JP2003279969A - Manufacturing method for reflection film, manufacturing method for device, manufacturing method for optoelectronic device, device, optoelectronic device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a reflection film capable of realizing excellent workability and cost reduction without the need of large- scale facilities at the time of forming the reflection film into a prescribed pattern. <P>SOLUTION: By ejecting a liquid material including a metal onto a substrate 104 by using an ink-jet device IJ, the reflection film 111 including the metal is formed on the substrate 104. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a reflective film, a method for manufacturing a device, a method for manufacturing an electro-optical device, a device, an electro-optical device, and electronic equipment.

[0002]

2. Description of the Related Art An optical disk such as a laser disk (registered trademark) has a resin substrate and a reflective film made of metal such as aluminum or aluminum alloy provided on the resin substrate. Conventionally, a sputtering method and a vacuum vapor deposition method are known as methods for forming a metallic reflection film.

In the vacuum vapor deposition method, an evaporation source is arranged in the lower part of the vacuum container, and a work (substrate) is arranged in the upper part of the vacuum container so as to face the evaporation source, and evaporation is performed by electron beam heating or resistance heating. This is a method of evaporating the source metal particles such as aluminum and depositing them on the surface of the work to form a metal film such as aluminum on the surface.

Further, in the sputtering method, for example, the plasma sputtering method, a sputtering source in which a metal target such as aluminum is provided above a magnet is arranged in a vacuum chamber, and a work is arranged so as to face the sputtering source. Then, while introducing an inert gas into the vacuum container, a plasma is generated between the work and the metal target by the magnetic field formed near the surface of the metal target and the applied electric field, and the metal target is sputtered by this plasma. Then, metal particles of aluminum or the like are deposited on the surface of the work to form a metal film of aluminum or the like on the surface.

[0005]

However, the above-mentioned conventional method for forming a reflective film has the following problems. That is, when it is desired to form the reflection film in a predetermined pattern, it is necessary to form the metal film on the surface of the work by the above-described vacuum deposition method or sputtering method, and then pattern the metal film by a photolithography process or an etching process. The above-mentioned steps require large-scale equipment, and the number of steps is increased, resulting in lower workability and higher costs.

The present invention has been made in view of the above circumstances, and when forming a reflective film in a predetermined pattern, a large-scale facility is not required, and good workability and cost reduction can be realized. And a method for manufacturing a device, a method for manufacturing an electro-optical device, a device and an electro-optical device, and an electronic apparatus using the manufacturing method for a reflective film.

[0007]

In order to solve the above-mentioned problems, a method of manufacturing a reflective film according to the present invention is characterized in that a liquid material containing a metal is provided on a substrate by using a droplet discharge device. And a reflective film containing the metal is formed.

According to the present invention, since the reflective film is formed by using the droplet discharge device, another process such as a photolithography process or an etching process is required when forming the reflective film having a pattern. Therefore, a reflective film having a desired pattern can be easily formed. Therefore, the reflective film can be manufactured with good workability in a simple process.

In the method for producing a reflective film of the present invention, the metal contains at least one of Au, Ag, Cu, Al, Ni and Cr, and the liquid material is a predetermined solvent in which the metal is dispersed. The configuration that is the one is adopted. As a result, the droplet discharge device can discharge the above metal onto the substrate to form the metal reflection film.

Here, the droplet discharge device in the present invention includes an ink jet device having an ink jet head (droplet discharge head). An inkjet head of an inkjet device can quantitatively eject a liquid material by an inkjet method, and for example, 1 to 300 per dot.
It is a device capable of quantitatively intermittently dropping nanogram liquid material (fluid). By adopting the inkjet method as the method for manufacturing the reflective film, the reflective film can be formed in a predetermined pattern with inexpensive equipment. The droplet discharge device may be a dispenser device.

As an ink jet system, even a piezo jet system in which a fluid (liquid material) is ejected by a change in volume of a piezoelectric element, a system in which a fluid is ejected by rapidly generating steam by applying heat May be

Here, the fluid means a medium having a viscosity capable of being discharged (dripping) from a nozzle of an ink jet head. It does not matter whether it is aqueous or oily. It is sufficient if it has fluidity (viscosity) capable of being ejected from a nozzle or the like, and even if a solid substance is mixed, it may be a fluid as a whole. Further, the material contained in the fluid may be, in addition to those dispersed as fine particles in a solvent, those heated to a temperature equal to or higher than the melting point and dissolved, and a dye, a pigment or other functional material is added to the solvent. It may be one. The substrate may be a flat substrate or a curved substrate. Furthermore, the hardness of the pattern forming surface does not need to be hard, and may be the surface of a flexible material such as film, paper, or rubber in addition to glass, plastic, and metal.

The method of manufacturing a device of the present invention is characterized in that, in the method of manufacturing a device having a reflective film, the reflective film is formed by the method of manufacturing a reflective film described above.

According to the present invention, when the reflective film of the device is formed, by using the reflective film manufacturing method of the present invention, it is possible to form the device with good workability in a small number of steps.
Therefore, a low-cost device can be manufactured.

The method of manufacturing an electro-optical device according to the present invention is the method of manufacturing an electro-optical device having an electro-optical material and a pair of substrates sandwiching the electro-optical material, wherein a reflective film adjacent to the substrate is formed. The method has a step of forming a reflective film containing metal on the substrate by providing a liquid material containing metal on the substrate using a droplet discharge device.

According to the present invention, when the electro-optical device having the reflective film is manufactured, the reflective film is formed by using the droplet discharge device. Therefore, when the reflective film having the pattern is formed, photolithography is performed. A reflective film having a desired pattern can be easily formed without requiring other steps such as a step and an etching step. Therefore, it is possible to manufacture the electro-optical device with good workability and low cost in a simple process.

Here, the electro-optical material includes a liquid crystal material and an organic electroluminescent material, and the electro-optical device includes a liquid crystal device and an organic electroluminescent device. In particular, examples of the liquid crystal device having a reflective film include a reflective liquid crystal display device that captures ambient light and displays an image.

In the method of manufacturing an electro-optical device of the present invention, there is adopted a structure having a step of forming a partition wall on the substrate, and providing the liquid material in a space formed by the partition wall and the substrate. Thus, for example, the partition wall is formed as a resist layer (bank layer) patterned to have an opening by using a photolithography method or a printing method, and the liquid material is discharged into the opening by discharging the liquid material into the opening. The patterning can be performed with high precision simply by arranging it in the portion. Here, by performing surface treatment such as lyophobic treatment or lyophilic treatment on the formed bank layer in advance, patterning of the liquid material can be performed with higher accuracy.

The device of the present invention is characterized by being manufactured by the device manufacturing method described above. According to the present invention, since it is manufactured by the device manufacturing method described above, a low cost and inexpensive device is provided.

An electro-optical device according to the present invention is manufactured by the above-described method for manufacturing an electro-optical device. According to the present invention, since it is manufactured by the manufacturing method of the electro-optical device described above, a low-cost and inexpensive electro-optical device is provided.

The electronic equipment of the present invention is characterized by having the device described above. Further, an electronic apparatus of the invention is characterized by including the electro-optical device described above. According to the present invention, by mounting the device and the electro-optical device of the present invention, it is possible to provide low-cost and inexpensive electronic equipment.

Here, the reflective film in the present invention is a film which is provided in a device, an electro-optical device or an electronic device and is capable of generating a reflected light having a desired intensity (reflectance) when irradiated with light. To tell. That is, the reflectance is set according to the purpose of the device, and a reflection film having the set reflectance may be used.

[0023]

BEST MODE FOR CARRYING OUT THE INVENTION A method for manufacturing a reflective film of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing an inkjet device as a droplet discharge device used in the method for manufacturing a reflective film of the present invention, and FIGS. 2 and 3 are diagrams showing an inkjet head (droplet discharge head). In FIG. 1, an inkjet device (droplet discharge device) IJ
Is a film forming apparatus capable of placing a liquid material on the substrate P, and includes a base 12, a stage ST provided on the base 12 and supporting the substrate P, and interposed between the base 12 and the stage ST. , The first for movably supporting the stage ST
The moving device 14 and the substrate P supported by the stage ST
Ink containing a predetermined material for (liquid material, fluid)
An inkjet head (droplet ejection device) 20 capable of quantitatively ejecting (dripping) ink and a second moving device 16 that movably supports the inkjet head 20 are provided.
An electronic balance (not shown) as a weight measuring device, a capping unit 22, and a cleaning unit 24 are provided on the base 12. Then, the ink ejection operation of the inkjet head 20 and the first moving device 1
The operation of the inkjet device IJ including the moving operation of the fourth moving device 16 and the second moving device 16 is controlled by the control device CONT.

In the following description, the droplet discharge device is described as an ink jet device, but the invention is not particularly limited to the ink jet device, and the liquid material is drawn in a predetermined pattern on the substrate P by discharging droplets. What is possible is, for example, a dispenser device may be used.

The first moving device 14 is installed on the base 12 and is positioned along the Y-axis direction. The second moving device 16 is vertically attached to the base 12 by using the columns 16A and 16A, and is attached to the rear portion 12A of the base 12. The X-axis direction (second direction) of the second moving device 16 is a direction orthogonal to the Y-axis direction (first direction) of the first moving device 14. Here, the Y-axis direction is a direction along the front portion 12B and the rear portion 12A of the base 12. On the other hand, the X-axis direction is a direction along the left-right direction of the base 12 and is horizontal.
The Z-axis direction is a direction perpendicular to the X-axis direction and the Y-axis direction.

The first moving device 14 is composed of, for example, a linear motor, and is provided with guide rails 40, 40 and a slider 42 movably provided along the guide rail 40. The slider 42 of the first moving device 14 of the linear motor type is the guide rail 40.
Can be positioned by moving in the Y-axis direction.

Further, the slider 42 is about the Z axis (θz)
The motor 44 is provided. The motor 44 is, for example, a direct drive motor, and the rotor of the motor 44 is fixed to the stage ST. As a result, by energizing the motor 44, the rotor and the stage ST are separated by θ.
The stage ST can be indexed (rotationally indexed) by rotating along the z direction. That is, the first moving device 14 moves the stage ST in the Y-axis direction (first direction).
And can be moved in the θz direction.

The stage ST holds the substrate P and positions it at a predetermined position. Further, the stage ST has a suction holding device 50, and when the suction holding device 50 operates, the substrate P is sucked and held on the stage ST through the hole 46A of the stage ST.

The second moving device 16 is composed of a linear motor, and is a column 16 fixed to the columns 16A and 16A.
B, a guide rail 62A supported by the column 16B, and a slider 60 movably supported along the guide rail 62A in the X-axis direction.
The slider 60 can be moved along the guide rail 62A in the X-axis direction to be positioned, and the inkjet head 20 is attached to the slider 60.

The ink jet head 20 has motors 62, 64, 66 and 68 as swing positioning devices. When the motor 62 is operated, the inkjet head 20 can move up and down along the Z axis and be positioned.
The Z axis is a direction (vertical direction) orthogonal to the X axis and the Y axis. When the motor 64 is operated, the inkjet head 20 can be positioned by swinging along the β direction around the Y axis. When the motor 66 is operated, the inkjet head 20 can be positioned by swinging in the γ direction around the X axis. When the motor 68 is operated, the inkjet head 20 can be positioned by swinging in the α direction around the Z axis. That is, the second moving device 16 supports the inkjet head 20 movably in the X-axis direction (first direction) and the Z-axis direction, and can move the inkjet head 20 in the θx direction, the θy direction, and the θz direction. To support.

As described above, the inkjet head 20 of FIG. 1 can be positioned by linearly moving in the Z-axis direction on the slider 60, and can be positioned by swinging along α, β and γ. The ink ejection surface 20P of 20 can accurately control the position or orientation with respect to the substrate P on the stage ST side. A plurality of nozzles for ejecting ink are provided on the ink ejection surface 20P of the inkjet head 20.

FIG. 2 is an exploded perspective view showing the ink jet head 20. As shown in FIG. 2, the inkjet head 20 includes a nozzle plate 21 having nozzles 211.
0, a pressure chamber substrate 220 having a vibrating plate 230, and a housing 250 that fits and supports the nozzle plate 210 and the vibrating plate 230 with a capacitor. As shown in the partial perspective view of the perspective view of FIG. 3, the main structure of the inkjet head 20 has a structure in which the pressure chamber substrate 220 is sandwiched between the nozzle plate 210 and the vibration plate 230. Nozzles 211 are formed on the nozzle plate 210 at positions corresponding to the cavities (pressure chambers) 221 when bonded to the pressure chamber substrate 220. Pressure chamber substrate 2
By etching a silicon single crystal substrate or the like, each of the cavities 20 can function as a pressure chamber.
A plurality of 1 are provided. Side walls 222 separate the cavities 221 from each other. Each cavity 221 has a reservoir 223, which is a common flow path, via a supply port 224.
Connected to. The diaphragm 230 is made of, for example, a thermal oxide film. The vibrating plate 230 has an ink tank port 23.
1 is provided, and is configured to be capable of supplying an arbitrary liquid material from a tank (fluid containing portion) (not shown) through a pipe (flow path). A piezoelectric element 240 is formed on the diaphragm 230 at a position corresponding to the cavity 221. The piezoelectric element 240 has a structure in which a crystal of piezoelectric ceramics such as a PZT element is sandwiched between an upper electrode and a lower electrode (not shown). The piezoelectric element 240 is configured to be able to generate a volume change in response to an ejection signal supplied from the control device CONT.

In order to eject the liquid material from the ink jet head 20, first, the controller CONT supplies the ink jet head 20 with an ejection signal for ejecting the liquid material. The liquid material flows into the cavity 221 of the inkjet head 20, and in the inkjet head 20 to which the ejection signal is supplied, the piezoelectric element 240 changes its volume due to the voltage applied between its upper electrode and lower electrode. Occurs. This volume change deforms the vibration plate 230 and changes the volume of the cavity 221. As a result, the liquid material droplets are ejected from the nozzle hole 211 of the cavity 221. The liquid material reduced by the discharge is newly supplied from the tank 80 described later to the cavity 221 from which the liquid material is discharged.

Although the above-mentioned ink jet head has a structure in which the volume of the piezoelectric element is changed to eject the liquid material, the heating element applies heat to the liquid material to expel the liquid droplet to eject the liquid material. It may be configured.

The electronic balance (not shown) measures, for example, the weight of one ink droplet ejected from the nozzle of the ink jet head 20, and manages, for example, 5000 ink droplets from the nozzle of the ink jet head 20. Receive. The electronic balance measures the weight of these 5000 ink drops by 5
By dividing by the number of 000 and the number of nozzles, the weight of one ink drop per nozzle can be accurately measured. The amount of ink droplets ejected from the inkjet head 20 can be optimally controlled based on the measured amount of ink droplets.

The cleaning unit 24 can clean the nozzles of the ink jet head 20 or the like periodically or at any time during the device manufacturing process or during standby. The capping unit 22 covers the ink ejection surface 20P of the inkjet head 20 with a cap in a standby state before manufacturing a device in order to prevent the ink ejection surface 20P from drying.

By moving the inkjet head 20 in the X-axis direction by the second moving device 16, the inkjet head 20 can be selectively positioned above the electronic balance, cleaning unit 24 or capping unit 22. That is, even during the device manufacturing work, the weight of the ink droplet can be measured by moving the inkjet head 20 to the electronic balance side, for example.
Further, by moving the inkjet head 20 onto the cleaning unit 24, the inkjet head 20 can be cleaned. Inkjet head 2
When 0 is moved onto the capping unit 22, a cap is attached to the ink ejection surface 20P of the inkjet head 20 to prevent drying.

That is, the electronic balance, the cleaning unit 24, and the capping unit 22 are arranged on the rear end side of the base 12 and directly below the movement path of the ink jet head 20 and apart from the stage ST.
Since the work of supplying the substrate P to the stage ST and the work of discharging the substrate P are performed on the front end side of the base 12, these electronic balances,
The cleaning unit 24 or the capping unit 22 does not hinder the work.

The substrate P has a pattern formation region in which a pattern is formed on the upper surface. Then, in order to form a reflective film as a pattern, ink (liquid material) is ejected from the inkjet head 20 onto the pattern formation region of the substrate P.

The ink is, for example, Au (gold) or Ag.
It contains a metallic material which is a reflective film forming material for forming a reflective film such as (silver), Cu (copper), Al (aluminum), Ni (nickel), Cr (chrome). The ink is a paste of the metal material using a predetermined solvent and a binder resin.

Here, the metal may be any one as long as it reflects irradiated light. In addition to the above metals, indium, tin, lead, zinc, titanium, tantalum, tungsten,
At least one metal selected from the group consisting of palladium, platinum, iron, cobalt, boron, silicon, magnesium, scandium, rhodium, iridium, vanadium, ruthenium, osmium, niobium, bismuth, barium or the like, or an alloy thereof can be used. In addition, silver oxide (AgO or Ag
₂ O) and copper oxide are also included. Among these metals, aluminum or an alloy containing aluminum is preferable in the present embodiment.

The above metal is processed into fine particles and dispersed in a liquid material. Here, the particle size of the metal fine particles is preferably as small as possible (for example, 5 to 7 nm).

Here, as the solvent for dispersing the metal fine particles into a liquid material, alcohols having 5 or more carbon atoms (for example, terpineol, citronellol, geraniol,
A solvent containing at least one of nerol and phenethyl alcohol) or a solvent containing at least one of organic esters (eg, ethyl acetate, methyl oleate, butyl acetate, glyceride) may be used, and may be appropriately selected depending on the metal used. You can choose. Furthermore, mineral spirits, tridecane,
Dodecylbenzene or a mixture thereof, or a mixture thereof with α-terpineol, a hydrocarbon having 5 or more carbon atoms (for example, pinene, etc.), alcohol (for example,
n-heptanol etc.), ether (eg ethyl benzyl ether etc.), ester (eg n-butyl stearate etc.), ketone (eg diisobutyl ketone etc.), organic nitrogen compound (eg triisopropanolamine etc.), organic It is also possible to use a silicon compound (silicone oil or the like), an organic sulfur compound or a mixture thereof. Here, since a high boiling point solvent is preferable for the inkjet device IJ, it is preferable to use, for example, tetradecane having a boiling point of about 250 ° C. The viscosity of the ink can be adjusted by selecting the solvent to be used.
In addition, you may add a suitable organic substance in an organic solvent as needed.

The ink in which the metal material is dispersed is stored in a tank (liquid material storage portion) 80. Tank 8
0 is connected to the inkjet head 20 via a pipe (flow path) 81, and the ink to be ejected from the inkjet head 20 is supplied from the tank 80 via the pipe 81.

The tank 80 is provided with a temperature adjusting device 82 for adjusting the temperature of the ink. Temperature control device 82
Is composed of a heater. The temperature adjusting device 82 is controlled by the control device CONT, and the ink in the tank 80 is adjusted to a predetermined temperature by the temperature adjusting device 82 to be adjusted to a desired viscosity.

Further, the tank 80 is provided with a stirring device 83 for stirring the ink contained in the tank 80. The metal fine particles in the ink are uniformly dispersed by being stirred by the stirring device 83.

Further, the ink flowing through the pipe 81 is controlled to a predetermined temperature by a pipe temperature adjusting device (not shown),
The viscosity is adjusted. Furthermore, the temperature of the ink ejected from the inkjet head 20 is
It is controlled by a temperature adjusting device (not shown) provided at 0 to adjust the viscosity to a desired value.

Here, the ink jet head 2 is shown in FIG.
Although only one 0 is shown, the inkjet device I
A plurality of inkjet heads 20 are provided in J, and different or the same kind of ink is ejected from each of the plurality of inkjet heads 20. Then, of the plurality of ink jets 20 on the substrate P, the ink containing the first material is ejected from the first ink jet head, and then the ink is baked or dried,
Then, the ink containing the second material is ejected from the second inkjet head onto the substrate P, and then the substrate P is baked or dried, and thereafter, the same process is performed using a plurality of inkjet heads. Then, a plurality of material layers are laminated to form a multilayer pattern.

FIG. 4 is a view showing an example of a device having a reflective film formed by using the ink jet device IJ, and is a schematic sectional view showing a reflective liquid crystal display device. As shown in FIG. 4, the reflective liquid crystal display device LCD includes an upper polarizing plate 101, a counter substrate 102 which is a glass substrate, a liquid crystal 103, an element substrate 104 which is a glass substrate, and a lower polarizing plate 105. Have RG is used as the counter substrate 102.
A B3 color filter 107 is provided for each pixel, and these are separated by a light shielding film (black matrix) 107a. Further, the counter substrate 102 is provided with a counter electrode 108 which is adjacent to the color filter 107 via an unillustrated overcoat layer (protective layer) and an alignment film 109 which is adjacent to the counter electrode 108. On the other hand, the element substrate 104 includes a plurality of pixel electrodes 110 and a plurality of pixel electrodes 11.
Adjacent reflective films 111 are provided corresponding to the respective 0s. The reflective film 111 is provided on the element substrate 104. In addition, the alignment film 1 covers the pixel electrode 110.
12 are provided. The liquid crystal display device LCD has a driver IC chip D and is driven by this.

The counter electrode 108 and the pixel electrode 110 are made of transparent ITO (Indium Tin Oxide),
Each of the pixel electrodes 110 has a thin film transistor (TFT).
ansistor: Thin film transistor) or MIM (Metal)
Insulator Metal: A switching element (not shown) such as a two-terminal switching element is connected. The counter substrate 102 and the element substrate 104 are connected by a sealing material 113 containing an epoxy adhesive or the like. The sealing material 113 contains a gap material that adjusts the distance (gap) between the counter substrate 102 and the element substrate 104 when they are bonded to each other.

Next, a procedure for manufacturing the above-mentioned liquid crystal display device LCD will be described with reference to FIG. Figure 5
As shown in (a), a synthetic resin layer (resist layer, bank layer) 200 such as an acrylic resin or a polyimide resin is formed on the element substrate 104 by using a spin coating method or a dip coating method. Here, a synthetic resin layer 200 is formed by applying a solution of a polyimide resin in a solvent to the element substrate 104 by a spin coating method.

Next, as shown in FIG. 5B, openings 200a corresponding to pixels are formed in the synthetic resin layer 200 by photolithography. Opening 200
By forming a, a partition is formed in the synthetic resin layer 200. Opening 200 forming a partition
When a is formed, the surface of the synthetic resin layer 200 is provided with a lyophilic region and a lyophobic region. In this embodiment, each region is provided by the plasma treatment process. Specifically, the plasma treatment step includes a preheating step, a lyophilic step for making the wall surface of the opening 200a and the surface of the element substrate 104 lyophilic, and a lyophobic step for making the upper surface of the synthetic resin layer 200 lyophobic. And a cooling step. That is, the base material (element substrate 104) is heated to a predetermined temperature (for example, about 70 to 80 ° C.), and then plasma treatment (O ₂ plasma treatment) using oxygen as a reaction gas in the atmosphere is performed as a lyophilic step. Subsequently, as a lyophobic process, plasma treatment (CF ₄ plasma treatment) using tetrafluoromethane as a reaction gas is performed in the air atmosphere, and the base material heated for plasma treatment is cooled to room temperature. Liquidity and liquid repellency will be imparted to a predetermined location.

Next, as shown in FIG. 5C, for the synthetic resin layer (bank layer) 200 having an opening 200a, the ink jet device I described with reference to FIGS.
From the inkjet head 20 of J, the ink containing the above-mentioned metal for forming the reflection film 111 is opened 200.
It is discharged to a (a space formed by the partition wall and the substrate 104). The ejected ink droplets spread on the surface of the element substrate 104 that has been subjected to the lyophilic treatment, and fill the vicinity of the bottom of the opening 200a. On the other hand, the liquid-repellent synthetic resin layer 20
Ink drops are repelled and do not adhere to the upper surface of 0. Therefore, even if the ink droplet is ejected from the predetermined ejection position onto the upper surface of the synthetic resin layer 200, the upper surface is not wetted by the ink droplet, and the repelled ink droplet is the opening portion 200a of the synthetic resin layer 200. It is supposed to roll inside. Here, the synthetic resin layer (bank layer) 200 may be made of any material as long as it does not dissolve in the solvent of the ink and is easily patterned by etching or the like. When the ink containing the metal is placed in the opening 200a,
The reflection film 111 is formed by performing a drying process and a heat treatment for removing the solvent contained in the ink.

After the reflection film 111 is formed, FIG.
As shown in, the pixel electrode 110 is formed on the upper layer of the reflective film 111.

Next, as shown in FIG. 5E, a polyimide layer which is a material for forming the alignment film 112 is provided on the element substrate 104. Then, after drying and firing this polyimide layer, rubbing is performed for orientation treatment.

On the other hand, although not shown, the counter substrate 102
Also, after forming the color filter 107 by, for example, a photolithography method, an unillustrated overcoat layer (protective layer) and the counter electrode 108 are provided. Then, an alignment film 109 is formed adjacent to the counter electrode 108, and the alignment film 109 is subjected to alignment treatment by rubbing.

Then, a sealing material 113 is arranged around the element substrate 104 (may be around the counter substrate 102) by a screen printing method or the like, and the reflection film 111 and the pixel electrode 110 are formed.
The element substrate 104 provided with and the counter substrate 102 provided with the color filter 107 are bonded to each other, and after heating and curing, the liquid crystal 103 is injected between the element substrate 104 and the counter substrate 102. After the liquid crystal 103 is injected, the injection port is sealed, the liquid crystal is washed, the liquid crystal driving driver IC chip D is attached, and the polarizing plates 101 and 105 are attached to form the liquid crystal display device LCD.

As described above, since the reflective film 111 is formed by using the ink jet device IJ,
When forming the reflective film 111 for each pixel, another process such as a photolithography process or an etching process is not necessary, and the reflective film 111 having a desired pattern can be easily formed. Therefore, the reflective film can be manufactured with good workability in a simple process.

Before the counter substrate 102 and the element substrate 104 are bonded together, a partition wall (bank) is provided on the element substrate 104 side, and the liquid crystal 103 is discharged by the ink jet device IJ into the space formed by this partition wall. After that, the element substrate 104 and the counter substrate 102 having the color filter 107 may be attached to each other. Then, by mounting the polarizing plates 101 and 105, the driver IC chip for driving the liquid crystal is mounted, and the liquid crystal display device LC
D is formed.

6 to 8 are views showing another embodiment of the reflection type liquid crystal display device. Here, in the description using FIGS. 6 to 8, the description of the same or equivalent components as those of the reflective liquid crystal display device LCD described with reference to FIGS. 4 and 5 will be simplified or omitted. In the reflective liquid crystal display device LCD2 shown in FIG. 6, a reflective film 111 is formed on the counter substrate 102 side. That is, the counter substrate 102
Is a reflection film 111 formed adjacent to the counter substrate 102 for each pixel, a color filter 107 adjacent to the reflection film 111, and a counter electrode 108 adjacent to the color filter 107 via an overcoat layer (not shown). , Counter electrode 1
08, and the alignment film 109 adjacent to 08. On the other hand, the element substrate 104 has the pixel electrode 110 adjacent to the element substrate 104. A switching element such as a TFT connected to the pixel electrode 110 is provided on the element substrate 104 side. The liquid crystal 103 is arranged between the counter electrode 102 and the element substrate 104. The reflective film 11
1 is formed by the inkjet device IJ.

The reflective liquid crystal display device LCD2 described with reference to FIG. 6 has a structure in which the reflective film 111 and the color filter 107 are provided on the counter substrate 102 side. On the other hand, FIG.
The reflection-type liquid crystal display device LCD described with reference to (1) has a configuration in which the color filter 107 is provided on the counter substrate 102 side and the reflection film 111 is provided on the element substrate 104 side having switching elements.

In the reflective liquid crystal display device LCD3 shown in FIG. 7, the reflective film 111 is provided on the counter substrate 102 side, and the color filter 107 is provided on the element substrate 104 side having the pixel electrode 110 connected to the switching circuit. .
FIG. 7 shows the overcoat layer (protective layer) 114 of the color filter 107. The reflective film 111 is formed by the inkjet device IJ.

The reflective liquid crystal display device LCD3 shown in FIG.
In the configuration, the reflection film 111 is provided on the counter substrate 102 side, and the color filter 107 is provided on the element substrate 104 side.

In the reflective liquid crystal display device LCD4 shown in FIG. 8, a reflective film 111 and a color filter 107 are provided on the element substrate 104 side having the pixel electrode 110 connected to the switching circuit. The reflective film 111 is formed by the inkjet device IJ.

The reflection type liquid crystal display device LCD4 shown in FIG.
Is a configuration in which the reflection film 111 and the color filter 107 are provided on the element substrate 104 side.

In each of the above embodiments, the pattern of the color filter and the reflection film is as shown in FIGS.
As shown in FIG. 5, any pattern of stripe type, mosaic type, and delta type may be used. Further, the color filter may be either RGB type or YMC type. The element substrate of the liquid crystal display device may have a simple matrix structure or an active matrix structure (TFT, TFD).

FIG. 10 is a view showing an example of a device having a reflection film formed by using the ink jet device IJ, showing an optical disk CD, and FIG.
Is a plan view, and FIG. 10B is a sectional view taken along the line AA of FIG. As shown in FIG. 10, the optical disc CD is
A read-only optical disc in which information signals such as a musical tone signal, a video signal, and a data signal are recorded so as to be optically readable. The substrate 201 has a circular shape in plan view, and the substrate 201.
The signal pattern 202 formed on the substrate 201 and the reflection film 203 formed as a thin film on the signal pattern 202 formed on the substrate 201. The substrate 201 is made of a light-transmitting synthetic resin such as polycarbonate or PMMA, which is injected by an injection molding machine to which a stamper having a concave-convex pattern is formed based on an information signal to be recorded. It is molded by transferring to one surface side of the synthetic resin injected into the cavity of the molding machine and forming a signal pattern.

Further, instead of using the light-transmissive synthetic resin, an ultraviolet curable resin is applied to one surface of a flat glass substrate, and an uneven pattern is formed on the basis of the information signal to be recorded on the applied ultraviolet curable resin. In the state where the stamper on which is formed is pressure-bonded, the ultraviolet curable resin applied on the glass substrate is cured by irradiating ultraviolet rays from the glass substrate side, and the stamper is peeled off to form the uneven pattern of the stamper on the glass substrate. There is also a method of forming a disk substrate by transferring the applied ultraviolet curable resin.

Then, the reflection film 203 is formed on the formed signal pattern 202 of the substrate 201 by using the ink jet device IJ. Examples of the material for forming the reflective film 203 include a reflective metal, such as aluminum or an alloy containing aluminum. Alternatively, the material for forming the reflective film 203 may be Ag, Cr, Ni, or an alloy containing these. The thickness of the reflective film 203 to be formed is 400Å to 1200Å, preferably 450Å to 95.
It is set to 0Å, more preferably 500Å to 900Å.

The substrate 201 by the inkjet device IJ
When the reflective film 203 is formed on the substrate 201, the substrate 201 is loaded and supported on the stage ST shown in FIG. The controller CONT moves the stage ST supporting the substrate 201 to Y.
While scanning in the axial direction, the ink containing the reflective film forming material is applied to the substrate 201 by the ink jet head 20.
A predetermined width is discharged in the axial direction. By this one scan, the substrate 201 is coated with ink having a predetermined width in the X-axis direction. Then, when one scan of the stage ST is completed, the control unit CONT moves the stage ST supporting the substrate 201 stepwise in the X-axis direction. Then, the controller CONT ejects ink from the inkjet head 20 onto the substrate 201 while scanning the stage ST again in the Y-axis direction. By repeating this a predetermined number of times, the ink is uniformly applied to the circular substrate 201.

After the ink is applied to the substrate 201, a drying process (baking process) is performed. As a drying condition, when the substrate 201 is made of the synthetic resin, the substrate is dried at a temperature of 50 ° C. to 80 ° C. for about 1 hour. On the other hand, when the substrate 201 is a glass substrate, it is about 3 at a temperature of 150 ° C to 200 ° C.
It is dried for a minute.

When ink is applied to the circular substrate 201 by the ink jet device IJ, the substrate 20
The stage ST supporting 1 may be rotated in the θz direction, and ink may be applied to the rotating substrate 201. Of course, the ink may be applied to the substrate 201 while the substrate 201 is fixed and the inkjet head 20 is rotated in a circle in the θz direction.

Examples of electronic equipment including the liquid crystal display device LCD of the above embodiment will be described. FIG. 11 is a perspective view showing an example of a mobile phone. In FIG. 11, reference numeral 1
Reference numeral 000 denotes a mobile phone main body, and reference numeral 1001 denotes a display unit using the above liquid crystal display device.

FIG. 12 is a perspective view showing an example of a wrist watch type electronic device. In FIG. 12, reference numeral 1100 indicates the timepiece main body, and reference numeral 1101 indicates the display unit using the above liquid crystal display device.

FIG. 13 is a perspective view showing an example of a portable information processing device such as a word processor and a personal computer. In FIG. 13, reference numeral 1200 is an information processing apparatus, reference numeral 1202 is an input unit such as a keyboard, reference numeral 1204 is the information processing apparatus main body, and reference numeral 1206 is a display unit using the above liquid crystal display device.

Since the electronic equipment shown in FIGS. 11 to 13 is equipped with the liquid crystal display device of the above-mentioned embodiment, it is possible to realize an electronic equipment equipped with a liquid crystal display section having excellent display quality at low cost. .

In the above embodiment, the method for manufacturing a reflective film of the present invention is applied to the reflective film of a reflective liquid crystal display device or the reflective film of an optical disk, but the present invention is not limited to these devices and has a reflective film. The inkjet method can be applied when manufacturing reflective films for all devices and media. Further, the method for producing a reflective film of the present invention can be applied also when forming a reflective film on an organic electroluminescence device.

[0078]

According to the present invention, since the reflective film is formed by using the droplet discharge device, when the reflective film having a pattern is formed, other steps such as a photolithography process and an etching process are performed. A reflective film having a desired pattern can be easily formed without the need. Therefore, the reflective film can be manufactured with good workability in a simple process.

[Brief description of drawings]

FIG. 1 is a schematic perspective view showing a droplet discharge device used in a method for manufacturing a reflective film of the present invention.

FIG. 2 is an exploded perspective view of an inkjet head.

FIG. 3 is a partial cross-sectional view of a perspective view of a main part of the inkjet head.

FIG. 4 is a cross-sectional view showing a liquid crystal display device, which is an example of a device having a reflective film manufactured by the method for manufacturing a reflective film of the present invention.

FIG. 5 is a diagram showing an example of a manufacturing process of a liquid crystal display device.

FIG. 6 is a cross-sectional view showing another embodiment of a liquid crystal display device having a reflective film.

FIG. 7 is a cross-sectional view showing another embodiment of a liquid crystal display device having a reflective film.

FIG. 8 is a cross-sectional view showing another embodiment of a liquid crystal display device having a reflective film.

FIG. 9 is a diagram showing an example of a color filter pattern.

FIG. 10 is a diagram showing an example of a device for rocking the reflective film manufactured by the method for manufacturing a reflective film of the present invention, which is an optical disk.

FIG. 11 is a diagram showing an example of an electronic apparatus including the device of the present invention.

FIG. 12 is a diagram showing an example of an electronic apparatus including the device of the present invention.

FIG. 13 is a diagram showing an example of an electronic apparatus including the device of the present invention.

[Explanation of symbols]

IJ Inkjet device (droplet ejection device) 20 Inkjet head (droplet ejection device, droplet ejection head) 111 Reflective film

Continued front page    (72) Inventor Tomoki Kawase             Seiko, 3-3-3 Yamato, Suwa City, Nagano Prefecture             -In Epson Corporation F-term (reference) 2H042 DA02 DA03 DA04 DA05 DA07                       DA12 DA22 DC01 DE00                 2H048 BA02 BA45 BA64 BA66 BB02                       BB10 BB42                 2H091 FA14Y FB02 FB12 FB13                       FC01 FC18 LA12

Claims (9)

[Claims] 1. A method of manufacturing a reflection film, comprising forming a reflection film containing the metal on the substrate by providing a liquid material containing the metal on the substrate using a droplet discharge device. 2. The metal is Au, Ag, Cu, Al,
The method for producing a reflective film according to claim 1, wherein the liquid material contains at least one of Ni and Cr, and the liquid material is one in which the metal is dispersed in a predetermined solvent. 3. A method for manufacturing a device having a reflective film, wherein the reflective film is formed by the method for manufacturing a reflective film according to claim 1. 4. A method of manufacturing an electro-optical device having an electro-optical material and a pair of substrates sandwiching the electro-optical material, the method including the step of forming a reflective film adjacent to the substrate, the liquid containing a metal. A method for manufacturing an electro-optical device, characterized in that a reflective film containing the metal is formed on the substrate by providing a material on the substrate using a droplet discharge device. 5. The manufacturing of the electro-optical device according to claim 4, further comprising a step of forming a partition on the substrate, wherein the liquid material is provided in a space formed by the partition and the substrate. Method. 6. A device manufactured by the method for manufacturing a device according to claim 3. 7. An electro-optical device manufactured by the method for manufacturing an electro-optical device according to claim 4. 8. An electronic apparatus comprising the device according to claim 6. 9. An electronic apparatus comprising the electro-optical device according to claim 7.