JP2003266597A - Metal foil laminated sheet - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a metal foil laminated sheet obtained by bonding and laminating a metal foil and a thermoplastic resin film by an adhesive and to avoid the damage such as dimensional shrinkage or the like due to heating at the time of curing of the adhesive of the thermoplastic resin film and to make even a film having no heat resistance usable. <P>SOLUTION: The metal foil laminated sheet 10 is obtained by bonding and laminating a conductive layer 1 made of the metal foil such as a copper foil or the like and an insulating layer 2 made of the thermoplastic resin film such as a polyethylene terephthalate film or the like by an adhesive layer made of an ionizing radiation curable resin. The ionizing radiation curable resin is preferably a cationic polymerization type one. The curing of the adhesive layer can be performed by ionizing radiation and heating is slight even if together used and the damage of the adhesive layer can be avoided. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a metal foil laminated sheet having a conductive layer / adhesive layer / insulating layer structure which can be used as an after-etching type flexible printed wiring board in an electronic circuit or the like. It also relates to a method for producing such a metal foil laminated sheet.

[0002]

2. Description of the Related Art A metal foil laminated sheet is typically used as a substrate of an after-etching type flexible printed wiring board used in electronic circuits and the like in various electronic devices such as video cameras. In addition, the metal foil laminated sheet is also used for flat cables, electromagnetic wave shielding materials, surface heating elements and the like.

Conventionally, the construction of the metal foil laminated sheet as described above uses, for example, a metal foil such as a copper foil as the conductive layer, while using a thermoplastic resin film such as a polyimide film or a polyester film as the insulating layer. The conductive layer and the insulating layer are bonded and laminated with an adhesive agent interposed therebetween.

[0004]

However, a thermosetting resin such as an epoxy resin is used as the adhesive from the viewpoint of heat resistance of the metal foil laminated sheet.
However, if a thermosetting resin is used for the adhesive, there is no problem if the thermoplastic resin of the insulating layer is a heat-resistant resin film such as a polyimide film, but it is a general resin that is lower in cost and ordinary. When a thermoplastic resin film such as a polyethylene terephthalate film is used, the heat resistance of the resin film may be insufficient.

This is because when the thermosetting resin of the adhesive is hardened at a high temperature of, for example, 180 ° C. or higher, a thermal shock is applied to the thermoplastic resin film serving as the insulating layer. This is because dimensional shrinkage and distortion are given to the plastic resin film.

That is, an object of the present invention is to provide a metal foil laminated sheet in which a metal foil and a thermoplastic resin film are laminated via an adhesive, and adverse effects such as dimensional shrinkage of the thermoplastic resin film due to heating during curing of the adhesive. Is to avoid the above, and to be able to use even a thermoplastic resin film having poor heat resistance. Another object is to provide a method for producing such a metal foil laminated sheet.

[0007]

Therefore, in order to solve the above-mentioned problems, in the metal foil laminated sheet of the present invention, the conductive layer made of the metal foil and the insulating layer made of the thermoplastic resin film interpose the adhesive layer. In the metal foil laminated sheet laminated by the above method, at least an ionizing radiation curable resin is used as the resin of the adhesive layer.

With such a structure, even if the thermoplastic resin film used for the insulating layer is a film having no heat resistance such as a polyimide film, the conductive layer and the insulating layer are laminated with an adhesive layer. At that time, it can be laminated without giving dimensional shrinkage or strain, and a metal foil laminated sheet without dimensional shrinkage or strain can be obtained.

Further, the laminated sheet of the present invention has a constitution in which the ionizing radiation curable resin is a cationic polymerization type in the above constitution.

With such a structure, the cationic polymerization type has less volume shrinkage during curing of the epoxy type and the like, as compared with the case where an adhesive made of a radical polymerization type ionizing radiation curable resin such as an acrylate type is used. Since a resin can be used, it is possible to obtain a metal foil laminated sheet which has less dimensional shrinkage and distortion due to volumetric shrinkage during curing of the adhesive.

The method for producing a metal foil laminated sheet of the present invention is a method for producing a metal foil laminated sheet in which a conductive layer made of a metal foil and an insulating layer made of a thermoplastic resin film are laminated with an adhesive. In, in at least one of the metal foil and the thermoplastic resin film, after applying an adhesive containing at least ionizing radiation-curable resin, the metal foil and the thermoplastic resin film so that the adhesive application surface is in contact. It was laminated and then irradiated with ionizing radiation to cure the ionizing radiation curable resin of the adhesive to form an adhesive layer.

By using the manufacturing method having such a structure, even if the thermoplastic resin film used for the insulating layer is a film having no heat resistance such as a polyimide film, the metal foil to be the conductive layer and the insulating layer are used. When the thermoplastic resin film and the thermoplastic resin film are laminated with an adhesive, they can be laminated without giving dimensional shrinkage or strain to the thermoplastic resin film, and a metal foil laminated sheet having no dimensional shrinkage or strain can be obtained.

Further, in the method for producing a metal foil laminated sheet of the present invention, in addition to the above-mentioned production method, the ionizing radiation-curable resin of the adhesive is a cationic polymerization type resin, and the adhesive is irradiated by irradiation with the ionizing radiation. It was made to cure by cationic polymerization.

By using the manufacturing method having such a constitution, as compared with the case where an adhesive made of a radical polymerization type ionizing radiation-curable resin such as an acrylate type is used, a volume of the epoxy type or the like at the time of curing of the cationic polymerization type is increased. Since a resin with less shrinkage can be used, a metal foil laminated sheet with less dimensional shrinkage and distortion due to volumetric shrinkage during curing of the adhesive layer can be obtained.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

[Outline] First, FIG. 1 is a cross-sectional view illustrating one embodiment of a metal foil laminated sheet of the present invention. In the present invention, as in the metal foil laminated sheet 10 shown in FIG. 1, in a configuration in which the conductive layer 1 made of a metal foil, the adhesive layer 3, and the insulating layer 3 made of a thermoplastic resin film are sequentially laminated from the upper side of the drawing. The resin of the adhesive layer 3 is at least an ionizing radiation curable resin, and more preferably the ionizing radiation curable resin is a cationic polymerization type ionizing radiation curable resin.

Thus, by using an ionizing radiation curable resin instead of a thermosetting resin for the adhesive, and more preferably using a cationic polymerization type ionizing radiation curable resin, a thermoplastic resin film used for the insulating layer is obtained. However, it is possible to avoid thermal damage to the thermoplastic resin film even with a resin having poor heat resistance, such as a polyester resin such as a polyethylene terephthalate film. Therefore, a metal foil laminated sheet without the dimensional shrinkage or distortion of the thermoplastic resin film of the insulating layer is possible.

In such a metal foil laminated sheet, for example, an adhesive containing at least an ionizing radiation curable resin, preferably a cationic polymerization type ionizing radiation curable resin is applied to the metal foil side, and then the polyester is used. It can be obtained by press-bonding with a thermoplastic resin film such as a resin and then irradiating ionizing radiation such as ultraviolet rays or electron beams from the thermoplastic resin film side to polymerize and cure the resin of the adhesive.

[Conductive Layer] The conductive layer 1 is composed of a metal foil. The metal foil is not particularly limited as long as it basically has conductivity, but when a metal foil laminated sheet is used as a flexible printed wiring board, it is usually a copper foil. Further, as the other metal foil, for example,
Iron, aluminum, nickel, chrome, stainless steel,
Examples thereof include metal foils made of gold, silver and the like. It should be noted that the thickness of the metal foil is not particularly limited as long as it depends on the application. For example, the thickness of the metal foil is about 5 to 100 μm. In addition, in the case of flexible printed wiring board applications, the thickness is often 18 μm or 35 μm.

The conductive layer, that is, the surface of the metal foil on the side of the adhesive layer may be appropriately subjected to a known easy-adhesion treatment for the purpose of strengthening the adhesiveness with the adhesive layer. For example, a sandblast process or the like.

[Insulating Layer] The insulating layer 2 is composed of a thermoplastic resin film. As the thermoplastic resin film,
A heat-resistant film having good dimensional stability upon heating such as a polyimide film may be used, but in the present invention, a film having less heat resistance than the resin film can also be used.

Specifically, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polyethylene, polypropylene, polymethylpentene, polybutene, ionomer, ethylene-propylene copolymer, ethylene-propylene-butene copolymer, olefin-based heat It is possible to use a resin film having a single layer or a plurality of different layers of a single resin or a mixture of a polyolefin resin such as a plastic elastomer, a vinyl chloride resin, an ethylene-vinyl acetate copolymer, an acrylic resin and a polyamide resin. it can.

Further, these resin films may be either uniaxially stretched or biaxially stretched stretched films or non-stretched films. However, while a stretched film is generally stronger, it tends to shrink when heated, but in the present invention,
Even with a stretched film, you can avoid thermal damage,
It is more effective than an unstretched film. A typical example of the stretched film is a stretched polyester resin film such as a biaxially stretched polyethylene terephthalate film which is low cost and tough. The thickness of the thermoplastic resin film is not particularly limited as long as it depends on the application. For example, it is about 10 to 200 μm.

The adhesive layer side or the other surface of the thermoplastic resin film may be appropriately subjected to a known easy-adhesion treatment, if necessary. Examples of the easy-adhesion treatment include corona discharge treatment, plasma treatment, primer layer formation, and surface matting.

By the way, according to the present invention, unlike the curing of the adhesive with the thermosetting resin, a long time such as 30 minutes or 3 hours is not required, and the curing of the adhesive is performed by the irradiation of ionizing radiation. Therefore, since it is completed in a short time of seconds, it is also excellent in productivity. Therefore, the thermoplastic resin film used as the insulating layer is excellent in productivity even when it is a heat-resistant film having extremely excellent heat resistance such as a polyimide film. However, in order to enjoy the gist and effect of the present invention that a thermoplastic resin film having poor heat resistance can be used, a film having lower heat resistance than a polyimide film (for example, polyethylene terephthalate film) was used. The constitution is more preferable and preferable.

Regarding the heat resistance of the resin film, there are various evaluations. For example, when it is taken from the continuous use temperature, the heat resistance is based on UL temperature index which is UL (Underwriters Laboratories Inc.) standard, JIS C4003. There are also heat resistance classes. In the JIS, the heat resistance class is from bottom to bottom: Y type (90 ° C), A type (105 ° C),
Type E (120 ° C), Type B (130 ° C), Type F (155
C), H type (180 ° C), C type (exceeding 180 ° C), etc. And, the polyimide film is of type H (1
80 ° C.) to C type (exceeding 180 ° C.), and polyethylene terephthalate film is E type (120 ° C.) to B type
Seed (130 ° C). Therefore, as a thermoplastic resin film having lower heat resistance than the polyimide film, F
A thermoplastic resin film corresponding to heat resistance of F type or lower of F type of type B, type B, type E, type A, or type Y is suitable. Also,
From the viewpoint of cost and the like, a thermoplastic resin film corresponding to the heat resistance of Class B or less is suitable as long as it has heat resistance of a polyethylene terephthalate film which is versatile and low cost in various fields.

If the heat resistance is taken as the melting point of the thermoplastic resin, polyethylene terephthalate has a temperature of 264 ° C.
In the case of considering a polyethylene terephthalate film as a standard, a resin having a melting point of 264 ° C. or lower may be considered suitable as a resin having poor heat resistance. Examples of such a resin having a melting point of 264 ° C. or lower include, in addition to the polyethylene terephthalate, for example, polybutylene terephthalate (melting point 225 ° C.) polycarbonate (melting point 2
40 ° C), vinyl chloride resin (melting point 212 ° C), polypropylene (melting point 176 ° C), polyethylene (melting point 137)
℃) and the like.

[Adhesive Layer] The adhesive layer 3 uses at least an ionizing radiation curable resin as its resin. The ionizing radiation-curable resin is a composition that can be polymerized and cured by ionizing radiation such as ultraviolet rays or electron beams, and specifically has a radically polymerizable unsaturated bond or a cationically polymerizable functional group in the molecule. , A prepolymer (including a so-called oligomer) and / or a monomer are appropriately mixed.
It should be noted that these prepolymers or monomers are used alone or as a mixture of plural kinds.

The above-mentioned prepolymer or monomer specifically has a radically polymerizable unsaturated group such as a (meth) acryloyl group or a (meth) acryloyloxy group, or a cationically polymerizable functional group such as an epoxy group in the molecule. Consisting of a compound having. Further, a polyene / thiol-based prepolymer obtained by combining polyene and polythiol can also be used as the ionizing radiation curable resin. In addition, for example, a (meth) acryloyl group means an acryloyl group or a methacryloyl group. Further, the following (meth) acrylate also means acrylate or methacrylate.

When the ionizing radiation curable resin is a composition having a radical polymerizable unsaturated bond, it becomes a radical polymerization type adhesive, and when the ionizing radiation curable resin is a composition having a cationically polymerizable functional group. It becomes a cationic polymerization type adhesive.

Examples of the prepolymer having a radically polymerizable unsaturated group include polyester (meth) acrylate, urethane (meth) acrylate and epoxy (meth).
Examples thereof include acrylate, melamine (meth) acrylate, triazine (meth) acrylate, silicone (meth) acrylate and the like.

Further, examples of the monomer having a radically polymerizable unsaturated group include methyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, phenoxyethyl (meth) acrylate and the like as monofunctional monomers. Further, as a polyfunctional monomer, diethylene glycol di (meth) acrylate, propylene glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, trimethylolpropane ethylene oxide tri (meth) acrylate, dipentaerythritol tetra (meth) acrylate. , Dipentaerythritol penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, and the like.

On the other hand, examples of the prepolymer having a cationically polymerizable functional group include bisphenol type epoxy resin, novolac type epoxy resin, alicyclic epoxy resin,
Examples thereof include epoxy resins such as aliphatic epoxy resins, vinyl ether resins such as aliphatic vinyl ethers, aromatic vinyl ethers, urethane vinyl ethers and ester vinyl ethers, cyclic ether compounds, and prepolymers such as spiro compounds.

When the resin is photopolymerized with ultraviolet rays or visible rays to be cured, the above ionizing radiation curable resin is
Further, a photopolymerization initiator is added. In the case of a resin system having a radically polymerizable unsaturated group, as a photopolymerization initiator, acetophenones, benzophenones, thioxanthones,
Benzoin and benzoin methyl ethers may be used alone or in combination. In the case of a resin system having a cationically polymerizable functional group, an aromatic diazonium salt, an aromatic sulfonium salt, an aromatic iodonium salt, a metallocene compound, a benzoin sulfonic acid ester, or the like is used alone or as a mixture as a photopolymerization initiator. be able to. The addition amount of these photopolymerization initiators is 0.1 to 1 with respect to 100 parts by mass of the ionizing radiation curable resin.
It is about 0 parts by mass.

As the ionizing radiation, an electromagnetic wave or charged particles having energy capable of crosslinking the molecules in the adhesive is used. UV rays or electron rays are usually used, but visible rays, X-rays, ion rays and the like can also be used. As the ultraviolet ray source, a light source such as an ultra-high pressure mercury lamp, a high pressure mercury lamp, a low pressure mercury lamp, a carbon arc lamp, a black light, and a metal halide lamp is used. As a wavelength of ultraviolet rays, a wavelength range of 190 to 380 nm is usually mainly used. As the electron beam source, various electron beam accelerators such as Cockcroft-Walton type, Van de Graft type, resonance transformer type, insulating core transformer type, linear type, dynamitron type, high frequency type, etc. are used.
Those which irradiate with electrons having an energy of 1000 keV, preferably 100 to 300 keV are used.

As the adhesive, at least an ionizing radiation-curable resin is used as the resin. Resins other than the ionizing radiation-curable resin, for example, vinyl chloride-vinyl acetate copolymer, polyvinyl acetate, acrylic resin, A thermoplastic resin such as a cellulosic resin or a thermosetting resin such as a urethane resin, a curable polyester resin, a curable acrylic resin or an epoxy resin may be used in combination. When the thermosetting resin is used in combination, the temperature and the curing time of the thermosetting resin should be within the range that does not deviate from the gist of the present invention of avoiding heat damage.

Various known additives may be added to the adhesive. Examples of these additives include fillers made of inorganic powder such as calcium carbonate, barium sulfate, silica and alumina, flame retardants and colorants.

By using at least the ionizing radiation curable resin as the adhesive resin, the adhesive heat required when the thermosetting resin such as the thermosetting urethane resin or the thermosetting epoxy resin is used. It is possible to avoid exposing the thermoplastic resin film serving as the insulating layer to the high temperature for curing. As a result, it is possible to avoid dimensional shrinkage and distortion of the thermoplastic resin film due to thermal shock during curing and heating.

The ionizing radiation curable resin used for the adhesive may be radical polymerization type or cationic polymerization type, and basically any of them may be used, but the cationic polymerization type is preferable. That is, if it is a cationic polymerization type, as compared with the case of using a radical polymerization type ionizing radiation curable resin such as an acrylate type, an ionizing radiation curable resin such as an epoxy type which has less volume shrinkage during curing can be used, This is because it is possible to obtain a metal foil laminated sheet with less dimensional shrinkage and strain due to volumetric shrinkage of the adhesive layer itself upon curing.

The surface to which the adhesive is applied may be either the conductive layer (metal foil) or the insulating layer (thermoplastic resin film), or both surfaces.

The adhesive may be applied by a known coating method such as gravure coating or roll coating. The thickness of the adhesive layer is not particularly limited and depends on the application, but is usually 5 to 4
It is about 0 μm. If it is too thin, the adhesive strength will decrease, and if it is too thick, the flexibility will decrease.

After the adhesive is applied, it is pressure-bonded by a laminating roll or a hot press to fix the conductive layer and the insulating layer with the adhesive, and then ionizing radiation is irradiated to photopolymerize the adhesive. When cured, it becomes an adhesive layer containing a cured product of an ionizing radiation curable resin, and a desired metal foil laminated sheet is obtained. The irradiation of ionizing radiation is usually performed from the insulating layer side in terms of transparency to ionizing radiation.

In the present invention, ionizing radiation is used as an essential curing means for curing the adhesive.
Thermal polymerization by heating may be used together without departing from the spirit of the present invention. For example, a part of the curing reaction is allowed to proceed by thermal polymerization to bring it into a semi-cured state, and then the conductive layer and the insulating layer are bonded to each other, and thereafter, ionizing radiation is applied to perform photopolymerization and complete curing. By doing so, depending on the resin composition, problems such as peeling between the conductive layer and the insulating layer before they are completely cured by irradiation with ionizing radiation after bonding the conductive layer and the insulating layer may occur. It is also possible to avoid it by generating an appropriate adhesive force / adhesive force.

[0044]

EXAMPLES The present invention will be described in more detail below with reference to examples and comparative examples.

Example 1 A metal foil laminated sheet 10 having the structure shown in the sectional view of FIG. 1 was produced as follows. First, a copper foil having a thickness of 35 μm was prepared as the metal foil to be the conductive layer 1. Then, on one surface of this copper foil, an adhesive composed of a cationic polymerization type epoxy ionizing radiation curable resin was applied by a roll coating method at 20 g / m ² (dry) and heated at 200 ° C. for 1 minute to semi-heat. It was cured. Then, a 25 μm-thick biaxially stretched polyethylene terephthalate film was laminated as an insulating layer 2 on the adhesive-coated surface by pressure bonding using a laminating roller. Then, in order to completely cure the adhesive, ultraviolet rays are radiated from the insulating layer side at 1980 mJ / cm ² by a high pressure mercury lamp to completely cure it by photopolymerization to form an adhesive layer 3, and a desired metal foil laminated sheet as shown in FIG. Got 10.

Example 2 A metal foil laminated sheet 10 having the structure shown in the sectional view of FIG. 1 was produced as follows. First, a copper foil having a thickness of 35 μm was prepared as the metal foil to be the conductive layer 1. Then, an adhesive composed of a cationic polymerization type epoxy ionizing radiation curable resin was applied on one surface of the copper foil at 20 g / m ² (dry) in the same manner as in Example 1, and an insulating layer was applied to the adhesive applied surface. As No. 2, a biaxially stretched polyethylene terephthalate film having a thickness of 25 μm was pressed and laminated in the same manner as in Example 1. Then, ultraviolet rays were radiated from the insulating layer side at 1980 mJ / cm ² with a high pressure mercury lamp to completely cure the adhesive by photopolymerization to form an adhesive layer 3 to obtain a desired metal foil laminated sheet 10 as shown in FIG.

Comparative Example 1 In Example 1, a thermosetting epoxy adhesive was used as an adhesive, the adhesive was applied to a copper foil and then heated at 200 ° C. for 1 minute to be a semi-cured state.
A 25 μm-thick biaxially stretched polyethylene terephthalate film as the insulating layer 2 was pressure-bonded and laminated on the adhesive-coated surface in the same manner as in Example 1. Then, it was cured by heating at 180 ° C. for 3 hours, and the adhesive was completely cured by thermosetting to obtain the desired metal foil laminated sheet as the adhesive layer 3.

[Performance Evaluation] With respect to the metal foil laminated sheets obtained in Examples 1 and 2, the biaxially stretched polyethylene terephthalate film of the insulating layer had a smooth surface without heat damage when the adhesive was cured. However, Comparative Example 1
Regarding the metal foil laminated sheet of No. 3, wrinkles and distortions were observed in the polyethylene terephthalate film due to heat damage when the adhesive was cured.

[0049]

(1) According to the metal foil laminated sheet of the present invention, even if the thermoplastic resin film used for the insulating layer is a film having no heat resistance such as a polyimide film,
When laminating the conductive layer and the insulating layer with the adhesive layer, they can be laminated without giving dimensional shrinkage or strain, and a metal foil laminated sheet without dimensional shrinkage or strain can be obtained. (2) Furthermore, by making the ionizing radiation curable resin of the adhesive a cationic polymerization type, the volume shrinkage during curing is reduced as compared with the case where an adhesive of a radical polymerization type ionizing radiation curable resin such as an acrylate type is used. Since a resin having a small amount can be used, it is possible to obtain a metal foil laminated sheet which has less dimensional contraction and distortion due to volume contraction of the adhesive when cured.

(3) On the other hand, according to the method for producing a metal foil laminated sheet of the present invention, even if the thermoplastic resin film used for the insulating layer is a film having no heat resistance such as a polyimide film, When the metal foil and the thermoplastic resin film to be the insulating layer are adhered and laminated with an adhesive, the thermoplastic resin film can be laminated without dimensional shrinkage or strain, and the metal foil has no dimensional shrinkage or strain. A laminated sheet is obtained. (4) Further, if the ionizing radiation curable resin of the adhesive is a cationic polymerization type and the adhesive is cationically polymerized and cured by irradiation of ionizing radiation, a radical polymerization type ionizing radiation curable agent such as an acrylate-based resin. Since a resin having less volume shrinkage upon curing can be used as compared with the case where an adhesive made of resin is used, a metal foil laminated sheet having less dimensional shrinkage and strain due to volume shrinkage upon curing of the adhesive layer can be obtained.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating one form of a metal foil laminated sheet according to the present invention.

[Explanation of symbols]

1 (Metal foil) Conductive layer 2 (Thermoplastic resin film) Insulating layer 3 Adhesive layer 10 Metal foil laminated sheet

   ─────────────────────────────────────────────────── ─── Continued front page    F-term (reference) 4F100 AB01A AB33A AK01B AK01G                       AK42 BA02 EC03 EC032                       EJ08 EJ082 GB43 JB14G                       JB16B JG01A JG04B JL04                 4F211 AA24 AA39 AD03 AD08 AD32                       AH36 TA03 TC02 TD11 TH06                       TN45 TQ03

Claims (4)

[Claims] 1. A metal foil laminated sheet in which a conductive layer made of a metal foil and an insulating layer made of a thermoplastic resin film are laminated via an adhesive layer, wherein at least ionizing radiation curing is used as the resin of the adhesive layer. A metal foil laminated sheet using a flexible resin. 2. The metal foil laminated sheet according to claim 1, wherein the ionizing radiation curable resin is a cationic polymerization type. 3. A method for producing a metal foil laminated sheet, which comprises laminating a conductive layer made of a metal foil and an insulating layer made of a thermoplastic resin film via an adhesive, in at least one of the metal foil and the thermoplastic resin film. On one side, after applying an adhesive containing at least an ionizing radiation-curable resin, these metal foil and a thermoplastic resin film are laminated so that the adhesive application surface is in contact, and then irradiated with ionizing radiation. A method for producing a metal foil laminated sheet, comprising curing an ionizing radiation curable resin of an adhesive to form an adhesive layer. 4. The method for producing a metal foil laminated sheet according to claim 3, wherein the ionizing radiation curable resin of the adhesive is a cationic polymerization type resin, and the adhesive is cationically polymerized and cured by irradiation with ionizing radiation.