JP2003312719A - Cover film for electronic component carrier tape - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cover film for an electronic component carrier tape in which the adhesive property between layers composing the cover film is excellent without such an adhesive as an anchor coat agent or the like. <P>SOLUTION: The cover film for the electronic part carrier tape 10 comprises a basic material layer (I) 11 composed of a basic material and a composition layer (II) 12 which is in contact with the basic material layer (I) 11 and is composed of a polyolefinic resin and an olefinic resin composition containing 0.01 to 10 mass part of an epoxy compound having two or more epoxy groups within the molecular and having a molecular weight of 3000 or less to 100 mass part of the resin component including the polyolefinic resin. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cover film for an electronic component carrier tape, which is used as a cover material for a carrier tape containing electronic components and the like,
More specifically, the present invention relates to a cover film for an electronic component carrier tape, which has excellent adhesiveness between layers constituting the cover film without using an adhesive such as an anchor coating agent.

[0002]

2. Description of the Related Art With the miniaturization of electronic equipment, electronic components used are also becoming smaller and higher in performance. In the assembly process of such electronic devices, electronic components are automatically mounted on a printed circuit board. Electronic components used for such automatic mounting are packaged in taping so that they are automatically and sequentially supplied.

As such a taping package, for example, an electronic component carrier tape as shown in FIG. 6 is used. This electronic component carrier tape 20 is
A carrier tape main body 22 having recesses 21 for accommodating electronic components 30 at regular intervals, and a cover film 23 having both ends heat-sealed in the longitudinal direction on the upper surface of the carrier tape main body 22. is there.

As the cover film 23, a base material layer 24 made of a biaxially stretched film such as polyethylene terephthalate (PET) is adhered to the base material layer 24 via an anchor coat layer 25 made of an anchor coating agent. ,
An intermediate layer 26 made of an olefin resin or a composition thereof (hereinafter also referred to as a polyolefin resin), and the intermediate layer 2
6 in contact with the heat-sealing layer 27 made of styrene resin
The one consisting of and is commonly used.

The electronic component 30 housed in the electronic component carrier tape 20 composed of the cover film 23 and the carrier tape main body 22 as described above is the cover film 23.
After being peeled off by the automatic peeling device, it is taken out from the recess 21 of the carrier tape body 22 by an automatic take-out machine and mounted on a printed circuit board or the like.

[0006]

This cover film 2
In 3, the biaxially stretched film such as polyethylene terephthalate (PET) used for the base material layer 24 and the olefin resin used for the intermediate layer 26 are poor in adhesiveness, and therefore these are intercalated with an anchor coating agent. Must be stacked. However, since this anchor coating agent contains a solvent, there is a problem that the working environment is deteriorated by the volatilized solvent when the cover film 23 is manufactured. Moreover, since the solvent is used, it is necessary to pay close attention to fire prevention. Further, it is necessary to prepare ventilation equipment, and there is a problem that the manufacturing cost becomes high due to the burden on such equipment.

Therefore, an object of the present invention is to provide a cover film for an electronic component carrier tape, which is excellent in the adhesiveness between the respective layers constituting the cover film without using an adhesive such as an anchor coating agent.

[0008]

That is, a cover film for an electronic component carrier tape according to the present invention comprises a base material layer (I) made of a base material, a base material layer (I) being in contact with the base material layer (I), and a polyolefin resin. Resin component 1 containing the polyolefin resin
Epoxy compound 0.0 having 2 or more epoxy groups in the molecule and having a molecular weight of 3000 or less with respect to 00 parts by mass
1 to 10 parts by mass of a composition layer (II) composed of an olefin-based resin composition.

Further, the olefin resin composition of the composition layer (II) preferably further contains, as a resin component, an olefin resin having a functional group which reacts with an epoxy group in the molecule. Further, it is desirable that the cover film for an electronic component carrier tape of the present invention further has a sealant layer (III) in contact with the composition layer (II).

The polyolefin resin comprises 100 to 10% by mass of ethylene (co) polymer (A) and 0 to 90% by mass of another polyolefin resin (B).
The ethylene (co) polymer (A) is produced in the presence of a single site catalyst, and the ethylene (co) polymer (A) has a (a) density of 0.86 to 0.97.
g / cm ³ , (b) melt flow rate of 0.01 to 2
It is preferably 00 g / 10 minutes.

Further, the ethylene (co) polymer (A)
Preferably satisfies the following requirements (a) to (d). (A) Density of 0.86 to 0.97 g / cm ³ , (b) Melt flow rate of 0.01 to 200 g / 10
Min, (c) molecular weight distribution (Mw / Mn) of 1.5 to 4.5, (d) total 25 determined from the integrated elution curve of elution temperature-elution amount curve by continuous temperature rising elution fractionation method (TREF) The difference T ₇₅ -T ₂₅ between the temperature T _{25 at} which 100% elutes and the temperature T _{75 at} which 75% of the whole elutes, and the density d satisfy the following equation (equation 1) (equation 1) T ₇₅ -T ₂₅ ≤ -670 x d + 644

Further, the ethylene (co) polymer (A)
Preferably further satisfies the following requirement (e). (E) The difference between the temperature T _{25 at} which 25% of the whole is eluted and the temperature T _{75 at} which 75% of the whole is obtained, which is obtained from the integral elution curve of the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF) T ₇₅ -T ₂₅ and density d satisfy the following to satisfy the relation of (formula 2) (formula 2) d <when ^{_{0.950g / cm 3 T 75 -T 25}} ≧ -300 × d + 285 d ≧ 0.950g / Cm ³ T ₇₅ −T ₂₅ ≧ 0

The ethylene (co) polymer (A) is an ethylene (co) polymer which further satisfies the following requirements (f) and (g):
The polymer (A1) or the ethylene (co) polymer (A2) satisfying the following requirements (h) and (i) is preferable. (F) The ortho-dichlorobenzene (ODCB) -soluble content X (mass%), density d and melt flow rate (MFR) at 25 ° C. satisfy the following relationships (formula 3) and (formula 4) (formula 3). When d-0.008logMFR ≧ 0.93, X <2.0 (Equation 4) When d-0.008logMFR <0.93, X <9.8 × 10 ³ × (0.9300-d + 0.008)
logMFR) ² +2.0 (g) Elution temperature by continuous temperature-rising elution fractionation method (TREF) There are multiple peaks on the curve (h) Elution temperature by continuous temperature-rising elution fractionation method (TREF) -elution The quantity curve has only one peak (i) has one or two melting point peaks, and the highest melting point T _ml and the density d satisfy the following expression (expression 5) (expression 5). T _ml ≧ 150 × d-19

Further, the ethylene (co) polymer (A2)
Preferably further satisfies the following requirement (j). (J) Melt tension (MT) and melt flow rate (MFR) satisfy the following (formula 6) (formula 6) logMT ≦ −0.572 × logMFR +
0.3 Further, the halogen content in the olefin resin composition is preferably 10 ppm or less.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below.
FIG. 1 is a sectional view showing an example of a cover film for an electronic component carrier tape of the present invention. This electronic component carrier tape cover film 10 contains a base material layer (I) 11 made of a base material, and a resin component containing a polyolefin resin and an epoxy compound (C) which are in contact with the base material layer (I) 11. And a composition layer (II) 12 made of an olefin resin composition. Here, the resin component containing a polyolefin-based resin refers to a polyolefin-based resin described below alone or a composition containing the polyolefin-based resin and an olefin-based resin (D) described below.

The base material used for the base material layer (I) in the present invention includes a film or sheet, a plate-like body and the like. Examples of such a substrate include polypropylene-based resins, polyamide-based resins, polyester-based resins, saponified ethylene-vinyl acetate copolymers, polyvinylidene chloride, plastic films or sheets such as polycarbonate (these stretched products and printed materials). , Secondary processed films such as metal evaporated materials, and sheets), aluminum, iron, copper, metal foils or plates such as alloys containing these as the main components, cellophane, paper, woven cloth, non-woven cloth, etc. Is used.

Among them, as the base material for the cover film 10 for the electronic component carrier tape, polyester resin such as polyethylene terephthalate (PET), polyamide resin such as nylon 6 and polypropylene are excellent in heat resistance and water resistance. A biaxially stretched film of a system resin is preferably used.

The composition layer (II) in the present invention is a layer for adhering the cover film to the body of the electronic component carrier tape by heat sealing, and at the time of heat sealing the composition layer (II) and the carrier tape body. Is a layer for making the heat and pressure applied to the interface of (1) uniform and for making the heat seal strength between the composition layer (II) and the carrier tape body uniform.

As the polyolefin resin of the composition layer (II), high density polyethylene, medium density polyethylene, linear low density polyethylene, ethylene (co) polymer obtained by the high pressure radical method (hereinafter referred to as ethylene polymer) , A propylene-based polymer, or a mixture of two or more thereof. Examples of the propylene polymer include a propylene homopolymer, a random copolymer of propylene and another α-olefin such as ethylene, and a block copolymer.

The ethylene polymer is different from (but does not overlap with) the ethylene (co) polymer (A) described later, and is a conventionally known Ziegler-type catalyst or Phillips catalyst (hereinafter, both are referred to as Ziegler-type catalyst). ) Or high density polyethylene polymerized using a metallocene catalyst,
Examples thereof include medium density polyethylene, linear low density polyethylene and ultra low density polyethylene; and ethylene resins obtained by the high pressure radical method. These generally have a broader molecular weight distribution or composition distribution than the ethylene (co) polymer (A) described below.

High-density polyethylene (HDPE), medium-density polyethylene (MDP) using the above Ziegler type catalyst
E) and linear low density polyethylene (LLDPE) have a density of 0.91 to 0.97 g / cm ³ , preferably 0.9.
1 to 0.96 g / cm ³ , more preferably 0.91 to
It is in the range of 0.94 g / cm ³ and has an MFR of 0.
01-200 g / 10 minutes, preferably 0.05-100
g / 10 minutes, more preferably 0.1-80 g / 10 minutes.

The ultra-low density polyethylene (VLDPE) using the above Ziegler type catalyst has a density of 0.86 to 0.9.
Less than 1 g / cm ³ , preferably 0.88 to 0.905 g
/ Cm ^3, MFR is 0.01 to 200 g / 10 min, preferably 0.1 to 100 g / 10 min, more preferably selected in the range of 0.1~80g / 10 min. The ultra-low density polyethylene (VLDPE) has an intermediate property between linear low-density polyethylene (LLDPE) and ethylene (co) polymer rubber (EPR, EPDM), and has a differential scanning calorimetry (DSC). Is a specific ethylene (co) polymer having a maximum peak temperature (Tm) of 60 ° C. or higher, preferably 100 ° C. or higher, and a boiling n-hexane insoluble content of 10% by mass or more.

Ultra low density polyethylene (VLDPE) is
Polymerization is performed using a solid catalyst component containing at least titanium and / or vanadium and an organoaluminum compound or a metallocene catalyst. Such ultra-low density polyethylene (VLDPE) is a resin having both a high crystalline portion represented by linear low density polyethylene (LLDPE) and an amorphous portion represented by an ethylene (co) polymer rubber,
The former features such as mechanical strength and heat resistance, and the latter features such as rubber-like elasticity and low-temperature impact resistance coexist in a well-balanced manner.

The α-olefin in the above ethylene polymer has 3 to 12 carbon atoms, preferably 3 to 10 carbon atoms.
Specifically, propylene, 1-butene,
4-methyl-1-pentene, 1-hexene, 1-octene, 1-decene, 1-dodecene and the like can be mentioned. The total content of these α-olefins is usually 3
It is preferably selected in the range of ˜40 mol%.

The preferred polyolefin resin in the composition layer (II) comprises 100 to 10% by mass of the ethylene (co) polymer (A) and 0 to 90% by mass of another polyolefin resin (B). Is mentioned.
Here, the ethylene (co) polymer (A) used in the composition layer (II) is produced in the presence of a single-site catalyst, and the ethylene (co) polymer (A) (A) The density is 0.86 to 0.97 g / cm ³ , and (b) the melt flow rate is 0.01 to 200 g / 10 minutes.

The ethylene (co) polymer (A) is obtained by homopolymerizing ethylene or copolymerizing ethylene with an α-olefin having 3 to 20 carbon atoms, preferably 3 to 12 carbon atoms. . Examples of the α-olefin having 3 to 12 carbon atoms in the ethylene (co) polymer (A) include propylene, 1-pentene, 4-methyl-1-pentene, 1-hexene, 1-octene, 1-decene, 1
-Examples include dodecene. Further, it is desirable that the total content of these α-olefins is selected in the range of usually 30 mol% or less, preferably 3 to 20 mol% or less.

(A) Density of ethylene (co) polymer (A)
Is 0.86 to 0.97 g / cm³Range and preferred
Specifically 0.91 to 0.95 g / cm³ , More preferably
Is 0.91 to 0.94 g / cm³ Is the range. Density is
0.86 g / cm³ Less than, stiffness (waist strength), heat resistance
It becomes inferior in sex. Also, the density is 0.97 g / cm ³ 
If it exceeds, the tear strength and impact resistance will be insufficient.

The (b) melt flow rate (hereinafter referred to as MFR) of the ethylene (co) polymer (A) is 0.01 to.
The range is 200 g / 10 minutes, preferably 0.1 to 1
00 g / 10 minutes, more preferably 1.0 to 80 g / minute. If the MFR is less than 0.01 g / 10 minutes,
Molding workability is poor. Also, MFR is 200g
If it exceeds / 10 minutes, the tear strength and impact resistance will be poor.

The ethylene (co) polymer (A) preferably further satisfies the requirements (c) and (d) below. The (c) molecular weight distribution (Mw / Mn) of the ethylene (co) polymer (A) is preferably 1.5.
To 4.5, more preferably 2.0 to 4.0, and still more preferably 2.5 to 3.0. Mw / Mn is 1.
When it is less than 5, the moldability becomes poor. Mw / Mn
If it exceeds 4.5, the tear strength, impact resistance, etc. may be insufficient. Here, the molecular weight distribution (Mw / Mn) of the ethylene (co) polymer is determined by gel permeation chromatography (GPC) to determine the weight average molecular weight (Mw).
w) and the number average molecular weight (Mn), and their ratio (Mw
It can be obtained by calculating / Mn).

The ethylene (co) polymer (A) is, for example,
As shown in FIG. 2, (d) continuous temperature rising elution fractionation method (TRE
The difference T ₇₅ -T ₂₅ and the density d between the temperature T _{25 at} which 25% of the whole is eluted and the temperature T _{75 at} which 75% of the whole is obtained, which is obtained from the integrated elution curve of the elution temperature-elution amount curve by F), are Those satisfying the relationship of the following (formula 1) are preferable. (Equation 1) When T ₇₅ −T ₂₅ ≦ −670 × d + 644 T ₇₅ −T ₂₅ and the density d do not satisfy the relation of the above (Equation 1), the low temperature heat sealability may be deteriorated.

The method of measuring TREF is as follows. First, a sample is added to ODCB to which an antioxidant (for example, butylhydroxytoluene) is added so that the sample concentration becomes 0.05% by mass, and heated and dissolved at 140 ° C. 5 ml of this sample solution is injected into a column filled with glass beads and cooled to 25 ° C. at a cooling rate of 0.1 ° C./min to deposit the sample on the surface of the glass beads. Next, while flowing ODCB at a constant flow rate through this column, the column temperature was raised to 50 ° C.
The sample is sequentially eluted while the temperature is raised at a constant rate of / hr. At this time, the concentration of the sample eluted in the solvent is continuously detected by measuring the absorption of the asymmetric stretching vibration of methylene at a wave number of 2925 cm ⁻¹ with an infrared detector.
From this value, the concentration of the ethylene (co) polymer in the solution is quantitatively analyzed to determine the relationship between the elution temperature and the elution rate. TRE
According to the F analysis, the change in the elution rate with respect to the temperature change can be continuously analyzed with an extremely small amount of sample, and thus relatively fine peaks that cannot be detected by the fractionation method can be detected.

Further, the ethylene (co) polymer (A) was further subjected to (e) the total eluate 2 obtained from the integral elution curve of the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF).
The difference T ₇₅ -T ₂₅ and the density d of the temperature T ₇₅ 5% 75% of the total temperature T ₂₅ eluting elutes preferably satisfy the following relationship (Equation 2). (Equation 2) When d <0.950 g / cm ³ , T ₇₅ −T ₂₅ ≧ −300 × d + 285 When d ≧ 0.950 g / cm ³ T ₇₅ −T ₂₅ ≧ 0 T ₇₅ −T ₂₅ and the density d is By satisfying the relationship of the above (formula 2), the heat sealing strength and heat resistance are further improved.

The ethylene (co) polymer (A) is an ethylene (co) polymer (A1) which further satisfies the requirements (f) and (g) described later, or (h) and (i) described further below. Ethylene (co) polymer (A
It is preferable that it is either of 2).

(F) 2 of ethylene (co) polymer (A1)
ODCB soluble content X (mass%) and density d at 5 ° C
And MFR satisfy the relationship of the following (formula 3) and (formula 4), and when (formula 3) d-0.008logMFR ≧ 0.93, X <2.0 (formula 4) d-0 When 0.008 log MFR <0.93, X <9.8 × 10 ³ × (0.9300−d + 0.008)
logMFR) ² +2.0, preferably d-0.008l
In the case of ogMFR ≧ 0.93, X <1.0 d−0.008 In the case of log MFR <0.93, X <7.4 × 10 ³ × (0.9300−d + 0.008
logMFR) ² +2.0, more preferably, if d-0.008logMFR ≧ 0.93, X <0.5 If d-0.008logMFR <0.93, X <5 .6 × 10 ³ × (0.9300-d + 0.008
The relationship of logMFR) ² +2.0 is satisfied.

Here, the amount X of the ODCB soluble component at 25 ° C. is measured by the following method. Sample 0.5
g in 20 ml ODCB at 135 ° C. for 2 hours,
After the sample is completely dissolved, it is cooled to 25 ° C. After leaving this solution at 25 ° C. overnight, it is filtered with a Teflon (registered trademark) filter to collect a filtrate. The absorption peak intensity of this filtrate, which is a sample solution, near the wave number 2925 cm ⁻¹ of the asymmetric stretching vibration of methylene is measured by an infrared spectroscope, and the sample concentration is calculated from a calibration curve prepared in advance. From this value, the ODCB soluble content at 25 ° C. can be obtained.

The ODCB-soluble component at 25 ° C. is a highly branched component and a low molecular weight component contained in the ethylene (co) polymer, which causes deterioration of heat resistance and stickiness of the surface of the molded product, which is a hygienic problem. It is desirable that the content is small, because it causes the blocking of the inner surface of the molded body. O
The amount of DCB-soluble matter is influenced by the content and molecular weight of α-olefin in the entire copolymer, that is, the density and MFR. Therefore, these indices are density and MFR and OD
When the amount of the CB-soluble component satisfies the above relationship, it means that the uneven distribution of α-olefin contained in the entire copolymer is small.

The ethylene (co) polymer (A1) is
(G) A plurality of peaks are present in the elution temperature-elution amount curve obtained by the continuous temperature rising elution fractionation method (TREF). It is particularly preferable that the peak temperature on the high temperature side of the plurality of peak temperatures exists between 85 ° C and 100 ° C. The presence of this peak raises the melting point, raises the crystallinity, and improves the heat resistance and rigidity of the molded body.

Here, the ethylene (co) polymer (A1)
Is a continuous temperature rising elution fractionation method (TR
It is a special ethylene (co) polymer having a plurality of peaks substantially in the elution temperature-elution amount curve determined by EF). On the other hand, the ethylene (co) polymer in FIG. 4 has substantially one peak in the elution temperature-elution amount curve obtained by the continuous temperature rising elution fractionation method (TREF).
This is a polymer, and an ethylene (co) polymer with a typical conventional metallocene catalyst corresponds to this.

In the present invention, the ethylene (co) polymer (A
In 2), as shown in FIG. 5, (h) the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF) has one peak.

Further, the ethylene (co) polymer (A2) in the present invention has (i) one or more melting point peaks, and the highest melting point T _ml and density d among them are as follows (formula 5). Satisfy the relationship. (Equation 5) T _ml ≧ 150 × d−19 If the melting point T _m1 and the density d do not satisfy the relationship of the above (Equation 5), the heat resistance may deteriorate.

Among the ethylene (co) polymers (A2), ethylene (co) polymers further satisfying the requirement (j) below are preferable. (J) Melt tension (MT) and melt flow rate (MFR) satisfy the relationship of (Equation 6) below (Equation 6) logMT ≦ −0.572 × logMFR +
When 0.3 MT and MFR satisfy the relationship of the above (formula 6), moldability such as film molding becomes good.

Here, the ethylene (co) polymer (A2)
As shown in FIG. 5, although the number of TREF peaks is one, the ethylene (co) polymer with the conventional typical metallocene-based catalyst does not satisfy the above (formula 2), and It is distinguished from an ethylene (co) polymer using a metallocene catalyst.

The ethylene (co) polymer (A) is a linear ethylene (co) polymer obtained by homopolymerizing ethylene or copolymerizing ethylene and α-olefin in the presence of a single site catalyst. It is united. Such a linear ethylene (co) polymer has excellent adhesiveness to a substrate or the like. In addition, since the molecular weight distribution and composition distribution are narrow,
It is a polymer with excellent mechanical properties, heat sealing properties, heat blocking properties, and heat resistance.

The single-site catalyst in the present invention may be one obtained by a known catalyst such as a typical conventional metallocene catalyst or CGC catalyst,
In particular, the ethylene (co) polymer (A) has the following a1
It is desirable to produce with a catalyst obtained by mixing the compounds of a4. a1: a compound represented by the general formula Me ¹ R ¹ _p R ² _q (OR ³ ) _r X ¹ _4-pqr (wherein Me ¹ represents zirconium, titanium, and hafnium, and R ¹ and R ³ are each a carbon number). 1 to
24 hydrocarbon groups, R ² is 2,4-pentanedionato ligand or a derivative thereof, benzoylmethanato ligand,
A benzoylacetonato ligand or a derivative thereof, X ¹ represents a halogen atom, and p, q, and r are each 0 ≦ p
≤4, 0 ≤ q ≤ 4, 0 ≤ r ≤ 4, 0 ≤ p + q + r ≤ 4) a2: a compound represented by the general formula Me ² R ⁴ _m (OR ⁵ ) _n X ² _zmn . (In the formula, Me ² is a group I to III element of the periodic table, R ⁴
And R ⁵ are each a hydrocarbon group having 1 to 24 carbon atoms, X
² is a halogen atom or a hydrogen atom (however, when X ² is a hydrogen atom, Me ² is limited to the group III element of the periodic table), z is the valence of Me ² , and m and n are Each is an integer satisfying the ranges of 0 ≦ m ≦ z and 0 ≦ n ≦ z, and 0 ≦ m + n ≦ z) a3: an organic cyclic compound having a conjugated double bond a4: an Al—O—Al bond Modified organoaluminum oxy compound and / or boron compound containing

Further details will be described below. The catalyst component a1
In the formula of the compound represented by the general formula Me ¹ R ¹ _p R ² _q (OR ³ ) _r X ¹ _4-pqr , Me ¹ represents zirconium, titanium or hafnium, and the kinds of these transition metals are limited. A plurality of zirconium compounds can be used, but zirconium, which has excellent weather resistance of the copolymer, is particularly preferably contained. R ¹ and R ³ are each a hydrocarbon group having 1 to 24 carbon atoms, preferably 1 to 12 carbon atoms, and more preferably 1 to 8 carbon atoms. Specifically, an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group, and a butyl group;
Alkenyl groups such as vinyl and allyl; phenyl,
Aryl groups such as tolyl group, xylyl group, mesityl group, indenyl group and naphthyl group; benzyl group, trityl group,
Examples thereof include an aralkyl group such as a phenethyl group, a styryl group, a benzhydryl group, a phenylbutyl group and a neophyl group. These may have branches. R ² is 2,
A 4-pentanedionate ligand or a derivative thereof, a benzoylmethanato ligand, a benzoylacetonato ligand or a derivative thereof is shown. X ¹ represents a halogen atom such as fluorine, iodine, chlorine and bromine. p and q are 0 ≦ p ≦ 4, 0 ≦ q ≦ 4, 0 ≦ r ≦ 4, and 0 ≦ p + q, respectively.
It is an integer that satisfies the range of + r ≦ 4.

Examples of the compound represented by the general formula of the catalyst component a1 include tetramethylzirconium, tetraethylzirconium, tetrabenzylzirconium, tetrapropoxyzirconium, tripropoxymonochlorozirconium, tetraethoxyzirconium, tetrabutoxyzirconium, tetrabutoxytitanium. , Tetrabutoxyhafnium and the like, and particularly Z such as tetrapropoxyzirconium and tetrabutoxyzirconium.
The r (OR) ₄ compound is preferable, and two or more kinds thereof may be mixed and used. Further, specific examples of the 2,4-pentanedionato ligand or its derivative, benzoylmethanato ligand, benzoylacetonato ligand or its derivative include tetra (2,4-pentanedionato) zirconium. , Tri (2,4-pentanedionato)
Chloride zirconium, di (2,4-pentanedionato) dichloride zirconium, (2,4-pentanedionato) trichloride zirconium, di (2,4-pentanedionato) dietoxide zirconium, di (2,4-) Pentandionato) di-n-propoxide zirconium, di (2,4-pentanedionato) di-n
-Butoxide zirconium, di (2,4-pentanedionato) dibenzylzirconium, di (2,4-pentanedionato) dineofoylzirconium, tetra (dibenzoylmethanato) zirconium, di (dibenzoylmethanato) die Toxide zirconium, di (dibenzoylmethanato) di-n-propoxide zirconium, di (dibenzoylmethanato) di-n-butoxide zirconium, di (benzoylacetonato) dietoxide zirconium, di (benzoylacetonato) ) Di-n-propoxide zirconium, di (benzoylacetonato)
Examples thereof include di-n-butoxide zirconium.

The catalyst component a2 has the general formula Me ² R ⁴ _m (O
R ⁵⁾ wherein Me ² in _n X ² compound represented by _zmn represents the periodic table I~III group element, lithium, sodium,
Potassium, magnesium, calcium, zinc, boron,
Such as aluminum. R ⁴ and R ⁵ are each a hydrocarbon group having 1 to 24 carbon atoms, preferably 1 to 1 carbon atoms
2, more preferably 1 to 8, specifically, an alkyl group such as a methyl group, an ethyl group, a propyl group, an isopropyl group and a butyl group; an alkenyl group such as a vinyl group and an allyl group; a phenyl group, a tolyl group, Examples thereof include aryl groups such as xylyl group, mesityl group, indenyl group and naphthyl group; aralkyl groups such as benzyl group, trityl group, phenethyl group, styryl group, benzhydryl group, phenylbutyl group and neophyl group. These may have branches. X ² represents a halogen atom such as fluorine, iodine, chlorine and bromine, or a hydrogen atom. However, when X ² is a hydrogen atom, Me ² is limited to a group III element of the periodic table exemplified by boron, aluminum and the like. Further, z represents the valence of Me ² , m and n are integers satisfying the ranges of 0 ≦ m ≦ z and 0 ≦ n ≦ z, and 0 ≦ m + n ≦ z.

Examples of the compound represented by the above general formula of the catalyst component a2 include organolithium compounds such as methyllithium and ethyllithium; organomagnesium compounds such as dimethylmagnesium, diethylmagnesium, methylmagnesium chloride and ethylmagnesium chloride; dimethyl. Organozinc compounds such as zinc and diethylzinc; Organoboron compounds such as trimethylboron and triethylboron; Trimethylaluminum, triethylaluminum, tripropylaluminum, triisobutylaluminum, trihexylaluminum, tridecylaluminum, diethylaluminum chloride, ethylaluminum dichloride , Ethyl aluminum sesquichloride, diethyl aluminum ethoxide, diethyl aluminum Derivatives of organoaluminum compounds such as Idoraido the like.

The above-mentioned organic cyclic compound having a conjugated double bond of the catalyst component a3 is cyclic and has one or more conjugated double bonds, preferably 2 to 4 and more preferably 2 to 3 or 1 ring. A cyclic hydrocarbon compound having two or more and having a total carbon number of 4 to 24, preferably 4 to 12; the cyclic hydrocarbon compound partially has 1 to 6 hydrocarbon residues (typically, carbon A cyclic hydrocarbon compound substituted with an alkyl group or an aralkyl group of the formula 1 to 12; 2 or more, preferably 2 to 4, more preferably 2 to 2 conjugated double bonds.
Have 1 or 2 or more rings with 3 and have 4 total carbon atoms
An organosilicon compound having a cyclic hydrocarbon group of -24, preferably 4 to 12; the cyclic hydrocarbon group is partially substituted with 1 to 6 hydrocarbon residues or an alkali metal salt (sodium or lithium salt). Included organosilicon compounds. Particularly preferably, one having a cyclopentadiene structure in any of the molecules is desirable.

Examples of the above-mentioned suitable compounds include cyclopentadiene, indene, azulene or their alkyl, aryl, aralkyl, alkoxy or aryloxy derivatives. Moreover, the compound which these compounds couple | bonded (bridge | crosslink) through the alkylene group (The carbon number is 2-8 normally, Preferably 2-3) is also used suitably.

The organosilicon compound having a cyclic hydrocarbon group can be represented by the following general formula. A _L SiR _4-L where A represents a cyclopentadienyl group, a substituted cyclopentadienyl group, an indenyl group, or a cyclic hydrogen group exemplified by the substituted indenyl group, and R represents a methyl group, an ethyl group, or a propyl group. Groups, alkyl groups such as isopropyl group, butyl group; alkoxy groups such as methoxy group, ethoxy group, propoxy group, butoxy group; aryl groups such as phenyl group; aryloxy groups such as phenoxy group; aralkyl groups such as benzyl group Is shown and represents a hydrocarbon residue or hydrogen having 1 to 24 carbon atoms, preferably 1 to 12 and L is 1
≦ L ≦ 4, preferably 1 ≦ L ≦ 3.

Specific examples of the organic cyclic hydrocarbon compound of the above component a3 include cyclopentadiene, methylcyclopentadiene, ethylcyclopentadiene, propylcyclopentadiene, butylcyclopentadiene, 1,3-dimethylcyclopentadiene and 1-methyl-3-. Ethylcyclopentadiene, 1-methyl-3-propylcyclopentadiene, 1-methyl-3-butylcyclopentadiene, 1,2,4-trimethylcyclopentadiene, pentamethylcyclopentadiene, indene, 4-methyl-
1-indene, 4,7-dimethylindene, cycloheptatriene, methylcycloheptatriene, cyclooctatetraene, azulene, fluorene, cyclopolyene having 5 to 24 carbon atoms such as methylfluorene or substituted cyclopolyene, monocyclopenta Examples thereof include dienylsilane, biscyclopentadienylsilane, triscyclopentadienylsilane, monoindenylsilane, bisindenylsilane and trisindenylsilane.

The modified organoaluminum oxy compound containing an Al--O--Al bond of the catalyst component a4 is obtained by reacting an alkylaluminum compound with water to obtain a modified organoaluminum oxy compound usually called aluminoxane. The molecule usually contains 1 to 100, preferably 1 to 50 Al-O-Al bonds. The modified organoaluminum oxy compound may be linear or cyclic.

The reaction of organoaluminum with water is usually carried out in an inert hydrocarbon. As the inert hydrocarbon,
Aliphatic, alicyclic and aromatic hydrocarbons such as pentane, hexane, heptane, cyclohexane, benzene, toluene and xylene are preferable. The reaction ratio of water and the organoaluminum compound (water / Al molar ratio) is usually 0.25 / 1 to 1.2.
/ 1, preferably 0.5 / 1 to 1/1.

Examples of the boron compound include triethylaluminum tetra (pentafluorophenyl) borate and triethylammonium tetra (pentafluorophenyl).
Borate, dimethylanilinium tetra (pentafluorophenyl) borate, dimethylanilinium tetra (pentafluorophenyl) borate, butylammonium tetra (pentafluorophenyl) borate, N, N-
Examples include dimethylanilinium tetra (pentafluorophenyl) borate, N, N-dimethylanilinium tetra (3,5-difluorophenyl) borate, trityl tetrakispentafluoroborate, ferrocenium tetrakispentafluoroborate, and trispentafluoroborane. To be Among them, N, N-dimethylanilinium tetra (pentafluorophenyl) borate,
Trityl tetrakispentafluoroborate, ferrocenium tetrakispentafluoroborate, and trispentafluoroborane are preferred.

The above catalysts may be used by mixing and contacting a1 to a4, but it is preferable to use them by supporting them on an inorganic carrier and / or a particulate polymer carrier (a5). Examples of the inorganic carrier and / or the particulate polymer carrier (a5) include carbonaceous materials, metals, metal oxides, metal chlorides, metal carbonates or mixtures thereof, or thermoplastic resins, thermosetting resins and the like. Suitable metals that can be used for the inorganic carrier include iron, aluminum, nickel and the like. Specifically, Si
O ₂ , Al ₂ O ₃ , MgO, ZrO ₂ , TiO ₂ , B ₂ O ₃ ,
Examples thereof include CaO, ZnO, BaO, ThO _{2 and the} like, or a mixture thereof. SiO ₂ —Al ₂ O ₃ , SiO ₂ —V
₂ O ₅ , SiO ₂ —TiO ₂ , SiO ₂ —V ₂ O ₅ , SiO ₂ —
MgO, etc. SiO ₂ -Cr ₂ O ₃ and the like. Of these, those containing, as a main component, at least one component selected from the group consisting of SiO ₂ and Al ₂ O ₃ . Further, as the organic compound, either a thermoplastic resin or a thermosetting resin can be used, and specifically, particulate polyolefin, polyester, polyamide, polyvinyl chloride, poly (meth) acrylate, polystyrene, poly Examples include norbornene, various natural polymers, and mixtures thereof.

The above inorganic carrier and / or particulate polymer carrier can be used as they are, but preferably, as a pretreatment, these carriers are treated with an organoaluminum compound or a modified organoaluminum compound containing an Al--O--Al bond. It can also be used as the component a5 after the contact treatment.

The ethylene (co) polymer (A) is produced by a gas phase polymerization method, a slurry polymerization method, a solution polymerization method or the like in the presence of the above catalyst and substantially no solvent. Butane, pentane,
In the presence or absence of an inert hydrocarbon solvent exemplified by aliphatic hydrocarbons such as hexane and heptane, aromatic hydrocarbons such as benzene, toluene and xylene, and alicyclic hydrocarbons such as cyclohexane and methylcyclohexane. Manufactured in. The polymerization conditions are not particularly limited, but the polymerization temperature is usually 15 to 350 ° C., preferably 20 to 200 ° C., more preferably 50 to 110 ° C., and the polymerization pressure is usually atmospheric pressure to 70 kg / cm ^{2 in} the case of the low and medium pressure method. G, preferably normal pressure to 20 kg / cm ² G, usually 15 in the case of high pressure method
00 kg / cm ² G or less is desirable. In the case of the low and medium pressure method, the polymerization time is usually 3 minutes to 10 hours, preferably about 5 minutes to 5 hours. In the case of the high pressure method, it is usually 1 minute to 30 minutes, preferably 2 minutes to 20 minutes. The polymerization is not limited to the one-step polymerization method, and is not particularly limited to a two-step or more multi-step polymerization method in which the polymerization conditions such as hydrogen concentration, monomer concentration, polymerization pressure, polymerization temperature and catalyst are different from each other. As a particularly preferable manufacturing method, Japanese Patent Application Laid-Open No. 5-132518
The method described in Japanese Patent Laid-Open Publication is cited.

The ethylene (co) polymer (A) has a halogen concentration of at most 10 ppm, preferably at most 5 ppm, more preferably at most 5 ppm by using a halogen-free catalyst such as chlorine in the above catalyst components. 2ppm or less (ND: Non-Detec)
t). By using such a halogen-free ethylene (co) polymer such as chlorine, it is not necessary to use an acid neutralizer (halogen absorber) as in the past, and the chemical stability is excellent, especially for electronic parts. It is possible to provide a clean cover film that can be suitably used as a carrier tape for use in automobiles.

As the ethylene resin which is one of the other polyolefin resins (B) obtained by the high pressure radical method, low density polyethylene (LDPE) obtained by the high pressure radical polymerization method, an ethylene / vinyl ester copolymer is used. , A copolymer of ethylene and an α, β-unsaturated carboxylic acid or a derivative thereof, and the like.

The MFR of the LDPE is 0.01 to 20.
0 g / 10 minutes, preferably 0.1-100 g / 10 minutes,
More preferably, it is in the range of 1.0 to 80 g / 10 minutes. Within this range, the melt tension will be in an appropriate range, and the moldability will be improved. The density of LDPE is 0.91 to 0.94 g / cm ³ , and more preferably 0.91 to 0.935 g / cm ³ . Within this range, the melt tension will be in an appropriate range, and the moldability will be improved. The melt tension of LDPE is
The amount is 1.5 to 25 g, preferably 3 to 20 g, and more preferably 3 to 15 g. Also, the molecular weight distribution M of LDPE
w / Mn is 3.0 to 12, preferably 4.0 to 8.0.
Is. The molecular weight distribution Mw / Mn of LDPE is
It is 3.0 to 12, preferably 4.0 to 8.0.

The ethylene / vinyl ester copolymer is a vinyl propionate, vinyl acetate, vinyl caproate, vinyl caprylate, vinyl laurate, vinyl stearate containing ethylene as a main component, which is produced by a high pressure radical polymerization method. , A copolymer with a vinyl ester monomer such as trifluorovinyl acetate. Among them, vinyl acetate is particularly preferable. Further, ethylene 50 to 99.5% by mass, vinyl ester 0.5 to 50% by mass, and other copolymerizable unsaturated monomer 0
A copolymer composed of ˜49.5 mass% is preferred. In particular,
The content of vinyl ester is in the range of 3 to 30% by mass, preferably 5 to 25% by mass. The MFR of the ethylene / vinyl ester copolymer is 0.01 to 200 g / 10 minutes,
The range is preferably 0.1 to 100 g / 10 minutes, and more preferably 1.0 to 80 g / 10 minutes.

The copolymer of ethylene and α, β-unsaturated carboxylic acid or its derivative is ethylene.
(Meth) acrylic acid or its alkyl ester copolymer may be mentioned, and examples of these comonomers include acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, methacrylic acid. Propyl, isopropyl acrylate, isopropyl methacrylate, acrylic acid n-
Butyl, n-butyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, lauryl acrylate, lauryl methacrylate, stearyl acrylate,
Examples thereof include stearyl methacrylate, glycidyl acrylate, glycidyl methacrylate and the like. Among these, particularly preferred are alkyl esters of (meth) acrylic acid such as methyl and ethyl. In particular, the content of (meth) acrylic acid ester is 3 to
It is in the range of 30% by mass, preferably 5 to 25% by mass.
The MFR of a copolymer of ethylene and an α, β-unsaturated carboxylic acid or its derivative is 0.01 to 200 g / 10 minutes,
It is preferably 0.05 to 100 g / 10 minutes, and more preferably 0.1 to 80 g / 10 minutes.

A preferred embodiment of the composition layer (II) is
The ethylene (co) polymer (A) is preferably 100 to 10% by mass and the other polyolefin resin (B) is 0 to 90% by mass. When the ethylene (co) polymer (A) is less than 10% by mass or the other polyolefin resin (B) exceeds 90% by mass, the low temperature heat sealability and the adhesive strength may not be improved.

The olefin resin composition used for the composition layer (II) further contains at least two epoxy groups (oxirane groups) in the molecule and has a molecular weight of 3000.
The following epoxy compound (C) is contained. With an epoxy compound having one epoxy group in the molecule, the effect of improving the adhesiveness to the substrate cannot be expected so much. The molecular weight of this epoxy compound is 3,000 or less, preferably 1
It is preferably 500 or less, and particularly preferably 1000 or less. Molecular weight is 3
If it exceeds 000, a sufficient effect of improving the adhesiveness cannot be obtained when it is made into a composition.

Examples of the epoxy compound (C) include phthalic acid diglycidyl ester, isophthalic acid diglycidyl ester, terephthalic acid diglycidyl ester, adipic acid diglycidyl ester, trimethylolpropane triglycidyl ether, and polyglycerol polyglycol. Examples thereof include glycidyl ether, pentaerythritol polyglycidyl ether, butanediol diglycidyl ether, hydrogenated bisphenol A diglycidyl ether, phenol novolac polyglycidyl ether, and epoxidized vegetable oil. Among them, epoxidized vegetable oil is preferable from the viewpoints of easy handling, availability, and low cost.

Here, the epoxidized vegetable oil is an epoxidized unsaturated double bond of natural vegetable oil using peracid or the like, and examples thereof include epoxidized soybean oil, epoxidized linseed oil, epoxidized olive oil, and epoxy. Safflower oil, epoxidized corn oil and the like can be mentioned. These epoxidized vegetable oils are available, for example, from Asahi Denka Kogyo Co., Ltd.
Made, O-130P (epoxidized soybean oil), O-180A
(Epoxidized linseed oil) and the like. It should be noted that the presence of an unepoxidized or insufficiently epoxidized oil component, which is a by-product when the vegetable oil is epoxidized, does not hinder the action and effect of the present invention.

The content of the epoxy compound (C) in the olefin resin composition is 100 parts by mass of the resin component containing the polyolefin resin and, if desired, the olefin resin (D) having a functional group that reacts with an epoxy group. ,
0.01 to 10 parts by mass, more preferably 0.05
-8 parts by mass, and further 0.1-5 parts by mass. If the content of the epoxy compound (C) is less than 0.01 parts by mass, the effect of improving the adhesiveness to the substrate is insufficient, and if it exceeds 10 parts by mass, blocking due to stickiness or generation of odor may occur. Problems may occur.

The olefin resin composition used in the composition layer (II) may further contain an olefin resin (D) having a functional group which reacts with an epoxy group in the molecule. This olefin resin (D) is not essential, but its addition to the base material can be further improved by adding it. This is because a reaction occurs between the epoxy group and a functional group capable of reacting with the epoxy group, and the epoxy compound (C) grafted to the resin component increases.

The amount of the olefin resin (D) having a functional group which reacts with an epoxy group is preferably less than 30% by mass, more preferably the total amount of the polyolefin and the olefin resin (D). Is 2 to 25% by mass
And more preferably 5 to 20 mass%. Addition of 30% by mass or more of the olefin resin (D) has an effect of improving adhesion, but is not economical.

Examples of the functional group which reacts with the epoxy group include a carboxyl group or a derivative thereof, an amino group, a phenol group, a hydroxyl group and a thiol group. Among them, an olefin resin (D) having in the molecule at least one group selected from the group consisting of an acid anhydride group, a carboxyl group and a carboxylic acid metal salt is preferably used in view of the balance between reactivity and stability. The method of introducing the functional group that reacts with the epoxy group mainly includes a copolymerization method and a graft method.

For example, as the olefin resin (D) having a functional group capable of reacting with an epoxy group produced by a copolymerization method, a random multi-component copolymer of ethylene and a compound capable of reacting with ethylene can be mentioned. Examples of the compound used for the copolymerization include (meth) acrylic acid such as α, β-
Unsaturated carboxylic acids, α, β-unsaturated carboxylic acid metal salts such as sodium (meth) acrylate, maleic anhydride, itaconic anhydride, unsaturated carboxylic acid anhydrides such as citraconic anhydride, hydroxyethyl (meth) acrylate Examples thereof include hydroxyl group-containing compounds such as (meth) allyl alcohol and unsaturated amino compounds such as allylamine, but not limited thereto. Further, in addition to these unsaturated compounds, vinyl alcohol esters such as (meth) acrylic acid ester, vinyl acetate, vinyl propionate and the like can be copolymerized and used. Two or more kinds of copolymers of these compounds and ethylene may be used in combination.

On the other hand, the olefin resin (D) having a functional group capable of reacting with an epoxy group introduced by graft modification is
In general, a polyolefin, a free radical generator such as a peroxide, and a modifying compound are allowed to act in a molten or solution state for production. As the polyolefin used for the graft modification, LDPE, linear low density polyethylene (LLDPE), high density polyethylene (HDPE),
In addition to polypropylene (PP), ethylene-propylene copolymer, propylene-butene-1 copolymer, ethylene-vinyl acetate copolymer (EVA), ethylene- (meth) acrylic acid copolymer (E (M) A), ethylene-vinyl acetate- (meth) acrylic acid ester copolymer and the like. These may be used alone or in combination of two or more. Further, for example, ethylene- (meth)
A copolymer such as an acrylic acid ester-maleic anhydride copolymer which already contains an acid or a derivative thereof may be further graft-modified and used.

The type of the free radical generator used in the graft modification is not particularly limited, but, for example, a general organic peroxide is used as the free radical generator, and among them, good reactivity and easy handling are preferable. From the viewpoint of ease, dicumyl peroxide, 2,5-dimethyl-2,5-bis (t-butylperoxy) hexane, 1,3-bis (2-t-butylperoxyisopropyl) benzene, benzoyl peroxide, etc. It is preferably used.

As the unsaturated compound for modification, the same unsaturated compound as the compound copolymerizable with ethylene used in the above-mentioned copolymerization method is used, and the carboxylic acid group or carboxylic acid anhydride group and its metal are used. Basically, it can be used as long as it has an unsaturated group capable of radical reaction such as salt, amino group, and hydroxyl group. Examples of the unsaturated compound for modification include unsaturated carboxylic acids such as (meth) acrylic acid, unsaturated carboxylic acid metal salts such as sodium (meth) acrylate, maleic anhydride or itaconic anhydride, and anhydrous Examples thereof include, but are not limited to, unsaturated carboxylic acid anhydrides such as citraconic acid, hydroxyethyl (meth) acrylate, unsaturated hydroxyl group-containing compounds such as (meth) allyl alcohol, and unsaturated amino compounds such as allylamine.

If desired, conventional additives may be added to the olefin resin composition used in the composition layer (II), but antioxidants, antiblocking agents, lubricants and antistatic agents are preferred. Agent, anti-fog agent, ultraviolet absorber,
Known additives such as organic or inorganic pigments, nucleating agents and crosslinking agents are not blended, or even if the resin composition is blended with additives, the blended additives are substantially An additive that does not adversely affect the contacted object such as an electronic component is desirable.

In the present invention, the additive which does not substantially affect the object to be contacted is, for example, hydrotalcite or the like, which does not corrode the object to be contacted, and is for the electronic component carrier tape of the present invention. It is an additive that can be added within a range that does not essentially impair the characteristics of the cover film.

The olefin resin composition used in the composition layer (II) is the above-mentioned polyolefin resin and epoxy compound (C) and, if necessary, the olefin resin (D).
Can be obtained by mixing with a Henschel mixer, a ribbon mixer, or the like, or by kneading the mixture with an open roll, a Banbury mixer, a kneader, an extruder, or the like. The kneading temperature is usually from the melting point of the resin to 350 ° C.

In the cover film for an electronic component carrier tape of the present invention, the composition layer (II) also serves as a heat seal layer, but in some cases, another known sealant layer (III) is provided as the third layer. Good. Examples of the sealant film used for the sealant layer (III) include polyolefin-based sealants and styrene-based sealants.

Further, the composition layer (I
I) or the sealant layer (III) may have antistatic properties. As a method of imparting antistatic performance to the composition layer (II) or the sealant layer (III) to be the heat seal layer, kneading an antistatic agent into the composition layer (II) or the sealant layer (III), or , A method of applying an antistatic agent to the surface of the composition layer (II) or the sealant layer (III). As an antistatic agent when kneading,
Anionic antistatic agents such as alkyl sulfonates and phosphate ester salts; cationic antistatic agents such as amide cations; amphoteric antistatic agents such as alkylbetaine; fatty acid monoglycerides, di- (2-hydroxyethyl) alkylamines, etc. Nonionic antistatic agents, such as electroconductive fine powders.

As the antistatic agent for coating, anionic antistatic agents such as alkylsulfonates and alkylsulfate salts; cationic antistatic agents such as choline acyl chloride and alkyltrimethylammonium salts;
Amphoteric antistatic agents such as imidazoline type and alanine type; Nonionic antistatic agents such as polyoxyethylene alkylamine and polyoxyethylene alkylphenyl ether;
Examples include conductive fine powder dispersion solutions.

Examples of the method for coating the surface include a method in which water or an organic solvent is added to a coating solution or suspension containing an antistatic agent, if necessary, and the resultant is coated on a film and dried by heating. The coating can be performed by a known coating method such as an air knife coating method, a curtain coating method, a gravure coating method or a spray coating method.

The surface resistivity of the heat-sealing layer thus obtained, which has been subjected to the antistatic treatment, is 10 ¹ to 10 ¹² Ω.
The range of / □ is general, the range of 10 ⁶ to 10 ¹² Ω / □ is preferable, and the range of 10 ⁸ to 10 ¹² Ω / □ is more preferable. As the antistatic agent, anionic, cationic, amphoteric, nonionic, etc. antistatic agents are preferable because they do not significantly impair the transparency of the film, and as an antistatic treatment method, coating is performed on the surface. The method is preferable because it can be used in a relatively small amount.

As a method for producing the cover film for an electronic component carrier tape of the present invention, an olefin resin composition is extrusion-laminated on a substrate, and the composition layer (II) is formed on the substrate layer (I). A method of laminating; a method of laminating the composition layer (II) on the base material layer (I) by laminating the base material layer (I) and the composition layer (II) by dry lamination molding. . Further, when having a sealant layer (III), as a method for producing a cover film for an electronic component carrier tape of the present invention, a olefin resin composition and a sealant layer (III) are coextruded on a substrate,
On the base material layer (I), the composition layer (II) and the sealant layer (I
II) method of laminating; base material layer (I) and composition layer (II) are laminated by dry lamination molding, and sealant layer (III) is dry laminated or extrusion laminated on the composition layer (II). There may be mentioned a method of stacking the layers.

The molding temperature for extrusion-laminating the olefin resin composition on the substrate is in the range of 240 to 330 ° C., preferably 260 to 320 ° C., more preferably 2
It is in the range of 80 to 310 ° C. In addition, particularly when laminating at a relatively low temperature of about 300 ° C. or less, it is desirable to oxidize the molten resin on the bonding surface with the base material with air, ozone, or the like. In addition, it is desirable that the bonding surface of the base material is subjected to surface treatment such as corona discharge treatment. If the molding temperature is lower than 240 ° C., the adhesive strength may not be sufficient, and if it exceeds 330 ° C., the resin is deteriorated, which is not preferable.

The ozone treatment amount depends on the type of substrate, conditions, etc.
5g / Nm depending on ³× 1 Nm³/ Hr ~
100 g / Nm³× 20 Nm³/ Hr range, preferably
10 g / Nm³× 1.5 Nm³/ Hr ~ 70g / Nm³× 1
0 Nm³/ Hr, more preferably 15 g / Nm³× 2N
m³/ Hr-50g / Nm³× 8 Nm³Select in the range of / hr
Is selected. The corona discharge treatment amount is 1 to 300w
/ M² Range, preferably 5 to 200 w min / m² , Further
Preferably 10 to 100 w min / m² Selected in the range of
Is desirable. Especially ozone treatment and corona discharge treatment
By using together, the adhesive strength is dramatically improved.
be able to.

In such a cover film for an electronic component carrier tape, the olefin resin composition used in the composition layer (II) contains a specific epoxy compound (C).
Since it contains, it exhibits practically sufficient adhesive strength, and it is not necessary to use an anchor coating agent. Therefore, the working environment is not polluted by the use of the solvent. Also,
Since no anchor coating agent is used, residual solvent in the cover film for electronic component carrier tape is reduced. Moreover, since sufficient adhesive strength can be obtained without using an anchor coating agent, high-speed molding becomes possible. Further, since it is not necessary to use the anchor coating agent, the cost is reduced.

[0088]

EXAMPLES The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

The test method in this example is as follows. [Density] Based on JIS K6760. [MFR] Based on JIS K6760. [Mw / Mn] GPC (150C type manufactured by Waters)
Was used, and ODCB at 135 ° C. was used as a solvent. GMMHR-H (S) manufactured by Tosoh Corporation was used as a column.

With the [TREF] column kept at 135 ° C., a sample was injected into the column and the temperature was lowered to 25 ° C. at 0.1 ° C./min to deposit the polymer on the glass beads,
The column was heated under the following conditions and the concentration of polymer eluted at each temperature was detected with an infrared detector. (Solvent: ODCB, flow rate: 1 ml / min, temperature rising rate: 50 ° C./hr, detector: infrared spectroscope (wavelength 2925 cm ⁻¹ ), column: 0.8 cm
φ × 12 cmL (filled with glass beads), sample concentration:
0.05% by mass) [Measurement of T _ml by DSC] A sheet having a thickness of 0.2 mm was formed by hot pressing, and a sample of about 5 mg was punched out from the sheet. This sample was kept at 230 ° C. for 10 minutes and then cooled to 0 ° C. at 2 ° C./minute. Then 170 again at 10 ° C / min
The temperature was raised to 0 ° C., and the temperature at the peak of the highest temperature peak that appeared was defined as the highest peak temperature T _ml .

[ODCB soluble content] A sample of 0.5 g was added to 20
After adding to ml ODCB and heating at 135 ° C. for 2 hours to completely dissolve the sample, the sample was cooled to 25 ° C. This solution was left at 25 ° C. overnight and then filtered through a Teflon (registered trademark) filter to collect a filtrate. The absorption peak intensity near the wave number 2925 cm ⁻¹ of the asymmetric stretching vibration of methylene in the filtrate, which is the sample solution, was measured by an infrared spectroscope, and the sample concentration in the filtrate was calculated from the calibration curve prepared in advance. From this value, the amount of ODCB-soluble matter at 25 ° C was determined.

[Melt Tension (MT)] It was determined by measuring the stress when the molten polymer was stretched at a constant rate with a strain gauge. The measurement sample is granulated into pellets, and is manufactured by Toyo Seiki Seisakusho M
It measured using the T measuring device. The orifice used has a hole diameter of 2.09 mmφ and a length of 8 mm, and the measurement conditions are a resin temperature of 190 ° C., a cylinder descending speed of 20 mm / min, and a winding speed of 15 m / min. [Halogen concentration] 10ppm measured by fluorescent X-ray method
When the above chlorine was detected, this was taken as the analytical value. When it was lower than 10 ppm, it was measured by a TOX-100 type chlorine / sulfur analyzer manufactured by Dia Instruments Co., Ltd., and when it was 2 ppm or less, it was regarded as substantially non-containing, and was designated as ND (non-detect).

The various components used in the examples are as follows. [Ethylene (co) polymer (A)] The ethylene (co) polymer (A11) was synthesized by the following method. [Preparation of solid catalyst] [Solid catalyst] In a catalyst preparation device equipped with an electromagnetic induction stirrer,
1000 ml of toluene purified under nitrogen, 26 g of tetrapropoxyzirconium (Zr (OPr) ₄ ), 22 g of indene and 88 g of methylbutylcyclopentadiene
Was added, and 100 g of tripropylaluminum was added dropwise over 100 minutes while maintaining the temperature at 90 ° C., and then the mixture was reacted at the same temperature for 2 hours. After cooling to 40 ° C., 2424 ml of a toluene solution of methylalumoxane (concentration 3.3 mmol / ml) was added and stirred for 2 hours. Next in advance 4
Silica calcined at 50 ° C for 5 hours (surface area 300 m ²
/ G) 2000 g, and after stirring at room temperature for 1 hour, 40
Nitrogen was blown and dried under reduced pressure at 0 ° C. to obtain a solid catalyst (a) having good fluidity.

[Gas Phase Polymerization] Continuous fluidized bed gas phase polymerization apparatus
Polymerization temperature 65 ° C, total pressure 20 kgf / cm ² At G
Copolymerization of ethylene and 1-hexene was performed. The solid touch
The medium (a) is continuously supplied, and ethylene, 1-hexene and
And hydrogen, etc. are supplied so as to maintain a predetermined molar ratio for polymerization.
Then, an ethylene (co) polymer (A11) was obtained. Both
The results of measuring the physical properties of the polymer are shown in Table 1.

The ethylene (co) polymer (A12) was synthesized by the following method. [Preparation of solid catalyst] [Solid catalyst] In a catalyst preparation device equipped with an electromagnetic induction stirrer,
1000 g of toluene purified under nitrogen, 31 g of tetrabutoxyzirconium (Zr (OBu) ₄ ) and 74 g of indene were added, 127 g of triisobutylaluminum was added dropwise over 100 minutes while maintaining at 90 ° C., and then at the same temperature for 2 hours. It was made to react. After cooling to 40 ° C,
Toluene solution of methylalumoxane (concentration 3.3 mmo
(24 ml) was added and the mixture was stirred for 2 hours. Next, 2000 g of silica (surface area 300 m ² / g) calcined in advance at 450 ° C. for 5 hours was added, and after stirring at room temperature for 1 hour, nitrogen blowing and vacuum drying were performed at 40 ° C.
A solid catalyst (II) having good fluidity was obtained.

[Gas Phase Polymerization] Continuous fluidized bed gas phase polymerization apparatus
Polymerization temperature 70 ° C, total pressure 20 kgf / cm ²At G
Copolymerization of ethylene and 1-hexene was performed. The solid touch
The medium (b) is continuously supplied to supply ethylene, 1-hexene and
And hydrogen to maintain the specified molar ratio
Then, an ethylene (co) polymer (A12) was obtained. Both
The results of measuring the physical properties of the polymer are shown in Table 1.

The ethylene (co) polymer (A2) was synthesized by the following method. [Preparation of solid catalyst] [Solid catalyst] In a catalyst preparation device equipped with an electromagnetic induction stirrer,
1000 ml of toluene purified under nitrogen, 26 g of tetrapropoxyzirconium (Zr (OPr) ₄ ), 74 g of indene and 78 of methylpropylcyclopentadiene
g was added, and 100 g of tripropylaluminum was added dropwise over 100 minutes while maintaining the temperature at 90 ° C., and then reacted at the same temperature for 2 hours. After cooling to 40 ° C, a toluene solution of methylalumoxane (concentration 3.3 mmol / ml)
2133 ml was added and stirred for 2 hours. Next, silica that had been preliminarily calcined at 450 ° C. for 5 hours (surface area 300 m
² / g) 2000 g was added and stirred at room temperature for 1 hour, then 4
Nitrogen was blown and dried under reduced pressure at 0 ° C. to obtain a solid catalyst (C) having good fluidity.

[Gas phase polymerization] Continuous fluidized bed gas phase polymerization apparatus
Polymerization temperature 80 ° C, total pressure 20 kgf / cm ²At G
Copolymerization of ethylene and 1-hexene was performed. The solid touch
The medium (c) is continuously supplied, and ethylene, 1-hexene and
And hydrogen are supplied to maintain the specified molar ratio for polymerization.
Thus, an ethylene (co) polymer (A2) was obtained. Its copolymerization
The measurement results of physical properties of the body are shown in Table 1.

[Production of ethylene / hexene-1 copolymer (A3) by metallocene catalyst] Purified toluene was put into a pressure reactor equipped with a stirrer and purged with nitrogen, then 1-hexene was added, and bis ( A mixture of n-butylcyclopentadienyl) zirconium dichloride and methylalumoxane (MAO) was added (Al / Zr molar ratio = 200).
After adding, the temperature was raised to 80 ° C. to adjust the metallocene catalyst. Next, ethylene was added, and while continuously polymerizing ethylene, the total pressure was maintained at 8 kg / cm ³ , and the polymerization was performed.
An ethylene / hexene-1 copolymer (A3) was produced.
The measurement results of the physical properties of the copolymer are shown in Table 1.

[Linear low-density polyethylene (A4) with commercially available Ziegler type catalyst] (LLDPE) Density: 0.910 g / cm ³ , MFR:
10 g / 10 min, comonomer: 4-methyl-pentene-
1 The physical properties of the ethylene (co) polymer are shown in Table 1.

[0101]

[Table 1]

The following were used as other polyethylene resins (B) obtained by the high pressure radical method. [Low-density polyethylene (B
1)] Density: 0.917 g / cm ³ , MFR: 7.0 g / 10 min

The following compounds were used as the epoxy compound (C). [Epoxy compound (C1)] Epoxidized soybean oil (molecular weight: about 1000, oxirane oxygen 6.9%, O-130P manufactured by Asahi Denka Co., Ltd.) [Epoxy compound (C2)] Epoxidized linseed oil (molecular weight: About 1000, oxirane oxygen 9.1%, Asahi Denka Kogyo Co., Ltd., O-180A)

The following materials were used as the base material. S1: Biaxially stretched polyethylene terephthalate film (Unitika, Emblet PET, thickness 25 μm) S2: Biaxially stretched polyamide film (Unitika, ON)
U, thickness 15 μm)

[Examples 1 to 5] Low density polyethylene (B
1) and the epoxy compounds (C1, C2) and the components shown in Table 2 were mixed in a Henschel mixer, and a resin temperature of 2 was obtained using a Φ50 mm single screw extruder manufactured by Tanabe Kogyo Co., Ltd.
The mixture was melt-kneaded and pelletized under the conditions of 00 ° C. and an extrusion rate of 35 kg / hr. Using an extrusion laminating machine (manufactured by Modern Machinery Co., Ltd.) having an extruder with a diameter of 90 mm, the pellets were separated from the T-die to the nip roll by 120 mm, the resin temperature was 320 ° C immediately below the die during molding, and the laminating speed was 100 m / min. Under the conditions of a laminate thickness of 25 μm and a coat width of 860 mm, the cover film for an electronic component carrier tape was manufactured by extruding it on a substrate and performing extrusion lamination. At this time, an in-line corona discharge treatment (6 KW) was performed on the substrate immediately before extrusion lamination using a Corona treatment machine manufactured by Pillar Co., which has a discharge output of 6 kW and an electrode width of 1 m.

The obtained cover film was aged in a gear oven at 40 ° C. for 2 days and then conditioned in a constant temperature chamber at 23 ° C. for 1 day. A rectangular sample having a length of 20 cm and a width of 15 mm is cut out from the cover film with the M direction as the longitudinal direction, and the base material layer (I) and the composition layer (II) are cut by a universal tensile tester manufactured by Orientec Co., Ltd. The adhesive strength at the interface with and was measured under conditions of a tensile speed of 300 mm / min, an initial chuck distance of 50 mm, and T-type peeling. The results are shown in Table 2.

[Examples 6 to 12] The ethylene (co) polymer (A), the low density polyethylene (B1) and the epoxy compound (C1) were changed to the compositions shown in Table 2, and the base materials shown in Table 2 were used. A cover film for an electronic component carrier tape was manufactured in the same manner as in Example 1 except that the adhesive strength at the interface between the base material layer (I) and the composition layer (II) was measured. The results are shown in Table 2.

[Comparative Examples 1 to 4] A cover film for an electronic component carrier tape was produced in the same manner as in Example 1 except that each component was changed to the composition shown in Table 2 and the base material shown in Table 2 was used. The adhesive strength at the interface between the base material layer (I) and the composition layer (II) was measured. The results are shown in Table 2.

[0109]

[Table 2]

[0110]

As described above, the cover film for an electronic component carrier tape of the present invention comprises a base material layer (I) made of a base material, a polyolefin resin and a base material layer (I) in contact with the base material layer (I). Resin component 1 containing the polyolefin resin
Epoxy compound 0.0 having 2 or more epoxy groups in the molecule and having a molecular weight of 3000 or less with respect to 00 parts by mass
Since it has a composition layer (II) composed of an olefin resin composition containing 1 to 10 parts by mass, the base material layer (I) can be used without using an adhesive such as an anchor coat agent.
The adhesiveness between the composition and the composition layer (II) is excellent.

If the olefin resin composition of the composition layer (II) further contains, as a resin component, an olefin resin having a functional group capable of reacting with an epoxy group in the molecule, a base material layer The adhesiveness between (I) and the composition layer (II) is further improved.

The polyolefin resin is ethylene
(Co) polymer (A) 100 to 10% by mass and other poly
The olefin resin (B) is 0 to 90% by mass, and
Ethylene (co) polymer (A) is a single-site catalyst
Is produced in the presence of
(A) density of united (A) is 0.86 to 0.97 g / cm
³ , (B) the melt flow rate is 0.01 to 200 g /
If it is 10 minutes, the base material layer (I) and the composition layer
Excellent adhesion to (II) and low temperature heat sealability
Shape workability is improved, and high-speed formability is further improved.

If the olefin resin composition contains no additive, or an additive that does not substantially affect the object to be contacted, or the above-mentioned ethylene (co) polymer If the halogen content of 10 ppm or less is 10 ppm or less, it becomes possible to provide a clean cover film for electronic component carrier tape.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing an example of an electronic component carrier tape of the present invention.

FIG. 2 is a graph showing an elution temperature-elution amount curve of the ethylene (co) polymer (A) according to the present invention.

FIG. 3 is an ethylene (co) polymer (A1) according to the present invention.
3 is a graph showing an elution temperature-elution amount curve of.

FIG. 4 is a graph showing an elution temperature-elution amount curve of an ethylene (co) polymer with a metallocene catalyst.

FIG. 5: Ethylene (co) polymer (A2) according to the present invention
3 is a graph showing an elution temperature-elution amount curve of.

FIG. 6 is a cross-sectional view showing an example of a conventional electronic component carrier tape.

[Explanation of symbols] 10 Electronic component carrier tape cover film 11 Base material layer (I) 12 Composition layer (II)

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Tokinori Imayama             2-3-2 Yokou, Kawasaki-ku, Kawasaki-shi, Kanagawa               Japan Polyolefin Co., Ltd.             Research and Development Center F-term (reference) 3E086 AB02 AC07 AD09 AD24 BA04                       BA13 BA14 BA15 BB15 BB20                       BB35 BB51 BB74 BB90 CA31                 4F100 AH02B AH02H AK03B AK42A                       AL05B AL06B AT00A BA02                       BA10A BA10B BA15 GB16                       GB41 GB90 JK06 JL06 YY00B

Claims (10)

[Claims] 1. A base material layer (I) composed of a base material, and a polyolefin resin, which is in contact with the base material layer (I),
An olefin resin composition containing 0.01 to 10 parts by mass of an epoxy compound having two or more epoxy groups in a molecule and a molecular weight of 3000 or less with respect to 100 parts by mass of a resin component containing the polyolefin resin. A cover film for an electronic component carrier tape, comprising a composition layer (II) comprising 2. The olefin resin composition of the composition layer (II) further contains, as a resin component, an olefin resin having a functional group that reacts with an epoxy group in the molecule. A cover film for an electronic component carrier tape as described above. 3. The cover film for an electronic component carrier tape according to claim 1, further comprising a sealant layer (III) in contact with the composition layer (II). 4. The polyolefin-based resin comprises 100 to 10% by mass of an ethylene (co) polymer (A) and 0 to 90% by mass of another polyolefin-based resin (B), and the ethylene (co) polymer ( A) is produced in the presence of a single-site catalyst, and the ethylene (co) polymer (A) has a (a) density of 0.86 to 0.97.
g / cm ³ , (b) melt flow rate of 0.01 to 2
It is 00 g / 10 minutes, The cover film for electronic component carrier tapes in any one of the Claims 1 thru | or 3 characterized by the above-mentioned. 5. The cover film for an electronic component carrier tape according to claim 4, wherein the ethylene (co) polymer (A) satisfies the following requirements (a) to (d). (A) Density of 0.86 to 0.97 g / cm ³ , (b) Melt flow rate of 0.01 to 200 g / 10
Min, (c) molecular weight distribution (Mw / Mn) of 1.5 to 4.5, (d) total 25 determined from the integrated elution curve of elution temperature-elution amount curve by continuous temperature rising elution fractionation method (TREF) The difference T ₇₅ -T ₂₅ between the temperature T _{25 at} which 100% elutes and the temperature T _{75 at} which 75% of the whole elutes, and the density d satisfy the following equation (equation 1) (equation 1) T ₇₅ -T ₂₅ ≤ -670 x d + 644 6. The cover film for an electronic component carrier tape according to claim 5, wherein the ethylene (co) polymer (A) further satisfies the following requirement (e). (E) The difference between the temperature T _{25 at} which 25% of the whole is eluted and the temperature T _{75 at} which 75% of the whole is obtained, which is obtained from the integral elution curve of the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF) T ₇₅ -T ₂₅ and density d satisfy the following to satisfy the relation of (formula 2) (formula 2) d <when _{^{0.950g / cm 3 T 75 -T 25}} ≧ -300 × d + 285 d ≧ 0.950g / Cm ³ T ₇₅ −T ₂₅ ≧ 0 7. The ethylene (co) polymer (A) is an ethylene (co) polymer (A1) which further satisfies the following requirements (f) and (g):
A cover film for an electronic component carrier tape as described above. (F) Ortho-dichlorobenzene (ODC at 25 ° C)
B) Soluble content X (mass%), density d and melt flow rate (MFR) satisfy the relationships of the following (formula 3) and (formula 4) (formula 3) d-0.008log MFR ≧ 0.93 When X <2.0 (Equation 4) d−0.008 log MFR <0.93 When X <9.8 × 10 ³ × (0.9300−d + 0.008
logMFR) ² +2.0 (g) Multiple peaks on the elution temperature-elution volume curve by continuous temperature rising elution fractionation (TREF) 8. The ethylene (co) polymer (A) is an ethylene (co) polymer (A2) further satisfying the following requirements (h) and (i):
A cover film for an electronic component carrier tape as described above. (H) One peak of the elution temperature-elution amount curve by the continuous temperature rising elution fractionation method (TREF). (I) One or more melting point peaks, and the highest melting point _Tml and density d satisfies the following relationship (Equation 5) (Equation 5) T _ml ≧ 150 × d−19 9. The ethylene (co) polymer (A2) comprises:
The cover film for an electronic component carrier tape according to claim 8, which further satisfies the following requirement (j). (J) Melt tension (MT) and melt flow rate (MFR) satisfy the following (formula 6) (formula 6) logMT ≦ −0.572 × logMFR +
0.3 10. The cover film for an electronic component carrier tape according to claim 4, wherein the halogen content in the ethylene (co) polymer (A) is 10 ppm or less.