JP2003247059A - Deposition-preventive plate, thin film deposition apparatus, and deposition-preventive plate cleaning method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily deposit metal particles on a deposition-preventive plate, while unifying the size of the metal particles deposited on the deposition- preventive plate. <P>SOLUTION: Al particles 4 are deposited on a rough surface 2 of the deposition-preventive plate 1 by discharging Al droplets 3 on the deposition- preventive plate 1 by an ink-jet method. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a deposition preventive jig, a thin film forming apparatus, and a cleaning method for the deposition preventive jig, and is particularly suitable for application to a deposition preventive plate jig for preventing deposits. It is something.

[0002]

2. Description of the Related Art In a conventional thin film forming apparatus such as a CVD apparatus, a vapor deposition apparatus or a sputtering apparatus, in order to prevent deposits from adhering to the inside of the chamber, an Al-based thermal spraying protection plate may be mounted inside the chamber. Exists. In this Al-based thermal spray deposition protection plate, Al is sprayed on the roughened deposition protection plate surface. Then, by spraying Al onto the roughened deposition-inhibitory plate surface, the surface area of the deposition-inhibitory plate surface can be increased, and more deposits can be attached and reuse can be facilitated. It becomes possible.

FIG. 4 is a cross-sectional view showing a conventional method for cleaning an adhesion preventing jig. In FIG. 4A, the deposit 104 is removed from the deposition preventing plate 101 on which the deposit 104 has been deposited.
Then, as shown in FIG. 4B, for example, by sandblasting BR, the surface of the deposition-inhibitory plate 101 is roughened, and the roughened surface 102 is formed on the surface of the deposition-inhibitory plate 101.

Next, as shown in FIG. 4 (c), the rough surface 10
The deposition preventive plate 101 on which 2 is formed is placed in a plasma spraying apparatus or an arc spraying apparatus. Then, the inside of the plasma spraying apparatus or the arc spraying apparatus on which the deposition-preventing plate 101 is placed is evacuated to perform plasma discharge or arc discharge, so that the Al sprayed S on the rough surface 102 of the deposition-preventing plate 101.
Do Y.

As a result, Al-based particles 103 are formed on the rough surface 102 of the deposition preventive plate 101. When the Al-based particles 103 are formed on the rough surface 102 of the deposition-inhibitory plate 101, the deposition-resistant plate 101 in which the Al-based particles 103 are formed is formed.
Is installed on the inner wall surface of the chamber of a thin film forming apparatus such as a CVD apparatus, a vapor deposition apparatus, or a sputtering apparatus.

When a thin film forming process is performed by these thin film forming apparatuses, a part of the raw materials used for forming the thin film reaches the wall surface of the chamber. Then, as shown in FIG. 4D, these raw materials or reactants adhere to the deposition-inhibitory plate 101, and the deposit 104 is deposited on the deposition-inhibitory plate 101. When the deposit 104 deposited on the deposition-inhibitory plate 101 reaches a certain amount, the process returns to the step of FIG. 4A, the deposit 104 deposited on the deposition-inhibition plate 101 is removed, and the deposit 104 in FIG. ),
By performing the step (c), the deposition preventing plate 101 is reused.

[0007]

However, in the conventional cleaning method for the deposition-inhibitory plate 101, the thermal spray SY of Al is performed on the rough surface 102 of the deposition-inhibition plate 101 by plasma discharge or arc discharge. Therefore, the A
In the case of forming the l-based particles 103, in the low pressure plasma spraying apparatus or the arc spraying apparatus, it is necessary to evacuate the inside of the apparatus, and there is a problem that the apparatus becomes large and the cost increases.

Further, the method using plasma discharge or arc discharge has a problem that it takes time to set the conditions for the spray SY in order to make the sizes of the Al-based particles 103 uniform during the spray SY. Furthermore, by plasma discharge,
When forming the Al-based particles 103 on the deposition-inhibitory plate 101, it is necessary to flow an Ar gas or the like between the electrodes to generate an arc by applying a voltage, which makes maintenance of the plasma spraying apparatus difficult and makes it difficult to maintain the plasma spraying apparatus. There was a problem that it took time to manage.

On the other hand, due to arc discharge, Al-based particles 10
When 3 is formed on the deposition-inhibitory plate 101, the sprayed shape becomes non-uniform as compared with the case where plasma discharge is used.
There was a problem that the number of cleaning times of 1 increased. Therefore, an object of the present invention is to provide an adhesion preventive jig, a thin film forming apparatus, and an adhesion preventive tool capable of easily forming metal particles on an adhesion preventing plate while making the metal particles formed on the adhesion preventing plate uniform. A jig cleaning method is provided.

[0010]

In order to solve the above-mentioned problems, according to the adhesion-preventing jig according to claim 1, an adhesion-preventing plate having a rough surface formed on the surface, and a metal on the rough surface. And metal particles that are deposited by discharging the droplets. As a result, it becomes possible to weld the metal particles onto the deposition-inhibitory plate simply by discharging the metal droplets onto the deposition-inhibitory plate, and evacuation is performed to weld the metal particles onto the deposition-inhibitory plate. Since it is not necessary, cost can be reduced.

Further, the size of the metal particles can be easily defined by the size of the discharged droplets, and the size of the metal particles can be reduced by making the diameter of the nozzle for discharging the droplets uniform. Therefore, the surface area on the deposition-inhibitory plate can be increased and the number of times of cleaning the deposition-inhibitory plate can be reduced. Further, according to the deposition-preventing jig of the second aspect, the deposition-preventing plate is a stainless plate, a titanium plate, or an alumina plate.

[0012] With this, it is possible to easily remove the deposits attached to the metal particles from the deposition-inhibitory plate, and it is possible to easily reuse the deposition-inhibitory plate. Further, according to the deposition-preventing jig of claim 3, the metal particles are Al-based particles. As a result, the deposit can be efficiently attached, and at the same time, the Al-based particles to which the deposit is attached can be removed from the deposition preventive plate, and the deposition preventive plate can be easily reused.

Further, according to the thin film forming apparatus of the fourth aspect, the chamber on which the object to be processed is placed, the depositing means for depositing the deposit on the object to be processed, and the chamber inner wall surface in a detachable state. And a deposition preventing plate on which metal particles are attached by discharging metal droplets. This makes it possible to prevent deposits from adhering to the chamber inner wall surface by simply attaching the adhesion barrier plate to the chamber inner wall surface, and to even out the size of the metal particles to clean the adhesion barrier plate. It is possible to reduce the number of times the attachment-and-detachment plate is attached and detached, and the chamber can be easily maintained.

According to a fifth aspect of the thin film forming apparatus, the depositing means is sputtering, CVD, vapor deposition or epitaxial growth. As a result, unnecessary deposits can be efficiently attached to the deposition-inhibitory plate, generation of particles can be suppressed, and thin film formation can be performed accurately. According to the method for cleaning an adhesion-preventing jig of claim 6, a step of removing deposits deposited on the surface of the adhesion-preventing plate, a step of blasting the surface of the adhesion-preventing plate, and the blasting treatment. And a step of ejecting metal droplets onto the surface of the deposition-inhibitory plate.

With this, it becomes possible to efficiently weld the metal particles onto the deposition-inhibitory plate and to make the sizes of the metal particles uniform by simply discharging the droplets of the metal onto the deposition-inhibitory plate. Is possible. For this reason, since it is not necessary to perform vacuuming to form the metal particles on the deposition-inhibitory plate, it is possible to reduce the cost and increase the surface area on the deposition-inhibitory plate to prevent the deposition. The number of times of cleaning the plate can be reduced.

[0016]

BEST MODE FOR CARRYING OUT THE INVENTION An adhesion-preventing jig and a cleaning method therefor according to an embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a cross-sectional view showing a method for cleaning an adhesion-preventing jig according to an embodiment of the present invention. In FIG. 1A, the deposit 5 is removed from the deposition preventive plate 1 on which the deposit 5 is deposited.

Then, as shown in FIG. 1B, the surface of the deposition-inhibitory plate 1 is roughened by, for example, sandblasting BR to form a rough surface 2 on the surface of the deposition-inhibitory plate 1. As the deposition preventive plate 1, for example, a stainless plate, a titanium plate or an alumina plate can be used. Further, as a method for forming the rough surface 2 on the surface of the adhesion-preventing plate 1, for example, etching treatment or the like can be used in addition to the sandblast treatment BR.

Next, as shown in FIG. 1 (c), the deposition-inhibitory plate 1 having the roughened surface 2 is placed on the deposition-inhibition jig cleaning device.
Here, the cleaning device for the deposition-inhibitory jig is provided with nozzles 121 to 12n for ejecting Al droplets 3 onto the deposition-inhibitory plate 1 by an inkjet method. Then, the Al droplets 3 are ejected onto the deposition-inhibiting plate 1 through the nozzles 121 to 12n, so that the Al-based particles 4 are formed on the rough surface 2 of the deposition-inhibiting plate 1.
To form.

When the Al-based particles 4 are formed on the rough surface 2 of the deposition-inhibiting plate 1, the deposition-inhibiting plate 1 on which the Al-based particles 3 are formed is used as a thin film in a CVD device, a vapor deposition device, a sputtering device or the like. It is installed on the inner wall surface of the chamber of the forming apparatus. When a thin film forming process is performed by these thin film forming apparatuses, a part of the raw materials used for forming the thin film reaches the chamber wall surface. Then, these raw materials or reactants adhere to the deposition-inhibitory plate 1, so that the deposit 5 is deposited on the deposition-inhibitory plate 1 as shown in FIG.

Then, the deposit 5 deposited on the deposition-inhibitory plate 1
However, when the thickness reaches a level such that it peels off from the adhesion-preventing plate 1,
Returning to the step (a), the deposit 5 deposited on the deposition-inhibitory plate 1 is removed. Then, the deposition-preventing plate 1 can be reused by performing the steps of FIGS. 1B and 1C. Here, by forming the Al-based particles 4 on the deposition-inhibitory plate 1 by an inkjet method, it is possible to perform vacuuming without
It becomes possible to form the Al-based particles 4 on the deposition-inhibitory plate 1, and the Al-based particles 4 can be easily homogenized.

Therefore, not only can the maintenance of the cleaning device for the deposition-inhibitory jig be facilitated, the size of the cleaning device for the deposition-inhibitory jig can be reduced, and the cost can be reduced. It is possible to increase the surface area of the deposits 5 and increase the amount of deposits 5 deposited up to the peeling.
It is possible to reduce the number of times of cleaning. FIG. 2 is a perspective view showing the configuration of a cleaning device for an adhesion-preventing jig according to an embodiment of the present invention.

In FIG. 2, the cleaning device for the deposition preventive jig is
A drive mechanism 6, a control circuit 7, a solidification device 8, ink jet recording heads 21 to 2n, and tanks 31 to 3n are provided. Here, the drive mechanism 6 drives the ink jet recording heads 21 to 2n in the X axis direction and the Y axis direction, and is a motor for moving the ink jet recording heads 21 to 2n in the X axis direction and the Y axis direction. 41, 4
Two are provided. The control circuit 7 controls the drive mechanism 6, the solidification device 8, and the inkjet recording heads 21 to 2n. The solidifying device 8 includes the metal fluids 11 to 11 ejected from the ink jet recording heads 21 to 2n onto the deposition preventing plate 1.
Solidify 1n.

Further, the ink jet type recording heads 21-
2n is for ejecting the metal fluids 11 to 1n onto the deposition-inhibiting plate 1, and the ink jet recording heads 21 to 2n are nozzles 121 to 12n for ejecting the metal fluids 11 to 1n onto the deposition-inhibiting plate 1. Is provided. Here, the nozzle 12
1 to 12n are based on the volume change by the piezoelectric element,
The metal fluids 11 to 1n may be discharged, or the metal fluids 11 to 1n may be discharged based on the thermal expansion of the heating element.
You may comprise so that n may be discharged.

The tanks 31 to 3n are connected to the metal fluid 11
The tanks 31 to 3n are connected to the ink jet recording heads 21 to 2n. As the metal fluids 11 to 1n to be filled in the tanks 31 to 3n, it is possible to use fluids obtained by heating a metal such as Al, solder, gallium, Pb, Sn, or indium to a melting point or higher to give fluidity.

When the Al-based particles 4 are formed on the deposition-preventing plate 1, the Al metal fluids 11 to 1 are stored in the tanks 31 to 3n.
Fill n. Then, the deposition-inhibitory plate 1 on which the rough surface 2 is formed is arranged toward the ink jet recording heads 21 to 2n, and a discharge command of the metal fluids 11 to 1n is given to the control circuit 7. Then, the control circuit 7 sends the drive signals Sx and Sy to the motors 41 and 42, and at the same time, discharge signals Sh1 to Shn.
Are sent to the inkjet recording heads 21 to 2n to cause the inkjet recording heads 21 to 2n to scan in the X-axis direction and the Y-axis direction, and the droplets 3 are ejected from the inkjet recording heads 21 to 2n.

Here, the motors 41 and 42 are connected to the control circuit 7
When the drive signals Sx and Sy are received from, the inkjet recording heads 21 to 2n are scanned via the drive mechanism 6 in the X-axis direction and the Y-axis direction. In addition, the inkjet recording heads 21 to 2n output the ejection signal Sh from the control circuit 7.
When receiving 1 to Shn, the droplet 3 is ejected through the nozzles 121 to 12n.

As a result, the droplets 3 of the Al metal fluids 11 to 1n are discharged onto the deposition-inhibitory plate 1, and Al-based particles 4 are formed on the deposition-inhibitory plate 1. Further, the control circuit 7 sends a control signal Sp to the solidification device 8 as needed. Then, the solidification device 8
Applies a physical or chemical treatment to the droplet 3 landed on the deposition-inhibitory plate 1.

Here, as the physical or chemical treatment, for example, cold air blowing, reheating / annealing treatment by lamp irradiation, chemical change treatment by chemical substance administration and the like can be mentioned. In addition, in the above-described embodiment, as a method of forming the Al-based particles 4 on the deposition preventing plate 1,
Although the method using the Al metal fluids 11 to 1n has been described, the solution in which the metal fine particles are dispersed in the solvent is discharged onto the deposition-inhibitory plate 1 by the inkjet method, and the solvent is evaporated to deposit the solution on the deposition-inhibitory plate 1. Alternatively, metal particles may be formed.

FIG. 3 is a sectional view showing the structure of a sputtering apparatus equipped with the deposition-inhibitory jig according to one embodiment of the present invention. In FIG. 3, the chamber 51 is provided with an inlet 51a for introducing Ar gas into the chamber 51 and an exhaust port 51b for evacuating the inside of the chamber 51, and a mounting table 52 for mounting the wafer W thereon. Also, a cathode 53 for maintaining the target TG at a negative potential is provided, and further, magnets MG1 to MG3 for generating a magnetic field are provided on the target TG.

Further, on the inner wall surface of the chamber 51, there are attached deposition-preventing plates 1a to 1c on which Al-based particles 4a to 4c are formed by an ink jet method. When depositing a deposit on the wafer W, the chamber 51 is evacuated,
Ar gas in the chamber 51 is introduced. And the cathode 5
A negative potential is applied to 3 and a positive potential is applied to the wafer W side.

Then, due to the high electric field between the wafer W and the target TG, Ar gas is turned into plasma and Ar ions are generated. Then, the Ar ions are attracted to the negative potential of the cathode 53, collide with the target TG, and knock out atoms from the target TG. Then, the atoms knocked out from the target TG adhere to the wafer W, and a deposit can be formed on the wafer W.

Here, some of the atoms knocked out from the target TG deviate from the wafer W toward the inner wall surface of the chamber 51, but the deposition prevention plates 1a to 1a are formed on the inner wall surface of the chamber 51.
Since c is mounted, it is possible to prevent deposits from accumulating on the inner wall surface of the chamber 51. Then, Al-based particles 4a to 4c are evenly formed on the deposition-preventing plates 1a to 1c by an inkjet method.
4c allows the deposits to be efficiently adhered, so that it is possible to suppress the peeling of the deposits and suppress the generation of particles, and at the same time, the deposition-preventing plates 1a to 1c.
It is possible to reduce the number of times of cleaning and maintenance work.

In the embodiment shown in FIG. 3, the thin film forming apparatus to which the deposition preventive jig is attached is explained as an example of the sputtering apparatus. You may do it.

[0034]

As described above, according to the present invention,
By simply ejecting metal droplets onto the deposition-inhibitory plate, it becomes possible to efficiently weld the metal particles onto the deposition-inhibitory plate, and it becomes possible to make the sizes of the metal particles uniform.
It becomes possible to reduce costs, and
Maintenance work can be reduced.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a method for cleaning an adhesion-preventing jig according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a configuration of a cleaning device for a deposition preventive jig according to an embodiment of the present invention.

FIG. 3 is a cross-sectional view showing a configuration of a sputtering apparatus equipped with an adhesion-preventing jig according to an embodiment of the present invention.

FIG. 4 is a cross-sectional view showing a conventional method for cleaning an adhesion preventing jig.

[Explanation of symbols]

1, 1a to 1c Anti-stick plate 2 rough surface 3 droplets 4 4a-4c Al-based particles 5 sediment 121-12n nozzle 6 Drive mechanism 7 control circuit 8 Solidifying device 11-1n Metal fluid 21-2n Inkjet recording head 31-3n tank 41, 42 motor Sx, Sy drive signal Sp control signal Sh1 to Shn discharge signal 51 chambers 51a inlet 51b exhaust port 52 table 53 cathode TG target W wafer MG1 to MG3 Magnet

Claims (6)

[Claims] 1. An adhesion-preventing plate having a rough surface formed on the surface thereof, and metal particles deposited on the rough surface by discharging metal droplets. jig. 2. The adhesion preventing jig according to claim 1, wherein the adhesion preventing plate is a stainless plate, a titanium plate or an alumina plate. 3. The deposition preventive jig according to claim 1, wherein the metal particles are Al-based particles. 4. A chamber for mounting a processing target, a deposition means for depositing a deposit on the processing target, and a detachably mounted on the inner wall surface of the chamber for discharging metal droplets. A thin film forming apparatus comprising: a deposition preventive plate on which metal particles are welded. 5. The thin film forming apparatus according to claim 4, wherein the depositing means is sputtering, CVD, vapor deposition, or epitaxial growth. 6. A step of removing deposits deposited on the surface of the deposition-inhibitory plate, a step of blasting the surface of the deposition-inhibitory plate, and metal droplets on the surface of the blast-treated deposition-inhibitory plate. A method for cleaning an adhesion-preventing jig, which comprises a step of discharging.