JP2003285289A - Handling device, conveyer and handling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To quickly handle an object to be handled, and improve positioning accuracy when unloading. <P>SOLUTION: The handling device includes a planer insulating member 11, electrodes 12A and 12B provided inside the insulating member 11 and a voltage controller 13 for applying a voltage to the electrodes 12A and 12B, for using static electric force caused when the voltage is applied to the electrodes 12A and 12B by the voltage controller 13 to attract the object 17 to be handled placed below the insulating member 11. The insulating member 11 is flexible and has both ends supported by supporting devices 14A and 14B with its center part bending. The member 11 is also formed with uneven portions 15 on its bottom to have a rough surface on the bottom. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a handling device for attracting a thin handling object to a chuck by using electrostatic force, a carrying device equipped with the handling device, and a handling method.

[0002]

2. Description of the Related Art Conventionally, as a thin film adsorption device,
A handling device as shown in FIG. 7 is known. In this handling apparatus, a plurality of vacuum chucks 2 are attached to a flat plate-shaped structure 1, and a handling object 3 is sucked and gripped by the vacuum chuck 2. The structure 1 is connected to an actuator (not shown), and the handling target 3 can be conveyed by moving the entire structure 1 in the left-right and up-down directions in the drawing by this actuator.

A handling device as shown in FIG. 8 is also known. This handling device comprises a flat plate-shaped structure 4, an insulating member 5 fixed to the bottom surface of the structure 4,
An electrostatic chuck 7 having plus and minus electrode portions 6A and 6B provided inside the insulating member 5 is provided. The electrode units 6A and 6B are connected to the voltage controller 8, and a voltage is applied to the electrode units 6A and 6B by the voltage controller 8 and the handling target 9 is moved to the electrostatic chuck 7 by using the electrostatic force generated at that time. The bottom surface (bottom surface of the insulating member 5) is adsorbed and gripped. The structure 4 is connected to an actuator (not shown), and by moving the entire electrostatic chuck 7 in the left-right and up-down directions in the figure by this actuator,
The handling object 9 can be transported.

[0004]

However, in the handling apparatus shown in FIG. 7 among the above-mentioned conventional techniques, since the handling object is a film and is thin, the handling object is self-weighted between the adjacent vacuum chucks. There is a risk that it will bend due to, causing plastic deformation. Moreover, when the handling object is bent, the positioning accuracy is deteriorated by the amount of the bending when the handling object is unloaded.

On the other hand, in the handling device shown in FIG. 8, the handling object does not bend, but if the handling object is thin and light, the applied voltage to the electrode portion during unloading will be small. Even if the electrostatic force is removed by shutting off, the object to be handled does not easily separate from the bottom surface of the electrostatic chuck. That is, since the bottom surface of the electrostatic chuck is formed in a flat shape, and the handling object is also normally flat, when a thin and light handling object is adsorbed by the electrostatic chuck, it is The adhesion to the bottom of the chuck is extremely high, and a vacuum is created between the two, so even if the electrostatic force is removed,
The object to be handled does not easily separate from the bottom surface of the electrostatic chuck. In this case, it is necessary to wait for the object to be handled to naturally separate from the bottom surface of the electrostatic chuck, which wastes time and is not practical.

Further, in the conventional electrostatic chuck, in order to reliably maintain the relative positional relationship between the object to be handled and the chuck surface at the time of loading, the chuck surface is not allowed to bend and the chuck itself has a high rigidity. Things are required. However, in this case, when the surface area of the object to be handled becomes large, the chuck surface also becomes large accordingly.
In order to maintain high rigidity, the thickness of the chuck body must be increased, and as a result, the weight of the electrostatic chuck as a whole is increased. For example, the surface area of the chuck surface is 1 m ² and the weight is 1
In an electrostatic chuck designed to handle an object to be handled that weighs less than Kg, the electrostatic chuck has a self-weight of about 40 Kg. To move a heavier electrostatic chuck at a higher speed, the actuator becomes larger, The member around the actuator also becomes large, which poses a practical problem.

An object of the present invention is to quickly handle an object to be handled and to improve the positioning accuracy during unloading.

[0008]

In order to solve the above problems, the present invention provides a planar chuck body, an electrode portion provided inside the chuck body, and a voltage controller for applying a voltage to the electrode portion. A handling device for attracting a handling object placed below the chuck body by using an electrostatic force generated when a voltage is applied to the electrode part by the voltage control part, wherein the chuck body is flexible. It is characterized in that both ends are supported in a state where the central part is bent and the bottom surface is roughened.

According to the above construction, since the bottom surface has a rough surface roughness, when the chuck body adsorbs the object to be handled, a vacuum state is not created between the bottom surface of the chuck body and the object to be handled. Since the object to be handled is easily separated from the bottom surface of the chuck body during unloading, the handling work can be performed quickly. Also, since the chuck body is flexible and both ends are supported with the center part flexed, the entire handling object can be brought into close contact with the bottom surface of the chuck body, and positioning accuracy during unloading Also improves.

The chuck body is formed in a film shape including the electrode portion. According to this structure, the weight of the chuck body is reduced, and the chuck body can be moved quickly by the actuator.

The present invention further comprises a flat plate-shaped chuck body, an electrode portion provided inside the chuck body, and a voltage control portion for applying a voltage to the electrode portion. The voltage control portion applies a voltage to the electrode portion. A handling device for attracting a handling object placed below the chuck body by using electrostatic force generated when applied, characterized in that the chuck body has a rough bottom surface. There is.

According to the above construction, since the surface of the bottom surface of the chuck body is formed to have a rough surface, the object to be handled is easily separated from the bottom surface of the chuck body during unloading, so that the handling work can be performed quickly. It can be carried out.

The chuck body has a large number of through holes extending from the bottom surface to the upper surface. When the object to be handled is adsorbed to the chuck body, there is air between the bottom surface of the chuck body and the object to be handled, and the damping force of this air slows the adsorption speed. If a large number of through holes as described above are formed, the air between the bottom surface of the chuck body and the object to be handled can be easily discharged to the upper surface of the chuck body through the large number of through holes,
The adsorption speed becomes faster.

Further, a sensor is provided on the bottom surface of the chuck body for detecting whether or not the object to be handled is in close contact,
The voltage control unit takes in the detection signal from the sensor and lowers the voltage applied to the electrode unit when it is determined that the object to be handled is in close contact with the bottom surface of the chuck body. According to this structure, it is possible to prevent the handling object from being deformed or damaged by an excessive electrostatic force when the handling object is in close contact with the bottom surface of the chuck body.

Further, the present invention comprises a flat plate-shaped chuck body, an electrode portion provided on the bottom surface of the chuck body, and a voltage control portion for applying a voltage to the electrode portion, and the voltage control portion applies voltage to the electrode portion. A handling device for adsorbing a handling object placed below the electrode part by using an electrostatic force generated when a voltage is applied, characterized in that the electrode part has a rough bottom surface. I am trying.

According to the above structure, since the bottom surface of the electrode portion is formed to have a rough surface, the object to be handled is easily separated from the bottom surface of the electrode portion during unloading, so that the handling work can be performed quickly. It can be carried out. Also in this case, a large number of through holes penetrating from the bottom surface to the top surface can be formed in the chuck body. Furthermore, a sensor is installed on the bottom surface of the chuck body to detect whether or not the handling object is in close contact, and the voltage control unit captures the detection signal from the sensor and determines that the handling object is in close contact with the bottom surface of the chuck body. In this case, the voltage applied to the electrode portion may be controlled to be low.

Further, according to the present invention, in a carrying device provided with a handling device for attracting a handling object by utilizing electrostatic force and a moving mechanism for moving the handling device, any one of the above handling devices is used as the handling device. It is equipped with a feature.

Further, according to the present invention, there is provided a chuck body which is flexible and has both end portions supported in a state where the central portion is bent and whose bottom surface has a rough surface, and a chuck body. When adsorbing a handling object using a handling device equipped with an electrode part, the chuck body is placed on the handling object and brought into close contact with the handling object, and voltage is applied to the electrode part in this state. That is, the handling object is attracted to the bottom surface of the chuck body by electrostatic force.

Further, according to the present invention, the chuck main body is flexible and has both ends supported in a state where the central portion is bent, and the bottom surface has a rough surface roughness. When the object to be handled is adsorbed by using a handling device equipped with an electrode part, the central part of the chuck body is brought into contact with the object to be handled, and in this state a voltage is applied to the electrode part to handle it by electrostatic force. That is, the object is sucked and adsorbed on the bottom surface of the chuck body.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described in detail below. (First Embodiment) FIG. 1 shows a handling apparatus according to the first embodiment. The handling device applies a voltage to the planar insulating member 11 as the chuck body, the plus side electrode portion 12A and the minus side electrode portion 12B provided inside the insulating member 11, and the electrode portions 12A and 12B. And a voltage controller 13 as a voltage controller.
The insulating member 11 is flexible and both ends thereof are clamped and supported by the supporting devices 14A and 14B in a state where the central portion is bent. Further, the insulating member 11 is provided with fine irregularities 15 on the bottom surface as shown in an enlarged view in the lower circle of FIG. 1, and the surface shape of the bottom is rough. Further, a large number of through holes 16 penetrating from the bottom surface to the upper surface are formed in the insulating member 11 including the electrode portions 12A and 12B. The shape of the bottom surface of the insulating member 11 is not limited to the fine irregularities 15 as shown in the lower circle in FIG. 1, and may have a fine saw-tooth shape in cross section or a rounded saw-toothed tip. .

In the above configuration, when the voltage controller 13 applies a voltage to the electrode parts 12A and 12B after the insulating member 11 is brought close to the handling object 17, an electrostatic force is induced between it and the handling object 17, The handling object 17 is adsorbed on the bottom surface of the insulating member 11. At this time, voltages having opposite polarities and the same absolute value are applied to the electrode portions 12A and 12B, respectively. The electrode portion 12A and the electrode portion 12B have the same surface area, and when voltages of opposite polarities and of the same absolute value are applied, the voltage of the back surface of the handling object 17 (the surface on the opposite side of the insulating member 11) becomes 0V. Can be held at The handling target 17 can be transported by moving the supporting devices 14A and 14B in the vertical and horizontal directions by an actuator (not shown).

Here, there are the following two methods as a handling method for loading the handling object 17 on the bottom surface of the insulating member 11.

First, the first handling method is as shown in FIG. In this method, the insulating member 11 is moved downward, and the insulating member 11 is placed on the entire surface of the handling object 17 placed on the sample table 18,
The bottom surface is brought into close contact with the handling object 17. And
If voltage is applied to the electrode portions 12A and 12B in this state,
The handling object 17 is an insulating member 1 due to electrostatic force.
When the insulating member 11 is attracted to the bottom surface of the No. 1 and the insulating member 11 is moved upward, the state shown in FIG. 1 is obtained.

The second handling method is as shown in FIG. In this method, the insulating member 11 is moved downward, and the bent central portion of the insulating member 11 is moved to the sample stage 18
The voltage is applied to the electrode portions 12A and 12B by bringing the handling object 17 placed on the top into contact with the central portion thereof. In the state of FIG. 3, the distance between the insulating member 11 and the handling object 17 gradually increases from the central portion of the handling object 17 to both ends. When voltage is applied, insulation member 1
The electrostatic force between 1 and the handling object 17 also weakens accordingly. Therefore, in this method, the object 17 to be handled is sequentially adsorbed to the bottom surface of the insulating member 11 from a location near the center, and finally the state shown in FIG.

Next, unloading will be described. When the voltage applied to the electrode portions 12A and 12B is cut off, the electrode portion 1
The electrostatic force acting between 2A and 12B and the handling object 17 disappears instantaneously, and the handling object 17 falls by its own weight. At this time, the following two points are important so that the light handling target 17 can be quickly dropped by its own weight.

The handling object 17 is the insulating member 11.
When it is in close contact with the bottom surface, the handling object 17 is pressed against the bottom surface of the insulating member 11 by the atmospheric pressure because the vacuum state exists between the handling object 17 and the insulating member 11 bottom surface even if the applied voltage is cut off. And handling object 1
The object 17 to be handled does not fall only by the light weight of 7. Therefore, in the present embodiment, as described above, the surface roughness of the surface of the bottom of the insulating member 11 that is in contact with the handling target 17 is made rough, and the handling target 17 and the insulating member 11 are made rough.
A large number of minute spaces 105 are formed between the bottom surface and the bottom surface to prevent generation of the vacuum state at the time of suction handling.

When the surface area of the handling object 17 is large, a large damping force is induced by the air flowing in and out of the gap between the bottom surface of the insulating member 11 and the handling object 17 as the gap fluctuates. This damping force prevents the thin and light handling object 17 from quickly adhering to the bottom surface of the insulating member 11, and also prevents the handling object 17 from rapidly dropping during unloading. Therefore, in the present embodiment, in order to eliminate this damping force, a large number of through holes 16 penetrating from the bottom surface to the upper surface of the insulating member 11 including the electrode portions 12A and 12B.
Forming an insulating member 11 for loading and unloading
Air in and out between the bottom surface and the handling object 17 is made smooth.

(Second Embodiment) FIG. 4 shows a handling device according to a second embodiment. In this embodiment,
The object 17 to be handled on the bottom surface of the insulating member 11 during loading
A position sensor 21 is provided to detect whether or not the two are in close contact with each other. Then, the detection signal from the position sensor 21 is input to the voltage controller 13. Other configurations are similar to those in the first embodiment.

From the state where the bottom surface of the insulating member 11 has a certain initial gap with the handling object 17, in order to attract and hold the handling object 17 by suction, a voltage inversely proportional to the square of the gap is applied to the electrode portion 12A, It is necessary to apply the voltage to 12B, but once the handling object 17 is adsorbed on the bottom surface of the insulating member 11, the applied voltage required to maintain the adsorbed state may be low.

Therefore, in the present embodiment, the insulating member 11
When the position sensor 21 detects that the handling object 17 is in close contact with the bottom surface, the voltage controller 13 controls the voltage applied to the electrode units 12A and 12B to be low. As a result, it is possible to prevent the handling target 17 from wrinkling or being scratched by the action of an excessive electrostatic force during suction and holding.

(Third Embodiment) FIG. 5 shows a handling device according to a third embodiment. In the first and second embodiments, the insulating member 11, that is, the chuck has flexibility, but in the present embodiment, the chuck itself is formed with high rigidity. That is, the handling device according to the present embodiment includes the planar insulating member 31 and the insulating member 3.
1 includes a positive side electrode portion 32A and a negative side electrode portion 32B, and a voltage controller 13 that applies a voltage to the electrode portions 32A and 32B. Insulation member 31
Is fixed to the lower surface of a highly rigid flat plate-shaped support member 33. Here, the insulating member 31 and the support member 33 form a chuck body.

Further, the insulating member 31 is provided with fine irregularities 34 on the bottom surface as shown enlarged in the lower circle of FIG. 5, and the surface shape of the bottom portion is rough. Further, in the insulating member 31 and the supporting member 33 including the electrode portions 32A and 32B, a large number of through holes 35 penetrating from the bottom surface of the insulating member 31 to the upper surface of the supporting member 33 are formed. The shape of the bottom surface of the insulating member 31 is not limited to the fine irregularities 34 in the lower circle in FIG. 5, and may have a fine saw-tooth shape in cross section or a rounded sawtooth-shaped tip. .

In the above structure, since the bottom surface of the insulating member 31 is formed to have a rough surface, the handling object 36 is easily separated from the bottom surface of the insulating member 31 during unloading.
The handling work can be done quickly. Further, since a large number of through holes 35 are formed, it becomes easy for air to come in and out between the bottom surface of the insulating member 31 and the handling target object 36, and the handling work can be performed more quickly.

In the present embodiment, since the highly rigid support member 33 exists, there is a drawback that the weight of the chuck becomes heavy.
For this reason, the handling object 36 has a diameter of 300 m as an applicable range of the handling device according to the present embodiment.
It is about m or less.

In the handling device of this embodiment as well, as in the case of the second embodiment, the insulating member 3 at the time of loading is used.
A position sensor that detects whether or not the handling target object 36 is in close contact with the bottom surface of the first unit can be provided. Then, based on the detection signal from the position sensor, the voltage controller 13
May be configured to control the voltage applied to the electrode portions 32A and 32B.

(Fourth Embodiment) FIG. 6 shows a handling device according to a fourth embodiment. Although the electrode portion is provided inside the insulating member in the first to third embodiments, the electrode portion is fixed to the bottom surface of the insulating member in the present embodiment. That is, the handling device according to the present embodiment includes the planar insulating member 41 and the electrode section 4 provided on the bottom surface of the insulating member 41.
2A and 42B, and a voltage control unit 13 that applies a voltage to the electrode units 42A and 42B. The insulating member 41 is fixed to the lower surface of a highly rigid flat plate-shaped support member 43. Here, the insulating member 41 and the support member 43 form a chuck body.

The electrode portions 42A and 42B are provided with fine irregularities 44 on the bottom surface as shown in an enlarged scale in the lower circle of FIG. 6, and the surface shape of the bottom portion is rough. Further, the insulating member 41 and the support member 43 including the electrode portions 42A and 42B are provided with a large number of through holes 45 penetrating from the bottom surfaces of the electrode portions 42A and 42B to the upper surface of the support member 43. The shape of the bottom surface of the electrodes 42A and 42B is not limited to the fine irregularities 44 in the lower circle of FIG. 6, but may be a fine sawtooth shape in cross section, or the tip of the sawtooth is rounded. Is also good.

In the above structure, the electrode portions 42A, 42B
Since the bottom surface is formed to have a rough surface, the handling object 46 can be easily separated from the bottom surfaces of the electrode portions 42A and 42B at the time of unloading, and the handling work can be performed quickly. Further, since a large number of through holes 45 are formed, the bottom surfaces of the electrode portions 42A and 42B and the handling object 4
Air can easily enter and leave between 6 and the handling work can be performed more quickly.

As in the case of the second embodiment, the handling device of the present embodiment also has the electrode portions 42A, 4A at the time of loading.
A position sensor that detects whether or not the handling object 46 is in close contact with the bottom surface of 2B can be provided. Then, based on the detection signal from the position sensor, the voltage controller 1
3 can be configured to control the voltage applied to the electrode portions 42A and 42B.

Further, in this embodiment, the electrode parts 42A, 4A
2B and the handling object 46 are in direct contact,
The handling work can be performed only when the handling object 46 is a high resistance body, or at least one surface is a high resistance body.

The handling devices of the first and second embodiments can also be configured as in the fourth embodiment. That is, in the first and second embodiments, the electrode portions 12A and 12B are not provided inside the insulating member 11, and the electrode portions 12A and 12B are provided on the bottom surface of the insulating member 11.
To fix. Then, by providing fine irregularities 44 on the bottoms of the electrode portions 12A and 12B and roughening the surface roughness of the bottom surfaces of the electrode portions 12A and 12B, the same operational effect can be obtained.

[0042]

As described above, according to the present invention,
Since the bottom surface of the chuck body is rough,
A vacuum state does not occur between the bottom surface of the chuck body and the object to be handled, and the handling work can be performed quickly.

If the chuck body is flexible, the position of the object to be handled will not be displaced during handling, and the positioning accuracy during unloading will be improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram of a handling device according to a first embodiment of the present invention.

FIG. 2 is a diagram showing an example of a handling method by the handling device of FIG.

FIG. 3 is a diagram showing another example of a handling method by the handling device of FIG.

FIG. 4 is a configuration diagram of a handling device according to a second embodiment of the present invention.

FIG. 5 is a configuration diagram of a handling device according to a third embodiment of the present invention.

FIG. 6 is a configuration diagram of a handling device according to a fourth embodiment of the present invention.

FIG. 7 is a configuration diagram of a handling device according to the related art.

FIG. 8 is a configuration diagram of another handling device according to the related art.

[Explanation of symbols]

11 Insulation member 12A, 12B electrode part 13 Voltage controller 14A, 14B support device 15 unevenness 16 through holes 17 Handling object 21 Position sensor 31 Insulation member 32A, 32B electrode part 33 Support member 34 unevenness 35 through hole 36 Handling object 41 Insulation member 42A, 42B electrode part 43 Support member 44 unevenness 45 through hole 46 Handling object

Claims (11)

[Claims] 1. A planar chuck body, an electrode section provided inside the chuck body, and a voltage control section for applying a voltage to the electrode section, wherein a voltage is applied to the electrode section by the voltage control section. A handling device for attracting a handling object placed below the chuck body by using electrostatic force generated when applied, wherein the chuck body has flexibility and a central portion is bent. The handling device is characterized in that both ends are supported by and the bottom surface is roughened. 2. The handling device according to claim 1, wherein the chuck body, including the electrode portion, is formed in a film shape. 3. A flat plate-shaped chuck body, an electrode section provided inside the chuck body, and a voltage control section for applying a voltage to the electrode section, wherein a voltage is applied to the electrode section by the voltage control section. A handling device for attracting a handling object placed below the chuck body by using an electrostatic force generated when applied, wherein the chuck body has a rough bottom surface. A characteristic handling device. 4. The handling device according to claim 1, wherein the chuck body has a large number of through holes penetrating from a bottom surface to an upper surface thereof. apparatus. 5. The handling device according to claim 1, further comprising a position sensor that detects whether or not the handling object is in close contact with the bottom surface of the chuck body, and the voltage control. The unit captures a detection signal from the position sensor, and when it determines that the handling object is in close contact with the bottom surface of the chuck body, lowers the voltage applied to the electrode unit. . 6. A flat plate-shaped chuck body, an electrode portion provided on the bottom surface of the chuck body, and a voltage controller for applying a voltage to the electrode portion, wherein the voltage controller applies a voltage to the electrode portion. A handling device for adsorbing a handling object placed below the electrode part by using an electrostatic force generated when a voltage is applied, wherein the electrode part is formed to have a rough surface at the bottom surface. A handling device characterized by. 7. The handling device according to claim 6, wherein the chuck body holds air between the bottom surface and the handling object when adsorbing the handling object on the bottom surface of the electrode portion. A handling device characterized in that a large number of through holes are formed for pulling the chuck body upward. 8. The handling device according to claim 6, wherein a position sensor is provided on a bottom surface of the electrode unit to detect whether or not the handling object is in close contact, and the voltage control unit is configured to detect the position. A handling device, wherein when a detection signal from a sensor is taken in and it is determined that the object to be handled is in close contact with the bottom surface of the electrode portion, the voltage applied to the electrode portion is lowered. 9. A carrying device comprising a handling device for attracting a handling object by using electrostatic force and a moving mechanism for moving the handling device, wherein the handling device is any one of claims 1 to 8.
A handling device, which is equipped with the handling device according to the item. 10. A chuck body which is flexible and whose both ends are supported in a state where the central portion is bent and whose bottom surface has a rough surface, and an electrode portion provided inside the chuck body. When adsorbing a handling target using a handling device equipped with, the chuck body is placed on the handling target and brought into close contact with the handling target, and a voltage is applied to the electrode section in this state. A handling method for attracting the handling object to the bottom surface of the chuck body by electrostatic force. 11. A chuck main body which is flexible and has both ends supported in a state where a central portion is bent and whose bottom surface has a rough surface, and an electrode portion provided inside the chuck main body. When adsorbing a handling target using a handling device equipped with, the central portion of the chuck body is brought into contact with the handling target, a voltage is applied to the electrode portion in this state, and the electrostatic force causes A handling method for sucking and adsorbing a handling object on the bottom surface of the chuck body.