared paint 708 is applied to the surface of the mounting case on the emission side. The heat conducted from the electro-optical device or the heat generated in the mounting case may be radiated by radiation such as far infrared rays.

(Ninth Embodiment of Electro-Optical Device with Mounting Case) Next, a ninth embodiment of the electro-optical device with a mounting case will be described with reference to FIG. Here, FIG.
FIG. 9 is a schematic cross-sectional view of the ninth embodiment at the same place as the EE ′ cross section of FIG. 4.

In the ninth embodiment, the hook portion 629 provided on the emitting side has the electro-optical panel 50 from the lower side in FIG.
It is a type that directly contacts 0. In the ninth embodiment, the black paint 629a, which is an example of the black material, is used as the mounting case 60.
It is applied to the hook portion 629 of No. 9 on the side opposite to the side irradiated with the projection light L1. On the other hand, a white paint 619a, which is an example of a light-reflecting material, is applied to the side of the frame portion 619 of the mounting case 609 that is irradiated with the projection light L1. Other configurations are similar to those of the second embodiment shown in FIG.

Therefore, particularly in the ninth embodiment, the projection light L
The heat generated in the mounting case 608 itself due to No. 1 can be reduced by being reflected as reflected light Le by the white paint 619a applied to the surface of the frame portion 619. On the other hand, the heat generated in the electro-optical panel 500 by the projected light L1 and conducted to the mounting case 609 and the heat generated in the mounting case 609 itself are converted into far infrared rays L3 and the like by the black paint 629a applied to the surface of the hook portion 629. (Ie, inside the projection display device).

In this embodiment, instead of applying the black paint 629a to the hook portion 629, the hook portion 629 may be formed of a black material. On the other hand, white paint 619
Instead of applying a to the frame portion 619, the frame portion 619 may be formed from a white material.

Instead of the white paint 619a, a reflecting film may be formed from a light reflecting material such as aluminum, nickel, or chromium.

It is also possible to combine the structure of the ninth embodiment with the structure of the second or fifth embodiment.

(Other Modifications) In each of the above-described embodiments, the mounting case is composed of the frame portion and the hook portion, but the electro-optical panel is arranged with respect to the frame portion.
The hook portion may be omitted by fixing with an adhesive. At this time, instead of or in addition to applying the far-infrared radiation coating material, the far-infrared radiation material may be mixed in such an adhesive.

Also, in place of or in addition to applying the far-infrared radiation paint, the far-infrared radiation material may be mixed in a molding material that fills the gap between the frame portion and the hook portion. An effect similar to is obtained.

Furthermore, irregularities may be provided on the surface on which the far infrared radiation paint is applied or on the surface of the portion made of the far infrared radiation material. According to this structure, since the surface area for radiating far infrared rays or the like is substantially increased, the efficiency in converting heat to far infrared rays is further increased, and the temperature rise in the electro-optical device can be suppressed more efficiently. Becomes

Furthermore, instead of or in addition to the far infrared radiator material in each of the above-mentioned embodiments, for example, oxides of transition elements such as manganese dioxide, chromium oxide, iron oxide, cobalt oxide, copper oxide, or various kinds. A high efficiency infrared radiator material such as a ceramic material may be used. With such a configuration, it is almost difficult to obtain a heat radiation effect to the same extent as far-infrared radiation in each of the above-described embodiments, but by converting heat to infrared rays on the surface of the high-efficiency infrared radiator material. , A similar heat dissipation effect is obtained accordingly.

In each of the above-described embodiments, the heat radiation effect of far infrared rays or infrared rays in the mounting case has been described, but near infrared rays may be emitted along with such radiation. Furthermore, it is possible to employ a material in which the radiation of near infrared rays is more dominant than that of far infrared rays and infrared rays. In any case, by the heat radiation effect by radiating far infrared rays, near infrared rays or infrared rays,
Effects similar to those of the various embodiments described above are obtained correspondingly depending on the degree of the radiation.

As described in detail above, according to the embodiments of the present invention, at least a part of the mounting case is made by using at least one of the far infrared radiator material, the high efficiency infrared radiator material, and the black material. Or at least a part of the mounting case is coated, and the far-infrared rays or infrared rays emitted from the part enhance the heat dissipation effect in the mounting case. The temperature rise can be effectively prevented.

In each of the embodiments, since the peripheral area of the electro-optical device or the mounting case is particularly devised, the heat-dissipating glass plate is displayed in comparison with the case where the heat-dissipating glass plate is provided at a position facing the image display area of the electro-optical device. This is advantageous because it does not darken the image and there is no possibility that reflected light will be generated by inserting an interface in the optical path. Further, since the heat radiation effect can be enhanced without making any changes to the electro-optical device itself, it is advantageous in terms of manufacturing cost.

In each of the embodiments described above with reference to FIGS. 1 to 17, instead of providing the data line driving circuit 101 and the scanning line driving circuit 104 on the TFT array substrate 10, for example, TAB (Tape Automated). Bonding) The driving LSI mounted on the substrate may be electrically and mechanically connected via an anisotropic conductive film provided on the periphery of the TFT array substrate 10. Further, the side of the counter substrate 20 on which the projection light is incident and the TFT array substrate 10
On the side where the emitted light of is emitted, for example, TN (Twiste
d Nematic) mode, VA (Vertically Aligned) mode, PDLC (Polymer Dispersed Liquid Crystal) mode and other operation modes, and normally white mode / normally black mode, depending on the type, polarizing film, retardation film, polarizing plate, etc. Are arranged in a predetermined direction.

The present invention is not limited to the above-mentioned embodiments, but can be appropriately modified within the scope of the gist or concept of the invention which can be read from the claims and the entire specification, and such modifications are accompanied. A mounting case, and a projection display device including the mounting case and the electro-optical device mounted therein are also included in the technical scope of the present invention.

[Brief description of drawings]

FIG. 1 is a plan view of an embodiment of a projection type liquid crystal device according to the present invention.

FIG. 2 is a plan view of an embodiment of a liquid crystal panel according to the present invention.

3 is a cross-sectional view taken along the line HH 'of FIG.

FIG. 4 is a front view of the first embodiment of the mounting case according to the present invention.

FIG. 5 is a side view of the first embodiment of the mounting case according to the present invention.

FIG. 6 is a back view of the first embodiment of the mounting case according to the present invention.

FIG. 7 is a top view of the first embodiment of the mounting case according to the present invention.

8 is a cross-sectional view taken along the line D-D 'of FIG.

9 is a schematic cross-sectional view showing a layer containing a far-infrared radiator material by a thick line in a section EE ′ of FIG.

10 is a schematic cross-sectional view of the second embodiment at the same location as the EE ′ cross section of FIG. 4. FIG.

11 is a schematic cross-sectional view of the third embodiment at the same location as the EE ′ cross section of FIG. 4. FIG.

12 is a schematic cross-sectional view of the fourth embodiment at the same place as the EE ′ cross section of FIG. 4. FIG.

13 is a schematic cross-sectional view of the fifth embodiment at the same place as the EE ′ cross section of FIG. 4. FIG.

14 is a schematic cross-sectional view of the sixth embodiment at the same location as the EE ′ cross section of FIG. 4. FIG.

15 is a schematic cross-sectional view of the seventh embodiment at the same position as the EE ′ cross section of FIG. 4. FIG.

16 is a schematic cross-sectional view of the eighth embodiment at the same location as the EE ′ cross section of FIG. 4. FIG.

17 is a schematic cross-sectional view of the ninth embodiment at the same place as the EE ′ cross section of FIG. 4. FIG.

[Explanation of symbols]

10 ... TFT array substrate 20 ... Counter substrate 50 ... Liquid crystal layer 100R, 100G, 100B ... Light valve 601 to 609 ... Mounting case 610, 612 to 619 ... Frame portion 620, 621 to 629 ... Hook portion 701-708 ... Far-infrared radiation paint 1100 ... Liquid crystal projector 1102 ... Lamp unit

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) G03B 21/16 G03B 21/16 5G435 G09F 9/00 304 G09F 9/00 304B F term (reference) 2H088 FA18 HA05 HA14 MA20 2H089 HA40 JA10 KA15 QA06 QA11 UA05 2H091 FA08X FA08Z FA14Z FA35Z FA41Z GA01 GA11 GA13 LA04 LA11 LA12 MA07 2K103 AA05 AB10 DA03 DA16 3L044 BA06 CA13 DA01 DB01 BB17 CC01 BB17 CC01 5A435 AA12 AA17 ABBBB17A15 AA17 ABB17A15 AA17 ABB17A15 AA17 ABB17A15 AA17 AA15 AA17 AABB AA17 AABB AA17 AABB AA17 AABBA17

Claims (24)

[Claims] 1. An electro-optical device in which projection light is incident on an image display region from a light source, and a mounting case for holding at least a part of a peripheral region located around the image display region in the electro-optical device, An electro-optical device encased in a mounting case, comprising an intervening layer interposed in a gap between the mounting case and at least a part of the peripheral region and including a far infrared radiation material. 2. The mounting case-encased electro-optical device according to claim 1, wherein the intervening layer is applied to a surface of at least a part of the peripheral region. 3. The mounting case-encased electro-optical device according to claim 1, wherein the intervening layer is applied to a surface of the mounting case in a region facing at least a part of the peripheral region. 4. The mounting case-encased electro-optical device according to claim 1, wherein the intervening layer also functions as an adhesive for fixing the electro-optical device to the mounting case. 5. The mounting case-encased electro-optical device according to claim 1, wherein the intervening layer also serves as a molding material that fills a gap between the electro-optical device and the mounting case. 6. The mounting case-encased electro-optical device according to claim 1, wherein the mounting case is made of a material having a higher thermal conductivity than that of the intervening layer. apparatus. 7. The mounting case according to claim 1, wherein a surface of the mounting case on the light source side is made of a material having a light reflectance higher than that of the intervening layer. Electro-optical device. 8. The mounting case-encased electro-optical device according to claim 1, wherein unevenness is provided on a surface of the intervening layer. 9. An electro-optical device in which projection light is incident on the image display region from a light source, and a mounting case for holding at least a part of a peripheral region located around the image display region in the electro-optical device. The packaging case-encased electro-optical device, wherein at least a part of the peripheral region is formed of a far infrared radiator material. 10. The unevenness is provided on at least a part of the surface of the peripheral region.
The electro-optical device in the mounting case described in. 11. An electro-optical device in which projection light is incident on the image display region from a light source, and a mounting case for holding at least a part of a peripheral region located around the image display region in the electro-optical device. The mounting case-encased electro-optical device, wherein the mounting case in a region facing at least a part of the peripheral region is formed of a far infrared radiator material. 12. The mounting case-encased electro-optical device according to claim 11, wherein unevenness is provided on a surface of the mounting case in a region facing at least a part of the peripheral region. 13. An electro-optical device in which projection light is incident on an image display region from a light source, and a mounting case for holding at least a part of a peripheral region located around the image display region in the electro-optical device. The mounting case-encased electro-optical device, wherein a surface of the mounting case on the light source side includes a far-infrared radiator material. 14. A coating material containing the far-infrared radiator material is applied to a surface of the light source side, and the mounting case is formed of a material having a higher thermal conductivity than the coating material. The mounting case-encased electro-optical device according to claim 13, wherein 15. The far infrared radiator material is zirconia.
A (ZrO_Two), Alumina (Al_TwoO_Three), Titania
(TiO_Two), Zircon (ZrO_Two・ SiO _Two) And silicon
Stone (SiO_Two) Including at least one of the sintered bodies
15. The method according to any one of claims 1 to 14, characterized in that
Electro-optical device in a mounting case. 16. The packaging case-encased electro-optical device according to claim 1, wherein a high-efficiency infrared radiator material is used instead of or in addition to the far infrared radiator material. apparatus. 17. The high-efficiency infrared radiator material is manganese dioxide (MnO ₂ ), chromium oxide (Cr ₂ O ₃ ),
The mounting case according to claim 16, wherein the mounting case is an oxide of a transition element such as iron oxide (Fe ₂ O ₃ ), cobalt oxide (CoO), and copper oxide (CuO). 18. A material that emits near-infrared rays having a wavelength of about 0.83 to 3.0 μm is used instead of or in addition to the far-infrared radiator material. The electro-optical device encased in the mounting case according to claim 1. 19. An electro-optical device in which projection light is incident on the image display region from a light source, and a mounting case for holding at least a part of a peripheral region located around the image display region in the electro-optical device. The mounting case-encased electro-optical device, wherein a surface of the mounting case opposite to the light source and a surface of the mounting case facing the peripheral region at least partially include a black material. 20. The coating material containing the black material is applied to a surface of the mounting case opposite to the light source and a surface facing the peripheral region. Electro-optical device in a mounting case. 21. The mounting case-encased electro-optical device according to claim 20, wherein the mounting case is made of a material having a higher thermal conductivity than the paint. 22. The mounting case according to claim 19, wherein a surface of the mounting case on the light source side is made of a material having a higher light reflectance than the black material. Electro-optical device. 23. The mounting case-encased electro-optical device according to claim 1, the light source, an optical system that guides the projection light to the electro-optical device, and the emission from the electro-optical device. And a projection optical system for projecting projected light. 24. A cooling means is further provided for flowing a fluid into a peripheral space of the electro-optical device.
The projection type display device described in 1.