JP2003321508A - Resin paste composition and semiconductor device using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To obtain a die bonding resin paste composition which reduces the occurrence of reflow cracks in the solder reflow of a semiconductor device and improves reliability. <P>SOLUTION: The resin paste composition is obtained by uniformly dispersing (A) an acrylic acid ester or methacrylic acid ester, (B) a 1,3-diketone derivative or a urea derivative of a silicon compound, (C) liquid rubber component, (D) a radical initiator and (E) a filler. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin paste composition suitable for adhering a semiconductor element such as an IC or LSI to a supporting member such as a lead frame or an organic substrate, and a semiconductor device using the same.

[0002]

2. Description of the Related Art The mounting method of semiconductor devices is shifting from the conventional pin insertion method to the surface mounting method from the viewpoint of high density mounting. Since soldering is used and the package is heated to a high temperature of 200 ° C. or higher, package cracks occur due to rapid vaporization / expansion of moisture contained inside the package, particularly in the adhesive layer or encapsulant. There is a problem that the reliability of the device is lowered. This problem is due to copper lead frame and glass epoxy substrate (substrate made of glass fiber reinforced epoxy resin), BT substrate (substrate using BT resin made of cyanate monomer and its oligomer and bismaleimide), polyimide tape or film rather than 42 alloy lead frame. It is particularly serious in organic substrates such as. The reason is that the adhesive strength of the adhesive is low with respect to the copper lead frame and the organic substrate, and in particular, the copper lead frame has a plated frame of gold, silver, nickel, palladium or the like,
There are many organic wiring boards with metal wiring, such as copper, which have been similarly plated, and the adhesive strength of the adhesive is low with respect to such plating.

[0003]

DISCLOSURE OF THE INVENTION The present invention provides a peel strength of a resin paste composition for a support member, particularly a peel strength of a copper lead frame plated with gold, silver, nickel, palladium or the like and similar organic substrates with various plated wirings. It is an object of the present invention to provide a semiconductor device in which reflow cracks are eliminated even when a copper lead frame and an organic substrate are used by improving the above-mentioned drawbacks and eliminating the above-mentioned drawbacks of the prior art.

[0004]

The present invention provides (A) acrylic acid ester or methacrylic acid ester, (B) 1,
A silicon compound which is a 3-diketone derivative or a urea derivative, (C) a liquid rubber component, (D) a radical initiator,
And (E) a resin paste composition in which a filler is uniformly dispersed, and a semiconductor device obtained by adhering a semiconductor element to a supporting member using the resin paste composition and then sealing the same.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The resin paste composition of the present invention comprises
As described above, the component (A) contains an acrylic ester or a methacrylic ester. As the component (A), an acrylic ester and a methacrylic ester represented by the general formula 1, a phthalimide derivative or a maleimide derivative represented by the general formula 2, or an imide acrylate represented by the general formula 3 ( N-acryloyloxyethyl hexahydrophthalimide, N-acryloyloxyethyl-1,2,3,6-tetrahydrophthalimide, N-acryloyloxyethyl-3,4.
One or more selected from 5,6-tetrahydrophthalimide and N-acryloyloxyethylmaleimide) are preferable.

The blending amount of the component (A) is not particularly limited, but is 0. 0 with respect to 100 parts by weight of the total amount of the resin paste composition.
The amount is preferably 01 to 50 parts by weight, more preferably 0.1 to 40 parts by weight, and particularly preferably 1 to 30 parts by weight. When the amount of the component (A) is less than 0.01 part by weight, the viscosity of the resin paste composition is remarkably increased, resulting in poor workability during its preparation and coating workability during use. When it exceeds 50 parts by weight, the viscosity of the resin paste composition is remarkably lowered, and its adhesive force is remarkably lowered.

The resin paste composition of the present invention contains a silicon compound which is a 1,3-diketone derivative or a urea derivative as the component (B) as described above. As the component (B), a silicon compound which is a 1,3-diketone derivative represented by the general formula 4, a silicon compound which is a urea derivative represented by the general formula 5, and a compound represented by the general formula 6 Silicon compounds, N, N-bis (trimethylsilyl)
One or more selected from urea, N-trimethylsilylphenylurea, 3-ureidopropyltrimethoxysilane and 3-ureidopropyltriethoxysilane are preferable.

The blending amount of the component (B) is not particularly limited, but it is 0. 0 with respect to 100 parts by weight of the total amount of the resin paste composition.
It is preferably from 01 to 30 parts by weight, and from 0.05 to 20
More preferably, the amount is 0.1 to 10 parts by weight. The blending amount of the component (A) is 0.01
If it is less than part by weight, the adhesive strength of the resin paste composition is significantly reduced. When it exceeds 30 parts by weight, the viscosity of the resin paste composition is remarkably lowered and the adhesive strength thereof is remarkably lowered.

The liquid rubber component (C) used in the present invention is not particularly limited, but polybutadiene, polybutadiene derivative, butadiene-acrylonitrile copolymer,
Alternatively, at least one selected from derivatives of butadiene / acrylonitrile copolymer is preferable, and polybutadiene derivative having epoxy group, vinyl group, acryl group, methacryl group, carboxyl group or derivative of butadiene / acrylonitrile copolymer is preferable. One or more selected from the group is more preferable, and one or more selected from epoxidized polybutadiene, methacrylated polybutadiene, or carboxyl group-terminated butadiene / acrylonitrile copolymer having a viscosity of 1000 Pa · s or less is particularly preferable (viscosity: EHD type rotational viscometer, measured at 3 ° cone, 25 ° C).

The blending amount of the component (C) is preferably 0.01 to 50 parts by weight, more preferably 0.1 to 40 parts by weight, based on 100 parts by weight of the total resin paste composition. It is particularly preferable to use 1 to 30 parts by weight. If the blending amount is less than 0.01 part by weight, the adhesive force of the resin paste composition will be significantly reduced. If it exceeds 50 parts by weight, the viscosity of the resin paste composition becomes extremely high, and the workability during its preparation and the coating workability during use deteriorate.

The radical initiator of the component (D) used in the present invention is not particularly limited, but peroxides are preferable from the viewpoint of voids and the like, and the curability and viscosity stability of the resin paste composition are also preferable. Therefore, the decomposition temperature of the peroxide is preferably 50 to 200 ° C.

The blending amount of the component (D) is not particularly limited, but it is 0. 0 with respect to 100 parts by weight of the total amount of the resin paste composition.
It is preferably from 01 to 20 parts by weight, and from 0.05 to 10
More preferably, it is 0.1 to 5 parts by weight. If the amount of component (D) is less than 0.01 parts by weight, the adhesive strength of the resin paste composition will be significantly reduced. When it exceeds 20 parts by weight, the viscosity stability of the resin paste composition is remarkably lowered, and the adhesive strength thereof is remarkably lowered.

As the peroxide of the above radical initiator,
For example, methyl ethyl ketone peroxide, methyl isobutyl ketone peroxide, cyclohexanone peroxide, methyl cyclohexanone peroxide, acetylacetone peroxide, isobutyl peroxide, o-methylbenzoyl peroxide, bis-3,5,5-
Trimethylhexanoyl peroxide, lauroyl peroxide, benzoyl peroxide, 2,4,4-
Trimethylpentyl-2-hydroperoxide, diisopropylbenzene peroxide, cumene hydroperoxide, tert-butyl hydroperoxide, dicumyl peroxide, 2,5-dimethyl-2,5-di (t
tert-butylperoxy) hexane, 1,3-bis (tert-butylperoxyisopropyl) benzene, tert-butylcumyl peroxide, di-ter.
t-butyl peroxide, 2,5-dimethyl-2,
5-di (tert-butylperoxy) hexyne-3,
1,1-di-tert-butylperoxy-3,
3,5-trimethylcyclohexane, 1,1-di-
tert-butyl peroxycyclohexane, 2, 2
-Di (tert-butylperoxy) butane, 4,4
-Di-tert-butylperoxyvaleric acid-n-
Butyl ester, 2,4,4-trimethylpentyl peroxyphenoxyacetone, α-cumyl peroxy neodecanoate, tert-butyl peroxy neodecanoate, tert-butyl peroxy-2-ethylhexanoate, tert -Butylperoxyisobutyrate, di-tert-butylperoxyhexahydroterephthalate, tert-butylperoxyacetate, tert-butylperoxybenzoate and the like, but not limited thereto.

The component (E) filler used in the present invention is not particularly limited and includes, for example, gold, silver, copper, manganese, nickel, iron, aluminum, stainless steel alone or an alloy, silicon oxide, aluminum oxide, Powder of boron nitride, aluminum nitride, aluminum borate, etc.,
Further, polymer particles such as poly (vinylidene fluoride), composite particles of a conductive component and polymer particles, and the like can be mentioned, but the invention is not limited thereto.

The blending amount of the component (E) is not particularly limited, but is 1 to 100 parts by weight of the total amount of the resin paste composition.
The amount is preferably 95 parts by weight, more preferably 5 to 90 parts by weight, and particularly preferably 10 to 85 parts by weight. When the compounding amount of the component (E) is less than 1 part by weight,
The viscosity of the resin paste composition becomes remarkably low, and the coating workability during its use deteriorates. In addition, the adhesive strength is significantly reduced. If it exceeds 95 parts by weight, the viscosity of the resin paste composition becomes extremely high, and the workability during its preparation and the coating workability during use deteriorate.

In the resin paste composition of the present invention, if necessary, a moisture absorbent such as calcium oxide or magnesium oxide, a silane coupling agent, a titanate coupling agent, an aluminum coupling agent, a zircoaluminate coupling agent, etc. Adhesion improver, nonionic surfactant, wetting improver such as fluorine-containing surfactant, antifoaming agent such as silicone oil, ion trap agent such as inorganic ion exchanger,
A polymerization inhibitor or the like can be added as appropriate.

Examples of the silane coupling agent include vinyltris (β-methoxyethoxy) silane, vinyltriethoxysilane, vinyltrimethoxysilane and γ.
-Methacryloxypropyltrimethoxysilane, β-
(3,4-Epoxycyclohexyl) ethyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, γ-mercaptopropyl Trimethoxysilane, hexamethyldisilazane, N, O- (bistrimethylsilyl) acetamide, N-methyl-3-aminopropyltrimethoxysilane, 4,5-dihydroimidazolepropyltriethoxysilane, γ-mercaptopropyltriethoxysilane, γ-mercaptopropylmethyldimethoxysilane, 3-cyanopropyltrimethoxysilane, methyltri (methacryloyloxyethoxy) silane, methyltri (glycidyloxy) silane, 2-ethylhexyl-2-ethylhexyl Sylphosphonate, γ-glycidoxypropylmethyldimethoxysilane, vinyltriacetoxysilane, γ-anilinopropyltrimethoxysilane, γ-mercaptopropylmethyldimethoxysilane, γ-methacryloxypropylmethyldimethoxysilane, N-trimethylsilylacetamide, dimethyl Examples include trimethylsilylamine, diethyltrimethylsilylamine, trimethylsilylimidazole, trimethylsilylisocyanate, dimethylsilyldiisocyanate, methylsilyltriisocyanate, vinylsilyltriisocyanate, phenylsilyltriisocyanate, tetraisocyanatesilane, and ethoxysilanetriisocyanate, but are not limited thereto. It is not something that will be done.

As the titanate coupling agent,
For example, isopropyl triisostearoyl titanate,
Isopropyl trioctanoyl titanate, isopropyl dimethacryl isostearoyl titanate, isopropyl tridodecylbenzenesulfonyl titanate, isopropyl isostearoyl diacrylic titanate, isopropyl tri (dioctyl phosphate) titanate,
Isopropyl tricumyl phenyl titanate, isopropyl tris (dioctyl pyrophosphate) titanate, tetraisopropyl bis (dioctyl phosphite) titanate, tetraoctyl bis (ditridecyl phosphite) titanate, tetra (2,2-diallyloxymethyl-1-butyl) Bis (ditridecyl) phosphite titanate, dicumylphenyloxyacetate titanate, bis (dioctyl pyrophosphate) oxyacetate titanate, diisostearoyl ethylene titanate, bis (dioctyl pyrophosphate)
Ethylene titanate, diisopropoxy bis (2, 4
-Pentadionate) titanium (.), Diisopropylbistriethanolaminotitanate, titanium lactate, acetoacetic ester titanate, di-i-propoxybis (acetylacetonato) titanium,
Di-n-butoxybis (triethanolaminato) titanium, dihydroxybis (lactato) titanium, titanium-i-propoxyoctylene glycolate, titanium stearate, tri-n-butoxytitanium monostearate, titanium lactate ethyl ester, titanium Examples include, but are not limited to, triethanolaminate.

Examples of the polymerization inhibitor include quinones, hydroquinones, nitro-nitroso compounds, amines, polyoxy compounds, p-tert-butylcatechol, picric acid, sulfur-containing compounds such as dithiobenzoyl disulfide, cupric chloride. , Diphenylpicrylhydrazyl, tri-p-nitrophenylmethyl, triphenylferdazyl, N- (3-N-oxyanilino-1,
3-dimethylbutylidene) aniline oxide and the like, but not limited thereto.

If necessary, a bleeding inhibitor can be added to the resin paste composition of the present invention.
Examples of bleeding inhibitors include perfluorooctanoic acid,
Examples thereof include fatty acids such as octanoic acid amide and oleic acid, perfluorooctylethyl acrylate, and silicone, but are not limited to these.

To produce the resin paste composition of the present invention, (A) an acrylic ester or a methacrylic ester, (B) a silicon compound which is a 1,3-diketone derivative or a urea derivative, and (C) a liquid rubber component. , (D)
Radical initiator and (E) filler together with various additives that are used as needed are collectively or separately combined with a dispersing / dissolving device such as a stirrer, a raikai machine, a three-roller, and a planetary mixer. It may be placed in the above apparatus and heated as necessary to mix, dissolve, disintegrate, knead, or disperse to form a uniform paste.

In the present invention, a semiconductor device can be obtained by further adhering the semiconductor element and the supporting member using the resin paste composition produced as described above and then sealing. Using the resin paste composition of the present invention, a semiconductor element is provided with a copper lead frame, a glass epoxy substrate (substrate made of glass fiber reinforced epoxy resin), B
In order to adhere to a T substrate (substrate using BT resin composed of cyanate monomer and its oligomer and bismaleimide), an organic substrate such as polyimide tape or film, and other supporting members, first, a resin paste composition is dispensed onto the supporting member. After applying by a screen printing method, a stamping method, or the like, the semiconductor element is pressure-bonded, and then heat-cured by using a heating device such as an oven or a heat block. Further, the semiconductor device can be completed by going through a wire bonding step, a sealing step, etc., if necessary.

[0023]

EXAMPLES Next, the present invention will be described in detail with reference to examples, but the present invention is not limited thereto. The materials used in the following examples and comparative examples are those produced by the following method or obtained. (1) Preparation of Epoxy Resin 11 parts by weight of YDF-170 (trade name, manufactured by Tohto Kasei Co., Ltd., bisphenol F type epoxy resin, epoxy equivalent = 170) and TL-980 (trade name, manufactured by Yuka Shell Epoxy Co., bisphenol A) Type epoxy resin, epoxy equivalent =
185) 11 parts by weight of the mixture was heated to 80 ° C. and stirred for 1 hour to obtain a uniform epoxy resin. (2) Preparation of curing agent 2.0 parts by weight of H-1 (manufactured by Meiwa Kasei Co., Ltd., trade name, phenol novolac resin, OH equivalent = 106) and PP-101 (manufactured by Toto Kasei Co., trade name, alkyl) as a diluent Phenyl glycidyl ether, epoxy equivalent = 230) 4.
0 parts by weight was heated to 100 ° C. and stirring was continued for 1 hour to obtain a uniform phenol resin solution. (3) Curing accelerator 2P4MHZ (manufactured by Shikoku Chemicals, trade name, 2-phenyl-
4-methyl-5-hydroxymethylimidazole). (4) Filler TCG-1 (manufactured by Tokuriki Kagaku Kenkyusho, trade name, silver powder).

(5) Acrylic ester R-712 (manufactured by Nippon Kayaku Co., Ltd., trade name, α-phenyl-ω)
-Acryloyloxypolyoxyethylene formaldehyde polycondensate) and SR-339A (manufactured by Nippon Kayaku Co., Ltd., trade name, 2-phenoxyethyl acrylate). (6) Silicon compound A-1160 which is a urea derivative (manufactured by Nippon Unicar Co., Ltd., trade name, γ-ureidopropyltriethoxysilane 50% methanol solution)
Is. (7) Liquid rubber component E-1000-8 (manufactured by Nippon Petrochemical Co., Ltd., trade name, epoxidized polybutadiene, epoxy equivalent = 200). (8) Radical initiator Perbutyl Z (trade name, tert-butyl peroxybenzoate, manufactured by NOF CORPORATION).

The materials were mixed in the mixing ratios shown in Table 1, kneaded using a liquor machine, and then defoamed at 5 Torr or less for 30 minutes to obtain a resin paste composition. The characteristics (viscosity, peel strength, chip warpage and solder reflow resistance) of this resin paste composition were examined by the methods described below.
The results are shown in Table 1. (1) Viscosity: EHD type rotational viscometer (made by Tokyo Keiki Co., Ltd.)
The viscosity (Pa · s) at 25 ° C. was measured using a 3 ° cone. (2) Peel strength: About 3.2 mg of the resin paste composition obtained in each of Examples and Comparative Examples was applied on a glass epoxy substrate, and an 8 mm × 8 mm Si chip (thickness 0.4 mm) was pressure-bonded on the glass epoxy substrate. Then, the temperature was raised to 150 ° C. in 30 minutes in an oven and cured at 150 ° C. for 1 hour. 240 using an automatic adhesive force measuring device (manufactured by Hitachi Chemical Co., Ltd.)
The peel strength at N ° C (N / 64 ·) was measured.

(3) Solder reflow resistance: Using the resin paste compositions obtained in Examples and Comparative Examples, the following lead frame and glass epoxy substrate and Si chip were cured and adhered under the following curing conditions. After that, it was sealed with an epoxy encapsulant (trade name CEL-9200) manufactured by Hitachi Chemical Co., Ltd. to obtain a package for solder reflow resistance test. The package was allowed to absorb moisture for 168 hours in a constant temperature and humidity chamber in which the temperature and humidity were set to 85 ° C. and 60%, respectively. After that, solder reflow was performed under a reflow condition of 240 ° C./10 seconds, and the number of external cracks in the package was observed with a microscope (magnification: 15 times), and the number of internal cracks in the package was observed with an ultrasonic microscope. The number of cracked samples is shown for five samples. Support member: Copper-plated lead frame with gold plating Chip size: 8 mm x 10 mm (thickness 0.4 mm) Package: QFP, 14 mm x 20 mm x 2 mm Curing conditions: Temperature rising up to 150 ° C in 30 minutes, curing at 150 ° C for 1 hour Supporting member : Glass epoxy substrate Chip size: 10 mm x 10 mm (thickness 0.4 mm) Package: OMPAC type BGA, 24 mm x 24 mm
× 1.5 mm Curing conditions: Temperature rise to 150 ° C in 30 minutes, curing at 150 ° C for 1 hour

[0027]

[Table 1]

From the results shown in Table 1, the resin paste composition of the present invention (Example) shows good values in peel strength and chip warpage as compared with the resin paste composition using an epoxy resin (Comparative Example), The solder reflow resistance was also excellent. From this, it was confirmed that the resin paste composition of the present invention can provide a highly reliable package even when a copper lead frame and an organic substrate are used.

[0029]

INDUSTRIAL APPLICABILITY The resin paste composition of the present invention, when used as a die bonding material for a semiconductor device, has a paste layer when chip cracks, chip warpage, and solder reflow even when a copper lead frame and an organic substrate are used. Peeling can be suppressed, and the occurrence of reflow cracks can be reduced. As a result, the reliability of the semiconductor device can be improved.

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) C09J 4/02 C09J 4/02 5F047 109/00 109/00 H01L 21/52 H01L 21/52 EF term (reference) 4J011 PA03 PA05 PA07 PA08 PA13 PA14 PA47 PA76 PB22 PB40 PC02 4J026 AA68 AA76 AC10 AC11 AC12 AC32 BA27 BA28 BA29 BA30 DB13 GA07 4J027 AC02 AC06 AF05 BA07 BA19 BA20 BA21 CA08 CA12 CA14 CA15 CA21 CA31 CA33 CB04 CC02 CA07 GA01 FA02 CA06 4J040 FA02 CA06 4J040 FA02 HA066 HA076 HA166 HB20 HC19 HD36 KA12 KA42 MA02 NA20 4J100 AL08P BA15P BA16P BA29P BA30P BA31P BA64P BC04P BC53P BC54P BC66P BC69P CA01 JA46 5F047 AA11 AA17 BA36

Claims (9)

[Claims] 1. (A) acrylic acid ester or methacrylic acid ester, (B) a silicon compound which is a 1,3-diketone derivative or a urea derivative, (C) a liquid rubber component, (D) a radical initiator, and ( E) A resin paste composition obtained by uniformly dispersing a filler. 2. The resin paste composition according to claim 1, wherein the component (A) is at least one selected from acrylic acid esters and methacrylic acid esters represented by the general formula 1. [Chemical 1] [In the formula, R1 represents hydrogen or a methyl group, R2 represents an aliphatic hydrocarbon group having 1 to 100 carbon atoms and an alicyclic hydrocarbon group alone or in any combination, and R3 represents hydrogen, a methyl group or phenoxy group. Represents a methyl group, R4 represents hydrogen, an alkyl group having 1 to 6 carbon atoms, a phenyl group or a benzoyl group, and R5 represents a phenyl group, a nitrile group, or -Si.
(OR6) 3 (R6 represents an alkyl group having 1 to 6 carbon atoms), a group represented by the following formula (R7, R8 and R9 each independently represent hydrogen or an alkyl group having 1 to 6 carbon atoms, and R10 represents hydrogen or R11, R12, R13, R14, R1
5, R16, R17, and R18 each independently represent hydrogen or a methyl group, n represents an integer of 1 to 50, m represents 0,
It shows the number of 1, 2, or 3, and p, q, and x show the integer of 1-20 each independently. ] [Chemical 2] 3. The resin paste composition according to claim 1, wherein the component (A) is one or more selected from the phthalimide derivative or the maleimide derivative represented by the general formula 3. [Chemical 3] (In the formula, the imide group containing R1 represents a phthalimide derivative group or a maleimide derivative group, R2 represents H or a methyl group, and n represents an integer of 1 to 20.) 4. The component (A) is an imide acrylate represented by the general formula 4 (N-acryloyloxyethyl hexahydrophthalimide, N-acryloyloxyethyl-).
1,2,3,6-tetrahydrophthalimide, N-
At least one selected from acryloyloxyethyl-3,4,5,6-tetrahydrophthalimide, N-acryloyloxyethylmaleimide).
The resin paste composition described. [Chemical 4] 5. The component (A) is an acrylic acid ester and a methacrylic acid ester represented by the general formula 1,
Or a imide imide represented by the general formula 4 (N-acryloyloxyethyl hexahydrophthalimide, N-acryloyloxyethyl-1, 2,
The resin paste composition according to claim 1, which is one or more selected from 3,6-tetrahydrophthalimide, N-acryloyloxyethyl-3,4,5,6-tetrahydrophthalimide, N-acryloyloxyethylmaleimide). 6. The component (B) is represented by the general formula 5,
A silicon compound which is a 3-diketone derivative, or
The resin paste composition according to claim 1, which is one or more selected from silicon compounds which are urea derivatives represented by the general formula 6. Embedded image (R ¹ O) ₃ Si— (CH ₂ ) n-OCOCH
₂ COR ² (In the formula, R 1 represents a methyl group or an ethyl group, R 2 represents hydrogen, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents an integer of 1 to 20.) 6] (In the formula, R1 represents a methyl group or an ethyl group, R2 represents hydrogen, an alkyl group having 1 to 6 carbon atoms, or a phenyl group, and n represents 0 or an integer of 1 to 20.) 7. The component (B) is a silicon compound represented by the general formula 7, N, N-bis (trimethylsilyl) urea, N-trimethylsilylphenylurea, 3-ureidopropyltrimethoxysilane, 3-ureidopropyl. The resin paste composition according to claim 1, which is one or more selected from triethoxysilane. Embedded image (CH ₃ O) ₃ Si— (CH ₂ ) ₃ —OCOC
H ₂ COCH ₃ 8. The resin paste composition according to claim 1, wherein the component (C) is at least one selected from polybutadiene, polybutadiene derivatives, butadiene / acrylonitrile copolymers, and butadiene / acrylonitrile copolymer derivatives. 9. A semiconductor device obtained by adhering a semiconductor element to a supporting member using the resin paste composition according to any one of claims 1, 2, 3, 4, 5, 6, 7, and 8 and then sealing the same. .