JP2003273505A - Injection soldering apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an injection soldering apparatus of simplified structure. <P>SOLUTION: A pump 5 performs pumping of a fused solder 6 into a duct 2 laid at a bottom of a solder vessel 1. The duct 2 has an opening upper surface at the other end. The bottom of a nozzle body 6 is fixed to an aperture by deposition. The nozzle body 7 is communicated with the duct 2 at the aperture of bottom and thereby the fused solder 6 pumped into the duct 2 is sent through the aperture of the bottom. A rectifying plate 15 is allocated in the front and rear directions of the nozzle body 7 at the bottom of the nozzle body 7 facing to the duct 2, and thereby the fused solder 6 flowing into the nozzle body 7 is rectified. The nozzle body 7 is also integrated with cylindrical flowing path bodies 7a, 7b projected toward the upper part from the upper surface of a ceiling. Accordingly, in the nozzles 8a, 8b formed, the upper end apertures of the flowing path bodies 7a, 7b are projected to the upper side than the liquid surface level of the fused solder 6 in the solder tank 1. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet soldering device.

[0002]

2. Description of the Related Art When a chip component mounted on a printed circuit board is to be soldered to the printed circuit board, molten solder is ejected as a jet wave above the liquid surface to cause a lower surface of the printed circuit board (above the liquid surface) to move. BACKGROUND ART A jet soldering device is widely used in which molten solder is brought into contact with a soldering side surface to solder a mounted component.

[0003]

In the conventional jet soldering apparatus, two nozzles are arranged in front of and behind the moving direction of the printed circuit board, and the molten solder is ejected from both nozzles, so that the printed circuit board and the chip component are ejected. However, the structure is complicated because the pumps are provided corresponding to the two nozzles corresponding to the respective nozzles.

Another problem is to reduce the temperature drop between the two nozzles.

There is also a problem that the temperature of the molten solder is not uniform in the solder bath and the solder component changes.

The present invention has been made in view of the above points, and an object of the present invention is to provide a jet soldering device having a simple structure.

Another object of the invention of claim 2 is, in addition to the object of the invention of claim 1, is to provide a jet soldering device capable of reducing a temperature drop between nozzles.

An object of the invention of claim 3 is to provide a jet soldering device capable of easily adjusting the distance between nozzles in addition to the object of the invention of claim 2.

Further, the object of the invention of claim 4 is, in addition to the object of any one of claims 1 to 3, a jet flow capable of adjusting the amount of molten solder ejected from the first and second nozzles. It is to provide a soldering device.

A fifth aspect of the present invention is, in addition to the object of any one of the first to fourth aspects of the invention, to provide a jet soldering device capable of making the temperature of the molten solder uniform in the solder bath. To do.

[0011]

In order to achieve the above object, in the invention of claim 1, a solder bath for storing molten solder and a printed circuit board moving above the liquid level of the molten solder in the solder bath are provided. It is placed close to and parallel to the front and rear of the moving direction,
The upper end opening is exposed above the molten solder, and the first and second flow path bodies to which the pressurized molten solder is fed from the lower end opening and the upper end openings of the first and second flow path bodies are respectively covered. The first and second nozzles for ejecting the molten solder that has been deposited and sent through the respective flow path bodies so as to come into contact with the lower surface of the upper printed circuit board, and the molten solder for the first and second streams. It is characterized by being provided with one pump which pressurizes and sends it to the road body.

According to a second aspect of the present invention, in the first aspect of the invention, the second nozzle of the second flow path body, which is on the front side in the moving direction of the printed circuit board, has a molten solder ejected as a jet wave. Is provided with an obliquely downward guide that guides to the first flow path body side, and the distance between the apex position of this guide and the first flow path body is freely changeable.

According to a third aspect of the invention, in the second aspect of the invention, the distance to the first nozzle can be changed by replacing at least a part of the constituent member of the second nozzle. .

According to a fourth aspect of the present invention, in any one of the first to third aspects of the present invention, the first and second flow passage bodies are integrally projected upward from the ceiling portion, and lower end openings of both flow passage bodies are formed. A nozzle body connected to the inside of the nozzle, and one end of a duct for feeding the molten solder pressurized by a pump into the nozzle body is connected to the lower part of the nozzle body. In the main body, the molten solder that hangs down from the ceiling between the lower end openings of the first and second flow path bodies and is pressure-fed into the nozzle body from the duct is connected to the first and second
It is characterized in that a flow dividing plate for dividing the flow into the channel body is provided.

According to a fifth aspect of the invention, in any one of the first to fourth aspects of the invention, the first and second flow passages are arranged slightly below the liquid surface of the molten solder, and both flow passages are arranged. It is characterized in that a convection guide is provided for guiding the molten solder, which is jetted from the nozzle adhered to the nozzle and is returned between the flow path bodies, in a direction parallel to the flow path bodies.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to embodiments.

(Embodiment 1) This embodiment will be described with reference to FIGS.
It will be described based on.

The solder bath 1 stores the solder melted by the heating of a heater (not shown), and has a duct 2 at the bottom. A pump 5 having a blade portion 4 horizontally rotated by a motor M outside the bath via a rotary shaft 3 is provided in an opening of one end of the duct 2, and the molten solder 6 pressurized by the pump 5 is provided. Are pumped into the duct 2.

The upper surface of the other end of the duct 2 is open, and the bottom of the nozzle body 7 is attached and fixed to this opening. The nozzle body 7 has a bottom opening communicating with the inside of the duct 2, and pressurized molten solder 6 is fed from the duct 2 through the bottom opening. As shown in FIG. 2, a straightening plate 15 extending in the front-back direction of the nozzle body 7 (two side directions in FIG. 2) is arranged at the bottom of the nozzle body 7 facing the duct 2, and is pumped into the nozzle body 7. The molten solder 6 is rectified.

The nozzle body 7 is formed with cylindrical flow passage bodies 7a and 7b integrally projecting upward.
The inside of the nozzle body 7 and the inside of the flow path bodies 7a and 7b communicate with each other through the lower end openings of a and 7b.

Here, the flow path bodies 7a and 7b are arranged in a direction orthogonal to the paper surface of FIG. 1, and the respective upper end openings thereof project above the liquid surface of the molten solder 6 in the solder bath 1, The upper end opening constitutes the first and second nozzles 8a and 8b.

When the nozzles 8a and 8b are brought close to each other, as shown in FIG.
In the figure, the printed circuit board P is gradually moved so as to incline upward from the left side to the right side as indicated by the arrow X. In the first nozzle 8a on the rear side in the moving direction of the printed circuit board P, The upright walls 9a and 9b which are projected upward and forward of the upper end opening of the flow path body 7a are fixed to bolts and nuts, and the guide 10 is moved downward and rearward from the upper end of the rear upright wall 9a as shown in FIG. It has been extended.

And these standing walls 9a. A nozzle cap 11 extending in the longitudinal direction is attached between the upper ends of 9b as shown in FIG. The nozzle cap 11 is provided with a large number of diagonally formed long holes 12, and the nozzle 8a moves upward through the long holes 12 of the noise cap 11 through the molten solder 6 pressure-fed through the flow path body 7a. It is designed to eject as a small jet wave toward.

On the other hand, the second nozzle 8b on the front side in the moving direction of the printed circuit board P is also provided with upwardly projecting standing walls 13a and 13b before and after the upper end opening of the flow path body 7a, which are exchangeably fixed by bolts and nuts. As shown in FIG. 4, the guide 14 is integrally extended downward from the rear side, that is, from the upper end of the standing wall 13a on the nozzle 8a side. The nozzle 8b is opened from the opening surrounded by the upper ends of the standing walls 13a and 13b,
The molten solder 6 pressure-fed through the flow path body 7b is ejected upward as a large jet wave.

Inside the nozzle body 7, both flow path bodies 7a, 7a
At an intermediate position between the lower end openings of b, an upper end is fixed to the shaft body 16 and a flow dividing plate 17 that rotates in the front-rear direction about the shaft body 16 is hung from the ceiling portion of the nozzle body 7 in the direction of the current plate 15. The flow dividing plate 17 has a length extending over both ends of the nozzle body 7 in the longitudinal direction, and the longitudinal direction is orthogonal to the longitudinal direction of the flow straightening plate 15.

The shaft 16 is adapted to be rotated by a lever (not shown) provided on the outside of the nozzle body 7 via a link mechanism connected to the lever. The tilt angle can be adjusted by rotating 17 in the front-back direction with respect to the moving direction of the printed circuit board P. And according to the inclination angle, the flow path bodies 7a, 7
The amount of the molten solder 6 sent to b can be adjusted.

Thus, in the present embodiment, the molten solder 6 in the solder bath 1 is pressure-fed into the nozzle body 7 through the duct 2 by one pump 5, and the molten solder 6 fed into the nozzle body 7 is As shown in FIG. 2, the flow is rectified by the rectifying plate 15, and further divided by the flow dividing plate 17 into the flow passages 7a and 7b and pressure-fed upward.

The molten solder 6 pressure-fed into the fluid passage 7a is covered with a long hole 12 of a nozzle cap 11 attached to a nozzle 8a.
The terminals of the mounted component are soldered by coming into contact with the lower surface of the printed circuit board P that jets out as a smaller jet wave and moves upward and adheres to the conductive surface formed on the lower surface side of the printed circuit board P. And the molten solder 6 that did not contribute to soldering
Will return to the liquid surface of the molten solder 6 on both front and rear sides of the nozzle 8a. Here, the molten solder 6 ejected as a small jet wave enters into the gap between the chip components mounted on the lower surface side of the printed circuit board P to surely solder between the terminals of the chip component 18 and the conductive surface of the printed circuit board P. Attach.

Similarly, the molten solder 6 pressure-fed into the fluid passage 7b comes into contact with the lower surface of the printed circuit board P, which jets out as a jet wave larger than the upper end opening of the nozzle 8b and moves upward, so that The terminals of the mounted components are soldered by adhering to the formed conductive surface.

Then, the molten solder 6 which has not contributed to the soldering returns to the liquid surface of the molten solder 6 on both front and rear sides of the nozzle 8b. The lead wire of the discrete component 19 and the conductive surface of the printed board P are reliably soldered by the molten solder 6 ejected as a large jet wave from here.

Here, the temperature of the molten solder 6 after the jet flow returning to the liquid surface of the molten solder 6 between the nozzles 8a and 8b is lowered because it once comes into contact with the atmosphere.
When the distance b is large and the temperature drop (drop) between both nozzles 8a and 8b becomes large, as shown in FIG. 4A, the nozzle 8b is guided downward and rearward from the upper end of the standing wall 13a. Instead of extending 14 integrally, standing wall 13a
As shown in FIG. 4B, a horizontal piece 13c extending substantially horizontally from the upper end of the horizontal piece 13c is formed to extend.
By replacing the guide 14 downwardly and backward from the tip of c with a component integrally formed, the distance between the upper end of the nozzle 8a and the upper end of the guide 14 is reduced from L to L ', and both nozzles 8a,
It is also possible to reduce the temperature drop between the nozzles 8a and 8b due to the molten solder 6 returning between 8b.

The amount of the molten solder 6 divided into the fluid passages 7a and 7b is controlled by operating the lever outside the solder bath 1 to divide the flow dividing plate 1.
The tilt can be adjusted by rotating 7 and adjusting its inclination.

As shown in FIG. 5, at a position approximately midway between the nozzles 8a and 8b and below the liquid surface of the molten solder 6, the cross section viewed from the paper surface is mountain-shaped, and the upper surface and both ends in the longitudinal direction are open. If the convection guide 20 is provided along the longitudinal direction of 8a, 8b (the direction orthogonal to the paper surface), the temperature of the molten solder 6 jetted from both nozzles 8a, 8b and returning to the solder bath 1 is lowered by the atmosphere. In this state, the convection guide 20 located near the liquid surface regulates the depression below the liquid surface.
Guided in the left-right direction by a, 20b, 20c when viewed from the front. As a result, the returned molten solder 6 slowly convects, the temperature of the molten solder 6 in the solder bath 1 becomes uniform, and the change of the solder component can be eliminated.

(Embodiment 2) In Embodiment 1, the flow path bodies 7a and 7b having the nozzles 8a and 8b at the upper end are integrally provided in one nozzle body 7, but in this embodiment,
The flow path bodies 7a and 7b are independently provided, and the melted solder 6 is pressure-fed by each one pump (not shown).

The same components as those of the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In the present embodiment, the opening 23 of the secondary nozzle 8b can be moved up and down by the mechanism of the rack 21 and the pinion 22, and the shape of the jet wave ejected from the nozzle 8b can be adjusted by this vertical movement. Printed circuit board P
It is possible to control the amount of solder that adheres to the.

[0037]

According to the first aspect of the present invention, the solder bath for storing the molten solder and the printed circuit board moving above the liquid level of the molten solder in the solder bath are arranged so as to be close to and parallel to each other in the moving direction. , The upper opening is exposed above the molten solder, and the first and second flow passage bodies to which the pressurized molten solder is fed from the lower opening and the upper end openings of the first and second flow passage bodies, respectively. First and second nozzles for ejecting the molten solder that has been deposited and sent through the respective flow path bodies so as to contact the lower surface of the upper printed circuit board, and the molten solder for the first and second nozzles. Since it is provided with one pump for pressurizing and sending it into the flow path body, there is an effect that a jet type soldering device with two nozzles can be realized by one pump, and therefore the structure is simple.

According to a second aspect of the present invention, in the first aspect of the invention, the second solder of the second flow path body, which is on the front side in the moving direction of the printed circuit board, is jetted as a jet wave to form the molten solder. Since a diagonally downward guide for guiding the first flow path body to the first flow path body is provided and the distance between the apex position of this guide and the first flow path body can be freely changed, in the invention of claim 1, between the nozzles. It can be adjusted to reduce temperature drops.

According to the invention of claim 3, in the invention of claim 2, the distance to the first nozzle can be changed by replacing at least a part of the constituent members of the second nozzle. It is possible to realize a jet soldering device capable of easily adjusting the distance.

According to a fourth aspect of the present invention, in the first to third aspects of the present invention, the first and second flow passage bodies are integrally projected upward from the ceiling portion so that the lower end openings of both flow passage bodies are inward. A nozzle body is provided which is in communication with the nozzle body and is arranged in the solder tank. One end of a duct for feeding molten solder pressurized by a pump into the nozzle body is connected to a lower portion of the nozzle body, Is a shunt that divides the molten solder that hangs down from the ceiling between the lower end openings of the first and second flow passage bodies and is pressure-fed into the nozzle body from the duct into the first and second flow passage bodies. Since the plate is provided, the amount of molten solder ejected from the first and second nozzles can be adjusted.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects of the present invention, the first and second flow path members are arranged slightly below the liquid surface of the molten solder, and both flow path members are provided. Since a convection guide is provided to guide the molten solder that jets from the nozzle attached to the nozzle and returns between both flow path members in the parallel direction of both flow path members, it is necessary to make the temperature of the molten solder uniform in the solder bath. You can

[Brief description of drawings]

FIG. 1 is a side sectional view of a first embodiment of the present invention that can be partially omitted.

FIG. 2 is an enlarged front sectional view of the nozzle body of the above, in which a part thereof can be omitted.

FIG. 3 (a) is a side view of the nozzle body of the same.
(B) is a top view of the same nozzle body. (C) is another side view of the above nozzle body.

FIG. 4 is an explanatory diagram for adjusting the distance between the second nozzle and the first nozzle of the above.

FIG. 5 is an enlarged front cross-sectional view of another example of the above nozzle body, in which a part thereof can be omitted.

FIG. 6 is a side cross-sectional view of a second embodiment of the present invention that can be partially omitted.

[Explanation of symbols]

1 solder bath 2 ducts 3 rotation axes 4 wings 5 pumps 6 molten solder 7 Nozzle body 7a, 7b Channel body 8a, 8b nozzle 9a, 9b, 13a, 13b Standing wall 10, 14 guide 11 nozzle cap 12 long holes 15 Current plate 16 distribution board

Claims (5)

[Claims] 1. A solder bath for storing molten solder and a solder bath, which are arranged in close proximity to each other in the front-back direction of a moving direction of a printed circuit board moving above the liquid surface of the molten solder in the solder bath, and whose upper end opening is the above-mentioned molten solder. Of the first and second flow passage bodies, and the upper end openings of the first and second flow passage bodies. The first and second nozzles that generate jet waves so that the molten solder sent via the contacting portion with the lower surface of the upper printed circuit board, and the molten solder are pressurized into the first and second flow path bodies. A jet soldering device, which is equipped with a single pump for feeding. 2. The second nozzle of the second flow path body, which is on the front side in the moving direction of the printed circuit board, is obliquely downward to guide the molten solder ejected as a jet wave to the first flow path body side. The guide is provided, and the apex position of this guide and the first
2. The jet soldering device according to claim 1, wherein the distance to the first nozzle of the channel body is freely changeable. 3. The jet soldering device according to claim 2, wherein the distance to the first nozzle can be changed by replacing at least a part of the constituent member of the second nozzle. 4. The first and second flow passage bodies are integrally projected upward from the ceiling portion so that the lower end openings of both flow passage bodies communicate with the inside.
The nozzle body is provided in the solder bath, and one end of a duct for sending molten solder pressurized by a pump into the nozzle body is connected to a lower portion of the nozzle body. Provided is a flow distribution plate that hangs down from the ceiling portion between the lower end openings of the first and second flow passage bodies and divides the molten solder pressure-fed into the nozzle body from the duct into the first and second flow passage bodies. Claim 1 characterized by the above.
4. The jet soldering device according to any one of 3 to 3. 5. Melting which is disposed between the first and second flow path bodies and slightly below the liquid surface of the molten solder, jets from a nozzle attached to both flow path bodies, and returns between the flow path bodies. The jet soldering device according to any one of claims 1 to 3, further comprising a convection guide for guiding the solder in a direction parallel to both flow path bodies.