JP2003244558A - Image pickup device and manufacturing method therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suitably curve a solid-state image pickup element into a desired curvature and arrange it inside a camera, etc. <P>SOLUTION: The solid-state image pickup element 30 is formed into a shape of a thin film chip, having a film thickness of 20 μm or smaller, and is bonded and fixed on a mounting recessed portion 42 of a wiring substrate 40, in a state of a bare chip with no package or the like. The portion 42 is formed into, e.g. an arc surface or a spherical surface which is curved in a prescribed curvature. The element 30 is bonded and fixed in a state curved in a prescribed curvature by this portion 42 and is connected to a pad portion of the substrate 40. With this configuration, the curved device 30 can be positioned and arranged at a prescribed position in a camera module, thereby preventing sensitivity shading in the case of shortening an emission focus distance of a lens 20. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image pickup apparatus using a solid-state image pickup element such as a CCD type image sensor or a CMOS type image sensor formed in a thin film chip, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, various still cameras and video cameras using this type of solid-state image pickup device have been provided. A camera using such a solid-state image sensor is miniaturized by taking advantage of the characteristics of the solid-state image sensor, but in order to achieve further miniaturization, not only the solid-state image sensor but also the surrounding optical It is necessary to reduce the size of the system, and in particular, it is necessary to shorten the exit pupil distance of the lens. However, when the exit pupil distance of the lens is shortened, incident light enters the photosensor obliquely in the peripheral portion of the chip of the solid-state image sensor, which causes a problem of sensitivity shading. Therefore, in order to improve such a defect,
A method has been proposed in which at least the left and right ends are arranged so as to be curved toward the light incident side with a predetermined curvature (see, for example, Japanese Patent Laid-Open No. 6-133229).

[0003]

However, in manufacturing an actual image pickup apparatus, it is not easy to arrange the solid-state image pickup element in a curved shape. For example, a normal Si wafer cannot be bent, and it is necessary to reduce the thickness of the chip in order to bend the chip of the image pickup device. However, if the chip is thinned by using a conventional technique such as backside grinding, there is a problem that the cost increases. Also,
When the chip becomes thin to some extent, there is a problem that the Si wafer is easily broken.

On the other hand, the applicant of the present application provides a porous silicon layer on a silicon substrate, forms a solid-state image sensor on an epitaxial layer grown on the porous silicon layer, and then separates the silicon substrate by the porous silicon layer. Therefore, a manufacturing method for obtaining a thin film solid-state imaging device is proposed (see Japanese Patent Laid-Open No. 2001-257337). According to such a method, it is possible to stably manufacture a thin film chip-shaped solid-state imaging device having a film thickness of, for example, 20 μm or less.

In view of the background described above, an object of the present invention is to allow a solid-state image pickup device thinned by some method to be appropriately curved to a desired curvature and to be arranged in various devices, thereby reducing the size of each device. An object of the present invention is to provide an imaging device and a method for manufacturing the same that can contribute to improvement in quality, quality, yield, and the like.

[0006]

In order to achieve the above object, the present invention provides a solid-state image sensor formed in a thin film chip shape,
A supporting member on which the solid-state image sensor is mounted, the supporting member is provided with a mounting recess curved with a predetermined curvature, and the solid-state image sensor is mounted in a curved state along the mounting recess. . Further, the present invention is a method for manufacturing an imaging device having a solid-state imaging device formed in the shape of a thin film chip and a support member for mounting the solid-state imaging device, wherein the support member has a mounting recess curved at a predetermined curvature. It is characterized by including an assembling step of mounting the solid-state imaging device in a curved state along the mounting recess.

In the image pickup apparatus of the present invention, by mounting the solid-state image sensor formed in the shape of a thin film chip in the mounting recess provided in the support member of the solid-state image sensor, the solid-state image sensor is guided along the curvature of the mounting recess. Therefore, it can be attached to and fixed to the support member after being deformed to a predetermined curvature. Therefore, by incorporating the support member on which the solid-state image pickup device is mounted in various devices, the thin-film solid-state image pickup device can be easily arranged in various devices in a state of being appropriately curved to a desired curvature. It can contribute to downsizing, quality improvement, and yield improvement.

Further, according to the manufacturing method of the present invention, in the process of assembling the solid-state image pickup device formed in the shape of a thin film chip and the support member, the support member is provided with a mounting recess curved with a predetermined curvature, and the mounting recess is provided along the mounting recess. Since the solid-state image sensor is mounted in a curved state, the solid-state image sensor can be guided along the curvature of the mounting recess, and can be mounted on and fixed to the support member after being deformed to a predetermined curvature. Therefore, by incorporating the support member on which the solid-state image pickup device is mounted in various devices, the thin-film solid-state image pickup device can be easily arranged in various devices in a state of being appropriately curved to a desired curvature. It can contribute to downsizing, quality improvement, and yield improvement.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of an image pickup device and a manufacturing method thereof according to the present invention will be described below. The embodiments described below are preferred specific examples of the present invention, and various technically preferable limitations are given. However, the scope of the present invention is not limited to the present invention in the following description. Unless otherwise stated, the present invention is not limited to these embodiments.

FIG. 1 is a sectional view showing a state in which an image pickup apparatus according to a first embodiment of the present invention is incorporated in a camera module. In this camera module, a condenser lens 20 is arranged on the front surface of a case 10, and a wiring board 40 having a solid-state image sensor 30 inside the case 10 is positioned and arranged with respect to the lens 20. The wiring board 40 functions as a support member of the solid-state imaging device 30, has a mounting recess 42 curved with a predetermined curvature on a surface facing the lens 20, and has a bare chip shape along the mounting recess 42. The solid-state imaging device 30 is fixed in a curved state by adhesion.

The solid-state image pickup device 30 is, for example, an interline transfer type CCD image sensor, and includes a large number of photosensors which are photoelectric conversion devices in a two-dimensional matrix on a semiconductor substrate, and is arranged in each photosensor column. A plurality of CCD vertical charge transfer sections, a CCD horizontal charge transfer section provided at an end of the CCD vertical charge transfer section, and a CC
An output unit for converting the signal charges transferred by the D horizontal charge transfer unit into an electric signal is provided, and a light shielding film, an on-chip filter, an on-chip microlens, etc. are further provided on the output unit. In addition, the solid-state imaging device 30 of this example
Is formed as a thin film chip having a film thickness of 20 μm or less, and is in a bare chip state without a package,
It is adhesively fixed to the mounting recess 42 of the wiring board 40.

The mounting recess 42 is formed in the lens 20 as described above.
In order to prevent sensitivity shading when the exit pupil distance is shortened, the solid-state image sensor 30 is arranged in a curved state with a predetermined curvature, and the predetermined curvature corresponding to the curved shape of the solid-state image sensor 30. Is formed in an arc shape, for example. The curved shape may be a partial one having a curvature in only one-dimensional direction, for example, an arc surface, or a partial one having a curvature in a two-dimensional direction, for example, a spherical shape. Good. Further, it may have a curved shape such as an arc surface shape or a spherical shape or more.

Further, for the electrical connection between the solid-state image pickup device 30 and the wiring board 40, for example, a pad portion corresponding to the pad portion on the solid-state image pickup device 30 side is formed on the wiring board 40 side, and the solid-state image pickup element 30 is adhesively fixed. After that, the pads may be connected to each other by solder reflow, or after the solid-state imaging device 30 is bonded and fixed, the pads of the solid-state imaging device 30 and the pads on the wiring board 40 side may be wire-bonded. You may Further, in this example, the peripheral IC chips 50A and 50B are provided on the back side of the solid-state imaging device 30 of the wiring board 40.
Is provided. However, when the area of the wiring board 40 is larger than that of the solid-state imaging device 30, it is possible to provide a peripheral IC chip on the surface side of the wiring board 40 on which the solid-state imaging device 30 is provided.

Next, a method of manufacturing such an image pickup device will be described. FIG. 2 is an explanatory diagram showing a method of manufacturing the image pickup device according to the present embodiment. First, on the semiconductor wafer 60 shown in FIG. 2 (A), a large number of the above-mentioned solid-state imaging devices 30 are formed. The semiconductor wafer 60 is thinned by the method disclosed in, for example, Japanese Patent Laid-Open No. 2001-257337. That is, a porous silicon layer is provided on a silicon substrate (wafer),
After forming each layer of the solid-state imaging device on the epitaxial layer grown on the upper layer, by separating the silicon substrate by the porous silicon layer, only the semiconductor substrate by epitaxial growth is separated to obtain a thin film wafer. For example, a solid-state image sensor having a film thickness of 20 μm or less is manufactured.

Next, such a thin film wafer 60 is shown in FIG.
As shown in (B), dicing is performed in a state of being stuck on the supporting base 70 for reinforcement, and the chips are separated. After that, the solid-state imaging device 30 is appropriately separated from the support base 70 to obtain the thin-film chip-shaped solid-state imaging device 30. Then, as shown in FIG. 2C, the solid-state imaging device 30 in the form of a thin film chip is positioned and mounted in the mounting recess 42 of the wiring board 40, and is fixed in an adhesive state with an adhesive. As a result, the solid-state imaging device 30 can be mounted and fixed in a state of being curved in a curvature corresponding to the curvature shape of the mounting recess 42.

The equipment for mounting the solid-state image sensor 30 in the mounting recess 42 includes, for example, the solid-state image sensor 3
0 is suction-held by the vacuum suction nozzle mounted on the robot arm, and the solid-state imaging device 30 is positioned and arranged in the mounting recess 42 of the wiring board 40 which is positioned and arranged at a predetermined position by the operation of the robot arm. Then, the solid-state imaging device 30 is pressed toward the mounting recess 42 side by the operation of the pressing member provided in parallel with the vacuum suction nozzle, and the solid-state imaging device 30 is curved and deformed using the curvature shape of the mounting recess 42 as a guide.
The solid-state image sensor 30 and the mounting recess 42 are bonded together by an adhesive provided between the two. At this time, an elastic pad made of rubber or the like having a shape corresponding to the curvature shape of the mounting recess 42 is mounted on the tip end surface of the pressing member, and the solid-state imaging device 30 is pressed against the mounting recess 42 side by this elastic pad, so that a stable operation is achieved. It becomes possible to perform the mounting work of the solid-state image sensor 30, and the solid-state image sensor 30 is not damaged.
After that, the solid-state imaging device 30 is connected to the pad portion of the wiring board 40, and the assembly work for the module shown in FIG. 1 is performed.

Next, a second embodiment of the present invention will be described. In the first embodiment described above, the solid-state image sensor 30 is mounted in the mounting recess 42 of the wiring board 40. However, in the second embodiment, the same thin film chip shape as that of the first embodiment described above is used. The solid-state imaging device 30 is mounted in a mounting recess provided in the package with the lead frame. FIG. 3 is a sectional view showing an image pickup apparatus according to the second embodiment of the present invention. In the package body 80,
A mounting recess 82 for bending and mounting the solid-state imaging device 30 with a predetermined curvature is formed in the central portion, and the solid-state imaging device 30 is bonded and fixed in the same process as in the above-described first embodiment. ing. Further, a lead frame 90 is incorporated on the outer side of the package body 80, and the solid-state image sensor 3 is attached to the inner lead portion of the lead frame 90.
0 is wire-bonded. Then, the transparent cover 100 is mounted on the upper surface of the package body 80 to complete the package.

In this example, the solid-state image pickup device 30 is connected to the lead frame 90 by wire bonding. However, for example, a pad portion corresponding to the pad portion on the solid-state image pickup device 30 side is provided on the bottom surface of the package. In the case of the configuration of die bonding, the solid-state image sensor 3
After bonding and fixing 0, the pad portions may be connected to each other by solder reflow. The method of manufacturing the imaging device shown in FIG. 3 is almost the same as the configuration shown in FIG.

In this embodiment as described above, the solid-state image pickup element can be arranged so as to be curved to a desired curvature, and sensitivity shading can be reduced without performing pupil correction of the on-chip lens even in a camera having a short exit pupil distance. It is possible.
Also, when forming a thin film chip-shaped solid-state imaging device,
Since the method of thinning the silicon substrate (wafer) used as the basis of the epitaxial layer is used, there is no need to perform backside grinding, the silicon substrate can be repeatedly used, and cost reduction can be achieved. . Although the case where the solid-state imaging device is mounted on the wiring board or the package with the lead frame has been described above, the present invention is not limited to this, and is widely applicable to a configuration in which the solid-state imaging device is mounted on another supporting member. It is applicable. Further, it can be applied to a solid-state image pickup device other than the CCD image sensor. Also, as for the method of thinning the solid-state imaging device, the thickness may be thinned by another method.

[0020]

As described above, according to the image pickup apparatus of the present invention, by mounting the solid-state image pickup device formed in the shape of a thin film chip in the mounting recess provided in the support member of the solid-state image pickup device, The solid-state image sensor can be guided along the curvature, and can be mounted on and fixed to the support member after being deformed to a predetermined curvature. The image pickup element can be easily arranged in various devices in a state of being appropriately curved to a desired curvature, which can contribute to downsizing of various devices, improvement of quality, and improvement of yield.

Further, according to the manufacturing method of the present invention, in the process of assembling the solid-state image pickup device formed in the shape of a thin film chip and the support member, the support member is provided with a mounting recess curved at a predetermined curvature, and the mounting recess is provided. Since the solid-state image sensor is mounted in a curved state along with, the solid-state image sensor can be guided along the curvature of the mounting recess, and can be mounted and fixed to the support member after being deformed to a predetermined curvature. By incorporating the support member with the image pickup device mounted in various devices, it is possible to easily arrange the thin-film solid-state image pickup device in various devices in a state where the solid-state image pickup device is properly curved to a desired curvature, and to reduce the size of various devices. It can contribute to quality improvement and yield improvement.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a state in which an imaging device according to a first embodiment of the present invention is incorporated in a camera module.

FIG. 2 is an explanatory diagram showing a method of manufacturing the imaging device shown in FIG.

FIG. 3 is a sectional view showing a packaged image pickup device according to a second embodiment of the present invention.

[Explanation of symbols]

10 ... Case, 20 ... Condensing lens, 30 ... Solid-state image sensor, 40 ... Wiring board, 42, 82 ... Mounting recess,
50A, 50B ... peripheral IC chip, 60 ... semiconductor wafer, 70 ... support base, 80 ... package body, 9
0: Lead frame, 100: Transparent cover.

Continued front page    F-term (reference) 4M118 AB01 BA06 GD03 HA24 HA25                       HA29                 5C024 CY47 CY49 EX21 EX22 EX23                       EX42 EX43 EX51 GY04                 5F088 BA15 BB03 GA04 JA03 JA10                       JA12 JA20

Claims (22)

[Claims] 1. A solid-state image sensor formed in the shape of a thin film chip, and a support member for mounting the solid-state image sensor, wherein the support member is provided with a mounting recess curved at a predetermined curvature.
An imaging device, wherein the solid-state imaging device is mounted along the mounting recess in a curved state. 2. The image pickup apparatus according to claim 1, wherein the support member is a package with a lead frame, and the solid-state image pickup element is bonded in a curved state to a mounting recess provided in the package. 3. The image pickup device according to claim 2, wherein the solid-state image pickup device is connected to the lead frame by die bonding by adhering the solid-state image pickup device in a curved state to a mounting recess provided in the package. 4. The image pickup apparatus according to claim 2, wherein the solid-state image sensor is bonded in a curved state to a mounting recess provided in the package, and the solid-state image sensor is connected to a lead frame by wire bonding. 5. The image pickup device according to claim 1, wherein the support member is a wiring board, and a solid-state image pickup element is bonded in a curved state to a mounting recess provided in the wiring board. 6. The image pickup device according to claim 5, wherein the solid-state image pickup element is connected to the board wiring by die bonding by adhering the solid-state image pickup element in a curved state to a mounting recess provided in the wiring board. . 7. The image pickup device according to claim 5, wherein the solid-state image pickup element is bonded in a curved state to a mounting recess provided in the wiring board, and the solid-state image pickup element is connected to the board wiring by wire bonding. . 8. The image pickup apparatus according to claim 5, wherein the wiring board is incorporated in a camera module. 9. The image pickup apparatus according to claim 1, wherein the mounting recess of the support member has a curved surface in a one-dimensional direction. 10. The image pickup apparatus according to claim 1, wherein the mounting recess of the support member has a curved surface in a two-dimensional direction. 11. The image pickup apparatus according to claim 1, wherein the solid-state image pickup element is formed in a thin film chip shape having a film thickness of 20 μm or less. 12. A method of manufacturing an image pickup apparatus, comprising: a solid-state image sensor formed in the shape of a thin film chip; and a support member for mounting the solid-state image sensor, wherein the support member has a mounting recess curved at a predetermined curvature. Provided,
A method of manufacturing an image pickup device, comprising: an assembling step of mounting the solid-state image pickup element in a curved state along the mounting recess. 13. The method of manufacturing an image pickup device according to claim 12, wherein the support member is a package with a lead frame, and the solid-state image pickup element is bonded in a curved state to a mounting recess provided in the package. . 14. The image pickup device according to claim 13, wherein the solid-state image pickup device is connected to the lead frame by die bonding by adhering the solid-state image pickup device in a curved state in a mounting recess provided in the package. Production method. 15. The image pickup apparatus according to claim 13, wherein the solid-state image sensor is bonded in a curved state to a mounting recess provided in the package, and the solid-state image sensor is connected to a lead frame by wire bonding. Production method. 16. The method of manufacturing an image pickup apparatus according to claim 12, wherein the support member is a wiring board, and a solid-state image pickup element is bonded in a curved state to a mounting recess provided in the wiring board. 17. The image pickup device according to claim 16, wherein the solid-state image pickup device is connected to the substrate wiring by die bonding by adhering the solid-state image pickup device in a curved state to a mounting recess provided in the wiring board. Manufacturing method. 18. The image pickup device according to claim 16, wherein the solid-state image pickup element is bonded in a curved state to a mounting recess provided on the wiring board, and the solid-state image pickup element is connected to the board wiring by wire bonding. Manufacturing method. 19. The method of manufacturing an image pickup device according to claim 16, wherein the wiring board is incorporated in a camera module. 20. The method according to claim 12, wherein the mounting recess of the support member has a curved surface in a one-dimensional direction. 21. The method of manufacturing an image pickup device according to claim 12, wherein the mounting recess of the support member has a curved surface in a two-dimensional direction. 22. The method of manufacturing an image pickup device according to claim 12, wherein the solid-state image pickup element is formed in a thin film chip shape having a film thickness of 20 μm or less.