JP2003281985A5 - - Google Patents
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- Publication number
- JP2003281985A5 JP2003281985A5 JP2002082687A JP2002082687A JP2003281985A5 JP 2003281985 A5 JP2003281985 A5 JP 2003281985A5 JP 2002082687 A JP2002082687 A JP 2002082687A JP 2002082687 A JP2002082687 A JP 2002082687A JP 2003281985 A5 JP2003281985 A5 JP 2003281985A5
- Authority
- JP
- Japan
- Prior art keywords
- container body
- lead member
- hollow package
- circuit element
- disposed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000463 material Substances 0.000 claims 3
- 238000000465 moulding Methods 0.000 claims 3
- 239000011347 resin Substances 0.000 claims 3
- 229920005989 resin Polymers 0.000 claims 3
- 239000004020 conductor Substances 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 1
- 229910045601 alloy Inorganic materials 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000002844 melting Methods 0.000 claims 1
- 230000008018 melting Effects 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002082687A JP2003281985A (en) | 2002-03-25 | 2002-03-25 | Hollow package and manufacturing method therefor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002082687A JP2003281985A (en) | 2002-03-25 | 2002-03-25 | Hollow package and manufacturing method therefor |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2003281985A JP2003281985A (en) | 2003-10-03 |
JP2003281985A5 true JP2003281985A5 (en) | 2005-08-25 |
Family
ID=29230782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2002082687A Withdrawn JP2003281985A (en) | 2002-03-25 | 2002-03-25 | Hollow package and manufacturing method therefor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2003281985A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5225953B2 (en) * | 2009-08-27 | 2013-07-03 | 日東電工株式会社 | Electronic device and membrane filtration apparatus provided with the same |
DE202015101840U1 (en) * | 2015-04-15 | 2015-04-30 | Inter Control Hermann Köhler Elektrik GmbH & Co. KG | Fuse component |
JP6231218B1 (en) * | 2016-01-27 | 2017-11-15 | エス・オー・シー株式会社 | Chip fuse and manufacturing method of chip fuse |
-
2002
- 2002-03-25 JP JP2002082687A patent/JP2003281985A/en not_active Withdrawn
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