JP2003289194A - Boiling cooler - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a boiling cooler which is capable of smoothly circulating a refrigerant when it is used in a side heat position. <P>SOLUTION: A main flow path is composed of an opening 241b, a communicating path 242, an opening 231b, and a lower part of a rectilinear flow path 222. Most of the condensed liquid refrigerant is sent to a boiling region 61 from below through the above main flow path, and the main flow path is provided to middle plates 22 to 24 out of five plates 21 to 25 composing a refrigerant vessel. The upper end 232a of a blocking part 232 of the middle plate 23 is provided above the vapor-liquid interface of the refrigerant at the time when the refrigerant receives the maximum allowable heat, and only the gaseous refrigerant can be sent to a condensing region. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a boiling cooling device for cooling a heating element by transferring latent heat due to boiling and condensation of a refrigerant.

[0002]

2. Description of the Related Art As a conventional boiling cooling device, there is a boiling cooling device described in Japanese Patent Application No. 2001-327444 already filed by the present applicant. This boiling cooling device is a refrigerant container that receives heat by contacting the bottom surface with a heating element such as a heating electronic component,
A plurality of tubes communicating with the inside of the refrigerant container and assembled upright on the upper surface of the refrigerant container, and a header tank communicating the plurality of tubes with each other are provided.

The refrigerant container has a heat receiving plate on the surface of which a heating element is attached and a heat radiating plate on which the tube is attached to the surface. The refrigerant container penetrates in the plate thickness direction between the heat receiving plate and the heat radiating plate. A stack of two intermediate plates having a plurality of slit-shaped openings is shown. FIG. 4 shows an example of a laminated structure of plate members used in a refrigerant container having such a laminated structure, and FIG. 5 (a) is a sectional view of a boiling cooling device including the refrigerant container.
Shown in.

As shown in FIG. 4, an intermediate plate 122 and an intermediate plate 124 are superposed between the heat receiving plate 121 and the heat radiating plate 125. The intermediate plate 124 is an intermediate plate adjacent to the heat dissipation plate 125 in which an opening 125a to which a tube is attached is formed, and the intermediate plate 124 has, as shown in FIG.
A plurality of slit-shaped openings 124a extending in the horizontal direction in the figure of the intermediate plate 124 are arranged in parallel. Further, the intermediate plate 122 is an intermediate plate adjacent to the heat receiving plate 121, and as shown in FIG. 4, the intermediate plate 122 has a plurality of slit-shaped openings 122a extending in the vertical direction of the intermediate plate 122. It is installed side by side.

And, these intermediate plates 122, 1
When 24 is placed between the heat receiving plate 121 and the heat radiating plate 125, the slit-shaped opening 122a is formed.
And the opening 124a are arranged so as to be orthogonal to each other. As a result, the opening 122a and the opening 124a are all in communication with each other to form a space for storing the refrigerant in the refrigerant container.

The portion where the mounting range of the heating element is projected on the mounting surface side in the coolant container in the direction perpendicular to the mounting surface is the boiling region, and in this boiling region, the heat of the heating element is received and the refrigerant evaporates and vaporizes. The boiling region is the range indicated by reference numeral 161 surrounded by the alternate long and short dash line shown in FIG.

These plates 121, 122, 12
As shown in FIG. 5 (a), the boiling cooling device 101 including the refrigerant container 102 configured by laminating 4, 125 is arranged such that the refrigerant container 102 is on the lower side.
When cooling the heating element 6 attached to the outer bottom surface of the refrigerant container 2 (when used in so-called bottom heat), the refrigerant container 1
The refrigerant stored in 02 receives the heat of the heating element 6 and boils mainly in the boiling region.

The boiling and gasifying refrigerant mainly passes through the tube 103 above the boiling region and passes through the header tank 10.
4 and returns to the outer peripheral portion in the refrigerant container 102 mainly through the tube 103 above the outside of the boiling region. At this time, in the tube 103, the refrigerant releases latent heat to the outside and condenses into a liquid refrigerant.

In the above example, the header tank 1
Reference numeral 04 is configured by stacking plates 121, 122, 124, and 125 in the reverse order of the refrigerant container 102.

[0010]

However, in the above-mentioned boiling cooling apparatus, the refrigerant container 102 is arranged so as to be on the side as shown in FIG.
When the heating element 6 attached to the lateral outer surface of 02 is used in a posture for cooling (so-called side heat posture), the refrigerant is different from that used for so-called bottom heat shown in FIG. Flow through the path.

The refrigerant stored in the refrigerant container 102 receives the heat of the heating element 6 to boil mainly in the boiling region, and the refrigerant which is boiled and gasified is as shown in FIG. 5 (b). It passes through the tube 103 on the middle upper side, passes through the inside of the header tank 104, and returns to the inside of the refrigerant container 102 via the tube 103 on the lower side in the drawing. At this time, in the tube 103, the refrigerant releases latent heat to the outside and condenses to become a liquid refrigerant, which is returned to the refrigerant container 2.

At this time, a part of the refrigerant that has boiled in the boiling region in the refrigerant container 102 tries to flow back in the refrigerant container 102, or tries to flow backward in the tube 103 in the vicinity of the boiling region. May interfere with the flow of.

If the liquid refrigerant in the refrigerant container 102 flows into the upper tube 103 together with the gas refrigerant, the condensing performance of the refrigerant may deteriorate. Further, the flow of the refrigerant flowing into the header tank 104 is disturbed, and a part of the refrigerant rises in the header tank 104 and tries to flow backward in the tube 103 on the upper side in the drawing, and interferes with the original flow in the circulation direction. There is a case.

As described above, when the conventional boiling cooling device is used in the side-heat posture, there is a problem that the circulation of the refrigerant is not smoothly performed and the cooling performance may be deteriorated.

The present invention has been made in view of the above points, and is of a side heat for cooling a heating element which is arranged so that the refrigerant container is on the lateral side and is attached to the lateral outer surface of the refrigerant container. An object of the present invention is to provide a boiling cooling device capable of smoothly circulating a refrigerant when used in a posture.

[0016]

In order to achieve the above-mentioned object, in the invention described in claim 1, the heating element (6) is attached to the side surface, and the inside of the heating element (6) receives the heat and boils. A refrigerant container (2) for storing a refrigerant and a heating element (6) of the refrigerant container (2) communicating with the inside of the refrigerant container (2).
Of a plurality of tubes (3a, 3b) assembled substantially upright on the side surface facing the mounting surface of
a, 3b, 5) and a header tank (4) that connects the plurality of tubes (3a, 3b) to each other, and the refrigerant stored in the refrigerant container (2) receives heat from the heating element (6). And vaporize to vaporize the latent heat of the refrigerant vapor to the heat radiating part (3
a boiling cooling device (1) for cooling a heating element (6) by discharging from a, 3b, 5) a plurality of tubes (3a,
3b) is a first tube (3a) for sending the refrigerant from the refrigerant container (2) to the header tank (4) and a second tube (3b) for sending the refrigerant from the header tank (4) to the refrigerant container (2). And a boiling region (61) in which the refrigerant evaporates by the heating element (6) is formed inside the refrigerant container (2), and the refrigerant container (2) includes the second tube (3b).
Most of the refrigerant flowing in from the main flow path (241) is supplied to the boiling region (61) from the lower side of the boiling region (61).
b, 242, 231b, 222a).

According to this, the condensed liquid refrigerant is supplied from the lower side to the boiling region (61) through the main flow paths (241b, 242, 231b, 222a), and the refrigerant container (2).
The refrigerant that has boiled and gasified in the boiling region (61) in the
It is difficult to flow backward in the tube (3b) direction. Therefore, it is possible to make the refrigerant circulation smooth.

According to the second aspect of the invention, the refrigerant container (2) has a boiling region in the first tube (3a) when at least the maximum allowable heat amount is received from the heating element (6). In (61), it is characterized in that only the vaporized refrigerant vapor is sent.

According to this, it is possible to send only the refrigerant vapor (gas refrigerant) to the first tube (3a) and prevent the inflow of the liquid refrigerant. This is effective when it is necessary to exert a large cooling performance.

Further, as in the invention described in claim 3, the refrigerant container (2) has an inflow blocking portion (232) for blocking the inflow of the liquid refrigerant into the first tube (3a). The upper end (232a) of the inflow prevention section (232) is located above the refrigerant gas-liquid interface (62) in the refrigerant container (2) when the refrigerant container (2) receives the maximum allowable amount of heat from the heating element (6). By providing the first tube (3a), only the refrigerant vapor boiled and vaporized in the boiling region (61) can be sent.

Further, in the invention according to claim 4, the refrigerant container (2) includes a plurality of plate members (21, 22, 23,
24, 25) are laminated and formed.

According to this, a plurality of plate members (2
By laminating (1, 22, 23, 24, 25), the refrigerant container (2) can be easily constructed. Further, in the invention according to the third aspect, it is easy to form the inflow blocking portion (232).

Further, in the invention described in claim 5, the header tank (4) includes a plurality of plate members (41, 42, 4).
3, 44) are laminated and arranged.

According to this, a plurality of plate members (4
The header tank (4) can be easily constructed by stacking 1, 42, 43, 44).

Further, in the invention according to claim 6, the heat radiating portion (3a, 3b, 5) includes a plurality of tubes (3a, 3b).
It is characterized in that a radiating fin (5) is provided between b).

According to this, the heat dissipation portions (3a, 3b, 5)
It is possible to improve the heat dissipation performance of.

The reference numerals in parentheses attached to the above-mentioned respective means show the correspondence with the concrete means described in the embodiments described later.

[0028]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a diagram showing a schematic structure of a boiling cooling apparatus of this embodiment, (a) is a schematic side view and (b) is a schematic side view.
[Fig. 1] is a view of the boiling cooling device as viewed from the left side of Fig. 1 (a). Further, FIG. 2 is a sectional view taken along the line AA of FIG.

As shown in FIG. 1 (a), a boiling cooling device 1
Is for cooling the heating element 6 such as a semiconductor element, for example, a refrigerant container 2 for storing a refrigerant in the internal space, and a plurality of (7 in this example) tubes communicating with the internal space of the refrigerant container 2. 3a, 3b and the plurality of tubes 3a, 3
It is composed of a header tank 4 that communicates b with each other, and a radiation fin 5 provided between the plurality of tubes 3a and 3b.

In FIGS. 1A and 2, the radiation fins 5 are shown only between the tubes 3a at one location, and the other 5 are shown.
Illustration is omitted between the tubes at the locations. Here, the tube that sends the refrigerant from the refrigerant container 2 to the header tank 4 is the tube 3a that is the first tube, and the tube that sends the refrigerant from the header tank 4 to the refrigerant container 2 is
It is the tube 3b which is the second tube.

In the following description, the range of attachment of the heating element 6 to the refrigerant container 2 is the direction perpendicular to the attachment surface (see FIG. 1).
The portion projected to the mounting surface side in the refrigerant container 2 in (a) the left-right direction) is the boiling region, and the heating element 6 is located in this boiling region.
The refrigerant evaporates by receiving the heat of.

As shown in FIGS. 1A and 2, the refrigerant container 2 is a heat receiving plate 21 which is a plate member on the mounting surface side, and a plate member which is arranged on the outermost side opposite to the mounting surface. Heat dissipation plate 25 and heat receiving plate 21
The intermediate plates 22, 23, 24, which are three plate members, are stacked between the heat dissipation plate 25 and the heat dissipation plate 25.

The header tank 4 has an outer plate 41 which is a plate member having the same structure as the heat receiving plate 21 which constitutes the refrigerant container 2, and an outer plate which is a plate member which has the same structure as the heat radiating plate 25 which constitutes the refrigerant container 2. Four
4, and two intermediate plates 42, 43 which are two plate members laminated between the two outer plates 41, 44
It is composed by.

The intermediate plates 42 and 43 include an intermediate plate 122 used in the conventional boiling cooling apparatus 101,
The same as 124 is used. That is, the header tank 4 of the present embodiment is the conventional boiling cooling device 101.
Of the header tank 104 of FIG.

The heat receiving plate 21, the heat radiating plate 25, the intermediate plates 22, 23 and 24, and the outer plate 4
1, 44 and the intermediate plates 42, 43 are made of metal plates (for example, aluminum plates or aluminum alloy plates) that can be brazed and have excellent thermal conductivity, and are formed in the same rectangular shape in plan view. Specifically, aluminum plates are used for the heat receiving plate 21 and the outer plate 41 because of their thermal conductivity, and the other plates 22 to
For 25 and 42 to 44, a clad material in which a brazing material layer is formed on the surface of an aluminum alloy plate as a base material is used.

FIG. 3 is an explanatory view showing the laminated structure of the refrigerant container 2 of the boiling cooling device 1.

As shown in FIG. 3, the heat dissipation plate 25 is provided with a plurality of slit-shaped openings 251.
The opening 251 is an insertion hole into which tubes 3a and 3b described later are inserted.

Further, in each of the plates 21 to 25, through holes 214, 224, and 23 are respectively provided at a plurality of (four in this example, but some of which are not shown) corresponding to the lamination.
4, 244, 254 are provided. These through holes 214, 224, 234, 244, and 254 are used for the heating element 6
This is a hole used when screwing the boiling cooler 1 to an electronic device or the like (not shown) equipped with the. It should be noted that slits and the like which are formed in the intermediate plates 22, 23 and 24 and serve as a refrigerant flow path will be described later.

The tube 3 shown in FIGS. 1 (a) and 2
Reference numerals a and 3b are perforated flat tubes having a plurality of tubular passages therein by extrusion molding of an aluminum material. Further, the heat radiation fin 5 is formed by corrugating a thin plate material of aluminum having excellent heat conductivity. The thin plate material forming the heat radiation fins 5 has a brazing material layer formed on the surface thereof. And each plate 21-25, 41-4 which comprises the refrigerant | coolant container 2 and the header tank 4 is shown.
The boiling cooling device 1 is formed by integrally brazing the 4, tubes 3a, 3b and the radiation fins 5.

In FIG. 3, the region surrounded by the alternate long and short dash line of the heat receiving plate 21 and the intermediate plate 22 is the boiling region 61 described above. As shown in FIG. 3, the intermediate plate 2
2, a plurality of slit-shaped openings 222 extending in the vertical direction in the drawing are arranged in parallel, and the five central openings of the openings 222 are linear flows formed so as to cross the boiling region 61 vertically. It is the path 222a.

Further, in the intermediate plate 24, the opening portion 2 in which the tubes 3a and 3b are attached to the heat dissipation plate 25.
Corresponding to the position of 51, a plurality of slit-shaped openings 24
1a and 241b are provided. Between the lower two openings 241b (the opening 241b corresponding to the opening 251 in which the uppermost tube 3b is assembled and the opening 241b corresponding to the opening 251 in which the lowermost tube 3b is assembled) Is formed with a wide communication part 242.

Further, in the intermediate plate 23, the opening 2 in which the tubes 3a and 3b are attached to the heat dissipation plate 25.
Corresponding to the position of 51, a plurality of slit-shaped openings 23
1a and 231b are provided. However, 2 from the bottom
No opening is formed in the portion corresponding to the position where the third and third tubes 3b are assembled, and this portion has an opening 222 (the linear flow path 22).
2a), the opening portion 241b of the intermediate plate 24, and the communication portion 242 as a blocking portion 232 that is an inflow blocking portion.

When the five plates 21 to 25 are laminated and integrated, in the refrigerant container 2, the linear flow path 22 is formed.
The boiling region 61 and the tube 3a communicate with each other through the upper portion of 2a, the upper opening 231a, the upper opening 241a, and the like. Further, the lower opening 241b, the communication portion 242,
The tube 3b and the boiling region 61 communicate with each other through the lowermost opening 231b and the lower portion of the linear flow path 222a.

Here, the lower opening 241b and the communicating portion 2
42, the lowermost opening 231b and the linear flow path 222
The path formed by the lower part of a is the main flow path in the present embodiment that supplies most of the refrigerant flowing from the tube 3b to the boiling region 61 from the lower side. Further, the upper end 232a of the cutoff portion 232 which is the inflow prevention portion, when the heating element 6 attached to the side surface of the refrigerant container 2 generates the maximum amount of heat generation (in other words, the boiling cooling device 1 receives the maximum allowable amount of heat). At the time), it is provided at a position higher than the gas-liquid interface 62 (shown in FIG. 2) of the refrigerant in the refrigerant container 2.

In the present embodiment, each of the plates 21 to 21 described above is
The slits, holes, etc. provided in Nos. 25, 41 to 44 were formed by press working. In addition to pressing, cutting,
It can also be formed by etching or the like. Although not shown, the refrigerant container 2 is provided with an injection pipe communicating with the internal space thereof, and a predetermined amount of the refrigerant is injected into the internal space through the injection pipe, and after injection,
The tip of the injection pipe is sealed off and sealed. Also,
Freon is used as the refrigerant in this example.

Next, the operation of the boiling cooling device 1 having the above structure will be described.

The boiling cooling device 1 comprises a heating element 6 of the refrigerant container 2.
The mounting surface is arranged laterally (so-called side heat posture).

The refrigerant stored in the refrigerant container 2 receives the heat of the heating element 6 and is vaporized in the boiling region 61 to become a gas refrigerant, which flows from the refrigerant container 2 into the tube 3a arranged above. The refrigerant flowing into the tube 3 a from the refrigerant container 2 passes through the inside of the header tank 4 and returns to the inside of the refrigerant container 2 from the tube 3 b arranged below.

At this time, the refrigerant is cooled by heat exchange with the outside air when flowing through the tube 3a to become a condensate,
The condensed liquid refrigerant returns to the refrigerant container 2 while being cooled via the tube 3b. The heating element 6 is cooled by repeating the above cycle (boiling-condensing liquefaction). Since the heat radiation fins 5 are arranged between the tubes 3a and 3b, the refrigerant can be cooled well. The structure including the tubes 3a and 3b and the heat radiation fin 5 is the heat radiation portion in the present embodiment.

Here, the circulation path of the refrigerant in the refrigerant container 2 will be described in detail with reference to FIG. 3. The refrigerant vapor (gas refrigerant) boiled in the boiling region 61 is opened from the upper part of the linear flow path 222a to the opening part. It passes through 231a and the opening 241a and flows into the tube 3a assembled in the opening 251.

On the other hand, the liquid refrigerant flowing back through the tube 3b flows into the opening 241b or the communication portion 242,
They join at the site of the opening 241b at the bottom. The combined liquid refrigerant passes through the opening 231b, mainly rises in the lower part of the linear flow path 222a, and flows back to the boiling region 61 from below.

According to the above configuration and operation, the boiling cooling device 1 is used in a so-called side heat posture as shown in FIGS. 1 and 2, but most of the condensed liquid refrigerant is Opening part 241b, communication part 242, opening part 23
The coolant that is supplied from below to the boiling region 61 through the lower portion of the linear flow channel 222a and the linear flow channel 222a and is boiled and gasified in the boiling region 61 is unlikely to flow backward in the tube 3b direction.

Further, when the heating element 6 generates the maximum amount of heat and the boiling cooling device 1 is required to exhibit sufficient cooling performance, the refrigerant gas-liquid interface 62 in the refrigerant container 2 has the blocking portion 23.
The position is lower than the upper end 232a of No. 2. Therefore, it is possible to prevent the liquid refrigerant from flowing into the tube 3a, to favorably condense the refrigerant in the tube 3a, and to prevent the refrigerant flow from being disturbed in the tube 3a and the header tank 4. It is possible.

In this way, the circulation of the refrigerant can be made smooth and good cooling performance can be exhibited.

Also, the plurality of plates 21, 22, 23,
By stacking 24 and 25, the refrigerant container 2 including the blocking portion 232 and the like can be easily manufactured. Also, by stacking a plurality of plates 41, 42, 43, 44,
The header tank 4 can be easily manufactured.

(Other Embodiments) In the above-described embodiment, in the refrigerant container 2, most of the condensed liquid refrigerant flowing in from the tube 3b is provided with the opening 241b, the communicating portion 242, the opening 231b and the linear flow path. Although it was supplied from the lower side to the boiling region 61 through the lower part of 222a,
It goes without saying that all the liquid refrigerant flowing from the tube 3b may be supplied to the boiling region from the lower side.

Further, in the above-mentioned one embodiment, the shielding portion 2
The upper end 232a of 32 is provided above the refrigerant gas-liquid interface 62 in the refrigerant container 2 when receiving the maximum allowable heat amount, but it may be always provided at a position higher than the gas-liquid interface.

Further, in each of the above-mentioned embodiments, a so-called corrugated type radiation fin 5 is provided between the tubes 3a and 3b.
However, other types of fins may be used. Further, the fins may be eliminated as long as sufficient heat dissipation performance can be secured.

[Brief description of drawings]

FIG. 1 is a diagram showing a schematic structure of a boiling cooling device according to an embodiment of the present invention, in which (a) is a schematic side view and (b) is a schematic side view.
[Fig. 6] is a view seen from the left side of (a).

FIG. 2 is a cross-sectional view taken along the line AA of FIG. 1 (b) of the boiling cooling device according to the embodiment of the present invention, and is a cross-sectional view when the boiling cooling device is used in a side heat posture.

FIG. 3 is an explanatory diagram showing a laminated structure of a refrigerant container of a boiling cooling device according to an embodiment of the present invention.

FIG. 4 is an explanatory view showing a laminated structure of a refrigerant container of a conventional boiling cooling device.

FIG. 5 is a cross-sectional view of a conventional boiling cooling device, (a)
Is a cross-sectional view when used in the bottom heat posture,
(B) is a cross-sectional view when used in a side heat posture.

[Explanation of symbols]

1 boiling cooling system 2 Refrigerant container 3a tube (first tube, part of heat dissipation part) 3b tube (second tube, part of heat dissipation part) 4 header tank 5 Radiation fins (a part of heat radiation part) 6 heating element 21 Heat receiving plate (plate member) 22, 23, 24 Intermediate plate (plate member) 25 Heat dissipation plate (plate member) 41, 44 Outer plate (plate member) 42, 43 Intermediate plate (plate member) 222a Straight flow path (lower side is part of main flow path) 231b Opening (part of main flow path) 232 Shielding part (inflow blocking part) 232a upper end 241b Opening (part of main flow path) 242 communication part (part of main flow path)

─────────────────────────────────────────────────── ─── Continued Front Page (51) Int.Cl. ⁷ Identification Code FI Theme Coat (Reference) H01L 23/427 H01L 23/46 A

Claims (6)

[Claims] 1. A refrigerant container (2) having a heating element (6) attached to a side surface thereof, and storing therein a refrigerant boiled by receiving heat of the heating element (6), and an inside of the refrigerant container (2). A plurality of tubes (3a, 3a, 3b, 3d, which are connected to the refrigerant container (2) so as to be substantially upright on the side surface of the refrigerant container (2) facing the mounting surface of the heating element (6).
The refrigerant stored in the refrigerant container (2) is provided with a heat radiating part (3a, 3b, 5) having 3b) and a header tank (4) communicating the plurality of tubes (3a, 3b) with each other. Receives heat from the heating element (6) and evaporates to boiling, and the latent heat of the refrigerant vapor is released from the heat radiating portion (3a, 3b, 5) to cool the heating element (6). ), The plurality of tubes (3a, 3b) are the first tube (3a) for sending the refrigerant from the refrigerant container (2) to the header tank (4), and the header tank (4). A second tube (3b) for sending the refrigerant to the refrigerant container (2), and inside the refrigerant container (2), there is a boiling region (61) where the refrigerant is evaporated and vaporized by the heating element (6). Formed, the refrigerant container (2) is connected to the second tube. Most of the refrigerant flowing from the blanking (3b), said boiling area (61),
The main flow path (2) supplied from the lower side of the boiling region (61)
41b, 242, 231b, 222a). 2. The refrigerant container (2) receives at least the maximum allowable amount of heat from the heating element (6),
In the first tube (3a), the boiling area (61)
The boiling cooling device according to claim 1, wherein the boiling cooling device is configured to send only the vaporized refrigerant vapor. 3. The refrigerant container (2) has an inflow blocking part (232) for blocking the inflow of the liquid refrigerant into the first tube (3a), and the upper end of the inflow blocking part (232) (232). 232a) is provided above the refrigerant gas-liquid interface (62) in the refrigerant container (2) when the refrigerant container (2) receives the allowable maximum heat amount from the heating element (6). The boiling cooling device according to claim 2. 4. The refrigerant container (2) according to claim 1, wherein a plurality of plate members (21, 22, 23, 24, 25) are stacked and arranged. The boiling cooling device according to any one of claims. 5. The header tank (4) is formed by stacking a plurality of plate members (41, 42, 43, 44).
The boil cooling apparatus according to any one of 1. 6. The heat dissipating portion (3a, 3b, 5) comprises a heat dissipating fin (5) between the plurality of tubes (3a, 3b). The boiling cooling device according to any one of claims.