JP2003287552A - Probe needle and polishing method thereof - Google Patents
Probe needle and polishing method thereofInfo
- Publication number
- JP2003287552A JP2003287552A JP2002090357A JP2002090357A JP2003287552A JP 2003287552 A JP2003287552 A JP 2003287552A JP 2002090357 A JP2002090357 A JP 2002090357A JP 2002090357 A JP2002090357 A JP 2002090357A JP 2003287552 A JP2003287552 A JP 2003287552A
- Authority
- JP
- Japan
- Prior art keywords
- probe needle
- electrode pad
- end side
- contact surface
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ウエ−ハに形成さ
れた電子回路の電気的特性を検査するためのプロ−バに
関し、特に上記電子回路の電極パッドに接触させるプロ
−ブ針及びその研磨方法に係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a prober for inspecting electrical characteristics of an electronic circuit formed on a wafer, and more particularly to a probe needle for contacting an electrode pad of the electronic circuit and its probe needle. It relates to a polishing method.
【０００２】[0002]
【従来の技術】プロ−ブカ−ドは、基端部が該プロ−ブ
カ−ドに取り付けられ先端部が下方に屈曲して延びるプ
ロ−ブ針を有し、該プロ−ブ針の先端部に電子回路の電
極パッドを接触させて検査を行うが、上記電極パッドの
表面には、酸化アルミ等の金属酸化膜が薄く生成されて
いるので、電気的に両者を接続するためには、絶縁体で
あるこの金属酸化膜を除去してアルミニウム等の電極パ
ッドの金属部分にプロ−ブ針の先端部を直接接触させな
ければならない。2. Description of the Related Art A probe card has a probe needle having a proximal end portion attached to the probe card and a distal end portion bent downward to extend. The probe needle has a distal end portion. The electrode pad of the electronic circuit is contacted with the inspector, and a metal oxide film such as aluminum oxide is thinly formed on the surface of the electrode pad. This metal oxide film, which is the body, must be removed to bring the tip of the probe needle into direct contact with the metal portion of the electrode pad such as aluminum.
【０００３】そのため、ウエ−ハを吸着保持するウエ−
ハテ−ブルを上昇して該ウエ−ハ面に形成した電極パッ
ドをプロ−ブ針の先端に接触させた後、該ウエ−ハテ−
ブルをオ−バ−ドライブしてウエ−ハをさらに上昇し、
プロ−ブ針の先端部に針圧を作用させることにより該先
端部で電極パッド面の金属酸化膜を除去するようにして
いる。このようなオ−バ−ドライブは、プロ−ブカ−ド
に設けられている複数のプロ−ブ針の先端部の位置が完
全に同一面に存していないので、各先端部を複数の電極
パッドにそれぞれ確実に接触させるためにも必要であ
る。Therefore, a wafer for adsorbing and holding the wafer is held.
After raising the table to bring the electrode pad formed on the wafer surface into contact with the tip of the probe needle, the wafer table
Overdrive the bull and raise the wafer further,
By applying a needle pressure to the tip of the probe needle, the metal oxide film on the electrode pad surface is removed at the tip. In such an overdrive, the positions of the tips of a plurality of probe needles provided on the probe card are not completely on the same plane, so that each tip has a plurality of electrodes. It is also necessary to ensure reliable contact with the pads.
【０００４】図３は、プロ−ブカ−ドと電子回路の関係
を示す説明図と、従来のプロ−ブ針によるオ−バ−ドラ
イブ中のプロ−ブ針の先端部と電極パッドの関係を示す
説明図である。図において、ウエ−ハテ−ブル（図示
略）に保持されたウエ−ハが（ａ）の位置まで上昇する
と、プロ−ブカ−ド(20)に設けられたプロ−ブ針(21)の
先端部(22)は、電子回路(23)の電極パッド(24)と略平行
な面を有しているので、先端部(22)の下面の全面が電極
パッド(24)に接触する（図３（Ｂ))。そして、ウエ−ハ
テ−ブルをオ−バ−ドライブさせて（ｂ）の位置まで上
昇させると、上記プロ−ブ針(21)は基端部が固定されて
いるので先端部が押し上げられ弾性的に変形し、その先
端部がほぼ水平方向(25)に移動し、前端側角部(26)が上
昇して後端側角部(27)が電極パッド(24)上の金属酸化膜
(28)を除去しながら電極パッド(24)の本体部分にくい込
み、最終位置（ｃ）まで上昇させると、該後端側角部(2
7)は電極パッド(24)に深く入り込んで金属部分に電気的
に接続される。FIG. 3 is an explanatory view showing the relationship between the probe card and the electronic circuit, and the relationship between the tip of the probe needle and the electrode pad during the overdrive by the conventional probe needle. It is an explanatory view shown. In the figure, when the wafer held by the wafer table (not shown) rises to the position (a), the tip of the probe needle (21) provided on the probe card (20). Since the portion (22) has a surface substantially parallel to the electrode pad (24) of the electronic circuit (23), the entire lower surface of the tip portion (22) contacts the electrode pad (24) (FIG. 3). (B)). Then, when the wafer table is overdriven to rise to the position (b), the probe needle (21) has its proximal end fixed, so that the distal end is pushed up and is elastic. It is transformed into a metal oxide film on the electrode pad (24) by deforming the tip to move in a substantially horizontal direction (25), raising the front end side corner (26) and raising the rear end side corner (27).
While removing (28), the electrode pad (24) is pushed into the main body part and raised to the final position (c).
The electrode 7) penetrates deeply into the electrode pad 24 and is electrically connected to the metal part.
【０００５】上記のようにしてプロ−ブ針と電極パッド
は電気的に接続されるが、電極パッドに形成されたプロ
−ブ痕やその外周部の凸部の大きさにより種々の問題を
生じている。プロ−ブ痕の深さが電極パッド(24)の厚さ
よりも深くなると電極パッドを突き破って電子回路に損
傷を与えるし、プロ−ブ痕やその外周部の凸部が大きい
と後工程でのボンディングワイヤと電極との接合が不充
分になったり、プロ−ブ針に付着している金属酸化物が
多いと電極パッドとの接触が阻害され、検査の信頼性を
低下させる原因となっていた。Although the probe needle and the electrode pad are electrically connected as described above, various problems occur due to the size of the probe mark formed on the electrode pad and the size of the convex portion on the outer peripheral portion. ing. If the depth of the probe trace becomes deeper than the thickness of the electrode pad (24), it will break through the electrode pad and damage the electronic circuit. If the bonding wire and the electrode are not joined properly, or if there is a large amount of metal oxide attached to the probe needle, contact with the electrode pad is obstructed, which causes a decrease in the reliability of the inspection. .
【０００６】[0006]
【発明が解決しようとする課題】本発明の解決課題は、
上記のようにウエ−ハをオ−バ−ドライブしてプロ−ブ
針の先端部に針圧をかけながら電極パッド上の金属酸化
膜を除去してプロ−ブ針の先端部と電極パッドを電気的
に接続するようにしたプロ−バにおいて、上記プロ−ブ
針が電極パッドを突き破ることがなく、またプロ−ブ痕
やその外周部の凸部を少なくできるようにしたプロ−ブ
針を提供することである。The problems to be solved by the present invention are as follows.
As described above, while overdriving the wafer and applying needle pressure to the tip of the probe needle, the metal oxide film on the electrode pad was removed to remove the tip of the probe needle from the electrode pad. In a prober that is electrically connected, the probe needle does not break through the electrode pad, and a probe needle that can reduce the probe trace and the convex portion of its outer peripheral portion is used. Is to provide.
【０００７】また、本発明の解決課題は、上記の如きプ
ロ−ブ針を簡単に得られる研磨方法を提供することであ
る。Another object of the present invention is to provide a polishing method which can easily obtain the probe needle as described above.
【０００８】[0008]
【課題を解決するための手段】本発明によれば、ウエ−
ハに形成された電子回路の電気的特性を検査するプロ−
バで使用するプロ−ブ針であって、該プロ−ブ針の先端
部は、上記電子回路に設けた電極パッドに最初に接する
前端側接触面と、上記ウエ−ハをオ−バ−ドライブした
際上記電極パッド上を滑動する滑動面と、オ−バ−ドラ
イブの中程から終了近くで上記電極パッドに当接して該
電極パッド面に生成された金属酸化膜を除去して電極パ
ッド金属部分に接触する後端側接触面を具備することを
特徴とするプロ−ブ針が提供され、上記課題が解決され
る。According to the present invention, a wafer
A professional that inspects the electrical characteristics of electronic circuits formed on the
A probe needle for use in a bar, wherein the tip of the probe needle is used to overdrive the wafer with a front end side contact surface that first contacts an electrode pad provided in the electronic circuit. And a sliding surface that slides on the electrode pad and a metal oxide film formed on the electrode pad surface by contacting the electrode pad near the end of the overdrive and removing the electrode pad metal. A probe needle having a rear end side contact surface for contacting a portion is provided, and the above problems are solved.
【０００９】また本発明によれば、プロ−ブ針の先端部
に研磨板を接触し該研磨板を水平運動して該先端部を研
磨するようにしたプロ−ブ針の研磨方法において、上記
研磨板をプロ−ブ針の先端部に接触させて研磨した後、
該研磨板を微少量オ−バ−ドライブしてプロ−ブ針の先
端部を押し上げ、該プロ−ブ針の前端側接触面を研磨板
から離れさせ、その位置でプロ−ブ針の先端部を研磨
し、以後該研磨板を微少量づつオ−バ−ドライブさせて
プロ−ブ針の前端側接触面、滑動面及び後端側接触面に
わたって徐々に研磨し後端側接触面を前端側接触面より
多く研磨することを特徴とするプロ−ブ針の研磨方法が
提供され、この方法により上記プロ−ブ針を得ることが
でき、上記課題を解決することができる。According to the present invention, in the method for polishing a probe needle, the polishing plate is brought into contact with the tip of the probe needle to horizontally move the polishing plate to polish the tip. After polishing by bringing the polishing plate into contact with the tip of the probe needle,
The polishing plate is overdriven by a small amount to push up the tip portion of the probe needle to separate the front contact surface of the probe needle from the polishing plate, and at that position, the tip portion of the probe needle. Then, the polishing plate is overdriven by a small amount to gradually polish the front end side contact surface, the sliding surface and the rear end side contact surface of the probe needle, and the rear end side contact surface to the front end side. There is provided a method for polishing a probe needle, which is characterized by polishing more than the contact surface. By this method, the probe needle can be obtained, and the above problems can be solved.
【００１０】[0010]
【発明の実施の形態】プロ−ブ針は、基端部がプロ−ブ
カ−ドに取り付けられ、先端部が下方に屈曲して延びて
いるが、図１（Ａ）には本発明のプロ−ブ針（１）の先
端部（２）が拡大して示されている。図に示すように、
該先端部（２）は、前端側接触面（３）に対して後端側
接触面（４）が後退しており、該前端側接触面（３）と
後端側接触面（４）の間には適宜の曲率でわん曲する曲
面状若しくは複数の傾斜面を有する平面状の滑動面
（５）が形成されている。BEST MODE FOR CARRYING OUT THE INVENTION A probe needle has a proximal end portion attached to a probe card and a distal end portion bent downward to extend, and FIG. 1 (A) shows the probe of the present invention. -The tip (2) of the blunt needle (1) is shown enlarged. As shown in the figure,
The front end portion (2) has a rear end side contact surface (4) retracted with respect to the front end side contact surface (3), and the front end side contact surface (3) and the rear end side contact surface (4) are A sliding surface (5) having a curved surface curved with an appropriate curvature or a flat surface having a plurality of inclined surfaces is formed therebetween.
【００１１】上記前端側接触面（３）と後端側接触面
（４）の位置関係は、後記するようにウエ−ハを上昇し
て電子回路の電極パッド（６）にプロ−ブ針（１）を接
触する際、最初に上記前端側接触面（３）が電極パッド
（６）に接したとき、後端側接触面（４）は未だ該電極
パッド（６）に当らないようにしてある。そして、上記
ウエ−ハをオ−バ−ドライブすると、先端部は弾性的に
変形して上記滑動面（５）が電極パッド（６）上を滑動
し始め、該オ−バ−ドライブ行程の中程から終了近くに
上記後端側接触面（４）が電極パッド（６）に接するよ
うにしてある。As for the positional relationship between the front end side contact surface (3) and the rear end side contact surface (4), the wafer is lifted and the probe needle (6) is attached to the electrode pad (6) of the electronic circuit as described later. When the front end side contact surface (3) first contacts the electrode pad (6) when contacting 1), the rear end side contact surface (4) should not touch the electrode pad (6) yet. is there. When the wafer is overdriven, the tip end is elastically deformed and the sliding surface (5) begins to slide on the electrode pad (6), during the overdrive stroke. The contact surface (4) on the rear end side is brought into contact with the electrode pad (6) near the end.
【００１２】図１（Ｂ）〜（Ｄ）は、プロ−ブ針（１）
の先端部（２）が電極パッド（６）に接した状態からオ
−バ−ドライブが終了するまでの行程を示す説明図であ
って、同図（Ｂ）は、最初に（ａ）の位置までウエ−ハ
が上昇してきてアルミニウム層等の電極パッド（６）の
表面に上記前端側接触面（３）が接した状態を示してい
る。この状態では、電極パッド（６）上に生成された酸
化アルミ層等の金属酸化膜（７）は除去されていない。1B to 1D show a probe needle (1).
FIG. 6B is an explanatory view showing the process from the state in which the tip portion (2) of FIG. 2 is in contact with the electrode pad (6) to the end of overdrive, and FIG. Shown is a state in which the wafer ascends and the front end side contact surface (3) contacts the surface of the electrode pad (6) such as an aluminum layer. In this state, the metal oxide film (7) such as the aluminum oxide layer formed on the electrode pad (6) is not removed.
【００１３】上記ウエ−ハをオ−バ−ドライブ（上昇）
させると、上記プロ−ブ針（１）は弾性的に変形して滑
動面（５）が電極パッド（６）上を滑りながら矢印
（８）方向へ水平移動し、同図（Ｃ）に示すようにオ−
バ−ドライブの途中で後端側接触面（４）が電極パッド
（６）に接触し始める。オ−バ−ドライブを終了する段
階では、同図（Ｄ）に示すように上記後端側接触面
（４）は、金属酸化膜（７）を除去して上記電極パッド
（６）のアルミニウム層等の金属部分（９）に接触して
おり、これにより両者は電気的に接続される。Overdrive the wafer (up)
Then, the probe needle (1) is elastically deformed and the sliding surface (5) horizontally moves in the direction of the arrow (8) while sliding on the electrode pad (6), as shown in FIG. Like
The rear end side contact surface (4) starts to contact the electrode pad (6) during the bar drive. At the stage of finishing the overdrive, the metal oxide film (7) is removed from the rear contact surface (4) of the aluminum layer of the electrode pad (6) as shown in FIG. Etc. are in contact with a metal part (9), etc., so that they are electrically connected.
【００１４】上記（ａ）〜（ｃ）間のオ−バ−ドライブ
量は、約６０〜１２０μｍ程度、好ましくは約８０μｍ
程度であり、上記後端側接触面（４）が電極パッド
（６）に接する（ｂ）の位置は、オ−バ−ドライブ量の
中程、例えばオ−バ−ドライブ量が約８０μｍ程度のと
きは約４０μｍ程度とするとよい。また、プロ−ブ痕が
電極パッド（６）の厚さ以上に深くならないよう上記後
端側接触面（４）と前端側接触面（３）の高低差（Ｌ）
は、約５〜１５μｍ程度、好ましくは１０μｍ程度にし
てある。The amount of overdrive between (a) to (c) is about 60 to 120 μm, preferably about 80 μm.
The position (b) where the rear end side contact surface (4) is in contact with the electrode pad (6) is in the middle of the overdrive amount, for example, when the overdrive amount is about 80 μm. At this time, it may be about 40 μm. Further, the height difference (L) between the rear end side contact surface (4) and the front end side contact surface (3) is set so that the probe mark does not become deeper than the thickness of the electrode pad (6).
Is about 5 to 15 μm, preferably about 10 μm.
【００１５】上記の構成により、本発明のプロ−ブ針
（１）を使用すると、プロ−ブ針（１）により電極パッ
ド（６）が突き破られるおそれはなく、またプロ−ブ痕
やその外周部の凸部を小さくすることができる。With the above construction, when the probe needle (1) of the present invention is used, there is no possibility that the electrode pad (6) will be pierced by the probe needle (1), and the probe mark or its trace. It is possible to reduce the convex portion on the outer peripheral portion.
【００１６】上記プロ−ブ針を使用して電子回路の電気
的特性を検査していくと、次第にプロ−ブ針の先端部に
剥離した金属酸化物(10)が付着してくる（図２（Ａ))。
そのため、適時に上記プロ−ブ針の先端部をクリ−ニン
グする必要があるが、従来のように単にプロ−ブ針の先
端部に研磨板を接触し該研磨板を水平移動して研磨する
と、図３に示す如き形状に変化してしまう。When the electrical characteristics of the electronic circuit are inspected using the probe needle, the peeled metal oxide (10) gradually adheres to the tip of the probe needle (FIG. 2). (A)).
Therefore, it is necessary to clean the tip portion of the probe needle in a timely manner. However, if a polishing plate is simply brought into contact with the tip portion of the probe needle and the polishing plate is horizontally moved and polished as in the conventional case, , The shape is changed as shown in FIG.
【００１７】図２（Ｂ）〜（Ｄ）は、本発明のプロ−ブ
針を研磨する方法の説明図であって、上下動可能に設け
た研磨板(11)を上昇してプロ−ブ針（１）の先端部
（２）に接触させ、該研磨板(11)を水平運動して研磨す
る（同図（Ｂ))。次に、該研磨板(11)を微少量オ−バ−
ドライブさせると、プロ−ブ針（１）は弾性変形して矢
印(12)方向に少し移動する結果、該プロ−ブ針の前端側
接触面（３）は研磨板から離れるから、その位置で研磨
板(11)を水平移動させてプロ−ブ針（１）の先端部を研
磨する（同図（Ｃ))。以後、ほぼ同様に研磨板を微少量
づつオ−バ−ドライブさせてプロ−ブ針の先端部を前端
側接触面（３）から滑動面（５）及び後端側接触面
（４）に向かって徐々に研磨する（同図（Ｄ))。このよ
うにすると、後端側接触面（４）を前端側接触面（３）
よりも多く研磨することができるので、図１（Ａ）に示
す如き形状にプロ−ブ針の先端部を研磨することができ
る。2 (B) to 2 (D) are explanatory views of a method for polishing a probe needle according to the present invention, in which a polishing plate (11) provided so as to be movable up and down is lifted to raise the probe. The tip (2) of the needle (1) is brought into contact with the tip of the needle (1), and the polishing plate (11) is horizontally moved for polishing (FIG. 2 (B)). Next, the polishing plate (11) was slightly overlaid.
When driven, the probe needle (1) elastically deforms and moves a little in the direction of the arrow (12). As a result, the contact surface (3) on the front end side of the probe needle separates from the polishing plate. The polishing plate (11) is horizontally moved to polish the tip portion of the probe needle (1) (FIG. 7C). After that, the polishing plate is overdriven by a small amount in the same manner to move the tip of the probe needle from the front end side contact surface (3) toward the sliding surface (5) and the rear end side contact surface (4). And gradually polish ((D) of the same figure). By doing this, the rear end side contact surface (4) becomes the front end side contact surface (3).
Since more can be polished, the tip of the probe needle can be polished into a shape as shown in FIG.
【００１８】上記研磨板(11)をオ−バ−ドライブさせる
際、１度にオ−バ−ドライブする量が大きいとプロ−ブ
針（１）に大きなストレスが作用し、プロ−ブ針が破損
する原因となる。そこで、本発明においては、上記研磨
板(11)を１度にオ−バ−ドライブする微少量を約３〜１
５μｍ程度、好ましくは約５μｍ程度とし、合計で最終
的に約５０〜１２０μｍ程度、好ましくは約６０〜８０
μｍ程度オ−バ−ドライブするようにしてある。このよ
うにすることにより無理なくプロ−ブ針の先端部を研磨
することができた。When the polishing plate (11) is overdriven, if the amount of overdriving at one time is large, a large stress acts on the probe needle (1), and the probe needle is moved. It may cause damage. Therefore, in the present invention, a minute amount of overdriving the polishing plate (11) at once is about 3 to 1.
5 μm, preferably about 5 μm, and finally about 50 to 120 μm, preferably about 60 to 80 in total.
It is designed to be overdriven by about μm. By doing so, the tip of the probe needle could be polished without difficulty.
【００１９】[0019]
【発明の効果】本発明は上記のように構成され、ウエ−
ハをオ−バ−ドライブする際に、最初にプロ−ブ針の先
端部の前端側接触面が電子回路の電極パッドに接触し、
オ−バ−ドライブ中は上記先端部に形成した滑動面が電
極パッド上を滑動し、オ−バ−ドライブの中程から終了
近くで先端部の後端側接触面が電極パッドに接触して該
電極パッド面に生成された金属酸化膜を除去し電極パッ
ドの金属部分に接するようにプロ−ブ針の先端部を形成
したので、従来のようにプロ−ブ針の先端部が電極パッ
ドに大きくくい込むことがなく、電子回路に損傷を与え
る危険性を少なくでき、またプロ−ブ痕やその外周部の
凸部を小さくすることができるから、検査やその後のボ
ンディングワイヤの接続等に支障を及ぼすことも少な
く、プロ−ブ針の寿命を長くすることができる。The present invention is constructed as described above and is a wafer.
At the time of overdriving the ha, the front end side contact surface of the tip of the probe needle first contacts the electrode pad of the electronic circuit,
During the overdrive, the sliding surface formed on the tip slides on the electrode pad, and the contact surface on the rear end side of the tip contacts the electrode pad near the end of the overdrive. Since the metal oxide film formed on the electrode pad surface was removed and the tip of the probe needle was formed so as to contact with the metal portion of the electrode pad, the tip of the probe needle is not attached to the electrode pad as in the conventional case. The risk of damaging the electronic circuit can be reduced without significantly pushing in, and the probe marks and the protrusions on the outer periphery can be made smaller, which hinders inspection and subsequent bonding wire connections. Is less likely to occur, and the life of the probe needle can be extended.
【００２０】また、上記プロ−ブ針に剥離した金属酸化
物が付着した際、プロ−ブ針の先端部に接触させた研磨
板を微少量づつオ−バ−ドライブして徐々に研磨して後
端側接触面を多く研磨するようにしたので、プロ−ブ針
を破損することなく確実に上記形状に研磨することがで
きる。なお、最初に上記形状のプロ−ブ針を製作する際
にも、上記研磨方法により簡単に製造することができ
る。Further, when the peeled metal oxide adheres to the probe needle, the polishing plate brought into contact with the tip of the probe needle is over-dried in minute amounts and gradually polished. Since the rear end side contact surface is polished a lot, the probe needle can be surely polished into the above-mentioned shape without being damaged. Even when the probe needle having the above-mentioned shape is manufactured for the first time, it can be easily manufactured by the polishing method.
【図１】本発明のプロ−ブ針を示し、（Ａ）は先端部の
拡大図、（Ｂ）〜（Ｄ）はプロ−ブ針の先端部が電極パ
ッドに接触してからオ−バ−ドライブが終了する段階ま
でを示す各説明図。FIG. 1 shows a probe needle of the present invention, in which (A) is an enlarged view of a tip portion, and (B) to (D) show an probe after the tip portion of the probe needle comes into contact with an electrode pad. -Each explanatory view showing the stage up to the end of the drive.
【図２】本発明のプロ−ブ針を研磨する工程の説明図
で、（Ａ）は研磨前のプロ−ブ針の拡大図、（Ｂ）〜
（Ｄ）は研磨板で研磨する状態の各説明図。FIG. 2 is an explanatory view of a step of polishing a probe needle of the present invention, (A) is an enlarged view of the probe needle before polishing, and (B)-
FIG. 3D is an explanatory diagram of a state of polishing with a polishing plate.
【図３】従来例を示し、（Ａ）はプロ−ブカ−ドと電子
回路の説明図、（Ｂ）〜（Ｄ）は従来のプロ−ブ針によ
る電極パッドへの接触状態を示す各説明図。FIG. 3 shows a conventional example, (A) is an explanatory view of a probe card and an electronic circuit, and (B) to (D) are respective explanations showing a state of contact with an electrode pad by a conventional probe needle. Fig.
１…プロ−ブ針 ２…先端部 ３…前端側接触面 ４…後端側接触面 ５…滑動面 ６…電極パッド ７…金属酸化膜 11…研磨板 1 ... Probe needle 2 ... Tip 3 ... Front end side contact surface 4 ... Rear end side contact surface 5 ... Sliding surface 6 ... Electrode pad 7 ... Metal oxide film 11 ... Polishing plate
───────────────────────────────────────────────────── フロントページの続き Ｆターム(参考） 2G003 AA07 AG03 AG04 AG12 AH05 AH06 2G011 AA02 AA10 AA17 AC13 AC14 AF07 3C049 AA01 AB01 CA01 CB04 4M106 AA01 BA01 DD03 DD12 DD18 ─────────────────────────────────────────────────── ─── Continued front page F-term (reference) 2G003 AA07 AG03 AG04 AG12 AH05 AH06 2G011 AA02 AA10 AA17 AC13 AC14 AF07 3C049 AA01 AB01 CA01 CB04 4M106 AA01 BA01 DD03 DD12 DD18
Claims (5)
特性を検査するプロ−バで使用するプロ−ブ針であっ
て、該プロ−ブ針の先端部は、上記電子回路に設けた電
極パッドに最初に接する前端側接触面と、上記ウエ−ハ
をオ−バ−ドライブした際上記電極パッド上を滑動する
滑動面と、オ−バ−ドライブの中程から終了近くで上記
電極パッドに当接して該電極パッド面に生成された金属
酸化膜を除去して電極パッドの金属部分に接触する後端
側接触面を具備することを特徴とするプロ−ブ針。1. A probe needle for use in a prober for inspecting the electrical characteristics of an electronic circuit formed on a wafer, the tip of the probe needle being provided in the electronic circuit. Front contact surface that first contacts the electrode pad, a sliding surface that slides on the electrode pad when the wafer is overdriven, and the electrode near the end of the overdrive. A probe needle having a rear end side contact surface which comes into contact with a pad and removes a metal oxide film formed on the electrode pad surface to contact a metal portion of the electrode pad.
を有する請求項１に記載のプロ−ブ針。2. The probe needle according to claim 1, wherein the sliding surface has a curved surface or a plurality of inclined surfaces.
μｍであり、上記後端側接触面は上記前端側接触面より
５〜１５μｍ上方に設けられている請求項１または２に
記載のプロ−ブ針。3. The overdrive amount is 60 to 120.
The probe needle according to claim 1 or 2, wherein the probe needle has a diameter of 10 μm and the rear end side contact surface is provided 5 to 15 μm above the front end side contact surface.
研磨板を水平運動して該先端部を研磨するようにしたプ
ロ−ブ針の研磨方法において、上記研磨板をプロ−ブ針
の先端部に接触させて研磨した後、該研磨板を微少量オ
−バ−ドライブしてプロ−ブ針の先端部を押し上げ、該
プロ−ブ針の前端側接触面を研磨板から離れさせ、その
位置でプロ−ブ針の先端部を研磨し、以後該研磨板を微
少量づつオ−バ−ドライブさせてプロ−ブ針の前端側接
触面、滑動面及び後端側接触面にわたって徐々に研磨し
後端側接触面を前端側接触面より多く研磨することを特
徴とするプロ−ブ針の研磨方法。4. A method for polishing a probe needle in which a polishing plate is brought into contact with a tip portion of a probe needle and the polishing plate is horizontally moved to polish the tip portion. After polishing by bringing the tip of the probe needle into contact with the tip of the probe needle, the tip of the probe needle is pushed up by slightly overdriving the polishing plate, and the contact surface on the front end side of the probe needle is removed from the polishing plate. Separately, the tip of the probe needle is ground at that position, and then the polishing plate is overdriven by a small amount to make a front end side contact surface, a sliding surface and a rear end side contact surface of the probe needle. A method for polishing a probe needle, which comprises gradually polishing the contact surface on the rear end side more than the contact surface on the front end side.
〜１５μｍである請求項４に記載のプロ−ブ針の研磨方
法。5. The minute amount of the overdrive is 3
The method for polishing a probe needle according to claim 4, wherein the probe needle has a diameter of ˜15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002090357A JP2003287552A (en) | 2002-03-28 | 2002-03-28 | Probe needle and polishing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002090357A JP2003287552A (en) | 2002-03-28 | 2002-03-28 | Probe needle and polishing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2003287552A true JP2003287552A (en) | 2003-10-10 |
Family
ID=29235681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002090357A Pending JP2003287552A (en) | 2002-03-28 | 2002-03-28 | Probe needle and polishing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2003287552A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012194133A (en) * | 2011-03-18 | 2012-10-11 | Mitsubishi Electric Corp | Probe cleaning apparatus and probe cleaning method using the same |
| KR20190096810A (en) * | 2018-02-09 | 2019-08-20 | 히오끼 덴끼 가부시끼가이샤 | Probe pin, probe unit and inspecting apparatus |
| US10416228B2 (en) | 2015-07-23 | 2019-09-17 | Tokyo Seimitsu Co., Ltd. | Prober |
-
2002
- 2002-03-28 JP JP2002090357A patent/JP2003287552A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012194133A (en) * | 2011-03-18 | 2012-10-11 | Mitsubishi Electric Corp | Probe cleaning apparatus and probe cleaning method using the same |
| US10416228B2 (en) | 2015-07-23 | 2019-09-17 | Tokyo Seimitsu Co., Ltd. | Prober |
| KR20190096810A (en) * | 2018-02-09 | 2019-08-20 | 히오끼 덴끼 가부시끼가이샤 | Probe pin, probe unit and inspecting apparatus |
| KR102545415B1 (en) | 2018-02-09 | 2023-06-20 | 히오끼 덴끼 가부시끼가이샤 | Probe pin, probe unit and inspecting apparatus |
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