JP2003258474A - Electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component which is preferred to a use while a good heat sink structure is assured. <P>SOLUTION: The electronic component comprises an opening 8 formed in an outer case 5a of a display unit 5 connected to a body 2 and having a plurality of holes 8a, and a heat sink plate 15 disposed in the display unit 5 and having a plurality of channels 15c for supplying a liquid refrigerant. The component further comprises a plurality of fins 17 provided between the channels 15c of the plate 15 so that the plate 15 is disposed between an LCD panel 6 and the outer case 5a so that the fins 17 are opposed to the opening 8. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device containing a heating element such as a semiconductor package, and more particularly to a structure for enhancing the cooling performance of the heating element.

[0002]

2. Description of the Related Art Portable electronic devices, represented by notebook type portable computers and mobile communication devices, are equipped with a microprocessor for processing multimedia information. This kind of microprocessor tends to rapidly increase the amount of heat generated during operation as the processing speed increases and the number of functions increases. Therefore, in order to ensure stable operation of the microprocessor, it is necessary to improve the heat dissipation of the microprocessor.

As a measure against this heat, the conventional electronic equipment is equipped with an air-cooling type cooling device for forcibly cooling the microprocessor. This cooling device includes a heat sink that removes heat from the microprocessor and dissipates it, and an electric fan that blows cooling air to the heat sink.

The heat sink has a heat receiving portion for receiving the heat of the microprocessor, a plurality of radiating fins and a cooling air passage. The cooling air passage is formed along the heat receiving portion and the radiating fins, and the cooling air is sent to the cooling air passage via the electric fan. The cooling air flows between the radiating fins so as to sew, and in the process of this flow, the heat sink is forcibly cooled. Therefore, the heat of the microprocessor transmitted to the heat sink is carried along with the flow of the cooling air and carried away, and is also discharged from the downstream end of the cooling air passage to the outside of the electronic device.

In this conventional cooling system, since the cooling air flowing through the cooling air passage serves as a cooling medium for depriving the heat of the microprocessor, much of the cooling performance of the microprocessor depends on the amount of cooling air and the cooling air and heat sink. Will depend on the contact area.

The chip shape of the microprocessor is fixed to some extent, and the contact area with the heat sink is also limited. In that sense, it is expected that microprocessors for electronic devices will become even faster and have more functions in the near future.
Along with this, the amount of heat generated by the microprocessor is expected to increase dramatically. Therefore, it is feared that the conventional cooling method by forced air cooling may cause insufficient cooling performance of the microprocessor or may reach its limit.

To improve this, for example, as disclosed in Japanese Patent Application Laid-Open No. 7-142886, a liquid having a much higher specific heat than air is used as a refrigerant to enhance the cooling efficiency of the microprocessor. The so-called liquid cooling method has been tried.

In this new cooling system, the heat receiving header is installed inside the housing in which the microprocessor is housed, and the heat dissipation header is installed inside the display unit supported by this housing. The heat receiving header is thermally connected to the macro processor, and a channel through which a liquid refrigerant flows is formed inside the heat receiving header. The heat dissipation header is thermally connected to the display unit, and a channel through which the refrigerant flows is formed inside the heat dissipation header. Then, the flow path of the heat receiving header and the flow path of the heat radiation header are connected to each other via a circulation path for circulating the refrigerant.

[0009]

By the way, Japanese Patent Laid-Open No. 7-1
In the heat dissipation structure described in Japanese Patent No. 42886, the heat dissipation member is directly connected to the metal housing of the display unit, and the metal housing is used as the heat dissipation member. However, the metal case to which the heat dissipation member is connected is partially heated to a high temperature, which is not preferable for the user.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a preferable electronic device for a user while ensuring a good heat dissipation structure.

[0011]

In order to achieve the above object, an electronic device according to a first aspect of the present invention is a display unit having a main body having a first flow path and a display panel connected to the main body and having a built-in display panel. And a heat radiating plate disposed inside the display unit on the back surface of the display panel and having a second flow path connected to the first flow path therein, and the first flow path and the second flow path. It is characterized by including a liquid coolant that is flowed over and an opening formed by a plurality of holes that are provided in the case of the display unit and that face the heat dissipation plate.

According to a tenth aspect of the present invention, there is provided an electronic apparatus including a main body having a first flow path, a display panel, an outer case for covering a rear surface of the display panel and an inner case located on the display surface side of the display panel. A display unit having a case; a heat radiating plate disposed inside the display unit on the back surface of the display panel and having a second flow path connected to the first flow path therein; It is characterized by including a liquid coolant flowing over the flow path and an opening formed by a plurality of holes provided in the outer case of the display unit and facing the heat dissipation plate.

According to a nineteenth aspect of the present invention, in an electronic device, a main body having a first flow path and a display panel are built-in, and an outer case for covering a rear surface of the display panel and an inner portion located on the display surface side of the display panel. A display unit having a case; a heat radiating plate disposed inside the display unit on the back surface of the display panel and having a second flow path connected to the first flow path therein; A liquid refrigerant flowing along the flow path, an opening formed by a plurality of holes provided in the outer case of the display unit and facing the heat dissipation plate, and a heat-generating component mounted in the main body. , A heat receiving part that is thermally connected to the heat-generating component and that has a first flow path inside, and a liquid coolant that is provided in the first flow path and that moves from the first flow path toward the second flow path. And a pump for feeding. With such a configuration, it is possible to provide a preferable electronic device to the user while ensuring a good heat dissipation structure.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.
A description will be given with reference to the drawings. FIG. 1 is a perspective view of a portable computer. The portable computer 1 has a main body 2 on which a keyboard 3 is provided. A display unit 5 is rotatably connected to the upper surface of the rear end of the main body 2 via a hinge unit 4. The display unit 5 has an outer case 5a and an inner case 5b, and an LCD panel (display panel) 6 is built in the display unit 5. The outer case 5a covers the back surface of the LCD panel 6, and the inner case 5b is located on the display surface side of the display panel 6.

FIG. 2 is a perspective view showing the rear surface of the portable computer. As shown in FIG. 2, the outer case 5a of the display unit 5 is provided with an opening 8 formed by a plurality of holes 8a formed in a matrix. The hole 8a is formed by punching (the hole 8a may of course be formed by another method).

FIG. 3 is a sectional view of the portable computer schematically showing a circulation path of the refrigerant. Inside the main body 2, a heat generating component 9 such as a CPU is mounted on a circuit board (not shown). The heat receiving part 11 is thermally connected to the heat generating component 9,
The heat generated from the heat generating component 9 is transferred to the heat receiving section 11. The heat receiving portion 11 is formed of a metal having a high thermal conductivity, such as aluminum or copper, and has therein a flow path for passing a liquid (not shown). Pump 1 on the circuit board (not shown)
0 is implemented. The pump 10 and the heat receiving portion 11 are first
The pipe 13 is connected to one end 13a and the other end 13b, respectively. Since the first tube 13 does not have to be variable in the main body 2, it may be formed of a metal material such as aluminum, copper, or stainless steel, or may be formed of a hard fluororesin material. . The pump 10 serves to feed the liquid from the inside of the pipe 13 to the flow path of the heat receiving portion 11.

One end 14a of the second tube 14 is connected to one end of the heat receiving portion 11. The other end 14b of the tube 14 is connected to the main body 2
Is connected to one end of a first pipe joint unit 20 provided over the display unit 5.

FIG. 4 is a perspective view of the heat dissipation member. As shown in FIGS. 3 and 4, one end 15a of the heat dissipation plate 15 is connected to the other end of the pipe joint unit 20 located on the display unit 5 side. The heat dissipation plate 15 has substantially the same plane size as the outer case 5a of the display unit 5. A plurality of flow paths 15c are formed inside the heat dissipation plate 15 in a ladder shape from the lower end 15d to the upper end 15e of the heat dissipation plate 15, and the liquid refrigerant flowing through the pipe joint unit 20 is almost in the flow path 15c. It will flow to all areas. The heat sink 15 is arranged on the back side of the LCD 6 (outer case 5a side) in the display unit 5, and the other end 1 of the heat sink 15 is disposed.
5 b is connected to a second pipe joint unit 21 provided between the display unit 5 and the main body 2. As shown in FIG. 4, a plurality of fins (projections) 17 protruding from the surface of the heat dissipation plate 15 are formed between the plurality of flow paths 15c of the heat dissipation plate 15. The fins 17 may be formed integrally with the heat dissipation plate 15 or may be separate members, or may be columnar instead of rib-shaped.

A third pipe 1 is provided at the other end of the pipe joint unit 21.
One end 16a of the pipe 6 is connected, and the other end 16b of the pipe 16 is connected to the pump 10. The second and third tubes 14 and 16 are made of a hard material such as a metal material or a fluororesin-based material like the first tube. Further, the heat dissipation plate 15 is preferably formed of a metal material such as aluminum or copper. Furthermore, the heat sink 15
Are formed to have substantially the same size as the area size of the opening 8 formed in the outer case 5a.

With this structure, the pump 10 is
The liquid refrigerant flowing in the few tubes 13, 14, 16 and the heat dissipation plate 15 is sent from the first tube 13 to the flow path provided in the heat receiving section 11, and the heat is transferred from the heat generating component 9 to the heat receiving section 11. After removing heat, the pipe joint unit 2 is passed through the second pipe.
Send to 0. The liquid is sent to the heat dissipation plate 15 via the pipe joint unit 20. The liquid refrigerant warmed in the heat receiving portion 11 is radiated by the heat radiating portion 15, and the pipe joint unit 21
Is fed into the third pipe 16 via. The liquid sent to the third pipe 16 returns to the pump 10. In this way, the pump 10 functions so that the liquid smoothly flows from the first pipe 13 to the third pipe 16.

Inside the main body 2, the hoop 10 and the first tube 1
3, the heat receiving portion 11, the second pipe 14 and the third pipe 16 form a first flow path, and the heat radiating plate 15 is provided inside the display portion 6.
A second second flow path is formed inside the first flow path and the second flow path.
By connecting the first flow path and the second flow path with the first and second pipe joint units, one flow path through which the liquid refrigerant flows is formed between the main body 2 and the display unit 6.

FIG. 5 is a sectional view taken along the section line AA 'in FIG.

An LCD 6 is arranged between the outer case 5a and the inner case 5b of the display unit 5. LCD 6 and outer case 5
A heat dissipation plate 15 is arranged between the heat dissipation plate 15 and a. At this time, the heat dissipation plate 15 is arranged so that the plurality of fins 17 formed on the surface thereof face the openings 8 formed in the outer case 5a. The warm liquid refrigerant received by the heat receiving portion is the heat radiating plate 15.
The heat is transferred to the heat dissipation plate 15 itself by passing through the inner flow path 15c, and is dissipated by the heat dissipation plate 15 itself and by the plurality of fins 17 provided on the heat dissipation plate 15. At this time, the heat radiated from the fins 17 is the hole 8a formed in the opening 8.
Since the heat is radiated from the display unit 5 to the outside of the display unit 5, the heat radiation efficiency is much improved as compared with the case where the opening 8 is not formed in the outer case 5a. Further, since the opening 8 of the outer case 5a is formed to have substantially the same size as the heat dissipation plate 15, heat can be effectively dissipated without staying inside the display unit 5.

FIG. 6 is a perspective view showing the rear surface of the portable computer according to the second embodiment. In the second embodiment, the same elements as those in the first embodiment are designated by the same reference numerals and the description thereof will be omitted.

In the second embodiment, the outer case 5a
A mesh part 8 obtained by processing the openings 8 formed in the
It is different from the first embodiment in that b is provided. Since the total hole area of the mesh-processed mesh portion 8b is larger than the total hole area of the holes 8a of the opening 8 of the first embodiment, there is an effect that the heat dissipation effect is improved.

The present invention is not limited to the above embodiments as long as it does not depart from the spirit of the invention.

[0027]

According to the invention described in detail above, it is possible to provide a preferable electronic device for a user while ensuring a good heat dissipation structure.

[Brief description of drawings]

FIG. 1 is a perspective view of a portable computer.

FIG. 2 is a perspective view showing the rear surface of the portable computer.

FIG. 3 is a sectional view of a portable computer schematically showing a circulation path of a refrigerant.

FIG. 4 is a perspective view of a heat dissipation member.

5 is a cross-sectional view taken along the line A-A 'in FIG.

FIG. 6 is a perspective view showing the back surface of the portable computer according to the second embodiment.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Portable computer, 2 ... Main body, 3 ... Keyboard, 4 ... Hinge part, 5 ... Display part, 5a ... Outer case, 5b ... Inner case, LCD panel, 6 ... (Display panel), 8 ... Opening part, 8a ... Hole, 8b ... Mesh part,
9 ... Exothermic parts, 10 ... Pump, 11 ... Heat receiving part, 13 ...
..First pipe, 14 ... Second pipe, 15 ... Radiating plate, 15c
... Flow path, 16 ... Third tube, 17 ... Fin (projection),
20 ... 1st pipe joint unit, 21 ... 2nd pipe joint unit

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hideo Iwasaki             1st Komukai Toshiba-cho, Sachi-ku, Kawasaki-shi, Kanagawa             Inside the Toshiba Research and Development Center (72) Inventor Kentaro Tomioka             2-9 Suehiro-cho, Ome City, Tokyo Stock Market             Company Toshiba Ome Factory (72) Inventor Hiroshi Ikata             2-9 Suehiro-cho, Ome City, Tokyo Stock Market             Company Toshiba Ome Factory F-term (reference) 5E322 AA01 AA05 AA07 AA11 BA01                       DA01 DA02                 5F036 AA01 BA10 BB05                 5G435 AA12 EE02 EE17 GG44

Claims (19)

[Claims] 1. A main body having a first flow path, a display section connected to the main body and having a built-in display panel, a display section inside the display section, and a display section inside the display section. A heat radiating plate provided with a second flow path connected to the first flow path, a liquid refrigerant flowing over the first flow path and the second flow path, and provided in a case of the display unit. An electronic device comprising: an opening formed by a plurality of holes provided so as to face the heat dissipation plate. 2. The electronic device according to claim 1, wherein the display unit has an outer case and an inner case, and the opening is provided in the outer case. 3. The electronic device according to claim 2, wherein the opening has a size corresponding to a plane size of the heat dissipation plate. 4. The electronic device according to claim 2, wherein the opening is formed by punching. 5. The electronic device according to claim 2, wherein the opening is formed by mesh processing. 6. The electronic device according to claim 1, wherein a plurality of the second flow paths are formed in a ladder shape, and fins are formed between the plurality of second flow paths. 7. The electronic device according to claim 1, wherein the heat dissipation plate is provided with fins projecting toward the opening. 8. A heat-generating component built into the main body, thermally connected to the heat-generating component, and internally provided with the first component.
2. The electronic device according to claim 1, further comprising: a heat receiving portion in which a part of the flow path is formed. 9. The electronic device according to claim 8, wherein the first flow path is provided with a pump for feeding the liquid refrigerant from the first flow path toward the second flow path. 10. A display having a main body having a first flow path, a display panel built-in, an outer case covering a back surface of the display panel, and an inner case positioned on a display surface side of the display panel. A heat sink disposed on the back surface of the display panel in the display section and having a second flow path connected to the first flow path therein, and the first and second flow paths. A liquid coolant flowing over the passage, and an opening formed by a plurality of holes provided in the outer case of the display unit and facing the heat dissipation plate. Electronic equipment to do. 11. The electronic device according to claim 10, wherein the first flow path and the second flow path are connected by a pipe joint provided between the main body and the display section. machine. 12. The electronic device according to claim 10, wherein the opening is formed by punching. 13. The electronic device according to claim 10, wherein the opening is formed by mesh processing. 14. The electronic device according to claim 10, wherein a plurality of the second flow paths are formed in a ladder shape, and fins are formed between the plurality of second flow paths. 15. The heat dissipation plate is provided with a protrusion protruding toward the opening.
Electronic device described. 16. A heat-generating component built in the main body, and a heat-receiving part which is thermally connected to the heat-generating component and in which a part of the first flow path is formed. The electronic device according to claim 10, wherein: 17. The electronic device according to claim 16, wherein the first flow path is provided with a pump for feeding the liquid refrigerant from the first flow path toward the second flow path. 18. The opening is formed to have a size substantially the same as a plane size of the heat dissipation plate.
Electronic device described. 19. A display having a main body having a first flow path, a display panel built-in, an outer case covering a back surface of the display panel, and an inner case located on a display surface side of the display panel. A heat sink disposed on the back surface of the display panel in the display section and having a second flow path connected to the first flow path therein, and the first and second flow paths. A liquid coolant flowing along the path, an opening formed by a plurality of holes provided in the outer case of the display unit and facing the heat dissipation plate, and mounted in the main body. A heat-generating component, a heat-receiving part that is thermally connected to the heat-generating component and has the first flow passage therein, and a heat-receiving part that is provided in the first flow passage, The above liquid refrigerant is sent in the direction of the channel 2 An electronic apparatus characterized by comprising a pump for writing, the.