JP2003240974A5 - - Google Patents

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Publication number
JP2003240974A5
JP2003240974A5 JP2002034119A JP2002034119A JP2003240974A5 JP 2003240974 A5 JP2003240974 A5 JP 2003240974A5 JP 2002034119 A JP2002034119 A JP 2002034119A JP 2002034119 A JP2002034119 A JP 2002034119A JP 2003240974 A5 JP2003240974 A5 JP 2003240974A5
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JP
Japan
Prior art keywords
material layer
adhesive material
optical fiber
layer
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002034119A
Other languages
Japanese (ja)
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JP2003240974A (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2002034119A priority Critical patent/JP2003240974A/en
Priority claimed from JP2002034119A external-priority patent/JP2003240974A/en
Publication of JP2003240974A publication Critical patent/JP2003240974A/en
Publication of JP2003240974A5 publication Critical patent/JP2003240974A5/ja
Pending legal-status Critical Current

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Claims (3)

光ファイバ配線板であって、
第１粘着材層と第２粘着材層のいずれか一方の一表面に光ファイバを所望のパターンで敷設し、その上に他方の一表面を押し付けて両表面を互いに接着させて成り、
第１粘着材層と第２粘着材層は常温においてそれぞれ光ファイバが少なくとも半径分だけ密着して埋没可能な柔軟性を有し、
第１粘着材層と第２粘着材層の互いに接着される表面は常温でプライマを介装して押し付けられ、該プライマが第１粘着材層および第２粘着材層と常温で化学的結合をする、ことを特徴とする光ファイバ配線板。An optical fiber wiring board,
An optical fiber is laid in a desired pattern on one surface of one of the first pressure-sensitive adhesive layer and the second pressure-sensitive adhesive layer, and the other surface is pressed onto the surface to adhere the both surfaces together.
Each of the first adhesive layer and the second adhesive layer has a flexibility that allows the optical fibers to be in close contact with each other at least at a radius at room temperature, and can be buried.
The surfaces of the first adhesive material layer and the second adhesive material layer that are bonded to each other are pressed with a primer at room temperature, and the primer chemically bonds with the first adhesive material layer and the second adhesive material layer at room temperature. An optical fiber wiring board characterized by the above. 第１粘着材層と第２粘着材層は光ファイバの半径の２倍以上の厚さを有する、ことを特徴とする請求項１に記載の光ファイバ配線板。  2. The optical fiber wiring board according to claim 1, wherein the first adhesive material layer and the second adhesive material layer have a thickness of at least twice the radius of the optical fiber. 第１粘着材層の外側面と第２粘着材層の外側面の、一方、または、両方に、べとつき防止用の被覆を有する、ことを特徴とする請求項１に記載の光ファイバ配線板。  The optical fiber wiring board according to claim 1, further comprising a coating for preventing stickiness on one or both of the outer surface of the first adhesive material layer and the outer surface of the second adhesive material layer.
JP2002034119A 2002-02-12 2002-02-12 Wiring board for optical fibers Pending JP2003240974A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002034119A JP2003240974A (en) 2002-02-12 2002-02-12 Wiring board for optical fibers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002034119A JP2003240974A (en) 2002-02-12 2002-02-12 Wiring board for optical fibers

Publications (2)

Publication Number Publication Date
JP2003240974A JP2003240974A (en) 2003-08-27
JP2003240974A5 true JP2003240974A5 (en) 2005-08-25

Family

ID=27776719

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002034119A Pending JP2003240974A (en) 2002-02-12 2002-02-12 Wiring board for optical fibers

Country Status (1)

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JP (1) JP2003240974A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6873781B2 (en) * 2003-03-11 2005-03-29 3M Innovative Properties Company Optical fiber wiring board
JP5100693B2 (en) * 2009-03-31 2012-12-19 古河電気工業株式会社 Optical fiber holding structure

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