JP2003286588A - Process for preparing composite conductive material - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a process for preparing a composite conductive material which imparts an electroconductivity to an insulating article, and the composite conductive material obtained through this process. <P>SOLUTION: The process for preparing the composite conductive material showing a high conductivity comprises steps wherein a substrate traveling at a speed of 0.4-4 m/min is coated with a metal such as nickel via vacuum ion sputtering at a density of 0.1-2.5 g/m<SP>2</SP>in an Ar protective atmosphere at 170-355°C±5°C under a reduced pressure of about 1.1×10<SP>-1</SP>-3.8×10<SP>-8</SP>kPa, the metal layer of nickel, etc., is continuously applied to the substrate via a conventional plastic electroplating technique or a deep plating process, and the obtained material is rinsed with water, oven- and air-dried and rolled into a roll. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for preparing a composite conductive material which makes an insulating article conductive. The present invention is in the field of electroplating.

[0002]

BACKGROUND OF THE INVENTION Since nickel foam is widely used in nickel-hydrogen batteries, various studies have been conducted on conductive substrates for use in preparing nickel foam. Moreover, current shielding materials are mainly conductive fabrics, which are difficult to bond thin plastic cements and are expensive to manufacture. The processes currently widely used in the preparation of conductive substrates on non-metallic materials, such as electroless plating and coating of conductive adhesives, cannot meet the requirements of environmental protection and product quality. Electroless plating is expensive to manufacture and can be very harmful to the environment. Conductive adhesive coatings cannot overcome the problem of poor manufacturing quality. The product obtained by vacuum coating is susceptible to oxidation. However, the provided electromagnetic shielding material has a very low resistance,
For example, it is desired that the resistance be about 0.2 to 5 Ω, and thus the prior art cannot meet the recent industrial demands.

[0003]

Overcome the shortcomings of the prior art
Therefore, the present invention provides a composite conductive material having good conductivity.
A method of preparation is provided. This method consists of (1) Ar protective atmosphere
In air, at 170 to 355 ° C ± 5 ° C, about 1.1 x 1
0^-1~ 3.8 x 10^-8kPa, especially about 1 × 10 ^-8~ 9x
10^-8Under reduced pressure of kPa, reduced pressure ion sputtering
And gold selected from nickel, copper or platinum
Coating the substrate with a metal, where the moving speed of the substrate
The degree is 0.4 to 4 m / min, preferably 1.5 to 2.5 m /
And the ion sputtering density is 0.1 to
2.5 g / m², Preferably 2-2.5 g / m²Is,
(2) Nickel, nickel + copper, nickel + copper + nickel
From nickel, nickel + copper + gold, copper, pure gold or platinum
A metal layer selected from the group consisting of
Vapor plating technology (eg continuous plating technology) and deep hole plating
Continuously plating the substrate by the process, and
(3) Rinse the obtained material with water and put it in a furnace or air
Drying, and rolling into rolls.

The present invention also provides a composite conductive material prepared by the above method.

[0005]

BEST MODE FOR CARRYING OUT THE INVENTION The method of the present invention is a method for preparing a composite conductive material, which comprises the following first to third steps. In the first step of the method of the present invention, in an Ar protective atmosphere,
170 to 355 ° C. ± 5 ° C., about 1.1 × 10 ^{−1 to} 3.8.
× 10 ^-8 kPa, especially about 1 × 10 ^{-8 to} 9 × 10 ^-8 kPa
Low pressure ion sputtering is performed under reduced pressure to coat the substrate with a metal selected from nickel, copper or platinum. Here, the moving speed of the base material is 0.4 to 4
m / min, preferably 1.5 to 2.5 m / min, and the ion sputtering density is 0.1 to 2.5 g / m ² ,
It is preferably ² to 2.5 g / m ² . Also here the conductivity R of the material is 5 to 35 kΩ and the amount of metal coated is about 0.3 to 0.53 g / m ² .

The substrate may be any insulating substrate. In a preferred embodiment, the substrate is a high density polyurethane foam sheet, a synthetic fiber filament braidin.
g), synthetic fiber fabric, synthetic fiber fabric, or synthetic fiber felt. Alternatively, the substrate is a 12 surface cell structure exploded foam of various thicknesses.
eticulated polyester polyurethane foam), polyether polyurethane foam, synthetic fiber filament braid, synthetic fiber fabric, synthetic fiber cloth, synthetic fiber felt,
Alternatively, it may be selected from polyester films.
In one specific aspect, the synthetic fiber is terylene,
Polyester, polypropylene or nylon fibers. In another specific aspect, the substrate has a pore diameter of about 44.
0 to 5,200 μm, preferably about 300 to 500 μm
And the thickness is about 1 to 6 mm, especially about 1.0 to 3.5 mm,
More particularly, it is a polyurethane foam of about 1.5 to 3.0 mm. In yet another specific embodiment, the substrate is a synthetic fiber filament blade having a hexagonal, square or circular shape with pores having a diameter of 0.5 to 2.0 mm, and the diameter of the synthetic fiber filament is 0. It is 1 to 0.2 mm. Here, the diameter of the hexagonal and square pores is the length of a diagonal line passing through the center of the pore.

In the second step of the method of the present invention, a metal layer selected from the group consisting of nickel, nickel + copper, nickel + copper + nickel, nickel + copper + gold, copper, pure gold or platinum is used. Continuous application to the substrate by conventional plastic electroplating techniques and deep hole plating processes. Here, the conductivity R of the obtained material is 0.1 to 8Ω, and “nickel + copper” means that nickel is plated first, and then copper is plated. The same interpretation shall be applied to similar expressions.

In the third step of the method of the present invention, the resulting material is rinsed with water, dried in an oven or air, and rolled into rolls.

Compared with the prior art, the present invention has the following advantages: (1) The composite conductive material obtained by the method of the present invention has good conductivity, can be directly used as a conductive base material for nickel foam, and has a web width of 1 m / min or faster. Allows rapid electroplating of 1.02 m substrates. This method does not suffer from problems such as phosphorus contamination and wastewater treatment by eliminating electroless plating and thus lowers manufacturing costs.
(2) The resulting composite conductive material has a low resistance, which results in electromagnetic shielding or electromagnetic field compatibility (EMI / EMC).
Suitable for use as material, speaker and receiver for mobile phone, plasma display, TFT-LC
There are applications in D-displays, TV sets, household items, computers or military magnetic field disturbance protection equipment, medical and precision equipment such as notebook computers and various types of power interface. (3) Pore diameter 440 ~
5,200 μm polyester foam can be combined with conductive substrate materials in combination with the use of permeable explosive reticulated foam with a 12 surface cell structure. This makes it possible to solve the problems encountered in notebook computers due to the air impermeability of electromagnetically compatible (EMI / EMC) materials. (4) Continuous automatic manufacturing can be performed to eliminate the influence of human factors. This ensures the quality of the product and improves production efficiency. (5)
The method of the present invention can produce the product as a very long sheet, which can be rolled into a coil to facilitate storage, shipping and cutting.

Furthermore, a pure gold mesh substrate can be obtained by the method of the present invention rather than the prior art methods such as the suspension method. In particular, according to the method of the present invention, a 12 surface cell structure explosive reticulated polyester foam was treated to render it conductive and plated with 30-250 g / m ² of pure gold, after which the material obtained was 1300 ° C. Sinter reduction can be performed at temperatures below about 45-60 minutes resulting in the preparation of pure gold reticulated substrates for fuel cells.

[0011]

The invention is further described in the following examples.

Example 1 A nickel-coated conductive material was prepared by a method including the following (1) to (4). (1) Substrate: High-density polyurethane foam sheet. (2) Nickel plating by ion sputtering: A
Approximately 8 × 10 ^-8 kP at 170 ° C in a protected atmosphere
Under reduced pressure of a, low pressure ion sputtering was performed to coat the substrate with nickel. Here, the moving speed of the base material was 2 m / min, and the ion sputtering density was 2 g / m ² . (3) The above materials were continuously plated with nickel by conventional electroplating techniques for plastics. (4) The resulting material was rinsed with water, oven dried and rolled.

EXAMPLE 2 Copper was coated on a synthetic fiber fabric in a manner similar to Example 1. However, here, the base material was a terylene chemical fiber cloth, and the ion sputtering density was 2.2 g / m ² .

Example 3 In a manner similar to Example 1, platinum was coated on a fabric of chemical fiber filaments. Here, however, the base material is a nylon chemical fiber filament woven fabric, the ion sputtering density is 1.8 g / m ² , the pores of this chemical fiber filament woven fabric are hexagonal, and the diameter of the pores is 1.0.
mm, and the diameter of the chemical fiber filament is 0.2
It was mm. Here, this pore diameter is measured as the length of a diagonal line passing through the center of the pore.

Example 4 Nickel was coated on a synthetic fiber felt in a manner similar to Example 2. However, in this case, the substrate is polypropylene fiber felt, and the ion sputtering density is 2.
It was 4 g / m ² .

Example 5 In a manner similar to Example 2, nickel was coated onto a single flame bonded terylene chemical fiber fabric and an exploded reticulated polyester foam. However, in this case, the substrate was a terylene chemical fiber woven fabric bonded with a single face flame and an explosive network polyester foam, and the ion sputtering density was 0.35 g / m ² .

Example 6 In a manner similar to Example 2, nickel was coated onto double-sided flame bonded terylene chemical fiber fabrics and nonwovens and explosive reticulated polyester foam. Here, however, the substrate was a double-sided flame bonded terylene chemical fiber woven fabric and nonwoven fabric, and explosive mesh polyester foam, and the ion sputtering density was 0.5 g / m ² .

Example 7 Nickel was coated on both sides of a polyester film in the same manner as in Example 2. However, here, the substrate was a polyester film, and the ion sputtering density was 0.45 g / m ² .

Those skilled in the art will recognize that various modifications and changes can be made to the embodiments of the present invention within the scope of the invention, which scope is defined by the claims.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) // C23C 14/14 C23C 14/14 D 14/20 14/20 Z 14/34 14/34 V (72 ) Inventor Shaden Feng, People's Republic of China, Shandong 274700, Yunchen County, Zhongjuan Dongmenji 20 (72) Inventor, Sha Shanhua People's Republic of China, Shandong 274700, Yunchen County, Zhongjuan Donmenji 20 (72) Inventor Zhao Ziping Chinese People's Republic of China, Shandong 274700, Yunchen County, Zhongjuan Dongmenji 20 (72) Inventor Hao Weitzen People's Republic of China, Shandong 274700, Yunchen County, Songjuan Dongmenji 20 F Term (Reference) 4F100 AB01A AB16A AB17A AB24A AK07B AK41B AK46B AK51B AK54B AL01B AT00B BA02 DC16B DG01B DG04B DG06B DG11B DG12B DJ00B EH46 EH462 EH66 EH662 EH71 EH712 EJ85 EJ852 EJ86 EJ862 GB41 JA14B JG01 JG04B YY00B 4K024 AA03 AA09 AA11 AA12 AB01 AB02 AB03 BA12 BA14 BB09 BB19 BC07 BC08 GA16 4K029 AA11 AA25 BA08 BA12 BA13 CA05 DC03 JA10 KA01 4K044 AA16 AB01 AB02 AB08 BA06 BA08 BB03 BC14 CA07 CA13 CA18

Claims (6)

[Claims] 1. In an Ar protective atmosphere, 170-35.
About 1.1 × 10 ^{-1 to} 3.8 × 10 ^-8 kP at 5 ° C. ± 5 ° C.
a, in particular, under reduced pressure of about 1 × 10 ^{−8 to} 9 × 10 ⁻⁸ kPa, low pressure ion sputtering is performed to obtain nickel,
The first step of coating the substrate with a metal selected from copper or platinum, wherein the substrate moving speed is 0.4-4 m /
Min, preferably 1.5 to 2.5 m / min, and the ion sputtering density is 0.1 to 2.5 g / m ² , preferably ² to 2.5 g / m ² , nickel, nickel + copper , A metal layer selected from the group consisting of nickel + copper + nickel, nickel + copper + gold, copper, pure gold or platinum is continuously applied to the substrate by conventional plastic electroplating techniques and deep hole plating processes. The second step, and rinsing the resulting material with water,
A third step of drying in an oven or air and rolling into a roll. 2. The base material is an insulating base material selected from high density polyurethane foam sheet, chemical fiber filament blade, chemical fiber fabric, chemical fiber cloth, or chemical fiber felt, and in particular, the base material is 12 Surface cell structure Explosive reticulated polyester polyurethane foam, polyether polyurethane foam, synthetic fiber filament blade, synthetic fiber fabric, synthetic fiber cloth, synthetic fiber felt, or substrate of various thickness selected from the group consisting of polyester film 2. The method according to claim 1, wherein
A method for preparing the composite conductive material according to 1. 3. The method for preparing a composite conductive material according to claim 1, wherein the chemical fiber is a fiber of terylene, polyester, polypropylene, or nylon. 4. The substrate has a pore diameter of about 440-5.
A polyurethane foam having a thickness of 200 μm, preferably about 300 to 500 μm and a thickness of about 1 to 6 mm, in particular about 1.0 to 3.5 mm, more particularly about 1.5 to 3.0 mm. Item 4. A method for preparing the composite conductive material according to any one of Items 1 to 3. 5. The chemical fiber filament blade, wherein the base material is hexagonal, square or circular and has pores with a diameter of 0.5 to 2.0 mm, and the diameter of the chemical fiber filament is 0.1 to 0.2 mm. The method for preparing a composite conductive material according to any one of claims 1 to 4, wherein the diameters of the hexagonal and square pores are the length of a diagonal line passing through the center of the pores. 6. A composite conductive material prepared by the method of any of claims 1-5.