JP2003283102A - Method and system for manufacturing metal film - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing metal films and a system for manufacturing the metal films by which the metal films can be efficiently made without causing decrease in a throughput when the metal films such as wiring patterns are made by a liquid drop discharging method. <P>SOLUTION: When the wiring patterns are made on a substrate P by discharging ink including metals onto the substrate P, the ink contains 50 wt.% to 70 wt.% inclusive of metal solid content. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal film manufacturing method and a metal film manufacturing apparatus for forming a metal film by discharging a fluid containing metal from a droplet discharge head.

[0002]

2. Description of the Related Art Conventionally, a photolithography method has been widely used as a method for manufacturing a device having a fine wiring pattern such as a semiconductor integrated circuit.
As disclosed in Japanese Patent No. 4671 and the like, attention is focused on a device manufacturing method using a droplet discharge method. The technique disclosed in the above publication forms an interconnection pattern (electric circuit) on a substrate by ejecting ink (fluid) containing a pattern forming material from a droplet ejection head onto a pattern forming surface. Yes, it is very effective in that it can be used for small-lot production.

To form an electric circuit by such a droplet discharge device, fine particles of metal are made into a paste using a solvent or a binder, and ink containing the metal is discharged onto a substrate to form an electric circuit. . Conventionally, the solid content of ink is set to about 30 wt%. As the solid content contained in the ink, there are binders and various additives in addition to metals, but most of them are metals. By setting the solid content to about 30 wt%, the metal fine particles are stably dispersed in the ink.

[0004]

However, in manufacturing a device using the above-mentioned ink, the following problems occur. When the wiring pattern of a device to be manufactured requires high conductivity, the film thickness (layer thickness) of this wiring pattern needs to be formed thicker than a predetermined thickness. However, the conventional solid content is 3
When ink of about 0 wt% is used, a wiring pattern having a predetermined thickness may not be obtained by one application operation (ejection operation). To obtain sufficient conductivity, the application operation is performed a plurality of times to obtain a wiring pattern. Had to be applied thickly. In this case, the throughput is lowered.

The present invention has been made in view of the above circumstances, and when a metal film such as a wiring pattern is formed using a droplet discharge method, the metal film can be formed efficiently without lowering the throughput. An object of the present invention is to provide a metal film manufacturing method and a metal film manufacturing apparatus.

[0006]

In order to solve the above-mentioned problems, a method of manufacturing a metal film according to the present invention is directed to discharging a fluid containing metal from a droplet discharge head onto a predetermined surface. In a method of manufacturing a metal film, the method including the step of forming a metal film, the amount of the metal contained in the fluid is 50 wt%.
It is characterized in that the content is set to 70 wt% or less and the fluid is discharged onto the predetermined surface.

According to the present invention, by setting the solid content (metal content) of the fluid to 50 wt% or more and 70 wt% or less, a metal such as a wiring pattern is formed by a droplet discharge method using this fluid. When forming a film, a metal film having a desired film thickness can be formed by one or a small number of coating operations (ejection operations). Therefore, a metal film having desired performance (electrical resistance value: for example, about 10 ⁻⁶ Ω) can be efficiently formed in a short time.

Here, if the solid content is more than 70 wt%, the metal fine particles in the fluid will not be stably dispersed, and the viscosity will increase and the droplets will not be stably ejected from the droplet ejection head. On the other hand, if the solid content is less than 50 wt%, the coating operation for obtaining the desired film thickness must be performed many times as in the conventional case.

As the droplet discharging method, even a piezo jet method in which a fluid is discharged by changing the volume of a piezoelectric element is a method in which a fluid is discharged by suddenly generating steam by applying heat. May be.

The fluid means a medium having a viscosity capable of being ejected from the nozzle of the droplet ejection head. It does not matter whether it is aqueous or oily. It is sufficient if it has fluidity (viscosity) that can be discharged from a nozzle or the like, and even if solid substances are mixed, it may be a fluid as a whole. Further, the material contained in the fluid may be one that is heated to a temperature equal to or higher than the melting point and dissolved, or one that is stirred as fine particles in a solvent, in which a dye, a pigment or other functional material is added in addition to the solvent. It may be. Further, the wiring pattern (electrical circuit) is a member that is formed by an electrical cooperative relationship between circuit elements, and has specific electrical characteristics and constant electrical characteristics.

The predetermined surface may be a flat substrate or a curved substrate. Furthermore, the hardness of the pattern forming surface does not need to be hard, and may be the surface of a flexible material such as film, paper, or rubber in addition to glass, plastic, and metal.

The metal used in the present invention is a conductive metal such as silver, gold, nickel, indium,
Tin, lead, zinc, titanium, copper, tantalum, tungsten,
Palladium, platinum, iron, cobalt, boron, silicon, aluminum, magnesium, scandium, rhodium,
At least one metal selected from the group consisting of iridium, vanadium, ruthenium, osmium, niobium, bismuth, barium or the like, or an alloy thereof can be used. In addition, silver oxide (A
gO or Ag ₂ O) and copper oxide are also included.

The above metal is processed into fine particles and dispersed in a fluid. Here, the particle size of the metal fine particles is preferably as small as possible (for example, 5 to 7 μm).

In this case, the viscosity of the fluid at the time of ejection from the droplet ejection head is 4 × by adjusting the temperature of the fluid by using the metal as the fluid using a predetermined solvent. 10 ^-2 Pa · s or less (40 cps
By setting the following), a stable ejection operation can be realized. That is, since the viscosity of the fluid changes depending on the temperature and the solvent used, it is possible to obtain a fluid having a desired viscosity even if the solid content is high by optimally selecting these.

Here, as the solvent in which the metal fine particles are dispersed to form a fluid, a solvent containing at least one of alcohols having 5 or more carbon atoms (for example, terpineol, citronellol, geraniol, nerol, phenethyl alcohol), or organic Any solvent containing at least one kind of ester (eg, ethyl acetate, methyl oleate, butyl acetate, glyceride) may be used, and can be appropriately selected depending on the use of the metal or metal paste to be used. Furthermore, mineral spirit, tridecane, dodecylbenzene or a mixture thereof, or a mixture thereof with α-terpineol, a hydrocarbon having 5 or more carbon atoms (for example, pinene, etc.),
Alcohol (eg, n-heptanol etc.), ether (eg, ethylbenzyl ether etc.), ester (eg, n-butyl stearate etc.), ketone (eg,
It is also possible to use diisobutyl ketone etc.), organic nitrogen compounds (eg triisopropanolamine etc.), organic silicon compounds (silicone oil etc.), organic sulfur compounds or mixtures thereof. Here, since a high boiling point solvent is preferable for the droplet discharge device, for example, tetradecane having a boiling point of about 250 ° C. is preferably used. In addition, you may add a suitable organic substance in an organic solvent as needed.

The metal film manufacturing apparatus of the present invention is a metal film manufacturing apparatus having a droplet discharge head capable of discharging a fluid containing metal, and the viscosity of the fluid at the time of discharging from the droplet discharge head. 4 × 10 ^-2 Pa · s or less (40
A temperature adjusting device for adjusting the temperature of the fluid so that the temperature is set to cps or less).

According to the present invention, the droplet discharge device can be used as a device for producing a metal wiring pattern, and a fluid having a high solid content can be obtained by adjusting the temperature of the fluid by a temperature adjusting device. Even when a body is used, a stable discharge operation can be realized by setting the viscosity of the fluid to 4 × 10 ^-2 Pa · s or less. In addition, when the solid content is 70 wt%, the viscosity of the fluid is 2 × 10 ⁻² to 4 at room temperature.
It is about 10 ⁻² Pa · s (20 to 40 cps).

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, a metal film manufacturing apparatus and a metal film manufacturing method of the present invention will be described. FIG. 1 is a schematic perspective view showing an embodiment of a metal film manufacturing apparatus of the present invention. A metal film manufacturing apparatus of the present invention is a droplet discharge apparatus that forms a wiring pattern that is a metal film by discharging droplets from a droplet discharge head onto a predetermined surface of a substrate.

In FIG. 1, a droplet discharge device IJ is disposed between the base 12, a stage ST provided on the base 12 and supporting the substrate P, and the stage ST is moved between the base 12 and the stage ST. A first moving device (moving device) 14 that supports the liquid droplet ejection head 20 that can eject ink (fluid) containing a predetermined material onto the substrate P supported by the stage ST; A second moving device 16 that movably supports the ejection head 20 and a control device CONT that controls the ink ejection operation of the droplet ejection head 20 are provided. The droplet discharge head 20 is a pipe (flow path) 1
A tank for storing ink through 01 (fluid containing portion)
Ink to be ejected from the droplet ejection head 20 is supplied from the tank 100 through the pipe 101.

A head temperature adjusting device (temperature adjusting device) 20A capable of adjusting the temperature of the ink ejected from the droplet ejecting head 20 to a predetermined temperature is attached to the droplet ejecting head 20. The temperature adjusting device 20A is a control device C.
Controlled by ONT.

Further, the droplet discharge device IJ has an electronic balance (not shown) as a weight measuring device provided on the base 12, a capping unit 22 and a cleaning unit 24. The operation of the droplet discharge device IJ including the first moving device 14 and the second moving device 16 is as follows.
It is controlled by the control unit CONT.

The droplet discharge device IJ is a chamber CH.
It is housed inside, and the entire droplet discharge device IJ including the chamber CH is arranged in a clean room. The temperature inside the chamber CH is controlled by a chamber temperature adjusting device (not shown).

Further, a tank temperature adjusting device (not shown) for adjusting the temperature of the ink contained in the tank 100 is attached to the tank 100. Also, pipe 1
01 also has a pipe temperature adjusting device (not shown) for adjusting the temperature of the ink flowing through the pipe 101.

Here, the entire device manufacturing apparatus (device manufacturing system) is provided with a plurality of droplet discharge devices IJ as shown in FIG. 1, and the inks containing different materials from each droplet discharge device ( Fluid) is discharged. Then, of the plurality of droplet discharge devices of the plurality of groups, the first droplet discharge device discharges the ink containing the first material and then bake or dry the ink.
Next, the ink containing the second material is ejected from the second droplet ejecting device to the first material layer, and then the ink is baked or dried, and the same process is performed using a plurality of droplet ejecting devices. By doing so, a plurality of material layers are laminated on the substrate P to form a multilayer wiring pattern.

The first moving device 14 is installed on the base 12 and is positioned along the Y direction. Second
The moving device 16 uses the columns 16A and 16A to form the base 1
It is attached upright with respect to 2, and is attached at the rear portion 12A of the base 12. Second moving device 1
The X direction (second direction) 6 is a direction orthogonal to the Y direction (first direction) of the first moving device 14. Here, the Y direction is a direction along the front portion 12B and the rear portion 12A of the base 12. On the other hand, the X direction is a direction along the left-right direction of the base 12 and is horizontal. Further, the Z direction is a direction perpendicular to the X direction and the Y direction.

The first moving device 14 is composed of, for example, a linear motor, and is provided with guide rails 40, 40 and a slider 42 movably provided along the guide rail 40. The slider 42 of the first moving device 14 of the linear motor type is the guide rail 40.
Can be positioned by moving in the Y direction.

The slider 42 rotates around the Z axis (θZ).
The motor 44 is provided. The motor 44 is, for example, a direct drive motor, and the rotor of the motor 44 is fixed to the stage ST. As a result, by energizing the motor 44, the rotor and the stage ST are separated by θ.
The stage ST can be indexed (rotational index) by rotating along the Z direction. That is, the first moving device 14 can move the stage ST in the Y direction (first direction) and the θZ direction.

The stage ST holds the substrate P and positions it at a predetermined position. Further, the stage ST has a suction holding device 50, and when the suction holding device 50 operates, the substrate P is sucked and held on the stage ST through the hole 46A of the stage ST.

The second moving device 16 is composed of a linear motor, and is a column 16 fixed to the columns 16A and 16A.
B, a guide rail 62A supported by the column 16B, and a slider 60 movably supported in the X direction along the guide rail 62A. The slider 60 can be positioned along the guide rail 62A by moving in the X direction, and the droplet discharge head 20 is attached to the slider 60.

The droplet discharge head 20 has motors 62, 64, 66 and 68 as swing positioning devices.
When the motor 62 is operated, the droplet discharge head 20 can be vertically moved and positioned along the Z axis. This Z axis is X
It is a direction (vertical direction) orthogonal to each of the axis and the Y axis. When the motor 64 is operated, the droplet discharge head 20
Positioning is possible by swinging along the β direction around the Y axis. When the motor 66 is operated, the droplet discharge head 20
Positioning is possible by swinging in the γ direction around the X axis. When the motor 68 is operated, the droplet discharge head 20 can be positioned by swinging in the α direction around the Z axis. That is, the second moving device 16 moves the droplet discharge head 20 in the X direction (first
Direction) and the Z direction, and the droplet discharge head 20 is supported so as to be movable in the θX direction, the θY direction, and the θZ direction.

As described above, the droplet discharge head 20 of FIG.
Can be positioned by linearly moving in the Z-axis direction on the slider 60, and can be positioned by swinging along α, β, γ, and the droplet discharge surface 20P of the droplet discharge head 20.
Can accurately control the position or orientation of the substrate P on the stage ST side. The droplet discharge surface 20P of the droplet discharge head 20 is provided with a plurality of nozzles for discharging ink.

FIG. 2 is an exploded perspective view showing the droplet discharge head 20. As shown in FIG. 2, the droplet discharge head 20 is
The nozzle plate 210 provided with the nozzles 211 and the pressure chamber substrate 220 provided with the vibration plate 230 are attached to the housing 25.
It is configured to fit in 0. This droplet discharge head 2
The main part structure of No. 0 has a structure in which the pressure chamber substrate 220 is sandwiched between the nozzle plate 210 and the vibration plate 230, as shown in the partial perspective view of the perspective view of FIG. Nozzle plate 21
No. 0 has a nozzle 211 formed at a position corresponding to the cavity (pressure chamber) 221 when bonded to the pressure chamber substrate 220. The pressure chamber substrate 220 includes
A plurality of cavities 221 are provided so that each can function as a pressure chamber by etching a silicon single crystal substrate or the like. Side walls (partition walls) 22 between the cavities 221
Separated by 2. Each cavity 221 has a supply port 22
It is connected to the reservoir 223, which is a common flow path, via No. 4. The diaphragm 230 is made of, for example, a thermal oxide film. The vibrating plate 230 is provided with an ink tank port 231 so that an arbitrary fluid can be supplied from the tank 100 through the pipe 101. A piezoelectric element 240 is formed on the vibrating plate 230 at a position corresponding to the cavity 221. The piezoelectric element 240 has a structure in which a crystal of piezoelectric ceramics such as a PZT element is sandwiched between an upper electrode and a lower electrode (not shown). Piezoelectric element 240
Is capable of causing a volume change in response to a discharge signal supplied from the control device CONT.

Ink (fluid) from the droplet discharge head 20
In order to eject, the control device CONT first supplies an ejection signal for ejecting the fluid to the droplet ejection head 20. The fluid has flown into the cavity 221 of the droplet discharge head 20 and is supplied with the discharge signal.
At 0, the piezoelectric element 240 causes a volume change due to the voltage applied between the upper electrode and the lower electrode. This volume change deforms the vibration plate 230 and causes the cavity 22
Change the volume of 1. As a result, the cavity 22
A droplet of the fluid is ejected from the first nozzle hole 211. The fluid discharged from the tank 100 is newly supplied to the cavity 221 from which the fluid has been discharged.

The droplet discharge head has a structure in which the piezoelectric element changes its volume to discharge the fluid, but heat is applied to the fluid by the heating element so that the fluid is expanded to discharge the droplet. It may have a different head configuration.

The electronic balance (not shown) includes a droplet discharge head 2
In order to measure and manage the weight of one droplet discharged from the 0 nozzle, for example, 5000 droplets are received from the nozzle of the droplet discharge head 20. The electronic balance can accurately measure the weight of one drop by dividing the weight of the 5000 drops by the number 5000. Based on the measured amount of this droplet, the droplet discharge head 20
It is possible to optimally control the amount of droplets discharged from the.

The cleaning unit 24 can clean the nozzles of the droplet discharge head 20 or the like periodically or at any time during the device manufacturing process or during standby. The capping unit 22 is used for the droplet discharge head 20.
In order to prevent the liquid droplet ejection surface 20P from drying, a cap is put on the liquid droplet ejection surface 20P during standby when the device is not manufactured.

By moving the droplet discharge head 20 in the X direction by the second moving device 16, the droplet discharge head 20 can be selectively positioned above the electronic balance, cleaning unit 24 or capping unit 22. . In other words, even during the device manufacturing work,
By moving the droplet discharge head 20 to the electronic balance side, for example, the weight of the droplet can be measured. In addition, the droplet discharge head 20
Can be moved onto the cleaning unit 24 to clean the droplet discharge head 20. When the droplet discharge head 20 is moved above the capping unit 22, a cap is attached to the droplet discharge surface 20P of the droplet discharge head 20 to prevent drying.

That is, the electronic balance, the cleaning unit 24, and the capping unit 22 are arranged on the rear end side of the base 12 and directly below the movement path of the droplet discharge head 20 and apart from the stage ST. Since the work of supplying the substrate P to the stage ST and the work of discharging the substrate P are performed on the front end side of the base 12, these electronic balance, cleaning unit 24 or capping unit 22 are used.
Will not hinder the work.

The wiring pattern (metal film) is formed on the upper surface of the substrate P.
Has a pattern forming region in which is formed. And
To form a wiring pattern, ink (fluid) is applied from the droplet discharge head 20 to the pattern formation area of the substrate P.
Is discharged.

The ink contained in the tank 100 contains a material for forming a wiring pattern (metal film) formed on the substrate P. The ink is formed by forming conductive metal fine particles into a paste using a predetermined organic solvent and a binder.

As the conductive metal contained in the ink, that is, the metal forming the wiring pattern, silver, gold, nickel, indium, tin, lead, zinc,
At least one metal selected from titanium, copper, tantalum, tungsten, palladium, platinum, iron, cobalt, boron, silicon, aluminum, magnesium, scandium, rhodium, iridium, vanadium, ruthenium, osmium, niobium, bismuth, barium, etc. These alloys are mentioned. In addition, silver oxide (AgO or Ag
₂ O) and copper oxide are also included.

The metal is processed into fine particles having, for example, a particle size of about 5 to 7 μm, and dispersed in a predetermined solvent to form an ink. As the solvent to be used, a solvent containing one or more alcohols having 5 or more carbon atoms (eg, terpineol, citronellol, geraniol, nerol, phenethyl alcohol), or organic esters (eg, ethyl acetate, methyl oleate, butyl acetate) ,
A solvent containing at least one of (glyceride),
It can be appropriately selected depending on the application of the metal or metal paste used. Furthermore, mineral spirits, tridecane, dodecylbenzene or a mixture thereof, or a mixture thereof with α-terpineol, a hydrocarbon having 5 or more carbon atoms (for example, pinene, etc.), alcohol (for example, n
-Heptanol etc.), ether (eg ethylbenzyl ether etc.), ester (eg n-butyl stearate etc.), ketone (eg diisobutyl ketone etc.), organic nitrogen compound (eg triisopropanolamine etc.), organosilicon A compound (silicone oil or the like), an organic sulfur compound or a mixture thereof can also be used. Here, since a high boiling point solvent is preferable for the droplet discharge device IJ, for example, tetradecane having a boiling point of about 250 ° C. is preferably used. The viscosity of the ink can be adjusted by selecting the solvent to be used.

The solid content of the ink is 50w.
It is set to be t% or more and 70 wt% or less. It is preferably set to 60 wt%. Here, the solid content is the metal fine particles, a predetermined binder, various additives, and the like. Of these, the metal fine particles occupy most of the solid content,
The amount of binders and additives is small.

The ink contained in the tank 100 is controlled to a predetermined temperature by the tank temperature adjusting device, and the temperature-adjusted ink is adjusted to a desired viscosity.

Further, the ink flowing through the pipe 101 is controlled to have a predetermined temperature by the pipe temperature adjusting device and its viscosity is adjusted. Further, the temperature of the ink ejected from the droplet ejection head 20 is controlled by the temperature adjusting device 20A provided in the droplet ejection head 20 to adjust the viscosity to a desired value. Further, the temperature inside the chamber CH is also controlled to a predetermined temperature by the chamber temperature adjusting device.

Next, using the droplet discharge device IJ having the above-described structure, ink is discharged from the droplet discharge head 20 onto the substrate (predetermined surface) P to form a wiring pattern (metal film) on the substrate P. The procedure for forming the will be described.

The ink contained in the tank 100 is temperature-controlled and its viscosity is controlled by a tank temperature adjusting device, and the pipe 1 is instructed by the controller CONT.
It is supplied to the droplet discharge head 20 through 01. Here, the temperature of the ink flowing through the pipe 101 is also controlled by the pipe temperature adjusting device and the viscosity is controlled.

The temperature of the ink ejected from the liquid droplet ejecting head 20 is controlled by the temperature adjusting device 20A and 4 × 1.
The viscosity is controlled to be 0 ^-2 Pa · s or less (40 cps or less). By adjusting the ink temperature during ejection and setting the viscosity to 40 cps or less, 50 wt.
%, The ink with a high solid content of 70% by weight or more can be stably ejected from the droplet ejection head 20.

Here, the solid content of the ink is 70 wt.
If it is set to be more than 0.1%, the fine metal particles in the ink will not be stably dispersed, and even if the temperature is controlled, the viscosity becomes high and the droplet discharge head 20 cannot stably discharge.

As described above, while adjusting the temperature of the ink, the wiring pattern is formed by the droplet discharge method using the ink having the solid content of 50 wt% or more and 70 wt% or less. A wiring pattern having a desired conductivity, that is, a metal film having a desired film thickness can be formed by, for example, one ejection operation (coating operation). here,
When the solid content is less than 50 wt%, the discharging operation (coating operation) for obtaining a desired film thickness must be performed many times as in the conventional case.

As described above, the solid content of the ink is 50 wt% or more and 70 wt% or less, preferably 60 w.
By setting t%, a wiring pattern having a desired film thickness can be formed by one or a small number of coating operations (ejection operations) when a wiring pattern is formed by a droplet discharge method using this ink. Therefore, a wiring pattern having desired performance (electrical resistance value: for example, about 10 ⁻⁶ Ω) can be efficiently formed in a short time, throughput can be improved, and manufacturing cost can be reduced.

Then, the metal, which is the material for forming the wiring pattern, is made into ink using a predetermined solvent, and the droplet discharge head 2
The temperature at the time of ejecting ink is adjusted by using the temperature adjusting device 20A attached to 0, and the viscosity of the ink at the time of ejecting from the droplet ejecting head 20 is 4 × 10 ⁻² Pa · s.
By setting below (40 cps or less), stable ejection operation can be realized. By controlling the viscosity of the ink by adjusting the temperature of the ink and selecting the solvent to be used, a stable ejection operation can be realized, which in turn contributes to improving the productivity of the device.

In the above embodiment, the tank temperature adjusting device, the pipe temperature adjusting device, and the head temperature adjusting device 20.
A. It has been described that the temperature of the ink is adjusted using all the temperature adjusting devices of the chamber temperature adjusting device, but the temperature of the ink at the time of discharging from the droplet discharge head 20 is adjusted to have a predetermined viscosity. Therefore, only the head temperature adjusting device 20A may be used to adjust the ink temperature during ejection.

By experimentally obtaining the relationship between the temperature and the viscosity of the ink at the time of ejection, the control unit CONT makes the ink have a desired viscosity based on the obtained result. The temperature adjustment device 20A can be controlled. Here, in the controller CONT, the relationship between the temperature and the viscosity of each of the plurality of types of ink used is stored.

In this embodiment, the temperature of the ink is adjusted by the temperature adjusting device. However, depending on the material used, the viscosity at room temperature is 40 cps or less even if the solid content is 70 wt%. It is not always necessary to adjust the temperature of the ink.

Although the ink in this embodiment contains a metal having conductivity, it may contain a conductive polymer.

With the method and apparatus for manufacturing a metal film of the present invention, a wiring pattern of an organic EL (electroluminescence) display device as shown in FIG. 4 can be formed. An EL display device has a structure in which a thin film containing a fluorescent inorganic and organic compound is sandwiched between a cathode and an anode, and excitons are generated by injecting electrons and holes into the thin film and recombining them. It is an element that produces (exciton) and emits light by utilizing the emission of light (fluorescence / phosphorescence) when the exciton is deactivated.

The organic EL display device S1 shown in FIG.
Thin film transistor (TFT)
or) is a so-called top emission type in which light is extracted from the side opposite to the side of the substrate P on which the or is arranged.

Examples of materials for forming the substrate P include glass, quartz, sapphire, and synthetic resins such as polyester, polyacrylate, polycarbonate, and polyetherketone. Here, when the organic EL display device is a top emission type, the substrate P may be opaque, and in that case, a ceramic sheet such as alumina or a metal sheet such as stainless steel that has been subjected to an insulation treatment such as surface oxidation, A thermosetting resin, a thermoplastic resin or the like can be used.

The organic EL display device S1 comprises a substrate P,
An anode (pixel electrode) 323 made of a transparent electrode material such as indium tin oxide (ITO), a hole transport layer 370 capable of transporting holes from the anode 323, and one of electro-optic substances. A light emitting layer (organic EL layer, electro-optical element) 360 containing an organic EL substance, an electron transport layer 350 provided on the upper surface of the light emitting layer 360, and an electron transport layer 35.
Formed on the substrate P and a cathode (counter electrode) 522 made of aluminum (Al), magnesium (Mg), gold (Au), silver (Ag), calcium (Ca), etc. The pixel electrode 323 includes a thin film transistor (hereinafter referred to as “TFT”) 324 as an energization control unit that controls whether or not to write a data signal. The TFT 324 operates based on an operation command signal from a scanning line drive circuit and a data line drive circuit (not shown), and controls energization to the pixel electrode 323.

The TFT 324 is provided on the surface of the substrate P via a base protective layer 581 composed mainly of SiO ₂ . This TFT 324 includes a silicon layer 541 formed on the upper layer of the base protection layer 581, a gate insulating layer 582 provided on the upper layer of the base protection layer 581 so as to cover the silicon layer 541, and an upper surface of the gate insulating layer 582. Gate electrode 542 provided in a portion facing the silicon layer 541
And a gate insulating layer 582 so as to cover the gate electrode 542.
The first interlayer insulating layer 583 provided on the upper layer, the source electrode 543 connected to the silicon layer 541 through a contact hole opened over the gate insulating layer 582 and the first interlayer insulating layer 583, and the gate electrode 542. A drain electrode 544 which is provided at a position facing the source electrode 543 and which is connected to the silicon layer 541 through a contact hole opened over the gate insulating layer 582 and the first interlayer insulating layer 583; and the source electrode 543 and the drain electrode 544. And a second interlayer insulating layer 584 provided on the first interlayer insulating layer 583 so as to cover the first interlayer insulating layer 583.

The pixel electrode 323 is disposed on the upper surface of the second interlayer insulating layer 584, and the pixel electrode 323 and the drain electrode 544 are connected through the contact hole 323a provided in the second interlayer insulating layer 584. There is. Also,
A third insulating layer (bank layer) 521 made of synthetic resin or the like is provided between the cathode 522 and a portion of the surface of the second interlayer insulating layer 584 other than where the organic EL element is provided.

A region of the silicon layer 541 which overlaps with the gate electrode 542 with the gate insulating layer 582 sandwiched therebetween serves as a channel region. Further, in the silicon layer 541, the source region is provided on the source side of the channel region, while the drain region is provided on the drain side of the channel region. Of these, the source region is connected to the source electrode 543 through a contact hole that is opened across the gate insulating layer 582 and the first interlayer insulating layer 583. On the other hand, the drain region is the gate insulating layer 5
The drain electrode 544 formed of the same layer as the source electrode 543 is connected through a contact hole that is opened between the first electrode 82 and the first interlayer insulating layer 583. Pixel electrode 3
23 is a silicon layer 54 via the drain electrode 544.
1 drain region.

In the organic EL display device S1 having the above structure, the anode 323 and the cathode 5 as metal films are formed.
In the film forming process such as 22, the manufacturing method and the manufacturing apparatus of the present invention can be applied.

The technical scope of the present invention is not limited to the above-mentioned embodiments, and various modifications can be made without departing from the spirit of the present invention. The material and layer structure are merely examples, and can be appropriately changed.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing an example of a metal film manufacturing apparatus of the present invention.

FIG. 2 is an exploded perspective view of a droplet discharge head.

FIG. 3 is a partial cross-sectional view of a perspective view of a main part of the droplet discharge head.

FIG. 4 is a diagram showing an example of a layer structure of an organic EL display device manufactured by the method for manufacturing a metal film of the present invention.

[Explanation of symbols]

20 Droplet ejection head 20A temperature controller CONT control device IJ droplet discharge device (metal film manufacturing device) P substrate (predetermined surface)

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01B 13/00 503 H01B 13/00 503D 5E343 H01L 21/288 H01L 21/288 Z 5G323 H05B 33/10 H05B 33/10 33 / 14 33/14 A 33/26 33/26 ZF term (reference) 3K007 AB18 DB03 FA00 4D075 AC06 AC08 AC96 BB22X DA06 DB13 DB14 DC18 DC22 EA10 EA14 EB01 EC30 EC54 4F041 AA06 AB01 AB05 BA10 BA22 BA32 BA38 BA48 4F042 AA07 AB BA16 CB11 DF09 4M104 BB01 BB02 BB04 BB05 BB06 BB07 BB08 BB09 BB13 BB14 BB17 BB18 BB36 DD51 5E343 AA12 AA26 AA34 BB23 BB24 BB25 BB28 BB15 BB15 BB45 FF45 DD45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45 BB45

Claims (3)

[Claims] 1. A method of manufacturing a metal film, comprising the step of discharging a fluid containing metal from a droplet discharge head onto a predetermined surface to form a metal film on the predetermined surface. The amount of metal is 50 wt% or more 7
A method for producing a metal film, which is set to 0 wt% or less and the fluid is discharged onto the predetermined surface. 2. The viscosity of the fluid when discharged from the droplet discharge head is 4 × 10 ⁻ by adjusting the temperature of the fluid by using the metal as the fluid using a predetermined solvent. ^The method for producing a metal film according to claim 1, wherein the pressure is set to ² Pa · s or less. 3. A metal film manufacturing apparatus having a droplet discharge head capable of discharging a fluid containing metal, wherein the viscosity of the fluid at the time of discharge from the droplet discharge head is 4 × 10 ⁻² Pa · An apparatus for producing a metal film, comprising a temperature adjusting device for adjusting the temperature of the fluid so as to be s or less.