JP2003289125A - Heat-radiating plate mounting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat-radiating plate mounting device whose assembly workability can be facilitated. <P>SOLUTION: In this heat-radiating plate mounting device for mounting a heat-radiating plate 3 via a spacer 2 on a substrate 1, the substrate 1 is provided with a penetrating part for penetrating the spacer 2 and a restraining part projected to the center of the penetrating part at the edge part of the penetrating part. The spacer 2 is provided with a screw part formed at the upper part and cut toward the lower part and an engaging part formed so as to be projected outward on the side face, and so as to be engaged with the restraining part. Then, the restraining part of the substrate 1 is engaged with the engaging part, and the heat-radiating plate 3 is mounted on the screw hole of the spacer mounted on the substrate by screwing the screw. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat sink mounting device, in which a heat sink mounting spacer can be mounted by one-touch operation, and it is not necessary to invert the substrate when mounting the heat sink, and assembling workability is possible without a simple jig. The present invention relates to a device for mounting a heat dissipation plate on a substrate of an electronic device that improves the heat dissipation.

[0002]

2. Description of the Related Art FIG. 7 is a perspective view showing a structure of a conventional radiator plate mounting apparatus for an electronic device board, and FIG. 8 is a sectional view showing an assembled state of the radiator plate mounting apparatus shown in FIG. 1 in each figure
Reference numeral 0 denotes a substrate of an electronic device for mounting a semiconductor 10b, which will be described later, 10a is a through hole formed through the substrate 10, and a through hole through which a fastening screw 40 for mounting a heat dissipation plate 30, which will be described later, penetrates. A semiconductor, which is a heat-generating component mounted on the substrate 10, is a heat-dissipating plate 30 that is mounted on the substrate 10 by the thickness of the semiconductor 10b when the heat-dissipating plate 30 is attached.
A spacer 20a for further separating and adjusting the gap between the board 10 of the electronic device and the heat sink 30 is provided so as to prevent the semiconductor 10b of the heat generating component mounted on the board 10 of the electronic device from being damaged by the attachment of the heat sink 30. A through hole formed through the spacer 20 and through which a fastening screw 40 for mounting a heat dissipation plate 30 described later penetrates, 20b is a double-sided tape for temporarily fixing the spacer 20 to the substrate 10 of the electronic device, and 30 is a semiconductor 10b. The heat dissipation plate 30 which is in thermal contact with the semiconductor device 10b, which is a heat generating component mounted on the board 10 of the electronic device, is provided by threading the heat dissipation plate 30 so that a fastening screw 40 described later can be screwed. , A female screw portion fixed by the fastening screw 40, 40 is a female screw portion 30a of the heat sink 30
A fastening screw that is screwed into the connector 50 is a deformation that fills the gap between the semiconductor 10b of the heat-generating component mounted on the substrate 10 of the electronic device and the heat sink 30 and improves the thermal conductivity between the semiconductor 10b and the heat sink 30. It is a possible heat conductive sheet.

Next, the operation will be described. First, the spacer 20 is attached to the substrate 10 of the electronic device. On this occasion,
Double-sided tape 2 to temporarily fix the position of the spacer 20
The spacer 20 is attached to the substrate 10 of the electronic device by 0b. Next, the heat conductive sheet 50 is attached onto the semiconductor 10b of the heat generating component mounted on the substrate 10 of the electronic device.

Next, the female screw portion 30a provided on the heat sink 30 and the substrate 10 of the electronic device are turned upside down with the substrate 10 of the electronic device on which the spacer 20 is attached with the female screw portion 30a side of the heat sink 30 as the upper surface. The through holes 10a provided in the above are stacked so that the positions thereof match. At this time, since the spacer 20 is attached to the substrate 10 by the double-sided tape 20b as described above, it is prevented from falling off.

Next, the fastening screw 40 is attached to the board 1 of the electronic device.
0 is inserted into the through hole 10a provided in the spacer 20, and the through hole 20a provided in the spacer 20 is threadedly engaged with the female screw portion 30a provided in the heat radiating plate 30 so that the heat radiating plate 30 is held. .

[0006]

However, as described above, the conventional heat sink mounting device for an electronic device is configured to hold the heat sink from the back side of the substrate of the electronic device with the fastening screw. Therefore, it is necessary to provide a double-sided tape on the spacer so that the spacer does not drop off because the female screw portion side of the heat sink is the upper surface and the substrate of the electronic device is turned upside down for assembly. Further, a simple jig has been required for facilitating alignment between the through hole provided in the substrate of the electronic device and the female screw portion of the heat dissipation plate. Therefore, there is a problem that assembly workability is poor.

The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a heat sink mounting device which facilitates assembly workability.

[0008]

According to another aspect of the present invention, there is provided a heat dissipation plate mounting device for mounting a heat dissipation plate on a substrate via a spacer, wherein the substrate has a fitting portion through which the spacer is fitted, and a fitting portion. Has a locking portion that projects toward the center of the fitting portion, and the spacer is provided in a screw hole that is provided in the upper portion and cut toward the lower portion, and that is provided on the side surface so as to project outward. The heat dissipation plate has an engaging portion that engages with the engaging portion, and the screw is screwed into the screw hole of the spacer attached to the substrate by engaging the engaging portion and the engaging portion of the board. It is attached.

Further, the engaging portion and the engaging portion are parallel to each other, and the engaging portion and the engaging portion engage with each other by rotating with the spacer fitted in the substrate.

Further, the engaging portion is provided with a rotation inhibiting portion which inhibits rotation of the spacer in a state of being fitted in the substrate.

Further, the spacer is provided with a plurality of engaging portions in the height direction.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. Hereinafter, a first embodiment of a heat sink mounting device for a substrate of an electronic device of the present invention
Will be described with reference to FIG. 1 is a first embodiment of the present invention.
FIG. 2 is a perspective view of a heat sink mounting device for a board in an electronic device using the heat sink mounting device shown in FIG. 2, and FIG. 2 shows an assembled state of the heat sink mounting device in which the heat sink is mounted by a spacer inserted into the substrate in the upper groove portion. FIG. 3 is a cross-sectional view showing the assembled state of the heat dissipation plate mounting device in which the heat dissipation plate is attached by the spacer inserted into the substrate in the lower groove portion, and FIG. 4 is a detailed view of the parts of the spacer to which the heat dissipation plate is attached. , (A)
Is a perspective view, (b) is a top view, (c) is a side view, and FIG. 5 is a top view of an opening hole provided in the substrate of the electronic device shown in FIG. 1.
FIG. 6 is a detailed view showing a state diagram in which the spacer for attaching the heat sink is fitted into the opening hole provided in the substrate of the electronic device.

In the figure, reference numeral 1 is a board of an electronic device for mounting a semiconductor 1a described later, and 1a is a board 1 of the electronic device.
The semiconductor 1b of the heat generating component mounted on is a fitting portion 1c through which a spacer 2 to which the heat dissipation plate 3 is attached and which will be described later are fitted, and a protrusion protruding toward the center of the penetration portion at the edge of the fitting portion 1c. The opening 2 formed through the substrate 1 so as to be composed of the portion 1d separates the radiator plate 3 from the substrate 1 by the thickness of the semiconductor 1a when the radiator plate 3 described later is attached. Semiconductor 1 of heat generating component mounted on substrate 1 of electronic device
a is a spacer that can be attached with one touch to adjust the gap between the heat sink 3 and the substrate 1 of the electronic device provided so as not to be damaged by the attachment of the heat sink 3, and 2a is integrally formed on the side surface of the spacer 2 and The engaging portion 2d which is provided to project in the direction and engages with the engaging portion 1d formed in the opening hole 1b of the substrate 1, 2b is a groove portion formed in the engaging portion in the circumferential direction, and 2c is an engaging portion. The rotation restraining portion 2d formed at one end of the groove portion 2b is provided on the upper surface of the spacer 2 by tapping from the upper portion to the lower portion of the spacer 2 with a tap or the like. The screw holes 3 for fastening the screws, which are attached by screwing, are in thermal contact with the semiconductor 1a, and the heat sink 3a for cooling the semiconductor 1a of the heat generating component mounted on the substrate 1 of the electronic device is denoted by 3a. I'm going through A through hole for a fastening screw for fixing the heat sink 3 by piercing the heat sink 3 through the fastening screw 4 and screwing the fastening screw 4 into the screw hole 2d for fastening the fastening screw of the spacer 2. Is a fastening screw that penetrates through the fastening screw through hole 3a of the heat dissipation plate 3 and is screwed into the fastening screw mounting screw hole 2d of the spacer 2; and 5 is a semiconductor 1a which is a heat-generating component mounted on the substrate 1 of the electronic device and radiates heat. It is a deformable heat conductive sheet that fills the gap between the plates 3 and improves the thermal conductivity between the semiconductor 1a and the heat dissipation plate 3.

FIG. 4 shows the details of the spacer 2, and the details of the spacer 2 will be described based on this drawing.

As described above, the spacer 2 is composed of the fastening screw mounting screw hole 2d provided on the upper surface and the engaging portion 2a provided on the side surface. Spacer 2 is
As shown in the drawing, the engaging portion 2a is formed on the side surface of the cylindrical shape with a radius (second radius) larger than the radius (first radius) of this cylindrical shape. As shown in the top view, the side surface of the cylindrical shape having the first radius and the circumference of the engaging portion 2a having the second radius are alternately repeated every 90 degrees. That is, the engaging portion 2a is provided so as to project from the side surface of the spacer 2 in two directions that are opposed to each other in the radial direction.

Further, as shown in the side view, the engaging portion 2a formed with the second radius has a groove portion 2b formed along the circumferential direction with a radius slightly smaller than the first radius. Further, one end of the groove portion 2b has a radius larger than the first radius,
Here, the rotation restraining portion 2c formed with the second radius is formed. The rotation inhibiting portion 2c is formed at the right end toward the side surface. In this embodiment, the groove 2b is provided at two positions in the height direction of the spacer 2.

FIG. 5 shows the details of the opening hole 1b.
The details of the opening hole 1b will be described with reference to this drawing.
As described above, the opening hole 1b is formed by penetrating the substrate 1 with the fitting portion 1c into which the spacer 2 is fitted and the engaging portion 1d provided at the edge portion of the fitting portion 1c. Open hole 1b
Is provided so that the spacer 2 is fitted therethrough,
The shape of the opening hole 1b is the same as the sectional view of the spacer 2, and is formed slightly larger so that the spacer 2 can be easily fitted therein. That is, the first radius and the second radius are alternately formed by 90 degrees.

Next, the operation will be described. In addition, in FIG.
The spacer 2 is fitted into the opening hole 1b formed in the substrate 1, and the engaging portion 2 of the spacer 2 is fitted into the locking portion 1d of the opening hole 1b.
The details of the operation for engaging a are shown.

First, the spacer 2 is inserted into the opening hole 1b formed in the substrate 1 of the electronic device with a size slightly larger than the outer shape of the spacer 2. Next, the locking portion 1d of the opening hole 1b
When the groove 2b of the engaging portion 2a of the spacer 2 is located in the same plane, the spacer 2 is rotated to the right. Then, the engaging portion 1d of the opening hole 1b is inserted into the groove portion 2b, the engaging portion 2a of the spacer 2 engages with the engaging portion 1d of the opening hole 1b, and the spacer 2 is perpendicular to the substrate 1. Fixed.

Next, the heat conductive sheet 5 is attached onto the semiconductor 1a of the heat generating component mounted on the substrate 1 of the electronic device. Next, the heat sink 3 is fastened by aligning the positions of the fastening screw mounting screw holes 2d provided at the center of the spacer 2 mounted on the substrate 1 of the electronic device with the fastening screw through holes provided in the heat sink 3. Secure with screws 4.

As described above, the groove portions 2b provided in the engaging portion 2a are provided at two positions in the height direction of the spacer 2. Therefore, when the spacer 2 is fitted into the substrate 1, the gap between the heat sink 3 and the substrate 1 can be changed by selecting the groove 2b into which the locking portion 1d of the opening hole 1b is fitted. Therefore, even when the height direction of the semiconductor 1a is different, the same spacer 2 can be used. In addition, in the present embodiment, the case where the groove portion 2b is provided at two places has been described, but the groove portion 2b may be provided at two or more places, and the distance between the heat sink 3 and the substrate 1 may be changed by the number of the provided groove portions 2b. It goes without saying that you can do it.

As described above, the heat sink mounting device according to the present embodiment is formed integrally with the fitting portion 1c into which the spacer 2 fits in the substrate 1 on which the semiconductor 1a is mounted and the edge portion of the fitting portion 1c. And an engaging portion 1d provided on the upper surface of the base plate 1.
By providing the spacer 2 which is provided with d and integrally formed with the engaging portion 2a for engaging with the engaging portion 1d on the side surface, and inserting the spacer 2 into the opening to engage the engaging portion 2a with the engaging portion 1d,
Since the spacer 2 is attached to the substrate 1 and the radiator plate 3 is attached to the fastening screw attachment screw hole 2d on the upper surface of the spacer 2 attached to the substrate 1 by the fastening screw, the spacer 2 can be attached with one touch. It is possible to attach, and the heat dissipation plate 3 can be attached by screws from the front side of the substrate 1, which has the effect of improving the assembly workability. Further, since the plurality of groove portions 2b of the engaging portion 2a of the spacer 2 are provided, the distance between the heat dissipation plate 3 and the substrate 1 can be changed.

[0023]

EFFECTS OF THE INVENTION The heat dissipation plate attaching device according to the present invention is a heat dissipation plate attaching device for attaching a heat dissipation plate to a substrate through a spacer, wherein the substrate has a fitting portion into which the spacer is fitted and an edge portion of the fitting portion. Has a locking portion that projects toward the center of the fitting portion, and the spacer has a screw hole that is provided in the upper portion and that is cut toward the lower portion and the locking portion that is provided on the side surface and that projects outward. The heat dissipation plate has an engaging portion that engages with each other, and the heat sink is attached by screwing a screw into a screw hole of a spacer attached to the substrate by engaging the engaging portion of the substrate and the engaging portion. Therefore, assembly workability can be facilitated.

Further, the engaging portion and the engaging portion are parallel to each other, and the engaging portion and the engaging portion engage with each other by rotating with the spacer fitted in the substrate, so that the assembling workability is improved. Can be done easily.

Further, since the engaging portion is provided with the rotation inhibiting portion for inhibiting the rotation of the spacer in the state of being fitted in the substrate, the assembly workability can be facilitated.

Further, since the spacer is provided with a plurality of engaging portions in the height direction, a plurality of groove portions of the engaging portions of the spacer are provided, so that the distance between the heat sink and the substrate can be changed.

[Brief description of drawings]

FIG. 1 is a perspective view of a radiator plate attaching device for a board in an electronic device using the radiator plate attaching device according to the first embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an assembled state of a heat dissipation plate mounting device in which a heat dissipation plate is attached by a spacer inserted into a substrate in an upper groove portion.

FIG. 3 is a cross-sectional view showing an assembled state of a heat sink mounting device in which a heat sink is attached by a spacer inserted into a substrate in a lower groove portion.

4A and 4B are detailed views of parts of a spacer to which a heat dissipation plate is attached, wherein FIG. 4A is a perspective view, FIG. 4B is a top view, and FIG.

5 is a top view of an opening hole provided in the substrate of the electronic device shown in FIG.

FIG. 6 is a detailed view showing a state diagram in which a spacer for attaching a heat dissipation plate is fitted into an opening hole provided in a substrate of an electronic device.

FIG. 7 is a perspective view showing a configuration of a conventional radiator plate attachment device for an electronic device board.

8 is a cross-sectional view showing an assembled state of the heat sink mounting device shown in FIG.

[Explanation of symbols]

1, 10 Substrate, 1a, 10b Semiconductor, 1b Opening hole, 1c Fitting part, 1d locking part, 10a Through hole, 2,
20 Spacer, 2a Engaging part, 2b Groove part, 2c
Rotation restraint part, 2d fastening screw mounting screw hole, 20a through hole, 20b double-sided tape, 3 heat sink, 3a fastening screw through hole, 30a female screw part, 4, 40 fastening screw,
5,50 heat conductive sheet.

Claims (4)

[Claims] 1. A heat sink mounting device for mounting a heat sink to a board via a spacer, wherein the board has a fitting portion into which the spacer is fitted, and a center of the fitting portion at an edge of the fitting portion. The spacer has a locking portion projecting toward a portion, and the spacer engages with the locking portion provided on an upper portion and a screw hole cut toward a lower portion and provided on a side surface so as to project outward. The heat dissipation plate has a matching engaging portion, and the heat dissipation plate is attached by screwing a screw into a screw hole of a spacer attached to the substrate by engaging the engaging portion and the engaging portion of the substrate. Characteristic heat sink mounting device. 2. The engaging portion and the engaging portion are parallel to each other, and the engaging portion and the engaging portion engage with each other by rotating with the spacer fitted in the substrate. The heat sink mounting device according to claim 1, wherein 3. The heat dissipation plate according to claim 1, wherein the engagement portion includes a rotation inhibiting portion that inhibits rotation of the spacer in a state of being fitted in the substrate. Mounting device. 4. The spacer according to claim 1, wherein a plurality of the engaging portions are provided in a height direction of the spacer.
The heat sink mounting device according to any one of 1.