JP2003250611A - Embroidery emblem and processing method therefor - Google Patents

Embroidery emblem and processing method therefor

Info

Publication number
JP2003250611A
JP2003250611A JP2002055683A JP2002055683A JP2003250611A JP 2003250611 A JP2003250611 A JP 2003250611A JP 2002055683 A JP2002055683 A JP 2002055683A JP 2002055683 A JP2002055683 A JP 2002055683A JP 2003250611 A JP2003250611 A JP 2003250611A
Authority
JP
Japan
Prior art keywords
embroidery
organdy
synthetic resin
resin board
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002055683A
Other languages
Japanese (ja)
Inventor
Toshifumi Nagai
敏文 永井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NAGAI SHISHU KK
Original Assignee
NAGAI SHISHU KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NAGAI SHISHU KK filed Critical NAGAI SHISHU KK
Priority to JP2002055683A priority Critical patent/JP2003250611A/en
Publication of JP2003250611A publication Critical patent/JP2003250611A/en
Pending legal-status Critical Current

Links

Abstract

<P>PROBLEM TO BE SOLVED: To efficiently produce a hollow embroidery emblem to be sewed up to babies' wear, children's wear, shoes, a cap or the like and to eliminate the necessity of dry cleaning a product after embroidery. <P>SOLUTION: The hollow embroidery emblem having a core material of organdy integrally provided therein is obtained through an embroidery process for performing an embroidery with a synthetic resin board meltable with an organic solvent being put over the organdy face; a separation process for cutting the excessive synthetic resin board except than the embroidery part formed in the embroidery process; a board melting process for bringing the embroidery part after the separation process into contact with the organic solvent together with the organdy and the internal synthetic board to melt and remove the synthetic resin board left in the embroidery part; and a heat cut process for heating and cutting the organdy along the peripheral edge of the embroidery part. <P>COPYRIGHT: (C)2003,JPO

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、ベビー服、子供服、
靴、帽子等に縫い付けて美観等の向上をはかるための刺
繍ワッペンに関するものである。
The present invention relates to baby clothes, children's clothes,
The present invention relates to an embroidery patch that is sewn on shoes, hats, etc. to improve the appearance.

【0002】[0002]

【従来の技術】ベビー服や子供服等には美観や興趣を向
上するための刺繍が施されていることが多い。最近は、
このような刺繍として、風趣に富んだいわゆる中空3D
刺繍が好んで採用される傾向がある。
2. Description of the Related Art Baby clothes, children's clothes, etc. are often embroidered to improve their aesthetics and interest. Nowadays,
As such embroidery, so-called hollow 3D rich in taste
Embroidery tends to be preferred.

【0003】[0003]

【発明が解決しようとする課題】このような中空刺繍の
加工方法として、平刺繍加工を施した布の上部にスチレ
ンボードを配置し、その上から直接立体刺繍加工を施す
方法が開発されている。この刺繍加工後は、柄(刺繍部
分)以外の余分なスチレンボードを剥し、公知のドライ
クリーニングを施してスチレンボードを溶解し、所望の
刺繍を完成するものである。
As a method for processing such hollow embroidery, a method has been developed in which a styrene board is arranged on the upper portion of a cloth that has been subjected to flat embroidery processing, and three-dimensional embroidery processing is performed directly on the styrene board. . After this embroidery processing, the excess styrene board other than the pattern (embroidery part) is peeled off, and known dry cleaning is performed to dissolve the styrene board to complete the desired embroidery.

【0004】しかしながら、この方法によると、子供服
等の製品に直接刺繍を施さねばならないので、刺繍のた
めの段取り作業が煩雑であり、しかも刺繍加工後に全体
をドライクリーニングしなければならないので、コスト
が高くなるという問題点があった。そこで本発明は、刺
繍を別途ワッペンの形で加工しておき、それを目的とす
る服等の製品に縫い付ける方式を採用することにより、
同時に多数の刺繍加工できるようにし、しかも、刺繍後
に製品をドライクリーニングしなくてもよいようにする
ことを課題としている。
However, according to this method, since products such as children's clothes must be directly embroidered, the setup work for embroidery is complicated, and the whole must be dry-cleaned after the embroidery process, which is costly. There was a problem that the cost was high. Therefore, according to the present invention, embroidery is separately processed in the form of a patch, and the method of sewing the embroidery to a product such as clothes for the purpose is adopted.
An object of the present invention is to enable a large number of embroidery processes at the same time and do not need to dry-clean the product after embroidery.

【0005】[0005]

【課題を解決するための手段】上記課題を解決するた
め、本発明は次のような構成を採用した。まず、請求項
1に記載の発明にかかる刺繍ワッペンは、内部にオーガ
ンディーの芯材が一体に設けられていることを特徴とし
ている。この刺繍ワッペンは、製品とは別個に加工され
るものであるから、能率的に製作することができ、衣服
等の任意の位置に簡単に取り付けることができる。しか
も所望のデザインの刺繍が施されたものでありながら、
内部にオーガンディーの芯材が一体に設けられているの
で、形崩れしにくく、取扱やすい。
In order to solve the above problems, the present invention employs the following configurations. First, the embroidery patch according to the invention described in claim 1 is characterized in that an organdy core material is integrally provided therein. Since this embroidery patch is processed separately from the product, it can be efficiently manufactured and can be easily attached to any position such as clothes. Moreover, while being embroidered with the desired design,
The organdy core is integrated inside, so it is easy to handle and keep its shape.

【0006】また、請求項2に記載の刺繍ワッペンの加
工方法は、オーガンディーの面上に有機溶剤で溶解する
合成樹脂ボードを重ねて刺繍をする刺繍工程と、該刺繍
工程で形成された刺繍部分以外の余計な合成樹脂ボード
を切り取る切り離し工程と、該切り離し工程を終えた刺
繍部分をオーガンディーごと有機溶剤に接触させて、刺
繍内部に残存する合成樹脂ボードを除去する除去工程
と、刺繍部分の外周縁に沿ってオーガンディーをヒート
カットするヒートカット工程とを経て所望形状の中空刺
繍ワッペンを得ることを特徴としている。合成樹脂ボー
ドとしては、スチレンボードを用いるのが好ましく、こ
れを溶解する有機溶剤としては、引火性のないパークロ
ルエチレンを使用するのが好ましい。
The embroidery patch processing method according to a second aspect of the present invention is an embroidery process in which a synthetic resin board that dissolves in an organic solvent is superposed on the surface of an organdy and embroidered, and the embroidery formed in the embroidery process. A step of cutting off the unnecessary synthetic resin board other than the part, a step of removing the synthetic resin board remaining inside the embroidery by bringing the embroidered part after the cutting step into contact with an organic solvent together with the organdy, and an embroidery part It is characterized in that a hollow embroidery patch having a desired shape is obtained through a heat cutting step of heat cutting the organdy along the outer peripheral edge of the. It is preferable to use styrene board as the synthetic resin board, and it is preferable to use non-flammable perchlorethylene as the organic solvent for dissolving the styrene board.

【0007】[0007]

【発明の実施の形態】以下、本発明の実施形態例につい
て具体的に説明する。図1は、本発明にかかる刺繍ワッ
ペンを例示するもので、このワッペン1(a,b)は、
公知の刺繍機械と刺繍糸を用いて加工されたもので、図
示例以外にも各種動物、文字、人間、器物、植物等、任
意の形状と色彩に形成することができる。刺繍ワッペン
1は、刺繍糸4で構成された外殻部分の内部に、図2に
模式的に示すようにオーガンディー2の芯材が含まれて
いる。オーガンディーは、薄い透明な張りのある平織布
であり、本発明で用いるものは、熱による切断が可能な
合成樹脂からなるもので、材質的には安価で入手しやす
い例えばポリエステルが好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be specifically described below. FIG. 1 illustrates an embroidery patch according to the present invention. This patch 1 (a, b) is
It is processed using a known embroidery machine and embroidery thread, and can be formed into any shape and color such as various animals, characters, humans, articles, plants, etc. other than the illustrated examples. The embroidery patch 1 includes the core material of the organdy 2 inside the outer shell portion formed of the embroidery thread 4, as schematically shown in FIG. Organdy is a thin transparent plain woven cloth, and the one used in the present invention is made of a synthetic resin that can be cut by heat, and is preferably inexpensive and easily available, for example, polyester.

【0008】このワッペン1は、つぎのようにして製作
することができる。まず、ある程度の広さを有するオー
ガンディー2と合成樹脂ボード3を用意し、台材(基
布)であるオーガンディー2上に合成樹脂ボード3を重
ね合わせる。合成樹脂ボードとしては、有機溶剤で溶解
可能なもので、例えばスチレンボードを用いるのが好ま
しい。
This patch 1 can be manufactured as follows. First, an organdie 2 and a synthetic resin board 3 having a certain size are prepared, and the synthetic resin board 3 is superposed on the organdy 2 which is a base material (base cloth). The synthetic resin board is one that can be dissolved in an organic solvent, and for example, a styrene board is preferably used.

【0009】上記オーガンディー2と合成樹脂ボード3
を重ね合わせたものの上から、公知の刺繍機械と刺繍糸
4を用いて所望デザインの刺繍を行う。図3の5は刺繍
部分を表す。刺繍糸は、オーガンディー2と合成樹脂ボ
ード3を繰り返し挿通した状態となる。
Organdy 2 and synthetic resin board 3
Embroidery of a desired design is performed on the superposed ones using a known embroidery machine and embroidery thread 4. Reference numeral 5 in FIG. 3 represents an embroidery portion. The embroidery thread is in a state in which the organdy 2 and the synthetic resin board 3 are repeatedly inserted.

【0010】この場合、オーガンディー2と合成樹脂ボ
ード3は、ある程度広いものを使用し、オーガンディー
と合成樹脂ボードを重ね合わせたものの上に互いに間隔
をおいて複数箇所に刺繍を行うのが好ましい。このよう
にすると、オーガンディー2と合成樹脂ボード3を取り
替えることなく、順次複数の刺繍を連続的に行うことが
できるので能率的である。図4はこの方法により、1枚
のオーガンディー2と合成樹脂ボード3上に多数の刺繍
部分5を並べて形成した例を表す。
In this case, it is preferable that the organdy 2 and the synthetic resin board 3 are wide to some extent, and embroidery is carried out at a plurality of positions on the superposed one of the organdy and the synthetic resin board at intervals. . This is efficient because it is possible to successively perform a plurality of embroidery without replacing the organdy 2 and the synthetic resin board 3. FIG. 4 shows an example in which a large number of embroidered portions 5 are formed side by side on one organdy 2 and a synthetic resin board 3 by this method.

【0011】オーガンディー2と合成樹脂ボード3を重
ね合わせたものの上に刺繍を施したら、つぎに刺繍部分
(刺繍パターン)5の外周にそって切り目を入れ、余分
な合成樹脂ボード3を鋏、カッター等の切断具で切り取
る。この場合の切り取りは、大まかでもよい。これによ
り、内部のみに合成樹脂ボードが残存する刺繍がオーガ
ンディー2上に並んでいる状態となる。
After embroidering on the superposed structure of the organdy 2 and the synthetic resin board 3, a cut is made along the outer periphery of the embroidery part (embroidery pattern) 5, and the extra synthetic resin board 3 is scissors. Cut off with a cutting tool such as a cutter. The cut in this case may be rough. As a result, the embroidery in which the synthetic resin board remains only inside is lined up on the organdy 2.

【0012】ついで、上記複数の刺繍が施されたオーガ
ンディー2に残存ボード溶解処理を施す。この処理は、
通常のドライクリーニングと同様な処理であり、有機溶
剤、例えばパークロルエチレンに上記加工物を曝すこと
により、刺繍内部に残存する合成樹脂ボードを溶解し除
去する工程である。この処理により、刺繍内部の合成樹
脂ボードが除去され、オーガンディーと刺繍糸のみが残
存することになる。
Then, the remaining board melting process is applied to the organdy 2 on which the plurality of embroidery patterns are applied. This process
The process is the same as the normal dry cleaning process, and is a process of dissolving and removing the synthetic resin board remaining inside the embroidery by exposing the processed product to an organic solvent such as perchlorethylene. By this process, the synthetic resin board inside the embroidery is removed, and only the organdy and the embroidery thread remain.

【0013】このように、合成樹脂ボードが除去された
ら、刺繍の外周縁に沿ってヒータの刃体を押し付け、オ
ーガンディーをヒートカット法で加熱切断する。これに
より、芯部にオーガンディー2が配された刺繍ワッペン
1が得られる。刺繍糸はオーガンディー2の表裏に繰り
返し挿通されているので、刺繍が台材となるオーガンデ
ィーにしっかりと固定されている。このオーガンディー
は、薄くて張りがあるので、刺繍の芯材として適切なも
のである。なお上記オーガンディーには、いわゆるオガ
ンザも含まれる。さらに、厳密な意味でのオーガンディ
ーに限らず、それほど目の詰んでいない適度の強度を有
する布を芯材として用いることができる。さらに、この
刺繍ワッペンは、内部に存在していた合成樹脂ボード3
を除去したものであるから、いわば中空状であり、特有
の風趣と立体感を有するものである。
After the synthetic resin board is removed in this way, the blade of the heater is pressed along the outer peripheral edge of the embroidery, and the organdy is heated and cut by the heat cutting method. As a result, the embroidery patch 1 having the organdy 2 on the core is obtained. Since the embroidery thread is repeatedly passed through the front and back of the organdy 2, the embroidery is firmly fixed to the organdy which is the base material. Since this organdy is thin and has tension, it is suitable as a core material for embroidery. The organdy includes so-called organza. Furthermore, not only the organdy in a strict sense, but also a cloth having an appropriate strength that is not so clogged can be used as the core material. Furthermore, this embroidery patch is a synthetic resin board 3 that was present inside.
Since it has been removed, it is so-called hollow and has a unique taste and three-dimensional effect.

【0014】この刺繍ワッペン1は、任意の布製品、例
えばベビー服、子供服、ジャケット、帽子、靴等に取り
付けて使用する。本発明では、これらの布製品に直接刺
繍を行うわけではなく、一旦刺繍部分のみをワッペンと
して製作し、これを所望の製品に縫い付けるものである
から、刺繍を能率的に行うことができる。しかも、刺繍
ワッペン取り付け後に全体をドライクリーニングする必
要がないので、コスト的にも好ましいものである。
The embroidery patch 1 is used by being attached to any cloth product such as baby clothes, children's clothes, jackets, hats, shoes and the like. In the present invention, these cloth products are not directly embroidered, but only the embroidery portion is once produced as a patch and sewn to a desired product, so that the embroidery can be efficiently performed. Moreover, since it is not necessary to dry-clean the whole body after attaching the embroidery patch, it is preferable in terms of cost.

【0015】[0015]

【発明の効果】以上の説明から明らかなように、本発明
によれば、いわゆる中空刺繍加工を能率的に行うことが
可能となった。
As is apparent from the above description, according to the present invention, so-called hollow embroidery processing can be efficiently performed.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の刺繍ワッペンを例示する外観図であ
る。
FIG. 1 is an external view illustrating an embroidery patch of the present invention.

【図2】刺繍ワッペンの模式的断面図である。FIG. 2 is a schematic cross-sectional view of an embroidery patch.

【図3】刺繍部分の断面図である。FIG. 3 is a cross-sectional view of an embroidery portion.

【図4】複数の刺繍を施す場合の平面図である。FIG. 4 is a plan view when a plurality of embroidery patterns are applied.

【符号の説明】[Explanation of symbols]

1 刺繍ワッペン 2 オーガンディー 3 合成樹脂ボード 4 刺繍糸 5 刺繍部分 1 Embroidery patch 2 organdy 3 synthetic resin board 4 embroidery thread 5 Embroidery part

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 内部にオーガンディーの芯材が一体に設
けられていることを特徴とする刺繍ワッペン。
1. An embroidery patch in which an organdy core material is integrally provided inside.
【請求項2】 オーガンディーの面上に有機溶剤で溶解
する合成樹脂ボードを重ねて刺繍をする刺繍工程と、該
刺繍工程で形成された刺繍部分以外の余計な合成樹脂ボ
ードを切り取る切り離し工程と、該切り離し工程を終え
た刺繍部分をオーガンディー及び内部の合成樹脂ボード
ごと有機溶剤に接触させて、刺繍内部に残存する合成樹
脂ボードを溶解除去するボード溶解工程と、刺繍部分の
外周縁に沿ってオーガンディーを加熱切断するヒートカ
ット工程とを経て所望形状の中空刺繍ワッペンを得るこ
とを特徴とする刺繍ワッペンの加工方法。
2. An embroidery step of embedding a synthetic resin board that dissolves in an organic solvent on the surface of an organdie and embroidering, and a step of cutting off an unnecessary synthetic resin board other than the embroidery portion formed in the embroidery step. , A board melting step of dissolving and removing the synthetic resin board remaining inside the embroidery by bringing the embroidery part, which has completed the separating step, into contact with an organic solvent together with the organic resin board and the synthetic resin board inside, and along the outer peripheral edge of the embroidery part A method for processing an embroidery patch, wherein a hollow embroidery patch having a desired shape is obtained through a heat cutting step of heating and cutting the organdy.
【請求項3】 オーガンディーの材質がポリエステルで
ある請求項2に記載の刺繍ワッペンの加工方法。
3. The embroidery patch processing method according to claim 2, wherein the material of the organdy is polyester.
【請求項4】 合成樹脂ボードがスチレンボードである
請求項2に記載の刺繍ワッペンの加工方法。
4. The method for processing an embroidery patch according to claim 2, wherein the synthetic resin board is a styrene board.
【請求項5】 有機溶剤がパークロルエチレンである請
求項2又は3に記載の刺繍ワッペンの加工方法。
5. The embroidery patch processing method according to claim 2, wherein the organic solvent is perchlorethylene.
JP2002055683A 2002-03-01 2002-03-01 Embroidery emblem and processing method therefor Pending JP2003250611A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002055683A JP2003250611A (en) 2002-03-01 2002-03-01 Embroidery emblem and processing method therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002055683A JP2003250611A (en) 2002-03-01 2002-03-01 Embroidery emblem and processing method therefor

Publications (1)

Publication Number Publication Date
JP2003250611A true JP2003250611A (en) 2003-09-09

Family

ID=28666460

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002055683A Pending JP2003250611A (en) 2002-03-01 2002-03-01 Embroidery emblem and processing method therefor

Country Status (1)

Country Link
JP (1) JP2003250611A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103820959A (en) * 2014-02-25 2014-05-28 苏州市叶绣工艺厂 Embroidery product's stain processing method
WO2015033934A1 (en) 2013-09-09 2015-03-12 エヌエスディ株式会社 Sewing machine
CN110284277A (en) * 2019-06-24 2019-09-27 昆明市长青民族工艺品有限公司 Fabrics hollow out copper coin spends production method

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015033934A1 (en) 2013-09-09 2015-03-12 エヌエスディ株式会社 Sewing machine
US10100450B2 (en) 2013-09-09 2018-10-16 Nsd Corporation Sewing machine
CN103820959A (en) * 2014-02-25 2014-05-28 苏州市叶绣工艺厂 Embroidery product's stain processing method
CN110284277A (en) * 2019-06-24 2019-09-27 昆明市长青民族工艺品有限公司 Fabrics hollow out copper coin spends production method
CN110284277B (en) * 2019-06-24 2021-06-25 昆明市长青民族工艺品有限公司 Method for making hollow copper coin with cloth art

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