JP2003242475A - Ic card - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an IC card having non-PVC material, capable of obtaining a clear and high-gradation print and hardly causing curling due to heat. <P>SOLUTION: This IC card has a core sheet 2 having an IC module, and surface and back over-sheets 7, 8 stacked on both sides of the core sheet 2. The surface and back over-sheets 7, 8 are resin sheets mainly composed of amorphous polyester resin having a melting point of 75 to 150°C, and having the stress change at 80°C ranging from -5 to 5 gf. In the IC card, an image receiving layer 9 is formed on the surface on the opposite side to the core sheet 2 on the surface side over-sheet 7. As the amorphous polyester resin, especially it is preferable to use polycarbonate/amorphous polyester blend resin having a softening point of 120 to 150°C. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a commuter pass, a pass ticket,
An IC card used for a membership card, an ID card, a prepaid card, a tag, and the like, and more particularly to an IC card supplied as a white card for a user to print a desired image using a commercially available thermal transfer printer, The present invention relates to those having improved image dyeing property and heat-resistant curl property.

[0002]

2. Description of the Related Art As a small-sized recording medium capable of holding a large amount of recording, an IC card having an IC module inside is becoming popular. This type of IC card is generally formed by arranging an IC module, an antenna, etc. on a core sheet to form an inlet, and laminating a pair of oversheets on both sides of the inlet, using a heat fusion press or an adhesive. It is manufactured by integrating by press bonding.

As the oversheet, a plastic sheet excellent in electric insulation and waterproofness is generally used in order to prevent destruction of information in the IC module. On the over sheet, in order to confirm the owner of the IC card, character information such as the owner's name and ID number, image information such as a facial photograph, or bar code information is provided. Moreover, as the number of cards carried by one user increases with the spread of cards, colorful patterns, etc. should be displayed on the oversheet to make it easier to identify from a large number of cards. It is also being formed.

As described above, various methods such as an offset printing method and a screen printing method are used to form an image on the oversheet on the surface of the IC card. In particular, the oversheet made of plastic is used. Further, as a method capable of clearly forming a high gradation image such as a face photograph, a sublimation heat transfer method or a fusion heat transfer method is suitable.

In the sublimation thermal transfer system, an ink sheet is superposed on an image receiving medium on which an image is to be formed, and ink in a portion corresponding to the image in the ink sheet is locally heated by a thermal head to be sublimated, By dyeing the image receiving medium, a desired image is formed on the image receiving medium. According to the sublimation heat transfer method, the image density at the boundary of the heating portion is smoothly reduced, and thus it is suitable for forming a high gradation image such as a full color photograph.

In the fusion thermal transfer system, an ink sheet is superposed on an image receiving medium on which an image is to be formed, and ink in a portion of the ink sheet corresponding to the image is locally heated and melted by using a thermal head. At the same time, a desired image is formed on the image receiving medium by transferring the image onto the image receiving medium. According to the fusion heat transfer method, the image density at the boundary of the heating part becomes sharp,
It is suitable for forming high density images with sharp edges. Further, since the ink mainly composed of a pigment is used, it is also excellent in light resistance and chemical resistance.

In recent years, a sublimation fusion thermal transfer type printer capable of performing both the sublimation thermal transfer method and the fusion thermal transfer method has been commercially available. For this reason, for example, a user of a company or school purchases an unprinted card and individually prints a facial photograph or the like using a commercially available sublimation fusion thermal transfer printer to obtain an IC card for identification. Creating is also becoming commonplace.

[0008]

By the way, the conventional IC
Polyvinyl chloride (PVC) has been widely used for oversheets used on the surface of cards. PVC is
It has excellent properties as a material, such as excellent dyeability and fixability of ink, good processability, and low cost. However, in recent years, as a drastic measure against environmental problems such as dioxin contamination and environmental hormones, there has been an active movement to stop using PVC and switch to a non-PVC material.

Therefore, as a substitute material for PVC, polyethylene terephthalate (PET), acrylonitrile-
Various non-PVC materials such as butadiene-styrene copolymer (ABS), polycarbonate (PC), polyethylene (PE), polypropylene (PP), and amorphous polyester resin have been proposed. Of these, PE
T, ABS, PC, PE and PP have poor ink dyeing properties, and it is difficult to obtain a good image. In addition, the softening point is high, and the IC card is apt to curl due to heat shrinkage due to heating during card formation or printing. If the IC card is curled when the card is formed, the running property when it is inserted into the printer for printing is deteriorated, and if the IC card is curled when printing, the running property when it is inserted into the reading device during actual use is deteriorated. So it's a problem.

The amorphous polyester resin is
Low softening point, small heat shrinkage, self-adhesiveness, etc.
It has physical properties similar to VC. However, when an image is formed by the sublimation fusion thermal transfer method, there is a problem that heat fusion easily occurs due to heating of the thermal head. If the heating temperature of the thermal head is lowered in order to prevent heat fusion, the heating required for sublimation and melting of the ink becomes insufficient and a clear image cannot be obtained. As described above, when a conventional PVC substitute material is used as a material for an IC card oversheet, troubles at the time of printing frequently occur, and therefore improvement is necessary.

As a method for preventing heat fusion during sublimation heat transfer to a non-PVC material, it has been proposed to provide a resin coating layer as an image receiving layer on the surface of the material. For example, JP-A-7-88974 discloses a method of applying a PVC resin. However, this method cannot meet the demand for non-PVC. Also, Japanese Patent 2572569
The publication discloses a treatment in which a polystyrene resin or the like is dissolved in a solvent such as toluene or methyl ethyl ketone, applied, and dried by heat. This method is preferable from the viewpoint of non-PVC, but when an amorphous polyester resin having a low softening point is used as the material of the oversheet,
There is a problem that there is a possibility of being significantly deformed by heat during heat drying.

Further, when a thermal transfer image is formed on an IC card with a commercially available card printer, there is a problem that printing cannot be performed on the entire surface of the IC card. In the sublimation / melt heat transfer combined use printer, the unprinted white card is superposed on the dye-coated surface of the sublimable yellow, magenta, and cyan dyes on the film, and on the dye-coated surface of the ink sheet coated with the melt-transferable ink, and the desired image and In accordance with an electric signal corresponding to a character, heat and heat supplied from a thermal head transfer and dye a dye and an ink from a necessary portion from a necessary portion to a required density to form an image. At this time, the printing is performed within a range of 0.5 to 3 mm narrower than the entire surface of the card for the purpose of preventing so-called "printing of the thermal head" and extending the durability period of the thermal head. Therefore, an unprinted white frame portion remains on the peripheral edge of the surface of the IC card, which spoils the appearance.

The present invention has been made in view of the above circumstances, and in an IC card using a non-PVC material,
An object of the present invention is to obtain an IC card which can obtain a clear and high gradation print and which is hard to curl due to heating at the time of forming a card or printing.

[0014]

In order to solve the above problems, the present invention provides an oversheet having a softening point of 75-1.
Amorphous polyester resin at 50 ℃ is the main component,
Provided is an IC card in which a resin sheet having a stress change of -5 to 5 gf at 80 ° C. is used, and an image receiving layer is formed on one surface of the oversheet and the surface opposite to the core sheet. . Since such an IC card has the image receiving layer, it becomes easy to print a clear and high gradation image on the surface of the IC card. In addition, since the softening point and the change in stress are within appropriate ranges, curling is less likely to occur due to heating during card formation and printing.

As the amorphous polyester resin, it is particularly preferable to use a polycarbonate / amorphous polyester blend resin having a softening point of 120 to 150 ° C. By setting the softening point within the above range,
When forming the image-receiving layer, the degree of thermal deformation when dried by heat is further reduced.

In order to further suppress curling due to heating, the stress change at 80 ° C. of the oversheet on which the image receiving layer is formed is S1, the thickness is T1, and the oversheet having no image receiving layer is used. When the stress change at 80 ° C. is S2 and the thickness is T2, these parameters are S1 ≦ S2 and 0.5 ≦ T1 / T2 ≦ 2.0.
It is preferable to satisfy the condition of. As a result, the degree of heat shrinkage of each oversheet during heating is easily balanced, and the degree of curling is further suppressed.

A printed image and an overvarnish layer may be sequentially formed on at least a part of the image receiving layer, and the remaining part of the image receiving layer may be exposed.
A high-gradation image such as a facial photograph can be printed on the exposed portion by using a commercially available thermal transfer printer for cards or the like. More preferably, it is preferable to sequentially form the printed image and the overvarnish layer on the peripheral portion of the surface of the IC card. As a result, it is not necessary to leave an unprinted white frame portion on the peripheral portion of the IC card surface, and thus the appearance of the IC card surface can be made more beautiful.

Alternatively, the oversheet having the image receiving layer may be transparent and a printed image may be formed on the surface of the oversheet opposite to the image receiving layer. According to this method, the printed image can be formed at a desired position to improve the aesthetic appearance, and the thermal transfer image is not likely to overlap the printed image. Therefore, the surface of the IC card may be mixed due to ink mixing or blurring. Does not become dirty.

At least one selected from a magnetic stripe, a sign panel, and a hologram panel can be arranged on the above IC card. As a result, it is possible to obtain effects such as improvement in distinguishability and writing ability and prevention of forgery.

[0020]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail based on the embodiments. FIG. 1 is a sectional view showing an example of an embodiment of an IC card of the present invention. In this IC card 1, the inlet 5 is formed by providing at least the IC module 3 and the antenna 4 on one surface of the core sheet 2. Then, the front-side oversheet 7 is laminated on one surface of the inlet 5 via the first adhesive layer 6a. A backside oversheet 8 is laminated on the other surface of the inlet 5 via a second adhesive layer 6b.

An image receiving layer 9 is formed on the front side oversheet 7 via a solvent barrier layer 10. A printed image 11 and an overvarnish layer 12 are formed on at least a part of the image receiving layer 9. A magnetic stripe 13, a hologram 14, and a sign panel 15 are arranged on the image receiving layer 9. The thickness of the IC card 1 is
The total range is 150 to 1000 μm, preferably 200 to 800 μm.

In the IC card of this embodiment, the front side oversheet 7 and the back side oversheet 8 are mainly composed of an amorphous polyester resin having a softening point of 75 to 150 ° C., and a stress change at −80 ° C. is −5. ~ 5
A resin sheet of gf is used. Softening point 75-15
As the amorphous polyester resin at 0 ° C.,
It is preferable to use a polycarbonate / amorphous polyester blend resin having a softening point of 120 to 150 ° C., which is obtained by blending a polycarbonate with an amorphous polyester resin. By setting the softening point within the above range, when the image receiving layer 9 is formed as described later, the degree of thermal deformation when heated is further reduced.

Here, the softening point of the resin is the temperature at which the viscosity (stress and composition flow rate) of the resin becomes 10 ¹² P (poise). The softening point is measured according to JIS K 7196 and is measured using a viscoelasticity measuring device or the like. Next, a specific method for measuring the softening point will be shown. First, 1
cm × 4 cm × 150 μm sheet-shaped sample piece,
Distance between chucks: 2 cm, load: 100 g, temperature range:
The displacement-temperature curve is created by measuring the displacement of the sample piece under the conditions of -20 ° C to 250 ° C and a temperature rising temperature of 5 ° C / min. In this curve, when the straight line part recognized on the low temperature side of the resin layer sample starting to soften is extended to the high temperature side, and the tangent line of the part where the displacement is maximum is extended to the low temperature side, these extended lines The temperature corresponding to the intersection is the softening point.

The change in stress of the resin sheet is the amount of change in stress acting inside the sample piece when the sample piece having a predetermined size is maintained at a predetermined temperature while controlling the strain to 0 μm. When this stress change has a positive value, it indicates that a contracting force acts inside the sample piece. Further, when the stress change has a negative value, it indicates that the expansion force works inside the sample piece. Next, a specific method of measuring the stress change will be shown. 80
℃, width 10mm × length 40mm × thickness 100μ
The load for controlling the strain to be 0 μm when the sample piece of m was left at room temperature without load and the displacement was set to zero, and the temperature was raised to 80 ° C. at a heating rate of 2 ° C./minute for 1 hour. The stress change can be measured by reading

By using an amorphous polyester resin having a softening point of 75 to 150 ° C. for the front-side oversheet 7 and the back-side oversheet 8, thermocompression bonding at the time of molding a card becomes easy, and further, thermal deformation at the time of printing. Is suppressed to be small. When the softening point of the resin used is less than 75 ° C., it is likely to be thermally deformed by heating by thermocompression bonding or thermal transfer printing. On the other hand, if the temperature exceeds 150 ° C, the thermocompression bonding process for stacking the cards becomes difficult, which is not preferable.

Further, as a result of diligent study by the inventor, it became clear that the stress change of the resin sheet has a strong correlation with the degree of heat shrinkage of the resin sheet. If the heat shrinkage of the resin sheet is small, it is considered that the IC card is hard to curl. Therefore, by setting the stress change within the range of -5 to 5 gf, the degree of thermal contraction of the resin sheet is reduced even when thermocompression bonding or printing is performed, and thus curling of the IC card can be suppressed. The stress change is more preferably in the range of 0 to 5 gf. The temperature at which the stress change is measured depends on the processing conditions such as thermocompression bonding and thermal transfer.
It was set to 0 ° C. If the stress change at 80 ° C. is less than −5 gf, the laminated resin sheets may be extruded from the hot plate when hot plate forming. Further, when the stress change exceeds 5 gf, the degree of heat shrinkage is large and the curling becomes significant.

By using the resin sheet as described above, curling of the IC card due to heat at the time of forming the IC card or printing is significantly suppressed, and the running property in the printer or the card reading device is not deteriorated. Further, by forming an appropriate image-receiving layer 9 on the front-side oversheet 7, a clear and high-gradation image can be obtained, and blurring does not occur. Moreover, since the non-PVC material is used, the harmfulness at the time of use or disposal is low.

The amorphous polyester resin is a resin having an amorphous property among polyester resins. Amorphous refers to a solid state in which the polymer structure has poor orientation and crystallinity and almost no crystal lattice is observed. Specific examples of such resins include dicarboxylic acids such as terephthalic acid, isophthalic acid, naphthalenedicarboxylic acid and adipic acid, and ethylene glycol,
It can be obtained by dehydration polycondensation with a diol such as diethylene glycol, triethylene glycol or cyclohexanedimethanol by an appropriate method. In particular, by copolymerizing a mixture of terephthalic acid as a dicarboxylic acid and ethylene glycol and cyclohexanedimethanol as a diol, an amorphous polyester resin having an appropriate softening point can be obtained. As such an amorphous polyester resin, for example, P
ET-G (trademark of Eastman Chemical Co.) type polyester resin is preferably used.

The amorphous polyester resin includes
Polycarbonate resin (PC), ethylene-vinyl acetate copolymer (EVA), polyethylene, polypropylene, polyacrylonitrile, styrene-acryl copolymer, in an appropriate ratio, as long as the softening point and the change in stress are within a predetermined range. Cellulose resin, polyvinyl acetal resin,
Resins such as polyester resins other than amorphous polyester resins and acrylic resins can be blended. The compounding ratio of the amorphous polyester resin in the resin sheet is 40% by mass or more with respect to the entire raw material resin component. In order to impart heat resistance, it is preferable to add a polycarbonate resin in an amount of 10 to 60% by mass.

The resin sheets used for the front-side oversheet 7 and the back-side oversheet 8 are prepared by mixing the above resins and various additives in a predetermined ratio to prepare a molten resin mixture, and then extrusion molding, injection molding, calendering. It can be obtained by molding into a sheet by an appropriate method such as molding. The resin compounding ratio is such that the softening point of the resin sheet is 75 to 150 ° C. and the stress change at 80 ° C. is −5.
It is selected to be ˜5 gf. In particular, the amorphous polyester resin is 45 to 55 mass% and the polycarbonate resin is 40 mass% or more, more preferably 45 to 5 mass%.
By blending with 5% by mass, the softening point is 120 to 1
A temperature of 50 ° C. is preferable. The thickness of the resin sheet is preferably in the range of 10 to 300 μm. When the thickness is less than 10 μm, the operability of the resin sheet is deteriorated, which is not preferable. If it exceeds 300 μm, the thickness of the entire card becomes large, and problems such as poor running and poor reading may occur when the card is inserted into a thermal transfer printer or a reading device.

Various additives that can be added to the molten resin mixture include pigments, antiblocking agents, stabilizers, antistatic agents, flame retardants, anti-shock agents, antioxidants, brighteners,
Examples include UV absorbers. In particular, it is preferable to add pigments such as magnesium oxide, aluminum oxide, silicon oxide, titanium oxide, calcium carbonate, barium sulfate, magnesium carbonate, calcium silicate, and talc in order to hide the IC module and the antenna. Among these pigments, titanium oxide is particularly preferable because it is inexpensive and has a high hiding property.

In order to further suppress curling, the stress change of the front side oversheet 7 is S1 and the thickness is T1,
The stress change of the back side oversheet 8 is S2, and the thickness is T2
, S1 ≦ S2 and 0.5 ≦ T1 / T2 ≦ 2.
It is preferably 0. Furthermore, S2-S1 is 0
It is preferably 5 gf, and particularly preferably 0.1 to 3 gf. Further, the thickness ratio is 0.6 ≦ T1
It is more preferable that /T2≦1.7.

As described above, the reason for specifying the stress change and the thickness of the front side and back side oversheets 7 and 8 is as follows.
It is as follows. When printing on an IC card by the thermal transfer method, the thermal head is brought into contact with the front side oversheet 7 via the image receiving layer 9 and the solvent barrier layer 10. Therefore, the front-side oversheet 7 is heated more strongly than the back-side oversheet 8, so that S1 is preferably smaller than S2 in order to further suppress the heat shrinkage of the front-side oversheet 7. By setting S1 ≦ S2, the front side oversheet 7 with a large heating amount
And the difference in the total amount of stress change between the back side oversheet 8 with a small heating amount and the curl after printing is further suppressed.

If the thickness of the front-side oversheet 7 and the back-side oversheet 8 are not balanced, curling may occur, so the thickness is 0.5 ≦ T1 /
It is preferable that T2 ≦ 2.

In the present embodiment, the image receiving layer 9 is provided on the front side oversheet 7 in order to prevent the ink ribbon from sticking during printing and to improve the dyeing property of the ink.
Is provided. The image receiving layer 9 is applied to the image receiving layer 9 by adding a polyester resin, a polycarbonate resin, a polyurethane resin, a polyether resin, a polyamide resin, an acrylic resin, a cellulose resin or the like to an organic solvent such as toluene or methyl ethyl ketone. It is formed by preparing a liquid, applying the liquid on the front side oversheet 7, and then drying. The image receiving layer 9
Various additives such as antioxidants, pigments, and ultraviolet absorbers may be added to the coating liquid for use as necessary.

The coating amount of the coating liquid for the image receiving layer 9 is preferably 1 to 12 g / m ² in dry mass,
In particular, it is preferable that the amount is ² to 8 g / m ² . 1 g / m ²
If it is less than the above range, the dyeing property of the ink may be insufficient, and problems such as sticking of the ink ribbon and image deterioration may occur. Further, when the coating amount of the composition for the image receiving layer 9 exceeds 12 g / m ² , the dyeing property is not improved, it is uneconomical and the printing density may be lowered, which is not preferable.

Since the organic solvent is mixed with the coating agent for the image receiving layer 9, the front side oversheet 7 may be swollen and deteriorated. Therefore, it is preferable to form the solvent barrier layer 10 between the image receiving layer 9 and the front-side oversheet 7. The solvent barrier layer 10 includes carboxymethyl cellulose, casein, dextrin, starch, modified starch, polyvinyl alcohol, modified polyvinyl alcohol, polyethylene oxide, polyvinylpyrrolidone,
Solvent barrier layer 1 containing a water-soluble or water-dispersible aqueous polymer resin selected from polyvinyl methyl ether, polyacrylic acid, polyacrylamide, acrylic resin, polyester resin, polyurethane resin, etc.
It can be formed by applying a 0 coating liquid and drying. The components used in the coating liquid for the solvent barrier layer 10 can be appropriately selected depending on the solvent resistance, the adhesive, and the like.

The coating liquid for the solvent barrier layer 10 may contain a pigment. This improves the blocking resistance and also improves the stability of the coating liquid. Examples of the pigment include magnesium, calcium, zinc, barium, titanium, aluminum, antimony, inorganic oxides such as lead, hydroxide, sulfide, carbonate, sulfate, silicate and the like, polystyrene, Solid polymer fine powder such as polyethylene is exemplified. Particularly, kaolin, talc, silica, gypsum, barite, alumina white, satin white, titanium oxide, calcium carbonate and the like are preferable.

The coating liquid for the solvent barrier layer 10 includes polyhydric alcohols such as ethylene, glycerin, trimethylolpropane and diethylene glycol, polyalkylene glycol water-soluble plasticizers such as polyethylene glycol and polypropylene glycol, and inorganic salts. filler,
A defoaming agent, a wetting agent, a leveling agent, a curing agent, a thickening agent, a lubricant, a film forming auxiliary agent and the like can be added.

The coating amount of the coated liquid solvent barrier layer 10, 1 to 10 g / m ² approximately by dry weight, in particular in the range of 2 to 6 g / m ² is preferred. If the coating amount is less than 1 g / m ² , the effect of the solvent barrier layer 10 is insufficient, and the organic solvent of the coating liquid for the image receiving layer 9 may cause the front side oversheet 7 to expand. If the amount is more than 10 g / m ² , stickiness becomes high and blocking is likely to occur, resulting in difficulty in operability and handleability. Appropriate surface treatment such as corona treatment may be applied to the surfaces of the front surface side oversheet 7, the back surface side oversheet 8, and the solvent barrier layer 10.

The coating liquid for the image receiving layer 9 and the coating liquid for the solvent barrier layer 10 can be applied by a coating method or a printing method. For the coating method, a coating device such as an air knife coater, a rod blade coater, a gravure coater, a bar coater, a blade coater, a roll coater, a size press coater, a slot coater, a curtain coater, a die coater is used. Examples of printing methods include screen printing, offset printing, and gravure printing. In particular, the printing method is preferable because it is easy to partially form the image receiving layer 9 and the solvent barrier layer 10 on the surface of the front side oversheet 7.

A printed image 11 can be formed on at least a part of the image receiving layer 9. For example, when creating a large number of ID cards such as employee ID cards, common design parts such as company name, logo, ground pattern, etc. are formed in advance by a printing method, and then individual names, affiliations, face photographs, etc. By forming the different portions by the thermal transfer method, it is possible to save time and cost for printing the thermal transfer image. In particular, if the print image 11 is formed on at least the peripheral portion of the image receiving layer 9, the peripheral portion cannot be printed by the thermal transfer printer and does not remain as a white frame. Furthermore, if the printed image 11 is formed by design printing, the appearance of the IC card 1 can be further improved. Then, if the other part of the image receiving layer 9 is exposed, the sublimation heat transfer image 21 and the fusion heat transfer image 2 are exposed there.
2 can be printed.

The printed image 11 may be formed by a normal printing method, but it is preferable that the printed image 11 is formed by using an ultraviolet curable ink by offset printing without extra heating, and the curl of the IC card 1 can be prevented. It is preferable because there is no fear. A known ink is used as the ultraviolet curable ink. Further, when the printed image 11 is provided on the image receiving layer 9, the ultraviolet curable ink used has sufficient adhesiveness to the image receiving layer 9 and has good dyeability, so that the image is Those that do not bleed are preferred.

An overvarnish layer 12 is preferably provided on the printed image 11 in order to protect the printed image 11. The overvarnish layer 12 can be formed by printing a suitable transparent resin layer by a known method such as ordinary offset printing or screen printing. Examples of the transparent resin for the overvarnish layer 12 include rosin-modified phenolic resins, rosin-based resins such as maleic acid rosin and polymerized rosin esters, and radical-curable polyol acrylates, polyester acrylates, epoxy acrylates, urethane acrylates as UV-curable resins. Examples thereof include polyfunctional oligoacrylates such as rosin-modified epoxy acrylate and rosin-modified acrylate. An acrylate monomer such as diethylene glycol dimethacrylate, a polymerization initiator such as benzoyl peroxide and benzophenone, and a sensitizer may be added to these transparent resins, if necessary, for the purpose of improving printability.

The magnetic stripe 13, hologram 14, sign panel 15 and the like can be provided on the surface of the IC card 1 by a method such as a sticking method, an embedding method, or a hot stamping method. This improves aesthetics and writability,
Effects such as forgery prevention can be obtained. As described above, since the IC card 1 of the present embodiment is extremely small in curling and thermal deformation due to heating during processing, it goes without saying that the hot stamping method may be used. Further, the magnetic stripe 13, the hologram 14, the sign panel 15, etc.
It may be directly provided on the image receiving layer 9 as shown in FIG. Further, when the printed image 11 and the overvarnish layer 12 are formed, they may be provided on the overvarnish layer 12.

The IC card 1 of this embodiment is provided with an inlet 5 for exchanging information with the outside and recording information. The inlet 5 is provided with at least the IC module 3 and the antenna 4 on the core sheet or in the hole formed in the core sheet. A magnetic flux generated by an electromagnetic wave or the like is applied to the antenna 4 to generate a current, and in response to this, a predetermined operation such as recording, rewriting, and reading of information is performed in the IC module 3.

As the core sheet 2, a resin film such as a polyethylene terephthalate (PET) resin film, an acrylonitrile-butadiene-styrene copolymer (ABS) resin film, a polybutylene resin film or a polycarbonate resin film, or wood paper or synthetic paper. Materials such as etc. can be used. Moreover, you may use what laminated | stacked the film of 2 or more types. The thickness of the core sheet 2 is preferably 10 to 300 μm.
If the thickness of the core sheet 2 is less than 10 μm, the operability is poor, and if it exceeds 300 μm, the thickness of the IC card 1 increases, which is not preferable.

As the IC module 3, a module having at least one functional component such as an input / output circuit, a memory, a memory control circuit, an arithmetic circuit, and a CPU, which has been used for the IC card 1 in the related art, is used without particular limitation. be able to. The dimensions of the IC module 3 are usually 0.5 to 10 mm in length and width and about 50 to 300 μm in thickness.

An antenna 4 is provided around the IC module 3 so as to be connected to the IC module 3. Such an antenna 4 is formed on the core sheet 2 by a winding method, a copper etching method, a silver paste screen printing method,
It can be formed by a vapor deposition method or the like. Furthermore, a display device, a battery, a vibrator for a timepiece, etc. may be arranged on the core sheet 2, if necessary.

In order to prevent the IC module 3 from being exposed on the surface of the IC card 1, the inlet 5 is laminated on the front side and back side oversheets 7, 8. Inlet 5 of front side and back side oversheets 7 and 8
In order to prevent the peeling from the sheet, it is preferable to provide first and second adhesive layers 6a and 6b between the inlet 5 and the front side and back side oversheets 7 and 8.

Adhesives for forming the first and second adhesive layers 6a and 6b include urea resin, melamine resin, phenol resin, epoxy resin, vinyl acetate resin, vinyl acetate-acrylic copolymer resin, ethylene- Vinyl acetate copolymer resin, acrylic resin, polyvinyl ether resin, polystyrene resin, polyurethane resin, polyamide resin, polyvinyl butyral resin, acrylic ester copolymer resin, methacrylic ester copolymer, Natural rubber resin, cyanoacrylate resin,
An adhesive such as a silicone resin can be used.
In addition, additives such as tackifiers, plasticizers, fillers and antiaging agents can be added to these adhesives, if necessary.

As a method of forming the first and second adhesive layers 6a and 6b on a sheet such as the core sheet 2, the front surface side oversheet 7 or the back surface side oversheet 8, an appropriate release paper is preliminarily adhered. After applying the agent and drying it into a sheet, a method of transferring the adhesive onto the sheet by laminating the sheet on the sheet and removing the release paper, or an adhesive onto the sheet Examples of the method include a method of directly applying and drying.
Preferably, a method of sandwiching a sheet-shaped hot melt adhesive between the sheets and heating and softening them for adhesion is preferable. The thickness of the first adhesive layer 6a provided between the front-side oversheet 7 and the inlet 5 is appropriately set according to the thickness of the IC module 3 and the like, but is usually 10 to 300 μm. It is preferable.

Between the core sheet 2 and the front side or back side oversheets 7 and 8, another substrate sheet is inserted and laminated for the purpose of adjusting the thickness and rigidity of the IC card 1. May be. Such substrate sheets include paper substrates such as high-quality paper, art paper and coated paper, polypropylene resin synthetic paper, polyethylene resin synthetic paper, cellophane film, nylon film, acetyl cellulose resin film, polyolefin resin film, polyamide resin. Examples of film base materials include films, polyimide resin films, polyether resin films, and polyester resin films.

Further, as shown in FIG. 3, the base material sheet 16
The second print image 17 may be formed on the top. In this case, the front side oversheet 7 is a transparent resin sheet. In this way, the second print image 17 has the I
The appearance is improved because it can be seen from the front side of the C card 1. Further, if the second print image 17 is provided on the entire surface of the resin sheet, the second print image 17 becomes a beautiful background pattern. For example, as shown in FIG.
When the sublimation heat transfer image 21 or the melt heat transfer image 22 is printed, the first print image 11 and the sublimation heat transfer image 21 or the melt heat transfer image 22 are overlapped with each other, so that ink is mixed or rubbed. May become dirty. However, there, as shown in FIG.
If the print image 17 is provided on the back side of the front oversheet 7, such a problem does not occur.

The IC card 1 is formed by stacking the core sheet 2 and the front and back side oversheets 7 and 8 and integrating them by a method such as thermocompression bonding, and then processed into a card shape by a punching method or a cutting method. It can be manufactured. The order of forming the image receiving layer 9 may be such that the surface side oversheet 7 is laminated with the core sheet 2 and integrated, and then the image receiving layer 9 is formed, or the image receiving layer 9 is formed on the surface side oversheet 7. After the image receiving layer 9 is formed, it may be laminated on the core sheet 2.

A backside coating layer may be formed on the backside oversheet 8 of the IC card 1. As a result, the runnability is improved, electrostatic charging is prevented, and damage to the image receiving layer 9 and transfer of images due to rubbing when the IC cards 1 are stacked are prevented.

The back coating layer is made of acrylic resin or epoxy resin.
Oil, polyester resin, phenol resin, alkyd resin
Apply a resin such as grease, urethane resin, melamine resin, etc.
It can be formed by making Back cover layer
The resin for use in the
Acrylic polymer containing ethyleneimine and cationic monomer
Coalescence, cation-modified acrylamide polymer, cation
It is preferable to add a cationic polymer such as soluble starch
Yes. The coating amount is 0.3 to 15 g / m in dry mass. ²Tosu
Preferably.

Such an IC card 1 is suitable for thermal transfer printing by a commercial thermal transfer printer for cards. The thermal transfer printing method may be either a sublimation heat transfer method or a melt heat transfer method, or both may be a sublimation heat transfer method. The sublimation heat transfer image 21 and the melt heat transfer image 22 are printed on the image receiving layer 9.

After performing the thermal transfer printing, a protective layer 23 may be formed on the sublimation thermal transfer image 21 and the melt thermal transfer image 22. In order to form the protective layer 23, the thermal transfer sheet is provided with the protective layer 23 for transfer, and the protective layer 23 is transferred onto the image receiving layer 9 by heating (hereinafter, also referred to as a transfer method). The transparent film is used as the image receiving layer 9
A method such as a method of sticking and laminating on top (hereinafter, also referred to as a sticking method) is used.

In the transfer system, a thermal transfer sheet having a dye layer may be provided with a protective layer 23 for transfer, and the protective layer 23 may be formed immediately after printing with a printing printer. Alternatively, the transfer protective layer 23 may be formed on another sheet, and after printing once, the protective layer 23 may be transferred by heating with a printer or the like. The other sheet is not particularly limited as long as it is a sheet material generally used for a thermal transfer sheet such as a PET film.

As a component of the transfer protective layer 23, a thermoplastic resin generally used in the image receiving layer 9 is preferably used, and examples thereof include polyester resin, acrylic resin,
Examples thereof include polyvinyl acetal-based resins such as polyvinyl butyral and cellulose-based resins such as cellulose acetate butyrate. Further, an aqueous resin such as styrene-butadiene rubber (SBR) latex, acrylonitrile-butadiene rubber (NBR) latex, acrylic emulsion, starch, polyvinyl alcohol or the like can also be used. In addition, a pigment may be appropriately used in combination, clay,
Examples thereof include calcium carbonate, titanium oxide, aluminum hydroxide, satin white, silica, magnesium oxide and barium sulfate.

In the case of the sticking method, a transparent film may be used as the protective layer 23 and may be adhered to the printed screen of the IC card 1 by heat with a desk laminator or the like. May be. As the transparent film,
A transparent polyethylene film, an ethylene-vinyl acetate copolymer (EVA) film, a polyolefin film such as a polypropylene film, or a polyethylene terephthalate (PET) film is used. Of course, known processes such as anchor coat process, corona process, and antistatic process may be performed. Further, a coating layer of a thermoplastic resin can be provided on the surface side of the transparent film. For example, polyester resin, acrylic resin, polyvinyl acetal resin such as polyvinyl butyral,
Cellulose resins such as cellulose acetate butyrate, etc. may be mentioned. Further, styrene-butadiene rubber (SBR) latex, acrylonitrile-butadiene rubber (NBR) latex, acrylic emulsion,
Aqueous resins such as starch and polyvinyl alcohol can also be used.

A pigment may be appropriately used in combination with the protective layer 23, and examples thereof include clay, calcium carbonate, titanium dioxide, alumina hydroxide, satin white, silica, magnesium oxide, barium sulfate and the like. For example, when writability and imprintability are required, the particle size of the pigment is 0.1 to 20.
About μm is preferable, and oil absorption is 100 to 300 ml / 1
About 100 g is preferable.

An ultraviolet absorber may be blended in the protective layer 23 or the coating layer, and those which absorb ultraviolet rays of 300 to 400 nm are preferable, and for example, benzophenone type, triazole type and salicylate type compounds can be used. . Further, the protective layer 23 or the coating layer, a fluorescent dye,
It is preferable to add a fluorescent pigment, a phosphorescent pigment, or the like because the anti-counterfeiting effect can be enhanced.

The protective layer 23 has a surface roughness (Ra, center line average roughness) of the protective layer 23 based on JIS K 0601.
Is preferably 50 μm or less. By the way, 50μ
If it exceeds m, the image quality when printing is performed may be non-uniform. The opacity of the protective layer 23 is 0.
70% is preferable and 0-40% is more preferable. 70%
If it exceeds, the sharpness of the sublimation heat transfer image 21 and the fusion heat transfer image 22 is deteriorated. When the protective layer 23 is provided by a sticking method, it is preferable that the opacity of the coating layer and the transparent film laminated is within the above range.

[0066]

The present invention will be described in more detail based on the following examples, but these specific examples do not limit the present invention.

[Embodiment 1] The IC card 1 shown in FIG.
It was made by the following procedure. Front side over sheet 7
Then, 100 μm thick amorphous polyester resin
Sheet (made by Mitsubishi Plastics, trade name: PG-WHT, Amol
67% by mass of polyester resin, 10 quality titanium oxide
%, Polycarbonate resin 23% by mass, softening point 7
6 ℃, stress change + 0.9gf)
Lil resin (manufactured by Mitsubishi Chemical Corporation, trade name: ST2000H)
Dry mass of 3g / m by bar coating method²Coating to be
Then, after drying to form the solvent barrier layer 10, the solvent
On the barrier layer 10, the composition: Polyester resin (manufactured by Toyobo Co., Ltd., trade name: Byron 200) 100 parts by mass Silicone oil (Shin-Etsu Chemical Co., Ltd., trade name: KF393) 3 parts by mass Isocyanate (Takeda Pharmaceutical Co., Ltd., trade name: Takenate D-140N)                                                             5 parts by mass Toluene 300 parts by mass The coating liquid for the image receiving layer 9 consisting of is dried by the bar coating method.
Mass 5g / m²Was applied so that After drying, receive the image
Dry mass 1 by offset printing on part of the surface of container
g / m ²The print image 11 is provided so that
2g / m by offset printing on top²Over varnish layer
12 was formed.

A 175 μm thick polyethylene terephthalate film (made by Teijin Ltd., trade name:
Tetoron S) is used to form a circuit and a 3-turn winding antenna on this one surface by screen printing of a silver paste, and further, an IC module 3 having a thickness of 185 μm is formed at a predetermined position via an anisotropic resin. (SIEMENS, product name: SLE44R31) was mounted by face bonding to prepare an inlet 5.

The inlet 5 has the first IC module 3 side.
The surface side oversheet 7 after the image receiving layer 9 is formed via the adhesive layer 6a (hot melt adhesive sheet) of
The side without the image receiving layer 9 was laminated as the inner surface. Next, the second adhesive layer 6b (hot-melt adhesive sheet) is used to form the backside oversheet 8 with a thickness of 100.
μm amorphous polyester resin sheet (manufactured by Mitsubishi Plastics, trade name: PG-WHT, 67% by weight of amorphous polyester resin, 10% by weight of titanium oxide, 23% by weight of polycarbonate resin, softening point 76 ° C., stress change +
0.9 gf) was laminated and thermocompression bonded at 150 ° C. Further, a magnetic stripe 13 (manufactured by Kurz Co., Ltd., trade name: MTL750) was placed on the exposed portion of the image receiving layer 9 and heat-pressed by a hot pressing plate having a smooth surface. After punching into a card shape, the hologram 14 and the sign panel 15 were thermocompression bonded to each other to obtain the IC card 1. The thickness of the obtained IC card 1 was 450 μm.

[Embodiment 2] The IC card 1 shown in FIG.
It was made by the following procedure. Front side over sheet 7
And amorphous polyester resin with a thickness of 150 μm
Sheet (Toray Gosei Co., Ltd., trade name: UW-1A, Amorph
45% by weight polyester resin, 10% by weight titanium oxide
%, Polycarbonate resin 45% by mass, softening point 12
8 ℃, stress change + 3.5gf)
Lil resin (Asahi Denka Kogyo KK, trade name: UX-125)
8 g / m dry weight by bar coating method²Coating to be
Then, after drying to form the solvent barrier layer 10, the solvent
On the barrier layer 10, the composition: Cellulose acetate butyrate resin (Eastman Chemical Co., Product name: CAB551-0.01) 100 parts by mass Silicone oil (Shin-Etsu Chemical Co., Ltd., trade name: KF393) 3 parts by mass Isocyanate (Takeda Pharmaceutical Co., Ltd., trade name: Takenate D-140N)                                                               5 parts by mass Toluene 300 parts by mass The coating liquid for the image receiving layer 9 consisting of is dried by the bar coating method.
Mass 2g / m²Was applied so that After drying, receive the image
Dry mass 1 by offset printing on part of the surface of container
g / m ²The print image 11 is provided so that
7g / m by screen printing on top²Over varnish layer
12 was formed.

An inlet 5 was prepared in the same manner as in Example 1, and the front side oversheet 7 was formed on the IC module 3 side of the inlet 5 via a first adhesive layer 6a (hot melt adhesive sheet). The side without the image receiving layer 9 was laminated as the inner surface. Then, a 110 μm-thick amorphous polyester resin sheet (manufactured by Toray Gosei Co., Ltd., trade name: UW-1A, amorphous polyester resin) serving as the back-side oversheet 8 via the second adhesive layer 6b (hot melt adhesive sheet) 45 mass%, titanium oxide 10
Mass%, polycarbonate resin 45 mass% contained, softening point 128 ° C, stress change + 3.5gf) are laminated to 150 ° C
It was thermocompression bonded. Furthermore, on the over varnish layer 12, a magnetic stripe 13 (manufactured by Kurz Co., Ltd., trade name: MTL75
0) were piled up and thermocompression-bonded by a hot pressing plate having a smooth surface. After punching into a card shape, the hologram 14 and the sign panel 15 were thermocompression bonded to each other to obtain the IC card 1. The thickness of the obtained IC card 1 was 750 μm.

Example 3 The IC card 1 shown in FIG. 3 was manufactured by the following procedure. Creation of surface base material. As the front-side oversheet 7, an amorphous polyester resin sheet having a thickness of 80 μm (manufactured by Toray Gosei Co., Ltd., trade name: UN-
1A, 50% by mass of amorphous polyester resin, 50% by mass of polycarbonate resin, softening point 117 ° C., stress change +1.7 gf) were used, and a water-based acrylic resin (trade name: ST2000H manufactured by Mitsubishi Chemical Co., Ltd.) was applied to the bar coating method. To a dry mass of 3 g / m ² and dried to form a solvent barrier layer 10. Then, on this solvent barrier layer 10, composition: polyester resin (manufactured by Toyobo Co., Ltd., trade name: Byron 200) 100 parts by mass silicone oil (manufactured by Shin-Etsu Chemical Co., Ltd., trade name: KF393) 3 parts by mass isocyanate (manufactured by Takeda Pharmaceutical Co., Ltd., trade name: Takenate D-140N) 5 parts by mass Toluene 300 parts by mass Coating solution for image receiving layer 9 Was applied by a bar coating method so as to have a dry mass of 5 g / m ² .

As the base sheet 16 for the printing sheet 18,
Using a 150 μm thick amorphous polyester resin sheet (trade name: PG700M, manufactured by Taihei Chemical Co., Ltd.), a print image 17 is formed thereon by offset printing so that the dry mass is 2 g / m ^2, and a print sheet 18 is formed. did.
An inlet 5 was prepared in the same manner as in Example 1, and the first adhesive layer 6a was formed on the IC module 3 side of the inlet 5.
The printing sheet 18 is laminated via a (hot melt adhesive sheet), and the third adhesive layer 6c is further formed thereon.
The front-side oversheet 7 was laminated with the side without the image receiving layer 9 as an inner surface via a (hot melt adhesive sheet). Then, a 110 μm thick amorphous polyester resin sheet (manufactured by Toray Gosei Co., Ltd., trade name: UN-1A, amorphous polyester) serving as the back-side oversheet 8 via the second adhesive layer 6b (hot melt adhesive sheet). Resin 50 mass%, polycarbonate resin 5
0% by mass content, softening point 117 ° C, stress change +1.7 g
f) were laminated and thermocompression bonded at 150 ° C. Further, a magnetic stripe 13 (manufactured by Kurz Co., Ltd., trade name: MTL750) was laid on the image receiving layer 9 and heat-pressed by a hot-press plate having a smooth surface. After punching into a card shape, the hologram 14 and the sign panel 15 were thermocompression bonded to each other to obtain the IC card 1. The thickness of the obtained IC card 1 was 450 μm.

[Example 4] As the front-side oversheet 7, an amorphous polyester resin sheet having a thickness of 150 µm (trade name: PG-WHT, manufactured by Mitsubishi Plastics, amorphous polyester resin 67% by mass, titanium oxide 10% by mass, polycarbonate). Resin 23% by mass, softening point 76
C., stress change +0.9 gf), using a 150 μm thick amorphous polyester resin sheet (trade name: UW-1A, manufactured by Toray Gosei Co., Ltd.) as the back side oversheet 8.
IC card 1 exactly as in Example 1 except that 45% by mass of amorphous polyester resin, 10% by mass of titanium oxide, 45% by mass of polycarbonate resin, softening point 128 ° C., stress change +3.5 gf) were used. Was manufactured. The thickness of the obtained IC card 1 was 750 μm.

[Example 5] As the front side oversheet 7, an amorphous polyester resin sheet having a thickness of 150 µm (trade name: HW-1A manufactured by Toray Gosei Co., Ltd., amorphous polyester resin 75% by mass, titanium oxide 10% by mass, polycarbonate). Resin 15% by mass, softening point 80
(° C, stress change +1.3 gf), using a 150 μm thick amorphous polyester resin sheet (trade name: UN-1A, manufactured by Toray Gosei Co., Ltd.) as the back side oversheet 8.
An IC card 1 was manufactured in exactly the same manner as in Example 1 except that 50% by mass of an amorphous polyester resin, 50% by mass of a polycarbonate resin, a softening point of 117 ° C., and a stress change of +1.7 gf) were used. The thickness of the obtained IC card 1 was 750 μm.

Example 6 A 120 μm thick amorphous polyester resin sheet (manufactured by Toray Gosei Co., Ltd., trade name: UN-1A, containing 50% by mass of amorphous polyester resin, 50% by mass of polycarbonate resin) as the front side oversheet 7. Softening point 117 ° C, stress change + 1.7g
f) is used as the back side oversheet 8 and has a thickness of 11
0 μm amorphous polyester resin sheet (manufactured by Toray Gosei Co., Ltd., trade name: UW-1A, amorphous polyester resin 45% by weight, titanium oxide 10% by weight, polycarbonate resin 45% by weight, softening point 110 ° C., stress change +3.5 gf) An IC card 1 was manufactured in exactly the same manner as in Example 1 except that the above was used. The thickness of the obtained IC card 1 was 750 μm.

[Example 7] As the surface side oversheet 7, a 150 μm thick amorphous polyester resin sheet (manufactured by Toray Gosei Co., Ltd., trade name: UN-1A, 50% by mass of amorphous polyester resin, 50% by mass of polycarbonate resin, Softening point 117 ° C, stress change + 1.7g
f) is used as the back side oversheet 8 having a thickness of 15
0 μm amorphous polyester resin sheet (manufactured by Toray Gosei Co., Ltd., trade name: HW-1A, amorphous polyester resin 75% by mass, titanium oxide 10% by mass, polycarbonate resin 15% by mass, softening point 80 ° C., stress change +
An IC card 1 was manufactured in exactly the same manner as in Example 1 except that 1.3 gf) was used. IC card 1 obtained
Had a thickness of 750 μm.

[Comparative Example 1] An amorphous polyester resin sheet having a thickness of 150 μm (manufactured by Taihei Chemical Co., Ltd.) was used for both the front-side oversheet 7 and the back-side oversheet 8.
Product name: CG730M, amorphous polyester resin 50% by mass, titanium oxide 10% by mass, polycarbonate resin 40% by mass, softening point 83 ° C., stress change +44 g
An IC card 1 was manufactured in exactly the same manner as in Example 1 except that f) was used. The thickness of the obtained IC card 1 was 450 μm.

[Comparative Example 2] As the front side oversheet 7, a 150 μm thick amorphous polyester resin sheet (manufactured by Taihei Chemical Co., Ltd., trade name: CG730M: amorphous polyester resin 50% by mass, titanium oxide 10% by mass, polycarbonate resin 40). Mass% content, softening point 83
C., stress change +44 gf), and as the back side oversheet 8, an amorphous polyester resin sheet having a thickness of 50 μm (manufactured by Taihei Chemical Co., Ltd., product name: CG730M, amorphous polyester resin 50% by mass, titanium oxide 1
An IC card 1 was manufactured in exactly the same manner as in Example 1 except that 0% by mass, 40% by mass of a polycarbonate resin, a softening point of 83 ° C., and a stress change of +44 gf) were used. The thickness of the obtained IC card 1 was 760 μm.

[Comparative Example 3] Both the front-side oversheet 7 and the back-side oversheet 8 have a thickness of 50 μm.
Axial stretched polyester resin sheet (manufactured by Teijin Ltd., trade name: S
-3, a softening point of 150 ° C. or higher, a stress change of +47 gf) was used, and an IC card 1 was manufactured in exactly the same manner as in Example 1. The thickness of the obtained IC card 1 is 45
It was 0 μm.

[Comparative Example 4] A 100 μm thick amorphous polyester resin sheet (manufactured by Taihei Chemical Co., Ltd., trade name: CG730M, amorphous polyester resin 50% by mass, titanium oxide 10% by mass, polycarbonate resin 40) was used as the surface side oversheet 7. Mass% content, softening point 83
C., stress change +44 gf), and an amorphous polyester resin sheet having a thickness of 100 μm (manufactured by Mitsubishi Plastics, trade name: PG-WHT:
IC card in the same manner as in Example 1 except that 67% by mass of amorphous polyester resin, 10% by mass of titanium oxide, 23% by mass of polycarbonate resin, softening point of 76 ° C., and stress change of +0.9 gf) were used. 1 was produced. The thickness of the obtained IC card 1 was 760 μm.

Table 1 shows the softening points, thicknesses, and stress changes of the front and back oversheets 7 and 8 in the above specific examples.

[0083]

[Table 1]

Further, each IC card 1 obtained was evaluated by the following method. [Image density] IC using a sublimation fusion thermal transfer printer for card (Nozaki Printing Paper Co., Ltd., trade name: NCP-100)
Sublimation heat transfer image 21 and fusion heat transfer image 22 were printed on card 1. For these sublimation heat transfer image 21 and melting heat transfer image 22, a Macbeth reflection densitometer (KO
The reflection density was measured by using LL-MORGEN, trade name: RD-914), the reflection density per printing energy was determined, and each image density was evaluated in four grades of ⊚, ◯, Δ, and ×.

[Curl] Regarding the IC card 1 (size: long side 85.60 mm, short side 53.98 mm) before and after the formation of the sublimation heat transfer image 21 and the fusion heat transfer image 22, the convex side contacts the reference horizontal plane. Leave the IC
The curl average height was determined by measuring the heights of the four corners of the card 1 from the reference horizontal plane and averaging the heights. A: Average curl height is less than 3 mm. Good: The curl average height is 3 to 5 mm. X: The curl average height exceeds 5 mm.

Table 2 shows the evaluation results of the IC card manufactured according to this example.

[0087]

[Table 2]

The IC card 1 of the example could form a clear image with high image density. Moreover, the curl was small. On the other hand, in the comparative example, the image density was poor, the curl was large, and the running property of the printer was hindered. In the examples, in the case of S1 <S2, the curl after printing was particularly small. In particular, in Examples 4 and 5, the curl after printing was smaller than that before printing. This is because the stress change S2 of the back side oversheet 8 was made larger than the stress change S1 of the front side oversheet 7, and the curl of the IC card 1 was returned and decreased due to the heat shrinkage of the back side oversheet 8. Conceivable.

[0089]

As described above, according to the present invention,
When manufacturing an IC card, curling and thermal deformation due to heating due to thermocompression bonding or thermal transfer printing are extremely small, so running failure when inserting into a thermal transfer printer or reading device,
There is no risk of problems such as poor reading. Also,
The thermocompression bonding process for stacking the cards is easy, and the card surface has high dyeability, so that clear and high-gradation prints can be obtained. Also, magnetic stripes, holograms, sign panels, etc. may be thermocompression bonded to the card surface. Moreover, since the non-PVC material is used, the harmfulness at the time of use or disposal is low.

By forming the printed image on at least a part of the image receiving layer or the back side of the front side oversheet, the aesthetic appearance is improved. If the print image is formed on the back side of the front-side oversheet, the print image and the thermal transfer image do not overlap with each other.
There is no risk of the surface of the C card becoming dirty.

[Brief description of drawings]

FIG. 1 is a schematic configuration diagram showing a first embodiment of an IC card of the present invention.

FIG. 2 is a schematic configuration diagram showing a second embodiment of an IC card of the present invention.

FIG. 3 is a schematic configuration diagram showing a third embodiment of an IC card of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... IC card, 2 ... Core sheet, 3 ... IC module, 4 ... Antenna, 5 ... Inlet, 6a ... 1st adhesive agent layer, 6b ... 2nd adhesive agent layer, 6c ... 3rd adhesive agent layer,
7 ... Front side oversheet, 8 ... Backside oversheet, 9 ... Image receiving layer, 10 ... Solvent barrier layer, 11 ... First
Printed image, 12 ... Over varnish layer, 13 ... Magnetic stripe, 14 ... Hologram, 15 ... Sign panel, 16 ...
Substrate sheet, 17 ... Second print image, 18 ... Print sheet, 21 ... Sublimation heat transfer image, 22 ... Melt heat transfer image, 2
3 ... Protective layer.

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Hideaki Shinohara             Made by Oji 1-10-6 Shinonome, Koto-ku, Tokyo             Paper Co., Ltd. Shinonome Research Center F-term (reference) 2C005 MA11 MB01 MB02 MB06 NA08                       NA09 PA02 PA14 PA21                 5B035 AA08 BA03 BA05 BB02 BB05                       BB09 BB11 BB12 CA03 CA06                       CA23

Claims (7)

[Claims] 1. An IC card having an inlet having an IC module and an antenna on a core sheet, and a pair of oversheets laminated on both surfaces of the inlet, wherein the pair of oversheets have a softening point of 75. A resin sheet having an amorphous polyester resin of ˜150 ° C. as a main component and a stress change at −80 ° C. of −5 to 5 gf, and one of the oversheets has a surface opposite to the core sheet. An IC card in which an image receiving layer is formed on. 2. An IC card having an inlet having an IC module and an antenna on a core sheet, and a pair of oversheets laminated on both sides of the inlet, wherein the pair of oversheets have a softening point of 120. ~ 150 ° C
The main component is the polycarbonate / amorphous polyester blend resin, and the stress change at 80 ° C is -5
An IC having a resin sheet of 5 gf, wherein one of the oversheets has an image receiving layer formed on the surface opposite to the core sheet.
card. 3. The oversheet on which the image receiving layer is formed has a stress change at 80 ° C. of S1 and a thickness of T1, and the oversheet having no image receiving layer at 80 ° C.
Where S2 is the stress change at T and T2 is the thickness, these parameters are S1≤S2 and 0.5≤T1 / T2.
The IC card according to claim 1, wherein the condition of ≦ 2.0 is satisfied. 4. A printed image and an overvarnish layer are sequentially formed on at least a part of the image receiving layer, and the remaining part on the image receiving layer is for forming a thermal transfer image. The IC card according to claim 1, wherein the IC card is exposed. 5. A printed image and an overvarnish layer are sequentially formed on at least a part of the image receiving layer, and a thermal transfer image is formed on the remaining part of the image receiving layer. 4. The method according to claim 1, wherein
The IC card according to any one of 1. 6. The oversheet having the image receiving layer is transparent, and a printed image is formed on the surface of the oversheet opposite to the image receiving layer. The IC card according to any one of 5 above. 7. I according to any one of claims 1 to 6.
An IC card, which is a C card, in which at least one selected from a magnetic stripe, a hologram, and a sign panel is arranged on the IC card.