JP2003327899A - Photocurable putty composition - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a photocurable putty composition having fast curing properties, and providing a cured film having excellent abrasivity, excellent adhesion properties and the like, especially the photocurable putty composition useful for repairing coating as repairing or the like of an automobile. <P>SOLUTION: The photocurable putty composition comprises (A) an epoxy group-containing compound, (B) a polymerizable unsaturated group-containing compound, (C) a cationic polymerization initiator, (D) a free radical photopolymerization initiator and (E) a pigment as essential components. The ratio (A)/(B) of the formulated components (A) to (B) by weight of solid is (95/5)-(5/95), and the content of the component (E) is 30-300 pts.wt. based on 100 pts.wt. solid component of the resin in the composition. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photocurable putty composition capable of forming a cured film which is fast-curing and has excellent polishing property, adhesiveness, etc., and particularly to a photocurable putty useful for repair coating such as automobile repair. It relates to a composition.

[0002]

2. Description of the Related Art For repair coating of automobile outer panels, etc., the old coating film on the damaged part is usually peeled off, the part is filled with putty material, the putty surface is polished after drying, and then A coating system is used in which a primer is painted and then polished, and then a base coating and a clear coating are sequentially performed to finish.

As a putty used in such a repair system, an unsaturated group-containing polyester resin-based room temperature curing type two-pack type coating is generally used, and usually, it is naturally dried or forcedly dried by hot air. Is being done. In this case, there is a problem that it takes a long time for all the repairing steps because it takes 20 minutes to 1 hour at room temperature for drying after coating. Also, the coating material is a two-component type, which is difficult to handle, and it has been desired to shift to a one-component type.

Therefore, the applicant of the present invention has filed Japanese Patent Application Laid-Open No. 9-13708.
No. 9, JP-A-9-176517, and the like, by using a one-pack type photocurable composition as putty, it is easy to handle, and the time of the entire repairing process can be greatly shortened. It was proposed that a coating film with good performance could be formed. However, the above putty composition is a photo-radical-polymerizable composition and has a defect such as inhibition of curing by oxygen in the air when cured by irradiation with light.

On the other hand, as a photo-curing composition, a photo-cationic polymerizable composition has been known so far, and the curing shrinkage is small and there is no inhibition of curing by oxygen, but there is an inhibition of curing by water, and the curing rates are comparable. However, it has a drawback that the curability of a thick film is poor.

An object of the present invention is a photocurable putty composition that can be used in general fields such as the field of automobile repair painting, that is, it can be cured for a short time and can form a film excellent in polishing and adhesion. To provide things.

[0007]

Means for Solving the Problems That is, the present invention is as follows. (A) Epoxy group-containing compound, (B) Polymerizable unsaturated group-containing compound, (C) Cationic polymerization initiator, (D) Photoradical polymerization initiator, (E) Pigment is contained as an essential component. ) Component and (B) component blending ratio is (A) /
The solid content weight ratio of (B) is 95/5 to 5/95, and
In addition, the content of the component (E) is 100 resin solids in the composition.
1. 30 to 300 parts by weight with respect to parts by weight, a photocurable putty composition, 2. The photocurable putty composition according to item 1, which contains an oxetane ring-containing compound and / or a vinyl ether compound. At least one selected from an epoxy group-containing compound (A), an oxetane ring-containing compound, a vinyl ether compound and a polymerizable unsaturated group-containing compound (B) has a hydroxyl group, or contains a hydroxyl group-containing compound 1
3. The photocurable putty composition according to item 2, 4. The photocurable putty composition according to item 1, which contains resin fine particles; There is provided a repair coating method comprising applying the photocurable putty composition according to any one of 1 to 4 on a surface of a base material, irradiating with light, and then applying a topcoat paint.

[0008]

BEST MODE FOR CARRYING OUT THE INVENTION In the present invention, the epoxy group-containing compound (A) is a low molecular weight compound and a high molecular weight resin containing a 1,2-epoxy group such as a conventionally known glycidyl group and alicyclic epoxy group. Etc. are included.

Examples of the low molecular weight compound containing a 1,2-epoxy group include glycidyl (meth) acrylate and allyl glycidyl ether;

[0010]

[Chemical 1]

[0011]

[Chemical 2]

Etc .;

[0013]

[Chemical 3]

An adduct of the like with a polyisocyanate compound;

[0015]

[Chemical 4]

[0016] Examples thereof include an adduct of and a polybasic acid.

Examples of the 1,2-epoxy group-containing resin include glycidyl ether type epoxy resin, glycidyl ester type epoxy resin, alicyclic epoxy resin, glycidyl group-containing acrylic resin, alicyclic epoxy group-containing acrylic resin. And so on. These can be used alone or in combination of two or more. Moreover, these may contain a hydroxyl group. Among these, for example, as the alicyclic epoxy group-containing acrylic resin, those obtained by a conventionally known method can be used without particular limitation, and for example, (i)
(Meth) acrylic acid ester monomer having an alicyclic epoxy group is homopolymerized by a known polymerization method such as solution polymerization in the presence of a radical polymerization initiator, or is copolymerized with another copolymerizable monomer, (Ii) by reacting a compound having an alicyclic epoxy group and a first reactive group with an acrylic resin having a second reactive group which reacts with the first reactive group. The resulting acrylic resin can be used. The alicyclic epoxy group-containing acrylic resin is 1
The number of alicyclic epoxy groups in the molecule is about 5 or more on average, preferably about 5 to 1600 on average, and more preferably 1 on average.
It is suitable to contain 0 to 200 of them, and it is desirable that the number average molecular weight of the resin is in the range of 2,000 to 100,000, preferably 3,000 to 30,000.

In the present invention, the above-mentioned epoxy group-containing compound (A) can be optionally used in combination with other cationically polymerizable compounds. For example, oxetane ring-containing compounds, vinyl ether compounds, oxolane compounds, cyclic acetal compounds, cyclic compounds. Examples thereof include lactone compounds and spiro orthoester compounds. Of these, it is particularly preferable to use an oxetane ring-containing compound and / or a vinyl ether compound in combination.

The above oxetane ring-containing compound has the following formula in one molecule:

[0020]

[Chemical 5]

(In the formula, R represents a hydrogen atom, a fluorine atom, a linear or branched alkyl group having 1 to 6 carbon atoms, a linear or branched fluoroalkyl group having 1 to 6 carbon atoms, or an allyl group. Is a compound having one oxetane ring. As the oxetane ring-containing compound,
In particular, (B-1) a compound having one oxetane ring and one hydroxyl group in one molecule, (B-2) a compound having one oxetane ring and one or more 1,2-epoxy groups in one molecule, And (B-3) a compound having at least one oxetane ring and at least one polymerizable unsaturated group in one molecule is preferable.

Examples of the oxetane ring-containing compound (B-1) include those represented by the following formula

[0023]

[Chemical 6]

Examples thereof include compounds represented by the formula (wherein R has the same meaning as described above).

Examples of the oxetane ring-containing compound (B-2) include those represented by the following formula

[0026]

[Chemical 7]

(In the formula, R has the same meaning as described above, and R 1
Represents an epoxy group-containing group).

Examples of the oxetane ring-containing compound (B-3) include those represented by the following formula

[0029]

[Chemical 8]

(Wherein R has the same meaning as described above and R ²
Represents a hydrogen atom or a methyl group).

The oxetane ring-containing compounds (B) listed above can be used alone or in combination of two or more kinds. Among these, (B-1) and (B-3) are particularly preferably used from the viewpoint of curability.

Examples of the vinyl ether compound include butyl vinyl ether, cyclohexyl vinyl ether, triethylene glycol divinyl ether, cyclohexane dimethanol divinyl ether, hydroxybutyl vinyl ether, propenyl ether propylene carbonate, hydroxybutyl vinyl ether, and isocyanate. And vinyl ether-terminated urethane oligomers.

The amount of the oxetane ring-containing compound and / or vinyl ether compound used relative to the epoxy group-containing compound (A) is 60% by weight or less, preferably 1 to 50% by weight, based on the weight of the solid content of the component (A). Within the range is suitable.

In the present invention, at least one selected from the epoxy group-containing compound (A), the oxetane ring-containing compound, the vinyl ether compound and the polymerizable unsaturated group-containing compound (B) contains a hydroxyl group or a hydroxyl group-containing compound. Further, it can be contained.

The hydroxyl group-containing compound includes conventionally known low molecular weight compounds containing a hydroxyl group and high molecular weight resins,
Examples thereof include aliphatic or aromatic polyhydric alcohols, alkylene oxide adducts or ε-caprolactone adducts of the polyhydric alcohols, vinyl ethers thereof and the like, and further hydroxyethyl (meth) acrylate. An acrylic resin containing a hydroxyl group-containing monomer as a copolymerization component, a hydroxyl group-containing polyester resin and the like can be mentioned. Of these, ε-caprolacturone adducts and polymers thereof are particularly preferable, and polycaprolactone diol,
Polycaprolactone triol and the like are preferable in terms of reactivity and physical properties.

The amount of the epoxy group-containing compound (A) used, and further the hydroxyl group-containing compound with respect to the oxetane ring-containing compound and vinyl ether compound, is 40% by weight or less, preferably 30% by weight or less, based on the total amount of these compounds. The range is appropriate. If the amount of the hydroxyl group-containing compound used exceeds this range, the reactivity is lowered and the resulting coating tends to be soft, which is not preferable.

In the present invention, the polymerizable unsaturated group-containing compound (B) is a component which is cured by a photoradical polymerization reaction, and includes a low molecular weight compound having a polymerizable unsaturated group and a high molecular weight resin.

Examples of the low molecular weight compound include monomers or oligomers having a polymerizable unsaturated group, such as ethyl (meth) acrylate, butyl (meth) acrylate, 2-ethylhexyl (meth) acrylate and isobornyl (meth). ) Acrylate, norbornyl (meth) acrylate, adamantyl (meth) acrylate, hydroxyethyl (meth) acrylate, polyethylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tetramethylolmethane tetra (meth) acrylate, tetramethylol Methane tetra (meth) acrylate, dipentaerythritol (meth) acrylate, tricyclodecane dimethanol di (meth) acrylate, 2,2-bis (4- (3-methacryl) Roxy-2-hydroxypropoxy) -phenyl) propane, di (methacryloxyethyl) trimethylhexamethylenediurethane, 2,2-bis (4-methacryloxypolyethoxyphenyl) propane and other monovalent or polyvalent alcohols. (Meth) acrylic acid ester; ethylene glycol dimaleate, propylene glycol diitaconate, etc .; 4- (meth) acryloyloxymethoxycarbonylphthalic acid, 4- (meth)
4- (meth) acryloyloxyl group-containing aromatic polycarboxylic acid such as acryloyloxyethoxycarbonylphthalic acid and its acid anhydride; styrene, α-methylstyrene, chlorostyrene, vinyltoluene, t-butylstyrene, divinylbenzene, etc. Aromatic vinyl compounds;
(Meth) acrylic acid, maleic acid; diallyl phthalate, diallyl isophthalate, triallyl phthalate;
Phosphoric acid (meth) acrylate; epoxy acrylate,
Examples thereof include polyester acrylate, polydimethyl silicon di (meth) acrylate, and urethane oligomer, and these can be used alone or in combination of two or more.

The resin having a polymerizable unsaturated group is, for example, a resin having at least one, and preferably three or more ethylenically unsaturated groups in one molecule, such as polyester resin, acrylic resin, vinyl resin, Examples include resins obtained by introducing a polymerizable unsaturated group such as a (meth) acryloyl group or an allyl group into a resin such as a polybutadiene resin, an alkyd resin, an epoxy resin, or a urethane resin. These may be used alone or in combination of two or more. Can be used. Of these,
A (meth) acryloyl group-introduced polyester resin, a (meth) acryloyl group-introduced epoxy resin, and a (meth) acryloyl group-introduced urethane resin are preferable.

The mixing ratio of the component (A) to the component (B) is 95 in terms of solid content weight ratio of component (A) / component (B).
/ 5 to 5/95, preferably 80/20 to 20/80, and the compounding ratio of the cationic polymerization component containing the component (A) and the component (B) is
Cationic polymerization component / (B) component solid content weight ratio of 95 /
5 to 5/95, preferably 70/30 to 35/65, the strength of the cured film, the viscosity of the putty composition,
It is suitable from the viewpoints of adhesion, polishing, thick film curability, and the like.

In the present invention, the cationic polymerization initiator (C)
Is a compound that can be cleaved by light irradiation or heating to generate a carbocation to initiate cationic polymerization of the epoxy group-containing compound (A), and further a cationic polymerization component such as an oxetane ring-containing compound or a vinyl ether compound. is there. The cationic polymerization initiator is preferably an aromatic onium salt, for example, SbF6-, SbF4
Preferred examples thereof include onium salts composed of an anion component such as-, BF4-, AsF6-, or PF6-, and an aromatic cation containing an atom such as nitrogen, sulfur, phosphorus, or iodine. .

Specific examples of the suitable cationic polymerization initiator (C) include, for example, the following formulas.

[0043]

[Chemical 9]

[0044]

[Chemical 10]

(In the formula, X- is SbF6-, SbF4-,
And a compound represented by PF6 −, BF4 − or AsF6 −.

The amount of the above-mentioned cationic polymerization initiator (C) to be added is such that the component (A), the oxetane ring-containing compound and / or
Alternatively, it is appropriate from the viewpoint of the curability of the film that the amount is in the range of about 0.1 to 100 parts by weight based on 100 parts by weight of the total solid content of the cationic polymerization components such as vinyl ether compounds.

In the present invention, the photoradical polymerization initiator (D) is a compound that absorbs ultraviolet rays or visible light to generate radicals and initiates radical polymerization of the polymerizable unsaturated group-containing compound (B). Thus, a photoradical polymerization initiator known per se can be used. Examples of the photo radical polymerization initiator (D) include 4-phenoxydichloroacetophenone, 4-t-butyl-dichloroacetophenone, 4-t-butyl-trichloroacetophenone, diethoxyacetophenone, and 2-hydroxy-2.
-Methyl-1-phenylpropan-1-one, 1- (4
-Isopropylphenyl) -2-hydroxy-2-methylpropan-1-one, 1- (4-dodecylphenyl)
2-hydroxy-2-methylpropan-1-one, 4
-(2-Hydroxyphenoxy) -phenyl (2-hydroxy-2-propyl) ketone, 1-hydroxycyclohexylphenyl ketone, 2-methyl-1- [4- (methylthio) phenyl] -2-morpholinopropanone-1
Acetophenone compounds such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,
Thioxanthone compounds such as 4-dimethylthioxanthone, isopropylthioxanthone, and 2,4-dichlorothioxanthone; benzyl, benzyldimethylketal,
Benzyl compounds such as benzyl-β-methoxyethyl acetal and 1-hydroxycyclohexyl phenyl ketone; benzophenone, methyl o-benzoylbenzoate,
Benzophenone compounds such as Michler's ketone, 4,4'-bisdiethylaminobenzophenone and 4,4'-dichlorobenzophenone; benzoin ether compounds such as benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isobutyl ether; bis (cyclopentadiene Titanocene derivatives such as enyl) -bis (2,6-difluoro-3- (1-pyr-1-yl) phenyl) titanium; camphorquinone, anthraquinone, 3-ketocoumarin, α-naphthyl, diphenylphosphine oxide, bis (2 , 4,6-Trimethylbenzoyl) -phenylphosphine oxide and the like.

The photoradical polymerization initiator (D) is
Not only does it contribute to the radical polymerization of the component (B), but it also acts as a sensitizer for the above cationic polymerization initiator (C) depending on its type, and its content is the solid content weight of the component (B). Within the range of 0.1 to 100 parts by weight, preferably within the range of 1 to 100 parts by weight with respect to 100 parts by weight, and within the range of approximately 0.1 to 10% by weight based on the total weight of resin solids in the putty composition. Is preferred.

In the present invention, as the pigment (E), for example, extrinsic pigments such as talc, mica, barium sulfate, kaolin, calcium carbonate, clay, silica, quartz and glass can be used. Coloring pigments such as bonblack and iron black may be mentioned, and further glass balloons, plastic balloons and the like may be included. The content of the pigment (E) is the resin solid content 1 in the composition.
It is in the range of 30 to 300 parts by weight with respect to 00 parts by weight.
If the content is less than 30 parts by weight, the polishing workability is poor, while if it exceeds 300 parts by weight, the finishability after topcoat coating is deteriorated, which is not preferable.

If necessary, resin fine particles may be used in combination with the pigment (E). As the resin fine particles,
Resin particles such as conventionally known polymer beads and finely pulverized polymers of the above monomers, and gelled polymer fine particles (for example, JP-A-51-126287,
JP-A-53-133233, JP-A-53-133
236, JP-A-56-76447, JP-A-58-129065), and the like, and particularly, a polymerizable monomer having at least two radically polymerizable unsaturated groups in the molecule and others. Gel polymer particles obtained by emulsion-polymerizing the radical-polymerizable unsaturated monomer (1) in the presence of a reactive emulsifier containing an allyl group in the molecule (see, for example, JP-A-3-66770).
Is excellent in dispersibility in the composition and can be preferably used.

As the polymerizable monomer having at least two radically polymerizable unsaturated groups in the molecule used for producing the gelled polymer fine particles, for example, ethylene glycol di (meth) acrylate, 1, 6-Hexanediol diacrylate, etc., and other radically polymerizable unsaturated monomers include, for example, conventionally known polymerizable unsaturated monomers such as (meth) acrylic acid alkyl ester, hydroxyl group-containing monomer, and styrene. And can be appropriately selected. A water-soluble azoamide compound or the like can be used as a polymerization initiator during emulsion polymerization.

The particle size of the above resin fine particles can be appropriately selected without any particular limitation, but is usually 30 μm or less, preferably 0.
The range of 05 to 10 μm is suitable. To adjust the particle size,
It can be carried out by a conventionally known method, for example, in the case of the gelled polymer fine particles, it can be carried out by adjusting the kind and amount of the reactive emulsifier. The resin fine particles are preferably blended so that the solid content is 5 to 100% by weight, preferably 10 to 50% by weight based on the weight of the pigment (E).

The putty composition of the present invention comprises the above (A),
Containing the components (B), (C), (D) and (E) as essential components, and further, if necessary, an organic solvent, sensitizer, chain transfer agent, organic peroxide, fibrin derivative, non-reactive Diluent, thermoplastic resin, phosphate group-containing compound, surface conditioner,
Various additives such as a defoaming agent can be blended.

In the present invention, a repair is carried out by coating the surface of the substrate with the photocurable putty composition obtained as described above, irradiating with light using a light source, polishing if necessary, and then coating a topcoat paint. It also provides a painting method.

Examples of the substrate surface include various material surfaces such as metal (iron, aluminum, zinc-plated steel sheet, iron-zinc alloy-plated steel sheet, tin plate, copper, etc.), plastics, ceramics, chemical treatment surfaces thereof, and plastics. Etc., and the old coating film surface coated on these, etc. When the surface is a damaged portion, it is appropriate to perform sanding around the damaged portion as necessary to the periphery thereof.

The putty composition can be applied mainly by a conventionally known method such as spatula application, or spraying may be performed by adjusting the coating viscosity. The coating amount is not particularly limited, but is usually 0.2 to
It is suitable to be within the range of 5 mm.

As the above-mentioned light source, conventionally known ones can be used without particular limitation, and examples thereof include a halogen lamp, a xenon lamp, a krypton lamp, a metal halide lamp, a fluorescent lamp, sunlight, a semiconductor laser and a light emitting diode. Can be mentioned. The irradiation conditions can be appropriately selected depending on the thickness and composition of the putty layer.

After the photo-curing putty layer is cured, or in an uncured state, primer coating may be applied as needed.

For primer surfacer coating, a room temperature dry type such as a lacquer type, a urethane type, an alkyd type, an epoxy type or a photocurable type primer surfacer can be used without particular limitation. When a photocurable primer surfacer is used, it is also possible to coat the photocurable primer surfacer with the putty surface uncured and to cure both layers simultaneously by irradiation with light.

The topcoat paint, which is applied after polishing the cured putty surface or primer surfacer surface, if necessary, is usually used for repairing acrylic lacquer, urethane curable paint, fluororesin paint, etc. Organic solvent-based or water-based top coatings can be used without particular limitation, and urethane curable coatings are particularly preferable. As the top coating, a conventionally known finish such as 1-coat finish or 2-coat finish can be applied without particular limitation.

The putty composition of the present invention is useful for repairing automobiles, railway vehicles, industrial equipment, woodworking, and the like, and is not limited to this, and is also used for repairing cracks in joints and furniture and for sealing joints. it can.

[0062]

EXAMPLES The present invention will be described in more detail with reference to examples. In addition, "part" and "%" mean "weight part" and "weight%", respectively.

Examples 1 to 6 and Comparative Examples 1 to 4 Each composition was compounded according to the composition shown in Table 1 below, and added sequentially and dispersed and mixed with stirring to prepare each putty composition.

(Note 1) Alicyclic epoxy resin: manufactured by Daicel Chemical Industries, Ltd., trade name "CEL-2021P", 3,4-
Epoxy cyclohexylmethyl-3,4-epoxycyclohexanecarboxylate

(Note 2) Resin fine particles: stirrer, thermometer,
A 1 liter flask equipped with a condenser and heating mantle was charged with 3547.5 parts of deionized water and "Latemur S-120.
A "(manufactured by Kao Corporation, sulfosuccinic acid-based allyl group-containing anionic reactive emulsifier, 50% aqueous solution) was added, and the temperature was raised to 90 ° C with stirring. Then, in this, "VA-
086 "(Wako Pure Chemical Industries, Ltd., water-soluble azoamide polymerization initiator) 12.5 parts was dissolved in deionized water 500 parts, and 20% of an aqueous solution was added. After 15 minutes, 300 parts of styrene, 400 parts of methyl methacrylate, 200 parts of n-butyl acrylate, 1,6-hexanediol diacrylate 1
5% of the monomer mixture consisting of 00 parts was added and stirred for 30 minutes. After that, the dropping of the remaining monomer mixture and the polymerization initiator aqueous solution was started, and the dropping of the monomer mixture was performed for 3 hours, and the polymerization initiator aqueous solution was dropped for 3.5 hours. did. After the completion of dropping the aqueous solution of the polymerization initiator, the temperature was kept at 90 ° C. for another 30 minutes, then cooled to room temperature, taken out with a filter cloth, and the solid content was 2
A 0% aqueous gelled fine particle polymer aqueous dispersion was obtained. The particle size was 72 nm. This was dried on a stainless steel pad to obtain fine resin particles.

(Note 3) "BBI-102": Midori Chemical Co., Ltd., iodonium salt-based photocationic polymerization initiator (Note 4) "Irgacure 184": Ciba Specialty Chemicals, photo radical polymerization initiator, 1-hydroxycyclohexyl Phenylketone (Note 5) “Irgacure 819”: Ciba Specialty Chemicals, photo radical polymerization initiator, bis (2,4,6-trimethylbenzoyl) -phenylphosphine oxide

[0067]

[Table 1]

Performance Test Each putty composition obtained above was placed on a test plate (mild steel plate) for 2 m.
It was applied with a spatula so as to have a thickness of m, and was irradiated with "Prismalite" (Halogen lamp manufactured by Cork Co., Ltd.) at an irradiation distance of 15 cm for 10 minutes. The performance test results of the obtained test coated plate are also shown in Table 1.

(* 1) Surface curability: The tackiness of the surface of the coated plate immediately after irradiation with the lamp was examined by touch with the fingers and evaluated according to the following criteria (◯: the surface has no tackiness and is good, Δ: a little sticking to the surface X: There is considerable adhesiveness on the surface).

(* 2) Thick film curability: Each putty composition was coated on a test plate (steel plate) with a spatula so as to have a thickness of 10 mm or more, and was irradiated with a "primal light" at an irradiation distance of 15 cm to 10 mm.
The uncured portion of the coating film surface obtained by irradiation for minutes was washed off with an acetone solvent, and the film thickness of the cured portion was measured (◯: 5 mm or more, Δ: 3 mm or more and less than 5 mm, x: less than 3 mm).

(* 3) Polishing property: The surface of the test coated plate was # 40.
Polishing was performed with a 0 water resistant paper and the polishing state was observed (◯: good, Δ: slightly entangled, ×: considerably entangled).

(* 4) Adhesion of steel plate: The test coated plate was bent at a 90 ° angle from the center and the state of the putty at the bent part was observed (◯: good, Δ: part of the putty was peeled off,
X: Putty is peeled off).

[0073]

According to the photocurable putty composition of the present invention,
It is possible to form a cured film that is fast-curing and that has excellent polishing properties, adhesiveness, etc., without being affected by the curing of the coating film surface. It is especially useful for repair painting such as automobile repair.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) C09D 129/10 C09D 129/10 171/00 171/00 C09K 3/10 C09K 3/10 LF term (reference) ) 4H017 AA04 AB08 AC08 AC18 AD05 AE05 4J036 AJ08 AJ09 AJ11 AK09 AK10 EA01 EA02 EA03 EA04 EA09 EA10 FA01 FA10 GA01 GA02 GA03 GA06 HA02 4J038 CA021 CE021 DB2 DB11 DB1 DB1 DB2 DB1 DB2 DB1 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB21 DB1 DB2 DB1 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB2 DB1 DB21 DB1 DB2 DB1 DB21

Claims (5)

[Claims] 1. An epoxy group-containing compound (A), a polymerizable unsaturated group-containing compound (B), a cationic polymerization initiator (C),
(D) contains a radical photopolymerization initiator and (E) a pigment as essential components, and the mixing ratio of the (A) component and the (B) component is 95 / based on the solid content weight ratio of (A) / (B). 5 to 5/95, and the content of the component (E) is 30 to 300 parts by weight relative to 100 parts by weight of the resin solid content in the composition, a photocurable putty composition. 2. The photocurable putty composition according to claim 1, which contains an oxetane ring-containing compound and / or a vinyl ether compound. 3. At least one selected from an epoxy group-containing compound (A), an oxetane ring-containing compound, a vinyl ether compound and a polymerizable unsaturated group-containing compound (B) contains a hydroxyl group or contains a hydroxyl group-containing compound. 3. The photocurable putty composition according to claim 1 or 2. 4. The photocurable putty composition according to claim 1, which contains fine resin particles. 5. The substrate surface according to claim 1, wherein
A repair coating method, which comprises applying the photocurable putty composition according to the item 1, irradiating with light, and then applying a topcoat paint.