JP2003306386A - Alumina ceramic setter and method for manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide ceramic setters which are effective for the electronic device components and the like made of materials which may react with setter materials; can prevent reaction with the setter materials; achieve high air permeability and high removal efficiency of organic substances in the process of firing or the like; can achieve uniform dispersion of an atmospheric gas in the setter and easy transfer to the outside; and lead to the improvement of the quality and productivity of the above components and the like, and to provide an economical method for manufacturing the same. <P>SOLUTION: The ceramic setters having a plurality of through-holes are used in the heat treatment or firing of ceramic electronic device components and metal components by injection molding. The ceramic setter comprises 98 wt.% or more of alumina and 0.3 wt.% or less of silica and has a relative density of 95% or more. The through-hole has a linear shape in the longitudinal direction with a generally same inner diameter, which has an average pore size of 0.3-1 mm. The method for manufacturing the setter is provided. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to heat treatment or firing (hereinafter referred to as "ceramic-based electronic device parts represented by capacitors, piezoelectric elements and ferrite elements" and high-precision metal-based parts manufactured by injection molding. The present invention relates to a ceramics setter (hereinafter, "ceramics setter" is simply referred to as "setter") used when "heat treatment or baking" is referred to as "firing or the like", and a manufacturing method thereof.

[0002]

2. Description of the Related Art In recent years, ceramic thin films having various characteristics have been developed and applied to various electronic devices. Examples of ceramic electronic devices include ceramic capacitors using dielectric ceramics, multilayer ceramic capacitors (chip capacitors), piezoelectric transducers using piezoelectric ceramics, piezoelectric sensors, and ceramic actuators such as motors and vibrators (solid displacement elements). ) Etc. are known,
A wide variety of uses are expected. The electronic device as described above is made of, for example, a ceramic member such as a very thin film (tape or sheet) of a micron unit, and has various characteristics by singly or laminating these films. Has been created. Taking a typical piezoelectric ceramics (transducer) as an example, the piezoelectric ceramics are lead zirconate titanate (P) to which various subcomponents are added in order to impart desired characteristics.
bTiO ₃ · PbZrO _3: PZT) and the ceramic member composed of a material composition composed mainly of, and is formed by the electrode. When manufacturing a ceramic member, in general, in order to improve the processability during manufacturing, an organic binder (binder) is added to the desired material composition, and molding is performed in that state, and then as a binder. The organic binder used is removed by heat treatment. Further, since the sub-component is added to the main component in a desired state, calcination treatment may be performed in advance.

A tray-shaped setter capable of accommodating a plurality of electronic device components is used when firing such a ceramic electronic device component (hereinafter referred to as "electronic device component"). For example, based on a refractory material having a main constituent phase of alumina or alumina-silica (mullite) having a particle size distribution in the range of several millimeters to several microns, a setter in which zirconia is sprayed (JP-A-61-242525). (See Japanese Patent Laid-Open No. 3-1090), and a setter in which zirconia is coated on the surface of alumina ceramics is used.

Electronic device parts are highly functional materials, and maintaining the quality of products is a very important problem. However, for the purpose of improving production efficiency, the unit area of the setter as described above is increased. Increasing the load of electronic device parts per unit makes it difficult to achieve a uniform temperature distribution and maintain the uniformity of the atmosphere gas during firing, etc., so that the quality of the manufactured electronic device parts can be maintained uniform. There is a risk that it will disappear or cause quality deterioration, and it is a difficult problem to improve production efficiency and maintain quality at the same time. On the other hand, in recent years, by using a highly breathable setter, a large amount of organic binder added in the molding process of electronic device parts can be removed more efficiently, and at the same time, the electrode material can be stabilized. It has been attempted to improve the productivity of electronic device parts and realize higher quality of products by enabling firing in a maintained state.

As a setter with high air permeability,
For example, one using porous ceramics produced by impregnating a porous organic material having continuous pores, such as urethane foam, with ceramics, punching a ceramic sheet, or forming fine pores when forming a plastic material. There is known a setter (see Japanese Patent Laid-Open No. 11-79853) manufactured by a method of mechanically punching. In addition, a molded body is made of a spherical organic material having a diameter of several millimeters, the ceramic slurry is injected into the gaps of the obtained spherical organic material molded body and solidified, and then the organic material is removed by firing or the like, and a ceramic having pores is formed. There is also a proposal of a method for producing a setter that obtains a porous body (see JP-A-63-265880).

However, any of the above-mentioned conventional air-permeable setters has a complicated manufacturing process, is inferior in productivity, and is not economical. Further, according to the study of the present inventors, the pore size of the setter having air permeability formed by the conventional method has various sizes and is non-uniform, and at the same time, the shape of the formed pores is complicatedly curved. Because, for example,
When electronic device parts were placed and fired, atmospheric gas was not smoothly ventilated. For this reason, a conventional setter having air permeability has a large number of pores, even if it has many pores.
Alternatively, the ventilation of the atmospheric gas from the inside to the outside is insufficient, and it has been difficult to carry out the firing and the like of the electronic device parts uniformly and stably in all the parts in the setter.

On the other hand, in recent years, metal-based parts, which have been manufactured by the pressure molding method using a press until now, have begun to be manufactured by the injection molding method. In this method, a metal powder material is added to an organic binder (binder).
Injection molding is possible by using a plastic material mixed with, and after obtaining an injection-molded product of the desired shape, this is heat-treated to remove the organic binder, resulting in a precise shape with a complicated shape. Have obtained various metal parts. The applications of delicate metal-based parts obtained by such a method are spreading in various fields. As described above, even in the case of manufacturing such a metal-based component, as in the case of manufacturing the electronic device component described above, the injection-molded product is heat-treated to remove the organic binder. Also in this case, for example, a setter based on a refractory material, an inexpensive setter mainly having a flat plate shape is used.

[0008] Even when firing or the like in the production of metal parts by this injection molding, the organic binder is
It is desired to develop an efficient setter that can be removed at a low temperature in a short time. On the other hand, if a setter having high air permeability can be obtained at low cost, it is possible to improve the productivity of metal-based parts obtained by injection molding.

On the other hand, the inventors of the present invention have a plurality of through-holes, the inner diameters of which are substantially the same in the longitudinal direction, and the average inner diameter of the through-holes is 0.3 to 1 mm.
We have developed a setter whose main component is alumina. Furthermore, when the material of the electronic device parts, etc. reacts with coexisting substances other than the main component, alumina, the content of alumina should be 99% by weight or more to stabilize the parts in contact with the electronic device parts etc. It has been found that a setter coated with zirconia oxide or magnesia is suitable. That is, if such a setter is used, the electronic device parts and the like will not react with the setter material, and a high removal function for organic substances and volatile components that is necessary to obtain high-quality electronic device parts and the like. At the same time, it achieves the uniform temperature distribution required when firing electronic device parts, etc., and also has the function of allowing the atmospheric gas to disperse uniformly inside the setter and to move the gas to the outside easily (smoothly). This is satisfactory, and as a result, electronic device parts and the like that maintain high quality can be obtained stably and with good productivity.

[0010]

However, in the case of a setter coated with zirconia or the like in order to prevent the reaction with the material forming the electronic device parts, etc., a setter having a plurality of through holes is formed. After that, it is necessary to further coat a portion that comes into contact with an electronic device component or the like, and it is difficult to say that the manufacturing method is necessarily simple.

Therefore, an object of the present invention is to solve the above-mentioned problems, and particularly to prevent the reaction with the setter material, which is effective for electronic device parts and the like made of a material which may react with the setter material, Moreover, when used for firing or the like that is performed in the production of electronic device parts, etc., it is possible to realize a uniform temperature distribution inside the setter, a uniform dispersion of atmospheric gas, and easy movement of gas to the outside. An object of the present invention is to provide a setter that can achieve high removal efficiency for organic substances and volatile components that adhere to or remain on device parts. Another object of the present invention is to obtain a setter having excellent functions as described above without requiring a coating treatment step of zirconia or the like on the surface of the setter, which is simple and economical. A method of manufacturing a setter is provided. Further, an object of the present invention is to provide an excellent setter as described above and a manufacturing method thereof, thereby achieving improvement in quality of electronic device parts manufactured by using the setter and improvement in productivity. In the end, it contributes to the improvement of the quality of ceramic electronic device products and the like using these parts and the like.

[0012]

The above object can be achieved by the present invention described below. That is, the present invention is a ceramics setter having a plurality of through-holes, which is used for a heat treatment or a firing step in the production of a ceramics-based electronic device component or in the production of a metal-based component obtained by injection molding. Contains at least 98% by weight of alumina and has a silica (silicon oxide) content of 0.3% by weight
It is below, and its form is that the relative density (bulk density / theoretical density × 100) is 95% or more, and the shape of each of the plurality of through-holes is a linear shape with an inner diameter substantially the same in the longitudinal direction. And the average pore diameter of the inner diameter is 0.3 to 1 mm
It is a ceramics setter characterized by

In a preferred embodiment of the present invention, in the above constitution, the content of alumina is at least 99% by weight.
The ceramics setter and the content of alumina are
A ceramic setter having a content of 99.5% by weight or more can be mentioned. Furthermore, a preferred mode of the present invention is, in the above-mentioned configuration, at least a silica content of 0.3% by weight or less in a portion which is in contact with a ceramic electronic device component or a metal component when these components are accommodated, A ceramics setter coated with 99.5% by weight or more of alumina, a ceramic setter having an external appearance of a plate shape having a plurality of through holes in the above configuration, and an external appearance of the ceramic setter having a plurality of penetrations in the above configuration. A plate-shaped having a hole, a ceramics setter having a convex portion functioning as a spacer on at least one surface thereof, and in the above configuration, the external shape is a tray-shaped consisting of a bottom plate and side walls, A ceramics setter having a plurality of through holes on at least one of the bottom plate and the side wall, or In the above structure,
The ceramic setter having the average pore diameter of 0.3 to 0.5 mm, and the ceramic setter having the porosity of 30 to 70% by volume in the portion having the plurality of through holes in the above-mentioned configuration can be mentioned. .

Another aspect of the present invention is the method for producing a ceramics setter according to any one of the above aspects, which contains at least 98% by weight of alumina and has a silica (silicon oxide) content of 0.3. To the raw material powder that is less than or equal to wt%,
After adding an organic compound to impart plasticity to the raw material powder,
A ceramics setter characterized in that the plasticized raw material powder is formed into a molded product having a desired shape having a plurality of through holes, the molded product is dried, and the dried molded product is fired at a temperature of 1400 to 1700 ° C. Is a manufacturing method. In addition, a preferred embodiment of the present invention has the above-mentioned configuration,
A method for manufacturing a ceramics setter, which calcinates a dried molded product before firing at a temperature of 1700 ° C., and, in the above configuration, after firing at a temperature of 1400 to 1700 ° C., the obtained fired product is formed into a desired shape. In a preferred embodiment of the present invention, the organic compound is a polymer having a weight average molecular weight of 400 to 6,000 in the above-mentioned constitution. .

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in more detail below with reference to preferred embodiments. First, the electronic device component mounted on the setter of the present invention is made of ceramics having various characteristics used for forming various ceramics electronic devices such as the capacitors, piezoelectric elements, and ferrite elements mentioned above. A ceramic member such as a thin film (tape or sheet) and a bulk (having a certain size). Further, similarly, with the delicate metal-based parts obtained by injection molding loaded in the setter of the present invention, after injection molding using a material obtained by adding an organic binder to a metal material such as stainless steel or titanium,
It is a metal member obtained by firing. The setter of the present invention is used for a heat treatment or a firing process performed when these members are manufactured, but is not for electronic device parts having a specific shape or material, and is widely used as a ceramic function. It can be used in all types of conductive materials and metallic materials.

In particular, the above-mentioned electronic device parts are required to have high functionality, and therefore, it is required to stably supply a homogeneous and high quality product. Therefore,
At the stage of firing etc. in the manufacturing process, it is completely prevented that these members react with the material of the setter in which the member is put, or that impurities from the setter are mixed into parts etc. It is important that the processing is done. Of course, when a process such as firing is performed in a state where a plurality of electronic device components and the like are loaded, it is required that the firing and the like be performed on all the components and the like under more uniform conditions. Furthermore, in order to improve the productivity of ceramic-based electronic device products that use electronic device parts, etc., reducing the cost of the setter used in the manufacturing process is an important factor, and the cost of the setter is
It should be cheaper. In the present invention, in the manufacture of electronic device parts and the like, all the above-mentioned problems are solved by improving the constituent materials and forms of the ceramic setter used when the parts and the like are stacked and fired.

First, the constituent materials of the setter of the present invention will be described. The setter of the invention is characterized in that it contains at least 98% by weight of alumina and the content of silica is limited to 0.3% by weight or less. The setter of the invention comprises at least 98% by weight of alumina, preferably at least 99% by weight, more preferably at least 99.5% by weight, so that a particularly high chemical durability of the setter is achieved at high temperatures. It

Further, the constituent material of the setter of the present invention contains at least 98% by weight of alumina as a main component, and the content of silica in the coexisting substance is further limited to 0.1% by weight or less. According to the study by the present inventors, even if the content of alumina is increased to 98% by weight or more, depending on the coexisting substance, the electronic device component or the like reacts with the constituent material of the setter or constitutes the setter. It was found that there are cases where the material may be mixed as impurities into parts and the like.

As a result of a study, the content of silica coexisting with alumina was limited to 0.3% by weight or less, and the relative density (= bulk density / theoretical density × 100) was 95% or more. It has been found that such a structure can almost completely prevent the reaction between the constituent material of the setter and the material of the setter, which may occur especially in electronic device parts. That is, when the relative density of the setter is as high as 95% or more, the setter has a high compaction with a high degree of compaction, and when compared with a setter having a relative density lower than 95%, the constituent material of the setter is obviously , Reacts with electronic device component materials,
It was found that contamination of parts and the like as impurities is suppressed.

Further, according to the study by the present inventors, among the trace amount of coexisting substances contained in the main component alumina,
It was found that the constituent material of the setter was suppressed from reacting with the electronic device component material even when the content of silica was controlled. In particular, the reaction with the constituent materials of the setter, which may occur when firing electronic device parts whose main raw material is lead oxide or titanium oxide, or the constituent materials of the setter are mixed as impurities into these parts or the like. It turns out that doing can be effectively prevented. The smaller the content of coexisting silica, the more preferable. However, according to the study by the present inventors, the content of silica is limited to 0.3% by weight or less with respect to 98% by weight or more of alumina. It turned out that the purpose of can be achieved.

Specific examples of the forming material used in the present invention include powders manufactured by Showa Denko and Sumitomo Chemical Co., Ltd. having an alumina content of 99% by weight. As the particle size of the powder material, it is preferable to use one having an average particle size of 0.3 to 3 μm.

The setter of the present invention has a plurality of through holes, and in addition to being made of the above-mentioned materials, the shape of each through hole is a straight line whose inner diameter is substantially the same in the longitudinal direction, The average pore diameter of the inner diameter is 0.3 to 1 mm, and more preferably 0.3 to 0.5 mm. The specific hole diameter of the through holes may be appropriately determined according to the size of the electronic device component or the like loaded on the setter, but all of these through holes are linear and have a uniform hole diameter. It is preferable that it is That is, the setter of the present invention has a large number of fine holes,
It is characterized by having a so-called honeycomb structure portion.

The setter of the present invention is formed by the method described below. That is, first, the following powdery materials are appropriately added with the following organic compounds to impart plasticity to the powder. After that, the average pore size was 0.
A powder material having this plasticity is obtained by using a die having a honeycomb shape having a linear through hole of a uniform size of 3 to 1 mm (see the enlarged view in FIG. 1) and capable of forming a molded product having a desired shape. Is extruded to obtain a molded product having a plurality of through holes. Next, the obtained molded product is fired to obtain a setter made of an alumina fired base material. The cross-sectional shape of the through hole may be any of rectangle, polygon, circle, ellipse and the like.

The addition ratio of the organic compound used at this time is preferably 3 to 10% by weight with respect to the high-purity alumina powder material. Further, as the organic compound,
Proper plasticity is given to the alumina powder, extrusion molding is possible, and it is possible to easily form a honeycomb-shaped molded product having the above-mentioned through-holes, and yet maintain its shape. Any material may be used as long as it can be removed by a subsequent treatment such as drying or baking. Among them, an organic compound having an appropriate molecular weight and having no organic substance remaining in the setter when firing a molded product having a through hole to form a setter is particularly preferable.

Specifically, the weight average molecular weight is 400 to
In the range of 6,000, it is preferable to use an organic compound having a characteristic that it melts upon heating and exhibits an appropriate viscosity and does not remain after heating and firing. Examples thereof include polyesters and cellulose derivatives containing a large number of oxygen atoms in the molecule, and further polyethylene oxide or polypropylene oxide having an appropriate degree of polymerization, or propylene oxide obtained by copolymerizing an arbitrary amount of ethylene oxide. It is preferred to use polyethers.

Polyether (industrial polyglycol)
Is generally used in nonionic surfactants, lubricants, hydraulic fluids, etc. For example, propylene oxide is mixed with an arbitrary amount of ethylene oxide to prepare a divalent ethylene glycol or propylene glycol. It can be synthesized by copolymerizing an alcohol or a trivalent alcohol such as glycerin or pentaerythritol as an initiator. The polyether having various physical properties can be obtained by appropriately selecting these synthetic materials. Therefore, suitable for the purpose of use of the setter of the present invention,
It is particularly preferable to use polyether because those having good physical properties can be appropriately selected and used. That is, by including an appropriate polyether in the alumina powder, it is possible to obtain a plasticity suitable for extrusion molding when heated to an appropriate temperature, and a molded article having through holes obtained after molding, Since it has an appropriate strength to the extent that it can retain its shape, the subsequent firing operation can be performed well.

According to the method of the present invention, a setter having a desired shape such as the plate shape or the tray shape described above is used, for example, by using the molded product having the through holes obtained as described above. Can be manufactured. First, the molded product is dried at about 30 to 80 ° C., and the dried molded product is processed into a plate-shaped or tray-shaped desired setter shape. The method of manufacturing the setter of is mentioned.
As another method, first, the above-mentioned molded product is
A method of producing the setter of the present invention by firing at ˜1700 ° C. and then processing the obtained fired product into a desired setter shape in the form of a plate or tray. The former method has excellent workability, and a setter having a desired shape can be obtained more easily. On the other hand, if the latter method is used for manufacturing, it is inferior to the former method in terms of workability, but there is an advantage that the degree of freedom in processing accuracy and shape is increased.

As described above, depending on the material used, the setter and the materials such as electronic device parts loaded on the setter may react with each other. In this case, the alumina processed as described above may react. It was necessary to coat the calcinated product consisting of at least a part with which the zirconia or the like comes into contact with the electronic device component during use with a stabilized zirconia. On the other hand, the setter of the present invention, as described above, does not require such coating.
It is possible to effectively prevent the electronic device component or the like from reacting with the setter when firing the electronic device component or the like. However, in order to prevent it more completely, the content of silica is 0.3% by weight or less and 99.5% in the portion that comes into contact with the ceramic electronic device parts when they are stored.
It is also possible to coat it with more than wt% alumina. As a coating method at this time, after preparing an aqueous slurry in which 99.5% by weight or more of alumina powder is dispersed in water, a setter is dipped in the obtained slurry to apply the slurry, or After applying the above-mentioned slurry to a desired portion of
Baking at a temperature of about 00 ° C. may be mentioned.

Next, the shape of the setter of the present invention will be described. FIG. 1 shows a schematic perspective view showing a setter whose appearance is a tray shape, but the present invention is not limited to this, and electronic device parts and the like are loaded on the loading section of the setter,
Any shape may be used as long as it can be fired when manufacturing an electronic device component or the like while being held. Further, the size thereof is not particularly limited, and may be appropriately determined according to the size and number of electronic device parts or the like loaded inside. Since the tray-shaped setter can be used by stacking the setters in stages, firing of electronic device parts and the like can be collectively performed. Further, the setter of the present invention realizes a uniform temperature distribution, a uniform dispersion of atmospheric gas, and a smooth movement to the outside due to its high air permeability even when the setters are used in stages. Therefore, at the same time as productivity is improved, quality is not impaired, and homogeneous and high-quality electronic device parts and the like can be stably obtained.

Further, the setter of the present invention may have the plate shape shown in FIG. 5 or the convex portion shown in FIG. The plate-shaped setter is capable of sufficiently holding parts depending on the shape of electronic device parts to be fired, etc., and is significantly more workable and more economical than the tray-shaped setters described above. There are advantages. Further, if at least one surface of the plate 1 is provided with a convex member 4 having an arbitrary shape that functions as a spacer by adhering or the like to form a plate with a convex portion, even though the plate-shaped setter, the tray described above is used. As in the case of the flat setter, it is possible to use a plurality of setters with protrusions in a row. Even in this case, the high air permeability realizes a uniform temperature distribution and a uniform atmosphere gas, which improves productivity and, at the same time, lowers the cost of homogeneous and high-quality electronic device parts without quality loss. Can be obtained.

In the setter of the present invention, the bottom plate of the plate-shaped setter or tray-shaped setter described above, or at least a part of the bottom plate and the side wall of the tray-shaped setter, in the longitudinal direction of each through hole as described above. A plurality of through holes are provided, in which the inner diameters of all the parts are substantially the same and the average hole diameter of the plurality of through holes is 0.3 to 1 mm.

As the through holes provided in the setter of the present invention, as shown in FIG. 5, when the setter has a plate shape, the through holes 3 are penetrated through the upper and lower surfaces of the plate 1 and substantially all over them. It is preferable to provide. If the setter has a tray shape as shown in FIG.
As shown in FIG. 2, the bottom plate 1 of the tray may be penetrated through the upper and lower surfaces thereof, and the through holes 3 may be provided in substantially the entire surface thereof, or, as shown in FIG. Two
The through holes 3 may be provided in both of them. In the case of a tray-shaped setter, as shown in FIG. 1, it is particularly preferable that the bottom plate 1 or the side wall 2 of the setter is provided with the through hole 3. Furthermore, as shown in FIG.
It is preferable that the direction of the through hole 3 is provided so as to face the inside of the setter on which electronic device components and the like are loaded, because more uniform air permeability can be realized.

As described above, for example, if through holes are provided over substantially the entire surface of the plate-like setter, substantially the entire bottom plate of the tray-like setter, or substantially the entire surfaces of both the bottom plate and the side wall, electronic device parts and the like are mounted. Not to mention the parts,
Since it is possible to achieve high good air permeability in the whole setter, when used in the firing process, etc., it is attached to or contained in the organic substances attached to or contained in the setter itself, or in electronic device parts placed on the setter, etc. Organic matter such as lipids can be removed more quickly. Furthermore, the setter of the present invention, as compared with a conventional setter having air permeability, can realize high air permeability in a significantly excellent and good state, so when firing electronic device parts or the like,
Within the setter, a more uniform temperature distribution, a more uniform dispersion of the atmospheric gas, and a smooth gas transfer to the outside are achieved. As a result, it becomes possible to stably manufacture higher quality electronic device components and the like.

In the setter of the present invention having the above-described shape, since the processing such as firing is performed with the electronic device parts and the like placed on the bottom plate of the plate-shaped or tray-shaped setter provided with the through holes, a minute The size of the through hole must be 1 mm or less so that an electronic device component having a certain size can be supported, but if the size of the through hole becomes too small,
This may impair the intended purpose of the present invention to achieve uniform dispersion of the atmospheric gas and easy movement of the gas to the outside. Therefore, in the present invention, the plurality of through holes provided on the bottom plate of the setter or the like have an average hole diameter of 0.3 mm or more. Further, it is more preferable to configure each setter so that the porosity in the portion where such through holes are provided is 30 to 70% by volume.

[0035]

EXAMPLES The present invention will be described more specifically below with reference to Examples and Comparative Examples. Example 1 In this example, an alumina powder having an average particle size of 1.1 μm and an alumina content of 99% by weight was used as a forming material. The silica content in this alumina powder was 0.2% by weight. As the organic compound contained in the powder, a polyether having a weight average molecular weight of 3,000 obtained by mixing propylene oxide with an arbitrary amount of ethylene oxide and copolymerizing with glycerin as an initiator was used. Then, such a copolymer was added to alumina powder at a ratio of 5% by weight, and mixed and kneaded by an extrusion molding machine to impart plasticity. Using the kneaded product thus obtained, a plurality of through holes each having a straight shape and a square cross section with a diameter of 1 mm were formed in a honeycomb shape by an extrusion molding machine. A molded product was molded. After drying, the temperature was raised to 1620 ° C. under the condition of 60 ° C./hour, and the material was fired at that temperature for 240 minutes to prepare an alumina fired member. The relative density (bulk density / theoretical density × 100) of the obtained alumina calcined member was measured and found to be 96%.

Next, using the obtained alumina calcined member, the side wall and the bottom plate have through holes in the state shown in FIG.
Moreover, the tray-shaped setter of this example was obtained by cutting and grinding so as to obtain a tray-shaped setter as shown in FIG. The obtained setter had a porosity of about 65% in the portion where the through holes were provided, and in that portion, a plurality of linear through holes having a uniform hole diameter were formed in a honeycomb shape. .

For the sake of comparison with the setter of the present example produced as described above, the tray-shaped setters of the following Comparative Examples 1 to 3 were used, and each setter had a tape-like set which was a member for electronic devices. The same amount of lead titanate-lead zirconate based ceramics compacts molded in
Heat treatment was performed up to 00 ° C. The temperature rising condition for heat treatment is 3
It was 0 ° C./hour. Then, in the case where each of the above-mentioned setters was used, the reaction between the lead titanate-lead zirconate-based ceramics compact and the setter (hereinafter simply referred to as reaction) at each heating / firing temperature was compared.

The evaluation method was as follows: For each setter after completion of the heating (baking) treatment at each temperature, the setter surface of the portion in contact with the lead titanate-lead zirconate ceramics was polished by 0.1 mm, The amount of lead oxide on the polished surface was measured with an electron microscope / energy dispersive composition analyzer. Then, the content of lead oxide existing on the surface of the setter and the state of adhesion of the lead titanate-lead zirconate ceramics were evaluated according to the following criteria. The lead oxide content is 0.
When the content is 2% or less, the reaction is not recognized as ◯, the content of lead oxide is 2% or less, and the reaction is slightly recognized when the lead titanate-lead zirconate ceramics are not adhering. If the content of lead oxide exceeds 2%, or if the adhesion of lead titanate-lead zirconate ceramics is recognized, it is evaluated as x. Table 1 shows the obtained results.

The following setters were used for comparison. Comparative Examples 1 to 3 are tray-shaped setters manufactured by the same method as in Example 1, but the forming materials are different,
Each has the following composition and characteristics. Comparative Example 1 is an alumina setter having a silica content of 0.2% by weight and an alumina content of 99%, but a relative density of 92%. In Comparative Example 2, the alumina content was 9
It is an alumina setter with a silica content of 0.6% by weight, although its relative density is 95% at 9% by weight. Comparative Example 3 is an alumina setter having an alumina content of 99% by weight, a silica content of 0.6% by weight, and a relative density of 92%.

[0040]

As is clear from Table 1, when each of the setters of Comparative Examples 1 to 3 was used, the heating temperature was 1200 ° C.
While the reaction was observed above, when the setter of Example 1 was used, no reaction was observed even at a heating temperature of 1300 ° C. When the organic substances remaining in the ceramic molded body were measured, they were completely removed by any setter. As a result,
Because the materials such as electronic device parts react with the setter,
Unlike the conventional setters of Comparative Examples 1 to 3, in which the surface of the setter had to be coated with zirconia or the like,
It was confirmed that the setter of the present example can heat without reacting even when firing the electronic device component as described above.

<Embodiment 2> In this embodiment, as a forming material, the average particle diameter is 1.0 μm and the alumina content is 99.5.
A molded product having through-holes was prepared in the same manner as in Example 1 except that a powder having a weight% and a silica content of 0.1% by weight was used, and then a tray as shown in FIG. A shape setter was formed. The relative density (bulk density / theoretical density × 100) of the obtained alumina calcined member was measured and found to be 97%. Further, a lead titanate-based ceramics compact was loaded on the setter obtained above, and fired at 1350 ° C. at the same temperature rising rate as in Example 1. Then, when the content ratio of lead oxide and titanium oxide was measured for the lead titanate-based ceramics molded body after the firing treatment, there was no change in the composition of lead oxide and titanium oxide. Also,
For the surface portion of the setter that was in contact with the lead titanate-based compact, the content of lead oxide was measured in the same manner as in Example 1. As a result, also in the case of the setter of this example, no reaction with the lead titanate-based ceramics was observed,
It was confirmed that the setter of this example was useful as a setter for firing ceramic-based electronic device parts, even though it was not coated with zirconia.

[0043]

As described above, the setter according to the present invention is particularly effective for electronic device parts or the like made of a material that may react with the setter material and reacts with the setter material. In addition, it is possible to prevent even temperature distribution inside the setter, even distribution of atmospheric gas, and easy movement of gas to the outside when used for firing or the like performed in manufacturing electronic device parts. Provided is a setter that can be realized and that can achieve high removal efficiency for organic substances and volatile components that are attached or remain on electronic device components and the like. Further, according to the method of the present invention,
In particular, there is provided a method of manufacturing a setter that does not require coating of zirconia or the like on the surface of the setter and that is highly economical. Furthermore, according to the present invention, by providing a setter having the above-mentioned excellent functions, it is possible to obtain a high-quality electronic device component or the like stably and with high productivity. As a result, it is possible to contribute to the improvement of the quality and productivity of the ceramic electronic device products using electronic device parts and the like.

[Brief description of drawings]

FIG. 1 is a schematic perspective view of a tray-shaped setter of the present invention.

FIG. 2 is a partial perspective view showing a cut surface of an example of the tray-shaped setter of the present invention.

FIG. 3 is a partial perspective view showing a cut surface of another example of the tray-like setter of the present invention, in which a bottom plate and a part of a side wall thereof are shown in cross section.

FIG. 4 is a partial perspective view showing a cut surface of another example of the tray-shaped setter of the present invention, in which a bottom plate and a part of a side wall thereof are shown in cross section.

FIG. 5 is a perspective view of an example of a plate-shaped setter of the present invention.

FIG. 6 is a perspective view of another example of the plate-shaped setter of the present invention.

[Explanation of symbols]

1: Bottom plate 2: Side wall 3: Through hole 4: Convex member

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI Theme Coat (reference) H01G 13/00 351 C04B 35/10 F (72) Inventor Yoshiyuki Izumi Mizuno Kitaura-cho, Kamezaki, Handa-shi, Aichi Prefecture 46 Address Mino Ceramics Co., Ltd. Technical Research Institute (72) Inventor Michichi Haga 1-chome, Kamezaki Kitaura-cho, Handa City, Aichi Pref. No. 19 No. 1 Stock company F-term in Motoyama (reference) 4G030 AA36 AA37 BA25 GA15 GA27 GA35 4K055 AA06 AA08 HA02 HA07 HA14 HA23 HA25 HA27 5E082 AA01 AB03 MM13 MM22 MM24 PP03

Claims (13)

[Claims] 1. A ceramic setter having a plurality of through-holes, which is used in a heat treatment or a firing step in the production of a ceramic electronic device component or a metal component obtained by injection molding, and the constituent material is at least It contains 98% by weight of alumina, the content of silica (silicon oxide) is 0.3% by weight or less, and its form is 95% in relative density (bulk density / theoretical density × 100).
Above, each shape of the plurality of through holes,
A ceramic setter characterized in that the inner diameters thereof are substantially linear in the longitudinal direction and the average hole diameter of the inner diameters is 0.3 to 1 mm. 2. The content of alumina is at least 9
The ceramic setter according to claim 1, which is 9% by weight. 3. The ceramic setter according to claim 1, wherein the content of the alumina is 99.5% by weight or more. 4. A silica content of at least 0.3% by weight in a portion which is in contact with at least the ceramic-based electronic device component or the metal component when the component is accommodated.
The ceramic setter according to any one of claims 1 to 3, which is coated with 9.5% by weight or more of alumina. 5. The ceramic setter according to claim 1, wherein the external shape is a plate shape having a plurality of through holes. 6. The ceramic according to claim 1, wherein the external shape is a plate shape having a plurality of through holes, and at least one surface thereof has a convex portion functioning as a spacer. Setter. 7. The outer shape thereof is a tray shape composed of a bottom plate and a side wall, and a plurality of through holes are provided in at least one of the bottom plate and the side wall. Ceramic setter described in. 8. The ceramic setter according to claim 1, wherein the average pore size is 0.3 to 0.5 mm. 9. The ceramic setter according to claim 1, wherein a porosity of a portion provided with a plurality of through holes is 30 to 70% by volume. 10. The method of manufacturing a ceramics setter according to claim 1, wherein at least 9
An organic compound is added to a raw material powder containing 8% by weight of alumina and having a silica (silicon oxide) content of 0.3% by weight or less to impart plasticity to the raw material powder, and then the plasticized raw material powder To a molded product having a desired shape having a plurality of through holes, the molded product is dried, and the dried molded product is
A method of manufacturing a ceramics setter, which comprises firing at a temperature of 0 to 1700 ° C. 11. The method for producing a ceramics setter according to claim 10, wherein the dried molded product is calcined before firing at a temperature of 1400 to 1700 ° C. 12. The method for producing a ceramics setter according to claim 10, further comprising a step of processing the obtained fired product into a desired shape after firing at a temperature of 1400 to 1700 ° C. 13. The organic compound has a weight average molecular weight of 400.
It is a polymer of -6,000, The manufacturing method of the ceramics setter in any one of Claims 10-12.