JP2003273292A - Sealing frame member and silicon elastomer sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing frame member capable of being effectively manufactured suitably for a sealing method for adhering the sealing frame member in advance formed in a specific profile to a substrate, pouring a liquid-like sealing resin into the frame to seal a semiconductor chip, and separating the sealing frame member from the substrate after the sealing resin is cured. <P>SOLUTION: A sealing frame member 11 is constituted of a two-layer silicon elastomer layer composed of a first layer 11a coming into contact with a substrate which mounts a semiconductor chip and a second layer 11b laminated thereon. As for the first layer 11a, an elastic modulus G' measured by a shear method at a frequency of 10 Hz and a temperature of 20°C in a dynamic viscoelasticity measurement is in a range of 3.0×10<SP>4</SP>Pa to 5.0×10<SP>5</SP>Pa. As for the second layer 11b, an elastic modulus E' measured by a stretch method at a frequency of 10 Hz and a temperature of 20°C in the dynamic viscoelasticity measurement is in a range of 3.0×10<SP>6</SP>Pa to 2.0×10<SP>7</SP>Pa. The thickness of the first layer 11a is formed to be 30 μm to 200 μm. The sealing frame member 11 is formed by a punching process of a silicon elastomer sheet 14. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sealing frame member for sealing a semiconductor chip and a silicone elastomer sheet, and more specifically, when the semiconductor chip is cured by hardening a liquid resin, the periphery of the semiconductor chip is sealed. The present invention relates to a sealing frame member arranged so as to surround it and a silicone elastomer sheet suitable for forming the sealing frame member.

[0002]

2. Description of the Related Art Most of current electronic components are integrated in the form of semiconductor chips. This semiconductor chip is sealed with resin, and its sealing form is BGA (ball grid array), CSP (chip size package),
QFP, PLCC (plastic lead chip carrier), COB (chip on board), T
There are ABs, flip chips, LCD modules and LED modules.

The step of encapsulating the semiconductor chip is performed by a method of printing and encapsulating the liquid encapsulating resin by screen printing or by using a die in accordance with the purpose and shape of the semiconductor chip. An injection molding method, a method of discharging a predetermined amount of liquid sealing resin and sealing by a potting method, or the like is used. Further, regarding the sealing of the liquid sealing resin when the mold is not used, the high-viscosity resin which is applied so as to surround the periphery of the semiconductor chip and the high-viscosity resin is applied and then poured inside to seal the semiconductor itself. In many cases, two types of resins having different viscosities, that is, a low viscosity resin, are used. In addition, this step also includes a step of curing the liquid encapsulating resin, and normally, the semiconductor chip after encapsulation is heated and cured for a predetermined time.

Japanese Unexamined Patent Publication No. 5-144858 discloses a sealing method in which a sealing frame is used for resin sealing and then the sealing frame is removed as necessary. In this sealing method, as shown in FIG. 6, a molded gel-shaped sealing frame 31 is used.
Is mounted on the printed circuit board 32 so as to surround the semiconductor chip 33 mounted on the printed circuit board 32 and to be in close contact with the printed circuit board 32. Then, a liquid sealing resin 34 is poured into the sealing frame 31 to cure the sealing resin 34. The sealing frame 31 is formed in a gel state by pouring a sol-like silicone rubber containing a curing agent into a molding die and curing the silicone rubber after a lapse of a certain time.

[0005]

However, the method using two kinds of resins having different viscosities, that is, a high-viscosity resin and a low-viscosity resin, has a low production efficiency because the resin coating step requires two steps, and the sealing is also difficult. Since the high-viscosity resin itself, which serves as a frame, is also a part of the sealing material, there is a problem that it is not suitable for sealing a small area.

On the other hand, in the method disclosed in Japanese Unexamined Patent Publication No. 5-144858, the sealing frame 31 is cured after the sealing resin 34 is cured.
By removing, the semiconductor chip 33 can be sealed even in a small area. However, JP-A-5-144858
Since the sealing frame 31 disclosed in the publication is formed by pouring a sol-like silicon rubber containing a curing agent into a molding die, it takes time to manufacture. Moreover, since the entire sealing frame 31 is formed of the gel-like silicon rubber having the same physical properties,
If the adhesion of the sealing frame 31 to the printed circuit board 32 is increased, the shape retaining function of the sealing frame 31 is lowered, and the shape of the sealing resin 34 cannot be accurately formed when the sealing frame 31 is attached to the printed circuit board 32. There are also problems.

The present invention has been made in view of the above problems. Then, a first purpose is to attach a sealing frame member having a predetermined shape to the substrate, pour a liquid sealing resin into the frame to seal the semiconductor chip, and after the sealing resin is cured, the sealing frame member is placed on the substrate. An object of the present invention is to provide a sealing frame member that is suitable for a sealing method of peeling from a semiconductor chip, can accurately seal a semiconductor chip even in a small area portion, and can be manufactured efficiently. A second object is to provide a silicone elastomer sheet which can easily and accurately manufacture the sealing frame member by punching.

[0008]

In order to achieve the first object, the invention according to claim 1 is a step of resin-sealing a semiconductor chip, in which the semiconductor chip is attached to a substrate so as to surround the semiconductor chip. A sealing frame member used as a substrate, which has a two-layer structure including a first layer in contact with the substrate and a second layer laminated on the first layer, the first layer being adhesive to the substrate. The second layer has a physical property that plays a role of maintaining the shape of the sealing frame member.

In the sealing frame member of the present invention, the adhesion to the substrate is secured by the first layer in contact with the substrate, and the shape of the sealing frame member is maintained by the second layer laminated thereon. Therefore, the semiconductor chip can be accurately sealed and can be peeled off without leaving any glue on the substrate after the sealing resin is cured.

According to a second aspect of the present invention, there is provided a sealing frame member which is used by being attached to a substrate so as to surround the semiconductor chip in a step of resin-sealing the semiconductor chip.
It is composed of two silicone elastomer layers, a first layer in contact with the substrate and a second layer laminated on the first layer, and the first layer and the second layer satisfy the following conditions. First layer:
By dynamic viscoelasticity measurement, the elastic modulus (G ′) measured by the shear method at a frequency of 10 Hz and a temperature of 20 ° C. is 3.0 × 10 ⁴ P.
It is in the range of a to 5.0 × 10 ⁵ Pa. Second layer: Dynamic viscoelasticity measurement, elastic modulus (E ′) measured by a tensile method at a frequency of 10 Hz and a temperature of 20 ° C. is 3.0 × 10 ⁶ Pa to 2.
It is in the range of 0 × 10 ⁷ Pa.

The sealing frame member of the present invention is formed of a silicone elastomer, and the first layer in contact with the substrate has physical properties capable of ensuring adhesion to the substrate, and the second layer laminated thereon has the sealing frame. It has physical properties that play a role of maintaining the shape of the member. Further, the sealing frame member can be easily manufactured by punching out a two-layered silicone elastomer sheet having the physical properties of the first layer and the second layer.

A third aspect of the invention is the invention according to the second aspect, wherein the thickness of the first layer is 30 μm to 200 μm.
μm. According to the present invention, it becomes easy to secure sufficient adhesion to the substrate and to obtain a predetermined dimensional accuracy by processing such as punching.

In order to achieve the second object, the invention according to claim 4 uses a dynamic viscoelasticity measurement to obtain a frequency of 10 Hz,
The elastic modulus (G ′) measured by the shear method at a temperature of 20 ° C. is 3.
A first layer formed in a sheet shape by a silicone elastomer layer in the range of 0 × 10 ⁴ Pa to 5.0 × 10 ⁵ Pa, and a layer laminated on the first layer, and by dynamic viscoelasticity measurement, The elastic modulus (E ') measured by the tensile method at a frequency of 10 Hz and a temperature of 20 ° C. is 3.0 × 10 ⁶ Pa to 2.0 × 10 ^7.
The second layer is formed in a sheet shape by the silicone elastomer layer having a range of Pa.

The silicone elastomer sheet of the present invention can be punched to form a sealing frame member having a desired shape with high dimensional accuracy. The invention according to claim 5 is
In the invention according to claim 4, the thickness of the first layer is 3
It was set to 0 μm to 200 μm. According to the present invention, it becomes easy to obtain a predetermined dimensional accuracy by processing such as punching.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION (First Embodiment) An embodiment of the present invention will be described below with reference to FIGS.

FIG. 1 (a) is a schematic perspective view of a sealing frame member, and FIG. 1 (b) is a partial schematic front view of a silicone elastomer sheet used for forming the sealing frame member. FIG. 2 is a schematic cross-sectional view showing a state in which a semiconductor chip is sealed, and FIG. 3 is a schematic plan view showing a state in which a sealing frame member is arranged at a sealing position of the semiconductor chip.

As shown in FIG. 1A, the sealing frame member 11
Is formed in a rectangular frame shape, and is laminated on the first layer 11a and the first layer 11a arranged so as to contact the printed wiring board 13 as a substrate on which the semiconductor chip 12 is mounted, as shown in FIG. The second layer 11b and the two silicone elastomer layers are included.

As shown in FIG. 1 (b), the sealing frame member 11 is composed of a first layer 14a formed in a sheet shape by a silicone elastomer layer, and a silicone elastomer layer laminated on the first layer 14a. Second layer 14b
It is formed by punching the silicone elastomer sheet 14 made of.

The silicone elastomer constituting the sealing frame member 11 of the present invention is an elastomer obtained by crosslinking a polyorganosiloxane having a siloxane skeleton represented by the following formula in both the first layer 11a and the second layer 11b. is there.

[0020]

[Chemical 1] Various polyorganosiloxanes including polydimethylsiloxane in which all R groups are methyl groups, and some of the methyl groups are substituted with one or more of other alkyl groups, vinyl groups, phenyl groups, fluoroalkyl groups, etc. They may be used alone or in a blend of two or more.

The crosslinking method applicable in the present invention is not particularly limited, and a conventionally known method can be applied. For example, a method of crosslinking a methyl group or a vinyl group of polyorganosiloxane by a radical reaction, a method of crosslinking by a condensation reaction of a silanol-terminated polyorganosiloxane and a silane compound having a hydrolyzable functional group,
Examples thereof include a method of crosslinking by a reaction of adding a hydrosilyl group to a vinyl group.

Further, to the silicone elastomer of the present invention, additives known to be conventionally added to silicone elastomer compositions may be added within the range not impairing the physical properties of the present invention. Examples of these additives include fumed silica, precipitated silica, silica powder, and other silicon oxides, as well as diatomaceous earth, calcium carbonate, carbon black, alumina, magnesium oxide, zinc oxide, boron nitride, iron oxide, and the like.

Of the first layer 11a of the silicone elastomer
Physical properties are measured by dynamic viscoelasticity, frequency 10Hz, temperature
Elastic modulus (G ') measured by shearing method at 20 ° C is 3.0 x
10 ^FourPa ~ 5.0 x 10^FiveIt is important to be in the range of Pa
Is. Further, in the process of heating and curing the liquid resin, 150
Since the temperature may rise up to about ℃, this temperature
To the extent the dynamic viscoelastic properties are within the scope of the invention.
desirable.

If the elastic modulus (G ') is too low, the silicone elastomer is too soft and easily deformed during punching, or too much when it is attached to the printed wiring board 13, resulting in a predetermined shape. Cannot be sealed. On the other hand, if the elastic modulus (G ′) is too high, the silicone elastomer is too hard and the adhesive force with the printed wiring board 13 is insufficient, so that the liquid sealing resin is used as the printed wiring board 13.
And the sealing frame member 11 leaks.

The physical properties of the second layer 11b of the silicone elastomer are determined by dynamic viscoelasticity such that the elastic modulus (E ') measured by the tensile method at a frequency of 10 Hz and a temperature of 20 ° C. is 3.0 × 1.
It is important to be in the range of 0 ⁶ Pa to 2.0 × 10 ⁷ Pa. For the above reason, it is desirable that the dynamic viscoelastic property is within the above range up to about 150 ° C.

If the elastic modulus (E ') is too low, the silicone elastomer is too soft and the sealing frame member 11 is attached to the substrate.
When being attached, the sealing frame member 11 is stretched and cannot be attached at a predetermined position, and the shape of the sealing resin is not accurate. On the contrary, if the elastic modulus (E ') is too high, the first
Since the difference in hardness between the layer 11a and the silicone elastomer is too large, there arises a problem that the dimensional accuracy is not obtained by a punching process or the like.

As described above, the first layer 11a plays a role of adhering to the printed wiring board 13, and the second layer 11b plays a role of maintaining the shape. A method for obtaining the silicone elastomer sheet 14 having the above-described dynamic viscoelasticity will be described below. Regarding the elastic moduli (G ′) and (E ′), the desired elastic modulus (G ′), by adjusting the type and molecular weight of polyorganosiloxane, the composition of the silicone elastomer such as the reinforcing filler, and the degree of crosslinking appropriately,
It can be (E '). It is also possible to blend a plurality of commercially available silicone compounds.

The adhesion between the first layer 14a and the second layer 14b is
It is general that both layers 14a and 14b are laminated and vulcanized and adhered in a state where the silicone elastomers of the first layer 14a and the second layer 14b are uncrosslinked, but the method is not limited to this.

The thickness of the first layers 11a and 14a is from 30 μm to
Those in the range of 200 μm are preferable. If the thickness is too thin, the required amount of deformation cannot be obtained when the printed wiring board 13 is attached, and sufficient adhesion to the printed wiring board 13 cannot be obtained. Further, if the thickness is too thick, it is difficult to obtain the dimensional accuracy of the house by punching or the like.

A sealing method using the sealing frame member 11 configured as described above will be described. As shown in FIGS. 2 and 3, the sealing frame member 11 has a die-bonding material 15 a on the semiconductor chip mounting electrode 15 formed on the printed wiring board 13.
The semiconductor chip 12 is bonded to the lead electrode 17 by the bonding wire 16 and is attached to the printed wiring board 13 so as to surround the semiconductor chip 12. The sealing frame member 11 is attached in close contact with the insulating material 13a provided around the upper surface of the printed wiring board 13. 1st layer 1
1a has a modulus of elasticity (G ′) of 3.0 × measured by a shear method at a frequency of 10 Hz and a temperature of 20 ° C. by dynamic viscoelasticity measurement.
Since it is in the range of 10 ⁴ Pa to 5.0 × 10 ⁵ Pa, it is adhered to the printed wiring board 13 with no gap due to its own adhesive force. Next, the liquid encapsulating resin 18 before curing is poured into the encapsulating frame member 11 and then heated to form the encapsulating resin 1.
After 8 is cured, the sealing frame member 11 is attached to the printed wiring board 1.
3 is peeled off from above, and the sealing of the semiconductor chip 12 is completed.

(Examples) Hereinafter, the present invention will be described in more detail with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

Example 1 A first layer 14a having a thickness of 100 μm, a frequency of 10 Hz and a modulus of elasticity (G ′) measured by a shearing method at a temperature of 20 ° C. of 8.3 × 10 ⁴ Pa, a thickness of 450 μm, a frequency of 10 Hz and a temperature of 20. Elastic modulus (E ') measured by tensile method at ℃ is 8.0 × 1
A silicone elastomer sheet 14 composed of the second layer 14b of 0 ⁶ Pa was prepared. This silicone elastomer sheet 14 was punched into a sealing area of 5 mm × 5 mm to obtain a sealing frame member 11.

Then, the sealing frame member 11 is attached to the printed wiring board 13 so as to surround the semiconductor chip 12 as shown in FIG. 2, and a liquid epoxy resin is poured into the sealing frame member 11 at 150 ° C. After the heat treatment for 12 hours, the sealing frame member 11 was peeled off. The liquid epoxy resin did not leak from between the sealing frame member 11 and the printed wiring board 13 and could be sealed in a predetermined shape.

Comparative Example 1 Except that the physical properties of the silicone elastomer constituting the first layer 14a are such that the elastic modulus (G ') measured by the shear method at a frequency of 10 Hz and a temperature of 20 ° C. is 1.0 × 10 ⁶ Pa. The same silicone elastomer sheet 14 as in Example 1
The sealing frame member 11 was obtained from. Then, the sealing frame member 11 was attached to the printed wiring board 13 in the same manner as in Example 1, and the semiconductor chip 12 was sealed with a liquid epoxy resin. As a result, the liquid epoxy resin leaked from between the sealing frame member 11 and the printed wiring board 13, and it was not possible to seal the liquid epoxy resin into a predetermined shape.

This embodiment has the following effects. (1) A sealing frame member 11 used by being attached on a substrate (printed wiring board 13) so as to surround the semiconductor chip 12, and a first layer 11a having physical properties capable of ensuring adhesion to the substrate, It has a two-layer structure with the second layer 11b having physical properties that play a role of maintaining the shape of the sealing frame member 11. Therefore, the semiconductor chip 12 can be accurately sealed and can be peeled off after the sealing resin 18 is cured without leaving any glue on the substrate.

(2) The sealing frame member 11 has a shear elastic modulus (G ') and a tensile elastic modulus (E') in a predetermined range measured by a dynamic viscoelasticity measurement at a frequency of 10 Hz and a temperature of 20 ° C. First layer 11a (G '= 3.0 × 10 ⁴ Pa to 5.0 ×
10 ⁵ Pa) and the second layer 11b (E '= 3.0 × 10 ⁶ P)
It has a two-layer structure of a to 2.0 × 10 ⁷ Pa). Therefore, it can be adhered to the substrate in a close contact state without a gap, and can be easily peeled off without leaving glue on the substrate after the resin sealing is completed.

(3) Since the first layer 11a and the second layer 11b are composed of the silicone elastomer layer, it is possible to suppress the deterioration of the sealing frame member 11 during heating when the sealing resin 18 is cured. Further, the sealing frame member 11 can be easily manufactured by punching the two-layered silicone elastomer sheet 14 having the physical properties of the first layer 11a and the second layer 11b.

(4) The thickness of the first layer 11a is from 30 μm to
Since the thickness is set to 200 μm, it becomes easy to secure sufficient adhesion to the substrate and to obtain a predetermined dimensional accuracy by processing such as punching.

(5) Silicone elastomer sheet 1
4 is frequency 10 Hz, temperature 2 by dynamic viscoelasticity measurement.
The first layer 11a (G '= 3.0) in which the shear elastic modulus (G') and the tensile elastic modulus (E ') measured at 0 ° C are within a predetermined range.
X10 < ⁴ > Pa-5.0 * 10 < ⁵ > Pa) and the 2nd layer 11b.
2 of (E '= 3.0 × 10 ⁶ Pa to 2.0 × 10 ⁷ Pa)
It has a layered structure. Therefore, the sealing frame member 11 having a desired shape can be formed by punching with high dimensional accuracy.

(6) Silicone elastomer sheet 1
In No. 4, the thickness of the first layer 14a is set to 30 μm to 200 μm. Therefore, it becomes easy to form the sealing frame member 11 with a predetermined dimensional accuracy by punching or the like.

The embodiment is not limited to the above, but may be embodied as follows, for example. The first layer 11a and the second layer 11b do not necessarily have to be composed of a silicone elastomer layer. For example,
The first layer 11a in contact with the substrate (printed wiring board 13) has physical properties capable of ensuring adhesion to the substrate, and the second layer 11a
It suffices that b has physical properties that play a role of retaining the shape of the sealing frame member 11, and that both layers 11a and 11b have heat resistance when the epoxy resin is thermoset.

The first layer 11a may be made of a silicone elastomer layer and the second layer 11b may be made of another resin. The shape of the sealing frame member 11 is not limited to a square, but a rectangle,
You may change suitably according to the shape of the other party to seal, such as an ellipse.

As shown in FIG. 4, a plurality of semiconductor chips 12 may be sealed in the sealing frame member 11. As shown in FIG. 5, the sealing frame member 11 may have a shape in which a plurality of sealing frames are continuous.

When the sealing frame member 11 is produced from the silicone elastomer sheet 14, it may be produced by cutting instead of punching. For example, the frame portion may be processed so as to be cut out with a laser beam, or may be cut out with a cutter.

The technical idea (invention) understood from the above embodiment will be described below. (1) In the invention according to claim 2 or 3,
The first layer and the second layer have the elastic modulus (G ′),
(E ′) is formed so that the temperature is within the above range up to 150 ° C.

(2) In the invention described in any one of claims 2 to 5, the silicone elastomers constituting the first layer and the second layer are made by blending a plurality of silicone compounds to obtain elastic moduli (G '), ( E ') is formed to have a value within the predetermined range.

(3) The sealing frame member according to any one of claims 1 to 3 is used to surround a semiconductor chip to be sealed with its first layer in close contact with the substrate. The sealing frame member is attached to the substrate, the liquid sealing resin is poured into the sealing frame member to seal the semiconductor chip, and the sealing frame member is peeled off from the substrate after the sealing resin is cured. Sealing method.

[0048]

As described in detail above, the first to third aspects of the invention are described.
According to the invention described in 1), a sealing frame member processed in advance into a predetermined shape is attached to the substrate, the liquid sealing resin is poured into the frame to seal the semiconductor chip, and the sealing resin is sealed after curing. It is suitable for a sealing method for peeling the stop frame member from the substrate and can be efficiently manufactured. Further, according to the invention described in claims 4 and 5, it is possible to easily and accurately manufacture the sealing frame member by punching.

[Brief description of drawings]

FIG. 1A is a schematic perspective view of a sealing frame member, and FIG. 1B is a partial schematic view of a silicone elastomer sheet.

FIG. 2 is a schematic cross-sectional view of a state in which a semiconductor chip is sealed.

FIG. 3 is a schematic plan view in which a sealing frame member is arranged at a sealing position of a semiconductor chip.

FIG. 4 is a schematic plan view of a sealing frame member according to another embodiment.

FIG. 5 is a schematic perspective view of a sealing frame member according to another embodiment.

FIG. 6 is a schematic cross-sectional view showing a state in which a conventional semiconductor chip is sealed.

[Explanation of symbols]

11 ... Sealing frame member, 11a, 14a ... 1st layer, 11b,
14b ... 2nd layer, 12 ... Semiconductor chip, 13 ... Printed wiring board as a substrate, 14 ... Silicone elastomer sheet.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Takeyuki Tsunekawa             5-8 Mitsuyacho, Nagahama-shi, Shiga Mitsubishi Plastics               Nagahama Factory Co., Ltd. (72) Inventor Muneyoshi Sakoda             130 Fukakusa Shimogawaracho, Fushimi-ku, Kyoto-shi, Kyoto Prefecture             No. 3 Nissan Packing Co., Ltd. F-term (reference) 4M109 AA01 BA03 CA06 DB07                 5F061 AA01 BA03 CA06

Claims (5)

[Claims] 1. A sealing frame member which is used by being stuck on a substrate so as to surround the semiconductor chip in a step of sealing the semiconductor chip with a resin, the first layer being in contact with the substrate; It is formed in a two-layer structure with a second layer laminated on one layer, the first layer has physical properties capable of ensuring adhesion to the substrate, and the second layer has physical properties that play a role of retaining the shape of the sealing frame member. A sealing frame member including. 2. A sealing frame member which is used by being stuck on a substrate so as to surround the semiconductor chip in the step of sealing the semiconductor chip with a resin, the first frame being in contact with the substrate, and the first layer. A sealing frame member constituted by two layers of silicone elastomer layers, one layer being a second layer and the other being a second layer, wherein the first layer and the second layer satisfy the following conditions. First layer: The elastic modulus (G ′) measured by the shear method at a frequency of 10 Hz and a temperature of 20 ° C. is 3.0 × by dynamic viscoelasticity measurement.
It is in the range of 10 ⁴ Pa to 5.0 × 10 ⁵ Pa. Second layer: Dynamic viscoelasticity measurement, the elastic modulus (E ') measured by the tensile method at a frequency of 10 Hz and a temperature of 20 ° C. is 3.0 × 1.
It is in the range of 0 ⁶ Pa to 2.0 × 10 ⁷ Pa. 3. The thickness of the first layer is 30 μm to 200 μm.
The sealing frame member according to claim 2, wherein m is m. 4. A frequency of 10H is measured by dynamic viscoelasticity measurement.
z, a first layer formed in a sheet shape by a silicone elastomer layer having an elastic modulus (G ′) measured by a shearing method at a temperature of 20 ° C. in the range of 3.0 × 10 ⁴ Pa to 5.0 × 10 ⁵ Pa And the elastic modulus (E ′) measured by a tensile method at a frequency of 10 Hz and a temperature of 20 ° C. by a dynamic viscoelasticity measurement while being laminated on the first layer, is 3.0 × 10 ⁶ Pa to 2.0. ×
A silicone elastomer sheet comprising a second layer formed in a sheet shape by a silicone elastomer layer having a range of 10 ⁷ Pa. 5. The thickness of the first layer is 30 μm to 200 μm.
The silicone elastomer sheet according to claim 4, wherein m is m.