JP2003298074A - Method for manufacturing light reception module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that an area requiring no light is covered with a metallic cover from the outside of a module, which is expensive and needs a long manufacturing period. <P>SOLUTION: In the light reception module including an element that is sensitive to light reception, a metallic film is stuck on the surface of a module of an area requiring no light. No metallic film is stuck on an area requiring a light. A type matching the light reception module is used. A clearance is made between the type and the light reception module in the area requiring no light, and a metallic liquid is poured into the clearance and it is solidified. <P>COPYRIGHT: (C)2004,JPO

Description

Description: BACKGROUND OF THE INVENTION [0001] 1. Field of the Invention [0002] The present invention relates to a light receiving module including an element responsive to light. 2. Description of the Related Art FIG. 2 shows a conventional structure of a semiconductor light receiving module including an element responsive to light. That is,
FIG. 2 shows a light receiving element 2, a control IC 3 for processing a signal of the light receiving element 2, and an attached chip part 4 mounted on a substrate 1.
Examples of the light receiving element 2 include a photodiode and a solar cell. The chip component 4 includes a resistor, a capacitor, and an inductance. The above elements and components are covered with the package resin 5. As the package resin 5, a resin that allows light to enter the light receiving element 2 to the maximum is selected. The above elements and components are protected by a package resin 5 against the environment in which the light receiving module is placed mechanically. The light receiving portion 6 of the light receiving module is formed in a lens shape in order to collect the light to the light receiving element to the maximum. [0004] Since elements other than the light receiving element 2 are generally liable to generate noise when irradiated with light, they are covered with a metal case 7 as shown in FIG. This metal case 7 covers the surface of the module except for the light receiving portion 6. [0005] The metal case 7 must be made according to the module. In order to manufacture the metal case 7, the metal plate must be manufactured through many steps such as bending, welding, and punching, and the manufacturing cost is considerably high. In addition, the production of the metal case 7 and the production of the light receiving module have to be performed in separate processes, respectively, and the investment in the production equipment is large. Furthermore, since an extra step of joining the metal case 7 and the light receiving module must be added, considerable man-hours are required, which also causes a large cost increase. [0006] In order to solve the above-mentioned problems, according to the present invention, a metal film is deposited on a light receiving module in a region excluding a light receiving portion. As a result, light does not enter because there is a metal film in a portion that becomes a problem when light is applied. In addition, the metal film can be attached by an automatic device. The present invention provides a simple method for irradiating a light receiving module including a semiconductor element responsive to light without irradiating a portion which becomes problematic when irradiated with light. . FIG. 1 shows the structure of the present invention. That is, the metal film 7 is adhered to the region excluding the light receiving portion 6. That is, in FIG. 1, a light receiving element 2, a control IC 3 for processing signals of the light receiving element 2, and other chip parts 4 are mounted on a substrate 1. The light receiving element 2, the control IC 3, and the chip component 4 are covered with a package resin 5 and protected mechanically or environmentally. As the package resin 5, a resin that allows light to efficiently enter the light receiving element 2 is selected. In addition, the light receiving portion 6 is often formed in a lens shape so that light can enter the light receiving element 2 with higher efficiency. Of course, if it is not necessary,
Need not be formed in a lens shape. Elements and components other than the light receiving element 2 may generate a noise signal when irradiated with light. For this purpose, as shown in FIG. 1, a metal film 7 is attached to a region excluding the light receiving portion 6 of the module. Since the metal film 7 is attached in a liquid state, it can be firmly attached to the surface of the module. FIG. 3 shows a method of attaching a metal film. That is, as shown in FIG.
Light receiving element 2 and control IC 3 and necessary resistors
Chip components 4 such as capacitors are mounted, and they are covered with a package resin 5. The light receiving portion 6 has a lens shape so as to easily collect light. Next, as shown in FIG. 3B, the light receiving module shown in FIG. 3A is sandwiched between the upper mold 11 and the lower mold 12. At this time, a gap 2 is formed in the upper part 11 at a place where a metal film is to be formed on the surface of the light receiving module. The other areas of the light receiving module are kept in close contact with the upper and lower dies 11, 12. Then, a metal liquid having a melting point of 150 ° C. or less
And a metal film 7 is formed on the surface of the light receiving module at the gap 2. Examples of the metal liquid include a solder alloy of tin (Sn) and bismuth (Bi), a low melting point metal such as Ga, and a multi-component solder alloy. A paste containing metal particles may be used instead of a perfect metal. After solidifying the metal film 7 thus attached, the upper and lower dies 11, 1
By removing the light receiving module from 2, a structure is obtained in which the metal film 7 adheres to the surface portion excluding the light receiving portion 6 of the light receiving module. According to the present invention, a metal film can be attached to a module in a very simple process. Therefore, the manufacturing cost and material can be reduced as compared with the case where a conventional metal case is used. Cost can be significantly reduced. Further, since the metal film is securely adhered to the resin at the required portion, the light blocking effect and the electromagnetic shielding effect work more effectively than in the conventional case.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a diagram showing a structure of a light receiving module of the present invention. FIG. 2 is a diagram showing a structure of a conventional light receiving module. FIG. 3 is a diagram showing a method for manufacturing a light receiving module of the present invention. [Description of Signs] 1 substrate 2 light receiving element 3 control IC 4 chip component 5 package resin 6 light receiving portion 7 metal film 11 upper mold 12 lower mold 13 gap 14 inflow port

Claims (1)

Claims: 1. A light receiving module is disposed in a mold, and a fixed gap is provided between the mold and the light receiving module only in a region where a metal film is to be adhered, and a metal liquid or metal is provided in the gap. After pouring a liquid material containing particles and solidifying the metal film, the metal film is attached to the surface of the area excluding the light receiving part, which is the module surface leading to the light-sensitive element, by removing the mold. Manufacturing method of a light receiving module.