JP2003248213A - Liquid crystal device and method for manufacturing the same and projection display device and electronic appliance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal device which is excellent in light and heat resistance and in which the liquid crystal and the alignment layer are prevented from being deteriorated by attaining efficient cooling of the device in the liquid crystal device using a substrate with low thermal conductivity such as a glass or quartz substrate or the like and to provide a projection display device and an electronic appliance. <P>SOLUTION: The liquid crystal device comprises a liquid crystal layer 11 sandwiched between upper and lower substrates 10, 20 placed opposite to each other and is characterized by having heat dissipation layers 15, 25 in contact with alignment layers 17, 24 or the liquid crystal layer 11 formed on at least one inside surface side of the upper or lower substrates 10, 20. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal device, a method of manufacturing a substrate for a liquid crystal device, and an electronic device, and more particularly, a liquid crystal device having high light resistance and high reliability suitable for use as a light valve of a liquid crystal projector. And a projection type display device and electronic equipment using the same.

[0002]

2. Description of the Related Art As a liquid crystal device, for example, a liquid crystal is sealed between two transparent substrates, and a thin film transistor (TFT) which constitutes one substrate.
(Hereinafter, abbreviated as ") an array substrate and a counter substrate which is the other substrate and is opposed to the array substrate. In such a liquid crystal device, a plurality of scanning lines and a plurality of data lines intersecting the scanning lines are arranged in a grid pattern on the TFT array substrate, and the scanning lines intersect the data lines. Pixel switching TFTs are provided corresponding to the parts. Further, a pixel electrode is formed in a region surrounded by these scanning lines and data lines, and an alignment film having an organic film such as polyimide formed on the pixel electrode and having a surface subjected to an alignment treatment by a rubbing treatment is formed. The liquid crystal molecules are arranged in a predetermined direction on the substrate by such an alignment film.

[0003]

However, the alignment film composed of such an organic film such as a polyimide film is used in the application of a large amount of light such as a light valve of a liquid crystal projector. As a result, the alignment control force of the liquid crystal molecules by the alignment film is reduced and the alignment state of the liquid crystal molecules is disturbed, and when the liquid crystal device is used as a display device, a display defect such as a decrease in contrast ratio occurs. There is. Further, the deterioration of the alignment film due to the photoreaction is accelerated as the heating is increased, and the life of the liquid crystal device is further shortened. Further, a transmissive liquid crystal device used in a liquid crystal projector or the like uses a material having a low thermal conductivity such as glass or quartz as a substrate, and thus is difficult to cool, and the liquid crystal and the alignment film are likely to deteriorate. Therefore, in order to supplement the cooling performance of the liquid crystal device, a cooling fan and a metal frame having high thermal conductivity are provided, but the cooling efficiency is limited to the glass (quartz) substrate having low thermal conductivity. Therefore, it is hard to say that a sufficient effect is obtained. Further, a sapphire substrate has been proposed as a substrate of a liquid crystal device in order to enhance the effects of a cooling fan and a metal frame, but the material cost increases and it is extremely difficult to manufacture a large sapphire substrate. Therefore, the increase of process cost is inevitable, so it is not a realistic solution.

The present invention has been made in view of the above circumstances, and enables efficient cooling of a liquid crystal device using a substrate having a low thermal conductivity, such as glass or quartz, and thus a liquid crystal. It is an object of the present invention to provide a liquid crystal device which is excellent in light resistance and heat resistance and which can suppress deterioration of the alignment film and the alignment film. Another object of the present invention is to provide a projection type display device and an electronic device which are equipped with the above liquid crystal device and are excellent in reliability.

[0005]

In order to solve the above-mentioned problems, a liquid crystal device according to the present invention is a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates arranged to face each other, A heat dissipation layer in contact with the alignment film or the liquid crystal layer is formed on the inner surface side of at least one of the pair of substrates. In the conventional liquid crystal device, since the cooling by the cooling fan or the heat sink is limited by the glass substrate having a low thermal conductivity, the alignment film and the liquid crystal layer built in the liquid crystal device cannot be efficiently cooled. According to the configuration of the present invention, since the heat dissipation layer is in contact with the liquid crystal layer or the alignment film, these heats can be extracted to the outside through the heat dissipation layer, and are rate-controlled by the glass substrate having low thermal conductivity. It is possible to cool the alignment film and the liquid crystal layer without having to do so. Therefore, according to the liquid crystal device having such a configuration, since the heat dissipation layer is formed so as to be in contact with the alignment film or the liquid crystal layer, which is likely to be deteriorated by the irradiation of light and the heating accompanying it, deterioration of the alignment film and the liquid crystal layer is caused. Can be effectively prevented, and excellent light resistance and heat resistance can be obtained. Further, in a liquid crystal device having a TFT element or the like as a pixel switching means, heat generated from the TFT element can be diffused through the heat dissipation layer, which is also effective in preventing malfunction due to overheating of the element.

Next, in the liquid crystal device according to the present invention,
The heat dissipation layer is diamond or diamond-like car
Materials containing bon and hydrogenated diamond-like carbon
It is preferable that Materials that make up these heat dissipation layers
The material can form an insulating transparent thin film, and
Since it has excellent thermal conductivity, it can be used for alignment films, liquid crystal layers, switch
It is possible to efficiently dissipate the heat of the switching element and the like. Well
In addition, a resin film such as an alignment film or a transparent film such as ITO that constitutes an electrode.
Bright conductive film or SiO forming the interlayer insulating film ₂Membrane etc.
It is possible to easily and uniformly form a film on the surface of
Therefore, there is no manufacturing difficulty and the liquid crystal device can be easily
The light resistance and heat resistance can be improved. Also, the release
Since the thermal layer is transparent, it covers the entire surface of the pixel electrode of the liquid crystal device.
Can be formed on the alignment film on the pixel electrode or the liquid crystal layer.
The heat can be efficiently dissipated. Furthermore, liquid crystal
Inert with the layer, causing deterioration of the liquid crystal layer
Nor.

Next, the liquid crystal device according to the present invention is characterized in that the heat dissipation layer has an alignment function for aligning the liquid crystal in a predetermined direction. According to the liquid crystal device having such a configuration, since it is possible to control the alignment of the liquid crystal by the heat dissipation layer, it is not necessary to separately provide an alignment film, so that the alignment function is deteriorated by light irradiation and the liquid crystal alignment is disturbed accordingly. Cannot occur. Therefore, a liquid crystal device having extremely excellent light resistance and heat resistance can be realized.

Next, in the liquid crystal device according to the present invention,
The orientation function of the heat dissipation layer may be imparted by rubbing the surface of the heat dissipation layer. Further, in the liquid crystal device according to the present invention, the alignment function of the heat dissipation layer may be imparted by irradiating the surface of the heat dissipation layer with a particle beam. In any of the liquid crystal devices according to the present invention having any of the above configurations, the liquid crystal device can be configured without the alignment film, because the alignment of the liquid crystal can be well controlled by the heat dissipation layer provided with the alignment function. For example, when the heat dissipation layer is formed of diamond-like carbon, the surface of the heat dissipation layer can be rubbed to provide the heat dissipation layer with an orientation function due to a shape effect, and if particle beam irradiation is performed, It becomes possible to orient the liquid crystal by interacting with the liquid crystal by partially breaking the carbon bond in the irradiated portion.

Next, in the liquid crystal device according to the present invention,
The heat dissipation layer may be formed on the alignment film.
According to the liquid crystal device having such a configuration, since the heat dissipation layer is disposed between the alignment film and the liquid crystal layer, the heat of the alignment film and the liquid crystal layer can be diffused very efficiently. Further, if the conventional alignment film deteriorates, the components of the electrode below the alignment film may diffuse into the liquid crystal layer and cause deterioration of the liquid crystal layer.However, according to this configuration, a heat dissipation layer is formed on the alignment film. Therefore, deterioration of the alignment film is unlikely to occur, and diffusion of electrode components is also blocked by the heat dissipation layer, so that deterioration of the liquid crystal layer is extremely unlikely to occur, and a highly reliable liquid crystal device can be obtained.

Next, in the liquid crystal device according to the present invention,
The heat dissipation layer may be formed below the alignment film. According to such a configuration, since the heat dissipation layer is formed on the lower side of the alignment film, only the step of forming the heat dissipation layer before forming the alignment film in the manufacturing process is provided, and other manufacturing processes are not performed conventionally. A liquid crystal device that can be manufactured by the same process as described above. Therefore, the liquid crystal device having this structure is excellent in light resistance and heat resistance, is easy to manufacture, and can improve reliability while suppressing an increase in manufacturing cost. In the above configuration, the liquid crystal layer and the heat dissipation layer are in contact with each other. For example, when diamond-like carbon is used for the heat dissipation layer and an alignment film that aligns the liquid crystal by the surface shape effect is used, it is formed as the heat dissipation layer. The thickness of diamond-like carbon is 5n
Since the thickness can be reduced to about m, the surface shape of the alignment film arranged on the lower side is not flattened, and the liquid crystal can be favorably aligned.

Next, in the liquid crystal device according to the present invention,
The alignment film may be an inorganic alignment film. According to this structure, since the alignment film is an inorganic alignment film, the alignment film has excellent light resistance and heat resistance as compared with, for example, an organic film, and the alignment regulating force of liquid crystal molecules is sufficiently secured. The inorganic alignment film may include a columnar structure inclined by a predetermined angle with respect to the substrate surface. In this case, the liquid crystal molecules are aligned due to the surface shape effect of the columnar structure, but the inorganic alignment film containing such a columnar structure can be obtained by the oblique vapor deposition method using SiO.

Next, in the liquid crystal device according to the present invention,
The heat dissipation layer may also serve as an interlayer insulating film for insulating any layer formed on the inner surface side of the pair of substrates. According to the liquid crystal device having such a configuration, since the heat dissipation layer also serves as the interlayer insulating film, the number of steps is not increased, and the steps are not significantly changed. Therefore, the manufacturing is easy. In addition, it is possible to provide a liquid crystal device having a structure similar to that of the conventional one, but having excellent heat dissipation and reliability. For example, in a liquid crystal device including a TFT element, if the interlayer insulating film in contact with the alignment film also serves as a heat dissipation layer, the effect of diffusing the heat of the alignment film can be obtained, and the heat dissipation layer can be located near the TFT element. Thus, the diffusion efficiency of the heat generated from the TFT element can be improved.

Next, in the liquid crystal device according to the present invention,
It is preferable that the heat dissipation layer includes a connecting portion for connecting to an external cooling means. With such a configuration, the heat dissipation layer can be connected to the external cooling means via the connection portion, so that the heat dissipation layer can be directly cooled, and the cooling efficiency of the alignment film and the liquid crystal layer can be further improved.

Next, in the liquid crystal device of the present invention,
A sealing material for radiating the heat of the heat dissipation layer to the outside may be connected to the connecting portion. According to such a configuration, the sealing material serves as a heat dissipation member and diffuses the heat of the heat dissipation layer, so that the heat diffusion efficiency can be further enhanced. Further, since the sealing material has a larger volume than the heat dissipation layer, it can also serve as a connecting portion to an external cooling means.

Next, in the liquid crystal device according to the present invention,
The encapsulant is along the peripheral edge or the peripheral edge of the substrate,
It is preferably formed so as to surround the substrate.
According to such a configuration, since the sealing material is arranged so as to surround the liquid crystal layer, it becomes possible to more efficiently take out heat from the inside of the liquid crystal device to the outside through the heat dissipation layer.

Next, in the liquid crystal device according to the present invention,
The heat dissipation layer may be connected to at least one of the metal wiring or the metal film formed on the both substrates, and may be configured to perform heat dissipation to the outside in cooperation with the metal wiring or the metal film. . With such a configuration, heat inside the liquid crystal device can be diffused to the outside through the metal wiring or the metal film extending from the inside of the liquid crystal device to the outside. The metal wiring and the metal film are connected to, for example, a metal light-shielding layer formed on the substrate in a stripe shape or a lattice shape in a plan view, a frame surrounding the display area of the liquid crystal device, and a switching element provided in the pixel. Various metal wirings to be used can be cited. An external cooling means may be connected to these metal wirings and metal films.

Next, a method of manufacturing a liquid crystal device according to the present invention is a method of manufacturing a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates arranged so as to face each other. On at least one inner surface side, a step of forming a heat dissipation layer in contact with the liquid crystal layer, a step of subjecting the surface of the heat dissipation layer to a rubbing treatment to impart an alignment function to the heat dissipation layer,
It is characterized by including. Alternatively, a method of manufacturing a liquid crystal device according to the present invention is a method of manufacturing a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates arranged to face each other, and at least one of the pair of substrates is A configuration including a step of forming a heat dissipation layer in contact with the liquid crystal layer on the inner surface side and a step of irradiating the surface of the heat dissipation layer with a particle beam to provide an alignment function to the heat dissipation layer can also be applied. .

According to the method of manufacturing a liquid crystal device of the present invention, the surface of the heat dissipation layer formed at a position in contact with the liquid crystal layer is rubbed, or the surface of the heat dissipation layer is irradiated with a particle beam. By providing the heat dissipation layer with an alignment function of aligning the liquid crystal in a predetermined direction, it is possible to manufacture a liquid crystal device having a heat dissipation layer that also functions as an alignment film.
Therefore, according to the manufacturing method of the present invention, since it is not necessary to provide an alignment film having relatively low resistance to light and heat, a liquid crystal device having excellent reliability can be obtained without significantly changing the conventional manufacturing process. It can be manufactured.

Next, a projection type display device according to the present invention is a projection type display device equipped with the liquid crystal device according to any one of the above, wherein the light source and the light emitted from the light source are modulated. A liquid crystal device and a magnifying projection optical system for magnifying and projecting the light modulated by the liquid crystal device onto a projection surface are featured. The liquid crystal device according to the present invention is suitable for use in a projection display device. That is, since the heat dissipation layer in contact with the alignment film or the liquid crystal layer is provided, heat can be efficiently diffused from the alignment film and the liquid crystal layer, and thus deterioration of the alignment film and the liquid crystal layer can be prevented, which is excellent in reliability. By using such a liquid crystal device, it is possible to provide a projection type display device having excellent reliability.

Next, an electronic apparatus according to the present invention is equipped with any one of the above liquid crystal devices. According to such a configuration, since the liquid crystal device having excellent reliability is provided, the electronic device can be provided with the highly reliable display unit.

[0021]

1 is a plan configuration diagram of an active matrix type liquid crystal device which is an embodiment of the present invention, and FIG. 2 is a sectional configuration diagram taken along line HH of FIG. is there. In the liquid crystal device shown in these drawings, a liquid crystal layer 11 is sandwiched between an upper substrate 10 and a lower substrate 20 which are arranged to face each other, and the liquid crystal layer 11 extends along the inner surface of the peripheral portions of the upper and lower substrates 10 and 20. Sealing material 14 provided in a substantially frame shape in plan view
And a sealing material 16 that seals the liquid crystal injecting portion 14a provided in the sealing material 14, and is configured. A light shielding film 13 as a frame is provided inside the sealing material 14 along the inside of the sealing material 14, and an area surrounded by the light shielding film 13 is a display area of the present liquid crystal device. Although illustration is omitted, a plurality of pixels are formed in a matrix in a display region of one substrate of the liquid crystal device of the present embodiment, a pixel electrode is provided for each pixel, and a switching element connected to the pixel electrode. , And metal wiring connected to the switching element, and the alignment film is provided so as to cover them. Also,
A counter electrode is provided on the other substrate, and the alignment film is provided so as to cover the counter electrode. Moreover, as shown in FIG. 1, a plurality of connection terminals 2 are provided on the upper surface side of the lower substrate 20.
2 is formed, and the metal wiring connected to the connection terminal 22 is connected to the electrode in the display area. A drive circuit for driving and controlling the electrode may be provided in a region of the lower substrate 20 outside the sealing material 14. In this case, the drive circuit and the electrode are electrically connected to each other, and the connection terminal 22 is provided. And the drive circuit are connected.

Next, as shown in the sectional view of FIG. 2, an alignment film 17 and a heat dissipation layer 15 are sequentially formed on the entire inner surface of the upper substrate 10 from the upper substrate 10 side, and the entire inner surface of the lower substrate 20 is formed. Further, the alignment film 24 and the heat dissipation layer 25 are sequentially formed from the lower substrate 20 side. Therefore, in the liquid crystal device of this embodiment, the heat dissipation layers 15 and 25 are in contact with the liquid crystal layer 11 on the surface side and are in contact with the alignment films 17 and 24 on the lower side.
Although not shown, in the display regions of the upper substrate 10 and the lower substrate 20 (regions surrounded by the light shielding film 13), liquid crystal molecules of the liquid crystal layer 11 are driven in addition to the heat dissipation layers 15 and 25. Is formed at least. In this way, the heat dissipation layer 1 is provided at a position in contact with the liquid crystal layer 11 and the alignment films 17, 24.
Since the liquid crystal devices 5 and 25 are provided, the heat of the liquid crystal layer 11 and the alignment films 17 and 24 can be efficiently diffused through the heat dissipation layers 15 and 25 in the liquid crystal device of the present embodiment.

Here, FIG. 3 is an explanatory view showing an enlarged cross-sectional structure of the central portion of the pixel on the lower substrate 20 side of the liquid crystal device shown in FIG. As shown in FIG.
An electrode 26 made of a transparent conductive film such as TO is formed, and an alignment film 24 made of a columnar structure such as silicon oxide is formed on the electrode 26. The heat dissipation layer 2 is formed on the surface of the alignment film 24.
5 is deposited. The heat dissipation layer 25 is the liquid crystal 1
It is in contact with the liquid crystal layer 11 made of 1a. Although the structure is simplified in FIG. 3, the alignment film 24 and the substrate 2 are actually shown.
In addition to the electrode 26, a constituent member of the liquid crystal device such as an interlayer insulating film may be provided between the electrode and 0. Further, the alignment film 17 and the heat dissipation layer 15 on the upper substrate 10 side also have substantially the same configuration as the alignment film and the heat dissipation layer shown in FIG. In FIG. 3, the alignment film 24 is formed by arranging an inorganic material such as silicon oxide at a predetermined angle on the lower substrate 20 on which the electrodes 26 and the like have been formed by using a predetermined vapor deposition apparatus. The columnar structure is formed by the oblique vapor deposition method. The alignment film 24 is an alignment film having a function of aligning the liquid crystal due to the surface shape effect on the liquid crystal layer 11 side, and the heat dissipation layer 25 is sufficiently thin so as to extend along the surface of the alignment film 24 as shown in FIG. Since the heat dissipation layer 25 does not impair the surface shape of the alignment film 24, the liquid crystal 11a can be favorably aligned. In other words, the heat dissipation layer 25 according to the present embodiment has an alignment function of aligning the liquid crystal 11a due to its surface shape effect.

An upper substrate 10 and a lower substrate 20 shown in FIGS.
Is a glass substrate or a quartz substrate, and the upper substrate 10 is
A substrate that is slightly smaller than the lower substrate 20 and has substantially the same contour as the sealing material 14 provided on the lower substrate 20 is used, and is fixed to the lower substrate 20 by the sealing material 14.
A molding material (sealing material) 30 such as a silicone resin is formed so as to surround the sealing material 14. In the cross-sectional view shown in FIG. 2, the molding material 30 includes a part of the side end surface 10 a of the upper substrate 10 and the sealing material 14.
Is formed so as to cover the outer peripheral surface and a part of the upper surface portion 25a of the lower substrate 20 from the outside. Therefore, the molding material 3
0 is connected to the heat dissipation layer 15 of the upper substrate 10 and the heat dissipation layer 25 of the lower substrate 20. Therefore, as described above, the heat dissipation layers 15 and 25 are formed at the positions in contact with the liquid crystal layer 11 and the alignment films 17 and 24, and are formed to extend to the outside of the sealing material 14, and at the outer peripheral side of the sealing material 14. Since it is connected to the molding material 30 that surrounds the
The heat of the liquid crystal layer 11 and the alignment films 17 and 24 is absorbed by the heat dissipation layer 15,
It is diffused to the molding material 30 side through 25. In this way, the liquid crystal device of the present embodiment has the upper and lower substrates 10, 20.
Since the heat inside can be efficiently radiated to the outside, it is possible to cool the alignment film and the liquid crystal layer having relatively low heat resistance without being limited by the upper and lower substrates 10 and 20 having low thermal conductivity. You can do it. Therefore, the liquid crystal device according to the present embodiment can obtain high reliability without deterioration of the alignment film and the liquid crystal layer due to light irradiation or heating even in applications where a large amount of light is irradiated such as a light valve of a liquid crystal projector. You can

In the liquid crystal device shown in FIGS. 1 and 2, the upper and lower substrates 1
By forming the heat dissipation layers 15 and 25 on the entire inner surface of 0 and 20 and connecting to the molding material 30 outside the sealing material 14,
Although the heat of the heat dissipation layers 15 and 25 is released to the outside,
The heat dissipation layers 15 and 25 may be formed only in the display area (or in the area surrounded by the sealing material 14). In this case, it is preferable to use metal wiring formed in the liquid crystal device as a means for radiating the heat of the heat dissipation layers 15 and 25 to the outside. That is, in the liquid crystal device, since the metal wiring that electrically connects the electrode in the display area to the external drive circuit or the connection terminal is formed, by forming the heat dissipation layer at the position in contact with the metal wiring, The heat of the heat dissipation layer inside the sealing material 14 can be released to the outside.

The light-shielding film 13 shown in FIG. 1 is formed on the inner surface side (the orientation film 17 side) of the upper substrate 20 in the sectional view shown in FIG. 2, and is made of a chromium metal film or a laminated aluminum / chrome film. The film and the chromium oxide are laminated. The light shielding film 13 made of this metal film may be formed so as to extend to the outside of the sealing material 14 shown in FIG. 1. With such a configuration, the heat dissipation layer 15 on the alignment film 17 and the display region. Since the connection can be easily made outside the heat dissipation layer 15, the heat dissipation layer 15 and the light shielding film 13 cooperate to efficiently radiate the heat of the liquid crystal device to the molding material 30.
Furthermore, the light-shielding film 13 may be connected to the metal wiring formed in a lattice shape or a stripe shape between the pixels in the display area. The metal wiring functions as a light-shielding film of a switching element formed around the pixel. The metal wiring provided in such a display region and the light shielding film 13 are connected to each other, and further, the light shielding film 13 and the heat dissipation layer 15 are connected to each other, so that the heat in the display region is shielded from the heat.
In addition, the liquid crystal device can be discharged to the outside through the heat dissipation layer 15, and a liquid crystal device having excellent heat resistance and light resistance can be realized. In addition, the metal wiring in the above-mentioned display area is the sealing material 1
4 may be formed so as to extend to the outside of 4 and the same effect as in the case where the light shielding layer 13 and the heat dissipation layer 15 are connected by connecting the extension portion of the metal wiring to the heat dissipation layer 15. Can be obtained.

In the liquid crystal device according to the present invention, the heat dissipation layers 15 and 25 are preferably made of a material capable of forming a transparent and insulative thin film such as diamond, diamond-like carbon or hydrogenated diamond-like carbon. In particular, it is preferable to use a material including a diamond-like carbon film or a hydrogenated diamond-like carbon film, which is excellent in terms of adhesion with polyimide or silicon oxide forming the alignment film, and reactivity with liquid crystal, as the heat dissipation layer. If the thickness of the heat dissipation layers 15 and 25 is too thin, a sufficient heat dissipation effect cannot be obtained, and if the thickness is too thick, the transmittance of the heat dissipation layer is reduced and the transmittance of the liquid crystal device is reduced. It is not a thing, but it is preferable to set it in the range of 5 nm to 30 nm. The heat dissipation layers 15 and 25 may be formed of a conductive thin film, but they can be formed because it is necessary to prevent malfunction of the elements formed on the inner surface of the substrate due to the heat dissipation layer. Since it is difficult to obtain the heat dissipation effect due to the limited area, it is preferable to use an insulating thin film.

In the liquid crystal device according to the present embodiment shown in FIGS. 1 and 2, the heat dissipation layers 15 and 25 are provided on the alignment films 17 and 24, respectively. If it is formed at a position in contact with the film or the liquid crystal layer, a high heat diffusion effect can be obtained, and further,
The heat dissipation layer may also serve as the alignment film.

FIG. 4 is a diagram showing a partial cross-sectional structure of the liquid crystal device when an alignment film is provided on the heat dissipation layer. In the liquid crystal device shown in this figure, an electrode 26 is formed on the lower substrate 20, a heat dissipation layer 25A is formed on the electrode 26, and an alignment film 24A containing a columnar structure is formed on the heat dissipation layer 25A. There is. That is, the liquid crystal device shown in FIGS. 2 and 3 has the same configuration except that the positions of the heat dissipation layer and the alignment film are exchanged, and the heat dissipation layer 25A and the alignment film 24A are the same as those of FIG.
The same as those shown in can be used. In such a configuration, the heat dissipation layer 25A is in contact with only the alignment film 24A, but the thickness of the alignment film 24A is 10 to 10.
The heat dissipation layer 2 has an extremely thin thickness of about 50 nm, and the columnar structures are formed with a gap (not shown).
5A can also effectively diffuse the heat of the liquid crystal layer 11. When the alignment film 24A is formed on the heat dissipation layer 25A as described above, the alignment film 24A made of the above-mentioned inorganic material is used.
Instead of this, an alignment film made of an organic material such as polyimide can also be applied. As described above, the heat dissipation layer according to the present invention is
Because it is composed of diamond-like carbon film,
Since the alignment film of the organic material can be well adhered and can be uniformly formed on the heat dissipation layer, the function of the alignment film does not deteriorate due to the heat dissipation layer provided under the organic material. . Further, since the alignment film made of an organic material is also made to have a thickness of about several tens of nm, the heat radiation property is not deteriorated due to the formation of the alignment film on the heat radiation layer.

Further, in the liquid crystal device according to the present invention, a heat dissipation layer having a function of aligning liquid crystals can be applied as the heat dissipation layer. With such a configuration, the liquid crystal can be aligned without providing an alignment film, the ease of production can be enhanced, and the production cost can be reduced. Also,
Conventionally, since it is not necessary to provide an alignment film which is relatively inferior in light resistance and heat resistance, the light resistance and heat resistance of the liquid crystal device can be further enhanced. Here, FIG. 8 and FIG. 9 are cross-sectional process drawings showing a process of imparting the above-mentioned orientation function to the heat dissipation layer.
8 and 9, reference numeral 20 is a lower substrate and reference numeral 25B.
Is a heat dissipation layer formed on the innermost uppermost layer of the lower substrate 20 (that is, the layer in contact with the liquid crystal layer when the liquid crystal device is configured). Further, in each of these drawings, each layer such as an electrode formed between the heat dissipation layer 25B and the lower substrate 20 is omitted for simplicity of explanation.

As shown in FIG. 8, the surface of the heat dissipation layer 25B is rubbed by a roller 50 provided with a rubbing cloth in a predetermined direction, or as shown in FIG. The above-mentioned orientation function can be imparted to the heat dissipation layer 25B by the method of irradiating the surface of the heat dissipation layer 25B with these particles. In the former case,
Since many fine grooves extending in a predetermined direction are formed on the surface of the heat dissipation layer 25B, the liquid crystal can be aligned by the surface shape effect of the heat dissipation layer 25B. Further, in the latter case, the bonds between the elements on the surface of the heat dissipation layer 25B are partially broken by the particle irradiation, so that an intermolecular interaction between the elements on the surface of the heat dissipation layer 25B and the liquid crystal causes the liquid crystal to be removed. It can be oriented.

In the liquid crystal device of this embodiment, the heat dissipation layer can be connected to an external cooling means in order to further enhance the heat dissipation effect of the heat dissipation layer. 5 is a cross-sectional configuration diagram in the case where the liquid crystal device shown in FIGS. 1 and 2 is provided with a metal frame as an external cooling means. Corresponds to the cross-sectional structure along. The liquid crystal device shown in FIG. 5 includes a metal hook 35 having a U-shaped cross section that holds the liquid crystal device, and a metal frame 36 attached to the metal hook 35. Further, the metal frame 36 is provided with fixing screw holes 36a, 36
a is provided so that it can be fixed to an electronic device such as a liquid crystal projector. Although not shown, the connection between the metal hook 35 and the metal frame 36 is filled with silicon resin or the like so that heat can be smoothly transferred from the metal hook 35 to the metal frame 36. It has become. According to the liquid crystal device having the above configuration, heat diffused from the liquid crystal layer 11 side to the molding material 30 outside the sealing material 14 by the heat dissipation layers 15 and 25 is transferred to the metal hook 35 and the metal frame 36 side, which are excellent in thermal conductivity. Since it can be diffused, a more excellent heat dissipation effect can be obtained. Further, if the metal frame 36 is cooled by a cooling fan or the like, the liquid crystal device can be cooled more effectively. Further, it is preferable to provide a heat radiating member such as a cooling fin on the metal frame 36. When the cooling fin is provided, the surface area of the metal frame 36 becomes large, and a higher cooling effect can be obtained. The liquid crystal device shown in FIG. 5 shows the case where the gap 35a exists between the molding material 30 and the metal hook 35.
The narrower the width of 5a, the smoother the heat conduction from the molding material 30 to the metal hook 35 is.
It is better to narrow 5a. Alternatively, the molding material 3
The volume of 0 is increased and the substrates 10 and 20 and the metal hook 35 are
You may make it fill with the mold material 30 between these.

In addition, the liquid crystal device according to the present embodiment may have a structure in which a connection portion for the cooling device is provided on the substrate of the liquid crystal device in order to facilitate the connection with the external cooling device. . FIG. 6 is a perspective configuration diagram showing an example of a configuration of a liquid crystal device provided with such a connecting portion, and FIG. 7 is a sectional configuration diagram taken along the line BB shown in FIG. As shown in FIGS. 6 and 7, this liquid crystal device is a lower substrate 2 of the liquid crystal device shown in FIG.
Instead of 0, a lower substrate 40 that is slightly larger than the lower substrate 20 is used, and other configurations are similar to those of the liquid crystal device shown in FIGS. That is, on the upper surface side of the lower substrate shown in FIG. 7, the alignment film 24 and the heat dissipation layer 25 are sequentially formed on the entire surface from the substrate side, and the alignment film 17 and the heat dissipation layer 15 are formed.
The liquid crystal layer 11 is sealed by the sealing material 14 between the upper substrate 10 and the upper substrate 10 which are sequentially formed. And the sealing material 14
The molding material 30 is provided in a frame shape surrounding the. Further, as shown in FIG. 6, a plurality of connection terminals 42 are provided. A molding material 30 is provided so as to surround the upper substrate 10.

In the liquid crystal device having the above structure, as shown in FIGS. 6 and 7, the lower substrate 40 is projected to one side more than the upper substrate 10, and this projecting portion (region surrounded by a broken line in FIG. 6). Is a connecting portion 46 to the external cooling means. This connection 4
The surface of 6 is a heat dissipation layer 25 formed continuously from the inside of the sealing material 14, and the heat of the heat dissipation layer 25 is diffused by connecting this heat dissipation layer 25 and an external cooling means. You can do it. In addition, this heat dissipation layer 2
As shown in FIG. 7, 5 is connected to the heat dissipation layer 15 on the upper substrate 10 side via the molding material 30, so that the heat dissipation layer 2
By cooling 5 the heat dissipation layer 15 on the upper substrate 10 side is also cooled. Of the components shown in FIGS. 6 and 7, the components denoted by the same reference numerals as those in FIGS. 1 and 2 have the same configurations as the components shown in FIGS. The cooling means connected to the connecting portion 46 may be a heat sink having a large number of blade-shaped fins, or such a heat sink having a cooling fan. Alternatively, the connecting portion 46 may be directly air-cooled by blowing air with a cooling fan or the like. As described above, by providing the connecting portion 46 with the external cooling means, the liquid crystal device can be cooled more efficiently.

The structure of the liquid crystal device according to the present invention can be applied to either a passive matrix type or an active matrix type liquid crystal device, or a color display type liquid crystal device. And, it is possible to obtain a high heat dissipation effect in any type of liquid crystal device,
A liquid crystal device with excellent reliability can be obtained. Particularly in the case of an active matrix type liquid crystal device, the heat dissipation layer may also serve as the interlayer insulating film directly below the alignment film. More specifically, in an active matrix type liquid crystal device, a TFT element or a TFD (Thin Film Diode) element for switching a pixel electrode is formed for each pixel, and a liquid crystal device including these switching elements is a transistor. Layer, a semiconductor layer in which a gate portion and a diode portion are formed, a pixel electrode layer, or layers such as a scanning line and a signal line connected to a switching element are stacked, and an interlayer insulating film is provided between the layers. Since the heat dissipation layer according to the present invention is composed of a transparent insulating thin film, it can be used in place of this interlayer insulating film. With such a configuration, since the heat dissipation layer is simultaneously formed in the step of forming the interlayer insulating film, it is possible to manufacture a liquid crystal device having excellent light resistance and heat resistance without increasing the number of steps.

[Electronic Equipment] Next, specific examples of electronic equipment provided with the liquid crystal device of the above embodiment will be described. Figure 10
(A) is a perspective view showing an example of a mobile phone. Figure 1
In 0 (a), 500 indicates a mobile phone body, and 50
Reference numeral 1 denotes a liquid crystal display unit including the liquid crystal device of the above embodiment. FIG. 10B is a perspective view showing an example of a portable information processing device such as a word processor and a personal computer. Figure 10
In (b), 600 is an information processing device, 601 is an input unit such as a keyboard, 603 is an information processing main body, and 602 is a liquid crystal display unit including the liquid crystal device of the above embodiment. FIG. 10C is a perspective view showing an example of a wrist watch type electronic device. In FIG. 10C, 700 indicates a watch body, and 701 indicates a liquid crystal display unit including the liquid crystal device of the above embodiment.

FIG. 11 is a schematic configuration diagram showing a main part of a projection type display device using the liquid crystal device of the above embodiment as a light modulator. In FIG. 11, 810 is a light source, 813,
814 is a dichroic mirror, 815, 816, 81
7 is a reflection mirror, 818 is an entrance lens, 819 is a relay lens, 820 is an exit lens, and 822, 823 and 824.
Is a liquid crystal light modulator, 825 is a cross dichroic prism, and 826 is a projection lens.

The light source 810 is a lamp 8 such as a metal halide.
11 and a reflector 812 that reflects the light of the lamp. Dichroic mirror 813 that reflects blue light and green light
Transmits the red light of the light flux from the light source 810 and reflects the blue light and the green light. The transmitted red light is reflected by the reflection mirror 817 and is incident on the red light liquid crystal light modulator 822 including the liquid crystal device of the above-described embodiment. On the other hand, of the color light reflected by the dichroic mirror 813, green light is reflected by the dichroic mirror 814 that reflects green light, and is incident on the liquid crystal light modulator for green light 823 including the liquid crystal device of the above embodiment. The blue light also passes through the second dichroic mirror 814. For blue light, a light guide unit 821 including a relay lens system including an entrance lens 818, a relay lens 819, and an exit lens 820 is provided in order to compensate for the difference in optical path length between green light and red light. Through this, blue light is incident on the blue light liquid crystal light modulation device 824 including the liquid crystal device of the above embodiment. The liquid crystal light modulators 822, 823, 824 for the respective colors further include an incident side polarization unit 822a, 823a, 824a, an emission side polarization unit 822b, 823b, 824b, and a liquid crystal device arranged between them. It is a liquid crystal light valve.

The three color lights modulated by the respective light modulators enter the cross dichroic prism 825. This prism is formed by laminating four right-angled prisms, and a dielectric multilayer film that reflects red light and a dielectric multilayer film that reflects blue light are formed in a cross shape on the inner surface thereof. Three color lights are combined by these dielectric multilayer films to form light representing a color image. The combined light is projected on the screen 827 by the projection lens 826 which is a projection optical system, and the image is enlarged and displayed.

Since the electronic equipments shown in FIGS. 10A to 10C and FIG. 11 are equipped with the liquid crystal device of the above-mentioned embodiment, they are excellent in light resistance and heat resistance and have high reliability. Is. The technical scope of the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0041]

As described above in detail, the liquid crystal device according to the present invention is a liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates arranged to face each other. Since the heat dissipation layer in contact with the alignment film or the liquid crystal layer is formed on at least one inner surface side, these heats can be extracted to the outside through the heat dissipation layer,
The alignment film and the liquid crystal layer can be cooled without being limited by the glass substrate having a low thermal conductivity. Therefore, according to the liquid crystal device having such a configuration, since the heat dissipation layer is formed so as to be in contact with the alignment film or the liquid crystal layer, which is likely to be deteriorated by the irradiation of light and the heating accompanying it, deterioration of the alignment film and the liquid crystal layer is caused. Can be effectively prevented, and excellent light resistance and heat resistance can be obtained. Further, in a liquid crystal device having a TFT element or the like as a pixel switching means,
The heat generated from the element can also be diffused through the heat dissipation layer, which is also effective in preventing malfunction due to overheating of the element.

Further, according to the method of manufacturing a liquid crystal device of the present invention, since the function of aligning the liquid crystal can be imparted to the heat dissipation layer formed at the position in contact with the liquid crystal layer, it is not necessary to provide an alignment film. Therefore, a liquid crystal device having excellent reliability can be easily manufactured.

Further, according to the present invention, since the liquid crystal device having excellent light resistance and heat resistance is provided, it is possible to provide a projection type display device and electronic equipment having high reliability.

[Brief description of drawings]

FIG. 1 is a plan configuration diagram of a liquid crystal device according to an embodiment of the present invention.

FIG. 2 is a cross-sectional configuration diagram taken along the line HH shown in FIG.

FIG. 3 is a cross-sectional configuration diagram showing a part of the liquid crystal device shown in FIG. 2 in an enlarged manner.

FIG. 4 is a diagram showing a cross-sectional structure of the liquid crystal device when the positional relationship between the alignment film and the heat dissipation layer is reversed.

5 is a cross-sectional configuration diagram showing an example in which a metal frame is attached to the liquid crystal device shown in FIGS.

FIG. 6 is a perspective configuration diagram showing an example of a liquid crystal device according to the present invention, which is provided with a connection portion with an external cooling means.

7 is a cross-sectional configuration diagram taken along the line BB of FIG.

FIG. 8 is a cross-sectional process diagram showing a step of imparting an orientation function to the heat dissipation layer in the manufacturing method according to the present invention.

FIG. 9 is a cross-sectional process diagram showing a step of imparting an alignment function to the heat dissipation layer in the manufacturing method according to the present invention.

10 (a) to 10 (c) are perspective views showing a plurality of examples of electronic devices according to the present invention.

FIG. 11 is a block diagram showing an example of a projection type display device according to the present invention.

[Explanation of symbols]

10 Upper substrate (substrate) 20,40 Lower substrate (substrate) 30 Mold material 11 Liquid crystal layer 13 frame 14 Seal material 15,25,25A, 25B Heat dissipation layer 17,24,24A Alignment film 26 electrodes 35 metal hook 36 metal frame 46 Connection

   ─────────────────────────────────────────────────── ─── Continued front page    F term (reference) 2H088 EA14 HA02 HA03 HA05 HA08                       MA04 MA20                 2H089 HA15 QA06 QA15 TA02 TA03                       TA04 TA09                 2H090 HB02Y HB08Y HB13Y HD14                       HD15 LA01 LA04 MB01 MB06                       MB12

Claims (17)

[Claims] 1. A liquid crystal device in which a liquid crystal layer is sandwiched between a pair of substrates arranged so as to face each other, and heat dissipation in contact with the alignment film or the liquid crystal layer is provided on the inner surface side of at least one of the pair of substrates. A liquid crystal device having a layer formed therein. 2. The liquid crystal device according to claim 1, wherein the heat dissipation layer is made of a material containing diamond, diamond-like carbon, and hydrogenated diamond-like carbon. 3. The heat dissipation layer has an alignment function of aligning liquid crystal in a predetermined direction.
Or the liquid crystal device according to item 2. 4. The liquid crystal device according to claim 3, wherein the alignment function of the heat dissipation layer is provided by subjecting the surface of the heat dissipation layer to a rubbing treatment. 5. The liquid crystal device according to claim 3, wherein the alignment function of the heat dissipation layer is provided by irradiating the surface of the heat dissipation layer with a particle beam. 6. The heat dissipation layer is formed on the alignment film.
The liquid crystal device according to item. 7. The liquid crystal device according to claim 1, wherein the heat dissipation layer is formed below the alignment film. 8. The liquid crystal device according to claim 6, wherein the alignment film is an inorganic alignment film. 9. The liquid crystal device according to claim 7, wherein the heat dissipation layer also serves as an interlayer insulating film for insulating an arbitrary interlayer formed on the inner surface side of the pair of substrates. 10. The liquid crystal device according to claim 1, wherein the heat dissipation layer includes a connecting portion for connecting to an external cooling unit. 11. The liquid crystal device according to claim 10, wherein a sealing material for radiating the heat of the heat dissipation layer to the outside is connected to the connection portion of the heat dissipation layer. 12. The liquid crystal device according to claim 11, wherein the encapsulating material is formed so as to surround the substrate along a peripheral portion or a peripheral end portion of the substrate. 13. The heat dissipation layer is connected to at least one of a metal wiring or a metal film formed on the both substrates, and radiates heat to the outside in cooperation with the metal wiring or the metal film. The liquid crystal device according to claim 1, wherein the liquid crystal device is a liquid crystal device. 14. A method of manufacturing a liquid crystal device, comprising a liquid crystal layer sandwiched between a pair of substrates arranged to face each other, wherein at least one inner surface of the pair of substrates is in contact with the liquid crystal layer. A method of manufacturing a liquid crystal device, comprising: a step of forming a heat dissipation layer; and a step of subjecting a surface of the heat dissipation layer to a rubbing treatment to impart an alignment function to the heat dissipation layer. 15. A method of manufacturing a liquid crystal device, comprising a liquid crystal layer sandwiched between a pair of substrates arranged to face each other, wherein at least one inner surface of the pair of substrates is in contact with the liquid crystal layer. A method of manufacturing a liquid crystal device, comprising: a step of forming a heat dissipation layer; and a step of irradiating a surface of the heat dissipation layer with a particle beam to impart an alignment function to the heat dissipation layer. 16. A projection type display device comprising the liquid crystal device according to claim 1, wherein the light source, the liquid crystal device that modulates light emitted from the light source, and A projection display device, comprising: a magnifying projection optical system that magnifies and projects light modulated by a liquid crystal device onto a projection surface. 17. An electronic apparatus comprising the liquid crystal device according to claim 1. Description: