JP2003292062A - Container or food tray coated with semiconductor film - Google Patents
Container or food tray coated with semiconductor filmInfo
- Publication number
- JP2003292062A JP2003292062A JP2002103661A JP2002103661A JP2003292062A JP 2003292062 A JP2003292062 A JP 2003292062A JP 2002103661 A JP2002103661 A JP 2002103661A JP 2002103661 A JP2002103661 A JP 2002103661A JP 2003292062 A JP2003292062 A JP 2003292062A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- semiconductor thin
- container
- tableware
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Cookers (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本願発明は、半導体薄膜を物
体の内表面に被覆し、該半導体薄膜に通電し、加熱する
ことにより、物体内部に収容された物を加熱するもので
あり、特に、食器内面に利用することにより加熱調理が
可能となることを特徴とし、その半導体として、人体に
無害な酸化物半導体および窒化物半導体を用い、食材を
入れたまま加熱可能な食器の構造およびその製造方法に
関するものである。更に詳しくは、n形酸化物半導体と
しては、アルミニウム、ボロン、ガリウム、インジウム
等の元素をドープした酸化亜鉛及び酸化亜鉛化合物を用
い、n形窒化物半導体としては、シリコン等の元素をド
ープした窒化ガリウムおよび窒化ガリウム化合物を用い
て、食器内面に通電加熱層を形成し、半導体通電加熱に
より食器であると同時に、加熱調理が可能である食器お
よびそれを作成する方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is to coat an inner surface of an object with a semiconductor thin film, and to energize and heat the semiconductor thin film to heat an object contained in the object. It is characterized in that it can be cooked by using it on the inner surface of tableware, and as the semiconductor, oxide semiconductor and nitride semiconductor harmless to the human body are used, and the structure of tableware that can be heated with foodstuffs in it and its manufacture It is about the method. More specifically, zinc oxide and zinc oxide compounds doped with elements such as aluminum, boron, gallium, and indium are used as the n-type oxide semiconductor, and nitrides doped with elements such as silicon are used as the n-type nitride semiconductor. TECHNICAL FIELD The present invention relates to a tableware that forms an electric heating layer on the inner surface of a tableware using gallium and a gallium nitride compound, and is a tableware that can be cooked at the same time as a tableware by semiconductor electric heating, and a method for producing the tableware.
【0002】[0002]
【従来の技術】従来、食材を加熱する場合、鍋などの加
熱容器に食材を入れて加熱し、加熱された食材を食器に
移していた。近年、電子レンジの登場により、食器のま
ま食材を加熱することが可能となった。しかし、電子レ
ンジは、調理器具で、その調理器具の中に食材の乗った
食器を入れないと加熱されない。つまり、食卓の上で食
器に盛られた食材を直接加熱することは不可能であっ
た。2. Description of the Related Art Conventionally, when heating foodstuffs, the foodstuffs are placed in a heating container such as a pan and heated, and the heated foodstuffs are transferred to tableware. In recent years, with the advent of microwave ovens, it has become possible to heat food ingredients in the form of tableware. However, the microwave oven is a cooking utensil, and it is not heated unless the tableware on which the food is placed is placed in the cooking utensil. In other words, it was impossible to directly heat the ingredients on the table on the table.
【0003】[0003]
【発明が解決しようとする課題】上記電子レンジに見ら
れるように、食卓の上において、食器に盛られた食材を
加熱することは、従来不可能であった。食器が加熱能力
を有していれば、この問題は、解決するはずである。As can be seen from the above microwave oven, it has hitherto been impossible to heat the food material placed on the tableware on the table. This problem should be solved if the dishes have heating capability.
【0004】[0004]
【課題を解決するための手段】本願発明は、半導体薄膜
を食器内側表面に作製することにより、食器上に食材を
載せたまま加熱処理を行うことを可能とするものであ
る。According to the present invention, a semiconductor thin film is formed on the inner surface of tableware so that heat treatment can be performed while food is placed on the tableware.
【0005】[0005]
【発明の原理及び作用】本発明の発端となったのは、透
明導電物質となる透明酸化物半導体の存在である。図3
に、主な酸化物透明導電物質の禁制帯幅及びその伝導帯
と価電子帯の真空準位からのエネルギーを示す。Principle and Action of the Invention The origin of the present invention is the existence of a transparent oxide semiconductor as a transparent conductive material. Figure 3
Shows the forbidden band width of the main oxide transparent conductive material and the energy from the vacuum level of its conduction band and valence band.
【0006】図3を参照すると、酸化物半導体には、伝
導帯下端と価電子帯上端の間の禁制帯のエネルギーが、
可視光全波長域のエネルギーより大きい酸化亜鉛や酸化
インジウムなどが存在することがわかる。Referring to FIG. 3, in the oxide semiconductor, the energy of the forbidden band between the lower end of the conduction band and the upper end of the valence band is
It can be seen that zinc oxide, indium oxide, etc., which are larger than the energy in the entire visible light wavelength range, exist.
【0007】これまでの酸化物半導体の研究により、ド
ーピングした酸化亜鉛および酸化インジウムは、高い可
視光透過率を保ちつつ高い電子濃度を有し、優れた導電
性を有することが分かっている。[0007] Previous studies on oxide semiconductors have revealed that doped zinc oxide and indium oxide have high electron concentration while maintaining high visible light transmittance, and have excellent conductivity.
【0008】このことから、透明半導体薄膜に通電加熱
する食器が実現可能であることが予測できる。From this, it can be predicted that tableware in which the transparent semiconductor thin film is electrically heated is realized.
【0009】[0009]
【実施例1】図1に見られるように、この予測をもと
に、酸化亜鉛の透明半導体薄膜を用いた加熱調理可能な
食器を作製した。図2に、図1の食器の一部を拡大して
示す。食器である陶器部分の上に半導体導電ヒーターを
積層し、その上に絶縁薄膜を積層している。Example 1 As shown in FIG. 1, cookable dishes using a transparent semiconductor thin film of zinc oxide were prepared based on this prediction. FIG. 2 shows a part of the tableware of FIG. 1 in an enlarged manner. A semiconductor conductive heater is laminated on the tableware pottery part, and an insulating thin film is laminated on it.
【0010】本願発明の透明半導体薄膜加熱食器におい
て重要となるパラメーターは、
(1)あらゆる特性のヒーターを設計可能な抵抗率制御
性。
(2)食器の美しい外観を損なわない。
(3)食品衛生上、人体に有害な物質を発生しない。
以上の3点である。以下、食器内面にn形酸化亜鉛半導
体薄膜を用いた実施例について説明する。The parameters that are important in the transparent semiconductor thin film heating tableware of the present invention are: (1) Resistivity controllability capable of designing heaters of all characteristics. (2) Does not impair the beautiful appearance of tableware. (3) In terms of food hygiene, no substances harmful to the human body are generated. These are the above three points. Examples in which an n-type zinc oxide semiconductor thin film is used for the inner surface of tableware will be described below.
【0011】まず、前述の本願発明の透明半導体薄膜加
熱食器で重要となる2つのパラメーターの第1点目であ
る、
(1)あらゆる特性のヒーターを設計可能な抵抗率制御
性について。
図5に、実施例における酸化亜鉛透明半導体薄膜の抵抗
率の電子濃度依存性を示す。酸化亜鉛透明半導体薄膜の
比抵抗は、2x10-4 Ωcm の金属並みの低抵抗から 4x103
Ωcmの高抵抗域まで制御することが可能であった(図
4参照)。比較のため、通電加熱に用いられるシリコン
(n-Si)の例を図5中に示した。First, the first point of the two important parameters in the transparent semiconductor thin film heating tableware of the present invention described above is as follows: (1) Resistivity controllability capable of designing heaters of all characteristics. FIG. 5 shows the electron concentration dependence of the resistivity of the zinc oxide transparent semiconductor thin film in the example. The resistivity of the zinc oxide transparent semiconductor thin film, 4x10 3 from the low-resistance metal par of 2x10 -4 [Omega] cm
It was possible to control up to a high resistance region of Ωcm (see Fig. 4). Silicon used for electrical heating for comparison
An example of (n-Si) is shown in FIG.
【0012】図5における酸化亜鉛とシリコンとの比較
を見ても分かるように、得られた実施例の酸化亜鉛透明
半導体薄膜は、シリコンと同じ比抵抗を実現できること
がわかった。As can be seen from the comparison between zinc oxide and silicon in FIG. 5, it was found that the zinc oxide transparent semiconductor thin film of the obtained example can realize the same specific resistance as that of silicon.
【0013】このことから、実施例における酸化亜鉛透
明半導体薄膜は、通電加熱に使われるシリコンと比較し
ても遜色ないヒーター特性をもつことがわかる。From this, it is understood that the zinc oxide transparent semiconductor thin film in the example has a heater characteristic comparable to that of silicon used for electric heating.
【0014】また、食材への電流の導通を防ぐ表面絶縁
層であるが、ヒーターと同じく人体に無害な酸化亜鉛で
形成可能なことが、図5に示した高抵抗領域に及ぶ抵抗
制御性から理解できる。Further, although it is a surface insulating layer which prevents the conduction of current to the food material, the fact that it can be formed of zinc oxide, which is harmless to the human body like the heater, can be formed from the resistance controllability covering the high resistance region shown in FIG. It can be understood.
【0015】[0015]
【実施例2】次に、上記の本願発明の透明半導体薄膜加
熱食器で重要となる3つのパラメーターの第2点目であ
る、
(2)食器の美しい外観を損なわない。について。
図6に、実施例における酸化亜鉛半導体薄膜の光透過率
の波長依存性を示す。人間の目に見える光すなわち可視
光の波長は、図6に示すとおり、ほぼ380nmから780nmぐ
らいの範囲である。この波長領域において、実施例にお
ける酸化亜鉛半導体薄膜の透過率は、95%を越えている
ことが、図6からわかる。このことから、実施例におけ
る酸化亜鉛半導体薄膜は、図柄や絵柄の美しい食器の上
に形成したとしも全て透過してそれらが目に写り、全く
食器の美しい外観を損なうことがないことがわかる。[Embodiment 2] Next, the second point of the three important parameters in the transparent semiconductor thin film heated tableware of the present invention is as follows: (2) The beautiful appearance of the tableware is not impaired. about. FIG. 6 shows the wavelength dependence of the light transmittance of the zinc oxide semiconductor thin film in the example. The wavelength of light visible to human eyes, that is, visible light is approximately in the range of 380 nm to 780 nm, as shown in FIG. It can be seen from FIG. 6 that the transmittance of the zinc oxide semiconductor thin film in the example exceeds 95% in this wavelength region. From this, it can be seen that the zinc oxide semiconductor thin film in the examples does not impair the beautiful appearance of the tableware at all, even if formed on the tableware with a beautiful pattern or pattern, all of them penetrate and are visible.
【0016】図7に、本願発明の半導体薄膜加熱食器の
稼働実験例を示す。家庭用電源を使用する想定で、印加
電圧は100Vとした。本実施例におけるガラスを含め
た透明半導体薄膜の可視光全域の透過率は、90%以上
であった。透明半導体薄膜としては、アルミニウムドー
プの酸化亜鉛を用い、その薄膜の膜厚は1μmであっ
た。温度計測は、薄膜表面で行った。図7を見ても分か
るように、20秒以内で水が蒸発する温度まで薄膜表面
が達していることがわかる。このことから、瞬時に食材
が加熱できる優れた食器として使用可能なことがわか
る。FIG. 7 shows an operation test example of the semiconductor thin film heated tableware of the present invention. Assuming that a household power supply is used, the applied voltage is 100V. The transparent semiconductor thin film including glass in this example had a transmittance of 90% or more over the entire visible light range. Aluminum-doped zinc oxide was used as the transparent semiconductor thin film, and the thickness of the thin film was 1 μm. The temperature was measured on the surface of the thin film. As can be seen from FIG. 7, it can be seen that the thin film surface reaches the temperature at which water evaporates within 20 seconds. From this, it can be seen that it can be used as an excellent tableware that can instantly heat food.
【0017】[0017]
【実施例3】本願発明に係る半導体薄膜加熱食器の作製
法の例を挙げる。最も安価で大面積に製作できる方法と
して、スパッタ法、蒸着法、ゾルゲル法がある。図8
は、そのゾルゲル法の概略を示している。[Embodiment 3] An example of a method for producing a semiconductor thin film heated tableware according to the present invention will be described. As the cheapest method for producing a large area, there are a sputtering method, a vapor deposition method, and a sol-gel method. Figure 8
Shows the outline of the sol-gel method.
【0018】図9に、図8のゾルゲル法を用いた製造プ
ロセスの一例を示す。図9は、その中でもディップ法に
より透明半導体薄膜加熱食器を作製するプロセスを説明
する。陶器、ガラス、耐熱性プラスチックなどの食器
を、透明半導体薄膜材料である有機金属材料混合溶液に
浸け、乾燥後、加熱反応させることにより、透明半導体
薄膜を形成する。図9のように溶媒にはエタノール、金
属亜鉛は酢酸化合物であり、人体には無害である。FIG. 9 shows an example of a manufacturing process using the sol-gel method shown in FIG. FIG. 9 illustrates a process for producing transparent semiconductor thin film heated tableware by the dipping method among them. A transparent semiconductor thin film is formed by immersing tableware such as pottery, glass, and heat-resistant plastic in a mixed solution of an organic metal material, which is a transparent semiconductor thin film material, drying and reacting with heating. As shown in FIG. 9, the solvent is ethanol and the metallic zinc is an acetic acid compound, which is harmless to the human body.
【0019】[0019]
【実施例4】図10に、原料ターゲットを蒸発させる手
法を用いた製造プロセスの一例を示す。陶器、ガラス、
耐熱性プラスチックなどの食器を、真空漕に入れ、半導
体薄膜材料であるターゲットからの元素を食器上に堆積
可能な位置に設置する。原料ターゲットから半導体元素
を飛ばし、食器上に薄膜を形成する。製膜後、大気中に
取り出す。図10のように原料ターゲット蒸発にアルゴ
ンプラズマ、半導体として酸化亜鉛を用いると、アルゴ
ンは人体に無害であり原料ターゲットの酸化亜鉛も人体
に無害であることから、食器作製プロセスとして衛生上
全く問題がないことがわかる。また、この作製法ではす
でに、半導体膜厚200nmで製膜所要時間60秒、シー
ト抵抗10Ω/□を実現している。Fourth Embodiment FIG. 10 shows an example of a manufacturing process using a method of evaporating a raw material target. Pottery, glass,
Tableware such as heat-resistant plastic is placed in a vacuum tank and placed at a position where elements from the target, which is a semiconductor thin film material, can be deposited on the tableware. The semiconductor element is removed from the raw material target to form a thin film on the tableware. After film formation, it is taken out into the atmosphere. As shown in FIG. 10, when argon plasma is used for evaporation of the raw material target and zinc oxide is used as a semiconductor, argon is harmless to the human body, and zinc oxide as the raw material target is also harmless to the human body. I know there isn't. In addition, this manufacturing method has already achieved a film formation time of 60 seconds and a sheet resistance of 10 Ω / □ at a semiconductor film thickness of 200 nm.
【0020】[0020]
【発明の効果】本発明は、大面積に作製が容易な酸化亜
鉛透明半導体薄膜を食器表面に形成することにより、通
電加熱で加熱調理が可能となるところにある。よって、
従来用いられていた、電子レンジ等による調理器具を用
いた加熱が不要になり、食器に食材をのせたまま食卓で
加熱調理が可能となるため、省スペースで時間効率が良
くなる。また、食器に移す必要がないため、あるいは、
加熱しながら食事を行うことができるため食材の冷却に
伴うエネルギーロスが少なく、省エネルギーでもある。EFFECTS OF THE INVENTION The present invention lies in the fact that by forming a zinc oxide transparent semiconductor thin film on a surface of a tableware, which can be easily manufactured in a large area, cooking can be performed by electric heating. Therefore,
It is not necessary to heat using a cooking utensil such as a microwave oven, which has been conventionally used, and it is possible to heat and cook at the table while placing the food on the tableware, thus saving space and improving time efficiency. Also, because it does not need to be transferred to tableware, or
Since the food can be eaten while heating, there is little energy loss due to the cooling of the food and it is also energy saving.
【図1】 透明半導体薄膜ヒーターを用いた加熱食器の
例FIG. 1 Example of heated tableware using a transparent semiconductor thin film heater
【図2】 透明半導体薄膜ヒーターを用いた加熱食器の
断面構造例[Fig. 2] Example of cross-sectional structure of heated tableware using a transparent semiconductor thin film heater
【図3】 酸化物半導体のバンドダイアグラムFIG. 3 Band diagram of an oxide semiconductor
【図4】 皿形状の食器での実施例FIG. 4 Example of dish-shaped tableware
【図5】 酸化亜鉛透明半導体薄膜の抵抗率の電子濃度
依存性FIG. 5 Dependence of resistivity of zinc oxide transparent semiconductor thin film on electron concentration
【図6】 実施例における酸化亜鉛透明半導体薄膜の光
透過率の波長依存性FIG. 6 is the wavelength dependence of the light transmittance of the zinc oxide transparent semiconductor thin film in the example.
【図7】 透明半導体薄膜ヒーターの印加電圧100V
における加熱温度の時間依存性。FIG. 7: Applied voltage of transparent semiconductor thin film heater 100V
Dependence of heating temperature on.
【図8】 ゾルーゲル法の概略(スピンコートを用いた
場合)FIG. 8: Outline of sol-gel method (when spin coating is used)
【図9】 ディップ法を用いた透明半導体薄膜ヒーター
の作製プロセスFIG. 9: Manufacturing process of transparent semiconductor thin film heater using dip method
【図10】 原料ターゲットの蒸発を用いて作製する方
法の例FIG. 10: Example of manufacturing method using evaporation of raw material target
Claims (6)
に通電し、発熱させることを特徴とする半導体薄膜を被
覆した容器。1. A container coated with a semiconductor thin film, characterized in that the inner surface of the container is coated with a semiconductor thin film, and the thin film is energized to generate heat.
特徴とする請求項1記載の半導体薄膜を被覆した容器。2. The container coated with a semiconductor thin film according to claim 1, wherein the container is a heat resistant container.
熱プラスチックにより形成されていることを特徴とする
請求項1記載の半導体薄膜を被覆した容器。3. The container coated with a semiconductor thin film according to claim 1, wherein the container is made of ceramics, heat-resistant glass or heat-resistant plastic.
であることを特徴とする請求項1記載の半導体薄膜を被
覆した容器。4. The container coated with a semiconductor thin film according to claim 1, wherein the container is used as tableware.
体に有害な物質を発生させることのない半導体薄膜であ
ることを特徴とする請求項1記載の半導体薄膜を被覆し
た容器。5. The container coated with a semiconductor thin film according to claim 1, wherein the semiconductor thin film is a semiconductor thin film which does not generate a harmful substance to a human body even when energized and heated.
物、酸化インジウム、酸化亜鉛、酸化マグネシウム亜
鉛、窒化ガリウム、窒化アルミニウムガリウム又は炭化
シリコンであることを特徴とする請求項1記載の半導体
薄膜を被覆した容器。6. The semiconductor thin film according to claim 1, wherein the semiconductor thin film is indium tin oxide, indium oxide, zinc oxide, magnesium zinc oxide, gallium nitride, aluminum gallium nitride or silicon carbide. Container.
Priority Applications (1)
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---|---|---|---|
JP2002103661A JP2003292062A (en) | 2002-04-05 | 2002-04-05 | Container or food tray coated with semiconductor film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002103661A JP2003292062A (en) | 2002-04-05 | 2002-04-05 | Container or food tray coated with semiconductor film |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2003292062A true JP2003292062A (en) | 2003-10-15 |
Family
ID=29242701
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009262745A (en) * | 2008-04-24 | 2009-11-12 | Tokai Rika Co Ltd | Steering wheel |
GB2470472A (en) * | 2009-05-19 | 2010-11-24 | Richards Morphy N I Ltd | Water heating vessel and liquid level |
EP2452599A1 (en) * | 2010-11-12 | 2012-05-16 | BSH Bosch und Siemens Hausgeräte GmbH | Stirring vessel for a kitchen appliance |
CN109877536A (en) * | 2019-01-28 | 2019-06-14 | 淄博友联电器有限公司 | Stretching iron pan answers bottom technique |
-
2002
- 2002-04-05 JP JP2002103661A patent/JP2003292062A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009262745A (en) * | 2008-04-24 | 2009-11-12 | Tokai Rika Co Ltd | Steering wheel |
GB2470472A (en) * | 2009-05-19 | 2010-11-24 | Richards Morphy N I Ltd | Water heating vessel and liquid level |
GB2470472B (en) * | 2009-05-19 | 2011-08-03 | Richards Morphy N I Ltd | Liquid preparation |
EP2452599A1 (en) * | 2010-11-12 | 2012-05-16 | BSH Bosch und Siemens Hausgeräte GmbH | Stirring vessel for a kitchen appliance |
CN109877536A (en) * | 2019-01-28 | 2019-06-14 | 淄博友联电器有限公司 | Stretching iron pan answers bottom technique |
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