JP2003273300A - Cpu cooling device - Google Patents
Cpu cooling deviceInfo
- Publication number
- JP2003273300A JP2003273300A JP2002070680A JP2002070680A JP2003273300A JP 2003273300 A JP2003273300 A JP 2003273300A JP 2002070680 A JP2002070680 A JP 2002070680A JP 2002070680 A JP2002070680 A JP 2002070680A JP 2003273300 A JP2003273300 A JP 2003273300A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- heat
- cooling device
- fan
- cpu
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はＣＰＵ冷却装置、特
に、冷却ファンとして軸流ファンを用いたＣＰＵ冷却装
置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CPU cooling device, and more particularly to a CPU cooling device using an axial fan as a cooling fan.
【０００２】[0002]
【従来の技術】ＬＳＩやパワートランジスタ等の電子部
品を構成する半導体素子は、熱に対して極めて弱く、約
１３０〜１５０℃で機能しなくなる。また、それ以下の
温度であっても、温度が上昇すると共に性能の信頼性は
著しく低下する。従来から許容温度以下で素子を作動さ
せるため、素子を収納したパッケージにヒートシンク放
熱フィン（以下、単に放熱フィンと記す）を取り付けて
素子を冷却していた。2. Description of the Related Art A semiconductor element that constitutes an electronic component such as an LSI or a power transistor is extremely weak against heat and does not function at about 130 to 150.degree. Further, even if the temperature is lower than that, the reliability of the performance remarkably decreases as the temperature rises. Conventionally, in order to operate an element at an allowable temperature or lower, a heat sink radiating fin (hereinafter simply referred to as radiating fin) is attached to a package containing the element to cool the element.
【０００３】素子の実装密度が低く発熱量が小さい場合
は、放熱フィンのみを用いた自然空冷により冷却可能で
あるが、素子そのものの発熱量の増加や、素子実装密度
の増加により発熱量が増大すると、ファンやブロワによ
り放熱フィンに冷却空気を供給する強制空冷が必要とな
る。When the mounting density of the elements is low and the amount of heat generation is small, it is possible to cool by natural air cooling using only the radiation fins, but the amount of heat generation of the elements themselves and the amount of heat generation increase due to an increase in the element mounting density. Then, forced air cooling for supplying cooling air to the radiation fins by a fan or a blower is required.
【０００４】これまでの冷却構造では、ファンユニット
をヒートシンクの上に取付けていた（例えば、特開平０
７−７４２９５号公報参照）が、排気をファンユニット
が再度吸収するという循環を起しやすく、冷却能力が低
下するので、ファンユニットをヒートシンクの横に取付
ける構造が提案されている。In the conventional cooling structure, the fan unit is mounted on the heat sink (see, for example, Japanese Patent Laid-Open No. Hei 0).
No. 7-74295), the fan unit easily recirculates the exhaust gas, and the cooling capacity is lowered. Therefore, a structure in which the fan unit is mounted beside the heat sink has been proposed.
【０００５】従来のＣＰＵ冷却装置について図面を参照
して詳細に説明する。A conventional CPU cooling device will be described in detail with reference to the drawings.
【０００６】図３（ａ），（ｂ）は従来の一例を示すフ
ァン一体型ヒートシンクＦＨの外観斜視図および透視斜
視図であり、図４はその側面透視図である。（例えば同
一出願人グループの、特開２００１−３２００００号公
報参照）
図３（ａ），（ｂ）に示すように、ファン一体型ヒート
シンクＦＨは，周囲を鉄板，アルミ等の板状物で囲んで
なる「中空本体」」である直方体状の本体１の長手方向
の前面側，背面側に、「吸入側ファン」である第１ファ
ン２および「排出側ファン」である第２ファン３を直列
に装着する。第１ファン２は吸入口１ａの近傍に配置
し、第２ファン３は排出口１ｂの近傍に配置する。第１
ファン２は本体内に冷たい空気を送り込み、第2ファン
３は熱せられた空気を排出する。3A and 3B are an external perspective view and a perspective view of a fan-integrated heat sink FH showing a conventional example, and FIG. 4 is a side perspective view thereof. (For example, refer to Japanese Patent Application Laid-Open No. 2001-320,000 of the same applicant group.) As shown in FIGS. 3A and 3B, the fan-integrated heat sink FH is surrounded by a plate-shaped object such as an iron plate or aluminum. The first fan 2 which is a “suction side fan” and the second fan 3 which is a “discharging side fan” are connected in series on the front side and the back side in the longitudinal direction of the rectangular parallelepiped body 1 which is a “hollow body”. Attach to. The first fan 2 is arranged near the inlet 1a, and the second fan 3 is arranged near the outlet 1b. First
The fan 2 sends cool air into the main body, and the second fan 3 discharges heated air.
【０００７】本体１の中央内部に長手方向（即ち、空気
流の経路）に平行にアルミ板等の放熱材からなる６枚の
長方形の放熱板４を狭いピッチの一定間隔（例えば、薄
型のノート型パソコン等の場合では１mm〜２mm）で配列
固定する。この放熱板４の底面側の半導体素子（発熱
体）と接触する部分に突起部４ａを設け（図４参照）、
突起部４ａに伝わった熱は内部の放熱板４ならびに本体
１の表面で放熱する。Inside the center of the main body 1, six rectangular heat radiating plates 4 made of a heat radiating material such as an aluminum plate are provided in parallel with the longitudinal direction (that is, the path of the air flow) at a narrow pitch (for example, a thin notebook). In the case of a personal computer, fix the array at 1 mm to 2 mm. Protrusions 4a are provided on the bottom surface side of the heat dissipation plate 4 in contact with the semiconductor element (heating element) (see FIG. 4),
The heat transmitted to the protrusion 4a is dissipated on the surface of the internal heat dissipation plate 4 and the main body 1.
【０００８】このとき第１ファン２で内部に風を送り、
第２ファン３で外部に空気を排出することによって（図
４参照）ファンの静圧を増やす。従って、第１ファン２
の影響で圧力損失の大きくなる本体１の内部で大量の風
量を得ることが可能である。内部の風量が大きいので、
放熱板４に伝わった熱が強制的かつ迅速に冷却される。
また逆に、ファンの静圧が高いため放熱板４は圧力損失
を犠牲にしても表面積をできるだけ大きくできるので、
放熱性を高めることが可能である。内部の放熱板のピッ
チを狭くして表面積を増やしても第１ファン２を１つの
みにした場合に比べて、十分な風量を得ることができ
る。よって高い冷却効果を得ることができる。At this time, the first fan 2 blows air inside,
By discharging air to the outside by the second fan 3 (see FIG. 4), the static pressure of the fan is increased. Therefore, the first fan 2
It is possible to obtain a large amount of air inside the main body 1 in which the pressure loss becomes large due to the influence of. Because the air volume inside is large,
The heat transmitted to the heat dissipation plate 4 is forcibly and quickly cooled.
On the contrary, since the static pressure of the fan is high, the surface area of the heat dissipation plate 4 can be increased as much as possible even at the expense of pressure loss.
It is possible to improve heat dissipation. Even if the pitch of the heat sinks inside is narrowed to increase the surface area, a sufficient air volume can be obtained as compared with the case where only one first fan 2 is provided. Therefore, a high cooling effect can be obtained.
【０００９】次にこのファン一体型ヒートシンクＦＨ
を、発熱体に接続した場合の動作について説明する。図
５に示すように、ファン一体型ヒートシンクＦＨが発熱
体（例えば半導体素子）５の上に装着され、導熱ゴムも
しくはサーマルグリスなどを介して放熱板４の突起部４
ａが発熱体（例えば、半導体集積回路装置、高性能のＣ
ＰＵ等）５と接触している。ファン一体型ヒートシンク
ＦＨは、発熱体５の熱が導熱ゴムやサーマルグリスなど
を介して本体１に伝わり、更に放熱板４に伝わる。第１
ファン２により外部の空気が本体内に取り込まれ、放熱
板４の熱が空気中に放熱される。そして本体内の熱せら
れた空気は第２ファン３によって強制的に外部へ排出さ
れる。Next, this fan integrated heat sink FH
The operation when is connected to a heating element will be described. As shown in FIG. 5, a fan-integrated heat sink FH is mounted on a heating element (for example, a semiconductor element) 5, and a protruding portion 4 of a heat dissipation plate 4 is provided via a heat conductive rubber or thermal grease.
a is a heating element (for example, a semiconductor integrated circuit device, a high-performance C
(PU, etc.) 5 is in contact. In the fan-integrated heat sink FH, the heat of the heating element 5 is transferred to the main body 1 via the heat-conducting rubber or thermal grease, and further to the heat dissipation plate 4. First
The outside air is taken into the main body by the fan 2, and the heat of the heat dissipation plate 4 is radiated into the air. Then, the heated air in the main body is forcibly discharged to the outside by the second fan 3.
【００１０】上述のようなヒートシンクの取り付け機構
については、特開平５−２４３４３９号公報に各種の機
構が紹介されている。Regarding the mounting mechanism of the heat sink as described above, various mechanisms are introduced in Japanese Patent Laid-Open No. 5-243439.
【００１１】[0011]
【発明が解決しようとする課題】上述した従来のＣＰＵ
冷却装置は、ファン筐体とヒートシンクが一体化されて
いるので、パソコン等の本体装置の設計の自由度が低下
するという問題があった。SUMMARY OF THE INVENTION The conventional CPU described above.
In the cooling device, since the fan housing and the heat sink are integrated, there is a problem that the degree of freedom in designing the main body device such as a personal computer is lowered.
【００１２】[0012]
【課題を解決するための手段】第１の発明のＣＰＵ冷却
装置は、ＣＰＵ等の発熱体からの熱を底板から放熱フィ
ンに伝達させるヒートシンクと前記ヒートシンクの熱を
軸流ファンで方向を限定して吸入（または排出）するＣ
ＰＵ冷却装置において、放熱フィンに対して吸入（また
は排出）方向が水平にする。According to the first aspect of the present invention, there is provided a CPU cooling device, wherein a heat sink for transmitting heat from a heating element such as a CPU to a heat radiating fin and a direction of the heat of the heat sink are limited by an axial fan. Inhaled (or discharged) C
In the PU cooling device, the suction (or discharge) direction is horizontal with respect to the heat radiation fins.
【００１３】第２の発明のＣＰＵ冷却装置は、第１の発
明において、前記軸流ファンが発生する空気流が水平で
あるように前記軸流ファンを直立させる。In the CPU cooling device of the second invention, in the first invention, the axial fan is erected so that the airflow generated by the axial fan is horizontal.
【００１４】第３の発明のＣＰＵ冷却装置は、第１の発
明において、前記ヒートシンクを前記空気流の経路に略
平行に設置する。According to a third aspect of the present invention, in the first aspect of the present invention, the heat sink is installed substantially parallel to the air flow path.
【００１５】第４の発明のＣＰＵ冷却装置は、第１の発
明において、前記ヒートシンクの一端に前記底板よりも
低い位置に前記軸流ファンを載置するための張出し棚部
を設ける。In the CPU cooling device of the fourth invention, in the first invention, an overhanging shelf for mounting the axial fan at a position lower than the bottom plate is provided at one end of the heat sink.
【００１６】第５の発明のＣＰＵ冷却装置は、第１の発
明において、前記ヒートシンクの両端に前記底板よりも
低い位置に前記軸流ファンを載置するための張出し棚部
を設ける。In a fifth aspect of the present invention, in the first aspect of the present invention, the CPU cooling device is provided at both ends of the heat sink with overhanging shelves for mounting the axial fan at a position lower than the bottom plate.
【００１７】第６の発明のＣＰＵ冷却装置は、第１の発
明において、前記ヒートシンクの一端に前記底板よりも
低い位置に前記軸流ファンを載置するための張出し棚部
を設け、前記ヒートシンクの他端にリテンションモジュ
ールと固定クリップを取り付けるための切込み部を設け
る。According to a sixth aspect of the present invention, in the CPU cooling apparatus according to the first aspect of the present invention, one end of the heat sink is provided with an overhanging shelf for mounting the axial fan at a position lower than the bottom plate. A notch is provided at the other end for attaching the retention module and the fixing clip.
【００１８】[0018]
【発明の実施の形態】次に、本発明について図面を参照
して詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described in detail with reference to the drawings.
【００１９】図１（ａ），（ｂ）は本発明の第１の実施
形態を示す斜視図および部分斜視図である。図１
（ａ），（ｂ）に示すＣＰＵ冷却装置は、ＣＰＵ等の発
熱体からの熱を底板１０２から放熱フィン１０５に伝達
させるヒートシンクと前記ヒートシンクの熱を軸流ファ
ンで方向を限定して吸入（または排出）するＣＰＵ冷却
装置において、一端に底板１０２よりも低い位置に軸流
ファンを載置するための張出し棚部１０１を設け他端に
リテンションモジュール１２０と固定クリップ１２１を
取り付けるための切込部１０２を設けたヒートシンク１
００と、軸流ファン１１０とを含んで構成される。FIGS. 1A and 1B are a perspective view and a partial perspective view showing a first embodiment of the present invention. Figure 1
In the CPU cooling device shown in (a) and (b), a heat sink for transmitting heat from a heating element such as a CPU to the radiation fins 105 from the bottom plate 102 and the heat of the heat sink are sucked in by an axial fan in a limited direction ( In the CPU cooling device for discharging, an extension shelf 101 for mounting the axial fan is provided at a position lower than the bottom plate 102 at one end, and a notch for attaching the retention module 120 and the fixing clip 121 at the other end. Heat sink 1 provided with 102
00 and an axial flow fan 110.
【００２０】張出し棚部１０１にはヒートシンク１００
を実装基板に取付けるための取付穴１０３ａ，１０３ｂ
がある。A heat sink 100 is attached to the overhanging shelf 101.
Mounting holes 103a and 103b for mounting the mounting board on the mounting board
There is.
【００２１】ＣＰＵ等の発熱体１３０の上にヒートシン
ク１００を載せ、ヒートシンク１００の一端をネジで、
他端をリテンションモジュール１２０と固定クリップ１
２１で基板に対して保持する。The heat sink 100 is placed on the heating element 130 such as CPU, and one end of the heat sink 100 is screwed.
The other end is a retention module 120 and a fixing clip 1.
The substrate is held at 21.
【００２２】図２は本発明の第２の実施形態を示す斜視
図である。ヒートシンク２００の両側に設けた張出し棚
部２０１，２０２の上に軸流ファン２１０，２１１を配
し、発熱体１３０を冷却する。これは、軸流ファン２１
０は吸入用、軸流ファン２１１は排出用であり、いわる
るプッシュ・プル動作をさせている。FIG. 2 is a perspective view showing a second embodiment of the present invention. Axial fans 210 and 211 are arranged on the overhanging shelves 201 and 202 provided on both sides of the heat sink 200 to cool the heating element 130. This is an axial fan 21
0 is for suction, and the axial fan 211 is for discharge, which is what is called push-pull operation.
【００２３】本発明は、例えばノート型パソコン筐体の
左端から冷気を吸入し、排熱空気流を筐体の右端に向け
て（放熱フィン１０５に対して水平方向に）放出してい
るので、ファンに排熱空気流が再吸入される悪循環を起
すことなく冷却能力が向上し、さらにヒートシンクの上
にファンをタンデムに配置（ヒートシンクにあたった下
向きの空気が筐体上部に昇りファンに再吸収される）し
た場合に比して筐体の高さを低くできるので、パソコン
の薄型化に寄与できる。According to the present invention, for example, the cool air is sucked from the left end of the notebook personal computer casing and the exhaust heat air flow is discharged toward the right end of the casing (horizontal direction with respect to the radiation fin 105). Cooling capacity is improved without creating a vicious cycle where the exhaust heat air flow is re-injected into the fan, and the fan is placed in tandem on the heat sink (the downward air hitting the heat sink rises to the top of the chassis and is reabsorbed by the fan). The height of the housing can be made lower than that of the above case, which can contribute to the thinning of the personal computer.
【００２４】さらに張出し棚部１０１の位置をヒートシ
ンクの底板１０２よりも下げたので、軸流ファン１１０
のモータ取付け枠の位置が下り、軸流ファン１１０の回
転羽根の先端部の位置が底板１０４に近づくため、発生
空気流を有効に利用できる。Further, since the position of the overhanging shelf 101 is lower than the bottom plate 102 of the heat sink, the axial fan 110
Since the position of the motor mounting frame is lowered and the positions of the tips of the rotating blades of the axial fan 110 approach the bottom plate 104, the generated airflow can be effectively used.
【００２５】[0025]
【発明の効果】本発明のＣＰＵ冷却装置は、冷却装置を
設置する底面積及び高さに制限がある条件で、固定クリ
ップをヒートシンクとは別部品としていたリテンション
モジュールをヒートシンクと一体型にすることにより、
固定クリップを使用せずにヒートシンクを固定すること
が出来、ヒートシンク設置スペース内にファンを収めな
がらも、冷却効率を落とさない構造に出来るという効果
がある。According to the CPU cooling device of the present invention, the retention module, which has the fixing clip as a separate component from the heat sink, is integrated with the heat sink under the condition that the bottom area and height of the cooling device are limited. Due to
The heat sink can be fixed without using a fixing clip, and there is an effect that a cooling efficiency can be reduced while the fan is housed in the heat sink installation space.
【図１】（ａ），（ｂ）本発明の第１の実施形態を示す
斜視図および部分斜視図である。1A and 1B are a perspective view and a partial perspective view showing a first embodiment of the present invention.
【図２】本発明の第２の実施形態を示す斜視図である。FIG. 2 is a perspective view showing a second embodiment of the present invention.
【図３】従来の一例を示す外観斜視図および透視斜視図
である。FIG. 3 is an external perspective view and a perspective view showing a conventional example.
【図４】従来の一例を示す側面斜視図である。FIG. 4 is a side perspective view showing a conventional example.
【図５】従来の使用例を示す側面透視図である。FIG. 5 is a side perspective view showing a conventional usage example.
１００，２００ ヒートシンク １０１，２０１，２０２ 張出し棚部 １０２ 切込部 １０３ａ，１０３ｂ 取付穴 １０４，２０４ 底板 １０５，２０５ 放熱フィン １１０，２１０，２１１ 軸流ファン １２０ リテンションモジュール １２１ 固定クリップ １３０ 発熱体 100,200 heat sink 101,201,202 Overhang shelf 102 notch 103a, 103b mounting holes 104,204 Bottom plate 105,205 Heat dissipation fin 110, 210, 211 Axial fan 120 retention module 121 securing clip 130 heating element
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｇ０６Ｆ 1/00 ３６０Ｂ ─────────────────────────────────────────────────── ─── Continued Front Page (51) Int.Cl. 7 Identification Code FI Theme Coat (Reference) G06F 1/00 360B
Claims (6)
熱フィンに伝達させるヒートシンクと前記ヒートシンク
の熱を軸流ファンで方向を限定して吸入（または排出）
するＣＰＵ冷却装置において、放熱フィンに対して吸入
（または排出）方向が水平であることを特徴とするＣＰ
Ｕ冷却装置。1. A heat sink for transmitting heat from a heating element such as a CPU to a radiation fin from a bottom plate, and heat of the heat sink is sucked (or discharged) in a limited direction by an axial fan.
In a CPU cooling device that operates, the CP is characterized in that the suction (or discharge) direction is horizontal with respect to the heat radiation fins.
U cooling device.
であるように前記軸流ファンを直立させた請求項１記載
のＣＰＵ冷却装置。2. The CPU cooling device according to claim 1, wherein the axial fan is erected so that the airflow generated by the axial fan is horizontal.
略平行に設置した請求項１記載のＣＰＵ冷却装置。3. The CPU cooling device according to claim 1, wherein the heat sink is installed substantially parallel to a path of the air flow.
も低い位置に前記軸流ファンを載置するための張出し棚
部を設けた請求項１記載のＣＰＵ冷却装置。4. The CPU cooling device according to claim 1, wherein one end of said heat sink is provided with a projecting shelf for mounting said axial fan at a position lower than said bottom plate.
も低い位置に前記軸流ファンを載置するための張出し棚
部を設けた請求項１記載のＣＰＵ冷却装置。5. The CPU cooling device according to claim 1, wherein both ends of the heat sink are provided with overhanging shelves for mounting the axial fan at a position lower than the bottom plate.
も低い位置に前記軸流ファンを載置するための張出し棚
部を設け、前記ヒートシンクの他端にリテンションモジ
ュールと固定クリップを取り付けるための切込み部を設
けた請求項１記載のＣＰＵ冷却装置。6. An extension shelf for placing the axial fan at a position lower than the bottom plate is provided at one end of the heat sink, and a notch for attaching a retention module and a fixing clip to the other end of the heat sink. The CPU cooling device according to claim 1, further comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002070680A JP3827594B2 (en) | 2002-03-14 | 2002-03-14 | CPU cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002070680A JP3827594B2 (en) | 2002-03-14 | 2002-03-14 | CPU cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003273300A true JP2003273300A (en) | 2003-09-26 |
| JP3827594B2 JP3827594B2 (en) | 2006-09-27 |
Family
ID=29201182
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002070680A Expired - Fee Related JP3827594B2 (en) | 2002-03-14 | 2002-03-14 | CPU cooling device |
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| Country | Link |
|---|---|
| JP (1) | JP3827594B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009164421A (en) * | 2008-01-08 | 2009-07-23 | Fujikura Ltd | Cooling device for electronic element |
| CN111473560A (en) * | 2020-04-16 | 2020-07-31 | 徐州精工密封科技有限公司 | Cooling device for sealing ring manufacturing die |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI479116B (en) * | 2009-04-10 | 2015-04-01 | Hon Hai Prec Ind Co Ltd | Heat dissipation apparatus |
-
2002
- 2002-03-14 JP JP2002070680A patent/JP3827594B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009164421A (en) * | 2008-01-08 | 2009-07-23 | Fujikura Ltd | Cooling device for electronic element |
| CN111473560A (en) * | 2020-04-16 | 2020-07-31 | 徐州精工密封科技有限公司 | Cooling device for sealing ring manufacturing die |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3827594B2 (en) | 2006-09-27 |
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