JP2003305656A - Cutting wheel - Google Patents

Cutting wheel

Info

Publication number
JP2003305656A
JP2003305656A JP2002112509A JP2002112509A JP2003305656A JP 2003305656 A JP2003305656 A JP 2003305656A JP 2002112509 A JP2002112509 A JP 2002112509A JP 2002112509 A JP2002112509 A JP 2002112509A JP 2003305656 A JP2003305656 A JP 2003305656A
Authority
JP
Japan
Prior art keywords
abrasive grains
substrate
cutting wheel
abrasive
circumferential direction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2002112509A
Other languages
Japanese (ja)
Other versions
JP3732150B2 (en
Inventor
Daisuke Ide
大介 井手
Seiya Ogata
誠也 緒方
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Noritake Co Ltd
Noritake Super Abrasive Co Ltd
Original Assignee
Noritake Co Ltd
Noritake Super Abrasive Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Noritake Co Ltd, Noritake Super Abrasive Co Ltd filed Critical Noritake Co Ltd
Priority to JP2002112509A priority Critical patent/JP3732150B2/en
Publication of JP2003305656A publication Critical patent/JP2003305656A/en
Application granted granted Critical
Publication of JP3732150B2 publication Critical patent/JP3732150B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

<P>PROBLEM TO BE SOLVED: To suppress the degradation of sharpness caused by the abrasion of abrasive grains by intentionally changing the projecting height of the abrasive grains in a cutting wheel with the abrasive grains stuck to a base by a brazing method. <P>SOLUTION: In the cutting wheel with the abrasive grains 2 arranged in one layer and brazed on the outer peripheral surface and the outer peripheral part side face of the disk-shaped base 1, the abrasive grains 2a, 2b, 2c different in average grain diameter are regularly arranged in the circumferential direction of the base within the abrasive grain layer forming range of the outer peripheral surface of the cutting wheel, and the abrasive grains are stuck in such a manner that the projecting height of the abrasive grains differs in a fixed pattern in the circumferential direction of the base. Stable sharpness can thereby be obtained with almost no fluctuation of sharpness in the circumferential direction of the base throughout the service period of the cutting wheel. <P>COPYRIGHT: (C)2004,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【発明の属する技術分野】本発明は、コンクリート、コ
ンクリート二次製品、セメント系建材、窯業系建材など
の切断に用いられる切断ホイールにかかり、詳しくは、
ろう付けにより基板に一層配列する砥粒の配列を改良し
てホイールの切れ味と寿命を向上させた切断ホイールに
関する。
TECHNICAL FIELD The present invention relates to a cutting wheel used for cutting concrete, concrete secondary products, cement-based building materials, ceramic-based building materials, and the like.
The present invention relates to a cutting wheel in which the sharpness and life of the wheel are improved by improving the arrangement of abrasive grains that are further arranged on a substrate by brazing.

【0002】[0002]

【従来の技術】コンクリート、コンクリート二次製品、
セメント系建材、窯業系建材などの切断用として、円盤
状の基板の外周面および外周部側面に砥粒をろう付け法
により一層配列した切断ホイールが使用されている。こ
のような切断ホイールには、切れ味に優れ、しかもその
切れ味が長期にわたって安定的に持続することが要求さ
れる。ところが、切断ホイールは切断作業の進行に伴い
切れ味と寿命が低下する。
2. Description of the Related Art Concrete, secondary concrete products,
BACKGROUND ART For cutting cement-based building materials, ceramic-based building materials, etc., a cutting wheel in which abrasive grains are further arranged by a brazing method on the outer peripheral surface and the outer peripheral side surface of a disk-shaped substrate is used. Such a cutting wheel is required to have excellent sharpness and to maintain the sharpness stably for a long period of time. However, the cutting wheel deteriorates in sharpness and life as the cutting work progresses.

【0003】その主な原因として、基板への砥粒の固着
状態が不安定で砥粒が脱落しやすいこと、チップポケッ
トが小さいこと、砥粒間隔のコントロールが不十分なた
めに切断作業中に切粉によって目詰まりが生じることが
挙げられる。とくに砥粒間隔に関しては、基板の表面に
砥粒を所定の配列状態に配設するのが難しく、砥粒どう
しが近接した状態にある部分においては、切粉が排出さ
れにくく、切れ味の低下につながる。
The main causes thereof are that the adhered state of the abrasive grains on the substrate is unstable and the abrasive grains are likely to fall off, the chip pocket is small, and the control of the abrasive grain interval is insufficient, so that during cutting work. It is possible that the chips cause clogging. Especially regarding the abrasive grain interval, it is difficult to arrange the abrasive grains in a predetermined arrangement state on the surface of the substrate, and in the portion where the abrasive grains are in close proximity to each other, cutting chips are difficult to be discharged, resulting in a decrease in sharpness. Connect

【0004】ろう付け法による切断ホイールの製造にお
いて、砥粒を均一に分散させるための方策として、特開
平9−19867号公報には、金属被覆したダイヤモン
ド砥粒を基板外周面と金型の間隙に充填し、基板と金型
を加熱しながら銀ろうを間隙に溶浸させる切断ホイール
の製造方法が開示されている。また特開平10−118
937号公報には、1個または集合した複数個の超砥粒
の一層によって作用砥粒を形成し、作用砥粒間の外周方
向の間隔を作用砥粒の粒径以上とした切断ホイールが記
載されている。
As a measure for uniformly dispersing abrasive grains in the production of a cutting wheel by the brazing method, Japanese Patent Laid-Open No. 9-19867 discloses a method in which metal-coated diamond abrasive grains are used to form a gap between a substrate outer peripheral surface and a die. A method for manufacturing a cutting wheel is disclosed, in which the silver brazing material is infiltrated and the substrate and the mold are heated and the silver solder is infiltrated into the gap. In addition, JP-A-10-118
Japanese Patent No. 937 describes a cutting wheel in which working abrasive grains are formed by a single layer of one or a plurality of superabrasive grains, and the distance between the working abrasive grains in the outer circumferential direction is equal to or larger than the grain size of the working abrasive grains. Has been done.

【0005】[0005]

【発明が解決しようとする課題】ところで、ろう付け法
により砥粒を基板外周面に固着した従来の切断ホイール
においては、基板外周面からの砥粒の突き出し高さが均
一となるようにツルーイングなどにより調整されてい
る。突き出し高さを均一にするのは、切断時の負荷を均
一に分散させるためと、振動を低減させてチッピングを
小さくする、という理由からである。ツルーイングによ
る調整を行わない場合は、突き出し高さが異なる砥粒が
存在することになるが、不規則に散在しているため切れ
味が不安定になる。
By the way, in the conventional cutting wheel in which the abrasive grains are fixed to the outer peripheral surface of the substrate by the brazing method, truing or the like is performed so that the protrusion height of the abrasive grains from the outer peripheral surface of the substrate becomes uniform. Has been adjusted by. The reason why the protrusion height is made uniform is that the load at the time of cutting is evenly distributed and that the vibration is reduced to reduce chipping. When the adjustment by truing is not performed, abrasive grains having different protrusion heights are present, but the sharpness becomes unstable because they are irregularly scattered.

【0006】しかし、砥粒の突き出し高さが均一である
と、切断ホイールの使用に伴って砥粒の摩耗が進行する
と、被切断材への食い込みが悪くなるとともに、チップ
ポケットが狭くなって切粉の排出性が悪くなる。特開平
10−118937号公報に記載の切断ホイールのよう
にスリットを設けるのは切粉の排出性を良くするためで
あるが、この場合でも砥粒の摩耗による被切断材への食
い込みの悪さを防ぐことはできない。
However, if the protrusion height of the abrasive grains is uniform, as the abrasion of the abrasive grains progresses with the use of the cutting wheel, the bite into the material to be cut becomes worse and the chip pocket becomes narrower. Poor discharge of powder. The slit is provided like the cutting wheel described in Japanese Patent Application Laid-Open No. 10-118937 in order to improve the discharging property of the chips, but in this case as well, the poor cutting into the material to be cut due to the abrasion of the abrasive grains It cannot be prevented.

【0007】本発明が解決すべき課題は、ろう付け法に
よって砥粒を基板に固着した切断ホイールにおいて、砥
粒の突き出し高さを意図的に変化させることによって、
砥粒の摩耗による切れ味の低下を抑制することにある。
The problem to be solved by the present invention is to intentionally change the protrusion height of abrasive grains in a cutting wheel in which abrasive grains are fixed to a substrate by a brazing method.
It is to suppress the deterioration of sharpness due to abrasion of abrasive grains.

【0008】[0008]

【課題を解決するための手段】本発明に係る切断ホイー
ルは、円盤状の基板の外周面および外周部側面に砥粒を
一層配列してろう付けした切断ホイールにおいて、基板
外周面の砥粒層形成範囲内に平均粒径の異なる砥粒が基
板周方向に規則的に配列されて、基板周方向に砥粒の突
き出し高さが一定のパターンで異なるように砥粒が固着
された切断ホイールである。
A cutting wheel according to the present invention is a cutting wheel in which abrasive grains are arrayed and brazed on the outer peripheral surface and the outer peripheral side surface of a disk-shaped substrate, and the abrasive layer is formed on the outer peripheral surface of the substrate. A cutting wheel in which abrasive grains with different average particle diameters are regularly arranged in the formation range in the substrate circumferential direction, and the abrasive grains are fixed so that the protrusion height of the abrasive grains in the substrate circumferential direction varies in a fixed pattern. is there.

【0009】砥粒として平均粒径の異なる複数種類の砥
粒を使用して、基板周方向に砥粒の突き出し高さが異な
るようにしたことにより、ホイールの使用によって先ず
突き出し高さが最も高い最大粒径の砥粒が最初に摩耗
し、次に二番目に粒径の大きい砥粒が切断に作用し、以
下順次粒径の小さい砥粒が切断に作用することによっ
て、使用初期の切断能率を維持しながら、ホイールの寿
命を延ばすことができる。この際、砥粒の突き出し高さ
が基板周方向に一定のパターンで異なるように、平均粒
径の異なる砥粒を基板周方向に規則的に配列することに
より、ホイールの使用期間を通じて基板周方向の切れ味
の変動がほとんどなく、安定した切れ味が得られる。
By using a plurality of types of abrasive grains having different average grain sizes as the abrasive grains so that the protrusion heights of the abrasive grains are different in the circumferential direction of the substrate, the protrusion height is first increased by using the wheel. The abrasive grain with the maximum grain size wears first, the abrasive grain with the second largest grain size acts on the cutting, and the abrasive grains with the smallest grain size subsequently act on the cutting, so that the cutting efficiency at the initial stage of use You can extend the life of the wheel while maintaining. At this time, by regularly arranging the abrasive grains having different average particle diameters in the substrate circumferential direction so that the protrusion heights of the abrasive grains are different in a constant pattern in the substrate circumferential direction, the substrate circumferential direction can be maintained during the period of use of the wheel. Stable sharpness can be obtained with almost no change in sharpness.

【0010】ここで、前記砥粒の突き出し高さの差が、
最小の平均粒径の20〜100%の範囲内とするのが望
ましい。平均粒径が最小の砥粒と最大の砥粒の粒径差が
2倍を超えると、最大の粒径の砥粒を保持していたろう
材が、最小の粒径の砥粒が作用する前に被切断材に接触
して切れ味低下となるので好ましくない。一方、ホイー
ルの寿命延長のためには、少なくとも最小の平均粒径の
20%以上の突き出し高さの変化があるのが好ましい。
突き出し高さの変化が最小の平均粒径の20%より小さ
いと従来の均一な突き出し高さのものと大差がないもの
となる。
Here, the difference in protrusion height of the abrasive grains is
It is desirable to set it within the range of 20 to 100% of the minimum average particle size. If the difference in particle size between the smallest and largest average grain size exceeds two times, the brazing material that has held the largest grain size will remain before the brazing material with the smallest grain size acts. Furthermore, it is not preferable because it comes into contact with the material to be cut and the sharpness is reduced. On the other hand, in order to extend the life of the wheel, it is preferable that there is a change in protrusion height of at least 20% of the minimum average particle size.
When the change in protrusion height is smaller than 20% of the minimum average particle diameter, there is no great difference from the conventional protrusion height.

【0011】さらに詳しくは、基板外周面の砥粒の配列
が周方向に一列の場合は、周方向に粒径の大きい順に砥
粒を配列する。砥粒の配列が周方向に二列以上の場合
は、列内では周方向に粒径の大きい順に砥粒を配列し、
隣り合う列とは配列順を揃えるか、または、配列順を砥
粒1個分づつずらした配列とする。このような配列とす
ることにより、粒径の大きい砥粒から順次粒径の小さい
砥粒が切断に作用することによって、使用初期の切断能
率を維持しながら、ホイールの寿命を延ばすことができ
る。
More specifically, if the abrasive grains on the outer peripheral surface of the substrate are arranged in a line in the circumferential direction, the abrasive grains are arranged in the circumferential direction in descending order of grain size. If the arrangement of the abrasive grains is two or more rows in the circumferential direction, the abrasive grains are arranged in the row in the circumferential direction in descending order of grain size,
The adjacent rows are arranged in the same order, or the arrangement order is shifted by one abrasive grain. With such an arrangement, the abrasive grains having a large grain size sequentially act on the grains having a small grain size to cut, whereby the life of the wheel can be extended while maintaining the cutting efficiency in the initial stage of use.

【0012】[0012]

【発明の実施の形態】図1および図2は本発明の第1の
実施形態の切断ホイールを説明する図であり、図1の
(a)は切断ホイールの正面図、(b)は(a)のA−
A線断面図であり、図2は基板周方向にみた一部の拡大
図である。図中、砥粒および砥粒の配置は模式的に示し
ている。
1 and 2 are views for explaining a cutting wheel according to a first embodiment of the present invention. (A) of FIG. 1 is a front view of the cutting wheel, (b) is (a) thereof. ) A-
FIG. 2 is a cross-sectional view taken along the line A, and FIG. 2 is an enlarged view of a part viewed in the substrate circumferential direction. In the figure, the abrasive grains and the arrangement of the abrasive grains are schematically shown.

【0013】本実施形態の切断ホイール10は、コンク
リートやセメント系建材などの切断用のホイールであ
る。基板1は外径100mm、厚さ1.2mmのスチー
ル製基板である。砥粒2はダイヤモンド砥粒で、それぞ
れ平均粒径が異なる大砥粒2a、中砥粒2b、小砥粒2
cからなる。ろう材3はAg−Cu−Ti系の活性金属
入りろうである。
The cutting wheel 10 of this embodiment is a wheel for cutting concrete or cement-based building materials. The substrate 1 is a steel substrate having an outer diameter of 100 mm and a thickness of 1.2 mm. Abrasive grain 2 is a diamond abrasive grain, and a large abrasive grain 2a, a medium abrasive grain 2b, and a small abrasive grain 2 having different average grain sizes.
It consists of c. The brazing material 3 is an Ag-Cu-Ti-based active metal-containing brazing material.

【0014】基板1の外周部には切粉排出のためのスリ
ット11が形成され、各スリット11の間に砥粒2が配
設されている。基板1の外周面には、図3に示すよう
に、砥粒2が1〜3列に基板周方向に間隔をおいて配設
され、外周部側面には砥粒2が2列に配設され、ろう材
3により基板1に固着されている。
Slits 11 for discharging chips are formed on the outer periphery of the substrate 1, and abrasive grains 2 are arranged between the slits 11. As shown in FIG. 3, on the outer peripheral surface of the substrate 1, abrasive grains 2 are arranged in 1 to 3 rows at intervals in the circumferential direction of the substrate, and on the outer peripheral side surface, the abrasive grains 2 are arranged in 2 rows. And is fixed to the substrate 1 by the brazing material 3.

【0015】つぎに外周面の砥粒2の配列について説明
する。本実施形態の切断ホイール10においては、図2
の部分拡大図に示すように、ホイール回転方向(図中、
矢印で示す)の前部から後部に向けて粒径の大きい順に
大砥粒2a、中砥粒2b、小砥粒2cが順次繰り返して
配列され、全体として粒径の異なる砥粒2が基板周方向
に規則的に配列されて、基板周方向に砥粒2の突き出し
高さが一定のパターンで異なるように大砥粒2a、中砥
粒2b、小砥粒2cが配列されている。これにより、ホ
イールの使用によって先ず突き出し高さが最も高い大砥
粒2aが最初に摩耗し、次に二番目の高さの中砥粒2b
が切断に作用し、次いで三番目の高さの小砥粒2cが切
断に作用することによって、所定の切断能率を維持しな
がら、ホイールの寿命を延ばすことができる。
Next, the arrangement of the abrasive grains 2 on the outer peripheral surface will be described. In the cutting wheel 10 of this embodiment, as shown in FIG.
As shown in the partially enlarged view of the wheel rotation direction (in the figure,
(Indicated by an arrow), a large abrasive grain 2a, a medium abrasive grain 2b, and a small abrasive grain 2c are sequentially and repeatedly arranged in order from the front portion to the rear portion thereof, and the abrasive grains 2 having different grain diameters as a whole are in the circumferential direction of the substrate. The large abrasive grains 2a, the medium abrasive grains 2b, and the small abrasive grains 2c are arranged so that the protruding heights of the abrasive grains 2 are different in a fixed pattern in the circumferential direction of the substrate. As a result, when the wheel is used, the large abrasive grain 2a having the highest protrusion height is worn first, and then the medium abrasive grain 2b having the second highest height is worn.
Acts on the cutting, and then the small abrasive grains 2c of the third height act on the cutting, whereby the life of the wheel can be extended while maintaining a predetermined cutting efficiency.

【0016】図3は基板周方向の砥粒の配列例を示す部
分拡大図である。図中、砥粒および砥粒の配置は模式的
に示している。
FIG. 3 is a partially enlarged view showing an arrangement example of abrasive grains in the circumferential direction of the substrate. In the figure, the abrasive grains and the arrangement of the abrasive grains are schematically shown.

【0017】図3の(a)は、基板厚さの薄い切断ホイ
ールの例で、砥粒2は基板周方向に一列のみ配設してい
る。その配列形態は、ホイール回転方向の前部から後部
に向けて粒径の大きい順に大砥粒2a、中砥粒2b、小
砥粒2cを繰り返し配列している。
FIG. 3A shows an example of a cutting wheel having a thin substrate, in which the abrasive grains 2 are arranged in only one row in the circumferential direction of the substrate. In the arrangement form, the large abrasive grains 2a, the medium abrasive grains 2b, and the small abrasive grains 2c are repeatedly arranged in the order of increasing particle diameter from the front part to the rear part in the wheel rotation direction.

【0018】図3の(b)は、砥粒2を基板周方向に二
列配設した例で、その配列形態は、列内では周方向に粒
径の大きい順に大砥粒2a、中砥粒2b、小砥粒2cを
配列し、隣り合う列とは配列順を砥粒1個分ずつずらし
た配列としている。
FIG. 3B shows an example in which the abrasive grains 2 are arranged in two rows in the circumferential direction of the substrate. The arrangement is such that, in the row, the large abrasive grains 2a and the medium abrasive grains are arranged in the order of increasing grain size in the circumferential direction. 2b and small abrasive grains 2c are arranged, and the adjacent columns are arranged such that the arrangement order is shifted by one abrasive grain.

【0019】図3の(c)は、図3(b)の二列配設に
さらに砥粒1個分ずつずらした三列目を配設した例で、
図3の(d)は、三列目の配列を一列目と同じとして配
設した例である。
FIG. 3 (c) shows an example in which a third row, which is shifted by one abrasive grain, is arranged in addition to the two rows arranged in FIG. 3 (b).
FIG. 3D shows an example in which the arrangement of the third row is the same as that of the first row.

【0020】図3の(a)〜(d)のいずれの場合も、
ホイール回転方向の前部から後部に向けて粒径の大きい
順に大砥粒2a、中砥粒2b、小砥粒2cが繰り返し配
列され、全体として粒径の異なる砥粒2が基板周方向に
規則的に配列されて、基板周方向に砥粒の突き出し高さ
が順に低くなるように大砥粒2a、中砥粒2b、小砥粒
2cが配列されている。これにより、ホイールの使用に
よって突き出し高さの高い順に摩耗し、順次突き出し高
さの低い砥粒が切断に作用することによって、所定の切
断能率を維持しながら、ホイールの寿命を延ばすことが
できる。
In any of the cases (a) to (d) of FIG.
A large abrasive grain 2a, a medium abrasive grain 2b, and a small abrasive grain 2c are repeatedly arranged in the order of increasing grain size from the front part to the rear part in the wheel rotation direction, and the abrasive grains 2 having different grain sizes as a whole are regularly arranged in the circumferential direction of the substrate. The large abrasive grains 2a, the medium abrasive grains 2b, and the small abrasive grains 2c are arranged so that the protrusion height of the abrasive grains decreases in the circumferential direction of the substrate. As a result, wear of the wheels increases in the order of protrusion height, and the abrasive particles with decreasing protrusion heights act on the cutting, thereby extending the life of the wheels while maintaining a predetermined cutting efficiency.

【0021】本実施形態の切断ホイール10の製造手順
はつぎの通りである。 ・基板1として外径100mm、厚さ1.2mmのスチ
ール製基板を準備する。 ・大砥粒2aとして平均粒径約600μmのダイヤモン
ド砥粒を、中砥粒2bとして平均粒径約450μmのダ
イヤモンド砥粒を、小砥粒2cとして平均粒径約350
μmのダイヤモンド砥粒をそれぞれ準備する。 ・基板外周面の大砥粒2a、中砥粒2b、小砥粒2cの
配列に応じた大きさの孔を所定のかたちに配列したスク
リーンを用いて、基板1の外周面に有機接着剤を塗布す
る。 ・この有機接着剤の上に大砥粒2a、中砥粒2b、小砥
粒2cを配置する。この状態で大砥粒2a、中砥粒2
b、小砥粒2cは基板外周面に図3の(a)〜(d)の
いずれかに示すかたちに配列される。 ・基板外周部側面についても同様な手順により砥粒2を
配列する。 ・これを乾燥炉中で120℃、1時間乾燥させ、砥粒2
を仮固定する。 ・三次元移動が可能なアプリケータ(吐出機)を用い
て、接着部とろう材とバインダーの混合物を砥粒粒径の
約1/2の高さに塗布する。 ・これを非酸化性雰囲気中で1000℃、1時間加熱
し、砥粒2を基板1に本固定する。
The manufacturing procedure of the cutting wheel 10 of this embodiment is as follows. As the substrate 1, a steel substrate having an outer diameter of 100 mm and a thickness of 1.2 mm is prepared. -Diamond abrasive grains having an average particle diameter of about 600 µm as the large abrasive grains 2a, diamond abrasive grains having an average particle diameter of about 450 µm as the medium abrasive grains 2b, and average particle diameter of about 350 as the small abrasive grains 2c.
A diamond abrasive grain of μm is prepared. An organic adhesive is applied to the outer peripheral surface of the substrate 1 using a screen in which holes having a size corresponding to the arrangement of the large abrasive grains 2a, the medium abrasive grains 2b, and the small abrasive grains 2c on the outer peripheral surface of the substrate are arranged in a predetermined shape. To do. -Large abrasive grains 2a, medium abrasive grains 2b, and small abrasive grains 2c are arranged on this organic adhesive. In this state, large abrasive grains 2a, medium abrasive grains 2
b, the small abrasive grains 2c are arranged on the outer peripheral surface of the substrate in any of the shapes shown in FIGS. The abrasive grains 2 are arranged on the side surface of the outer peripheral portion of the substrate by the same procedure.・ This is dried in a drying oven at 120 ° C for 1 hour to give 2 abrasive grains.
Temporarily fix. -Using a three-dimensionally movable applicator (discharging machine), apply the mixture of the adhesive part, the brazing material, and the binder to a height of about 1/2 of the abrasive grain size. -This is heated in a non-oxidizing atmosphere at 1000 ° C for 1 hour to permanently fix the abrasive grains 2 to the substrate 1.

【0022】〔試験例〕図3の(c)に示した砥粒配列
の切断ホイール(発明品1)と図3の(d)に示した砥
粒配列の切断ホイール(発明品2)、および、発明品
1,2の基板と同じ形状で同じ数の均一な粒径の砥粒を
配列した切断ホイール(比較品)を製造して切断加工試
験を行った。
[Test Example] A cutting wheel having an abrasive grain arrangement shown in FIG. 3C (invention product 1), a cutting wheel having an abrasive grain arrangement shown in FIG. 3D (invention product 2), and A cutting wheel (comparative product) having the same shape and the same number of abrasive grains of the same size as the substrates of the invention products 1 and 2 was manufactured and a cutting processing test was conducted.

【0023】〔試験条件〕 切断機械 :日立製丸のこ C4YA1 機械回転数:13000min−1 被切断材 :押し出し成形セメント板 切り込み量:15mm/pass 切断方式 :乾式切断 送り速度 :負荷電流8Aになるよう調節[Test conditions] Cutting machine: Hitachi circular saw C4YA1 Machine rotation speed: 13000 min -1 Material to be cut: Extrusion molding cement board Depth of cut: 15 mm / pass Cutting method: Dry cutting Feed rate: 8 A of load current To adjust

【0024】表1に試験結果を示す。Table 1 shows the test results.

【表1】 [Table 1]

【0025】発明品1,2の切断速度およびホイール寿
命は、比較品の切断速度およびホイール寿命を100と
したときの指数で示す。同表からわかるように、均一な
粒径の砥粒2を配列した比較品の切断ホイールに比べ
て、発明品1、2の切断ホイールは、切断速度、ホイー
ル寿命とも1.3〜1.5倍程度向上している。
The cutting speed and the wheel life of the invention products 1 and 2 are shown by indexes when the cutting speed and the wheel life of the comparative product are 100. As can be seen from the table, the cutting wheels of the invention products 1 and 2 have a cutting speed and a wheel life of 1.3 to 1.5 as compared with the cutting wheel of the comparative product in which the abrasive grains 2 having a uniform particle size are arranged. It has improved about twice.

【0026】[0026]

【発明の効果】基板外周面に配設する砥粒として平均粒
径の異なる複数種類の砥粒を使用して、基板周方向に砥
粒の突き出し高さが異なるようにしたことにより、粒径
の大きい砥粒から順次粒径の小さい砥粒が切断に作用す
ることによって、使用初期の切断能率を維持しながら、
ホイールの寿命を延ばすことができる。とくに、砥粒の
突き出し高さが基板周方向に一定のパターンで異なるよ
うに、平均粒径の異なる砥粒を基板周方向に規則的に配
列することにより、ホイールの使用期間を通じて基板周
方向の切れ味の変動がほとんどなく、安定した切れ味が
得られる。
EFFECT OF THE INVENTION By using a plurality of types of abrasive grains having different average particle diameters as the abrasive grains arranged on the outer peripheral surface of the substrate, the protrusion heights of the abrasive grains are made different in the circumferential direction of the substrate. While the abrasive grains having a smaller grain size act on the cutting in order from the larger grain, the cutting efficiency at the beginning of use is maintained,
The life of the wheel can be extended. In particular, by regularly arranging the abrasive grains having different average particle diameters in the substrate circumferential direction so that the protrusion height of the abrasive grains is different in a constant pattern in the substrate circumferential direction, the substrate circumferential direction can be kept constant during the period of use of the wheel. Stable sharpness is obtained with almost no change in sharpness.

【図面の簡単な説明】[Brief description of drawings]

【図1】 図1の(a)は切断ホイールの正面図、
(b)は(a)のA−A線断面図である。
1 (a) is a front view of a cutting wheel, FIG.
(B) is the sectional view on the AA line of (a).

【図2】 図1の切断ホイールの基板周方向にみた一部
の拡大図である。
FIG. 2 is an enlarged view of a part of the cutting wheel of FIG. 1 viewed in the substrate circumferential direction.

【図3】 基板周方向の砥粒の配列例を示す部分拡大図
である。
FIG. 3 is a partially enlarged view showing an arrangement example of abrasive grains in the circumferential direction of a substrate.

【符号の説明】[Explanation of symbols]

1 基板 2 砥粒 2a 大砥粒 2b 中砥粒 2c 小砥粒 3 ろう材 10 切断ホイール 11 スリット 1 substrate 2 abrasive grains 2a Large abrasive grain 2b Medium abrasive 2c small abrasive 3 brazing material 10 cutting wheels 11 slits

───────────────────────────────────────────────────── フロントページの続き (72)発明者 緒方 誠也 福岡県浮羽郡田主丸町大字竹野210番地 株式会社ノリタケスーパーアブレーシブ内 Fターム(参考) 3C063 AA02 AB03 BA23 BB02 BC02 BG05 BG07 CC08 EE16 EE31 FF08 FF20 FF23    ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Seiya Ogata             210 Takeno, Odaiba, Ukiha-gun, Fukuoka             Noritake Super Abrasive Co., Ltd. F-term (reference) 3C063 AA02 AB03 BA23 BB02 BC02                       BG05 BG07 CC08 EE16 EE31                       FF08 FF20 FF23

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 円盤状の基板の外周面および外周部側面
に砥粒を一層配列してろう付けした切断ホイールにおい
て、基板外周面の砥粒層形成範囲内に平均粒径の異なる
砥粒が基板周方向に規則的に配列されて、基板周方向に
砥粒の突き出し高さが一定のパターンで異なるように砥
粒が固着された切断ホイール。
1. A cutting wheel in which a single layer of abrasive grains is arrayed and brazed on the outer peripheral surface and the outer peripheral surface of a disk-shaped substrate, and abrasive grains having different average particle diameters are present in the abrasive grain layer forming range on the outer peripheral surface of the substrate. A cutting wheel that is regularly arranged in the circumferential direction of the substrate and has the abrasive grains fixed so that the protrusion height of the abrasive grains in the circumferential direction of the substrate is different in a fixed pattern.
【請求項2】 前記砥粒の突き出し高さの差が、最小の
平均粒径の20〜100%の範囲内である請求項1記載
の切断ホイール。
2. The cutting wheel according to claim 1, wherein the difference in protrusion height of the abrasive grains is within the range of 20 to 100% of the minimum average grain size.
JP2002112509A 2002-04-15 2002-04-15 Cutting wheel Expired - Fee Related JP3732150B2 (en)

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Application Number Priority Date Filing Date Title
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Publication Number Publication Date
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JP3732150B2 JP3732150B2 (en) 2006-01-05

Family

ID=29394994

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2671677A3 (en) * 2012-06-07 2017-11-08 EHWA Diamond Industrial Co., Ltd. Grinding wheel for grinding edges of glass substrates and method of manufacturing of the same

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2671677A3 (en) * 2012-06-07 2017-11-08 EHWA Diamond Industrial Co., Ltd. Grinding wheel for grinding edges of glass substrates and method of manufacturing of the same

Also Published As

Publication number Publication date
JP3732150B2 (en) 2006-01-05

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