JP2003305824A - Solder paste stencil printing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a solder paste stencil printing apparatus for minimizing the residual amount of solder paste. <P>SOLUTION: The solder paste stencil printing apparatus includes a support member (20), a stencil (10) having a large number of stencil aperture parts (11) held by the support member and at least one vibrator (40) for vibrating the stencil. At the time of operation, a base plate (50) is arranged on the bottom surface of the stencil (10) and the aperture parts (11) of the stencil (10) are filled with solder paste and the base plate (50) is slowly separated from the stencil (10) during the vibration of the vibrator (40). <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to solder paste stencil printing, and more particularly to a device for solder paste stencil printing that minimizes solder paste residue.

[0002]

2. Description of the Related Art Solder paste stencil printing is a technique for depositing solder on a substrate (object to be printed) such as a printed circuit board. When attaching the electric component to the substrate, the solder adhered between the substrate and the electric component becomes a conductor that electrically connects the substrate and the electric component.

Referring to FIG. 9, a conventional solder paste stencil printing apparatus mainly includes a stencil 70,
A support member 72 for holding the stencil 70 and a squeegee 73 are included. During operation, the substrate 80 is placed on the bottom surface of the stencil 70. Solder paste 74 (shown in FIG. 10A) is placed on the top surface of stencil 70. At this time, as shown in FIG. 10A, the squeegee 73 flattens the solder paste 74 so that the stencil opening 71 provided in the stencil 70 is filled with the solder paste 74. Referring to FIGS. 10B and 10C,
The substrate 80 and the stencil 70 are slowly separated so that most of the solder paste 74 is pulled out of the stencil opening 71 and deposited on the substrate 80 due to viscosity and gravity. At the same time, a portion of the solder paste 74 adheres to the inner surface defining the stencil opening 71, forming a residue 75.

However, the stencil opening 71 provided in the stencil 70 has a large aspect ratio (= depth / width).
, The amount of the residue 75 increases, and as a result, the amount of the solder paste 74 attached decreases. Therefore, two major problems arise from this reduction. First
In addition, after the stencil printing is performed several times, the stencil opening 71 is easily closed by the residue 75. Second
In addition, the insufficient amount of the solder paste 74 adhered to the substrate 80 causes the performance of the substrate 80, or more specifically, the substrate 80
The electrical conductivity between the electric component and the electric component arranged thereon is impaired.

Therefore, in order to overcome the above problems, current solder paste stencil printing mainly focuses on two solutions. First, the substrate 80 and stencil 7
By slowly performing the separation step from 0, the amount of the residue 75 is reduced because the viscosity and gravity pull a large amount of the solder paste 74 from the stencil opening 71. Second
11, the roller 90 is used for cleaning the stencil opening 71, and as shown in FIG. 12, the cloth 91 and the blowing means are used to clean the stencil opening 71.
Used to drive out remnants 75 from. However, none of these methods provide a complete solution to the above problem. After each stencil printing operation, the remnant 75 still adheres somewhat to the inner surface defining the stencil opening 71.

[0006]

SUMMARY OF THE INVENTION It is, therefore, an object of the present invention to provide a solder paste stencil printing apparatus which minimizes solder paste residue. That is, the object of the present invention is to prevent clogging of the stencil opening, as compared with a conventional similar stencil printing apparatus,
It is an object of the present invention to provide a solder paste stencil printing apparatus that minimizes the amount of solder paste that remains adhered to the stencil openings so that the number of times required to clean the stencil can be reduced. Moreover, the solder paste is uniformly and completely applied to the substrate so that a high quality substrate can be produced.

[0007]

In order to achieve these objects, a solder paste stencil printing apparatus mainly
It includes a support member, a stencil held by the support member, and at least one vibrator for vibrating the stencil. The stencil is provided with a plurality of stencil openings.

In operation, a substrate is placed on the bottom surface of the stencil and solder paste is placed on the top surface of the stencil. When slowly separating the stencil from the substrate, to minimize adhesion of the solder paste to the stencil opening, the solder paste is applied to the substrate through the stencil opening while the vibrator is vibrating. Attach it.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENT Referring to FIG. 1, a solder paste stencil printing apparatus for minimizing the residue of a solder paste according to the present invention mainly comprises a stencil 10, a supporting member 20, a squeegee 30, and a vibrator 40. Including.

The stencil 10 is provided with a plurality of stencil openings 11 at predetermined positions, and the stencil openings 11 are tapered to have a small top opening and a large bottom opening, as shown in FIG. 2A. Has become.

The support member 20 includes a frame 22 and two elongated bases 24. Stencil 10 is frame 22
The frame 22 is held by a plurality of connecting members 26.
Is firmly connected to the base 24.

As shown in FIG. 2A, the squeegee 30 is used to evenly place the solder paste 60 on the stencil 10 so that the stencil opening 11 is filled with the solder paste 60.

The vibrator 40 is a device that can vibrate the stencil 10 horizontally, vertically, or diagonally at a preferred frequency in the range of 2 Hz to 20 Hz. This allows the remaining solder paste adhered on the inner surface defining the stencil opening 11 to be removed. The vibrator 40 can be attached to either the stencil 10, the support member 20, or the squeegee 30. In the first embodiment shown in FIG. 1, the vibrator 40 includes two loudspeakers 41 and two rods 42, the rods 42 connecting two opposite side edges of the frame 22, the loudspeakers 41 being connected to the rods 42. It is installed.

Referring to FIGS. 2A-2C, during operation, the substrate 50 should be aligned so that the locations on the substrate 50 to which the solder paste 60 will later adhere are aligned with the stencil openings 11.
Is located on the bottom surface of the stencil 10. The solder paste 60 is placed on the top surface of the stencil 10 so that the stencil opening 11 is filled with the solder paste 60.
The squeegee 30 is used to slide the top surface several times from front to back. Next, the substrate 50 is solder paste 60.
Are slowly separated from the stencil 10 so that they are drawn out by the gravity and viscosity and adhere to the substrate 50.
During this deposition step, to aid in completely removing the solder paste 60 from the stencil opening 11, in other words, it adheres to the inner surface defining the stencil opening 11 and minimizes the amount of solder paste remaining. Therefore, each speaker 41 generates a sound wave that vibrates the stencil 10. Therefore, the solder paste 60 is completely deposited on the substrate 50 so that the finished substrate is of high quality. Furthermore, in order to minimize the amount of solder paste remaining, a cleaning step using rollers 90 and cloth 91 as shown in FIGS. 11 and 12 is no longer necessary, or at least the number of times required to clean stencil 10 is conventionally reduced. Compared to other solder paste stencil printing equipment.

Referring to FIGS. 3 and 4, there is shown a second embodiment of the invention in which the vibrator 40 is replaced by two vibrators 40 'and the other parts remain the same as in the first embodiment. ing. Each vibrator 40 ′ includes a support plate 411 ′ arranged around the stencil 10,
Two coils 412 'mounted on a support plate 411'
And the coil is connected to another coil and has ends connected to the anode and cathode of the power supply, respectively, as shown in FIG. Each vibrator 40 ′ also has a frame 2
It includes two first rods 43 'connecting the two side edges, each first rod 43' having a first magnetic assembly 42 'attached thereto. Three first magnets 42
1'included in each first magnetic assembly 42 ',
As shown in, the adjacent first magnets 421 'are arranged such that their magnetic poles are opposite to each other. Further, the first magnets 421 ′ are arranged so that the coils 412 ′ are located directly below the space sandwiched between the adjacent first magnets 421 ′. Therefore, when the coil 412 ′ is energized during operation, a magnetic field is temporarily formed according to Fleming's left-hand rule, and the stencil 10 vibrates vertically due to the interaction with the magnet 421 ′.

With further reference to FIGS. 7 and 8, there is shown a third embodiment of the present invention. In this embodiment, the first
Two additional rods 43 ″ are provided to connect the rods 43 ′ of each of the second rods 43 ″. Each second rod 43 ″ includes a second magnetic body assembly 42 ″, and each second magnetic body assembly 42 ″.
Includes three second magnets 412 ″, the second magnet 42
1 ″ is arranged in the same manner as described for the first magnet 421 ′. Therefore, the third embodiment is designed so that the vibration of the stencil 10 is enhanced as compared to the second embodiment. Instead of four, four second magnetic body assemblies 4
Including 2 ".

From the above description, the solder paste stencil printing apparatus of the present invention that minimizes solder paste residue has the following advantages: The amount of residual solder paste adhered to the inner surface defining the stencil opening 11 is minimized so that the number of times the stencil 10 can be cleaned after work is reduced compared to conventional solder paste stencil printing equipment. To do. 2. The solder paste 60 adheres to the substrate 50 completely and uniformly so that the quality of the finished substrate is high.

[Brief description of drawings]

FIG. 1 is a perspective view of a first embodiment of the present invention.

2A, 2B and 2C are diagrams showing a series of operations of the first embodiment.

FIG. 3 is an exploded perspective view of a second embodiment of the present invention.

FIG. 4 is a plan view of the second embodiment after assembly.

FIG. 5 is a partially enlarged plan view showing a coil according to a second embodiment.

FIG. 6 is a plan view showing a magnet and a coil according to a second embodiment.

FIG. 7 is an exploded perspective view of a third embodiment of the present invention.

FIG. 8 is a plan view of the third embodiment after assembly.

FIG. 9 is a perspective view of a conventional solder paste stencil printing apparatus.

10A, 10B, and 10C are views showing a series of operations of a conventional solder paste stencil printing apparatus.

FIG. 11 is a diagram showing a cleaning operation of a conventional solder paste stencil printing apparatus using a roller.

FIG. 12 is a diagram showing a cleaning operation of a conventional solder paste stencil printing apparatus using a cloth and a blowing unit.

[Explanation of symbols]

10 stencil 11 Stencil opening 20 Support member 22 frames 24 elongated base 26 Connection member 30 squeegee 40, 40 'vibrator 41 speakers 411 'support plate 412 'coil 42,43'43 "rod 42 ', 42 "magnetic assembly 421 ', 421 "magnets 50 substrates 60 solder paste

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor ▲ Kure ▼ Sho Taka             Taiwan Taoyuan County Bamboo Town Xinxiang Village Daxin Road 814 No. 92 (72) Inventor ▲ Yellow ▼ Deoksam             Taiwan Taoyuan County Bamboo Town Xinxiang Village Daxin Road 814 No. 92 (72) Inventor Liang Kou             Taiwan Taoyuan County Bamboo Town Xinxiang Village Daxin Road 814 No. 92 (72) Inventor Zhang Jian             Taiwan Taoyuan County Bamboo Town Xinxiang Village Daxin Road 814 No. 92 F-term (reference) 2C035 AA06 FD01                 5E319 AA03 AC01 BB05 CD29 GG15

Claims (12)

[Claims] 1. A support member and a member held by the support member,
A solder paste stencil printing apparatus including a stencil having a plurality of stencil openings and at least one vibrator for vibrating the stencil, wherein a substrate is arranged on the bottom surface of the stencil during operation and the solder paste is applied to the stencil. Placed on the top surface of the, by slowly separating the stencil from the substrate while vibrating the vibrator, the solder paste adheres to the substrate through the stencil opening,
A solder paste stencil printing device in which the solder paste adhered to the stencil opening is minimized. 2. The solder paste stencil printing apparatus according to claim 1, further comprising a squeegee for evenly leveling the solder paste and filling the stencil opening with the solder paste. 3. The solder paste stencil printing apparatus according to claim 1, wherein the vibrator is a speaker. 4. The solder paste stencil printing apparatus according to claim 3, wherein the speaker is attached to the support member. 5. The supporting member includes a frame and a plurality of elongated bases, the stencil is held on the frame, and the frame is rigidly connected to the elongated bases by a plurality of connecting members. The solder paste stencil printing device according to claim 1. 6. The vibrator includes at least one magnetic body assembly, a support plate is disposed around the stencil, at least one coil is mounted on the support plate, and when the coil is energized, The solder paste stencil printing apparatus according to claim 1, wherein a temporary magnetic field is formed and interacts with the magnetic assembly so as to vibrate the stencil. 7. The supporting member includes a frame and a plurality of elongated bases, the stencil is held on the frame, and the frame is rigidly connected to the elongated bases by a plurality of connecting members. The solder paste stencil printing apparatus according to claim 6. 8. At least one rod connecting two side edges of said frame, said at least one magnetic assembly being attached to said rod.
The solder paste stencil printing device according to claim 7. 9. The solder paste stencil printing apparatus according to claim 1, wherein the vibrator vibrates the stencil horizontally. 10. The solder paste stencil printing apparatus according to claim 1, wherein the vibrator vibrates the stencil vertically. 11. The solder paste stencil printing apparatus according to claim 1, wherein the vibrator vibrates the stencil obliquely. 12. The solder paste stencil printing device of claim 1, wherein the vibrator vibrates the stencil at a preferred frequency in the range of 2 Hz to 20 Hz.