JP2003258404A - Method of manufacturing electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that component control is troublesome in a method of manufacturing an electronic device. <P>SOLUTION: This manufacturing method comprises a measuring process 33 of measuring electrical properties of a reference pattern 31 formed on a printed board 21 which has a regulating pattern 27 having a correlation with the reference pattern 31, a regulating process 34 of regulating the regulating pattern 27 on the basis of a measurement result obtained in the measuring process 33 after the measuring process 33 is carried out, and a mounting process 38 of mounting an electronic component 23 on the printed board 21 after the regulating process 24 is finished. By this setup, the control of components can be easily carried out in the manufacture of the electronic device. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic device mainly used at high frequencies.

[0002]

2. Description of the Related Art A conventional method of manufacturing an electronic device will be described below. A conventional method of manufacturing an electronic device is as shown in FIG. That is, the etching step 2 for etching the printed circuit board 1a having the adjustment pattern.
And a mounting step 4 for mounting the electronic component 3 on the printed circuit board 1 etched after the etching step 2, a measuring step 5 for measuring electrical characteristics after the mounting step 4, and the measuring step after the measuring step 5. The adjustment step 6 of adjusting the adjustment pattern based on the measurement result of step 5. Then, after this adjusting step 6, the storage 7
I was doing

[0003]

However, in such a conventional process, since the adjustment process 6 is provided after the mounting process 4 for mounting the electronic component 3 on the printed circuit board 1, the etching of the printed circuit board 1 is performed. Depending on the state, the inductance value of the inductor fluctuates greatly, and its adjustment is difficult.

Therefore, in order to solve this problem, it was necessary to change the constant of the electronic component 3 connected to the inductor to deal with the problem. As a result, the numbers of the printed circuit boards 1 and the electronic components 3 are increased, and the management thereof is difficult.
The reason will be described in detail below.

The printed circuit board 1 used here is provided with a plurality of child printed circuit boards 9 connected in a parent printed circuit board 8 as shown in FIG. Then, the electronic component 3 is mounted on the child printed board 9 to manufacture an oscillation device as an electronic device.

This oscillator has a structure as shown in FIG. 12, for example. That is, the resonance circuit 1 including the inductor 10 and the capacitor 11 formed by the printed pattern
2 and an oscillation circuit 13 connected to the resonance circuit 12. Here, the inductor 10 is formed by a series connection circuit of a fixed inductor 14 provided on the inner layer of the child printed board 9 and an adjusting inductor 15 provided on the surface of the child printed board 9, and is fixed. The inductance value of the inductor 14 is sufficiently larger than the inductance value of the adjusting inductor 15. Further, the capacitor 11 is formed by a series connection circuit of a fixed capacitor 11a and a varicap diode 11b. In this oscillator, the oscillation frequency is substantially determined by the inductance of the inductor 10 and the capacitor 11.

The details of the inductor 10 are shown in FIG. In FIG. 13, the inductor 10 is composed of an inductor 14 formed by a thin line pattern and an inductor 15 formed by a thick line. Then, the inductor 15 formed by the thick line pattern is cut 16 with a laser to adjust the inductor 15. Then, the oscillation frequency of the oscillator is adjusted by adjusting the inductance of the inductor 15.

In the conventional structure, the width 14A of the pattern of the thin wire pattern inductor 14 is about 0.2 mm,
On the other hand, the pattern etching accuracy was ± 20 μm. The width of the pattern of the thin wire pattern inductor 14 1
There was about 10 times between 4A and the pattern etching accuracy, and the effect of the etching accuracy was small. However, with the recent miniaturization, it has become necessary to set the pattern width 14A of the thin wire pattern inductor 14 to about 0.1 mm.

For this reason, the relationship with the etching accuracy is increased by a factor of 5, and the influence on the oscillation frequency is large, which cannot be ignored. Therefore, when the value of the capacitor 11 is the same, it may not be possible to make a correction only by the adjustment inductor 15.

Therefore, the printed circuit board 1 is selected into a plurality of ranks according to the degree of variation in the pattern width forming the inductor 14, and the capacitors 11 corresponding to the ranks are selected.
It was necessary to determine the value of each. Therefore, the types of the capacitors 11 and the types of the printed circuit boards 1 are increased, and it is difficult to manage the parts.

Therefore, the present invention is intended to solve this problem, and it is an object of the present invention to provide a method of manufacturing an electronic device in which component management is easy.

[0012]

In order to achieve this object, a method of manufacturing an electronic device according to the present invention is directed to a printed circuit board having an adjustment pattern and a reference pattern having a correlation with the adjustment pattern. A measurement step of measuring the electrical characteristics of the reference pattern, an adjustment step of adjusting the adjustment pattern based on the measurement result of the measurement step after the measurement step, and the printed circuit board after the adjustment step. And a mounting step of mounting an electronic component.

This facilitates component management in the electronic device manufacturing method.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 of the present invention relates to a printed circuit board having an adjustment pattern and a reference pattern having a correlation with the adjustment pattern. A measuring step of measuring the characteristic, an adjusting step of adjusting the adjusting pattern based on the measurement result in the measuring step after the measuring step, and a mounting step of mounting an electronic component on the printed circuit board after the adjusting step. Even if the electrical characteristics of the pattern generated at the time of etching the printed circuit board are varied, it is possible to adjust the electrical characteristic by adjusting the adjustment pattern of the printed circuit board before mounting the electronic component. Since they can be made substantially the same, the number of electronic components to be mounted may be one. Therefore, it becomes easy to manage the parts in the manufacture of the electronic device.

Further, efficient production becomes possible. Furthermore,
Management costs can also be reduced.

According to a second aspect of the present invention, in the adjusting step, a circuit pattern on the front surface of which electronic components are mounted, a ground pattern provided on the back surface, and an inner layer between the front surface and the back surface are provided. The method for manufacturing an electronic device according to claim 1, wherein the adjustment pattern is adjusted by laser trimming from the back surface side of the printed board using a printed board having the adjustment pattern. Since the trimming is performed from the back surface side, the front surface pattern can be freely designed without damaging the front surface pattern. It also contributes to miniaturization.

According to a third aspect of the present invention, in the adjustment step, adjustment is performed by using a printed circuit board having a protective pattern provided between the adjustment pattern and the surface in a manner corresponding to the adjustment pattern as the printed circuit board. The method of manufacturing an electronic device according to claim 2, further comprising a protective pattern, the safety of the surface pattern is further increased.

According to a fourth aspect of the present invention, in the adjusting step, as the printed circuit board, the adjustment pattern is provided by being divided into an inner layer and a surface of the printed circuit board, and the printed circuit board is connected by through holes. The method for manufacturing an electronic device according to claim 2, wherein the adjustment is performed, and the adjustment can be performed on the surface of the printed circuit board. Therefore, it is convenient for adjustment after mounting the components.

According to a fifth aspect of the present invention, in the measuring step, as a printed board, a child printed board having a high-frequency circuit including an adjustment pattern, and a plurality of the child printed boards are integrally formed to form a parent print. A substrate and a printed circuit board in the parent printed circuit board, in which a reference pattern having a correlation with an inductance value of the adjustment pattern formed on the child printed circuit board is provided in a non-formed portion of the child printed circuit board. The method of manufacturing an electronic device according to claim 1, wherein the resistance value of the reference pattern is measured by using a digital resistance measuring instrument, wherein the adjustment of a plurality of child printed circuit boards is representatively measured by the reference pattern. Therefore, the efficiency of the measurement process can be improved.

According to a sixth aspect of the present invention, in the measuring step, the value of the inductance of the reference pattern of the printed circuit board is measured using a printed circuit board having a value larger than the value of the inductance formed on the child printed circuit board. Item 5
In the method for manufacturing an electronic device described in (1), since the inductance of the reference pattern is larger than the inductance of the child printed circuit board, the measurement error in the measurement process is reduced, and the measurement with less error can be easily performed.

The invention according to claim 7 is the method of manufacturing an electronic device according to claim 6, wherein in the measuring step, the reference pattern of the printed board is measured using a printed board having a zigzag shape. With the zigzag shape, a large inductance can be secured in a small area, and as a result, the measurement error in the measurement process is reduced, and the measurement with less error can be facilitated.

The invention according to claim 8 is the method of manufacturing an electronic device according to claim 5, wherein in the measuring step, the measurement is performed using a printed circuit board having a plurality of reference patterns provided at different positions of the parent printed circuit board. Since the reference patterns are provided at different positions, it is possible to more accurately measure the inductance of the child printed circuit board in the vicinity of each reference pattern in the measurement process. This measures the etching variation due to the difference in the position of the child printed circuit boards connected in the parent printed circuit board, and can make the most suitable adjustment for each child printed circuit board.

The invention according to claim 9 is the method of manufacturing an electronic device according to claim 6, wherein in the measuring step, the measurement is performed using a printed board having contact lands at both ends of a reference pattern of the printed board. Therefore, it is possible to easily and surely make contact with the measuring device in the measuring process.

According to a tenth aspect of the present invention, in the measuring step, as a printed board, a child printed board having a high-frequency circuit including an adjustment pattern and a parent print integrally formed by connecting a plurality of the child printed boards. A substrate and a printed circuit board in the parent printed circuit board, in which a reference pattern having a correlation with an inductance value of the adjustment pattern formed on the child printed circuit board is provided in a non-formed portion of the child printed circuit board. The method for manufacturing an electronic device according to claim 1, wherein an oscillation circuit connected to the reference pattern is provided outside the parent printed circuit board by using, and the oscillation frequency of the oscillation circuit is measured by a digital frequency counter. The oscillation frequency of the circuit can be easily measured with a digital frequency counter, and the measured value that matches the actual use can be obtained. Door can be.

According to an eleventh aspect of the present invention, in the measuring step, the value of the inductance of the reference pattern of the printed circuit board is measured using a printed circuit board having a value larger than the value of the inductance formed on the child printed circuit board. In the method of manufacturing an electronic device according to item 10, since the inductance of the reference pattern is larger than the inductance of the child printed circuit board, the measurement error in the measurement process is reduced, and the measurement with less error can be easily performed.

According to a twelfth aspect of the present invention, in the measuring step, the reference pattern of the printed circuit board is measured using a printed circuit board having a zigzag shape. With the zigzag shape, a large inductance can be secured in a small area, and as a result, the measurement error in the measurement process is reduced, and the measurement with less error can be facilitated.

The invention according to claim 13 is the method of manufacturing an electronic device according to claim 10, wherein in the measuring step, the measurement is performed using a printed circuit board having a plurality of reference patterns provided at different positions on the parent printed circuit board. Since the reference patterns are provided at different positions, it is possible to more accurately measure the inductance of the child printed circuit board in the vicinity of each reference pattern in the measurement process. This measures the variation in etching due to the difference in the position of the child printed circuit boards connected in the parent printed circuit board, and makes the most suitable adjustment for each child printed circuit board.

According to a fourteenth aspect of the present invention, in the measuring step, the measurement is performed using a printed circuit board having contact lands at both ends of the reference pattern of the printed circuit board.
In the method for manufacturing an electronic device described in, it is possible to easily and surely make contact with the measuring device in the measuring step.

(Embodiment 1) Embodiment 1 of the present invention will be described below with reference to the drawings. FIG. 1 is a flowchart of a method for manufacturing an electronic device according to the first embodiment of the present invention. In FIG. 1, 21a is a printed board, and the printed board 21a becomes a printed board 21 by etching a copper foil in an etching step 22.

The printed board 21 has a structure as shown in FIG. That is, the printed board 21 forming the electronic device is a four-layer board. A circuit pattern 24 on which an electronic component 23 is mounted is provided on the surface 22 forming the first layer. The back surface 25 of the fourth layer is an earth pattern 26. The adjustment pattern 27 is provided on the third layer, and the adjustment pattern 27 is led out to the surface 22 through the through hole 28 and connected to the pattern 29.

Reference numeral 30 is a protection pattern provided on the second layer, which is provided corresponding to the adjustment pattern 27. Reference numeral 31 is a reference pattern having a correlation with the adjustment pattern 27.

The printed board 21 thus etched is then subjected to a measuring step 33 to measure the electrical characteristics of the reference pattern 31 having a correlation with the adjusting pattern 27.
The measurement of the electrical characteristics includes a method of measuring the electric resistance of the reference pattern 31 and a method of measuring the oscillation frequency of the reference pattern 31 by actually operating the oscillation circuit. This will be described in 5 and 6.

Based on the measurement result measured in the measuring step 33, the adjusting pattern 27 is adjusted (processed) in the next adjusting step 34. The adjustment process 34 is performed on the printed circuit board 21.
Trimming with a laser beam is performed from the back surface 25 side. In this laser trimming, as shown in FIG. 3, a part of the adjustment portion (vertical direction in FIG. 3) 27a of the adjustment pattern 27 formed in a ladder shape (various other shapes are conceivable) is cut 35. Then do. In addition, 29 is a through hole 28
The pattern 29 is derived on the front surface 22 in this manner, and this pattern 29 can also be used as an auxiliary adjustment pattern. That is, a part of the pattern 29 can be cut 36 by laser trimming and finely adjusted.

In this adjusting step 34, since the laser trimming is performed from the back surface 25 side of the printed board 21, the circuit pattern 24 formed on the front surface 22 is not damaged. Therefore, the circuit pattern 24 can be routed without worrying about trimming, which contributes to downsizing. Further, since the protection pattern 30 is provided between the adjustment pattern 27 and the surface 22, the circuit pattern 24 on the surface 22 can be more reliably protected from laser trimming. Also, the ground pattern 2 is formed on the entire back surface 25.
Since 6 is laid, it can be shielded from the outside. Since the pattern 29 is provided, it can be adjusted from the front surface 22 side.

By adjusting the adjusting pattern 27 in the adjusting step 34 in this manner, the printed circuit board 21 having substantially constant electric characteristics can be obtained.

After the adjusting step 34, a mounting step 38 for mounting the electronic component 23 is performed. At this time, since the adjusting pattern 27 is adjusted to a substantially constant value by the adjusting step 34, the number of constants of the electronic parts 37 to be used may be one and the parts management becomes easy. Further, the manufacturing process is simplified and the production efficiency is improved. Furthermore, management costs are also reduced.

The oscillation circuit shown in the conventional example (FIG. 12) is used as the electric circuit in the first embodiment. That is, the adjustment pattern 2 corresponds to the conventional example.
The inductor 10 corresponds to 7 and the capacitor 11 corresponds to the electronic component 23.

In this way, the printed circuit board 21 on which the electronic component 23 is mounted is stored 39 in the next step.

(Second Embodiment) Next, in a second embodiment, a reference pattern in a printed circuit board in which one printed circuit board includes a large number of child printed circuit boards will be described. FIG. 4 is a plan view of a printed circuit board 50 for explaining the second embodiment of the present invention. This printed circuit board 50 also has the same reference pattern and adjustment pattern as the printed circuit board 21 described in the first embodiment, and has the same manufacturing process as in the first embodiment.

In FIG. 4, reference numeral 51 denotes a parent printed board, and a plurality of child printed boards 52 are provided on the parent printed board 51. In the present embodiment, nine child printed circuit boards 52 are provided horizontally and twelve vertically, and 108 child printed circuit boards 52 can be obtained from one parent printed circuit board 51.

Reference numeral 53 is a hole used when mounting an electric component on the parent printed board 51. Further, in the child printed board 52, the resonance circuit 12 and the inductor 10 as an adjustment pattern as described in the section of the prior art are formed. Reference numeral 54 is a reference pattern, which is provided in the vicinity of the side surface of the parent printed board 51 and in the non-formed portion of the child printed board 52. Although the inductance of the reference pattern 54 depends on the oscillation frequency of the oscillator of the slave printed board 52, it is several times to several tens of times that of the inductor 10. Therefore, the measurement of the inductance of the inductor 10 can be made indirect indirectly by reducing the measurement error according to the present invention. Can be measured.

(Embodiment 3) The reference pattern 54 is shown in FIG.
Although it is provided at one place in the parent printed board 51, it may be provided at four places as shown in FIG. By doing so,
The reference pattern 54a provided on the surface facing the reference pattern 54 provided on the parent printed board 51a, or the reference pattern 54 provided on the surface adjacent to the reference pattern 54.
By providing the reference pattern 54c and the reference pattern 54c, the inductance in the child printed board 52a can be more accurately grasped.

The reference pattern 54 has a zigzag shape as shown in FIG. 5, and contact lands 55 are provided at both ends thereof. As a result, this contact land 55 can be easily connected to another external device, and the value of its inductance can be accurately measured. Further, since the shape is zigzag, a large inductance value can be obtained with a small area. In the present embodiment, the length is set to 5 cm, and the width of the pattern is made equal to the pattern width of the inductor as the adjustment pattern formed on the child printed board 52a.

(Embodiment 4) FIG. 7 shows an example in which a multilayer substrate 60 is used. In this case, a reference pattern 61 is provided in the inner layer of the parent printed board and in the non-formed portion of the child printed board. Contact holes 63 are provided on the upper surface of the multilayer substrate 60 through the holes 62. As a result, the size of the substrate can be reduced. Further, a component mounting land and a recognition pattern for dividing the substrate can be formed on the first layer.

(Fifth Embodiment) Hereinafter, fifth and sixth embodiments will be described.
Now, the measurement process for measuring the electrical characteristics of the reference pattern 54 will be described. In FIG. 8, a digital resistance meter 56 is connected to the contact land 55 of the parent printed board 51, and the resistance value of the reference pattern 54 is read by the digital resistance meter 56 to indirectly form on the child printed board 52. You can know the value of the inductance.

By measuring the reference pattern 54 in this manner, the inductance of the adjustment pattern in the subsidiary printed board 52 can be indirectly measured.
In this case, the reference pattern 54 of the parent printed board 51 is representatively measured once, so that the adjustment pattern of the same printed daughter board 52 can be dealt with.

(Sixth Embodiment) In the sixth embodiment,
The difference from the fifth embodiment is that the measurement is performed according to the actual operation. That is, in the sixth embodiment, FIG.
Is the oscillator circuit 5 on the contact land 55 of the parent printed board 51.
7 is connected, and a frequency counter 58 is connected to the output of the oscillation circuit 57. In this way, the value of the inductance of the reference pattern 54 is once converted into a frequency by the oscillation circuit 57, so that the oscillation frequency obtained from the inductance of the child printed circuit board 52 can be indirectly known.

[0048]

As described above, according to the present invention, the electrical characteristics of the reference pattern are measured with respect to the printed circuit board having the adjustment pattern and the reference pattern having a correlation with the adjustment pattern. An electronic device including a measurement step, an adjustment step of adjusting the adjustment pattern based on the measurement result in the measurement step after the measurement step, and a mounting step of mounting an electronic component on the printed circuit board after the adjustment step. This is a method of manufacturing a device, and even if the electrical characteristics of the pattern generated during etching of the printed board vary, the adjustment pattern of the printed board is adjusted before mounting the electronic parts so that the electrical characteristics are substantially the same. Therefore, the number of electronic components to be mounted may be one. Therefore, it becomes easy to manage the parts in the manufacture of the electronic device.

In addition, efficient production becomes possible. Furthermore,
Management costs can also be reduced.

[Brief description of drawings]

FIG. 1 is a flowchart of a method for manufacturing an electronic device according to a first embodiment of the present invention.

FIG. 2 is a sectional view of a printed circuit board used for manufacturing the electronic device.

FIG. 3 is a plan view of a reference pattern provided in the printed circuit board.

FIG. 4 is a plan view of a printed circuit board used in the second embodiment of the present invention.

FIG. 5 is a plan view of a reference pattern provided in the printed circuit board.

FIG. 6 is a plan view of a printed circuit board used in a third embodiment of the present invention.

FIG. 7 is a cross-sectional view of essential parts of a printed circuit board used in Embodiment 4 of the present invention.

FIG. 8 is a connection diagram of a printed circuit board measuring device used in a fifth embodiment of the present invention.

FIG. 9 is a connection diagram of a printed circuit board measuring device used in a sixth embodiment of the present invention.

FIG. 10 is a flowchart of a conventional method for manufacturing an electronic device.

FIG. 11 is a plan view of a printed circuit board used in a conventional manufacturing method.

FIG. 12 is a circuit diagram of an oscillator circuit formed on a conventional printed circuit board.

FIG. 13 is a plan view of an inductance as an adjustment pattern forming the oscillation circuit.

[Explanation of symbols]

21 Printed circuit board 23 Electronic components 27 adjustment patterns 31 Reference pattern 33 measurement process 34 Adjustment process 38 Installation process 56 Digital resistance meter 57 Oscillation circuit 58 frequency counter

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05K 3/46 H05K 3/46 Q W X F term (reference) 4E351 AA01 BB01 BB05 BB09 BB33 FF06 FF09 FF14 FF18 FF28 GG06 GG07 5E317 AA02 AA24 BB02 BB12 GG11 GG16 5E338 AA03 CC01 CC07 CD13 CD14 CD32 EE11 EE31 5E346 AA12 AA15 AA32 AA43 AA51 BB02 BB15 BB16 CC08 FF01 FF45 GG32 GG34 GG31 HH06 HH06

Claims (14)

[Claims] 1. A measuring step of measuring an electric characteristic of the reference pattern on a printed circuit board having an adjusting pattern and a reference pattern having a correlation with the adjusting pattern, and the measuring step after the measuring step. A method of manufacturing an electronic device, comprising: an adjusting step of adjusting the adjusting pattern based on a measurement result in the measuring step; and a mounting step of mounting an electronic component on the printed circuit board after the adjusting step. 2. The adjusting step has a circuit pattern on the front surface of which electronic components are mounted, a ground pattern provided on the back surface, and an adjustment pattern provided on an inner layer between the front surface and the back surface. The method of manufacturing an electronic device according to claim 1, wherein the adjustment pattern is adjusted by performing laser trimming from the back surface side of the printed board using the printed board. 3. The adjustment step according to claim 2, wherein the adjustment is performed by using a printed board having a protection pattern provided between the adjustment pattern and the surface in correspondence with the adjustment pattern as the printed board. Electronic device manufacturing method. 4. The adjusting step according to claim 2, wherein the adjustment pattern is provided as a printed board by being divided into an inner layer and a front surface of the printed board, and the printed board is connected with through holes between the adjustment patterns. Electronic device manufacturing method. 5. In the measuring step, as a printed board, a child printed board having a high-frequency circuit including an adjustment pattern, a parent printed board integrally formed by connecting a plurality of the child printed boards, and the parent printed board. Of the reference pattern using a printed circuit board in which a reference pattern having a correlation with the value of the inductance of the adjustment pattern formed on the child printed circuit board is provided in the non-formed portion of the child printed circuit board. The method for manufacturing an electronic device according to claim 1, wherein the resistance value of the device is measured by a digital resistance measuring device. 6. The electronic device according to claim 5, wherein in the measuring step, the value of the inductance of the reference pattern of the printed circuit board is measured using a printed circuit board having a value larger than the value of the inductance formed on the child printed circuit board. Manufacturing method. 7. The method of manufacturing an electronic device according to claim 6, wherein in the measuring step, the reference pattern of the printed board is measured using a printed board having a zigzag shape. 8. The method of manufacturing an electronic device according to claim 5, wherein in the measuring step, the measurement is performed using a printed board having a plurality of reference patterns provided at different positions on the parent printed board. 9. The method of manufacturing an electronic device according to claim 6, wherein in the measuring step, the printed board is provided with contact lands at both ends of the reference pattern of the printed board. 10. In the measuring step, as a printed board, a child printed board having a high-frequency circuit including an adjustment pattern, a parent printed board integrally formed by connecting a plurality of the child printed boards, and this parent printed board. Of the reference pattern using a printed circuit board in which a reference pattern having a correlation with the value of the inductance of the adjustment pattern formed on the child printed circuit board is provided in the non-formed portion of the child printed circuit board. 2. The method of manufacturing an electronic device according to claim 1, wherein the oscillation circuit connected to is provided outside the main printed board, and the oscillation frequency of the oscillation circuit is measured by a digital frequency counter. 11. The electronic device according to claim 10, wherein in the measuring step, the value of the inductance of the reference pattern of the printed circuit board is measured using a printed circuit board having a value larger than the value of the inductance formed on the child printed circuit board. Manufacturing method. 12. The method of manufacturing an electronic device according to claim 11, wherein in the measuring step, the reference pattern of the printed circuit board is measured using a printed circuit board having a zigzag shape. 13. The method of manufacturing an electronic device according to claim 10, wherein in the measuring step, the measurement is performed using a printed board having a plurality of reference patterns provided at different positions on the parent printed board. 14. The method of manufacturing an electronic device according to claim 11, wherein in the measuring step, the printed board is provided with contact lands at both ends of the reference pattern of the printed board.