JP2003289268A - High-frequency module component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a high-frequency module component that can remove electrostatic surges and achieve stable transmission and reception, by prescribing a packaging structure on the multilayer interconnection board of an electrostatic surge removal circuit. <P>SOLUTION: A switch circuit section SW and the electrostatic surge removal circuit S are formed on the multilayer interconnection board 51, and especially, the electrostatic surge removal circuit S is allowed to approach a terminal electrode 56 at ground potential. When the shortest interval to the ground potential electrode 56 of a second electronic component element 2 for composing the electrostatic surge removal circuit section, and that from the second electronic component element 2 to a first electronic component element 1 for composing the switch circuit section SW are set to be D1, and D2, respectively, then the relation D1<D2 is achieved. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency module component including a switch circuit portion arranged between an antenna of a communication device and a transmission / reception circuit. The present invention relates to a high frequency module component in which an electric surge elimination circuit section is arranged.

[0002]

2. Description of the Related Art At the same time as mobile communication devices typified by portable telephones are becoming smaller, the generation of transmission systems of telephones is rapidly changing. In these mobile radio communication devices, a high frequency module component having a switch circuit section for selectively connecting and controlling an antenna to a receiving circuit or a transmitting circuit is widely used.

Normally, the switch circuit portion is formed on the multilayer wiring board 51 as a part of the high frequency module component shown in FIG. In the multilayer wiring board 51, a plurality of dielectric layers 52 are laminated, and inside thereof, a strip line, an inductance element, and an internal wiring pattern 55 including a conductor film which spreads in a plane and becomes a ground potential are formed. A wiring pattern 53 for mounting the component element 54 is formed. Further, an electronic component element 54 forming a predetermined circuit is mounted on the surface of the multilayer wiring board 51. The shield case 58 is attached so as to cover the front surface side of the multilayer wiring board 51. Furthermore, the multilayer wiring board 5
Various terminal electrodes 56 and 57 for connecting to an external mother board are formed on the end surface and the bottom surface of 1. In particular, the terminal electrode 56 is a terminal electrode having a ground potential, and will be connected to the leg portion 59 of the shield case 58, for example.

Such a switch circuit unit is shown in FIG.
The circuit configuration is as shown in. FIG. 6 shows the simplest single mode (switch circuit section which controls transmission / reception of a single communication system).

In the figure, the switch circuit section includes capacitor elements C51 to C57 and inductance elements L51 to L57.
56, resistor R51, switching diodes D51, D
52, and is arranged between the antenna and the receiving circuit and the transmitting circuit, for example. That is, the switch circuit unit has an antenna terminal ANT connected to the antenna, a reception terminal RX connected to the reception circuit, a transmission terminal TX connected to the transmission circuit, and a control terminal VC51 to which a control signal for switching between reception and transmission operations is supplied. is doing.

In operation, the antenna terminal ANT is supplied by supplying a bias signal for turning on the switching diodes D51 and D52 to the control terminal VC51.
Switching diode D51 between the transmitter and the transmission terminal TX
Is turned on (the impedance is small), and a transmission signal from the transmission circuit TX (for convenience, the same reference numeral as that of the terminal is attached) can be supplied to the antenna terminal ANT.

At this time, one end of the strip line L51 has a ground potential, and operates as a short stub. That is, if the length of the short stub is designed to be a quarter wavelength length in consideration of the central frequency of the transmission signal, the impedance becomes large with respect to the transmission signal, and as a result, the transmission signal is It does not flow into the reception circuit RX (for convenience, the same reference numerals as the terminals are attached).

On the contrary, by supplying the control terminal VC51 with a bias signal for turning off the switching diodes D51 and D52, the switching diode D51 between the antenna terminal ANT and the transmission terminal TX is turned off, and the antenna terminal is turned off. The ANT is disconnected from the transmission circuit TX. Further, the strip line L51 is separated from the ground by the switching diode D52, and as a result, the strip line L51 operates as a simple transmission line, and the reception signal received from the antenna flows to the reception terminal RX.

Here, in the switch circuit portion of FIG. 6, the filter F1 is a filter that passes the band of the received signal, and is a filter that removes other unnecessary signal components, for example, electrostatic surge components. It is composed of one inductance element L53, L54 and one capacitor element C53, C54.

Further, the filter F2 is a filter that allows the band of the transmission signal to pass therethrough, and is a filter that removes other unnecessary signal components, for example, electrostatic surge components, and includes two inductance elements L55 and L56 and a capacitor. It is composed of elements C55 and C56.

Such inductance elements L51 to L
Reference numeral 56 denotes an inductance conductor film (strip line conductor film) or a chip inductance element formed on the surface of the multilayer wiring board 51 shown in FIG. 5, or the multilayer wiring board 51.
It is formed by the inductance conductor film (strip line conductor film) formed inside the. Further, the capacitor elements C51 to C56, the resistor R51, and the switching diodes D51 and 52 are composed of a chip capacitor element, a chip resistor, a PIN switching diode and the like arranged on the multilayer wiring board 51. Further, the terminal electrodes 56 and 57 of the multilayer wiring board 51 are the antenna terminals AN of FIG.
T, the receiving terminal RX, the transmitting terminal TX, etc., and the other terminal electrodes 56 are ground terminals.
The shield case 58 is joined to the.

In order to reduce the size and increase the functionality of the high-frequency switch component, a circuit portion other than the switch circuit portion, a receiving circuit portion or a part thereof, and a transmitting circuit portion or a part thereof are formed on the multilayer wiring board 51. You may. In this case, the terminal electrode 5
The function of 7 differs depending on the combination of each circuit unit.

Further, in the switch circuit section, an electrostatic surge eliminating circuit section is arranged between the antenna terminal ANT connected to the antenna and the switch circuit section as a measure against surge.
The electrostatic surge eliminating circuit section is composed of a capacitor element and an inductance element, and is configured by, for example, a T-type connection. And, the conventional electrostatic surge eliminating circuit section generates 300 to 500 MHz when the antenna is touched by a human body.
It is intended to eliminate the degree of electrostatic surge. This is a circuit for preventing the switch circuit portion from being destroyed.

Further, in recent years, in order to improve the frequency selectivity in the receiving circuit, an S having a high frequency selectivity is provided in front of the receiving circuit instead of the circuit configuration of the filter F1 shown in FIG.
A SAW element such as an AW filter is often used. This SAW element generally has comb-teeth electrodes formed at predetermined intervals on a piezoelectric substrate, and the comb-teeth electrodes are very sensitive to the frequency to be selected. The shortest interval is narrow. Therefore, the presence of the electrostatic surge elimination circuit section is particularly important as a countermeasure against surge.

If this electrostatic surge eliminating circuit is not interposed, an excessive surge voltage will be applied to the SAW element and the comb-teeth electrode will be destroyed.

[0016]

However, the present inventor
Depending on the mounting positional relationship between the inductance element and capacitor element that make up the electrostatic surge elimination circuit section that is mounted on the multilayer wiring board and the switching diode, strip line, inductance element, coil, resistor, and capacitor element that make up the switch circuit section. It was also found that the electrostatic surge cannot be sufficiently removed due to the cutoff frequency of the electrostatic surge removing circuit section.

Since the SAW element corresponds to a high-frequency reception signal of, for example, a GSM communication system or a DCS communication system, it is unavoidable to use comb-teeth electrodes with a shortest interval of 1 μm or less, and switching is required in a conventional switch circuit section. It suffices if the diode D51 or D52 is configured to have a filter characteristic that cuts with a surge voltage that does not cause destruction.

However, when a SAW element is used in the switch circuit section, it is necessary to reduce the surge voltage by the electrostatic surge eliminating circuit section. It should be noted that although damage due to an electrostatic surge occurs remarkably in the SAW element in particular, it is necessary to deal with the switching diode operating as a semiconductor and the operation due to the electrostatic surge.

As a countermeasure against this, the cutoff frequency of the filter composed of the electrostatic surge eliminating circuit section may be set high, but in that case, for example, the loss of the communication band (about 900 MHz) of the GSM communication system becomes large. However, there is a problem that it adversely affects stable transmission and reception.

The present invention has been devised in view of the above-mentioned problems, and an object thereof is to improve the electrostatic surge elimination of an electrostatic surge elimination circuit and further to reduce the loss of signals in the transmission / reception band. The present invention provides a high-frequency module component including a switch circuit unit that can minimize

[0021]

According to the present invention, a switch circuit section for selectively controlling the supply of a reception signal received from an antenna to a reception circuit and a transmission signal of a transmission circuit to an antenna on the surface of a multilayer wiring board. And a second electronic component element that is disposed between the antenna and the switch circuit portion and that constitutes an electrostatic surge eliminating circuit portion that attenuates a surge voltage that intrudes from the antenna terminal. In a high-frequency module component that is mounted and on the end surface of the multilayer wiring board, a ground potential terminal electrode and an antenna terminal electrode connected to an antenna are formed, the second electronic component element and the ground potential terminal electrode When the shortest distance is D1 and the shortest distance between the first electronic component element and the second electronic component element is D2, a high frequency module satisfying D1 <D2. Is an Lumpur parts.

The second electronic component element is a high-pass filter having a cutoff frequency of 600 to 800 MHz.

The shortest distance D1 is 0.15
The range is 0.2 mm, and the shortest distance D2 is 0.25.
It is a value of mm or more.

According to the present invention, the shortest distance D1 between the second electronic component element (inductance element and capacitor element) forming the electrostatic surge eliminating circuit section S and the ground terminal electrode is set to the second electronic component element and the switch circuit section. Shortest distance D2 to the constituent first electronic component element (inductance element, capacitor element, resistance element, switching diode element)
Since it is made shorter, the surge signal input from the antenna terminal is switched by the filter function of the electrostatic surge removal circuit section and by the air discharge from the second electronic component element forming the electrostatic surge removal circuit section to the ground potential. The influence (damage) on the first electronic component element forming the part can be reduced. Particularly, it is a high-pass filter in which the cutoff frequency of the filter of the electrostatic surge elimination circuit is 600 to 800 MHz, and by setting it higher than the cutoff frequency of the filter of the general electrostatic surge elimination circuit, The surge voltage is low. As a result, malfunction of the switching diode, especially destruction of the comb-shaped electrodes of the SAW element can be reduced, and the switching diode and SAW
Maintaining stable operation of the device can be achieved.

Moreover, a required frequency band, for example, GS
It is possible to reduce the transmission / reception loss of the M communication system.

Further, the shortest distance D1 of the second electronic component element is set to a range of 0.15 to 0.2 mm, and the shortest distance D2 of the first electronic component element is set to a value of 0.25 mm or more. Therefore, the surge signal that has entered from the antenna is damaged by the high-pass filter function of the electrostatic surge eliminating circuit section S, and in particular, the effect of air discharge from the second electronic component element to the ground potential damages the first electronic component element. In particular, the damage of the SAW element can be reduced.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION A high frequency module component of the present invention will be described below. In addition, the high-frequency module component of the present invention, the structure of the high-frequency module component itself,
It is substantially the same as the structure shown in FIG. That is, the high frequency module component 50 was formed on the multilayer wiring board 51. In the multilayer circuit board, a plurality of dielectric layers 52 are stacked, and an internal wiring layer 55 including a strip line, an inductance element, and a conductor serving as a ground electrode spread in a planar shape inside thereof.
And a wiring pattern 53 on which various electronic component elements 54 are mounted is formed. Then, on the surface of the multilayer wiring board 51, electronic component elements 54 that form a switch circuit portion and an electrostatic surge eliminating circuit are mounted. Then, various electronic component elements 5 are formed on the surface of the multilayer wiring board 51.
The shield case 58 is attached so as to cover 4. Further, various terminal electrodes 56 and 57 connected to an external mother board are formed on the end surface and the bottom surface of the multilayer wiring board 51. The terminal electrode 56 is a terminal electrode having a ground potential and is connected to the leg portion 59 of the shield case 58, for example.

The multilayer wiring board 51 has at least a switch circuit section and an electrostatic surge eliminating circuit section, and is provided with all or part of the receiving circuit and all or part of the transmitting circuit. There is. Therefore, the terminal electrodes 56, 57
Among them, in particular, the terminal electrode 57 has a different function depending on the mounted circuit section, and is, for example, a power supply voltage, a reception terminal, a transmission terminal, or a control terminal for switching between transmission and reception, and further, the reception circuit and the transmission circuit. Is a terminal for supplying a signal to, and a terminal for controlling these.

FIG. 1 is a circuit diagram of a switch circuit section SW corresponding to a single communication system using an electrostatic surge eliminating circuit section S.

In FIG. 1, the switch circuit section SW is connected to the receiving circuit RX via a receiving terminal and is connected to the transmitting circuit TX via a transmitting terminal. Further, the switch circuit unit SW is connected to the antenna via the antenna terminal ANT.

In this switch circuit section SW, an electrostatic surge eliminating circuit section S connected to the antenna terminal ANT is arranged. The electrostatic surge eliminating circuit section S is composed of, for example, one inductance element L101 and two capacitor elements C101 and C102, one end of the inductance element L101 is connected to the ground potential, and the other end is 2 Capacitor elements C101, C10
2 are connected to form a T-type LC filter as a whole.

Here, one inductance element L101 and two capacitor elements C101 and C102 which form the electrostatic surge eliminating circuit section S are collectively referred to as a second electronic component element 2.

The switch circuit section SW is composed of capacitor elements C1 to C5, inductance elements L1 and L2, switching diodes D1 and D2, a resistor R1, and a SAW element SF. These capacitor elements C1 to C3, inductance elements L1 and L2, switching diodes D1 and D2, resistor R1, and SAW element S
F is generically defined as the first electronic component element 1.

Specifically, the antenna terminal ANT is connected to the receiving circuit RX and the transmitting circuit TX via the electrostatic surge eliminating circuit section S and the switch circuit section SW.

For example, a π-type filter including an inductance element L1 and capacitor elements C1 and C2 is arranged between the electrostatic surge eliminating circuit section S and the receiving circuit RX,
Further, the SAW element SF is arranged.

Incidentally, the capacitor element C2 and the SAW element SF
A switching diode D1 and a capacitor element C3 are arranged between the connection point of and the ground potential, and a control terminal VC is arranged on the anode side of the switching diode D1 via a resistor R1.

A switching diode D2 is arranged between the electrostatic surge eliminating circuit section S and the transmission circuit TX.

The switching diode D2 is provided between the transmission terminal side of the switching diode D2 and the ground potential.
The bias signal of No. 1 is grounded, and the inductance element L2 having a high impedance with respect to the high frequency signal is arranged. Here, a π-type filter (inductance element L
1, the capacitor elements C1 and C2) are combined with the off capacitance component when the switching diode D1 is in the off state,
It has a filter characteristic that allows the band of the received signal to pass. The determination of this characteristic is set by the circuit constant of each component. In addition, when the switching diode D1 is in the ON state, the switching diode D1 is combined with the ON inductance component to have a filter characteristic that does not pass the band of the transmission signal and the reception signal.

With such a configuration, when a bias signal for turning on the switching diode D1 and the switching diode D2 is supplied to the control voltage terminal VC, for example, this bias signal is applied to the switching diode D.
1, the inductance element L1, the switching diode D2, and the inductance element L2 to flow to the ground.

For example, in the transmission operation, a bias signal for turning on both the switching diodes D1 and D2 is supplied. As a result, the electrostatic surge elimination circuit section S and the transmission circuit TX are connected to each other. At the same time, in the π-type filter, it is combined with the on-inductance component of the switching diode D1 and acts to block the frequency band of the transmission signal.

As a result, the transmission signal is the capacitor element C.
5, it is led to the antenna terminal ANT via the switching diode D2 and the electrostatic surge elimination circuit section S. Then, the transmission signal is blocked by the π-type filter portion and never flows into the reception circuit RX.

FIG. 2 is a circuit diagram of a switch circuit section having an electrostatic surge eliminating circuit section S used in the high frequency module component of the present invention.

In this example, the switch circuit section SW selectively switches between the three communication systems. For example, the transmission / reception terminal is a transmission terminal TX for GSM communication.
GSM, GSM communication receiving terminal RXGSM, GSM communication control terminal VC for switching between transmitting operation and receiving operation
1. Transmitting terminal TxDCS / PCS commonly used during DCS communication and PCS communication, receiving terminal R for DCS communication
Reception terminals RxPCS, DCS for XDCS, PCS communication
Control terminal VC2 for switching between transmission operation and reception operation during communication and PCS communication, reception operation during PCS communication and PCS
It has a control terminal VC3 for switching between reception operation during communication.

Here, for example, the transmission / reception frequency band of the GSM communication system is 900 MHz band, and PCS, DC
The transmission / reception band of the S communication system is the 1.8 GHz band.

For this reason, the switch circuit section SW for GSM communication on the low frequency side has a low-pass filter LPF with a threshold value set to a value between 900 MHz and 1.8 GHz and an electrostatic surge from the antenna terminal ANT. It is arranged via the removal circuit section S. This switch circuit section S
As shown in FIG. 1, the configuration of W includes switching diodes D301, D401, inductance elements L31, L
401, capacitor elements C41, C42, C401, S
It is composed of an AW element SF401 and a resistor R401. The switch circuit unit SW for PCS / DCS communication on the higher frequency band side is arranged from the antenna terminal ANT via a high-pass filter HPF whose threshold value is set to a value between 900 MHz and 1.8 GHz. There is.

The switch circuit section SW has three switching diodes D501, D601 and D70.
1, 5 inductance elements L31, L401, capacitor elements C41, C42, C401, SAW element SF
401 and a resistor R401.

In operation, for example, the switching of transmission / reception of the GSM communication system is basically the same as in FIG. Then, the transmission / reception signal of the GSM communication system is, for example,
Low-pass filter LPF that does not pass a high frequency band such as 1.8 GHz band and at least 600 to 800M
It passes through the electrostatic surge eliminating circuit section S having a high-pass filter function having a cut-off frequency of Hz.

Further, for example, in switching transmission / reception of the DCS / PCS communication system, at the time of transmission of the DCS / PCS communication system, a bias signal for turning on the switching diodes D501 and D601 is supplied to the control terminal VC2 and the control terminal VC3 is supplied. Switching diode D
A bias signal for turning off 701 (for example, no bias is applied or a negative voltage is applied) is supplied. As a result, the switching diodes D501 and D601
Are turned on, and the switching diode D70
1 is off. Here, the capacitor element C61, the inductance element L61, the capacitor element C62, the switching diode D601 (on-inductance component is generated), and the capacitor element C63 are DCS / PCS.
It acts as a filter that cuts off the band of the transmission signal of the communication system.

Therefore, the transmission signal of the DCS / PCS communication system is received by the filter of the capacitor element C61, the inductance element L61, the capacitor element C62, the switching diode D601 (the on-inductance component is generated), and the capacitor element C63 as a reception terminal. It is not led out to RXDCS and is not led out to the reception terminal RXPCS by the switching diode D701 in the off state.

Further, at the time of reception by the PCS communication system,
A bias signal for turning off the switching diode D501 (for example, no bias is applied or a negative voltage is applied) is applied to the control terminal VC2, and at the same time, a bias signal for turning on the switching diode D701 is supplied to the control terminal VC3. The bias signal supplied to the switching diode D701 is also applied to the switching diode D601 to be in the ON state. Here, the capacitor element C61 and the inductance element L61
(On-inductance component is generated), capacitor element C
62, the switching diode D601, and the capacitor element C63 act as a filter that blocks the band of the received signal of the DCS communication system. That is, the capacitor element C61, the inductance element L61, the capacitor element C62, the switching diode D601, and the capacitor element C63 are
Further, it is necessary to set the circuit constants of the respective elements so as to function as a filter that blocks a received signal of the DCS communication system.

Therefore, the received signal of the PCS communication system which has been received by the antenna terminal ANT and passed through the high-pass filter is not led to the transmission terminal TXDCS / PCS by the switching diode D501 in the off state, and the above-mentioned capacitor is not used. The filter of the element C61, the inductance element L61, the capacitor element C62, the switching diode D601 (which generates an on-inductance component), and the capacitor element C63 does not lead to the reception terminal RXDCS. as a result,
It is stably led to the reception terminal RXPCS via the switching diode D701 in the on state.

Further, when receiving the DCS communication system,
A bias signal (for example, no bias is applied or a negative voltage is applied) that turns off the switching diodes D501, D601, and D701 is supplied to the control terminal VC2 and the control terminal VC3. Here, since the switching diode D601 is in the OFF state, the pass band characteristics of the capacitor element C61, the inductance element L61, the capacitor element C62, the switching diode D601 (the off capacitance component is generated), and the capacitor element C63 vary, and the DCS It acts as a filter that passes the band of the received signal of the communication system.

Therefore, the reception signal of the DCS communication system which has been received by the antenna terminal ANT and passed through the high pass filter is not led to the transmission terminal TXDCS / PCS by the switching diode D501 in the OFF state, and is in the OFF state. Switching diode D70
1 does not lead to the receiving terminal RXPCS. As a result, the received signal of the DCS communication system is S
It is stably led to the reception terminal RXDCS via the AW element SF601.

Here, what is important is that the multilayer circuit board 51 of the second electronic component element 2 (capacitor elements C101, C102, inductance element L101 in the circuit of FIG. 2) which constitutes the electrostatic surge eliminating circuit section S is formed. It is an arrangement structure.

That is, of the various electronic component elements 54 mounted on the multilayer wiring board 51, the shortest distance between the second electronic component element 2 and the terminal electrode 56 of the ground potential of the multilayer wiring board 51 is D1, and the second electronic component is First electronic component element 1 (switching diode,
When the shortest distance to the capacitor element, the resistor, the inductance element, the SAW element) is D2, the multilayer wiring board 51
Above the first electronic component element 1 and the second electronic component element 2, D
It was mounted so that the relation of 1 <D2 was satisfied. The mounting situation is shown in FIG. In FIG. 3, among the second electronic component elements 2 forming the electrostatic surge eliminating circuit section S, the component arranged closest to the terminal electrode 56 at the ground potential is, for example, the inductance element L101, and the shortest distance between them is It is D1.

Among the second electronic component elements 2 constituting the electrostatic surge eliminating circuit section S, the component closest to the first electronic component element 1 constituting the switch circuit section SW is, for example,
The first electronic component element 1 is the capacitor element C101.
Is a switching diode D2 in the circuit diagram of FIG. 1 and a switching diode D301 in the circuit diagram of FIG. The relationship between the shortest distances D1 and D2 is D1
<The relationship is D2. As a result, the electrostatic surge signal that has entered from the antenna terminal ANT is removed by the high-pass filter function of the electrostatic surge removing circuit section S, and the inductance element of the second electronic component element 2 that constitutes the electrostatic surge removing circuit section S is further removed. Immediately after L101 is discharged in the air to the terminal electrode 56 at the ground potential. Therefore, the second
1st which comprises the switch circuit part SW from the electronic component element 2
The damage given to the electronic component element 1 can be reduced.

According to the results of various experiments conducted by the present inventors, the shortest distance D1 from the second electronic component element 1 to the terminal electrode 56 at the ground potential is 0.15 to 0.2 mm, and the second electronic component element 2 is Shortest distance D2 to the first electronic component element 1
Is set to 0.25 mm or more, in particular, the electrostatic surge signal that has entered from the antenna terminal ANT is supplied with the high-pass filter function of the electrostatic surge eliminating circuit section S and the air discharge from the second electronic device element 2 to the ground potential. It has been confirmed that the effect of can reduce the damage to the first electronic component element 1.

Further, the capacitor elements C101 and C102 of the electrostatic surge eliminating circuit section S and the inductance element L10.
Configure a high-pass filter with 1 and control the circuit constant,
The cutoff frequency of this bypass filter is 600-8.
It is important to set it to 00 MHz.

In the electrostatic surge signal, the relationship between frequency and electrostatic voltage is inversely proportional. That is, the lower the frequency of the electrostatic surge signal, the higher the surge voltage, and the higher the frequency, the lower the surge voltage. Therefore, in consideration of damage to each electronic component element 1 of the switch circuit unit SW, it is desirable to set the cutoff frequency high. However, conversely, if the cutoff frequency is increased, the transmission / reception signal band required for the communication system will be lost. For example, in the GSM communication system, the frequency range required for communication is from 880 MHz,
For example, when the cutoff frequency is set to 850 MHz, a signal of 880 MHz is actually lost.

Considering both of these, for example, GSM
In order to suppress the loss in the communication system to less than 0.2 dB, the cutoff frequency of the electrostatic surge elimination circuit section S is set to 80
It is desirable to set it to 0 MHz or less.

At the same time, the first electronic component element 1, especially SA
Considering electrostatic breakdown that occurs in the comb-teeth electrodes of the W element SF, the surge voltage needs to be suppressed to 180 V or less, and the frequency needs to be set to 600 MHz or more.

From the above points, it is important to set the cutoff frequency of the electrostatic surge eliminating circuit section S to about 600 to 800 MHz.

FIG. 4 shows the relationship between the cutoff frequency of the electrostatic surge eliminating circuit section S and the surge potential pressure (black square mark and black circle mark) and the loss of the transmission signal of the GSM communication system. It shows the relationship.

In FIG. 4, the black square mark is the second mark.
The shortest distance D1 between the electronic component element 2 and the terminal electrode 56 at the ground potential is set to 0.3 mm, and the black circle mark indicates the shortest distance between the second electronic component element 2 and the ground potential. The difference in surge voltage when the distance D1 is set to 0.15 mm is shown.

Thus, the shortest distance D1 between the second electronic component element 2 and the terminal electrode 56 at the ground potential is 0.15 mm or more, and the shortest distance D2 of the first electronic component element is 0.25.
As a value of mm or more, D2> D1. As shown in the result of FIG. 4, the electrostatic surge signal that has entered from the antenna terminal ANT is particularly effective for the effect of air discharge from the second electronic component element to the ground potential by the effect of the filter function of the electrostatic surge eliminating circuit section S. By increasing the amount, damage to the first electronic component element 1, particularly damage to the SAW element, could be reduced.

When the shortest distance D1 between the second electronic component element 2 and the terminal electrode 56 at the ground potential exceeds 0.2 mm, the second electronic component element 2 and the terminal electrode 56 at the ground potential are formed.
The shortest distance D
It is important to set 1 to a value not exceeding 0.2 mm.

The specific high-frequency module component structure is as follows. The multilayer wiring board 51 is made of a substrate in which a plurality of dielectric layers 52 made of a glass ceramic material are laminated, wirings, strip lines, and a conductor film of ground potential are arranged between the layers of the dielectric layers 52. Via-hole conductors are formed so as to penetrate the dielectric layer 52. An internal wiring pattern including this wiring, strip line, and ground potential is formed. In addition, on one main surface of the multilayer circuit board 51, wiring, a strip line, a ground wiring,
Each electronic component element 54 such as an inductance element, a capacitor element, a switching diode, a resistor, a SAW element
Is installed. A capacitor element is formed by utilizing the internal wiring pattern 55 and the dielectric layer 52, and a resistance element is formed by a thick film resistor film on a part of the wiring pattern on the substrate surface. Here, the electronic component element 54 is the first electronic component element 1 forming the switch circuit section SW, and is also the electronic component element 54 forming the electrostatic surge eliminating circuit section S. In addition, the first electronic component element 1
Among them, the SAW element SF needs to be treated differently from other electronic component elements. That is, the SA element SF needs to be hermetically sealed because it does not like dust. Multilayer wiring board 5
In the SAW element SF mounted on the substrate 1, balanced output type interdigital electrodes (comb-shaped electrodes) are formed on a piezoelectric substrate such as a lithium tantalate single crystal substrate. Surface wiring pattern 5
It is necessary to cover the piezoelectric substrate with a casing-like case that can be hermetically sealed by being mounted on the piezoelectric chip of FIG.

Further, as a high frequency module component, in addition to the switch circuit section SW having the electrostatic surge eliminating circuit section S, especially when a receiving circuit and a part thereof and a transmitting circuit and a part thereof are integrated, an IC chip Is required. In this case, a cavity is formed on the surface of the multilayer wiring board 51, the SAW element SF and the IC chip are housed in the cavity, and the IC chip is connected to the internal wiring pattern exposed in the cavity by a bonding wire or a flip chip. The cavity opening may be hermetically sealed with a metal lid.

The internal wiring pattern 55 is made of silver, silver platinum, copper, or the like, and in particular, the conductor serving as a strip line has a width of 100 to 150 μm and a thickness of 5 to 25 μm. Further, the dielectric layer 52 has a thickness of 8 per layer.
It is composed of 9 layers with a thickness of 0 μm.

Further, each electronic component element 54 is joined to the wiring pattern 43 on the surface of the multilayer wiring board 51 via solder, and by a bonding wire or a solder bump so as to be electrically connected. A shield case 58 that covers each electronic component element 54 is attached. The shield case 58 is joined to the terminal electrode 56 of the ground potential formed on the end surface of the multilayer wiring board 51 via the legs 59 of the shield case 58 via solder,
The entire shield case 58 has the ground potential.

As a result, in the high frequency module component, the shield case 58 is arranged on the upper surface side of the multilayer wiring board 51 and the conductor film of the ground potential, for example, is arranged on the bottom surface side of the multilayer wiring board 51, so that it is shielded as a whole. Since it is surrounded by a container, external noise, or noise generated from the switching diode of the switch circuit unit SW and affecting the external circuit is reduced.

[0071]

As described above, the electrostatic surge eliminating circuit having a high-pass filter function is arranged between the antenna and the switch. In particular, since the shortest distance between the electronic component element that constitutes the electrostatic surge elimination circuit section and the terminal electrode at the ground potential is set appropriately, the switching diode or the SAW element in the switch circuit section is affected by the electrostatic surge signal. It is possible to obtain the best characteristics without receiving it.

Particularly, by setting the cut-off frequency of the electrostatic surge eliminating circuit to 600 to 800 MHz, sufficient electrostatic surge countermeasure can be performed without deteriorating the transmission / reception of the communication system, especially the characteristics of the communication band of the GSM communication system or the like. Can be applied.

[Brief description of drawings]

FIG. 1 is a circuit diagram of a high frequency module component of the present invention.

FIG. 2 is a circuit diagram of another high frequency module component of the present invention.

FIG. 3 is a partial plan view of the high frequency module component of the present invention.

FIG. 4 is a characteristic diagram showing the relationship between the cutoff frequency that determines the conditions of the present invention, the electrostatic surge voltage drop, and the passband loss of the GSM communication system.

FIG. 5 is an exploded perspective view of a typical high frequency module component.

FIG. 6 is a circuit diagram of a conventional high frequency module component.

[Explanation of symbols]

50 high frequency module parts 51 multilayer wiring board 52 Dielectric layer 53 wiring pattern 54 Electronic components 56 Terminal electrode of ground potential S Electrostatic surge elimination circuit section SW switching circuit section 1 First electronic component element 2 Second electronic component element

Claims (3)

[Claims] 1. A first electronic component element constituting a switch circuit section on a surface of a multilayer wiring board for selectively controlling a supply of a reception signal received from an antenna to a reception circuit and a transmission signal of a transmission circuit to an antenna. And disposed between the antenna and the switch circuit unit,
A second electronic component element that constitutes an electrostatic surge elimination circuit portion that attenuates a surge voltage that intrudes from the antenna terminal is mounted, and an antenna terminal that is connected to the terminal electrode at the ground potential and the antenna is provided on the end face of the multilayer wiring board. In a high-frequency module component having electrodes, the shortest distance between the second electronic component element and the terminal electrode at the ground potential is D1, the first electronic component element and the second electronic component element.
When the shortest distance from the electronic component element is D2, D1 <D2
High-frequency module parts that satisfy the above requirements. 2. The high frequency module component according to claim 1, wherein the second electronic component element is a high-pass filter having a cutoff frequency of 600 to 800 MHz. 3. The shortest distance D1 is 0.15 to 0.2 mm.
2. The high-frequency module component according to claim 1, wherein the shortest distance D2 is a value of 0.25 mm or more.