JP2003246913A - Molding resin composition and electric/electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a molding resin composition used as a solid insulating material for electric/electronic equipment by improving of erosion-resistance keeping tracking-resistance and by mixing a resin with fillers keeping low viscosity so as not to reducing efficiency of resin cast-molding, and to provide the electric/electronic equipment in which the molding resin composition is used as the solid insulating material. <P>SOLUTION: This molding resin composition comprises 100 pts.wt. of an epoxy resin as a main ingredient, 80 pts.wt. of hexahydrophthalic anhydride as a hardening agent, 4 pts.wt. of an organometallic complex as a hardening accelerator, and 330 pts.wt. of amorphous fused quartz which is subjected to surface modification treatment with a titanate-based coupling agent as the filler. The electric/electronic equipment has the solid insulating material which is molded by using the molding resin composition. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a molding resin composition used as a solid insulator for electric parts or electronic parts, and electric / electronic equipment using the molding resin composition.

[0002]

2. Description of the Related Art Electric appliances such as insulators, bushings, transformers, etc. must be installed outdoors, which is exposed to the natural environment, or in a harsh environment, such as a factory, where a lot of dust and dirt are suspended. There are many. Many solid insulators used for electric appliances in such a bad environment are made of an epoxy resin having excellent physical properties and stable chemical properties. Epoxy resin is widely used as a solid insulator for various devices other than the above-mentioned insulator, bushing, and transformer because of its excellent properties, and has reached many days with many achievements.

However, when a solid insulator made of epoxy resin is actually exposed to a harsh environment indoors or outdoors, it is subjected to external stress such as an electric field, heat, ultraviolet rays, and rainfall, and its characteristics change with time. Deterioration was unavoidable. The cause of such characteristic deterioration is particularly the adhesion of dust, soot, moisture, chemical substances, etc., and further, the accumulation of the adhered substances that have been laminated by repeating such adhesion repeatedly over the years. .

Due to the fouling substances formed by these adhesions and deposits, the water repellency of the surface of the solid insulator is temporarily weakened, or a water film connecting the high voltage part and the ground part is formed in order to lose the water repellency. A potential difference may occur on the surface of the insulator, a leakage current may flow, or a discharge may occur.

As described above, due to the dielectric breakdown, local scintillation discharge (microscopic light emission discharge) is repeatedly generated along with the surface leakage current in the high electric field creeping direction, and erosion occurs in which the surface of the insulator is eroded. Alternatively, a groove-shaped carbonized conductive path (tracking) is generated on the surface of the insulator.

Of these erosion tracking methods, in order to prevent the tracking phenomenon, a tracking resistant epoxy resin has been recently developed and gradually applied. This tracking resistant epoxy resin is
The focus is on the fact that the tracking resistance of a polymeric material basically depends on its molecular structure. Generally, there are materials that are deposited as free carbon on the surface during discharge and materials that are removed as volatile carbon compounds such as carbon dioxide, depending on the ratio of carbon atoms contained in the material to other carbon atoms. The latter is a material having high so-called tracking resistance.

However, even if the tracking-resistant epoxy resin is used to suppress the occurrence of tracking, repeated scintillation discharge causes erosion to occur gradually on the surface of the material, increasing the water-retaining property (water-repellent property) at this portion. Deterioration) causes an increase in leakage current and concentrated adhesion of pollutants, resulting in deterioration of electrical insulation performance. Therefore, it is necessary to improve erosion resistance in addition to tracking resistance.

Therefore, an inorganic filler is added to the tracking resistant epoxy resin, and a surface modification treatment is performed to chemically bond and reinforce the interface between the inorganic filler and the organic component in the composition. In actual industrial production, for example, a silica filler is used as an inorganic filler, and γ-
Surface modification treatment is performed with an epoxysilane coupling agent such as glycidoxypropyltrimethoxysilane.

[0009]

However, the tracking resistance epoxy resin filled with the silica filler surface-modified with the above-mentioned epoxysilane coupling agent and the tracking resistance epoxy resin filled with the untreated silica filler are used. When compared with an epoxy resin, the tracking resistant epoxy resin filled with the above-mentioned surface-modified silica filler has an increased initial viscosity.

An epoxy resin having a large initial viscosity has a poor viscous behavior, and, for example, the transferability (following ability of the surface of the mold with respect to the shape of the mold) may be deteriorated, which may cause a defective appearance due to a sink during casting and curing. It was Even if a part of the appearance defect occurs, the article becomes a defective article, and there is a concern that the material cost and the labor cost are wasted. In addition to this, since the initial viscosity is large, there is a problem in that the electrical equipment is insufficiently impregnated with resin between the coil element wires. As described above, there is a problem that the increase of the initial viscosity deteriorates the workability of resin casting.

A method of raising the resin temperature to reduce the initial viscosity is also conceivable, but the curing reaction becomes slow and the pot life (the time until the initial viscosity doubles) is lengthened, and the curing is delayed. This requires a long time, which causes a cost increase as the process lengthens. As described above, it is conventionally difficult to reduce the initial viscosity while avoiding an unnecessarily long pot life, and at present, it is possible to suppress the amount of silica filler mixed with the surface-modified treatment to a predetermined amount or less. Therefore, there was no choice but to suppress an unnecessary increase in the initial viscosity. As a result, the resin composition ratio of the main agent, the curing agent, the curing accelerator, the filler (silica filler), etc. changes, that is, the use ratio of the silica filler, which is low in raw material cost, is reduced. The usage rate increased, and the relative cost increased.

In view of the above problems, the present invention realizes a significant improvement in erosion resistance while maintaining tracking resistance, and a low-viscosity molding resin that does not impair resin casting workability. The present invention provides a composition and an electric / electronic device using the molding resin composition as a solid insulator.

[0013]

Means for Solving the Problems The present inventors have focused on the interfacial property between a matrix resin and a fused silica powder filler, filler surface modification treatment, hydrophobization tendency of treated powder, fluidity of mixed resin, and others, Epoxy resin, acid anhydride curing agent,
The desired purpose was achieved in the course of earnest research, such as the curing accelerator, and if necessary, the mixing ratio of pigments, dyes, coupling agents, etc., the method of homogeneous mixing, the curing conditions such as curing temperature and time, etc. Based on such findings, the present invention has been completed.

That is, the molding resin composition according to the invention of claim 1 comprises an epoxy resin, an acid anhydride curing agent, and
It is characterized by containing an organometallic compound curing accelerator and an inorganic filler subjected to a surface modification treatment with a titanate coupling agent.

Preferably, as described in claim 2, in the molding resin composition according to claim 1, 100 parts by weight of an epoxy resin as a main component, 80 parts by weight of hexahydrophthalic anhydride as a curing agent, and an organic compound. It is desirable to contain 4 parts by weight of a metal complex as a curing accelerator and 330 parts by weight of an amorphous fused quartz surface-modified with a titanate coupling agent as a filler.

As the resin (matrix resin) which is the main component in the present invention, a glycidyl ester type epoxy resin having excellent tracking resistance is recommended. The filler in the present invention is preferably amorphous fused silica (average particle size 15 μm, specific surface area 2.5 m ² / g). This is because if the average particle size is about 15 μm, the filler can be uniformly dispersed in the matrix resin and is versatile. Furthermore, if the filler is subjected to a surface modification treatment in advance, it is possible to improve the conformability at the adhesive interface with the amorphous fused quartz due to the curing shrinkage after gelling that occurs in the matrix resin, and to prevent the occurrence of defects at the adhesive interface. By reducing the viscosity of the resin, etc., the viscosity of the resin is suppressed to obtain a stable curing reaction.

The molding resin composition according to the invention of claim 3 is the molding resin composition according to claim 1 or 2, wherein the epoxy resin as a main component is a glycidyl ester type epoxy resin, The titanate-based coupling agent subjected to the surface modification treatment is characterized in that it is isopropyltriisostearoyl titanate or tetraoctylbis (ditridecylphosphite) titanate.

As the surface modification treatment, a titanate coupling agent such as isopropyl triisostearoyl titanate or tetraoctyl bis (ditridecyl phosphite) titanate as described above is used because the viscosity of the mixed and prepared resin is not increased. Surface modification treatment is preferred.

An electric / electronic device according to a fourth aspect of the present invention includes a solid insulating portion resin-molded using the molding resin composition according to any one of the first to third aspects. It is characterized by being provided.

An electric / electronic device according to a fifth aspect of the present invention is the electric / electronic device according to the fourth aspect, wherein any one of a terminal, a conductor, a coil, a voltage non-linear resistor element, or a combination thereof is used. A certain insert is placed in a mold, and the solid resin is formed by filling the molding resin composition according to any one of claims 1 to 3. .

An electric / electronic instrument according to a sixth aspect of the present invention is the electric / electronic instrument according to the fifth aspect, wherein an insert comprising a terminal, a coil and an iron core is arranged in a mold, and A transformer formed by filling the molding resin composition according to claim 3 to form a solid insulator.

According to a seventh aspect of the present invention, there is provided the electric / electronic instrument according to the fifth aspect, wherein an insert comprising a terminal and a voltage non-linear resistance element is arranged in a mold. It is a lightning arrester formed by filling the molding resin composition according to any one of claims 1 to 3 to form a solid insulator.

As described above, the molding resin composition according to any one of claims 1 to 3 is required to have both tracking resistance and erosion resistance in electric and electronic equipment (claim 4, 5) In particular, it is used for electric / electronic devices such as transformers (claim 6) and lightning arresters (claim 7) to suppress the occurrence of tracking phenomena and erosion phenomena. Since the molding resin composition has improved castability and good shape transferability and the like, it can be used as a material for a solid insulator of an electric / electronic device having a complicated shape.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, embodiments of the present invention will be described. The molding resin composition contained 100 parts by weight of a glycidyl ester type epoxy resin (CY184 manufactured by Bantico) as a matrix resin and 8 parts of hexahydrophthalic anhydride (Shikajid HH manufactured by Shin Nippon Rika Co., Ltd.) as a curing agent.
0 parts by weight, 4 parts by weight of an organometallic complex (DY065J manufactured by Bantico) as a curing accelerator, and 330 parts by weight of amorphous fused silica (manufactured by Tatsumori) as a filler (filler) were blended.

As described above, the filler is a silica powder having an average particle size of 15 μm and a specific surface area of 2.5 m ² / g, and the silica powder has a surface modifier (titanate coupling). Agent) isopropyltriisostearoyl titanate or tetraoctyl bis (ditridecyl phosphite) titanate, which is diluted with a small amount of a solvent, is sprayed to react with stirring with a Henschel type mixer, then dried and subjected to coupling treatment. did. Here, the amount of the surface modifier is determined as follows.

[0026]

[Equation 1]

Next, the reason why such a molding resin composition is suitable will be described. Here, various surface modification treatments are performed on the surface of the filler, and the background of finding the most preferable molding resin composition of the present invention by comparing these is described together with experimental results. In the experiment, the following three kinds of ideas by the filler surface modification were assumed as a measure for improving the erosion resistance against scintillation discharge.

By making the surface of the filler hydrophobic,
The wettability of the matrix resin and the filler is improved, the binding force is relatively improved, and moisture absorption at the interface between the resin and the filler is prevented. According to the basic idea, the binding force is further improved by the entanglement of the molecular chains of the matrix resin and the modified layer. By forming a reactive functional group on the filler surface and covalently bonding the matrix resin and the filler, a strong bonding force is secured.

Table 1 shows the surface modifiers and sample numbers selected for each of the above ideas.

[0030]

[Table 1]

In Table 1 above, a glycidyl ester type epoxy resin as a matrix resin (CYCO manufactured by Bantico) is used.
184), 80 parts by weight of hexahydrophthalic anhydride (Shikajid HH manufactured by Shin Nippon Rika Co., Ltd.) as a curing agent, 4 parts by weight of an organometallic complex (DY065J manufactured by Bantico) as a curing accelerator, and a filler (filler). Is a mixture of 330 parts by weight of amorphous fused silica (manufactured by Tatsumori Co., Ltd.), and a table of molding resin compositions in which the surface modification treatment for fillers is variously changed. The filler is Henschel while spraying a solution prepared by diluting one of the above surface modifiers with a small amount of a solvent on silica powder having an average particle size of 15 μm and a specific surface area of 2.5 m ² / g. It is common in that after stirring reaction with a mold mixer, it was dried and subjected to coupling treatment.

In Table 1, methyl-based silane surface modifiers generally belong to titanate-based surface modifiers, and epoxy-based silane surface modifiers belong to. In addition,
B-1 and B-3 are the molding resin compositions of the present invention exhibiting the most preferable properties.

The following evaluation experiments and evaluations were carried out using such various molding resin compositions. (1) Hydrophobicity evaluation experiment and evaluation of surface-modified silica powder (2) Fluidity evaluation experiment and evaluation of mixed resin (3) Erosion resistance evaluation experiment and evaluation (4) Morphological observation of erosion part explain.

(1) Hydrophobicity evaluation experiment of surface-modified silica powder and contents of evaluation experiment Two-layer liquid of water and n-hexane (15 ml of water and 15 ml of n-hexane) previously placed in a 50 ml beaker.
ml: a total of 30 ml), 0.2 g of untreated and surface-modified silica powder was introduced, and ultrasonic vibration was applied for 5 seconds, and then the dispersed state of the powder was observed.

Evaluation Table 2 below shows the results of evaluating the hydrophobicity of various surface-treated silicas.

[0036]

[Table 2]

Basically, the lower the dispersibility in water and the higher the dispersibility in n-hexane, the higher the hydrophobicity. The untreated powder has a hydrophilic property which is considered to be influenced by the hydroxyl groups on the surface because it is dispersed only in water, whereas the A-type and titanate-type surface modifiers using a methyl-type silane surface modifier aiming at hydrophobization. The B type sample using was not dispersed in water, but was dispersed only in n-hexane. As a result, it was confirmed that these samples were sufficiently hydrophobized.

On the other hand, the C type sample using the epoxy type silane surface modifier aiming at the covalent bond shows a tendency to disperse in both water and n-hexane, so that it is hydrophobized as compared with the untreated sample. However, due to the influence of functional groups such as glycidoxy groups, it was confirmed that the degree of hydrophobization is not as extreme as that of A and B systems.

(2) Fluidity Evaluation Experiment of Mixed Resin and Details of Evaluation Experiment 1650 g of untreated and various surface-modified silica powder was put into 500 g of matrix resin, and agitated by an electric agitator for 10 minutes. During this period, it was observed whether the silica powder was well dispersed in the matrix resin and showed a morphology of the mixed resin having fluidity, and when it was good, the mixed resin viscosity was measured using a B-type viscometer.

Evaluation Table 3 below shows the evaluation results concerning the fluidity of various surface-modified silica mixed resins.

[0041]

[Table 3]

As shown in Table 3, although there is a difference in the dispersibility of the filler in the resin, there is a large difference in the fluidity of the mixed resin between the samples, and A-1, B-1 to B-. No. 3 had a lower viscosity than the untreated one, but C-1 and 2 showed a tendency to have a higher viscosity. The reason why the viscosity is reduced in A-1 and B-1 to B-3 is considered to be improvement in wettability between the silica powder and the matrix resin. On the other hand, as the reason for increasing the viscosity, in C-1 and C-2, the reactive functional group (glycidoxy group in the case of C-1 and epoxycyclohexyl group in the case of C-2) of the surface modification layer and the matrix resin It is considered that this is due to the progress of the reaction.

(3) Erosion resistance evaluation experiment and evaluation experiment FIG. 1 shows an explanatory view of a test piece and an electrode mounting mode. As shown in FIG. 1, a test piece (thickness 6 mm, width 70 m) using various surface-modified silica as a filler.
m, flat plate with a length of 120 mm) is molded, and IEC6058
Performed the inclined plate method tracking resistance test based on 7.
The time until dielectric breakdown and the erosion depth after dielectric breakdown were measured. Actually, the electrodes were installed facing each other on the lower side of the flat plate inclined at 45 &deg;, and the pollution liquid was flowed little by little from the tip of the upper electrode while the voltage was constantly applied. The details of the test conditions are shown in Table 4.

[0044]

[Table 4]

Evaluation I of 5 types of molded products excluding C-2, which is difficult to mold in practice,
2 to 4 are graphs in which the data until the flashover in the EC60587 inclined plate method tracking resistance test, the maximum erosion depth and the erosion depth per unit time (erosion speed) are plotted.

As a result, when the methyl-silane-treated filler is used, the erosion resistance is reduced, as compared with the non-treated filler, and the effect of improving the wettability between the matrix resin and the filler is hardly exhibited. It was confirmed. On the other hand, in the sample using the titanate-based filler, which is considered to cause the entanglement of the modified layer and the resin with the hydrophobicization, and the sample using the epoxy-silane-treated filler for covalent bonding with the matrix resin, The erosion speed is lower than that of the untreated one (Fig. 4).
It was confirmed that the erosion resistance was improved. For titanate, hydrophobization and entanglement of molecular chains,
It is considered that the effect of the significant improvement in the bonding strength was exhibited for the epoxysilane.

The relationship between the erosion speed, the erosion depth and the time until flashover is examined as follows. First, since carbonization does not occur basically in this sample, it is considered that the discharge current mainly flows through the fouling liquid on the sample surface. In the initial stage where erosion does not occur, the fouling liquid is dispersed in a plane, but as the erosion occurs, the water channel becomes concentrated in the erosion part. In FIG. 3, the erosion depth is about 1.5 mm on average for all the samples, which means that the water channel in which the discharge current (60 mA) defined as the flashover flows is formed at this erosion depth. From this, it is considered that the time until the flashover corresponds to the time until the water channel of the same level is formed (erosion speed).

(4) Observation of Morphology of Erosion Part The morphology of the test piece after the above-mentioned test was observed with SEM (JEOL JSM820) centering on the erosion part. FIG. 5 shows the appearance of the test piece after the IEC60587 tracking resistance test and a cross-sectional observation view of the erosion part. A morphological observation image of the erosion part by SEM is shown in FIG. As a result, erosion occurs between the upper and lower electrodes, but the width and the depth thereof are partially changed. No carbonized deposits are found in the erosion area. On the other hand, from the morphological observation of the fine structure of the erosion part, it was confirmed that the matrix resin disappeared and the filler was rich in all the samples.

The conclusions obtained from the above-mentioned experimental results (1) to (4) will be described. Regarding electrical insulation epoxy resin (glycidyl ester type epoxy resin) with excellent tracking resistance, for the purpose of improving erosion resistance in scintillation discharge, hydrophobization (methyl silane treatment), hydrophobization + entanglement of molecular chains (titanate) The surface of the filler was modified based on three types of ideas: system treatment) and covalent bonding (epoxy silane treatment). The following conclusions were obtained as a result of investigating the hydrophobicity of the filler, the viscosity at the time of mixing, the mechanical properties of the molded product, and the erosion resistance at the time of discharge.

(1) While the untreated silica filler is hydrophilic, the methyl silane-treated and titanate-treated fillers are completely hydrophobic, and the epoxy silane-treated filler is also slightly hydrophobic.

(2) The viscosity of the mixed resin of the methyl-silane-treated filler and the titanate-treated filler decreased due to the improvement of the wettability of the resin, but the epoxy-silane-treated filler tends to have a high viscosity due to the reaction with the resin. Show.

(3) The erosion resistance of the molded article against discharge is improved when the titanate-treated and epoxy-silane-treated fillers are used, as compared with the untreated case. The effect of hydrophobization and entanglement of molecular chains was shown in the titanate type, and the effect of covalent bond formation between the resin and the filler was shown in the epoxy type silane. The time until flashover corresponds to the erosion speed.

(4) The surface of the erosion portion after the flashover is filler rich in all the samples, and it is considered that the property of the filler surface has a great influence on the erosion resistance.

(5) When the titanate-based modification treatment is performed on the filler, the erosion resistance is improved and the molding processability is improved due to the decrease in the viscosity of the mixed resin, while the epoxy-based silane surface modification treatment is performed. In this case, improvement in erosion resistance is found as a merit,
We obtained the knowledge to use these properly depending on the application.

As described above, it is understood that the mixed resin treated with the titanate according to the present invention can suppress the desired increase in viscosity at the time of resin mixing and can significantly improve the erosion resistance. Next, by using these epoxy resins as solid insulators for electric / electronic parts, etc., they can be used according to various applications such as insulators, bushings, transformers and the like. These can be manufactured by ordinary epoxy resin casting work without special treatment such as casting equipment and curing conditions. That is, the insert is arranged in the mold, and the above-mentioned claim 1 and claim 2
Alternatively, the resin composition for molding according to the third aspect of the present invention is filled, and the resin is manufactured through steps such as primary curing and secondary curing, but details thereof will be omitted. Even if these insulators, bushings, transformers, etc. are arranged outdoors or in a harsh environment such as in a factory where there is a lot of dust such as in a factory, they have erosion resistance and are less susceptible to environmental pollution and deterioration, and maintenance and inspection work is also possible. Labor saving can be achieved.

[0056]

EFFECTS OF THE INVENTION According to the present invention, the erosion resistance is greatly improved, the viscosity of the mixed resin is reduced, and the resin casting workability is not impaired, and it is used as a solid insulator constituting electric / electronic parts and the like. It is possible to obtain an epoxy resin capable of Further, an electric / electronic component or the like provided with this solid insulator can maintain excellent insulating performance for a long period of time even if it is arranged in a harsh environment.

In general, the present invention realizes a significant improvement in erosion resistance while maintaining tracking resistance, reduces the viscosity of the mixed resin of the filler, and does not impair the workability of resin casting, and It is possible to provide a molding resin composition that can be used as a solid insulator that constitutes an electronic component or the like, and an electric / electronic device that uses the molding resin composition as a solid insulator.

[Brief description of drawings]

FIG. 1 is an explanatory view of a test piece and an electrode attachment form.

FIG. 2 is a graph in which data of time until flashover in a IEC60587 inclined flat plate method tracking resistance test of five types of molded products is plotted.

FIG. 3 is a graph in which data of maximum erosion depths in the IEC60587 inclined flat plate method tracking resistance test of five types of molded products are plotted.

FIG. 4 is a graph in which erosion depth (erosion speed) data per unit time in IEC60587 inclined flat plate method tracking resistance test of five types of molded products is plotted.

FIG. 5 is an external view of a test piece and an erosion section cross-sectional view after an IEC60587 tracking resistance test.

FIG. 6 is a morphological observation image of an erosion portion by SEM.

─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. ⁷ Identification code FI theme code (reference) H01B 17/60 H01B 17/60 Z (72) Inventor Taro Yamashita 1-7-1 Yurakucho, Chiyoda-ku, Tokyo Toko Electric Co., Ltd. (72) Inventor Sachio Yoshihara, 7-2, Yohito, Utsunomiya City, Tochigi Prefecture Utsunomiya University Faculty of Engineering (72) Inventor Takashi Shiragashi, 1-2, Yohto, Utsunomiya City, Tochigi Prefecture Utsunomiya University F-term in the Faculty of Engineering (reference) 4F071 AA42 AB26 AC09 AC20 AE17 AH12 BA02 BA03 BB01 BB05 BB12 BC07 4J002 CD001 DJ016 EL137 FB166 FD016 FD147 FD158 GQ01 HA02 4J036 AA01 DB15 FA01 FA05 GA07 JA15 5G303 AA10 CA03 AB08 AB03 AB20 AB03 AB08 AB03 AB08 AB03 AB08 CA01 CB17 DA04 DA21

Claims (7)

[Claims] 1. An epoxy resin and an acid anhydride curing agent,
A molding resin composition comprising an organometallic compound curing accelerator and an inorganic filler which has been subjected to a surface modification treatment with a titanate coupling agent. 2. The molding resin composition according to claim 1, wherein 100 parts by weight of an epoxy resin as a main component, 80 parts by weight of hexahydrophthalic anhydride as a curing agent, and 4 parts by weight of an organometallic complex as a curing accelerator, A molding resin composition comprising 330 parts by weight of amorphous fused silica which has been surface-modified with a titanate coupling agent as a filler. 3. The molding resin composition according to claim 1 or 2, wherein the epoxy resin as a main component is a glycidyl ester type epoxy resin, and the titanate-based coupling agent to be surface-modified is isopropyl trioxide. A resin composition for molding, which is isostearoyl titanate or tetraoctyl bis (ditridecyl phosphite) titanate. 4. An electric / electronic device comprising a solid insulating part resin-molded using the molding resin composition according to claim 1. Description: 5. The electric / electronic device according to claim 4, wherein an insert, which is any one of a terminal, a conductor, a coil, a voltage non-linear resistance element, or a combination thereof, is arranged in a mold, and An electric / electronic device comprising the resin composition for molding according to claim 3 filled therein to form a solid insulator. 6. The electric / electronic device according to claim 5, wherein an insert comprising a terminal, a coil and an iron core is arranged in a mold, and the molding resin according to any one of claims 1 to 3. An electric / electronic device comprising a transformer filled with a composition to form a solid insulator. 7. The electric / electronic device according to claim 5, wherein an insert comprising a terminal and a voltage non-linear resistance element is arranged in a mold, and the insert according to claim 1. An electric / electronic device comprising a lightning arrester formed by filling a molding resin composition to form a solid insulator.