JP2003247727A - Regenerative floor heating appliance - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a regenerative floor heating appliance controlling the heat release so as not to produce a temperature difference according to time zone. <P>SOLUTION: This regenerative floor heating appliance is formed by stacking a regenerative board 1 on a heater block and sticking a floor board 2 on the regenerative board 1. The regenerative board 1 is formed by filling a casing body 3 with a regenerative material 5 and the casing body 3 is formed with, at least, a plurality of recesses 9 opening their upper surfaces. A heat release control plate 10 covering the upper surface of the regenerative board is slidably mounted on the upper surface of the regenerative board between the regenerative board 1 and the floor board 2. Through holes 11 are provided in the heat release control plate 10 corresponding to the respective recesses 9. This appliance is so formed that a heat release control is performed by sliding the heat release control plate 10 and changing over between a heat release accelerating state where the recesses 9 and the through holes 11 are accorded with each other and a heat release suppression state where the recesses 9 are not accorded with the through holes 11. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat storage floor heating apparatus for heating a floor by radiating the accumulated heat, and more particularly to a structure for controlling heat radiation according to the amount of heat stored in a heat storage board.

[0002]

2. Description of the Related Art A heat storage floor heating system is formed by combining a heater block (not shown), a heat storage board 1 and a floor plate 2 as shown in FIG. The heat storage board 1 is provided with a rising wall 4 at the periphery of a housing 3 made of synthetic resin having a flat rectangular box shape and a space inside, and a heat storage material 5 such as a latent heat storage material is loaded in the space of the housing 3. Is formed. A heater block is laminated on the lower surface of the housing 3 of the heat storage board 1, and the heat can be stored in the heat storage material 5 by causing the heater block to generate heat using midnight power or the like.
A floor board 2 such as plywood is arranged on the upper end of the rising wall 4 of the heat storage board 1 so as to cover the entire upper surface of the heat storage board 1, and the heat storage board 1 and the floor board 2 are integrated. .

The housing 3 of the heat storage board 1 is formed by blow molding or the like. As shown in FIG. 7, the upper surface plate portion 3a and the lower surface plate portion 3b are polymerized and combined at appropriate places of the housing 3. Part 6
Is formed. That is, the upper surface plate portion 3 a is provided with a bottomed inverted truncated cone cylindrical concave curved portion 7, and the lower surface plate portion 3 b is provided with a bottomed circular truncated cone cylindrical convex curved portion 7 of the concave curved portion 7. The bottom portion and the bottom portion of the convex curved portion 8 are fused to each other. In this way, by providing the concavely curved portion 7 and the convexly curved portion 8 and providing the overlapping portion 6 in which the bottom portions are fused to each other, the reinforcing rib functions.

[0004]

By the way, in the above heat storage floor heating system, the heater block is caused to generate heat by using the midnight power or the like to store heat in the heat storage material 5 at midnight, and the stored heat is transferred from the heat storage material 5 to the heat storage material 5. It is designed to radiate heat to the floor plate 2 for floor heating, but since the heat stored in the heat storage material 5 is radiated in a non-uniform manner, it is stored most (for example, in the morning).
Radiates a lot of heat, and when the amount of stored heat is low (for example, at night)
Does not radiate much. Therefore, there is a problem that the temperature difference becomes large depending on the time zone, such as morning and evening.

The present invention has been made in view of the above points, and it is an object of the present invention to provide a heat storage floor heating system capable of controlling heat radiation so that there is no temperature difference depending on the time zone.

[0006]

A heat storage floor heating apparatus of the present invention for solving the above problems is a heat storage in which a heat storage board 1 is laminated on a heater block and a floor plate 2 is stuck on the heat storage board 1. In the floor heating apparatus, the heat storage board 1 is formed by filling the housing 3 with the heat storage material 5, and the housing 3 is formed with a plurality of recesses 9 that open at least the upper surface.
A heat dissipation control plate 10 covering the upper surface of the heat storage board 1 is slidably mounted on the upper surface of the heat storage board 1 between the heat storage board 1 and the floor plate 2.
Through holes 1 are formed in the heat dissipation control plate 10 so as to correspond to the recesses 9 described above.
1 is provided, and heat dissipation control is performed by sliding the heat dissipation control plate 10 to switch between a heat dissipation promoting state in which the recess 9 and the through hole 11 are matched and a heat dissipation suppressing state in which the recess 9 and the through hole 11 are not matched. It is characterized by doing so. When the heat storage amount of the heat storage material 5 is large, the heat dissipation area can be suppressed by reducing the heat dissipation area of the housing 3 exposed in the through holes 11 by not aligning the recess 9 with the through holes 11. When the amount becomes small, the recess 9 and the through hole 11 are made to coincide with each other, so that the heat dissipation area of the housing 3 exposed in the through hole 11 can be increased and the heat dissipation can be promoted.
As a result, when the heat storage amount of the heat storage material 5 is large, the heat release can be suppressed, and when the heat storage amount of the heat storage material 5 is small, the heat release can be promoted, and the temperature difference due to the time zone cannot be made, and the temperature difference of one day can be reduced. You can

It is also preferable that the heat dissipation control plate 10 is slid by changing the shape of the shape memory alloy. In this case, the heat radiation control plate 10 is driven by the temperature change of the heat storage material 5 so that the heat radiation suppression state can be set when the heat storage amount is large and the heat radiation promotion state can be set when the heat storage amount is small. As a result, the heat dissipation control plate 10 operates properly according to the temperature change of the heat storage material 5, and the heat dissipation control plate 10 automatically operates.

It is also preferable that the recess 9 is provided so as to vertically penetrate between the upper surface and the lower surface of the housing 3 of the heat storage board 1. In this case, the heat dissipation area when the through hole 11 and the recess 9 are aligned can be increased, and when heat is taken out in a heat dissipation promoting state, it can be taken out evenly over the thickness direction of the housing 3.

The housing 3 of the heat storage board 1 has a top plate 3a.
And the lower surface plate portion 3b, the bottom surface of the concave curved portion 7 provided on the upper surface plate portion 3a and the bottom surface of the convex curved portion 8 provided on the lower surface plate portion 3b are polymerized and coupled to each other to form the overlapping portion 6. It is also preferable that the recesses 9 are formed so as to vertically penetrate by forming the holes 12. In this way, by providing the concavely curved portion 7 and the convexly curved portion 8 and providing the overlapping portion 6 having the bottom portions fused to each other, it functions as a reinforcing rib and becomes strong. Moreover, the recess 9 which penetrates vertically for heat dissipation can be easily formed by utilizing the portion for reinforcement.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION A floor heating system is formed as shown in FIG. 1 by combining a heater block (not shown), a heat storage board 1 and a floor plate 2 into a panel. The heat storage board 1 is formed by providing a rising wall 4 on the periphery of a housing 3 having a flat rectangular box shape and a space inside, and loading a heat storage material 5 such as a latent heat storage material in the space inside the housing 3. Has been done. The housing 3 and the rising wall 4 of the heat storage board 1 are integrally formed of a synthetic resin such as polypropylene. The heater block is mounted on the lower surface side of the housing 3 of the heat storage board 1 so that the heat can be stored in the heat storage material 5 of the heat storage board 1 by causing the heater block to generate heat with midnight power or the like.

A plurality of overlapping portions 6 are formed at appropriate places on the housing 3 of the heat storage board 1 by combining the upper surface plate portion 3a and the lower surface plate portion 3b of the housing 3 and connecting them. That is, the upper surface plate portion 3a is provided with a concave curved portion 7 having a bottomed inverted truncated cone shape, and the lower surface plate portion 3b.
Is provided with a convex curved portion 8 in the shape of a truncated cone with a bottom, and the bottom portion of the concave curved portion 7 and the bottom portion of the convex curved portion 8 are fused to each other. In this way, by providing the concavely curved portion 7 and the convexly curved portion 8 and providing the overlapping portion 6 in which the bottom portions are fused to each other, the reinforcing rib functions. A hole 12 is formed in the overlapping portion 6 so as to penetrate the overlapping portion 6, and a space 9 in the concave curved portion 7 and a space in the convex curved portion 8 and the hole 12 form a recess 9 penetrating vertically. The surface exposed in the recess 9 serves as a heat dissipation surface. In the case of this example, the recess 9 is provided so as to penetrate vertically, but the recess 9 may be provided only in the space of the recessed curved portion 7.

A floor plate 2 such as plywood is arranged on the upper end of the rising wall 4 of the heat storage board 1 so as to cover the entire upper surface of the heat storage board 1, and the heat storage board 1 and the floor plate 2 are integrated. It has been transformed. A heat dissipation control plate 10 that covers the housing 3 is disposed on the upper surface of the housing 3 of the heat storage board 1. The heat dissipation control plate 10 is made of a material having a relatively heat insulating property, and is, for example, a hard foam. It is made of synthetic resin. Through holes 11 are formed in the heat dissipation control plate 10 so as to correspond to the recesses 9 of the housing 3. The heat dissipation control plate 10 has a thickness of, for example, 2 mm, and the through holes 11 have a diameter of 14 mmφ. The heat dissipation control plate 10 can be slid so that the through hole 11 and the recess 9 are aligned with each other, or the through hole 11 and the recess 9 are not aligned with each other. When the through hole 11 and the recess 9 are not aligned with each other, the heat dissipation area S1 of the housing 3 exposed in the through hole 11 becomes small as shown in FIG.
When the through hole 11 and the recess 9 are aligned with each other, the heat dissipation area S2 of the housing 3 exposed in the through hole 11 becomes large as shown in FIG. 3B, and the heat dissipation is promoted. As a result, when the heat storage amount of the heat storage material 5 is large, the heat dissipation control plate 10 is moved so that the through hole 11 and the recess 9 do not coincide with each other so that the heat dissipation is suppressed.
When the amount of stored heat is small, the heat dissipation control plate 10 can be moved so that the through hole 11 and the recess 9 coincide with each other, and the heat dissipation can be promoted.

Further, in the case of this example, the operating plate 13 made of a shape memory alloy is used as a moving means for moving the heat dissipation control plate 10 so as to be in a heat dissipation suppressing state or a heat dissipation promoting state. The heat radiation control plate 10 is moved by the shape deformation of the plate 13. The shape memory alloy actuating plate 13 is formed into a substantially inverted L-shaped plate shape by a horizontal piece 13a and a vertical piece 13b, and the horizontal piece 13a is fixed to the floor plate 2 by a fastener 14.
The lower end of the vertical piece 13b is joined to one end of the heat dissipation control plate 10. The transformation point of this shape memory alloy is, for example, 40 to 45 ° C.
3b is adapted to be deformed. A spring 15 composed of a tension spring is arranged at the end of the heat dissipation control plate 10 opposite to the side on which the actuation plate 13 is mounted. One end of the spring 15 is connected to the heat dissipation control plate 10 and The end is fixed to the heat storage board 1. As a result, the heat dissipation control plate 10 is always pulled by a predetermined spring force in the direction opposite to the direction in which the actuation plate 13 is present.

However, in a state where the heat storage material 5 is sufficiently stored with heat, the temperature of the working plate 13 of the shape memory alloy rises, exceeds the temperature of the transformation point of the shape memory alloy, and the working plate 13 stores the memory of the shape memory alloy. It deforms into a shape and pulls the heat dissipation control plate 10 against the force of the spring 15 as shown in FIG. As a result, the heat dissipation control plate 10 moves so that the through hole 11 and the recess 9 do not coincide with each other, the heat dissipation area of the housing 3 exposed in the through hole 11 is reduced, and the heat dissipation is suppressed. When the heat storage amount of the heat storage material 5 decreases and the temperature of the operating plate 13 decreases and becomes lower than the temperature of the transformation point, the heat dissipation control plate 10 is returned by the force of the spring 15 as shown in FIG. As a result, the heat dissipation control plate 10 is moved so that the through hole 11 and the recess 9 are aligned with each other, the heat dissipation area of the housing 3 exposed in the through hole 11 is increased, and the heat dissipation is promoted. When the heat dissipation control plate 10 is moved by the shape memory alloy actuating plate 13 as described above, the heat dissipation control plate 10 is automatically moved in accordance with the amount of heat storage of the heat storage material 5 to be in a heat dissipation suppression state or a heat dissipation promotion state. it can.

In the case of this example, the shape memory alloy actuating plate 13 is designed to operate depending on the temperature of the heat storage material 5, but a small heater is attached near the shape memory alloy actuating plate 13 to electrically heat the heater. May be controlled to operate the operating plate 13. Alternatively, instead of the shape memory alloy actuating plate 13, a solenoid may be connected to the heat dissipation control plate 10, and the solenoid may be operated electrically to move the heat dissipation control plate 10 by a predetermined stroke. When the heat radiation control plate 10 is electrically controlled to move as described above, it is possible to arbitrarily switch between heat radiation suppression and heat radiation promotion.

[0016]

According to the first aspect of the present invention, the heat storage board is formed by filling the inside of the housing with the heat storage material, and at least a plurality of recesses for opening the upper surface are formed in the housing. A heat dissipation control plate that covers the upper surface of the heat storage board is slidably mounted on the upper surface of the heat storage board between the floor plate and the heat storage board, and through holes are provided in the heat dissipation control plate so as to correspond to the recesses. The amount of heat stored in the heat storage material is large because the heat dissipation control is performed by sliding the switch to switch between a heat dissipation promoting state where the recess and the through hole are aligned and a heat dissipation suppressing state where the recess and the through hole are not aligned. In this case, by not matching the recess with the through hole, the heat dissipation area of the housing exposed in the through hole can be reduced to suppress heat dissipation, and when the heat storage amount of the heat storage material is low, the recess and the through hole can be matched. By doing so, it is possible to increase the heat dissipation area of the case exposed in the through hole and promote heat dissipation. When the heat storage amount of the heat storage material is large, the heat release can be suppressed, and when the heat storage amount of the heat storage material is small, the heat release can be promoted, and the temperature difference due to the time zone cannot be made, and the temperature difference of the day is reduced. Is something that can be done.

The invention of claim 2 of the present invention is the invention of claim 1.
In the above, since the heat dissipation control plate is slid by changing the shape of the shape memory alloy, when the heat dissipation control plate is driven by the temperature change of the heat storage material and the heat storage amount is large, the heat dissipation suppression state can be set and the heat storage amount can be reduced. When the amount is small, the heat dissipation promotion state can be established, whereby the heat dissipation control plate operates properly and the heat dissipation control plate automatically operates according to the temperature change of the heat storage material.

The invention of claim 3 of the present invention is the invention of claim 1.
Alternatively, in claim 2, since the recess is provided so as to vertically penetrate between the upper surface and the lower surface of the housing of the heat storage board, the heat dissipation area when the through hole and the recess are aligned can be increased. In addition, when heat is taken out in the heat dissipation promoting state, it can be taken out evenly in the thickness direction of the housing.

The invention of claim 4 of the present invention is the invention of claim 1.
The housing of the heat storage board according to any one of claims 1 to 3, wherein the housing of the heat storage board includes an upper surface plate portion and a lower surface plate portion, and a bottom surface of the concave curved portion provided on the upper surface plate portion and a bottom surface of the convex curved portion provided on the lower surface plate portion. Since they are polymerized and combined with each other, by providing a polymerized portion having a concavely curved portion and a convexly curved portion and the bottom portions being fused to each other, the reinforcing rib functions to strengthen the polymerized portion. Since the recesses that penetrate vertically are formed by forming the holes in the recesses, it is possible to easily form the recesses that penetrate vertically for heat dissipation by utilizing the reinforcing portion.

[Brief description of drawings]

FIG. 1 is a schematic cross-sectional view of an example of an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing an enlarged main part of the above.

3A and 3B are explanatory views for explaining a heat radiation area.

FIG. 4 is a schematic cross-sectional view that operates in the heat radiation suppression state of the above.

FIG. 5 is a schematic cross-sectional view showing the operation in the heat dissipation promoting state of the above.

FIG. 6 is a schematic cross-sectional view of a conventional example.

FIG. 7 is a cross-sectional view enlarging a main part of a conventional example.

[Explanation of symbols]

1 heat storage board 2 floor board 3 housing 3a Top plate part 3b Bottom plate 5 Heat storage material 6 superposition section 7 concave part 8 convex curve 9 recess 10 Heat dissipation control plate 11 through holes

Continued front page    (72) Inventor Toshiki Tamura             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company F-term (reference) 3L071 CC05 CD01 CE01 CF04                 3L072 AA01 AB03 AC02 AD03 AD06                       AE03 AE10 AF07 AG00                 3L073 CC03 DE04 DF07

Claims (4)

[Claims] 1. A heat storage floor heating apparatus in which a heat storage board is laminated on a heater block and a floor plate is pasted on the heat storage board, wherein the heat storage board is formed by filling a heat storage material in the housing and the housing. A plurality of recesses that open at least the upper surface are formed in the heat storage board, and a heat dissipation control plate that covers the heat storage board is slidably mounted on the upper surface of the heat storage board between the heat storage board and the floor plate. Through holes are provided so as to correspond to the respective recesses, and the heat dissipation control plate is slid to switch between a heat dissipation promoting state in which the recesses and the through holes are aligned and a heat dissipation suppression state in which the recesses and the through holes are inconsistent. A heat storage floor heating system characterized in that heat radiation is controlled. 2. The heat storage floor heating system according to claim 1, wherein the heat dissipation control plate is slid by changing the shape of the shape memory alloy. 3. The heat storage floor heating device according to claim 1, wherein the recess is provided so as to vertically penetrate between the upper surface and the lower surface of the housing of the heat storage board. 4. The housing of the heat storage board is composed of an upper surface plate portion and a lower surface plate portion, and a bottom surface of a concave curved portion provided on the upper surface plate portion and a bottom surface of a convex curved portion provided on the lower surface plate portion are overlapped with each other. 4. The heat storage floor heating apparatus according to claim 1, wherein the heat storage floor heating device has a recess that vertically penetrates by forming a hole in the overlapping portion.